JP6541746B2 - Resin molding apparatus and method of manufacturing resin molded article - Google Patents

Description

  The present invention relates to a resin molding apparatus and a method of manufacturing a resin molded article.

  For example, a resin molding apparatus having a molding die is used for the method of manufacturing a resin molded product.

  For example, Patent Document 1 describes a method of manufacturing an electronic device by resin sealing between one surface of a first substrate and one surface of a second substrate.

JP, 2015-076547, A

  However, in resin molding of a molded product (also referred to as a molded product) having a plurality of substrates, for example, there is a risk that molding defects such as resin leakage may occur due to variations in the thickness of the molded product. is there.

  Then, this invention aims at provision of the resin molding apparatus which can suppress or prevent a molding malfunction, and the manufacturing method of a resin molded product, even if the thickness of a to-be-molded product has dispersion | variation.

In order to achieve the above object, the resin molding apparatus of the present invention is
Mold and
One type of wedge-shaped mechanism,
Including one mold cavity block drive mechanism,
The mold includes one mold and the other mold,
The one mold includes one mold cavity block and one mold cavity frame member,
A sliding hole is formed in the one cavity frame member,
The one mold cavity block is movable in the sliding hole in the mold opening and closing direction of the mold;
One mold cavity can be formed by the surface of the one mold cavity block facing the other mold and the inner surface of the one mold cavity frame member,
The one mold cavity block can be moved in the mold opening / closing direction using the one mold cavity block drive mechanism,
It is characterized in that the position of the one mold cavity block in the mold opening and closing direction can be fixed using the one mold wedge mechanism.

The method for producing a resin molded article of the present invention is
Performed using a resin molding apparatus including a molding die,
The mold includes one mold and the other mold,
The one mold includes one mold cavity block and one mold cavity frame member,
A sliding hole is formed in the one cavity frame member,
The one mold cavity block is movable in the sliding hole in the mold opening and closing direction of the mold;
One mold cavity can be formed by the surface of the one mold cavity block facing the other mold and the inner surface of the one mold cavity frame member,
A molding material supply step of supplying the molding material to the molding die;
One mold cavity block position changing step of changing the position of the one mold cavity block in the mold opening / closing direction of the mold;
A resin molding step of resin-molding the object in the one mold cavity;
It is characterized by including.

  According to the present invention, it is possible to provide a resin molding apparatus and a method for producing a resin molded product, which can suppress or prevent molding defects even if the thickness of the molded object varies.

FIG. 1 is a cross-sectional view schematically showing an example of the resin molding apparatus of the present invention. FIG. 2: is sectional drawing which shows typically 1 process in an example of the manufacturing method of the resin molded product using the resin molding apparatus of FIG. FIG. 3 is a cross-sectional view schematically showing another step in the same method for producing a resin molded product as in FIG. FIG. 4 is a cross-sectional view schematically showing still another step in the method for producing a resin molded product similar to FIG. FIG. 5 is a cross-sectional view schematically showing still another step in the method for producing a resin molded product similar to FIG. FIG. 6 is a cross-sectional view schematically showing still another step in the same method of manufacturing a resin molded product as in FIG. FIG. 7 is a cross-sectional view schematically showing still another step in the same method of manufacturing a resin molded product as in FIG. FIG. 8 is a cross-sectional view schematically showing still another process of the method for producing a resin molded product similar to FIG. FIG. 9 is a cross-sectional view schematically showing still another process of the method for producing a resin molded product similar to FIG. FIG. 10 is a cross-sectional view schematically showing still another process of the method for producing a resin molded product similar to FIG. FIG. 11 is a cross-sectional view schematically showing still another process of the same method of manufacturing a resin molded product as FIG. 2. FIG. 12 is a cross-sectional view schematically showing still another step in the method for producing a resin molded product similar to FIG. FIG. 13 is a cross-sectional view schematically showing still another process of the method for producing a resin molded product similar to FIG. FIG. 14: is sectional drawing which shows typically another process in the manufacturing method of the resin molded product same as FIG. FIG. 15 is a cross-sectional view schematically showing still another process of the method for producing a resin molded product similar to FIG. FIG. 16 is a cross-sectional view schematically showing still another process of the method for producing a resin molded product similar to FIG. FIG. 17 is a cross-sectional view schematically showing still another process of the method for producing a resin molded product similar to FIG. FIG. 18 is a cross-sectional view schematically showing still another process of the same method of manufacturing a resin molded product as FIG. 2. FIG. 19 is a cross-sectional view schematically showing the same resin molding apparatus as FIG. FIG. 20 is a cross-sectional view schematically showing a state in which the upper mold and the lower mold are removed from the resin molding apparatus of FIG. FIG. 21 is a cross-sectional view schematically showing a state in which an upper mold and a lower mold different from those of FIG. 19 are attached to the resin molding apparatus of FIG. FIG. 22 is a cross sectional view schematically showing one step in another example of the method for producing a resin molded product using the resin molding device of FIG. 1. FIG. 23: is sectional drawing which shows typically another process of the manufacturing method of the resin molded product same as FIG. FIG. 24: is sectional drawing which shows typically another process of the manufacturing method of the resin molded product same as FIG. FIG. 25 is a cross-sectional view schematically showing an example of a mechanism for adsorbing the release film to the upper mold in the resin molding apparatus of FIG. FIG. 26A is a cross-sectional view schematically showing an example of the object to be molded. Fig. 26 (b) is a cross-sectional view schematically showing an example of a resin molded product obtained by resin-molding the molded product of Fig. 26 (a).

  The invention will now be described in more detail by way of example. However, the present invention is not limited by the following description.

  The resin molding apparatus of the present invention may further include, for example, a release film adsorption mechanism.

  The resin molding apparatus of the present invention may be capable of pressing, for example, a molded object to be resin-molded by the one mold cavity block via a release film.

  The resin molding apparatus of the present invention further includes, for example, a pressing force measuring mechanism, and the pressing force measuring mechanism measures the pressing force for pressing the one mold cavity block using the one mold cavity block driving mechanism. It may be possible.

The resin molding apparatus of the present invention is, for example,
The one type wedge mechanism includes a pair of one type wedge members;
The pair of one type wedge members includes one type first wedge member and one type second wedge member;
The one mold first wedge-shaped member and the one mold second wedge-shaped member each have a tapered surface, and are arranged such that the respective tapered surfaces face each other,
When at least one of the one mold first wedge-shaped member and the one mold second wedge-shaped member is moved, the one mold first wedge-shaped member and the one mold second wedge-shaped member contact with each other The length in the mold opening and closing direction of the pair of one type wedge-shaped members may be changeable. The direction in which the at least one wedge-shaped member is moved may be, for example, the leading end direction or the trailing edge direction of the wedge-shaped wedge member to be moved.

The resin molding apparatus of the present invention is, for example,
The resin molding apparatus further includes the other type wedge-shaped mechanism,
The other mold includes the other mold cavity block,
The position of the other mold cavity block in the mold opening and closing direction may be fixable using the other mold wedge mechanism.

The resin molding apparatus of the present invention is, for example,
The other type wedge mechanism includes a pair of other type wedge members;
The pair of other mold wedge members includes the other mold first wedge member and the other mold second wedge member;
Each of the other mold first wedge-shaped member and the other mold second wedge-shaped member is arranged such that it has a tapered surface, and the respective tapered surfaces face each other,
When at least one of the one mold first wedge member and the one mold second wedge member is moved, the other mold first wedge member and the other mold second wedge member are brought into contact with each other. The length in the mold opening and closing direction of the pair of other mold wedge members may be variable. The direction in which the at least one wedge-shaped member is moved may be, for example, the leading end direction or the trailing edge direction of the wedge-shaped wedge member to be moved.

  In the resin molding apparatus according to the present invention, for example, the length of the pair of one mold wedge members in the mold opening / closing direction when the one mold first wedge member and the one mold second wedge member are in contact with each other By changing the position, the position of the one mold cavity block in the mold opening / closing direction may be changeable.

The resin molding apparatus of the present invention is, for example,
By moving at least one of the one mold and the other mold in the mold clamping direction of the mold, the object to be molded is sandwiched by the one mold and the other mold, and the one mold cavity By moving the one mold cavity block toward the molding object using a block drive mechanism, the molding material is pressed by the one mold cavity block through the mold release film, and thereafter, The position of the one mold cavity block in the mold opening / closing direction may be fixable using the one mold wedge mechanism.

  In the resin molding apparatus of the present invention, for example, after fixing the position of the one mold cavity block, at least one of the one mold and the other mold is moved in the mold opening direction of the mold, and thereafter The position of the one mold cavity block may be changed and fixed using the one mold cavity block drive mechanism and the one mold wedge mechanism.

  In the resin molding apparatus of the present invention, for example, the one mold may be an upper mold, and the other mold may be a lower mold. Also, for example, in the resin molding apparatus according to the present invention, the one mold may be a lower mold and the other mold may be an upper mold.

  The resin molding apparatus of the present invention may be, for example, an apparatus for transfer molding. Moreover, the resin molding apparatus of this invention is not limited to this, For example, apparatuses for compression molding etc. may be sufficient.

  The method for producing a resin molded product of the present invention is performed using a resin molding apparatus including a molding die as described above, but for example, the resin molding apparatus may be the resin molding apparatus of the present invention.

  The method for producing a resin molded article of the present invention may further include, for example, one mold surface coating step of coating the mold surface of the one mold with a release film.

  The method for producing a resin molded article according to the present invention may further include, for example, an object-pressing step of pressing a resin-formed object to be molded by the one mold cavity block via a release film. .

  The method for producing a resin molded article of the present invention may further include, for example, the other mold cavity block position changing step of changing the position of the other mold cavity block in the mold opening / closing direction.

  In the method for producing a resin molded product according to the present invention, for example, the resin molding apparatus is the resin molding apparatus according to the present invention, and the resin molding apparatus according to the present invention further includes the other type wedge-shaped mechanism. It is also good.

The method for producing a resin molded article of the present invention is, for example,
Furthermore, by moving at least one of the one mold and the other mold in the mold clamping direction of the mold, the object to be molded is clamped and fixed by the one mold and the other mold. Molding clamp process,
An object pressing step in which the object is pressed by the one mold cavity block via a release film;
One mold cavity block fixing step of fixing the position of the one mold cavity block;
In the one mold cavity block repositioning step, the one mold cavity block driving mechanism is used to move the one mold cavity block toward the molding object,
In the molding material pressing step, using the one mold cavity block drive mechanism, the molding material is pressed by the one mold cavity block through a mold release film,
After the object pressing step, in the one mold cavity block fixing step, the one mold wedge mechanism may be used to fix the position of the one mold cavity block in the mold opening / closing direction.

  In the method for producing a resin molded product according to the present invention, for example, after the one mold cavity block fixing step, at least one of the one mold and the other mold is moved in the mold opening direction of the mold; A second mold cavity block position changing step of changing the position of the one mold cavity block using the one mold cavity block drive mechanism, and the one mold using the one mold wedge mechanism And a second mold cavity block fixing step of fixing the position of the cavity block.

  In the method for producing a resin molded product according to the present invention, for example, in the resin molding step, the molded object may be resin-molded by transfer molding. Moreover, the manufacturing method of the resin molded product of this invention is not limited to this, For example, you may shape | mold the said to-be-molded product by compression molding etc. in the said resin molding process.

  In the method of manufacturing a resin molded product according to the present invention, for example, the molded product may include a plurality of substrates, and the molded product may be resin molded by resin sealing between the substrates.

  In the present invention, the “molding die” is, for example, a die, but is not limited thereto, and may be, for example, a ceramic die.

  In the present invention, the resin molded article is not particularly limited, and may be, for example, a resin molded article obtained by merely molding a resin, or a resin molded article obtained by resin sealing a component such as a chip. In the present invention, the resin molded product may be, for example, an electronic component.

  In the present invention, "resin molding" or "resin sealing" means, for example, that the resin is in a cured (solidified) state.

  In the present invention, the resin material before molding and the resin after molding are not particularly limited, and may be, for example, a thermosetting resin such as an epoxy resin or a silicone resin, or may be a thermoplastic resin. . In addition, a composite material partially containing a thermosetting resin or a thermoplastic resin may be used. In the present invention, examples of the form of the resin material before molding include granular resin, flowable resin, sheet-like resin, tablet-like resin, powder-like resin and the like. In the present invention, the fluid resin is not particularly limited as long as it is a resin having fluidity, and examples thereof include liquid resin and molten resin. In the present invention, the liquid resin means, for example, a resin which is liquid or has fluidity at room temperature. In the present invention, the molten resin means, for example, a resin which has become liquid or has fluidity by melting. The form of the resin may be any other form as long as it can be supplied to the cavity, pot or the like of the mold.

  Also, in general, "electronic component" may refer to a chip before resin sealing and to a state in which the chip is resin sealed, but in the present invention, when simply referred to as "electronic component", Unless otherwise specified, it refers to an electronic component (electronic component as a finished product) in which the chip is resin-sealed. In the present invention, “chip” refers to a chip before resin sealing, and specific examples include a chip such as an IC, a semiconductor chip, or a semiconductor element for power control. In the present invention, the chip before resin sealing is referred to as “chip” for convenience in order to distinguish it from the electronic component after resin sealing. However, the “chip” in the present invention is not particularly limited as long as it is a chip before resin sealing, and may not be in the form of a chip.

  In the present invention, the term "flip chip" refers to an IC chip having a bump-like projecting electrode called a bump on an electrode (bonding pad) on the surface of the IC chip, or to such a chip form. The chip is mounted downward (face down) on a wiring portion such as a printed circuit board. The flip chip is used, for example, as one of chips or mounting methods for wireless bonding.

  In the present invention, for example, a resin molded product may be manufactured by resin-sealing (resin molding) a component (for example, a chip, a flip chip, etc.) mounted on a substrate. In the present invention, the substrate (also referred to as an interposer) is not particularly limited, but may be, for example, a lead frame, a wiring substrate, a wafer, a ceramic substrate or the like. For example, as described above, the substrate may be a mounting substrate in which a chip is mounted on one side or both sides thereof. Although the mounting method of the said chip | tip is not specifically limited, For example, a wire bonding, flip chip bonding, etc. are mentioned. In the present invention, for example, the mounting substrate may be sealed with a resin to manufacture an electronic component in which the chip is sealed with a resin. Further, the application of the substrate sealed with the resin sealing device of the present invention is not particularly limited, but for example, a high frequency module substrate for mobile communication terminal, a module substrate for power control, a substrate for device control etc. may be mentioned. .

  Moreover, in the present invention, "mounting" includes "mounting" or "fixing". Furthermore, in the present invention, "placement" includes "fixing".

  Hereinafter, specific embodiments of the present invention will be described based on the drawings. Each drawing is schematically drawn with omission, exaggeration, etc. as appropriate for the convenience of description.

  In the present embodiment, an example of the resin molding apparatus of the present invention and an example of a method of manufacturing a resin molded product using the same will be described.

  The cross-sectional view of FIG. 1 schematically shows the configuration of the resin molding apparatus in the present embodiment. As shown, the resin molding apparatus 1000 includes a mold including an upper mold (one mold) 1100 and a lower mold (the other mold) 1200, and an upper mold cavity block position changing mechanism installation portion (one mold cavity block position A change mechanism installation portion) 1300 and a lower mold cavity block position change mechanism installation portion (the other mold cavity block position change mechanism installation portion) 1400 are included as main components. Furthermore, the resin molding apparatus 1000 further includes a release film suction mechanism (not shown in FIG. 1) and an air vent opening / closing mechanism 1330 as main components. The air vent opening / closing mechanism 1330 is one of the components of the upper mold cavity block position changing mechanism installation unit 1300 as described later in this embodiment, but the present invention is not limited to this. For example, the air vent opening / closing mechanism 1330 may be one of the components of the resin molding apparatus 1000 other than the upper mold cavity block position changing mechanism installation portion 1300.

  Upper die (one die) 1100 includes upper die cavity block (one die cavity block) 1101 and upper die cavity frame members (one die cavity frame members) 1102 and 1103. As shown in the figure, two upper mold cavity blocks 1101 are arranged in parallel. Among the members constituting the upper mold cavity frame member, the upper mold cavity frame member 1103 is disposed so as to be sandwiched between the two upper mold cavity blocks 1101. The upper mold cavity frame member 1102 is disposed outside the upper mold cavity block 1101 as illustrated. A sliding hole 1105 is formed in the upper mold cavity frame member so as to be surrounded by the upper mold cavity frame members 1102 and 1103. The upper mold cavity block 1101 is movable in the sliding hole 1105 in the mold opening and closing direction of the mold. The “mold opening and closing direction” is the opening and closing direction of the upper mold 1100 and the lower mold 1200 in FIG. 1, that is, the vertical direction of the drawing. Furthermore, as shown in the drawing, the upper mold cavity (one of the upper mold cavity blocks 1101 and 1103) is surrounded by a space between the upper mold cavity block 1101 facing the lower mold (the other mold) Mold cavity) 1106 can be formed. Then, as described later, it is possible to press the resin-molded object to be molded by the upper mold cavity block 1101 via the mold release film. Also, an air vent groove 1104 is formed at the lower end of the upper mold cavity frame member 1102.

  Although not shown in FIG. 1, the upper mold cavity frame member 1103 further includes an excess resin portion (unnecessary resin portion or cull portion) which is a space for accommodating an excess resin (unnecessary resin) at the time of resin molding. ) May be formed.

  The lower mold (the other mold) 1200 includes a lower mold cavity block (the other mold cavity block) 1201, a lower mold side block (the other mold side block) 1202, and a pot block 1203 as main components. The cavity block pillar (the other mold cavity block pillar) 1204, the lower mold elastic member (the other mold elastic member) 1205, and the plunger 1212 are included. The plunger 1212 may be one of the components of the lower mold 1200 as described above, but may be one of the components of the resin molding apparatus 1000 other than the lower mold 1200. There are two lower mold cavity blocks 1201, and the lower mold cavity blocks 1201 are arranged such that the upper surfaces thereof face the upper mold cavity block 1101. The pot block 1203 is disposed to be sandwiched between the two lower mold cavity blocks 1201. The lower mold side block 1202 is disposed outside the lower mold cavity block 1201 as illustrated. The two lower mold cavity blocks 1201 are disposed inside the lower mold side block 1202 and the pot block 1203, respectively. The pot block 1203 is formed with a pot 1211 which is a hole penetrating in the vertical direction. The plunger 1212 can move up and down in the pot 1211. As described later, it is possible to push the flowable resin in the pot 1211 into the upper mold cavity 1106 by raising the plunger 1212.

  The lower mold cavity block pillar 1204 is attached to the lower surface of the lower mold cavity block 1201. The lower mold elastic member 1205 is disposed so as to surround the lower mold cavity block pillar 1204, and can expand and contract in the mold opening and closing direction (vertical direction in the drawing).

  The upper mold cavity block position change mechanism installation unit (one mold cavity block position change mechanism installation unit) 1300 includes an upper cavity block drive mechanism (one mold cavity block drive mechanism) 1301 and an upper mold cavity block holding member (one Mold cavity block holding member) 1302, load cell (pressing force measuring mechanism) 1303, upper mold cavity block pillar (one mold cavity block pillar) 1304, upper mold wedge mechanism (one die wedge mechanism, upper die cotter mechanism) Or one type cotter mechanism 1310, upper mold second wedge member holding member (one mold second wedge member holding member, or upper mold second cotter holding member, or one mold second cotter holding) Elastic members (one mold second ridge) (also referred to as members) 1321 and an upper mold second Member holding member elastic member) 1322, air vent opening / closing mechanism 1330, platen (upper mold cavity block position changing mechanism installation base member or one mold cavity block position changing mechanism installation base member) 1340, upper mold Cavity block position change mechanism installation part frame member (one mold cavity block position change mechanism installation part frame member) 1341 and upper mold cavity block position change mechanism installation part bottom member (one mold cavity block position change mechanism installation part bottom member And 134). The platen 1340 is a single plate-like member, and is disposed above the upper mold 1100 so as to cover the entire upper mold 1100. Further, as described later, other members of the upper mold cavity block position changing mechanism installation portion 1300 are directly or indirectly attached to the platen 1340.

  The upper mold cavity block holding member 1302 penetrates the platen 1340 in the vertical direction as illustrated, and can move up and down. An upper mold cavity block pillar 1304 is attached to the lower end of one mold cavity block holding member 1302. An upper mold cavity block 1101 is attached to the lower end of the upper mold cavity block pillar 1304. Further, as described later, the upper mold cavity block 1101 is detachable from the upper mold cavity block pillar 1304. The upper mold cavity block drive mechanism 1301 is connected to the upper end of the upper mold cavity block holding member 1302. The upper mold cavity block 1101 can be moved up and down (that is, moved in the mold opening and closing direction) by moving the upper mold cavity block holding member 1302 up and down by the upper mold cavity block drive mechanism 1301.

  The upper mold wedge mechanism 1310 includes, as shown, an upper mold first wedge member (also referred to as one mold first wedge member, upper mold first cotter, or one mold first cotter) 1311a, and an upper mold second wedge Member (one mold second wedge member, upper die second cotter, or one die second cotter) 1311b, upper die wedge member power transmission member (one die wedge member power transmission member, upper die cotter power A transmission member or one type cotter power transmission member) 1312 and an upper type wedge member drive mechanism (also referred to as one type wedge member drive mechanism, upper type cotter drive mechanism or one type cotter drive mechanism) 1313 including. As shown in FIG. 1, one surface of the upper mold first wedge-shaped member 1311 a and the upper mold second wedge-shaped member 1311 b in the thickness direction (vertical direction in the figure) is a tapered surface. More specifically, as illustrated, the lower surface of the upper mold first wedge-shaped member 1311 a and the upper surface of the upper mold second wedge-shaped member 1311 b are respectively tapered surfaces. The upper mold first wedge-shaped member 1311 a and the upper mold second wedge-shaped member 1311 b are arranged such that their tapered surfaces face each other.

  The upper mold first wedge-shaped member 1311 a is connected to the upper wedge-shaped member driving mechanism 1313 through the upper wedge-shaped power member 1312. Then, a pair of upper-type wedge-shaped members (a pair of one-type wedge-shaped members, formed by the upper-die first wedge-shaped member 1311a and the upper-die second wedge-shaped member 1311b by the upper-die wedge-shaped member driving mechanism 1313; By sliding in the taper direction (left and right direction in the figure) of the tapered surface of a pair of upper type wedge-shaped members, "upper type wedge-shaped members" or "upper type cotter"), the pair of upper type wedge-shaped members The length in the thickness direction of can be changed. For example, when the upper mold first wedge-shaped member 1311a is slid in the direction of its tip, the upper mold second wedge-shaped member 1311b slides in the opposite direction relatively to the upper mold first wedge-shaped member 1311a. Then, the length in the thickness direction (vertical direction in the figure) of the pair of upper type wedge-shaped members is increased. Also, for example, it is possible to reduce the length in the thickness direction (vertical direction in the figure) of the pair of upper mold wedge members by sliding the upper mold first wedge member 1311a toward the rear end direction, for example. It is. Thereby, as described later, the position of the upper mold cavity block 1101 in the vertical direction (the mold opening and closing direction) can be changed. As a result, even if the thickness of the molded product varies, the position of the upper mold cavity block 1101 can be adjusted to an appropriate position. That is, this allows the depth of the upper mold cavity 1106 to be adjusted to an appropriate depth.

  In the example of FIG. 1, the upper mold first wedge-shaped member 1311 a on the upper side of the pair of upper mold wedge-shaped members may be slid in the horizontal (left and right) direction by the upper wedge-shaped member driving mechanism 1313. it can. However, the present invention is not limited to this. For example, the lower upper-mold second wedge-shaped member 1311 b may be slidable by the upper-die wedge-shaped member driving mechanism 1313, or the upper-mold first wedge-shaped member 1311 a and the upper mold first Both of the two wedge-shaped members 1311b may be slidable. Further, the upper wedge-shaped member driving mechanism 1313 is not particularly limited, but, for example, a servomotor, an air cylinder or the like can be used.

  Further, in FIG. 1, the entire one surface of each of the upper mold first wedge-shaped member 1311 a and the upper mold second wedge-shaped member 1311 b is a tapered surface. However, the present invention is not limited to this, and it is sufficient if at least one wedge-shaped member can be slid along the tapered surface. For example, in one or both of the upper mold first wedge-shaped member 1311a and the upper mold second wedge-shaped member 1311b, only a part of one surface may be a tapered surface. More specifically, for example, at least one of the upper mold first wedge-shaped member 1311a and the upper mold second wedge-shaped member 1311b shown in the figure, only the tip end (thin side) of one surface is a tapered surface and The thick side may be a horizontal plane.

  The upper surface of the upper mold second wedge member holding member 1321 is in contact with the lower surface of the upper mold second wedge member 1311 b. On the other hand, the lower surface of the platen 1340 is in contact with the upper surface of the upper mold first wedge-shaped member 1311 a. That is, the pair of upper type wedge-shaped members are disposed so as to be sandwiched between the upper surface of the upper type second wedge-shaped member holding member 1321 and the lower surface of the platen 1340. Then, using the elastic member 1322 of the upper mold second wedge member holding member and the upper mold second wedge member holding member 1321, the state in which the upper mold first wedge member 1311a and the upper mold second wedge member 1311b are in contact is maintained. ing.

  The upper mold cavity block position changing mechanism installation portion bottom surface member is formed by the upper member 1342 and the lower member 1343. The upper die cavity block position changing mechanism installation portion bottom member 1343 can have the upper die cavity frame members 1102 and 1103 attached to the lower surface thereof, as illustrated. As described later, the upper mold cavity frame members 1102 and 1103 are removable from the upper mold cavity block position changing mechanism installation portion bottom surface member 1343. The upper mold cavity block pillar 1304 penetrates the upper mold cavity block position changing mechanism installation portion bottom surface members 1342 and 1343 in the vertical direction, and can move up and down. The upper mold cavity block drive mechanism elastic member 1322 is disposed so as to be sandwiched between the lower surface of the upper mold second wedge member holding member 1321 and the upper surface of the upper mold cavity block position changing mechanism installation portion bottom surface member 1342. It is possible. The upper mold cavity block position changing mechanism setting part frame member 1341 has its upper end on the lower surface of the upper mold cavity block position changing mechanism mounting part base member 1340 and its lower end on the upper surface of the upper mold cavity block position changing mechanism mounting part bottom member 1342 , Each connected. In addition, the upper mold cavity block position changing mechanism installation portion frame member 1341 is disposed so as to surround the upper mold second wedge-shaped member holding member 1321, the upper mold cavity block holding member 1302, and the pair of upper wedge-shaped members. ing.

  The air vent opening / closing mechanism 1330 includes an air vent pin power mechanism 1331 and an air vent pin 1332. The air vent pin 1332 is, as illustrated, the upper portion of the upper mold cavity frame member 1102, the upper mold cavity block position changing mechanism installation portion bottom members 1342 and 1343, the upper mold cavity block position changing mechanism installation portion frame member 1341, and the platen 1340. And vertically, and can move up and down. By vertically moving the air vent pin 1332 by the air vent pin power mechanism 1331, as described later, the air vent groove 1104 can be opened and closed. The air vent pin power mechanism 1331 is not particularly limited, and, for example, a servomotor, an air cylinder, or the like can be used.

  The “upper mold cavity block position change mechanism (one mold cavity block position change mechanism)” installed in the upper mold cavity block position change mechanism installation unit (one mold cavity block position change mechanism installation unit) 1300 is The embodiment includes an upper die cavity block drive mechanism (one die cavity block drive mechanism) 1301 and an upper die wedge mechanism (one die wedge mechanism) 1310. However, the present invention is not limited to this, and for example, the upper mold cavity block position changing mechanism (one mold cavity block position changing mechanism) may further include other components.

  The lower mold cavity block position changing mechanism installation portion 1400 is, as shown, a lower mold wedge mechanism (the other mold wedge mechanism) 1410, a lower mold attachment member (the other mold attachment member) 1421, and a platen (the lower mold second member). And a second mold-shaped cotter holding member, a lower mold-second cotter holding member, or another mold-second cotter holding member 1422.

  The lower mold wedge mechanism 1410 includes, as shown, a lower mold first wedge member (also referred to as the other mold first wedge member, the lower mold first cotter, or the other mold first cotter) 1411a, and the lower mold second wedge member. Members (also referred to as the other mold second wedge-shaped member, lower mold second cotter, or the other mold second cotter) 1411b, lower mold wedge-shaped power transmission members (other type wedge-shaped power transmission members, lower cotter power A transmission member or the other type cotter power transmission member) 1412 and a lower type wedge member drive mechanism (also referred to as the other type wedge member drive mechanism, the lower type cotter drive mechanism, or the other type cotter drive mechanism) 1413 including. As shown in FIG. 1, in the lower mold first wedge-shaped member 1411a and the lower mold second wedge-shaped member 1411b, the other surface in the thickness direction (vertical direction in the figure) is a tapered surface. More specifically, as illustrated, the upper surface of the lower mold first wedge-shaped member 1411 a and the lower surface of the lower mold second wedge-shaped member 1411 b are respectively tapered surfaces. The lower mold first wedge-shaped member 1411 a and the lower mold second wedge-shaped member 1411 b are arranged such that their tapered surfaces face each other.

  The lower mold first wedge-shaped member 1411 a is connected to the lower wedge-shaped member drive mechanism 1413 via the lower wedge-shaped power member 1412. Then, a pair of lower-type wedge-shaped members (a pair of other-type wedge-shaped members, which are formed by the lower-mold first wedge-shaped member 1411a and the lower-type second wedge-shaped member 1411b by the lower wedge-shaped member driving mechanism 1413; By sliding in the taper direction (left and right direction in the figure) of the tapered surface of a pair of lower type wedge-shaped members, "lower type wedge-shaped members" or "lower type cotter"), the pair of lower type wedge-shaped members The length in the thickness direction of can be changed. For example, when the lower mold first wedge-shaped member 1411a is slid in the direction of its tip, the lower mold second wedge-shaped member 1411b slides in the opposite direction relatively to the lower mold first wedge-shaped member 1411a. Then, the length in the thickness direction (vertical direction in the figure) of the pair of lower mold wedge-shaped members is increased. Also, for example, it is possible to reduce the length in the thickness direction (vertical direction in the figure) of the pair of lower type wedge members by, for example, sliding the bottom die first wedge member 1411a toward the rear end direction. It is. Thereby, as described later, the position of the lower mold cavity block 1201 in the vertical direction (the mold opening and closing direction) can be changed. Thereby, for example, even if the thickness of the first substrate 11 in the article 10 to be described later varies (for example, even if the thickness of the first substrate 11 on the left and right in FIG. 3 described later is different), each lower mold cavity block 1201 By appropriately changing (adjusting) the positions of (for example, the left and right lower mold cavity blocks 1201 in FIG. 3), it is possible to clamp the left and right first substrates 11 with an appropriate pressing force.

  In the example of FIG. 1, the lower mold first wedge-shaped member 1411 a is caused to slide in the horizontal (left and right) direction by the lower wedge-shaped member drive mechanism 1413. Can. However, the present invention is not limited to this. For example, the upper lower-mold second wedge-shaped member 1411b may be slidable by the lower-mold wedge-shaped member drive mechanism 1413, or the lower-mold first wedge-shaped member 1411a and the lower mold second Both of the wedge-shaped members 1411 b may be slidable. The lower wedge-shaped member driving mechanism 1413 is not particularly limited, and, for example, a servomotor, an air cylinder, or the like can be used.

  Further, in FIG. 1, the entire one surface of each of the lower mold first wedge-shaped member 1411 a and the lower mold second wedge-shaped member 1411 b is a tapered surface. However, the present invention is not limited to this, and it is sufficient if at least one wedge-shaped member can be slid along the tapered surface. For example, in one or both of the lower mold first wedge-shaped member 1411a and the lower mold second wedge-shaped member 1411b, only a part of one surface may be a tapered surface. More specifically, for example, at least one of the lower mold first wedge-shaped member 1411a and the lower mold second wedge-shaped member 1411b shown in the figure, only the tip side (thin side) of one surface is a tapered surface, The thick side may be a horizontal plane. Further, although the lower mold first wedge-shaped member 1411 a and the lower mold second wedge-shaped member 1411 b are not in contact with each other in FIG. 1, the lower mold first wedge-shaped member 1411 a and the lower mold second wedge-shaped member are similar to the upper mold wedge-shaped mechanism 1310. The member 1411 b may be kept in contact with it.

  The upper surface of the lower mold second wedge member holding member 1422 is in contact with the lower surface of the lower mold first wedge member 1411a. On the other hand, the lower end of the lower mold cavity block pillar 1204 is connected to the upper surface of the lower mold second wedge-shaped member 1411 b. That is, the pair of lower mold wedge-shaped members are disposed so as to be sandwiched between the upper surface of the lower mold second wedge-shaped member holding member 1422 and the lower end of the lower mold cavity block pillar 1204. The lower mold cavity block 1201 can be moved up and down by changing the length of the pair of lower mold wedge members in the thickness direction.

  The lower mold mounting member 1421 is disposed above the lower mold second wedge-shaped member holding member 1422 and is fixed relative to the lower mold second wedge-shaped member holding member 1422 so as not to move up and down. In the space sandwiched between the lower mold attachment member 1421 and the lower mold second wedge member holding member 1422, the pair of lower wedge members are driven as described above, and the length in the thickness direction is changed. It is possible. A lower mold side block 1202 and a pot block 1203 are installed on the upper surface of the lower mold mounting member 1421. The lower mold cavity block pillar 1204 vertically penetrates the lower mold mounting member 1421 and can move up and down. The lower mold elastic member 1205 is sandwiched between the lower surface of the lower mold cavity block 1201 and the upper surface of the lower mold mounting member 1421, and can expand and contract in the mold opening and closing direction (vertical direction in the drawing) as described above.

  The “lower mold cavity block position change mechanism (other mold cavity block position change mechanism)” installed in the lower mold cavity block position change mechanism installation part (the other mold cavity block position change mechanism installation part) 1400 is The embodiment includes a lower wedge-shaped mechanism (the other wedge-shaped mechanism) 1410. However, the present invention is not limited to this. For example, the lower mold cavity block position changing mechanism (the other mold cavity block position changing mechanism) may further include other components.

  The manufacturing method of the resin molded product using the resin molding apparatus of FIG. 1 can be performed, for example, as shown in FIGS.

  First, as shown in FIG. 2, the release film 40 is supplied to the mold surface (upper mold surface) of the upper mold 1100. Then, the upper mold surface is covered with the mold release film 40 by adsorption or the like (one mold surface covering step). For the adsorption, as described later, a release film adsorption mechanism (not shown in FIG. 2) may be used. Further, the “mold surface (upper mold surface) of the upper mold 1100” for adsorbing the release film 40 includes the mold surface of the upper mold cavity 1106 and the lower surface of the upper mold cavity frame member 1102 as illustrated. Furthermore, at this time, as illustrated, the release film 41 is also supplied to the inside of the air vent groove 1104. In the state of FIG. 2, since the air vent groove 1104 is not closed, the release film 40 can be adsorbed via the air vent groove 1104.

  In addition, adsorption | suction of the release film 40 can be performed, for example, as shown in FIG. In FIG. 25, the resin molding apparatus 1000 has a release film suction mechanism 1351. Although the release film adsorption | suction mechanism 1351 is not specifically limited, For example, a suction pump etc. can be used. A mold release film is attached to the platen 1340, the upper mold cavity block position change mechanism installation portion frame member 1341, the upper mold cavity block position change mechanism installation portion bottom surface members 1342 and 1343 and the upper mold cavity frame members 1102 and 1103. A pipe 1352 is provided. The mold release film suction pipe 1352 is branched, and one end of each branched branch is opened as a mold release film suction hole 1353 at the lower end of the upper mold cavity frame members 1102 and 1103. Then, by releasing the release film suction mechanism 1351 from the other end of the release film suction pipe 1352, the release films 40 and 41 can be transferred to the upper mold surface and the air vent groove 1104 through the release film suction hole 1353. It can be adsorbed.

  Further, the release films 40 and 41 are transported to the position of the mold by, for example, a release film transport mechanism (not shown) or the like, and thereafter, on the mold surface (upper mold surface) of the upper mold 1100 as described above. It may be supplied.

  Next, as shown in FIG. 3, the tablet (resin material) 20 a is supplied into the pot 1211. At the same time, as shown in the drawing, the object to be molded (object to be molded) 10 is supplied to the upper surface of the lower mold cavity block 1201 (object to be molded supply process). The resin material 20a may be, for example, a thermosetting resin, but is not limited thereto, and may be, for example, a thermoplastic resin. At this time, the upper mold 1100 and the lower mold 1200 or only the lower mold 1200 may be previously heated and heated by a heater (not shown). Also, for example, the resin material 20a and the article 10 may be respectively transported to the position of the molding die by a transport mechanism (not shown) and supplied to the molding die.

  In addition, a product to be molded (a product to be molded; hereinafter, sometimes simply referred to as a "substrate") 10 may be, as illustrated, a first substrate 11, a second substrate 12, and a first connection portion (first connection). And a second connection portion (second connection terminal) 14 and a chip 15. The first substrate 11 and the second substrate 12 are arranged such that their respective one surfaces face each other. Opposing surfaces of the first substrate 11 and the second substrate 12 are connected to each other by a connection terminal 13. The chip 15 is connected by a second connection terminal 14 on the surface of the first substrate 11 facing the second substrate 12. Although one substrate (the article to be molded) 10 includes one each of the first substrate 11 and the second substrate 12 in the same figure, the present invention is not limited to this. For example, one substrate (object to be molded) 10 may include a plurality of second substrates 12, and the plurality of second substrates 12 may be mounted on the first substrate 11. In addition, the outline of the manufacturing method of the resin molded product using the board | substrate (to-be-molded product) 10 can be represented by FIG. 26 (a) and (b), for example. First, the substrate (the molded product) 10 shown in FIG. 26 (a) is the same as the substrate (the molded product) 10 of FIG. 3, and the configuration is as described above. The thickness (the height from the lower surface of the first substrate 11 to the upper surface of the second substrate 12) of the substrate (the article to be molded) 10 is represented by a symbol D in FIG. Then, as shown in FIG. 26B, by filling the space between the first substrate 11 and the second substrate 12 with a resin, the first connection terminal 13, the second connection terminal 14, and the chip 15 are sealed. It seals with resin 22 and molds. Thus, as illustrated, the resin molded product 10A can be manufactured. The specific method of the said resin sealing (resin molding) in a present Example is mentioned later. Further, for example, as shown in Example 3 described later, the present invention can cope with the case where the thickness D of the substrate (the article to be molded) 10 is different.

  Next, as shown in FIG. 4, the lower mold 1200 is raised in the direction of arrow X 1 by a drive source (not shown), and the first substrate 11 is divided by the lower mold cavity block 1201 and the upper mold cavity frame member 1102. Sandwich. At this time, as shown in the drawing, the resin material 20a is melted by the heat of the lower mold 1200, which has been heated in advance, and is changed to a molten resin (fluid resin) 20b.

  Next, as shown in FIG. 5, the lower die 1200 is further raised in the direction of the arrow X2. Accordingly, upward pressure is applied by the lower mold cavity block 1201 to the first substrate 11 sandwiched between the lower mold cavity block 1201 and the upper mold cavity frame member 1102. In this manner, the first substrate 11 is sandwiched and pressed between the lower mold cavity block 1201 and the upper mold cavity frame member 1102 and clamped (a molding object clamping step).

  Next, as shown in FIG. 6, the lower mold first wedge-shaped member 1411a is moved in the tip direction (the direction of the arrow a1) to be in contact with the lower mold second wedge-shaped member 1411b. By fixing the lower mold first wedge-shaped member 1411a and the lower mold second wedge-shaped member 1411b at this position, the position in the vertical direction of the lower mold cavity block 1201 is fixed at this position.

  Next, as shown in FIG. 7, the upper mold cavity block 1101 is lowered in the direction of the arrow c1 by the upper mold cavity block drive mechanism 1301. Thereby, the upper mold cavity block 1101 and the second substrate 12 are brought into contact with each other through the release film 40. At this time, the pressing force (clamping force) of the second substrate 12 by the upper mold cavity block 1101 is measured by the load cell 1303. This makes it possible to control the pressing force of the second substrate 12. By doing so, it is possible to suppress breakage of the substrate 10 due to the pressing force becoming too strong.

  Next, as shown in FIG. 8, the upper mold first wedge-shaped member 1311a is moved in the tip direction (the direction of the arrow e1). As a result, the length in the thickness direction of the upper cotter (upper mold first wedge-shaped member 1311a and upper mold second wedge-shaped member 1311b) is increased, and the upper mold second wedge-shaped member holding member 1321 is pushed down as illustrated. The upper mold cavity block holding member 1302 is contacted. By fixing upper mold first wedge-shaped member 1311a, upper mold second wedge-shaped member 1311b and upper mold cavity block holding member 1302 at this position, the vertical position of upper mold cavity block 1101 is fixed at this position ( One mold cavity block fixing process).

  Next, as shown in FIG. 9, lower die 1200 is lowered in the direction of arrow Y1, and the die is slightly opened. The “slightly open the mold” means that the second substrate 12 and the release film 40 are slightly opened so as not to be in contact with each other. Specifically, although not particularly limited, the distance between the second substrate 12 and the release film 40 may be a slight distance such as, for example, about 0.1 mm.

  Next, as shown in FIG. 10, the upper mold cavity block 1101 is lowered again in the direction of the arrow c2 by the upper mold cavity block drive mechanism 1301 (second mold cavity block position changing step). Thereby, the upper mold cavity block 1101 and the second substrate 12 are brought into contact with each other again through the release film 40 as illustrated. Thus, by lowering the upper mold cavity block 1101 in the direction of the arrow c 2 again, the upper mold second wedge member 1311 b is formed between the upper die cavity block holding member 1302 and the upper die second wedge member holding member 1321. Space for lowering the

  Next, as shown in FIG. 11, the upper mold first wedge-shaped member 1311a is slightly moved in the tip direction (the direction of the arrow e2). By doing this, as shown in FIG. 11, the upper mold second wedge member 1311b is in the state of FIG. 10 in consideration of the interference of the second substrate 12 (the part which shrinks in the mold clamping direction). It is slightly lowered from. As described above, by considering the interference of the second substrate 12, it is possible to suppress or prevent the resin from entering between the second substrate 12 and the release film 40.

  Next, as shown in FIG. 12, using the upper mold cavity block drive mechanism 1301, the upper mold cavity block 1101 is raised in the direction of the arrow d1. Thereby, as shown, the upper mold cavity block holding member 1302 and the upper mold second wedge-shaped member holding member 1321 are brought into contact with each other.

  The “one mold cavity block position changing step” in the method for producing a resin molded product according to the present invention can be performed, for example, as described in FIGS. 8 to 12, but is not limited to this method. Is optional. For example, in FIGS. 8 to 12, the upper mold wedge-shaped mechanism (one mold wedge mechanism) 1310 and the one mold cavity block drive mechanism (one mold cavity block drive mechanism) 1301 are used together in the “one mold cavity block position Change process was performed. However, the "one mold cavity block position changing step" may be performed, for example, using only one of the two mechanisms or neither of them. Moreover, the specific method and procedure which perform said "one type | mold cavity block position change process" are not limited to the method and procedure of FIGS. 8-12, either, It is arbitrary.

  Next, as shown in FIG. 13, the lower mold first wedge-shaped member 1411a is slightly moved in the tip direction (the direction of the arrow a2). As a result, in consideration of the interference of the first substrate 11, the length in the thickness direction of the pair of lower mold cotters consisting of the lower mold first wedge member 1411a and the lower mold second wedge member 1411b is slightly increased. At this time, the upper mold cavity block holding member 1302 continues to apply an upward force in the direction of the arrow d1 by the upper mold cavity block drive mechanism 1301 as illustrated.

  Next, as shown in FIG. 14, the lower mold 1200 is raised in the direction of arrow X3, and the mold is tightened again. As a result, the substrate (molded object) 10 to be resin-molded is pressed by the upper mold cavity block 1101 via the mold release film 40 (a molded object pressing step). Further, the pressure in the mold (in the upper mold cavity 1106, etc.) is reduced using a pressure reduction mechanism (not shown). At this time, as shown in FIG. 15, an upward force is continuously applied to the lower die 1200 in the direction of the arrow X4.

  Next, as shown in FIG. 16, the plunger 1212 is moved upward (in the direction of the arrow g1) to push the flowable resin 20b in the pot 1211 into the upper mold cavity 1106.

  Further, as shown in FIG. 17, the air vent pin 1332 is pushed downward (in the direction of the arrow h1) by the air vent pin power mechanism 1331 to close the air vent groove 1104. Thereafter, as shown in the figure, the plunger 1212 is further raised in the direction of the arrow g2, and the final filling of the flowable resin 20b into the upper mold cavity 1106 is performed. At this time, the upper mold cavity block 1101 is fixed using the upper mold wedge-shaped mechanism 1310 (second one mold cavity block fixing step). Furthermore, the lower mold cavity block 1201 is fixed using a lower mold wedge mechanism 1410. As described above, by fixing the upper mold cavity block 1101 and the lower mold cavity block 1201, even if resin pressure is applied in the upper mold cavity 1106, the upper mold cavity block 1101 and the lower mold cavity block 1201 can be opened and closed. Movement in the direction can be suppressed or prevented.

  Furthermore, as shown in FIG. 18, after the fluid resin 20b is cured to form a cured resin (sealing resin) 20 and an excess resin (unnecessary resin portion) 20d, the lower die 1200 is lowered in the direction of the arrow Y2, Open the mold. The method for curing the flowable resin 20b to form the cured resin (sealing resin) 20 is not particularly limited. For example, when the flowable resin 20b is a thermosetting resin, it may be cured by continuing heating. Also, for example, in the case where the flowable resin 20b is a thermoplastic resin, the heating to the mold may be stopped and the resin may be cured by being allowed to cool. Thus, a resin molded product in which the space between the first substrate 11 and the second substrate 12 is sealed with the curing resin (sealing resin) 20 can be manufactured. Thereafter, the resin molded product is carried out of the resin molding apparatus 1000 and recovered by an unloader (not shown) or the like.

  In addition, in the manufacturing method of the resin molded product of this invention, the said "resin molding process" is not limited to the method demonstrated in FIGS. For example, although the example of transfer molding was shown in FIGS. 2-18, any other resin molding method such as compression molding can be used in the present invention. Moreover, the method of transfer molding is not limited to the method of FIGS.

  In the present invention, for example, as described in the present embodiment, the position of one mold cavity block can be changed according to the thickness of the article to be molded. Thus, the depth of one of the mold cavities can be changed, so that molding defects can be suppressed or prevented even if the thickness of the article to be molded varies. Specifically, according to the present invention, for example, it is possible to suppress or prevent the resin leakage due to the tightening of the mold being too loose (the depth of one mold cavity is too large with respect to the thickness of the article to be molded). Further, according to the present invention, for example, it is possible to suppress or prevent breakage of the article to be molded due to too tight tightening of the mold (the depth of one mold cavity is too small with respect to the thickness of the article). it can. As a result, in the present invention, since the occurrence of defects of the resin molded product can be suppressed or prevented, the resin molded product can be manufactured with high yield.

  Note that, for example, the one mold wedge mechanism may be used to change the position of the one mold cavity block. Further, for the position change, for example, as described in the present embodiment, the one mold cavity block drive mechanism, the other mold wedge mechanism, or the like may be used, as necessary.

  Further, the present invention is not limited to the present embodiment, and any modification is possible. For example, in the present embodiment, the "one type" is the upper type and the "other type" is the lower type. However, the present invention is not limited to this, and, for example, the "one type" may be lower and the "other type" may be upper.

Example 2
Next, another embodiment of the present invention will be described.

  In the resin molding apparatus of the present invention, for example, only a mold can be replaced with another mold. This makes it possible to easily cope with resin molding using molding dies of different specifications.

  FIG. 19 is a cross-sectional view showing the configuration of the resin molding apparatus 1000 similar to FIG. 1 (Example 1). The configuration of this resin molding apparatus is as described in FIG.

  FIG. 20 shows the resin molding apparatus 1000 of FIG. 19 (FIG. 1) with the upper mold 1100 and the lower mold 1200 removed and the upper mold cavity block position changing mechanism installation portion (one mold cavity block position changing mechanism installation portion) 1300 and It is sectional drawing which shows typically the state which left the lower mold | type cavity block position change mechanism installation part (other mold cavity block position change mechanism installation part) 1400. FIG. The configurations of the upper mold cavity block position change mechanism installation portion 1300 and the lower mold cavity block position change mechanism installation portion 1400 are as described in FIG.

  FIG. 21 is a cross-sectional view schematically showing a configuration of a resin molding apparatus in a state where an upper mold 1100a and another lower mold 1200a different from the apparatus of FIG. 19 (FIG. 1) are attached to FIG. The upper mold (one mold) 1100a has an upper mold cavity block (one mold cavity block) 1101a instead of the upper mold cavity block (one mold cavity block) 1101, and an upper mold cavity frame member (one mold) Cavity frame member 1102 is replaced by an upper mold cavity frame member (one mold cavity frame member) 1102 a, and instead of the upper mold cavity frame member (one mold cavity frame member) 1103, an upper mold cavity frame member (one Frame member 1103a, air vent groove 1104a instead of air vent groove 1104a, slide hole 1105a instead of slide hole 1105, upper mold cavity (one mold cavity) 1106 Instead, it has an upper mold cavity (one mold cavity) 1106a. The upper mold 1100a is the same as the upper mold 1100 in FIG. 19 (FIG. 1) except that the shapes, dimensions, etc. of the respective parts (eg, upper mold cavity block and upper mold cavity frame member) slightly differ. Lower mold (the other mold) 1200a has lower mold cavity block (the other mold cavity block) 1201a instead of lower mold cavity block (the other mold cavity block) 1201, and lower mold side block (the other mold Lower mold side block (the other mold side block) 1202a instead of the mold side block 1202 and pot block 1203a instead of the pot block 1203 and the lower mold cavity block pillar (the other mold cavity block pillar) A lower mold cavity block pillar (the other mold cavity block pillar) 1204a is substituted for 1204, and a lower mold elastic member (the other mold elastic member) 1205a is substituted for the other mold elastic member (the lower mold elastic member) 1205 Have. The lower mold 1200a is the same as the lower mold 1200 of FIG. 19 (FIG. 1) except that the shapes, dimensions, etc. of the respective parts (eg, lower mold cavity block and pot block) are slightly different.

  For example, as shown in FIGS. 19 to 21, resin molds of different specifications can be coped with by exchanging the molds with molds of different specifications. Specifically, for example, as shown in FIGS. 19 to 21, the shape of the upper mold cavity block may be changed in accordance with the required cavity shape. Also, for example, as shown in FIGS. 19 to 21, the shape of the lower mold cavity block may be changed in accordance with the shape of the substrate to be used. Further, for example, as shown in FIGS. 19 to 21, the shape of the pot block may be changed in accordance with the number, the shape, and the like of resin tablets (resin materials) to be used. Also, for example, the air vent opening and closing mechanism may be moved according to the shape of the mold.

  In the resin molding apparatus of the present invention, for example, as shown in FIGS. 1 to 21, the wedge-shaped mechanism (cotter mechanism) is not incorporated as a part of the molding die, and the molding die and the wedge-shaped mechanism (cotter mechanism) are It is configured separately. As a result, for example, as shown in FIGS. 19 to 21, the mold can be easily replaced without replacing the wedge mechanism (cotter mechanism) or preparing another wedge member (cotter). For this reason, according to the resin molding apparatus of the present invention, for example, it is easy to exchange the molding die for the kind exchange of the resin molded product and the like.

[Example 3]
Next, another embodiment of the present invention will be described.

  In this embodiment, another example of a method for producing a resin molded product using the resin molding apparatus (FIG. 1) of Embodiment 1 will be described.

  FIG. 22 is a cross sectional view schematically showing one step of a method of manufacturing a resin molded product in the present example. In the figure, the thickness (height from the lower surface of the first substrate 11 to the upper surface of the second substrate 12) of the substrate (the article to be molded) 10 is different on the left and right (the thickness on the right is larger). Except this, FIG. 22 is the same as FIG. Although the widths of the upper mold cavities 1106 shown in FIGS. 22 and 3 are different from each other, the respective steps in the method of manufacturing a resin molded product can be performed similarly even if the widths of the upper mold cavities 1106 are different. it can.

  From this state, for example, the steps similar to FIGS. 4 to 5 are performed, and as shown in FIG. 23, the first substrate 11 is clamped and clamped between the lower mold cavity block 1201 and the upper mold cavity frame member 1102. Thereafter, for example, the same steps as in FIGS. 6 to 8 are performed, and as shown in FIG. 24, the position of the upper mold cavity block 1101 in the vertical direction is fixed at this position. Thereby, the depths of upper die cavities 1106 different from each other shown in FIG. 24 can be determined.

  22-24 are a part of process of the manufacturing method of the resin molded product of a present Example. More specifically, the method for producing a resin molded product of the present example may be performed, for example, according to the same procedures and steps as those of Example 1 (FIGS. 2 to 18).

  Moreover, in FIGS. 22-24, the example from which the thickness of the board | substrate (the to-be-molded product) 10 differs by the right and left of the figure was shown for convenience of illustration and description. However, in the present invention, the example corresponding to the change in the thickness of the object to be molded (object to be molded) is not limited to this. Specifically, for example, in the method of manufacturing a resin molded product once, the thickness of all objects to be molded is made the same, and when the method of manufacturing a resin molded product is performed again, it is necessary to precede the process. And the thickness of the object to be molded may be changed.

  Furthermore, the present invention is not limited to the above-described embodiments, and may be arbitrarily and appropriately combined, changed, or selected as needed without departing from the scope of the present invention. It is a thing.

10 Substrate (molding object, molding product)
DESCRIPTION OF SYMBOLS 10A Resin molded product 11 1st board | substrate 12 2nd board | substrate 13 1st connection part (1st connection terminal)
14 2nd connection part (2nd connection terminal)
15 Chip 20 Hardening resin (Sealing resin)
20a tablet (resin material)
20b Molten resin (flowable resin)
20d surplus resin (unnecessary resin part)
40 Release film 41 Release film of air vent portion 1000 Resin molding apparatus 1100, 1100a Upper mold (one of the molds)
1101, 1101a Upper mold cavity block (one mold cavity block)
1102, 1102a Upper mold cavity frame member (one mold cavity frame member)
1103, 1103a Upper mold cavity frame member (one mold cavity frame member)
1104, 1104a air vent groove 1105, 1105a sliding hole 1106, 1106a upper mold cavity (one mold cavity)
1200, 1200a Lower type (other type)
1201, 1201a Lower mold cavity block (other mold cavity block)
1202, 1202a Lower mold side block (the other mold side block)
1203, 1203a pot block 1204, 1204a lower mold cavity block pillar (other mold cavity block pillar)
1205, 1205a Lower mold elastic member (other mold elastic member)
1211 pot 1212 plunger 1300 upper mold cavity block position change mechanism installation part (one mold cavity block position change mechanism installation part)
1301 Upper mold cavity block drive mechanism (One mold cavity block drive mechanism)
1302 Upper mold cavity block holding member (one mold cavity block holding member)
1303 Load cell (pressure measurement mechanism)
1304 Upper mold cavity block pillar (one mold cavity block pillar)
1310 Upper type wedge type mechanism (one type wedge type mechanism)
1311a Upper type first wedge-shaped member (one type first wedge-shaped member)
1311b Upper type second wedge-shaped member (one type second wedge-shaped member)
1312 Upper type wedge-shaped power transmission member (one type wedge-shaped power transmission member)
1313 Upper type wedge member drive mechanism (one type wedge member drive mechanism)
1321 Upper mold second wedge-shaped member holding member (one mold second wedge-shaped member holding member)
1322 Elastic member of upper type second wedge-shaped member holding member (elastic member of one type second wedge-shaped member holding member)
1330 air vent opening / closing mechanism 1331 air vent pin power mechanism 1332 air vent pin 1340 platen (upper mold cavity block position changing mechanism installation base member or one mold cavity block position changing mechanism installation base member)
1341 Upper mold cavity block position change mechanism installation part frame member (One mold cavity block position change mechanism installation part frame member)
1342, 1343 Upper mold cavity block position changing mechanism installation part bottom member (One mold cavity block position changing mechanism installation part bottom member)
1351 Release film suction mechanism 1352 Release film suction pipe 1353 Release film suction hole 1400 Lower mold cavity block position change mechanism installation part (other mold cavity block position change mechanism installation part)
1410 Lower type wedge mechanism (other type wedge mechanism)
1411a Lower type first wedge-shaped member (other type first wedge-shaped member)
1411b Lower mold second wedge member (other mold second wedge member)
1412 Lower type wedge-shaped power transmission member (other type wedge-shaped power transmission member)
1413 Lower type wedge member drive mechanism (other type wedge member drive mechanism)
1421 Lower mold mounting member (other mold mounting member)
1422 Platen (lower mold second wedge-shaped member holding member or the other mold second wedge-shaped member holding member)
Arrows Y1 to Y2 indicating the rising direction or the direction of force application of the lower mold (the other mold) 1200 X1 to X4 arrows a1 to a2 indicating the lowering direction of the lower mold (the other mold) 1200 lower mold first wedge member (the other Arrow c1 to c2 indicating the advancing direction of the mold first wedge-shaped member 1411a arrow d1 indicating the lowering direction of the upper mold cavity block (one mold cavity block) 1101 uplift of the upper mold cavity block (one mold cavity block) 1101 Arrows e1 to e2 indicating the direction Arrows g1 to g2 indicating the advancing direction of the upper mold first wedge member (one die first wedge member) 1311a Arrow indicating the pushing direction of the plunger 1212 s Space h1 Lowering direction of the air vent pin 1332 Arrow D indicated: Thickness (height) of the object 10

Claims (20)

Mold and
One type of wedge-shaped mechanism,
Including one mold cavity block drive mechanism,
The mold includes one mold and the other mold,
The one mold includes one mold cavity block and one mold cavity frame member,
A sliding hole is formed in the one cavity frame member,
The one mold cavity block is movable in the sliding hole in the mold opening and closing direction of the mold;
One mold cavity can be formed by the surface of the one mold cavity block facing the other mold and the inner surface of the one mold cavity frame member,
The one mold cavity block can be moved in the mold opening / closing direction using the one mold cavity block drive mechanism,
Using said one of the mold wedge mechanism, Ri fixable der the position of said one of the mold cavity block in the mold opening and closing direction,
A part of the molding is clamped by the one cavity frame member and the other mold, and the one mold cavity block driving mechanism is used to perform the one mold cavity block and the other mold. In a state where a portion different from the part of the object to be molded is pressed,
For the one mold cavity block whose position is set based on the state, the using one type of wedge mechanism, and fixed to said Rukoto to limit the position in a direction away from the said other type resin Molding equipment.   A position where a portion different from the part of the object to be molded is pressed by the one mold cavity block and the other mold in order to set the position of the one mold cavity block based on the state The resin molding apparatus according to claim 1, wherein the one mold cavity block is set close to the other mold. Furthermore, it includes a pressing force measurement mechanism,
The resin molding apparatus according to claim 1 or 2, wherein the pressing force measuring mechanism can measure the pressing force for pressing the one mold cavity block using the one mold cavity block driving mechanism. The one type wedge mechanism includes a pair of one type wedge members;
The pair of one type wedge members includes one type first wedge member and one type second wedge member;
The one mold first wedge-shaped member and the one mold second wedge-shaped member each have a tapered surface, and are arranged such that the respective tapered surfaces face each other,
When at least one of the one mold first wedge-shaped member and the one mold second wedge-shaped member is moved, the one mold first wedge-shaped member and the one mold second wedge-shaped member contact with each other The resin molding apparatus according to any one of claims 1 to 3, wherein the length of the pair of mold wedge members in the mold opening and closing direction can be changed. The resin molding apparatus further includes the other type wedge-shaped mechanism,
The other mold includes the other mold cavity block,
Using the other type wedge mechanism, Ri fixable der the position of the other of the mold cavity block in the mold opening and closing direction,
In the above state, clamping is performed by the one cavity frame member and the other mold cavity block in order to clamp a part of the object to be molded, and a portion different from the part of the object is pressed. Pressing with the one mold cavity block and the other mold cavity block,
For the other of the mold cavity block whose position is set based on the state, using the other type wedge mechanism, said claims 1 to affix to limit the position in a direction away from the one mold 4 The resin molding apparatus as described in any one.   A state in which a portion different from the part of the object to be molded is pressed by the one mold cavity block and the other mold cavity block to set the position of the other mold cavity block based on the state. The resin molding apparatus according to claim 5, wherein the other mold cavity block is set closer to the one mold than the other position. The other type wedge mechanism includes a pair of other type wedge members;
The pair of other mold wedge members includes the other mold first wedge member and the other mold second wedge member;
Each of the other mold first wedge-shaped member and the other mold second wedge-shaped member is arranged such that it has a tapered surface, and the respective tapered surfaces face each other,
When at least one of the one mold first wedge member and the one mold second wedge member is moved, the other mold first wedge member and the other mold second wedge member are brought into contact with each other. The resin molding apparatus according to claim 5 or 6 , wherein the length in the mold opening / closing direction of the pair of other mold wedge members can be changed. By changing the length in the mold opening / closing direction of the pair of one mold wedge members when the one mold first wedge member contacts the one mold second wedge member, the mold opening / closing direction can be obtained. The resin molding apparatus according to any one of claims 4 to 7 , wherein the position of the one mold cavity block can be changed. By moving at least one of the one mold and the other mold in the mold clamping direction of the mold, the object to be molded is sandwiched by the one mold and the other mold, and the one mold cavity By moving the one mold cavity block toward the molding object using a block drive mechanism, the molding material is pressed by the one mold cavity block through the mold release film, and thereafter, The resin molding apparatus according to any one of claims 1 to 8 , wherein the position of the one mold cavity block in the mold opening / closing direction can be fixed using the one mold wedge mechanism. After fixing the position of the one mold cavity block, at least one of the one mold and the other mold is moved in the mold opening direction of the mold, and thereafter, the one mold cavity block driving mechanism and The resin molding apparatus according to any one of claims 1 to 9 , wherein the position of the one mold cavity block can be changed and fixed using the one mold wedge mechanism. A method for producing a resin molded product using a resin molding apparatus including a molding die,
The mold includes one mold and the other mold,
The one mold includes one mold cavity block and one mold cavity frame member,
A sliding hole is formed in the one cavity frame member,
The one mold cavity block is movable in the sliding hole in the mold opening and closing direction of the mold;
One mold cavity can be formed by the surface of the one mold cavity block facing the other mold and the inner surface of the one mold cavity frame member,
The other mold includes the other mold cavity block,
The method is
And the molded substance supply step of supplying the molded product in the mold,
A part of the molding is clamped by the one cavity frame member and the other mold cavity block with respect to the molding supplied to the mold, and the one mold cavity block and the one mold cavity block Setting a portion different from the part of the object to be molded by the other mold cavity block;
Fixing the one mold cavity block whose position has been set based on the state so as to limit the position away from the other mold;
Fixing the other mold cavity block whose position is set based on the state so as to limit the position away from the one mold;
A resin molding step of resin-molding the object in the one mold cavity;
A method for producing a resin molded product, comprising:   A state in which a portion different from the part of the object to be molded is pressed by the one mold cavity block and the other mold cavity block to set the position of the one mold cavity block based on the state. The method for manufacturing a resin molded product according to claim 11, wherein the one mold cavity block is set closer to the other mold from the above position.   A state in which a portion different from the part of the object to be molded is pressed by the one mold cavity block and the other mold cavity block to set the position of the other mold cavity block based on the state. The method for producing a resin molded product according to claim 11 or 12, wherein the other mold cavity block is set closer to the one mold from the above position.   The method for producing a resin molded product according to any one of claims 11 to 13, wherein in the state, a release film is interposed between the one mold cavity block and the object to be molded. The method for producing a resin molded product according to any one of claims 11 to 14, wherein the resin molding apparatus is a resin molding apparatus according to any one of claims 1 to 10 . The method for producing a resin molded product according to any one of claims 11 to 15, further comprising the other mold cavity block position changing step of changing the position of the other mold cavity block in the mold opening / closing direction. The method for producing a resin molded article according to claim 16 , wherein the resin molding apparatus is the resin molding apparatus according to any one of claims 5 to 7 . Furthermore, by moving at least one of the one mold and the other mold in the mold clamping direction of the mold, a clamp for clamping the mold with the mold and the other mold. Process,
An object pressing step in which the object is pressed by the one mold cavity block via a release film;
One mold cavity block fixing step of fixing the position of the one mold cavity block;
In the one mold cavity block repositioning step, the one mold cavity block driving mechanism is used to move the one mold cavity block toward the molding object,
In the object pressing step, using the one mold cavity block drive mechanism,
Pressing the object to be molded by the one mold cavity block through the mold release film;
The method according to any one of claims 15 to 17 , wherein after the object pressing step, in the one mold cavity block fixing step, the one mold wedge mechanism is used to fix the position of the one mold cavity block in the mold opening and closing direction. The manufacturing method of the resin molded article as described in any one. After the one mold cavity block fixing step, at least one of the one mold and the other mold is moved in the mold opening direction of the mold, and thereafter, using the one mold cavity block drive mechanism, A second one mold cavity block position changing step of changing the position of the one mold cavity block, and a second one mold cavity fixing the position of the one mold cavity block using the one mold wedge mechanism the method of the resin molded product prepared according to any one of claims 11 to 18, comprising a block fixed step. The molded article includes a plurality of substrates,
The method for producing a resin molded product according to any one of claims 11 to 19 , wherein the molded object is resin-molded by resin sealing between the respective substrates.

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