JP7430152B2 - Resin molding equipment and method for manufacturing resin molded products - Google Patents

Description

The present invention relates to a technology for a resin molding apparatus and a method for manufacturing a resin molded product.

Patent Document 1 discloses a lower mold on which a substrate is placed, an upper mold in which a cavity is formed by an upper mold cavity frame member and a cavity block, a mold clamping mechanism for clamping the lower mold and the upper mold, and a resin material. A resin molding apparatus is disclosed that includes a plunger that supplies the resin to the cavity. This resin molding apparatus can adjust the depth of the cavity to an appropriate depth by adjusting the position of the cavity block with respect to the upper mold cavity frame member.

Japanese Patent Application Publication No. 2020-179604

Here, in recent years, with the expansion of technical fields to which resin molded products are applied, the requirements for precision required for resin molded products have become higher. Therefore, there is a need for a technology that can produce resin molded products with higher precision.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a resin molding apparatus and a method for manufacturing resin molded products that are capable of manufacturing resin molded products with high precision. That's true.

The problem to be solved by the present invention is as described above, and in order to solve this problem, a resin molding apparatus according to the present invention provides a chip volumetric apparatus that measures the volume of a chip placed on a substrate to be resin molded. a measuring section, a resin volume measuring section that measures the volume of a resin material used for resin molding of the substrate, a lower mold on which the substrate is placed, a side block, and a device that can be raised and lowered up and down with respect to the side block. an upper die forming a cavity by means of a cavity block provided to a calculation unit that calculates the relationship between the resin filling rate of the cavity and the position of the plunger based on the measurement results of the volume measurement unit and the resin volume measurement unit; and resin molding using the substrate and the resin material. When the plunger reaches a position corresponding to a predetermined resin filling rate, using the relationship between the resin filling rate calculated by the calculation unit and the position of the plunger, A control unit that performs filling rate corresponding control to control the operation.

Moreover, the method for manufacturing a resin molded article according to the present invention is for manufacturing a resin molded article using the resin molding apparatus.

Further, the method for manufacturing a resin molded product according to the present invention includes a chip volume measuring step of measuring the volume of a chip placed on a substrate, a resin volume measuring step of measuring the volume of a resin material, the chip volume measuring step and a plunger position calculation step of calculating the relationship between the resin filling rate of the cavity and the position of the plunger based on the volume of the chip and the volume of the resin material measured in the resin volume measurement step; and the substrate and the resin material. When resin molding is performed using the plunger, the method includes a filling rate corresponding control step of controlling operations related to resin molding when the plunger reaches a position corresponding to a predetermined resin filling rate.

According to the present invention, highly accurate resin molded products can be manufactured.

FIG. 1 is a schematic plan view showing the overall configuration of a resin molding apparatus according to an embodiment. FIG. 1 is a front sectional view showing the configuration of a resin molded module according to an embodiment. (a) A schematic plan view showing the configuration of a lower mold according to an embodiment viewed from the mold surface side (above). (b) A schematic bottom view showing the configuration of the upper mold according to one embodiment viewed from the mold surface side (lower side). (a) A schematic plan view showing a connecting groove that connects the cull portions. (b) A schematic plan view showing an example in which the cull parts are connected to each other via a cavity. (a) A front sectional view showing how the depth of the cavity becomes shallow when clamped by the mold clamping mechanism. (b) A front sectional view showing how the depth of the cavity increases when resin is supplied by the plunger. The flowchart which showed an example of the manufacturing method of a resin molded article. The figure which showed the time change of the clamp load, plunger position, and plunger load based on a 1st control aspect. 5 is a flowchart showing a specific example of filling rate corresponding control. (a) A front sectional view showing the lower mold and the upper mold in a clamped state. (b) A front sectional view showing the lower die and the upper die in a state where the clamp load is reduced. The figure which showed the time change of the clamp load, plunger position, and plunger load based on a 2nd control aspect.

In the following, the directions shown by arrow U, arrow D, arrow L, arrow R, arrow F, and arrow B shown in the figures will be referred to as upward direction, downward direction, left direction, right direction, front direction, and backward direction, respectively. Define and explain.

<Overall configuration of resin molding device 1>
First, the configuration of a resin molding apparatus 1 according to the first embodiment will be described using FIG. 1. The resin molding apparatus 1 seals an electronic element such as a semiconductor chip (hereinafter simply referred to as a "chip 2a") with a resin, and manufactures a resin molded product. In particular, this embodiment illustrates a resin molding apparatus 1 that performs resin molding using a transfer molding method.

The resin molding apparatus 1 includes a supply module 10, a resin molding module 20, and a carry-out module 30 as components. Each component is removable and replaceable with respect to other components.

<Supply module 10>
The supply module 10 supplies a lead frame (hereinafter simply referred to as "substrate 2"), which is a type of substrate on which the chip 2a is mounted, and a resin tablet T to the resin molding module 20. Note that in this embodiment, a lead frame is illustrated as the substrate 2, but in addition to the lead frame, various other substrates (glass epoxy substrate, ceramic substrate, resin substrate, metal substrate, etc.) may be used. is possible. The supply module 10 mainly includes a frame delivery section 11, a frame measurement section 12, a frame supply section 13, a resin delivery section 14, a resin measurement section 15, a resin supply section 16, a loader 17, and a control section 18.

The frame sending section 11 sends out the substrate 2 that is not sealed with resin and is accommodated in an in-magazine unit (not shown) to the frame measuring section 12 . The frame measuring section 12 measures the volume of the chip 2a mounted on the substrate 2. Note that the frame measuring section 12 is an embodiment of the chip volume measuring section of the present application. Details regarding the frame measuring section 12 will be described later. The substrate 2 that has been completely measured in the frame measurement section 12 is sent to the frame supply section 13. The frame supply section 13 receives the substrates 2 from the frame measurement section 12, appropriately aligns the received substrates 2, and delivers them to the loader 17.

The resin delivery section 14 receives the resin tablets T from a stocker (not shown) and sends the resin tablets T to the resin measuring section 15. The resin measuring section 15 measures the weight (volume) of the resin tablet T. Note that the resin measuring section 15 is an embodiment of the resin volume measuring section of the present application. Details of the resin measuring section 15 will be described later. The resin tablet T for which the measurement in the resin measurement section 15 has been completed is sent to the resin supply section 16. The resin supply section 16 receives the resin tablets T from the resin measurement section 15, appropriately arranges the received resin tablets T, and delivers them to the loader 17.

The loader 17 transports the substrate 2 and resin tablets T received from the frame supply section 13 and the resin supply section 16 to the resin molding module 20.

The control unit 18 controls the operation of each module of the resin molding apparatus 1. Note that the control unit 18 is an embodiment of the calculation unit of the present application. The control unit 18 controls the operations of the supply module 10, resin molding module 20, and unloading module 30. Further, using the control unit 18, the operation of each module can be arbitrarily changed (adjusted).

In addition, in this embodiment, although the example which provided the control part 18 in the supply module 10 is shown, it is also possible to provide the control part 18 in other modules. Further, it is also possible to provide a plurality of control sections 18. For example, it is also possible to provide the control section 18 for each module or for each device, and to control the operations of each module individually while interlocking with each other.

<Resin molding module 20>
The resin molding module 20 seals the chip 2a mounted on the substrate 2 with resin. In this embodiment, two resin molded modules 20 are arranged side by side. By performing the resin sealing of the substrate 2 in parallel using the two resin molding modules 20, it is possible to improve the manufacturing efficiency of the resin molded product. The resin molding module 20 mainly includes a mold (a lower mold 110 and an upper mold 140) and a mold clamping mechanism 190 (see FIG. 2).

The molds (lower mold 110 and upper mold 140) are used to resin-seal the chip 2a mounted on the substrate 2 using a molten resin material. The mold includes a pair of upper and lower molds, that is, a lower mold 110 and an upper mold 140 (see FIG. 2, etc.). The mold is provided with a heating section (not shown) such as a heater.

The mold clamping mechanism 190 (see FIG. 2) clamps or opens the molds (lower mold 110 and upper mold 140) by moving the lower mold 110 up and down.

<Export module 30>
The carry-out module 30 receives the resin-sealed substrate 2 from the resin molding module 20 and carries it out. The unloading module 30 mainly includes an unloader 31 and a substrate storage section 32.

The unloader 31 holds the resin-sealed substrate 2 and carries it out to the substrate storage section 32 . The substrate accommodating portion 32 accommodates the resin-sealed substrate 2.

<Overview of operation of resin molding device 1>
Next, an outline of the operation of the resin molding apparatus 1 configured as described above (a method for manufacturing a resin molded product using the resin molding apparatus 1) will be explained using FIGS. 1 and 2.

In the supply module 10 , the frame sending section 11 sends out the substrate 2 housed in an in-magazine unit (not shown) to the frame measuring section 12 . The frame measuring section 12 measures the volume of the chip 2a of the received substrate 2, and then sends out the substrate 2 to the frame supply section 13. The frame supply unit 13 appropriately aligns the received substrates 2 and delivers them to the loader 17.

Further, the resin sending section 14 sends out the resin tablet T received from the stocker (not shown) to the resin measuring section 15. The resin measuring section 15 measures the weight (volume) of the received resin tablet T, and then sends out the resin tablet T to the resin supply section 16. The resin supply unit 16 delivers a necessary number of the received resin tablets T to the loader 17. The loader 17 transports the received substrate 2 and resin tablet T to the mold of the resin molding module 20.

In the resin molding module 20, the mold clamping mechanism 190 clamps the mold. Then, the resin tablet T is heated and melted by a heating section (not shown) of the mold, and the substrate 2 is resin-sealed using the generated molten resin.

After the resin sealing is completed, the mold clamping mechanism 190 opens the mold. Then, the resin-sealed substrate 2 is released from the mold. Thereafter, the unloader 31 unloads the substrate 2 from the mold and stores it in the substrate accommodating section 32 of the unloading module 30. At this time, unnecessary portions (unnecessary resin such as culls and runners) of the resin-molded substrate 2 are appropriately removed. In this way, a resin-sealed substrate 2 (resin molded product) is manufactured.

<Detailed configuration of resin molding module 20>
Next, the configuration of the resin molded module 20 will be explained in more detail. As shown in FIG. 2, the resin molding module 20 mainly includes a lower mold installation section 100, a lower mold 110, a lower mold cavity adjustment mechanism 120, an upper mold installation section 130, an upper mold 140, a disc spring 150, and an upper mold cavity adjustment mechanism. 160, an air vent opening/closing mechanism 170, a transfer mechanism 180, and a mold clamping mechanism 190.

<Lower mold installation section 100>
The lower mold installation part 100 shown in FIG. 2 is a part where the lower mold 110 is provided. The lower mold installation section 100 mainly includes a lower mold movable base section 101 and a lower mold mounting section 102 .

The lower mold movable base part 101 forms the lower part of the lower mold installation part 100. The lower mold attachment part 102 is a part to which the lower mold 110 is attached. The lower mold attachment part 102 is provided on the upper part of the lower mold movable base part 101.

<Lower mold 110>
The lower mold 110 shown in FIGS. 2, 3(a), and 9 forms the lower part of the mold. The lower mold 110 mainly includes a lower mold side block 111, a pot block 112, a lower mold cavity block 113, a lower mold pillar 114, and a lower mold elastic member 115. In the lower mold 110 of this embodiment, as shown in FIG. A side block 111 is arranged.

The lower die side block 111 forms the outer peripheral portion of the lower die 110. The lower mold side block 111 is provided on the upper surface of the lower mold mounting portion 102.

The pot block 112 is a portion in which the resin tablets T supplied from the supply module 10 are accommodated. A plurality of through holes (pots) for accommodating resin tablets T are formed in the pot block 112. The pot block 112 is placed between the lower mold cavity blocks 113 on the left and right sides. The pot block 112 is provided on the upper surface of the lower mold attachment part 102.

The lower mold cavity block 113 is a portion on which the substrate 2 is placed. The lower mold cavity block 113 is arranged between the lower mold side block 111 and the pot block 112. The lower mold cavity block 113 is arranged so as to be movable relative to the lower mold side blocks 111 and the pot block 112 in the vertical direction.

The lower mold pillar 114 is a member arranged to extend downward from the lower mold cavity block 113. The upper end of the lower mold pillar 114 is fixed to the lower part of the lower mold cavity block 113.

The lower mold elastic member 115 applies an upward force to the lower mold cavity block 113. The lower mold elastic member 115 is formed of, for example, a compression coil spring. The lower mold elastic member 115 is arranged between the lower mold cavity block 113 and the lower mold mounting portion 102. The biasing force of the lower mold elastic member 115 always applies an upward force to the lower mold cavity block 113.

<Lower mold cavity adjustment mechanism 120>
The lower mold cavity adjustment mechanism 120 shown in FIG. 2 is for adjusting the position of the lower mold cavity block 113. The lower mold cavity adjustment mechanism 120 mainly includes a lower mold first wedge-shaped member 121 , a lower mold second wedge-shaped member 122 , and a lower mold wedge-shaped member driving section 123 .

The first lower wedge-shaped member 121 and the second lower wedge-shaped member 122 are a pair of members in which tapered portions are formed on surfaces facing each other. The lower mold second wedge-shaped member 122 is arranged above the lower mold first wedge-shaped member 121. The lower mold second wedge-shaped member 122 is arranged below the lower mold pillar 114. The lower end of the lower mold pillar 114 comes into contact with the lower mold second wedge-shaped member 122, thereby restricting the downward movement of the lower mold cavity block 113. This defines the position of the lower mold cavity block 113.

The lower mold wedge-shaped member driving section 123 moves the lower mold first wedge-shaped member 121 in the horizontal direction (left-right direction). The lower wedge-shaped member driving section 123 is formed by, for example, a servo motor, an air cylinder, or the like. The lower mold wedge-shaped member driving section 123 is connected to the lower mold first wedge-shaped member 121 via an appropriate power transmission member. By driving the lower mold wedge-shaped member driving section 123, the lower mold first wedge-shaped member 121 can be arbitrarily moved in the left-right direction.

The position of the lower mold cavity block 113 can be adjusted by the lower mold cavity adjustment mechanism 120 configured in this way. Specifically, when the lower mold wedge-shaped member driving section 123 is driven to move the lower mold first wedge-shaped member 121 in the left-right direction, the lower mold second wedge-shaped member 122 in contact with the lower mold first wedge-shaped member 121 moves. It will be displaced up and down along the tapered portion. By vertically displacing the lower mold second wedge-shaped member 122, the position where the downward movement of the lower mold pillar 114 is restricted is displaced, and as a result, the position of the lower mold cavity block 113 can be adjusted. .

<Upper mold installation section 130>
The upper mold installation part 130 shown in FIGS. 2 and 9 is a part where the upper mold 140 is provided. Note that the upper die installation section 130 is an embodiment of the upper die support section of the present application. The upper mold installation section 130 mainly includes an upper mold fixing base section 131, an upper mold mounting section 132, and a heater plate 133.

The upper mold fixing base part 131 forms the upper part of the upper mold installation part 130. The upper mold attachment part 132 is a part to which the upper mold 140 is attached. The upper mold attachment part 132 is formed by combining a plurality of members. The upper mold attachment part 132 is provided at the lower part of the upper mold fixed base part 131. A support portion 132a that supports an upper mold 140 (upper mold base portion 141), which will be described later, from below is provided on the outer periphery of the upper mold mounting portion 132. The heater plate 133 is for heating the upper mold 140. The heater plate 133 is provided on the bottom surface of the upper die mounting portion 132.

<Upper mold 140>
The upper mold 140 shown in FIGS. 2, 3(b), and 9 forms the upper part of the mold. The upper mold 140 mainly includes an upper mold base portion 141, an upper mold side block 142, an upper mold cavity block 143, an upper mold support 145, and an upper mold pillar 146. In this embodiment, as shown in FIG. 3(b), there is a cull block 144 in the center, upper mold cavity blocks 143 are arranged on the left and right sides of the cull block 144, and the outer periphery of the upper mold cavity block 143 (excluding the cull block side) An upper mold side block 142 is arranged.

The upper die base portion 141 is a member that supports an upper die side block 142, which will be described later. The upper die base portion 141 is formed into a plate shape having a predetermined thickness at the top and bottom. The outer peripheral portion of the upper mold base portion 141 is supported from below by the support portion 132a of the upper mold mounting portion 132. Thereby, the upper mold base part 141 is supported so as to be movable in the vertical direction with respect to the upper mold installation part 130.

The upper mold side block 142 forms the side surface of the cavity C formed by the upper mold 140. Note that the upper die side block 142 is an embodiment of the side block of the present application. The upper mold side block 142 is formed into a frame shape with an opening formed at a position corresponding to the resin molded product (cavity C). The upper die side block 142 is provided on the lower surface of the upper die base portion 141. An air vent groove 142a is formed in the upper mold side block 142.

The air vent groove 142a shown in FIG. 2 is for discharging the air inside the cavity C to the outside. The air vent groove 142a is formed at an appropriate position on the lower surface of the upper die side block 142.

The upper mold cavity block 143 forms the upper surface of the cavity C formed by the upper mold 140. Note that the upper mold cavity block 143 is an embodiment of the cavity block of the present application. The upper mold cavity block 143 is arranged inside the upper mold side block 142 (more specifically, inside the opening of the upper mold side block 142). The upper mold cavity block 143 is arranged so as to be movable relative to the upper mold side block 142 in the vertical direction.

The cull block 144 is arranged at a position facing the pot block 112 of the lower mold 110 and forms the side surface of the cavity C formed by the upper mold 140. A groove-shaped cull portion 144a and a runner portion 144b for guiding the resin material to the cavity C are formed on the lower surface of the cull block 144 (see FIG. 3(b)). In addition, in order to easily understand the flow of resin, FIG. 2 schematically shows how the through hole (pot) of the pot block 112 communicates with the cavity C, which will be described later, via the cull part 144a and the runner part 144b. It shows.

The upper mold support 145 restricts upward movement of the upper mold 140 by contacting the upper mold installation part 130 and defines the position of the upper mold 140. The upper die support 145 is fixed to the upper surface of the upper die base portion 141. A plurality of upper die supports 145 are provided at appropriate positions on the upper surface of the upper die base portion 141.

The upper mold pillar 146 is a member arranged to extend upward from the upper mold cavity block 143. The lower end of the upper mold pillar 146 is fixed to the upper part of the upper mold cavity block 143. The upper mold pillar 146 is arranged to penetrate the upper mold base portion 141.

Note that FIG. 2 shows a state in which the release film F is adsorbed to the lower surface of the upper mold 140 (the surface forming the cavity C).

<Disc spring 150>
The disc spring 150 applies a downward force to the upper die 140. Note that the disc spring 150 is an embodiment of the application section of the present application. The disc spring 150 is arranged between the lower surface of the upper mold installation section 130 (heater plate 133) and the upper surface of the upper mold 140 (upper mold base section 141). Due to the biasing force of the disc spring 150, a force is always applied to the upper mold 140 in a direction away from the upper mold installation portion 130 (downward).

<Upper mold cavity adjustment mechanism 160>
The upper mold cavity adjustment mechanism 160 adjusts the position of the upper mold cavity block 143. Note that the upper mold cavity adjustment mechanism 160 is an embodiment of the position adjustment mechanism of the present application. The upper mold cavity adjustment mechanism 160 includes an upper mold cavity block holding member 161, an upper mold cavity block drive section 162, a regulating member 163, an upper mold elastic member 164, an upper mold first wedge-shaped member 165, an upper mold second wedge-shaped member 166, and An upper wedge-shaped member driving section 167 is provided.

The upper mold cavity block holding member 161 holds the upper mold cavity block 143. The upper mold cavity block holding member 161 is formed into a hollow frame shape when viewed from the front. The upper mold cavity block holding member 161 is formed by combining a plurality of members (upper and lower plate members and a plurality of cylindrical members connecting the upper and lower plate members, etc.). The upper mold cavity block holding member 161 is arranged so as to vertically penetrate the upper mold fixing base portion 131. The upper mold cavity block holding member 161 is provided so as to be movable up and down with respect to the upper mold fixed base portion 131. The upper end of the upper mold pillar 146 is fixed to the lower surface of the upper mold cavity block holding member 161. Thereby, the upper mold cavity block holding member 161 can hold the upper mold cavity block 143 via the upper mold pillar 146.

The upper mold cavity block drive section 162 moves the upper mold cavity block holding member 161 in the vertical direction (up and down direction). The upper mold cavity block drive section 162 is formed by, for example, a servo motor, an air cylinder, or the like. The upper mold cavity block drive section 162 is provided above the upper mold cavity block holding member 161. By driving the upper mold cavity block drive section 162, the upper mold cavity block holding member 161 (and thus the upper mold cavity block 143) can be arbitrarily moved in the vertical direction with respect to the upper mold installation section 130.

The regulating member 163 restricts the movement of the upper mold cavity block holding member 161 by coming into contact with the upper mold cavity block holding member 161. The regulating member 163 is formed by combining a plurality of members (plate-like members, etc.). The regulating member 163 includes an upper part that straddles the upper mold cavity block holding member 161 from side to side, and a central part disposed inside the upper mold cavity block holding member 161. The center portion of the regulating member 163 is arranged so as to be able to contact the lower portion (bottom portion) of the upper mold cavity block holding member 161 from above. The regulating member 163 can restrict upward movement of the upper mold cavity block holding member 161 by contacting the lower part of the upper mold cavity block holding member 161 from above. This allows the depth of the cavity C to be defined.

The upper mold elastic member 164 applies an upward force to the regulating member 163. The upper mold elastic member 164 is formed of, for example, a compression coil spring. The upper mold elastic member 164 is arranged between the regulating member 163 and the upper mold mounting part 132. Due to the biasing force of the upper mold elastic member 164, an upward force is always applied to the regulating member 163.

The first upper wedge-shaped member 165 and the second upper wedge-shaped member 166 are a pair of members having tapered portions formed on surfaces facing each other. The upper mold second wedge-shaped member 166 is arranged below the upper mold first wedge-shaped member 165. The upper mold first wedge-shaped member 165 and the upper mold second wedge-shaped member 166 are arranged inside the upper mold cavity block holding member 161. More specifically, the upper mold first wedge-shaped member 165 and the upper mold second wedge-shaped member 166 are arranged between the upper mold fixed base part 131 and the regulating member 163. The upper mold second wedge-shaped member 166 is fixed to the upper surface of the regulating member 163.

The upper mold wedge-shaped member driving section 167 moves the upper mold first wedge-shaped member 165 in the horizontal direction (left-right direction). The upper wedge-shaped member driving section 167 is formed by, for example, a servo motor, an air cylinder, or the like. The upper mold wedge-shaped member driving section 167 is connected to the upper mold first wedge-shaped member 165 via a suitable power transmission member. By driving the upper wedge-shaped member drive section 167, the upper wedge-shaped member drive section 167 can be arbitrarily moved in the left-right direction.

The position of the upper mold cavity block 143 can be adjusted by the upper mold cavity adjustment mechanism 160 configured in this way. Specifically, when the upper mold cavity block drive unit 162 is driven to move the upper mold cavity block holding member 161 downward, a gap is created between the regulating member 163 and the lower part of the upper mold cavity block holding member 161. . That is, the regulating member 163 can move up and down using this gap. In this state, when the upper mold wedge-shaped member driving section 167 is driven to move the upper mold first wedge-shaped member 165 in the left-right direction, the upper mold second wedge-shaped member 166 in contact with the upper mold first wedge-shaped member 165 tapers. It will be displaced up and down along the section. Further, the regulating member 163 is also vertically displaced together with the upper mold second wedge-shaped member 166. After adjusting the regulating member 163 to a predetermined position, the upper mold cavity block drive section 162 is driven again to move the upper mold cavity block holding member 161 upward until it comes into contact with the regulating member 163. By vertically displacing the regulating member 163 in this way, the position where the upward movement of the upper die cavity block holding member 161 is regulated is displaced, so the position of the upper die cavity block 143 can be adjusted. I can do it.

<Air vent opening/closing mechanism 170>
The air vent opening/closing mechanism 170 shown in FIG. 2 opens and closes the air vent groove 142a that communicates the cavity C with the outside. The air vent opening/closing mechanism 170 mainly includes an air vent pin 171 and an air vent drive section 172.

The air vent pin 171 is for closing the air vent groove 142a. The air vent pin 171 is vertically movably provided in a through hole in the upper die side block 142 that communicates with the air vent groove 142a.

The air vent drive unit 172 moves the air vent pin 171 in the vertical direction. The air vent drive section 172 is formed by, for example, a servo motor, an air cylinder, or the like. Air vent drive section 172 is connected to air vent pin 171 via a suitable power transmission member. By driving the air vent drive section 172, the air vent pin 171 can be arbitrarily moved in the vertical direction. For example, by moving the air vent pin 171 downward, the air vent groove 142a can be closed.

<Transfer mechanism 180>
The transfer mechanism 180 supplies resin material to the cavity C. The transfer mechanism 180 mainly includes a transfer drive section 181, a plunger 182, and a plunger load measurement section 183.

The transfer drive unit 181 is a drive source that moves a plunger 182, which will be described later, in the vertical direction (up and down direction). Note that the transfer drive unit 181 is an embodiment of the drive source of the present application. The transfer drive unit 181 is formed by, for example, a servo motor, an air cylinder, or the like. The transfer drive section 181 is provided on the lower mold movable base section 101 below the pot block 112.

The plunger 182 injects the resin tablet T (resin material) housed in the pot block 112 and supplies it to the cavity C. The plunger 182 is arranged within the pot block 112 so that it can move up and down (raise and lower).

The plunger load measurement unit 183 measures the force (plunger load) applied to the plunger 182. Specifically, the force applied to the plunger 182 is the force by which the transfer drive unit 181 pushes the plunger 182. The plunger load measuring section 183 is formed by, for example, a load cell or the like. Plunger load measuring section 183 is provided between transfer drive section 181 and plunger 182.

In this embodiment, an elastic layer is provided between the transfer drive unit 181 and the plunger 182 in order to equalize the force applied to the resin material by each plunger 182 (as a result, the resin pressure in the cavity C). No members, etc. (equal pressure mechanism) are arranged. Therefore, the plunger 182 moves by an amount proportional to the output of the transfer drive section 181. For example, when pushing up the plunger 182 from below using an air cylinder having an extendable rod as the transfer drive unit 181, the plunger 182 also moves by the same amount as the movement of the rod of the transfer drive unit 181. Further, for example, when the transfer drive unit 181 moves the plunger 182 via a suitable speed reduction mechanism, the plunger 182 moves by an amount equal to the output of the transfer drive unit 181 multiplied by the reduction ratio of the speed reduction mechanism.

<Shape of cull portion 144a>
In this way, since the plunger 182 is configured to move by an amount proportional to the output of the transfer drive unit 181, when a plurality of plungers 182 are used to supply resin material to the cavity C, the resin pressure in the cavity C is It is desirable that the configuration is such that the values are uniform. In this embodiment, the resin material is supplied from a plurality of plungers 182 (pots) to a common cavity C, and the resin pressure is made uniform through the cavity C. Other methods of making the resin pressure in the cavity C uniform are, for example, as shown in FIG. 4(a), a method of forming connecting grooves 144c connecting the cull portions 144a, and as shown in FIG. 4(b). When there are a plurality of cavities C, there is also a method of forming a connecting groove 144d that connects the cavities C (supplying the resin material from the plurality of cull parts 144a to the common cavity C). By connecting the cull portions 144a together in this manner, it is possible to suppress variations in the pressure applied to the resin material due to variations in the plunger loads of the respective plungers 182.

<Mold clamping mechanism 190>
The mold clamping mechanism 190 shown in FIG. 2 raises the lower mold 110 and clamps the lower mold 110 and the upper mold 140 together. Note that the mold clamping mechanism 190 is an embodiment of the clamping mechanism of the present application. The mold clamping mechanism 190 mainly includes a fixed platen 191, a support column 192, a drive mechanism 193, and a clamp load measuring section 194.

The fixed platen 191 is a part that is installed on the ground and supports other members. A lower mold 110 (lower mold installation section 100) is provided on the upper part of the fixed platen 191 via a drive mechanism 193, which will be described later.

The support column 192 supports the upper mold 140 (upper mold installation section 130). The support column 192 is provided to extend upward from the fixed platen 191. An upper mold fixing base part 131 of the upper mold installation part 130 is fixed to the upper part of the support column 192 . As a result, the upper mold 140 (upper mold installation section 130) is placed above the lower mold 110 (lower mold installation section 100).

The drive mechanism 193 moves the lower mold 110 (lower mold installation section 100) in the vertical direction (up and down direction). The drive mechanism 193 is formed by, for example, a drive source such as a servo motor, and an appropriate power transmission mechanism. The drive mechanism 193 is arranged between the fixed platen 191 and the lower mold installation section 100. By driving the drive mechanism 193, the lower die installation section 100 can be arbitrarily moved (elevated) in the vertical direction. For example, by raising the lower mold 110 toward the upper mold 140 using the drive mechanism 193, the mold can be clamped. Furthermore, by lowering the lower mold 110 in a direction away from the upper mold 140 using the drive mechanism 193, the mold can be opened.

The clamp load measurement unit 194 measures the force (clamp load) when the mold clamping mechanism 190 clamps the lower mold 110 and the upper mold 140 together. The clamp load measuring section 194 is formed by, for example, a load cell, a strain gauge, or the like. The clamp load measuring section 194 is provided on the support column 192. The clamp load measurement unit 194 can measure the clamp load based on the load applied to the support column 192.

Note that FIG. 2 shows a state in which the lower mold 110 and the upper mold 140 are clamped after the substrate 2 and the resin tablet T are transferred to the mold.

<Overview of the manufacturing method of resin molded products>
Below, a method for manufacturing a resin molded product using the resin molding apparatus 1 configured as described above will be described.

In this embodiment, when resin molding is performed in the resin molding module 20, control is performed to improve the dimensional accuracy of the product (specifically, the dimensional accuracy of the thickness of the molded resin). To help understand this control, first, factors that cause variations in product dimensions in the resin molding apparatus 1 will be explained using FIG. 5.

As shown in FIG. 5A, when the lower mold 110 is raised by the mold clamping mechanism 190 and the lower mold 110 and the upper mold 140 are clamped, the upper mold side block 142 of the upper mold 140 is attached to the lower mold 110. You will come into contact with Therefore, the clamping load by the mold clamping mechanism 190 is mainly applied to the upper mold side block 142. When a clamp load is applied to the upper die side block 142, the upper die side block 142 is vertically compressed and slightly deformed, so that the depth (vertical thickness) of the cavity C may become shallow.

Further, as shown in FIG. 5B, when resin is supplied into the cavity C by the plunger 182 of the transfer mechanism 180, pressure from the resin material in the cavity C acts upward on the upper mold cavity block 143. . For this reason, the upper mold cavity block 143 is pushed upward and slightly moves or deforms, so there is a possibility that the depth of the cavity C becomes deeper.

In this way, when performing resin molding using the resin molding device 1, the depth of the cavity C may change depending on the operation of each part, so by suppressing this change, the dimensions of the resin molded product can be adjusted. Accuracy can be improved. Below, a method of manufacturing a resin molded product (control mode of clamp load and plunger load) that can improve such dimensional accuracy will be described.

In step S10 of FIG. 6, the volumes of the resin tablet T and the chip 2a on the substrate 2 are measured. This will be explained in detail below.

The volume of the resin tablet T is measured in the resin measuring section 15 of the supply module 10 as described above. The resin measuring section 15 can measure the volume of the resin tablet T using any measuring device. An example of the resin measuring section 15 is a scale that measures the weight of the resin tablet T. The volume of the resin tablet T is calculated from the weight of the resin tablet T measured by a weight scale and the specific gravity of the resin tablet T. Note that the method for measuring the volume of the resin tablet T is not particularly limited, and measurement can be performed using various other devices. For example, it is possible to use various types of three-dimensional scanners, laser volume meters using laser light, and the like.

Further, the volume of the chip 2a on the substrate 2 is measured by the frame measuring section 12 of the supply module 10 as described above. The frame measuring section 12 can measure the volume of the chip 2a on the substrate 2 using any measuring device. An example of the frame measurement unit 12 is a volume meter that measures the volume of the chip 2a on the substrate 2. The volume meter is a laser volume meter that measures the shape (and thus the volume) of the chip 2a by detecting the distance to the chip 2a on the substrate 2 using laser light. Note that the method for measuring the volume of the chip 2a is not particularly limited, and measurement can be performed using various other devices. For example, it is possible to use various types of three-dimensional scanners.

Next, in step S20 of FIG. 6, the position of the plunger 182 at a predetermined resin filling rate of the cavity C is calculated. This will be explained in detail below.

The control unit 18 controls the cavity C based on the dimensions of each part (upper mold side block 142, upper mold cavity block 143, pot block 112, cull block 144, etc.) stored in advance and the vertical position of the upper mold cavity block 143. Calculate the capacity of Note that the vertical position of the upper mold cavity block 143 can be determined based on the amount of drive of the upper mold wedge-shaped member driving section 167, etc. The control unit 18 determines, based on the calculated capacity of the cavity C and the volumes of the resin tablet T and the chip 2a measured in step S10, how much of the capacity of the cavity C should the plunger 182 rise to? % filled with molten resin material (resin filling rate) can be calculated.

In this embodiment, as shown in FIG. 5, the control unit 18 controls the positions of the plunger 182 at which the resin filling rate of the cavity C is 0%, 25%, 50%, 75%, and 100% (hereinafter, each position P0 , P25, P50, P75 and P100) are calculated.

Strictly speaking, when the plunger 182 is at a position lower than the position P0, the resin filling rate of the cavity C is 0% regardless of the position of the plunger 182, but in this embodiment, the resin filling rate is 0% when the plunger 182 is raised. The position where the resin material starts to be supplied into the cavity C is defined as a position P0 where the resin filling rate is 0%.

Next, in step S30 of FIG. 6, the substrate 2 and the resin tablet T are each transported to the mold of the resin molding module 20. Specifically, the substrate 2 is placed on the lower die 110, and the resin tablet T is housed in the pot of the pot block 112.

Next, in step S40 in FIG. 6, the lower mold 110 and the upper mold 140 are clamped by the mold clamping mechanism 190. Specifically, the lower mold 110 is raised by the mold clamping mechanism 190, and the lower mold 110 contacts the upper mold 140 from below. This closes cavity C. At this time, as shown in FIG. 9(a), the upper mold 140 rises to a position where the upper mold support 145 contacts the upper mold installation part 130 (heater plate 133).

Hereinafter, using the graph shown in FIG. 7, the clamp load (unit: tonf, N, etc.) accompanying the operation of the resin molding device 1, the plunger position (the vertical position of the plunger 182 with the initial position as 0, the unit: mm, for example) etc.), and an example of the time change of the plunger load (unit: tonf, N, etc.) will also be explained.

By clamping the lower mold 110 and the upper mold 140 in step S40, the clamp load increases to CL1 at time t1 in FIG.

Next, in step S50 in FIG. 6, the plunger 182 starts rising (time t2 in FIG. 7).

Next, in step S60 of FIG. 6, filling rate corresponding control is executed. The filling rate corresponding control is to control the operation of the resin molding apparatus 1 based on the resin filling rate of the cavity C.

An example of filling rate corresponding control is shown in FIG. FIG. 8 shows an example of controlling the clamp load and the moving speed of the plunger 182 based on the resin filling rate.

Specifically, when the position of the plunger 182 reaches position P50 (position where the resin filling rate is 50%) (YES in step S61), the clamp load is increased from CL1 to CL2 (step S62). In FIG. 7, the plunger 182 reaches position P50 at time t3, and the clamp load is increased from CL1 to CL2 from time t3 to time t4.

Further, when the position of the plunger 182 reaches position P50 (position where the resin filling rate is 50%) (YES in step S61), the moving speed of the plunger 182 is adjusted (step S62). In FIG. 7, the change in the plunger 182 over time (the slope of the graph of the plunger position) becomes gentle at time t3. That is, the moving speed of plunger 182 is adjusted to be slow.

Next, when the position of the plunger 182 reaches position P100 (the position where the resin filling rate is 100%) (YES in step S63), the plunger 182 is stopped (step S64). In FIG. 7, the plunger 182 reaches the position P100 at time t5, and the movement (rise) of the plunger 182 is stopped.

Although FIG. 8 shows an example in which the clamp load and the moving speed of the plunger 182 are adjusted only once when the resin filling rate reaches 50%, the number of adjustments is not limited to this, and may be adjusted multiple times. It is also possible to make adjustments. For example, it is also possible to adjust the clamp load, etc. each time the resin filling rate reaches 25%, 50%, and 75% (positions P25, P50, and P75 of the plunger 182). Further, the resin filling rate that triggers this adjustment is not limited to the above example, and can be set arbitrarily.

By increasing the clamp load in stages according to the resin filling rate in this way, changes in the depth of the cavity C can be suppressed. Specifically, as the resin filling rate increases, the force of the resin material to push the upper mold cavity block 143 upward increases, so that the depth of the cavity C becomes deeper (see FIG. 5(b)). Therefore, by increasing the clamping load according to the resin filling rate as described above and making the depth of the cavity C shallower (see Fig. 5(a)), the tendency of the change in the depth of the cavity C (the depth (increase and decrease in depth) can be offset, and changes in the depth of cavity C can be suppressed.

Further, by adjusting the moving speed of the plunger 182 according to the resin filling rate, it is possible to suppress the occurrence of unfilled resin material, etc. Specifically, the resin material flowing inside the cavity C is divided into a relatively easy-to-flow portion (for example, a portion of the substrate 2 where the chip 2a is not provided) and a relatively difficult-to-flow portion (for example, a portion of the substrate 2 where the chip 2a is not provided). It may be desirable to adjust the flow rate in order to improve the circulation of the resin. Therefore, by adjusting the moving speed of the plunger 182 according to the resin filling rate as described above, it is possible to improve the circulation of the resin.

Furthermore, in this embodiment, the resin filling rate (the position of the plunger 182 corresponding to the resin filling rate) is calculated based on the actually measured values of the volumes of the resin tablet T and the chip 2a of the substrate 2. Regardless of variations in the volume of each tablet T, the resin filling rate of the cavity C can be determined with high accuracy. Thereby, changes in the depth of the cavity C can be suppressed with higher accuracy.

Note that an appropriate clamp load value and an appropriate moving speed of the plunger 182 for the resin filling rate can be determined in advance through experiments, numerical analysis, or the like.

Next, in step S70 of FIG. 6, cavity control is performed. Cavity control is to adjust the position of the upper mold cavity block 143 before pressure adjustment control, which will be described later.

Specifically, in a state where the lower mold 110 and the upper mold 140 are clamped as shown in FIG. 9(a), the clamping load is reduced as shown in FIG. 9(b). At this time, the clamp load is reduced while the upper mold cavity block holding member 161 is pressed downward by the upper mold cavity block drive section 162. In FIG. 7, the clamp load is decreased from CL2 to CLdown at time t6. At this time, there is a risk that the depth of the cavity C will become deeper due to a decrease in the clamping load, but since the upper mold cavity block drive unit 162 presses the upper mold cavity block holding member 161 downward, can be suppressed from deepening.

When the clamp load decreases, as shown in FIG. 9(b), the upper mold 140 is relatively moved in the direction away from the upper mold installation part 130 by the disc spring 150, so that the regulating member 163 and the upper mold cavity block holding member 161 (see part A in FIG. 9(b)).

By forming such a gap, the movable range of the upper mold second wedge-shaped member 166 is ensured. That is, the upper die second wedge-shaped member 166 can move up and down. By driving the upper mold wedge-shaped member driving section 167 in this state, the position of the upper mold cavity block 143 can be adjusted as desired.

For example, in the example shown in FIG. 7, the upper mold cavity block 143 is slightly lowered. As a result, the depth of the cavity C can be made slightly shallower, and in the pressure adjustment control (step S80), the first final adjustment control (step S90), and the second final adjustment control (step S100), which will be described later, the depth of the cavity C can be made slightly shallower. It becomes easier to apply high pressure to the resin material.

Next, in step S80 of FIG. 6, pressure adjustment control is executed. Pressure adjustment control is to adjust the clamp load to increase the pressure applied to the resin material in the cavity C.

Specifically, as shown in FIG. 7, the clamp load is increased from CLdown to CLM (preset clamp load) (time t7). At this time, the plunger 182 is stopped. Therefore, the resin material filled in the cavity C supports the tendency of the cavity C to become shallower due to an increase in the clamp load, so that changes in the depth of the cavity C are suppressed. Moreover, this increases the pressure applied to the resin material in the cavity C, suppresses the occurrence of unfilled resin, etc., and improves the accuracy of the resin molded product. Note that FIG. 7 shows that the plunger load increases as the pressure inside the cavity C increases.

Next, in step S90 of FIG. 6, first final adjustment control is executed. The first final adjustment control is to adjust the clamp load to a preset final clamp load.

Specifically, as shown in FIG. 7, the clamp load is increased from CLM to CLf (final clamp load) (time t8). At this time, the plunger 182 is stopped. Therefore, the resin material filled in the cavity C supports the tendency of the cavity C to become shallower due to an increase in the clamp load, so that changes in the depth of the cavity C are suppressed. Moreover, this increases the pressure applied to the resin material in the cavity C, suppresses the occurrence of unfilled resin, etc., and improves the accuracy of the resin molded product.

Next, in step S100 of FIG. 6, second final adjustment control is executed. The second final adjustment control is to adjust the plunger load to a preset final plunger load.

Specifically, as shown in FIG. 7, the plunger 182 is moved so that the plunger load becomes Trf (time t9). In the example shown in FIG. 7, since the plunger load at the time when the first final adjustment control is completed (time t8) is less than Trf, the plunger 182 is raised to increase the plunger load to Trf.

For example, if the plunger load at the time when the first final adjustment control is completed (time t8) is greater than Trf, the plunger 182 is lowered in step S100 to reduce the plunger load to Trf. Further, if the plunger load at the time when the first final adjustment control is completed (time t8) is Trf, the plunger load is maintained at Trf without moving the plunger 182 in step S100. In this way, by adjusting the final plunger load to a preset value, it is possible to improve the accuracy of the resin molded product.

Note that by moving the plunger 182 as in the second final adjustment control, the pressure applied to the resin material in the cavity C can be efficiently adjusted, but on the other hand, the amount of the resin material in the cavity C changes and the depth of the cavity C changes. It is easy to change the temperature. Therefore, in this embodiment, the clamping force is increased in advance to the final clamping force in the first final adjustment control, and the plunger load is accordingly increased to a value close to the final plunger load. As a result, the amount of movement of the plunger 182 in the second final adjustment control can be kept small, so that changes in the depth of the cavity C can be suppressed.

Next, in step S110 of FIG. 6, the clamp load and plunger load are held while waiting until a curing time (hardening time) has elapsed.

Next, in step S120 of FIG. 6, the plunger 182 is lowered to reduce the plunger load, and the lower mold 110 and the upper mold 140 are opened by the mold clamping mechanism 190.

Next, in step S130 of FIG. 6, the substrate 2 that has been resin molded (resin sealed) is taken out from the mold. The unloaded substrate 2 is transported to the unload module 30.

As described above, by appropriately controlling the clamp load and the plunger load, it is possible to suppress changes in the depth of the cavity C and improve the dimensional accuracy of the resin molded product.

<Another example of control mode>
Below, another example of the method for manufacturing a resin molded product (control mode of clamp load and plunger load) will be described.

The example shown in FIG. 10 shows another example of the control mode of the clamp load, etc. shown in FIG. 7. Note that, for convenience, the control mode shown in FIG. 7 is hereinafter referred to as a first control mode, and the control mode shown in FIG. 10 is referred to as a second control mode. The second control mode shown in FIG. 10 differs from the first control mode shown in FIG. 7 mainly in the control contents from time t6 to time t7 (steps S70 and S80 in FIG. 6). This difference will be explained below.

In the first control mode, the position of the upper die cavity block 143 was adjusted so that the depth of the cavity C becomes shallow in the cavity control in step S70 in FIG. The position of the upper mold cavity block 143 is adjusted so that it becomes deeper.

That is, in the second control mode, the upper mold wedge-shaped member driving section 167 is driven with the clamp load reduced to CLdown in step S70, and the upper mold cavity block 143 is slightly raised. As a result, the depth of the cavity C becomes slightly deeper.

Next, in step S80 of FIG. 6, pressure adjustment control is executed. Here, as described above, in the second control mode, the depth of the cavity C is adjusted to become deeper in step S70. As the depth of the cavity C increases in this way, the capacity of the cavity C also changes (increases), so the resin filling rate, which was 100%, decreases and becomes less than 100%.

Therefore, the control unit 18 recalculates the relationship between the resin filling rate of the cavity C and the position of the plunger 182 at this point. Note that this calculation method is the same as step S20.

Next, the clamp load is increased from CLdown to CLM2 (time t7). At this time, since the resin filling rate is less than 100%, the clamp load CL is increased stepwise while the plunger 182 is raised to supply the resin material into the cavity C. That is, similar to the above-described filling rate corresponding control (step S60), the clamp load is increased in stages when the plunger 182 reaches a position corresponding to a predetermined resin filling rate. Further, at this time, it is also possible to adjust the moving speed of the plunger 182. The example shown in FIG. 10 shows an example in which the clamp load is increased by two steps, CLM1 and CLM2.

In this way, in the pressure adjustment control (step S80), the clamp load is increased in stages according to the resin filling rate, similarly to the filling rate corresponding control (step S60) described above, so that the depth of the cavity C can be changed. can be suppressed. However, in the pressure adjustment control, it is also possible to adopt a configuration in which the above-mentioned filling rate corresponding control is not performed.

In addition, in the above-mentioned filling rate corresponding control (step S60), an example was shown in which the clamp load and the moving speed of the plunger 182 were adjusted according to the resin filling rate. It is also possible to control the operation of mechanism 170 (see FIG. 2). For example, when the resin filling rate reaches a predetermined value (when the plunger 182 reaches a position corresponding to the predetermined resin filling rate), the air vent pin 171 can be lowered to close the air vent groove 142a. Thereby, opening and closing of the air vent groove 142a can be precisely controlled according to the resin filling rate.

In addition, in the filling rate corresponding control (step S60) described above, an example is given in which each part is controlled using the position of the plunger 182 corresponding to each resin filling rate (0%, 25%, 50%, 75%, and 100%). Although shown, the control method is not limited to this, and for example, it is also possible to perform control using other positions as a trigger based on these positions.

For example, when raising the plunger 182 (when supplying resin material to the cavity C), the plunger 182 moves a predetermined distance (for example, 5 mm etc.), it is possible to perform controls such as adjusting the moving speed of the plunger 182 and closing the air vent groove 142a.

In this way, by performing control triggered by the plunger 182 reaching a position below the position P0 as a reference, control based on the position of the plunger 182 before the resin material is supplied to the cavity C can be performed. can be executed. As a result, each part can be controlled, for example, just before the resin material starts to be supplied to the cavity C, or at the same time as the resin material starts to be supplied (timing that does not depend on the resin filling rate).

As described above, the resin molding apparatus 1 according to the present embodiment can move up and down with respect to the lower mold 110 on which the substrate 2 is placed, the upper mold side block 142 (side block), and the upper mold side block 142. An upper mold 140 that forms a cavity C by an upper mold cavity block 143 (cavity block) provided so that , a transfer mechanism 180 that supplies resin material to the cavity C by a plunger 182, and after the cavity C is filled with the resin material supplied from the transfer mechanism 180, a clamping load by the mold clamping mechanism 190 is applied. The plunger load applied to the plunger 182 is reduced by driving the plunger 182 after the first final adjustment control (step S90) for adjusting the final clamp load and the first final adjustment control are completed. The control unit 18 includes a control unit 18 that performs second final adjustment control (step S100) to adjust the plunger load to the final plunger load.

With this configuration, a resin molded product with high precision can be manufactured. That is, by adjusting the clamp load in advance in the first adjustment control before the second final adjustment control (adjustment of the plunger load by the plunger 182), the amount of movement of the plunger 182 in the second final adjustment control can be suppressed. . Thereby, changes in the depth of the cavity C can be suppressed.

Further, the control unit 18 increases the clamping load by the mold clamping mechanism 190 in the first final adjustment control.

With this configuration, the amount of movement of the plunger 182 in the second final adjustment control can be effectively suppressed. Thereby, changes in the depth of the cavity C can be suppressed.

Further, after the cavity C is filled with the resin material and before performing the first final adjustment control, the control unit 18 adjusts the clamping load by the mold clamping mechanism 190 so that the inside of the cavity C is filled with the resin material. This is to perform pressure adjustment control (step S80) to increase the resin pressure.

By configuring in this way, the occurrence of unfilled resin, etc. can be suppressed, and the accuracy of the resin molded product can be improved.

Furthermore, before performing the pressure adjustment control, the control section 18 performs cavity control (step S70) to adjust the relative position of the upper mold cavity block 143 with respect to the upper mold side block 142.

With this configuration, the depth of the cavity C during pressure adjustment control can be arbitrarily adjusted in advance.

Further, in the cavity control, the control unit 18 moves the upper mold cavity block 143 relative to the upper mold side block 142 while reducing the clamping load by the mold clamping mechanism 190. It is.

With this configuration, the upper mold cavity block 143 can be easily moved by reducing the clamp load.

Further, the resin molding apparatus 1 includes an upper mold installation part 130 (upper mold support part) that supports the upper mold 140 so as to be movable up and down, and a An upper mold cavity adjustment mechanism 160 (position adjustment mechanism) that can adjust the position of the block 143, and a disc spring 150 that applies force to the upper mold 140 in a direction that ensures the range of motion of the upper mold cavity adjustment mechanism 160. (applying part).

With this configuration, the movable range of the upper mold cavity adjustment mechanism 160 (upper mold second wedge-shaped member 166) is ensured, and the position adjustment of the upper mold cavity block 143 by the upper mold cavity adjustment mechanism 160 is easily performed. be able to.

Further, in the cavity control, the control unit 18 adjusts the position of the upper mold cavity block 143 so that the cavity C becomes deeper by utilizing the movable range ensured by the disc spring 150, and adjusts the position of the upper mold cavity block 143 so that the cavity C becomes deeper. In the adjustment control, the clamping load by the mold clamping mechanism 190 is increased while the resin material is supplied to the cavity C by the transfer mechanism 180.

With this configuration, by supplying the resin material again to the cavity C once filled with the resin material, occurrences such as unfilled resin can be suppressed, and the accuracy of the resin molded product can be improved. I can do it.

Further, the transfer mechanism 180 includes a transfer drive section 181 (drive source) that drives the plunger 182, and moves the plunger 182 by an amount of movement proportional to the output of the transfer drive section 181.

With this configuration, the clamp load and plunger load can be adjusted with higher accuracy. That is, since the plunger 182 can be moved to completely follow the output of the transfer drive unit 181 without using an elastic member or the like between the transfer drive unit 181 and the plunger 182, the position of the plunger 182 (and thus the resin Each part can be controlled accurately based on the filling rate. Further, the plunger load by the plunger 182 can also be precisely adjusted.

Moreover, the method for manufacturing a resin molded product according to the present embodiment is for manufacturing a resin molded product using the resin molding apparatus 1.

With this configuration, a resin molded product with high precision can be manufactured.

In addition, the method for manufacturing a resin molded product according to the present embodiment includes a lower mold 110 on which the substrate 2 is placed, an upper mold side block 142, and a structure that can be moved up and down with respect to the upper mold side block 142. A clamping step (step S40) in which the upper mold 140 forming the cavity C is clamped by the mold clamping mechanism 190 using the upper mold cavity block 143 provided, and a resin material supply in which the resin material is supplied to the cavity C by the plunger 182. steps (step S50, step S60), and a first final adjustment step (step S90) of adjusting the clamping load by the mold clamping mechanism 190 to be the final clamping load after the cavity C is filled with the resin material. ), and a second final adjustment step (step S100) in which the plunger 182 is driven so that the plunger load applied to the plunger 182 becomes the final plunger load after the clamp load by the mold clamping mechanism 190 reaches the final clamp load. ).

With this configuration, a resin molded product with high precision can be manufactured. That is, by adjusting the clamp load in advance in the first adjustment control before the second final adjustment control (adjustment of the plunger load by the plunger 182), the amount of movement of the plunger 182 in the second final adjustment control can be suppressed. . Thereby, changes in the depth of the cavity C can be suppressed.

Further, as described above, the resin molding apparatus 1 according to the present embodiment includes the lower mold 110 on which the substrate 2 is placed, the upper mold side block 142 (side block), and the upper mold side block 142 located above and below the upper mold side block 142. An upper mold 140 forming a cavity C, a mold clamping mechanism 190 (clamping mechanism) that clamps the lower mold 110 and the upper mold 140 by an upper mold cavity block 143 (cavity block) provided so as to be movable up and down. ), a transfer mechanism 180 that supplies the resin material to the cavity C by a plunger 182, and a transfer mechanism 180 that supplies the resin material to the cavity C using a plunger 182; Filling rate corresponding control that uses the relationship between the resin filling rate of the cavity C and the position of the plunger 182 to control operations related to resin molding when the plunger 182 reaches a position corresponding to a predetermined resin filling rate. (Step S60, step S80 in the second control mode).

With this configuration, a resin molded product with high precision can be manufactured. That is, since the resin filling rate can be accurately grasped based on the volume of the resin tablet T and the chip 2a of the substrate 2 actually used, each part can be controlled based on this resin filling rate. This makes it possible to improve the accuracy of the resin molded product.

In addition, in the filling rate corresponding control, the control unit 18 performs clamp force adjustment control that adjusts the clamping load by the mold clamping mechanism 190 when the plunger 182 reaches a position corresponding to a predetermined resin filling rate. (Step S60) is performed.

With this configuration, the accuracy of the resin molded product can be improved by adjusting the clamp load so as to suppress changes in the depth of the cavity C depending on the resin filling rate.

Further, the control section 18 increases the clamping load by the mold clamping mechanism 190 in stages in the clamping force adjustment control.

With this configuration, it is possible to prevent the depth of the cavity C from becoming deeper as the resin filling rate increases by increasing the clamp load.

In addition, in the filling rate corresponding control, the control unit 18 performs plunger speed adjustment control (step S60).

With this configuration, the flow rate of the resin material can be adjusted according to the resin filling rate, and the precision of the resin molded product can be improved.

Further, in the filling rate corresponding control, the control unit 18 switches the opening and closing of the air vent groove 142a connected to the cavity C when the plunger 182 reaches a position corresponding to a predetermined resin filling rate. The air vent switching control (step S60) is performed.

With this configuration, by opening and closing the air vent groove 142a according to the resin filling rate, the flow of the resin material can be adjusted with high precision, and the precision of the resin molded product can be improved.

The resin molding apparatus 1 also includes a frame measuring section 12 (chip volume measuring section) that measures the volume of the chip 2a placed on the substrate 2, and a resin measuring section that measures the volume of the resin material (resin tablet T). 15 (resin volume measurement unit), and a calculation unit (control unit 18) that calculates the relationship between the resin filling rate and the position of the plunger 182 based on the measurement results of the frame measurement unit 12 and the resin measurement unit 15. It further comprises:

With this configuration, the position of the plunger 182 (resin filling rate) can be determined based on the actually measured volumes of the chip 2a and the resin material. Even if there are variations in volume, highly accurate control can be performed.

Further, the resin molding apparatus 1 includes an upper mold installation part 130 (upper mold support part) that supports the upper mold 140 so as to be movable up and down, and a An upper mold cavity adjustment mechanism 160 (position adjustment mechanism) that can adjust the position of the block 143, and a disc spring 150 that applies force to the upper mold 140 in a direction that ensures the range of motion of the upper mold cavity adjustment mechanism 160. (applying part), and the control part 18 controls the cavity C to be deep by utilizing the movable range ensured by the disc spring 150 after the cavity C is filled with the resin material. The cavity control is performed to adjust the relative position of the upper mold cavity block 143 to the upper mold side block 142, and after the cavity control, the clamp load by the mold clamping mechanism 190 is adjusted to A pressure adjustment control is performed to increase the resin pressure inside the container, and in the pressure adjustment control, the filling rate corresponding control is performed.

With this configuration, each part can be controlled based on the resin filling rate even in pressure adjustment control, so it is possible to improve the accuracy of the resin molded product.

Moreover, the method for manufacturing a resin molded product according to the present embodiment is for manufacturing a resin molded product using the resin molding apparatus 1.

With this configuration, a resin molded product with high precision can be manufactured.

Furthermore, the method for manufacturing a resin molded product according to the present embodiment includes a chip volume measuring step (step S10) of measuring the volume of the chip 2a placed on the substrate 2, and a resin volume measuring step (step S10) of measuring the volume of the resin material. step S10), and a plunger position calculation step (step S20) of calculating the relationship between the resin filling rate of the cavity C and the position of the plunger 182 based on the measured volume of the chip 2a and the volume of the resin material. and a filling rate corresponding control step (step S60, step S80 in the second control mode) of controlling operations related to resin molding when the plunger 182 reaches a position corresponding to a predetermined resin filling rate. It is something to do.

With this configuration, a resin molded product with high precision can be manufactured. That is, since the resin filling rate can be accurately grasped based on the volume of the resin tablet T and the chip 2a of the substrate 2 actually used, each part can be controlled based on this resin filling rate. This makes it possible to improve the accuracy of the resin molded product.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and appropriate changes can be made within the scope of the technical idea of the invention described in the claims. .

For example, the components (supply module 10, etc.) used in the resin molding apparatus 1 of the embodiment described above are just one example, and can be detached or replaced as appropriate. For example, it is possible to change the number of resin molded modules 20. Further, the configuration and operation of the components (supply module 10, etc.) used in the resin molding apparatus 1 of this embodiment are merely examples, and can be changed as appropriate.

Further, in the above embodiment, an example is shown in which a tablet-shaped resin material (resin tablet T) is used, but the present invention is not limited to this. That is, the resin material can be in any form such as not only tablets but also granules, powders, liquids, etc.

Further, in the above embodiment, an example is shown in which the cull portion 144a and the runner portion 144b are formed in the cull block 144, but for example, a portion of the cull portion 144a and the runner portion 144b may be formed in the pot block 112. You can. Further, in the above embodiment, an example is shown in which the pot block 112 is provided with a plurality of through holes (pots), but the number of through holes may be one.

Further, the control mode illustrated in the above embodiment is an example, and detailed control contents (for example, target values of clamp load and plunger load, control timing, etc.) can be changed arbitrarily. For example, in the above embodiment, an example is shown in which the second final adjustment control (step S100) is executed after the first final adjustment control (step S90) is completed, but the second final adjustment control (step S100) is executed before the first final adjustment control is completed. It is also possible to start a second final adjustment control.

Further, in the above embodiment, the disc spring 150 is illustrated as the applying portion that applies force to the upper die 140, but the present invention is not limited to this, and various other configurations can be adopted. For example, it is also possible to use various elastic members or actuators such as air cylinders as the applying section.

Further, in the above embodiment, an example was shown in which the volume of the chip 2a, etc. of the substrate 2 is measured in the frame measuring section 12 and the resin measuring section 15 included in the resin molding apparatus 1, but the present invention is not limited to this. do not have. For example, the resin molding apparatus 1 can perform resin molding using a substrate 2 or a resin tablet T whose volume has been measured externally. In this case, the resin molding apparatus 1 does not need to include the frame measuring section 12 or the resin measuring section 15.

In the above embodiment, examples of the filling rate corresponding control include clamp force adjustment control that adjusts the clamp load, plunger speed adjustment control that adjusts the moving speed of the plunger 182, and air vent switching that switches between opening and closing the air vent groove 142a. Although the control is illustrated, the present invention is not limited to this, and it is possible to control any operation related to resin molding.

1 Resin molding device 12 Frame measurement section 15 Resin measurement section 18 Control section 110 Lower mold 130 Upper mold installation section 140 Upper mold 142 Upper mold side block 143 Upper mold cavity block 150 Belleville spring 160 Upper mold cavity adjustment mechanism 170 Air vent opening/closing mechanism 180 Transfer mechanism 181 Transfer drive section 182 Plunger 190 Mold clamping mechanism

Claims (8)

a chip volume measuring unit that measures the volume of a chip placed on a substrate to be resin molded;
a resin volume measurement unit that measures the volume of a resin material used for resin molding of the substrate;
a lower mold on which the substrate is placed;
an upper mold forming a cavity by a side block and a cavity block provided so as to be movable up and down with respect to the side block;
a clamp mechanism that clamps the lower mold and the upper mold;
a transfer mechanism that supplies resin material to the cavity by a plunger;
a calculation unit that calculates the relationship between the resin filling rate of the cavity and the position of the plunger based on the measurement results of the chip volume measurement unit and the resin volume measurement unit;
When resin molding is performed using the substrate and the resin material, the plunger reaches a predetermined resin filling rate using the relationship between the resin filling rate calculated by the calculation unit and the position of the plunger. a control unit that performs filling rate corresponding control that controls operations related to resin molding upon reaching the corresponding position;
A resin molding device comprising: In the filling rate corresponding control, the control unit performs clamping force adjustment control that adjusts the clamping load by the clamping mechanism when the plunger reaches a position corresponding to a predetermined resin filling rate.
The resin molding apparatus according to claim 1. In the clamping force adjustment control, the control unit increases the clamping load by the clamping mechanism in stages;
The resin molding apparatus according to claim 2. In the filling rate corresponding control, the control unit performs plunger speed adjustment control that adjusts the moving speed of the plunger when the plunger reaches a position corresponding to a predetermined resin filling rate.
The resin molding apparatus according to any one of claims 1 to 3. In the filling rate corresponding control, the control unit performs air vent switching control for switching opening and closing of an air vent groove connected to the cavity when the plunger reaches a position corresponding to a predetermined resin filling rate. ,
A resin molding apparatus according to any one of claims 1 to 4. an upper mold support part that supports the upper mold so as to be movable up and down;
a position adjustment mechanism provided in the upper mold support part and capable of adjusting the position of the cavity block;
an applying unit that applies force to the upper die in a direction that ensures a range of motion of the position adjustment mechanism;
further comprising;
The control unit includes:
After the cavity is filled with the resin material, the relative position of the cavity block with respect to the side block is adjusted so that the cavity becomes deeper by utilizing the movable range secured by the applying section. control and
After the cavity control, pressure adjustment control adjusts the clamp load by the clamp mechanism to increase the resin pressure in the cavity;
and
performing the filling rate corresponding control in the pressure adjustment control;
A resin molding apparatus according to any one of claims 1 to 5. Producing a resin molded product using the resin molding apparatus according to any one of claims 1 to 6,
Method for manufacturing resin molded products. a chip volume measurement step of measuring the volume of the chip placed on the substrate;
a resin volume measuring step of measuring the volume of the resin material;
a plunger position calculation step of calculating the relationship between the resin filling rate of the cavity and the position of the plunger based on the volume of the chip and the volume of the resin material measured in the chip volume measurement step and the resin volume measurement step;
When performing resin molding using the substrate and the resin material, a filling rate corresponding control step of controlling operations related to resin molding when the plunger reaches a position corresponding to a predetermined resin filling rate;
A method for manufacturing a resin molded product comprising:

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