JP6704159B1 - Resin sealing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accurately clamp an individual type substrate such as FCBGA in a resin encapsulation device for clamping resin in a plurality of molds for resin encapsulation molding even if the thickness of each substrate varies. Provide a resin encapsulation device that can perform resin encapsulation molding at one time. A lower mold 3 having a plurality of substrate mounting portions 31 on which a plurality of substrates are individually mounted, and rods 32 that penetrate through the substrate in the vertical direction and abut against the plurality of substrate mounting portions 31, respectively. A thickness measuring means for measuring the thickness of each of the plurality of substrates, a mold base 2 for detachably supporting the lower mold 3, and a thickness of each of the plurality of substrates measured by the thickness measuring means. An adjusting mechanism 23 that presses the rod 32 by the pressing member 22 that penetrates the mold base 2 and individually adjusts the heights of the plurality of substrate mounting portions 31 is included. [Selection diagram] Figure 1

Description

The present invention relates to a resin encapsulation device for encapsulating an individual type substrate such as an FCBGA (Flip Chip Ball Grid Array) with a resin.

In the resin encapsulation molding of semiconductors, there is an increasing need for resin encapsulation molding of a substrate of an individual type (one substrate/one product (one chip to a plurality of chips)) such as FCBGA. Since this FCBGA substrate has a multi-layer structure, it is thicker than a conventional BGA (Ball Grid Array) product, and because of the multi-layer structure, the dimensional variation of the substrate thickness is large. Further, since the chip mounted on the substrate is large and generates a large amount of heat, there is also a demand for exposing the chip surface and mounting a heat sink in a post process.

For example, in Patent Document 1, in order to accurately clamp and resin-mount the mounted component according to the thickness of the mounted component mounted on the molded product, the first molded product is clamped and resin-molded. A first insert member that has an end surface facing the mounting component mounted on the molded product, and slides in the mold opening and closing direction with respect to the first mold; A pushing member for pushing the insert member 1 in the mold opening/closing direction to adjust the position in the die opening/closing direction is attached, and a plurality of pushing members mounted on the first die are arranged in the longitudinal direction of the molded product. The pusher member mounted on the second mold includes a movable taper plate that is driven to move back and forth in the orthogonal direction, and a fixed taper plate that is arranged with the movable taper plate facing the tapered surface. Disclosed is a resin mold die including a movable taper plate that is driven to move back and forth in a direction parallel to the longitudinal direction, and a fixed taper plate that is arranged with the movable taper plate facing the tapered surface.

In this resin mold die, after measuring the thickness of the substrate of the molded product and the thickness of the mounted component of the molded product, the press mounted on the first mold is measured based on the measurement result of the thickness of the mounted component. The moving member is controlled to set the position of the first insert member in the mold opening/closing direction, and the pushing member mounted on the second mold is controlled based on the measurement result of the thickness of the substrate to control the second moving member. The position of the insert member in the mold opening/closing direction is set and resin molding is performed. As a result, when the thickness of the product to be molded varies and exposure molding is possible.

JP, 2011-11426, A

In the conventional resin mold described above, an adjusting mechanism such as an insert member or a pushing member for adjusting the substrate mounting height is mounted in the mold, and a conventional strip-shaped lead frame or one semiconductor is used. It is good to place two substrates from which a plurality of products are to be placed in a mold and perform batch molding, but when producing a large number of individual type substrates such as FCBGA such as 4 to 6 in a batch, It is difficult in terms of space to incorporate a number of adjusting mechanisms corresponding to the number of substrates in the mold.

Therefore, in the present invention, in a resin encapsulation apparatus that clamps a plurality of individual type substrates such as FCBGA in a metal mold for resin encapsulation and molding, even if there is variation in the thickness of each substrate, it is appropriate. It is an object of the present invention to provide a resin encapsulation device that can be clamped at the same time and collectively encapsulated by resin molding.

The resin sealing device of the present invention is a lower mold for clamping a plurality of substrates with an upper mold and injecting resin into a cavity formed between the upper mold and the resin for molding. And a lower mold having a plurality of substrate mounting parts on which a plurality of substrates are individually mounted, and a rod penetrating the lower mold in the vertical direction and abutting on each of the plurality of substrate mounting parts. A thickness measuring means for measuring the thickness of each of the plurality of substrates, a mold base for detachably supporting the lower mold, and a mold base for measuring the thickness of each of the plurality of substrates measured by the thickness measuring means. And an adjusting mechanism for individually adjusting the heights of the plurality of substrate mounting portions by pressing the rod with a pressing member penetrating through.

According to the resin sealing device of the present invention, when the plurality of substrates individually mounted on the plurality of substrate mounting portions of the lower mold are clamped between the upper mold and the plurality of substrates, the thickness is measured by the thickness measuring means. According to the thickness of each of the plurality of substrates, the rod is pressed by the pressing member penetrating the mold base, and the heights of the plurality of substrate mounting portions of the lower mold are individually adjusted to mount each substrate. It is possible to accurately clamp the substrate placed on the part.

Here, the adjusting mechanism is an elevating member that elevates and lowers the pressing member, and includes an elevating member having a first tapered surface on a lower portion, an elastic member that presses the elevating member downward, and a first tapered surface of the elevating member on an upper portion. A moving member having a second tapered surface facing each other, a sliding member interposed between the first tapered surface and the second tapered surface, and moving the moving member forward and backward to move the first tapered surface, the sliding member, and It is desirable to have a drive part which raises/lowers a raising/lowering member via a 2nd taper surface. Thus, since the sliding member is interposed between the first tapered surface of the moving member and the second tapered surface of the elevating member, the sliding member slides when the moving member is moved forward and backward. The lifting member can be raised and lowered smoothly.

The resin sealing device of the present invention preferably has a detachable spacer member on the upper end of the pressing member. As a result, it is possible to adjust the thickness of the spacer member by exchanging or processing the spacer member, and evenly adjusting the pressing force and the inclination of the pressing member against the substrate mounting portion.

In the resin sealing device of the present invention, it is preferable that a plurality of rods are provided in each of the plurality of substrate mounting portions, and that the resin sealing device has a receiving plate that abuts the lower surfaces of the plurality of rods and transmits the pressing force of the pressing member. As a result, the pressing force of the pressing member is evenly transmitted to the plurality of rods via the receiving plate, so that the driving accuracy of the substrate platform can be improved.

The resin sealing device of the present invention measures the thickness of each of the plurality of substrates by the thickness measuring means, and adjusts the plurality of substrate placement parts by the adjusting mechanism according to the thickness of each of the plurality of substrates measured by the thickness measuring means. After individually adjusting the heights of the molds, the upper and lower molds are temporarily closed and clamped with the release films arranged on the plurality of substrate mounting parts, respectively. It is desirable to further include a control unit that closes the upper mold and the lower mold after injecting the resin and raises the plurality of substrate mounting parts by the adjusting mechanism. Thereby, the thickness of each of the plurality of substrates is measured by the thickness measuring means, and the heights of the plurality of substrate mounting portions are individually adjusted by the adjusting mechanism according to each thickness of the plurality of substrates measured by the thickness measuring means. After adjustment, the mold release film placed on each of the plurality of substrates placed on each of the plurality of substrate placement parts is temporarily closed by clamping the upper mold and the lower mold, and when the resin is injected. Even if the substrate mounting part is slightly lowered or the mold is slightly opened due to the resin injection pressure, the upper mold and the lower mold are further closed, and the adjustment mechanism is used to move the plurality of substrate mounting parts. By raising, the amount of crushing by the clamp can be controlled without crushing and crushing the release film more than necessary.

(1) A lower mold for clamping a plurality of substrates with the upper mold and injecting a resin into a cavity formed between the upper mold and the resin for molding. Of a plurality of substrates, and a lower mold having a plurality of substrate mounting parts on which the individual substrate is mounted, and a rod penetrating the lower mold in the vertical direction and abutting on each of the plurality of substrate mounting parts. A thickness measuring means for measuring each thickness, a mold base detachably supporting the lower mold, and a pressing member penetrating the mold base according to each thickness of the plurality of substrates measured by the thickness measuring means. With the configuration including an adjusting mechanism that presses the rod and individually adjusts the heights of the plurality of substrate mounting portions, the plurality of substrates individually mounted on the plurality of substrate mounting portions of the lower mold are moved upward. When clamped between the mold and the mold, the rod is pressed by the pressing member penetrating the mold base according to the thickness of each of the plurality of substrates measured by the thickness measuring means, and the plurality of substrates of the lower mold are mounted. By individually adjusting the height of the mounting part, it is possible to absorb the variation in the thickness of the substrate mounted on each substrate mounting part and clamp it accurately for batch resin molding. Become.

(2) The adjusting mechanism is an elevating member that elevates and lowers the pressing member, and has an elevating member having a first tapered surface on the lower portion, an elastic member that presses the elevating member downward, and a first tapered surface of the elevating member on the upper portion A moving member having a second tapered surface facing each other, a sliding member interposed between the first tapered surface and the second tapered surface, and moving the moving member forward and backward to move the first tapered surface, the sliding member, and With the configuration including the drive unit that moves the elevating member up and down via the second tapered surface, the elevating member can be smoothly moved up and down by sliding the sliding member when the moving member is moved forward and backward. It is possible to adjust the height of the substrate mounting portion with high accuracy.

(3) With the configuration having the detachable spacer member at the upper end of the pressing member, the thickness of the spacer member can be easily adjusted by replacing or processing the spacer member, and the pressing member can evenly press the substrate mounting portion. It is possible to easily adjust the pressure and the inclination.

(4) A plurality of rods are provided in each of the plurality of substrate mounting portions, and a configuration is provided that has a receiving plate that abuts the lower surfaces of the plurality of rods and transmits the pressing force of the pressing member. Can be raised.

(5) The thickness of each of the plurality of substrates is measured by the thickness measuring means, and the heights of the plurality of substrate mounting portions are individually adjusted by the adjusting mechanism according to the thickness of each of the plurality of substrates measured by the thickness measuring means. After adjustment, the upper mold and the lower mold are once closed and clamped to the release films arranged on the plurality of substrates respectively mounted on the plurality of substrate mounting portions, and after resin injection, Further, the upper mold and the lower mold are closed, and the control unit that raises the plurality of substrate placement units by the adjusting mechanism is used to measure the thickness of each of the plurality of substrates by the thickness measuring unit and the thickness measuring unit. After individually adjusting the heights of the plurality of substrate mounting portions by the adjusting mechanism according to the respective thicknesses of the plurality of measured substrates, the plurality of substrate mounting portions are mounted on the plurality of substrate mounting portions. When the upper mold and the lower mold are temporarily closed and clamped with the release film provided, when the resin is injected, the substrate placing part is slightly lowered due to the resin injection pressure, or the mold is opened slightly. Even if it does, the upper mold and the lower mold are closed, and the multiple substrate mounting parts are raised by the adjusting mechanism, so that the release film is not crushed and crushed more than necessary, and crushed by the clamp. The amount can be controlled, and it becomes possible to prevent the air vent from collapsing, prevent resin leakage, and prevent the release film from wrinkling.

It is a longitudinal cross-sectional view which shows the schematic structure of the lower metal mold|die part of the resin sealing device in embodiment of this invention. It is a figure which shows the state which removed the lower metal mold of FIG. It is a top view of FIG. It is explanatory drawing which shows arrangement|positioning of a thickness measuring means. It is explanatory drawing which shows the state which adjusted the height of the board|substrate mounting part with respect to the board|substrate from which thickness differs. It is explanatory drawing which shows the state which opened the metal mold|die. It is explanatory drawing which shows the state which closed the metal mold|die. It is explanatory drawing which shows the mode of the air vent in the state which clamped the mold release film. It is explanatory drawing which shows the form which further provided the pressing plate in the upper end part of the pressing member. It is explanatory drawing which shows the state in which the bottom face member of the cavity of an upper metal mold is in a retracted position. It is explanatory drawing which shows the state in which the bottom face member of the cavity of an upper die exists in a molding position. FIG. 6 is an explanatory view showing a state where the bottom member of the cavity of the upper mold is pressed against the surface of the semiconductor chip.

1 is a vertical cross-sectional view showing a schematic configuration of a lower mold portion of a resin sealing device according to an embodiment of the present invention, FIG. 2 is a view showing a state where the lower mold of FIG. 1 is removed, and FIG. FIG. 4 is an explanatory view showing the arrangement of the thickness measuring means.

As shown in FIGS. 1 and 2, a resin sealing device according to an embodiment of the present invention includes a mold base 2 on a mold press unit 1. The mold base 2 detachably supports the lower mold 3. The lower mold 3 clamps a plurality of substrates 6 between itself and the upper mold 5 (see FIG. 6), and injects resin into a cavity 51 (see FIG. 3) formed between the lower mold 3 and the upper mold 5. Then, it is for resin sealing molding.

In FIG. 3, the position of the cavity 51 formed between the upper mold 5 and the lower mold 3 and the positions of the cull 57, runner 58, gate 59 and air vent 60 formed in the upper mold 5. And are indicated by a one-dot chain line. The semiconductor chip 7 mounted on the substrate 6 is housed in the cavity 51 (see FIGS. 6 and 7). The cull 57, the runner 58, and the gate 59 are resin paths communicating with the cavity 51. The air vent 60 is a gas discharge passage formed on the opposite side of the gate 59 with the cavity 51 interposed therebetween.

In addition, the resin sealing device according to the present embodiment includes a thickness measuring unit 4 (see FIG. 4) that measures the thickness of each of the plurality of substrates 6. The thickness measuring means 4 can be composed of, for example, a pair of laser displacement sensors 4A and 4B arranged vertically so as to sandwich the substrate 6. The thickness measuring means 4 measures the thickness of the substrate 6 by detecting the positions of the upper surface and the lower surface of the substrate 6 by the laser displacement sensors 4A and 4B, respectively. The thickness measuring means 4 is controlled by the control unit 10.

The lower mold 3 includes a plurality of substrate mounting parts 31 on which a plurality of substrates 6 are individually mounted, and a rod which penetrates the lower mold 3 in the vertical direction and abuts on each of the plurality of substrate mounting parts 31. 32 and 32. A plurality of rods 32 are provided in each of the plurality of substrate mounting portions 31. Further, a plurality of receiving plates 33 are provided on the lower surfaces of the plurality of rods 32 that abut on each of the substrate mounting portions 31.

The receiving plate 33 is constantly pressed downward by the elastic member 34, and rises against the elastic member 34 by the amount that is pushed up by the upward movement of the pressing member 22. On the other hand, when the pressing member 22 descends, the receiving plate 33 is pressed by the elastic member 34 and descends. The receiving plate 33 is provided for each of the plurality of substrate mounting portions 31, and comes into contact with the lower surface of the rod 32 of each of the plurality of substrate mounting portions 31 so that the pressing force of the pressing member 22, which will be described later, is applied to the rod 32. It is transmitted to each substrate mounting part 31 via the.

The mold base 2 includes a mold holding portion 21 that holds the lower mold 3, a pressing member 22 that penetrates the mold base 2 and presses the rod 32, and a plurality of substrates 6 measured by the thickness measuring means 4. And an adjusting mechanism 23 for individually adjusting the heights of the plurality of substrate placement parts 31 by pressing the rod 32 by the pressing member 22 according to the thickness of the substrate mounting part 31. The pressing member 22 presses the rod 32 via the plurality of receiving plates 33 of the lower mold 3 of the mold holding unit 21. Further, a detachable spacer member 22A is provided on the upper end of the pressing member 22.

The adjustment mechanism 23 includes an elevating member 24 that elevates and lowers the pressing member 22, an elastic member 25 that presses the elevating member 24 downward, a moving member 26 that elevates and lowers the elevating member 24 by moving forward and backward, and a moving member 26. A drive unit 27 for moving the substrate forward and backward is provided for each substrate platform 31. The elevating member 24 has a first tapered surface 24A on the lower surface. The moving member 26 moves horizontally on the pedestal 30. Further, the moving member 26 has a second taper surface 26A on the upper portion, which faces the first taper surface 24A of the elevating member 24. A roller 28 as a sliding member is interposed between the first tapered surface 24A and the second tapered surface 26A. A roller 29 as a sliding member is interposed between the moving member 26 and the pedestal 30.

The adjusting mechanism 23 moves the moving member 26 forward and backward by the drive unit 27, thereby moving the elevating member 24 up and down via the first tapered surface 24A, the roller 28, and the second tapered surface 26A. At this time, the elevating member 24 is constantly pressed downward by the elastic member 25, and rises against the elastic member 25 by the amount pushed up by the moving member 26 moving forward. On the other hand, when the moving member 26 retracts, the elevating member 24 is pressed by the elastic member 25 and descends. The adjusting mechanism 23 is controlled by the control unit 10.

In the resin sealing device having the above configuration, the control unit 10 measures the thickness of the substrate 6 placed on each substrate placing unit 31 by the thickness measuring unit 4, and measures the thickness of the plurality of substrates 6 measured by the thickness measuring unit 4. The height of each substrate mounting portion 31 is individually adjusted by the adjusting mechanism 23 according to each thickness. As a result, even when a thick substrate 6A and a thin substrate 6B having different thicknesses are mounted on the substrate mounting portion 31 of one lower die 3, for example, as shown in FIG. The rod 32 is pressed by the pressing member 22 according to the thickness of 6B, and the height of the substrate platform 31 is individually adjusted.

After that, as shown in FIG. 6, each substrate 6 is placed on each substrate placing portion 31, and the resin 36 is put into the pot 35 of the lower mold 3, and then placed on each of the plurality of substrate placing portions 31. The release film 11 is arranged on the plurality of placed substrates 6, and the upper mold 5 and the lower mold 3 are once closed and clamped as shown in FIG. 7. Then, the plunger 37 is raised to inject the resin 36 from the pot 35 into the cavity 51 through the cull 57, the runner 58 and the gate 59.

At the time of this resin injection, the substrate mounting portion 31 is slightly lowered by the injection pressure of the resin 36, and the upper die 5 and the lower die 3 are slightly opened (about 0.02 to 0.03 mm). The control unit 10 further closes the upper mold 5 and the lower mold 3, and causes the adjustment mechanism 23 to raise each substrate mounting unit 31. As a result, it is possible to control the crushing amount by the clamp without crushing the release film 11 more than necessary as shown in FIG. 8, preventing the air vent 60 from crushing, preventing resin leakage, and removing the release film 11. Wrinkles can be prevented.

As described above, in the resin sealing device according to the present embodiment, the plurality of substrates 6 individually mounted on the plurality of substrate mounting portions 31 of the lower mold 3 are clamped between the upper mold 5. At this time, the rod 32 is pressed by the pressing member 22 penetrating the mold base 2 according to the thickness of each of the plurality of substrates 6 measured by the thickness measuring means 4, and the plurality of substrate mounting portions of the lower mold 3 are then pressed. By individually adjusting the heights of the substrates 31, the variations in the thickness of the substrates 6 mounted on the respective substrate mounting portions 31 are absorbed and accurately clamped to collectively seal the plurality of substrates 6 with resin. It can be molded.

Therefore, even if the substrate 6 is a large piece type multi-layer substrate such as FCBGA and the thickness is thicker than the conventional BGA product and the variation in the substrate thickness is large, it is possible to improve the production efficiency of the resin sealing molding. Becomes Further, in this resin sealing device, since it is possible to remove the lower mold 3 from the mold base 2 and replace it as shown in FIG. 3, it is possible to produce another type by replacing only the mold. Cost reduction is possible even for multi-product production.

Further, in the resin sealing device according to the present embodiment, the roller 28 as a sliding member is interposed between the first tapered surface 24A of the elevating member 24 and the second tapered surface 26A of the moving member 26, and the moving member When the roller 26 slides forward and backward, the roller 28 slides so that the elevating member 24 can be smoothly moved up and down, and the height of the substrate platform 31 can be adjusted with high accuracy. It is possible.

Further, since the pressing member 22 according to the present embodiment has the detachable spacer member 22A at the upper end, the spacer member 22A can be easily adjusted in thickness by exchanging or processing the spacer member 22A. It is possible to easily perform uniform pressing force adjustment and tilt adjustment on the mounting portion 31.

In addition, in the resin sealing device according to the present embodiment, a plurality of rods 32 are provided in each of the plurality of substrate mounting portions 31, and the rods 32 are in contact with the lower surfaces of the rods 32 to receive the pressing force of the pressing member 22. Since the structure has the plate 33, the pressing force of the pressing member 22 is evenly transmitted to the plurality of rods 32 via the receiving plate 33, and the driving accuracy of the substrate platform 31 can be improved.

As shown in FIG. 9, it is also possible to provide a pressing plate 22B at the upper end of the pressing member 22 and press the receiving plate 33 via the pressing plate 22B. As a result, the upper surface of the pressing plate 22B becomes parallel to the lower surface of the substrate mounting portion 31, and the pressing force of the pressing member 22 is evenly transmitted to the substrate mounting portion 31.

Further, in the resin sealing device according to the present embodiment, as shown in FIG. 6, the bottom member 52 of each cavity 51 of the upper mold 5 can be moved up and down. The elevating mechanism of the bottom member 52 includes a plurality of rods 53 that penetrate the upper mold 5 in the vertical direction and contact the bottom members 52 of the cavities 51, a receiving plate 54 that contacts the upper surface of the rod 53, and a receiving plate. An elastic member 55 that presses 54 upward and a pressing member 56 that presses the rod 53 via the receiving plate 54 are provided. A removable spacer member 56A is provided at the lower end of the pressing member 56.

The receiving plate 54 is constantly pressed upward by the elastic member 55 and moves downward against the elastic member 55 by an amount that is pressed down by the pressing member 56 moving downward. On the other hand, when the pressing member 56 moves up, the receiving plate 54 is pressed by the elastic member 55 and moves up. The receiving plate 54 is provided for each cavity 51, and transmits the pressing force of the pressing member 56 to the bottom member 52 via the rod 53.

FIG. 10 shows a state in which the bottom member 52 of the cavity 51 of the upper mold 5 is in the retracted position. By individually lowering the pressing member 56 of each cavity 51 from this retracted position, it is possible to lower the bottom member 52 to the molding position of each cavity 51 shown in FIG. 11 and perform resin sealing molding. Further, as shown in FIG. 12, the pressing member 56 is lowered to press the bottom surface member 52 against the surface of the semiconductor chip 7 mounted on the substrate 6, so that the chip surface exposure molding can be performed.

INDUSTRIAL APPLICABILITY The resin encapsulation device of the present invention is useful as a resin encapsulation device for resin-encapsulating individual type substrates such as FCBGAs (Flip Chip Ball Grid Arrays), and in particular, the thickness of each substrate varies. Even in the case, it is suitable as a resin encapsulation device that can be accurately clamped and collectively encapsulated with resin.

1 Mold Press Section 2 Mold Base 3 Lower Mold 4 Thickness Measuring Means 4A Laser Displacement Sensor 5 Upper Mold 6, 6A, 6B Substrate 7 Semiconductor Chip 10 Control Section 11 Release Film 21 Mold Holding Section 22 Pressing Member 22A Spacer Member 22B Pressing plate 23 Adjusting mechanism 24 Elevating member 25 Elastic member 26 Moving member 27 Drive part 28, 29 Roller 30 Pedestal 31 Substrate placing part 32 Rod 33 Receiving plate 34 Elastic member 35 Pot 36 Resin 37 Plunger 51 Cavity 52 Bottom member 53 Rod 54 Receiving Plate 55 Elastic Member 56 Pressing Member 56A Spacer Member 57 Cull 58 Runner 59 Gate 60 Air Vent

Claims (5)

A lower mold for clamping a plurality of substrates with the upper mold and injecting a resin into a cavity formed between the upper mold and the resin for molding. A lower mold having a plurality of substrate mounting parts that are individually mounted, and a rod that penetrates the lower mold in the vertical direction and abuts on each of the plurality of substrate mounting parts,
Thickness measuring means for measuring the thickness of each of the plurality of substrates,
A mold base that detachably supports the lower mold,
According to the thickness of each of the plurality of substrates measured by the thickness measuring means, the pressing member penetrating the mold base presses the rod to individually adjust the heights of the plurality of substrate mounting portions. A resin sealing device including an adjusting mechanism. The adjustment mechanism is an elevating member that elevates and lowers the pressing member, and includes an elevating member having a first tapered surface on a lower portion, an elastic member that presses the elevating member downward, and a first taper of the elevating member on an upper portion. A moving member having a second tapered surface facing the surface, a sliding member interposed between the first tapered surface and the second tapered surface, and the first tapered surface by moving the moving member forward and backward. 2. The resin sealing device according to claim 1, further comprising: a drive unit that raises and lowers the elevating member via the sliding member and the second tapered surface. The resin sealing device according to claim 1, further comprising a detachable spacer member at an upper end of the pressing member. A plurality of the rods are provided in each of the plurality of substrate mounting portions,
The resin sealing device according to any one of claims 1 to 3, further comprising a receiving plate that is in contact with lower surfaces of the plurality of rods and that transmits a pressing force of the pressing member. The thickness of each of the plurality of substrates is measured by the thickness measuring unit, and the height of the plurality of substrate placement units is adjusted by the adjusting mechanism according to the thickness of each of the plurality of substrates measured by the thickness measuring unit. After individually adjusting, the release film disposed on the plurality of substrates respectively mounted on the plurality of substrate mounting portions is clamped by temporarily closing the upper mold and the lower mold. Then, after the resin is injected, the upper mold and the lower mold are further closed, and a control unit for raising the plurality of substrate placement parts by the adjusting mechanism is provided. The resin sealing device described.

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