TW202404780A - Mold die, resin molding apparatus, and method for producing resin molded product - Google Patents

Abstract

The molding die (C) comprises a lower mold (LM) including a lower mold cavity block (53) and a barrel section (54) forming a material cylinder (54b); an upper mold (UM) including an upper mold cavity block (64) and a waste material section (65) positioned above the barrel section (54) and capable of independent vertical movement relative to the upper mold cavity block (64); a first elastic member (55) for pushing the lower mold cavity block (53) towards the upper mold (UM); a plurality of elastically deformable support members (63) for pushing the upper mold cavity block (64) and the waste material section (65); and a second elastic member (66) for pushing the waste material section (65) to protrude downward more than the lower surface of the upper mold cavity block (64).

Description

Molding mold, resin molding device, and method of manufacturing resin molded products

The present invention relates to a molding die, a resin molding device, and a method for manufacturing resin molded products.

A substrate or the like on which a semiconductor chip is fixed is usually sealed with resin and used as an electronic component. Conventionally, as a resin molding apparatus for resin sealing a substrate or the like, an apparatus including a metal mold for transfer molding for manufacturing semiconductor packages such as MAP (molded array packaging) has been known (see, for example, Patent Document 1). ).

In the molding die disclosed in Patent Document 1, a pore block is used to close the pore grooves when a transfer molding die is used to perform resin molding of a highly fluid resin material. Thereby, it is described to prevent the air remaining in the mold cavity from being filled with resin material and to prevent the resin material from flowing out of the metal mold. Furthermore, as a measure against uneven thickness of the substrate, it is described that an elastic member is used in the lower cavity block and a floating pin is used in the upper cavity block to turn the cavity block into a floating mechanism.

Prior technical literature patent documents Patent Document 1: Japanese Patent Application Publication No. 2015-226014

Problem to be solved by invention In order to stably produce a resin molded product, it is preferable that the pressing force acting on the substrate during resin molding is small. However, in the molding die disclosed in Patent Document 1, in order to prevent burrs, it is necessary to maximize the elastic force of the elastic member and the pushing force of the floating pin to press the lower mold cavity block and the upper mold cavity before the resin material flows in the mold cavity. Floating of mold cavity block. As a result, a large pressure is required during resin molding, and in order to apply an excessively large pressing force to the substrate during resin molding, the pore groove collapse air is not fully discharged and remains in the mold cavity, resulting in Void, the entire mold cavity is not filled with resin material.

Therefore, there is a demand for a molding die, a resin molding apparatus, and a method for manufacturing resin molded products that can stably produce resin molded products by reducing the pressing force acting on the substrate during resin molding.

Solutions for solving problems The molding mold of the present invention is characterized by having a lower mold including a lower mold cavity block on which a molded object is mounted and a barrel block in which a barrel filled with resin material is formed; and an upper mold including a mold cavity and The upper mold cavity block of the air hole groove; and the waste material block arranged above the barrel block and can be raised and lowered independently from the upper mold cavity block; the first elastic member moves the lower mold cavity block toward the The upper mold pushes; elastically deformable plural support members push the upper mold cavity block and the waste block; a second elastic member can push the waste block to make the waste block smaller The lower surface of the upper mold cavity block protrudes downward.

The resin molding apparatus of the present invention is characterized in that it includes: the molding die described above; and a mold clamping mechanism for clamping the molding mold.

The manufacturing method of a resin molded article of the present invention is characterized in that it is a manufacturing method of a resin molded article using the resin molding apparatus described above, and includes the following steps: a supply step of supplying the molding object to the molding die. and the resin material; in the mold closing step, the second elastic member is elastically deformed by the first mold clamping force, so that the waste block is in contact with the barrel block, and the upper mold cavity block is The lower surface is in contact with the upper surface of the molded object, the resin material filled in the barrel is supplied to the mold cavity, and the air hole groove is closed by the second mold clamping force; and forming In the step, resin molding of the molded object is performed.

Invention effect According to the present invention, it is possible to provide a mold, a resin molding device, and a method for manufacturing resin molded products that can stably produce resin molded products by reducing the pressing force acting on a substrate during resin molding.

Hereinafter, embodiments of the mold, the resin molding apparatus, and the manufacturing method of the resin molded product of the present invention will be described based on the drawings. However, the present invention is not limited to the following embodiments, and various changes can be made within the scope that does not deviate from the purpose of the present invention.

[Constitution of the entire device] A molding object such as a substrate on which a semiconductor chip (hereinafter, sometimes simply referred to as a "wafer") is fixed is sealed with resin and used as an electronic component. The electronic components are used, for example, as high-frequency module substrates for mobile communication terminals, module substrates for power control, and machine control substrates. As one of the techniques for resin-sealing a molding object, there is a transfer method in which a BGA (Ball Grid Array) substrate or the like is resin-sealed to produce a semiconductor package. In this transfer method, a substrate, etc. with a fixed wafer is accommodated in the cavity of a mold, and then the resin sheet, which is solidified by powdery resin, is supplied to the barrel of the mold, heated and melted, and then combined. A method of manufacturing a resin molded product by supplying molten resin obtained by melting the resin sheet into the mold cavity while the mold is being molded, hardening the mold, and then opening the mold.

In addition, powdery and granular resins include not only powdery and granular resins, but also resin sheets formed by solid resins obtained by compacting and solidifying powdery and granular resins, and either of these is melted by heating. Liquid molten resin. The powdery and granular resin may be a thermoplastic resin or a thermosetting resin. When thermosetting resin is heated, its viscosity decreases, and when further heated, it polymerizes and hardens to become a hardened resin. The powdery resin in this embodiment is preferably a resin sheet formed of solid resin due to ease of handling, and in order to reliably fill the molten resin between the wafer and the substrate, it is more preferred to contain micronized resin. High-flow thermosetting resin as filler material.

The schematic structure of the resin molding apparatus 100 of this embodiment is shown in FIG. 1 . The resin molding apparatus 100 is an apparatus that molds a substrate Sa (an example of a molding object) before resin molding with resin using a mold C. In this embodiment, the pre-resin molding substrate Sa has a rectangular shape, and the semiconductor wafer is fixed in advance.

The resin molding device 100 includes: a CPU 1 as a central control device; a memory unit 8 that stores control information such as a control program; a molding mechanism 2 that has a mold C; a driving mechanism that drives each of the parts described below; and a touch panel 9. It accepts input of action instructions or abnormality processing-related information from the user, and displays various output information of the resin molding apparatus 100 . The CPU 1 constitutes a control unit 10 that controls the operation of each part of the resin molding apparatus 100 by executing programs and the like stored in the memory unit 8 .

The operations of the resin molding apparatus 100 described below are performed based on the operation instructions of the control unit 10 unless otherwise specified. In the following description, the description of the operation instructions of the control unit 10 will be omitted in principle, and only the operation instructions of the control unit 10 will be explained as necessary.

The resin molding apparatus 100 is composed of a device that sequentially connects the supply module M1, the molding module M2, and the storage module M3 into one unit. The supply module M1 has a structure for accommodating a plurality of resin before molding. The input cassette 7 for the substrate Sa is provided. The molding module M2 has the molding die C. The storage module M3 has the output cassette 72 for the resin-molded substrate Sb (an example of a resin molded product). The resin-molded substrate Sb is The pre-resin molding substrate Sa is molded with resin. The supply module M1, the molding module M2, and the storage module M3 are provided with guide rails G arranged linearly across each of these modules. The guide rail G is a rail-like member that moves the loader 40 and the unloader 44 described below. The guide rail G is arranged on the back side of each module.

Each module is configured so that it can be added or removed by being detachable from each other. The resin molding apparatus 100 of this embodiment has two molding modules M2. The resin molding apparatus 100 may have only one molding module M2, or may have three or more molding modules M2.

[Driving mechanism] The drive mechanism includes a loader 40, a substrate supply unit 42, an unloader 44, a mold clamping mechanism 35, and a transfer mechanism 39 to be described later (see FIG. 2).

The loader 40 is a transport mechanism that carries the pre-resin molding substrate Sa into the mold C. The substrate supply unit 42 pushes out the pre-resin molding substrate Sa from the in-magazine 7 and delivers it to the transport mechanism of the alignment mechanism 70 . The unloader 44 is a transport mechanism that transports the resin-molded substrate Sb out of the mold C. The transfer mechanism is a mechanism that supplies resin melted by the resin sheet T (an example of a resin material) from a barrel to the mold cavity in the mold C. The mold clamping mechanism 35 is a mechanism for clamping the mold C. The transfer mechanism 39 and the mold clamping mechanism 35 are driven independently.

The loader 40, the substrate supply unit 42, and the unloader 44 each have an actuator 40b, an actuator 42b, and an actuator 44b. The actuator 40b, the actuator 42b, and the actuator 44b are air cylinders corresponding to the respective installation locations, the distances to be driven, etc. of each part.

[Substrate supply unit] The substrate supply unit 42 is a mechanism that pushes out the pre-resin molding substrates Sa one at a time from the cassette 7 of a storage container that houses a plurality of pre-resin molding substrates Sa at intervals in the vertical direction, and transports them toward the alignment mechanism 70 . The substrate supply unit 42 has an actuator 42b. In this embodiment, the substrate supply unit 42 pushes the pre-resin molding substrate Sa out of the cassette 7 using the actuator 42b, and moves the substrate Sa to the alignment mechanism 70 arranged adjacent to the cassette 7. The arrangement mechanism 70 has a rotating disk 70a, and when the pre-resin molding substrate Sa is placed, the rotating disk 70a is rotated so as to be in a state suitable for the loader 40 to pick up the pre-resin molding substrate Sa. Sa arrangement. The substrate supply unit 42, the cassette 7, and the alignment mechanism 70 are provided in the supply module M1. The substrate supply unit 42, the cassette 7, and the alignment mechanism 70 are arranged on the front side of the guide G in the supply module M1.

[Loader] The loader 40 is a transport mechanism that carries the pre-resin molding substrate Sa into the mold C. The loader 40 can move along the guide G from the supply module M1 across the forming module M2. The loader 40 has a loader pickup part 40a that picks up the pre-resin molding substrate Sa and the resin sheet T.

The loader pickup part 40a is provided with a plurality of pairs of claws (not shown) extending downward. The loader pickup part 40a drives the pair of claws by an actuator (not shown) to pick up the pre-resin molding substrate Sa from the alignment mechanism 70, transport it to the lower mold LM of the molding mold C, and place (carry in) it to the lower mold LM. Module LM. Hereinafter, the pickup operation of the loader pickup part 40a will be simply described as pickup.

Furthermore, the loader pickup part 40a drives the claw for holding the resin material by another actuator (not shown), and picks up the resin sheet T from the resin supply device 79. The resin sheet T is picked up in the same manner as the pre-resin molding substrate Sa. However, in this embodiment, each claw picks up one resin piece T.

The loader pickup part 40a can move forward and backward from the back side to the front side in FIG. 1 by the actuator 40b. The loader 40 moves the loader pickup part 40 a forward and backward, picks up the pre-resin molding substrate Sa from the alignment mechanism 70 , moves the supply module M1 across the molding module M2 , and carries the pre-resin molding substrate Sa into the mold C. Then, the loader 40 moves the loader pickup unit 40 a forward and backward, picks up the resin sheet T from the resin supply device 79 , moves the supply module M1 across the molding module M2 , and carries the resin sheet T into the mold C.

[Unloader] The unloader 44 is a transport mechanism that transports the resin-molded substrate Sb out of the mold C. The unloader 44 can move along the guide G so that the self-forming module M2 crosses the receiving module M3. The unloader 44 has an unloader pickup part 44a that picks up the resin-molded substrate Sb and the like. The unloader pickup part 44a can move forward and backward from the back side to the front side in FIG. 1 by the actuator 44b. The unloader 44 moves the unloader pick-up part 44a forward and backward, picks up the resin-molded substrate Sb from the lower mold LM of the mold C, moves the self-molding module M2 across the storage module M3, and carries the resin-molded substrate Sb into the storage module M3 gate disconnecting mechanism 71. The unloader 44 transports and stores the resin-molded substrate Sb from the unnecessary resin portion removed by the gate opening mechanism 71 to the output cassette 72 .

In addition, the unloader pickup part 44a is equipped with a plurality of pairs of claws (not shown) extending downward like the loader pickup part 40a. The unloader pickup part 44a picks up in the same manner as the loader pickup part 40a.

Next, the molding die set M2 will be described in detail.

As shown in FIG. 2 , the molding module M2 is provided with tie rods 32 at the four corners of a lower fixed plate 31 that is rectangular in plan view, and is provided with an upper fixed plate 33 that is rectangular in plan view near the upper end of the tie rod 32 . A rectangular movable platform 34 in plan view is provided between the lower fixed plate 31 and the upper fixed plate 33 . The movable platform 34 is provided with holes at four corners through which the tie rods 32 pass, and can move up and down along the tie rods 32 . On the lower fixed plate 31, there is a device (that is, the mold clamping mechanism 35) for moving the movable platform 34 up and down. The mold clamping mechanism 35 includes an electric motor Ma composed of a servo motor as a drive source, a strain gauge or a weighing sensor for calculating the clamping force of the mold C (hereinafter referred to as "clamping force"). The load sensor Wa is composed of a measuring instrument and the like. The mold closing mechanism 35 can close the mold C by moving the movable platform 34 upward, and can open the mold C by moving the movable platform 34 downward.

The forming mold C includes a lower mold LM and an upper mold UM. The lower mold LM and the upper mold UM are composed of metal molds arranged to face each other.

The lower mold LM is placed on the lower template 38 , and the lower template 38 is placed on the movable platform 34 . The lower mold LM includes a base block 51, side blocks 52 and a lower cavity block 53 placed on the base block 51, and a barrel block 54. The side blocks 52 are mounted on the base block 51 . A first elastic member 55 is disposed between the base block 51 and the lower mold cavity block 53 . The first elastic member 55 pushes the lower mold cavity block 53 toward above the upper mold UM relative to the base block 51 . An example of the first elastic member 55 is one in which a plurality of disc springs are laminated. The lower mold cavity block 53 is configured to be relatively movable in the up and down direction with respect to the base block 51 and the side blocks 52 by elastically deforming the first elastic member 55 . That is, the lower mold LM has a floating mechanism in which the lower mold cavity block 53 can move in the up and down direction. In addition, the elastic force of the first elastic member 55 is set so that elastic deformation starts before the floating pin 63 described later when the mold is closed.

In the state before the mold C is clamped, in the lower mold LM, the upper surface of the lower cavity block 53 is flush with the upper surface 58 of the side block 52 . The pre-resin molding substrate Sa is placed on the upper surface of the lower mold cavity block 53 with the surface on which the semiconductor wafer Sc or the like is fixed facing upward. Furthermore, the lower mold heater 36 for heating the pre-resin molding substrate Sa and the resin sheet T is built in the lower mold cavity block 53 . In this embodiment, the lower mold LM has two lower mold cavity blocks 53 and 53, and a barrel block 54 is arranged at a position sandwiched between the two lower mold cavity blocks 53 and 53. A barrel 54b having a cylindrical recessed portion is formed in the barrel block 54, and the inside of the barrel 54b is filled with a resin sheet T (resin melted by heating). Below the barrel block 54, a plunger 54a driven by an electric motor Mb such as a servo motor is inserted so as to be movable up and down. An elastic member (not shown) is provided at the support portion of the plunger 54a. The plunger 54a is slightly displaced by the elastic force of the elastic member to release the excess pushing force, and can adapt to the amount of resin when the resin sheet T is melted during pressure maintenance. the deviation. Furthermore, the lower mold LM has a load sensor Wb composed of a strain gauge, a load cell, or the like for calculating how much the plunger 54a pushes out the molten resin Ta (an example of a resin material).

The upper mold UM and the lower mold LM are arranged to face each other. The upper mold UM has a retainer base 61 fixed to the lower surface of the upper fixed plate 33, a pin retainer 62 fixed to the lower surface of the retainer base 61, and a plurality of floating pins 63 ( An example of a support member) is supported on the mold cavity block 64 and the scrap block 65 . The plurality of floating pins 63 are respectively inserted into a plurality of through holes formed in the pin holder 62 , and the upper and lower ends are not fixed to the holder base 61 , the upper mold cavity block 64 , and the scrap block 65 . The length of the floating pin 63 arranged above the scrap block 65 is the same as the length of the floating pin 63 arranged above the upper mold cavity block 64 . As will be described later, since the scrap block 65 is further supported by the cage base 61 via the second elastic member 66 in such a manner that its lower surface 69 protrudes downward than the lower surface 68 of the upper mold cavity block 64, it is disposed in the scrap block. The other end of the floating pin 63 above 65 is held in the pin retainer 62 and is away from the retainer base 61. In the state before closing the mold C, the upper mold cavity block 64 and the scrap block 65 are separated from the pin holder 62 .

On the lower surface 68 of the upper mold cavity block 64, a cavity MC is formed which is a concave portion for supplying the molten resin Ta. The upper mold cavity block 64 has a built-in upper mold heater 37 for heating the cavity MC. The upper mold cavity block 64 is opposite to the lower mold cavity block 53 and the side block 52 .

In this embodiment, the upper mold UM has two upper mold cavity blocks 64 and 64, and a scrap block 65 is arranged at a position sandwiched between the two upper mold cavity blocks 64 and 64. The scrap block 65 has a flow path 65a that allows the molten resin Ta to flow from the barrel 54b of the barrel block 54 toward the mold cavity MC. That is, the scrap block 65 is arranged above the barrel block 54 . The upper mold cavity block 64 and the scrap block 65 are composed of separate members, and the scrap block 65 is configured to be raised and lowered (movable in the up and down direction) independently of the upper mold cavity block 64 . The scrap block 65 is provided with an inlet gate 65b through which the molten resin Ta flows from the runner 65a toward the mold cavity MC. One end of the scrap block 65 is supported on the cage base 61 via a second elastic member 66 fixed on the cage base 61 . In the state before the mold C is clamped, the scrap block 65 is configured such that the lower surface 69 of the scrap block 65 protrudes further downward than the lower surface 68 of the upper mold cavity block 64 by the second elastic member 66 . An example of the second elastic member 66 is one in which a plurality of disc springs are laminated. In addition, the elastic force of the second elastic member 66 is set so that elastic deformation starts before the first elastic member 55 when the mold is closed.

An air hole groove 64a is formed on the lower surface 68 of the upper mold cavity block 64 and away from the gate 65b to discharge air from the mold cavity MC to the outside of the upper mold UM. The air hole groove 64a is formed by opening and closing the air hole block 67. One end of the air hole block 67 is mounted on the pin holder 62, and is inserted into the through hole formed in the upper mold cavity block 64 so as to be located in the middle of the air hole groove 64a when advancing. The lower end of the air hole block 67 is set higher than the lower surface 68 of the upper mold cavity block 64 before the mold C is clamped. That is, when the molding die C is closed and the air hole block 67 is arranged flush with or above the bottom surface of the air hole groove 64a, the air inside the mold cavity MC can be discharged to the upper mold by activating a pump (not shown). Outside the UM, when the air hole block 67 advances (moves downward) and closes the air hole groove 64a, the air in the mold cavity MC (and the molten resin Ta) cannot be discharged to the outside of the upper mold UM. Since one end of the air hole block 67 in this embodiment is mounted on the pin holder 62, if the mold closing mechanism 35 closes the mold and the floating pin 63 is compressed, the air hole block 67 can move forward relative to the upper mold cavity block 64. (Move down). Therefore, a special driving mechanism for moving the air hole block 67 forward and backward is not required, and the structure of the molding die C can be simplified and the molding die C can be constructed at a low price.

[Method for manufacturing resin molded products] Next, a method of manufacturing a resin molded product will be described using FIGS. 1 to 4 . The manufacturing method of the resin molded product (resin molded substrate Sb) includes: a supply step of supplying the pre-resin molding substrate Sa and the resin sheet T to the mold C; a mold clamping step of clamping the mold C; and a molding step of The molten resin Ta supplied from the gate 65b is filled in the mold cavity MC, and the resin molding of the substrate Sa before resin molding is performed. This molding step is a step in which the molding module M2 performs resin molding on the pre-resin molding substrate Sa between the time the pre-resin molding substrate Sa is moved into the molding module M2 and the time the resin-molded substrate Sb is unloaded from the molding module M2. The forming step includes a mold closing step. The operations of the forming mold C and the mold clamping mechanism 35 in the forming step are controlled by the control unit 10 .

First, the supply step will be explained. As shown in FIG. 1 , the loader 40 is heated in advance in the state of the storage space of the heat insulating resin sheet T. Then, the heaters 36 and 37 are energized to heat the mold C in advance (see also FIG. 2 ). Then, the plurality of pre-resin molding substrates Sa taken out from the cassette 7 are placed on the alignment mechanism 70 . The arrangement mechanism 70 has a rotating disk 70a. When the pre-resin molding substrate Sa is placed, the rotating disk 70a is rotated to arrange the pre-resin molding substrate Sa in a state suitable for the loader 40 to pick up the pre-resin molding substrate Sa. . The loader pickup part 40a picks up the pre-resin molding substrate Sa from the alignment mechanism 70 via the actuator 40b, places it on the loader 40, and picks up the resin sheet T from the resin supply device 79, and stores the resin sheet in the loader 40. T's containment space. Then, the loader 40 transports the pre-resin molding substrate Sa to the molding module M2, places the pre-resin molding substrate Sa with the semiconductor wafer Sc fixed side facing upward on the substrate setting portion of the lower mold LM, and places the resin sheet T It is accommodated in the barrel 54b of the barrel block 54 (refer to FIG. 2). By housing the resin sheet T in the barrel 54b of the barrel block 54, the lower mold heater 36 built in the lower mold LM heats the resin sheet T and turns it into molten resin Ta. In addition, before the movable platform 34 of the mold clamping mechanism 35 described later is raised, a release film (not shown) is adsorbed to the lower surface 68 of the cavity block 64 on the upper mold UM.

Next, the molding step including the mold clamping step will be described. First, from the state shown in Fig. 2, the movable platform 34 is moved upward by the mold clamping mechanism 35, so that the lower mold LM is relatively moved in the direction of the upper mold UM. As shown in Fig. 3(A), the barrel Block 54 is in contact with scrap block 65 . At this point in time, the upper surface 56 of the pre-resin molding substrate Sa placed on the lower mold LM is not in contact with the lower surface 68 of the upper mold cavity block 64 .

Figure 4 shows respectively: the horizontal axis is the molding time for manufacturing the resin molded product, and the vertical axis is the graph of the position of the transfer mechanism (A); the horizontal axis is the same molding time, and the vertical axis is the graph of the mold clamping force (B); The horizontal axis represents the same molding time, and the vertical axis represents a graph (C) of the supply pressure of the molten resin Ta to the mold cavity MC. That is, the items on the horizontal axis of the graphs (A), (B), and (C) in FIG. 4 are common, while the items on the vertical axis are different. The position of the transfer mechanism takes the state in Figure 3(A) as zero (reference position). The state shown in Fig. 3(A) is represented by time (a) in the graphs (A), (B) and (C) of Fig. 4. That is, it can be seen that at time (a), the transfer mechanism of pattern (A) has not moved upward from the reference position, the mold clamping force of the elastic force of the second elastic member 66 of pattern (B) has not yet occurred, and the melting of pattern (C) has not yet occurred. The supply of resin Ta has not yet started, so the supply pressure is zero. Thereafter, the mold-clamping state in FIG. 3(A) will be referred to as the first mold-clamping state. In addition, each time (timing) from time (a) to time (e) shown in FIG. 4 is set in advance by the control unit.

After time (a) has elapsed, if the movable platform is moved upward by the mold closing mechanism from the first mold closing state and the lower mold LM is relatively moved in the direction of the upper mold UM, the second elastic member 66 starts to elastically Deformation occurs, and a mold clamping force (hereinafter referred to as "first mold clamping force") shown in graph (B) in Figure 4 is generated. Then, as shown in FIG. 3(B) , the barrel block 54 and the scrap block 65 remain in close contact while the second elastic member 66 elastically deforms, and the upper surface 56 of the pre-resin molding substrate Sa and the lower surface of the upper mold cavity block 64 68 contacts. At this time, the first elastic member 55 and the floating pin 63 exert no elastic force at all or only slightly on the resin molding front substrate Sa and the upper mold cavity block 64 . Therefore, the pressing force exerted by the first elastic member 55 and the floating pin 63 on the pre-resin molding substrate Sa is very small. Therefore, the upper surface of the lower mold cavity block 53 and the upper surface 58 of the side block 52 remain flush. Thereafter, the mold-clamping state in FIG. 3(B) is called the second mold-clamping state. In addition, FIG. 3(B) shows a state in which the molten resin Ta is supplied with the positional relationship between the lower mold LM and the upper mold UM as described above.

In the second mold closing state, the air in the mold cavity MC is discharged from the air hole groove 64a to the outside of the upper mold UM by a pump (not shown), and the plunger 54a is moved upward by the electric motor Mb to cause melting. The resin Ta flows from the barrel 54b to the gate 65b through the flow path 65a of the waste block 65. Thereby, the supply of molten resin Ta to the mold cavity MC starts. The start of supply is represented by time (b) in the graphs (A), (B), and (C) of Fig. 4 . That is, at time (b), it can be seen that the transfer mechanism including the plunger 54a in the figure (A) starts to move upward, the first mold clamping force after the elapsed time (a) in the figure (B) is maintained, and the figure (C) The supply pressure of the molten resin Ta starts, but the pressure is very small. Thereby, even if the pressing force acting on the pre-resin molding substrate Sa is very small, the molten resin Ta will not leak out of the mold C.

In figures (A), (B) and (C) of Figure 4, after time (b) has elapsed, the second state is maintained, the transfer mechanism including the plunger rises (refer to figure (A) of Figure 4), and the barrel 54b The molten resin Ta inside is filled into the mold cavity MC. At this time, the first mold clamping force shown in the graph (B) of FIG. 4 is maintained, and as shown in the graph (C) of FIG. 4 , the supply pressure of the molten resin Ta is maintained in a small state. Then, before the molten resin Ta is completely filled into the mold cavity MC, and the time (c) when the resin does not leak out of the mold C, the mold clamping mechanism moves the movable platform upward to increase the mold clamping force ( Refer to graph (B) in Figure 4). Thereby, the first elastic member 55 is elastically deformed. As shown in FIG. 3(C) , the side block 52 of the lower mold LM is in contact with the upper mold cavity block 64 of the upper mold UM, and the upper surface 56 of the substrate Sa before resin molding is in contact with the side block 52 . The upper surface 58 of the block 52 and the upper surface 57 of the barrel block 54 become flush. When the elastic deformation compression amount (elastic deformation amount) of the first elastic member 55 reaches the maximum, the floating pin 63 elastically deforms. When the compression amount reaches the maximum, the pin holder 62 comes into contact with the upper mold cavity block 64 . Thereby, as shown in FIG. 3(C) , the air hole block 67 closes the air hole groove 64a. Thereby, the air in the mold cavity MC cannot be discharged to the outside, but the molten resin Ta is almost completely filled in the mold cavity MC, and almost no air remains. Therefore, almost no voids will occur after the molten resin Ta is hardened. Hereinafter, the mold-clamping state at this time will be called the third mold-clamping state, and the mold-clamping force will be called the second mold-clamping force. In addition, the compression of the elastic deformation of the floating pin 63 from FIG. 3(B) to FIG. 3(C) is exaggeratedly drawn. The actual floating pin 63 has very little compression.

After the time (c) in the graphs (A), (B), and (C) of Figure 4, the transfer mechanism including the plunger rises, and the molten resin Ta is supplied to the mold cavity MC. At the time (d), the plunger The plug 54a reaches the top dead center. After the time (d) has elapsed, the plunger 54a does not move, but as shown in graph (A) of Figure 4, the transfer mechanism continues to rise. This is because an elastic member (not shown) provided in the support portion of the plunger 54a elastically deforms. Thereby, the molten resin Ta remaining in the barrel 54b is filled into the mold cavity MC, and the air hole groove 64a is closed, so the supply pressure of the molten resin Ta rises rapidly (see graph (C) in FIG. 4). Then, when the supply pressure of the molten resin Ta reaches a predetermined value, the transfer mechanism stops (see time (e) in graphs (A) and (C) of FIG. 4 ). Thereby, the supply of molten resin Ta is completed. In addition, as shown in graph (B) of FIG. 4 , the third mold clamping state and the second mold clamping force are maintained after time (c).

As shown in the graphs (A), (B) and (C) of Figure 4, after the elapse of time (e), the position of the transfer mechanism, the mold clamping force, and the supply pressure of the molten resin are maintained in the same state, and the molten resin Ta is hardened. Then, after a predetermined time has elapsed, the control unit 10 lowers the clamping force of the mold clamping mechanism to move the movable platform downward, thereby opening the mold C. Next, the resin molded substrate Sb is demolded from the mold cavity MC to complete the resin molding. Thereafter, the resin-molded substrate Sb is picked up by the unloader pickup part 44a of the unloader 44, and the resin-molded substrate Sb is moved by the unloader 44 across the molding module M2 across the accommodation module M3. Next, the resin-molded substrate Sb is removed from unnecessary resin portions by the gate opening mechanism 71, and then stored in the output cassette 72 (see FIG. 1).

In this embodiment, by elastically deforming the second elastic member 66, the upper surface 56 of the pre-resin molding substrate Sa comes into contact with the lower surface 68 of the upper mold cavity block 64, and the first elastic member 55 and the floating pin 63 contact the resin. Resin supply can be started in a state where the pre-molding substrate Sa and the upper mold cavity block 64 have no elastic force acting at all or only slightly acting on it, so that the resin can be supplied. In the conventional device, the resin must be supplied by elastically deforming the first elastic member 55 of the lower mold so that the upper surface 56 of the substrate Sa before resin molding comes into contact with the lower surface 68 of the upper mold cavity block 64. During resin injection, Only a mold clamping force (pressure force) large enough to elastically deform the first elastic member 55 is applied to the pre-resin molding substrate. In this embodiment, the second elastic member 66 is set to start elastic deformation before the first elastic member 55 , that is, since the elastic coefficient of the second elastic member 66 is set to be smaller than the elastic coefficient of the first elastic member 55 , It can reduce the pushing force acting on the substrate during resin molding.

Furthermore, in this embodiment, before the molten resin Ta is filled into the mold cavity MC, the first elastic member 55 and the floating pin 63 are elastically deformed, and first, the upper surface 56 of the front substrate Sa and the side blocks are resin-molded. The upper surface 58 of 52 is flush with the upper surface 57 of the barrel block 54. Immediately thereafter, the floating pin 63 is completely elastically deformed, and the air hole groove 64a is closed by the air hole block 67. In the conventional device, before the molten resin Ta is filled into the mold cavity MC, the elastic force of the floating pin 63 must be preset to be greater than the elastic deformation of the first elastic member 55 in a way that the air hole groove is not closed. Much more elasticity. In this embodiment, since the resin can be almost filled into the mold cavity MC with a smaller mold clamping force (in this embodiment, the first mold clamping force) than in the past, there is no need for the floating pin 63 to close the air hole groove 64 a In this way, the initial elastic deformation elastic force can be set to the conventional size, and the final mold clamping force (in this embodiment, the second mold clamping force) can also be set smaller than the conventional one. As a result, the pressing force acting on the substrate during resin molding can be reduced.

[Other embodiments] Hereinafter, other embodiments of the above-described embodiment will be described. In addition, for easy understanding, the same terms and symbols will be used for description of the same components as those in the above-mentioned embodiment.

<1> In the above-mentioned embodiment, the powdery resin of the resin sheet T is a highly fluid thermosetting resin containing a filler, but it may not be highly fluid. In addition, it is not necessary to contain a filler.

<2> In the above-mentioned embodiment, although the first elastic member 55 and the second elastic member 66 are both laminated disc springs, they are not limited thereto. For example, a compression coil spring can be used, and any elastic member can be used.

<3> In the above embodiment, the pre-resin molding substrate Sa has a rectangular shape, but it is not limited to this. For example, a substrate of any shape, such as a circular substrate, can be used. Furthermore, the size of the substrate is not limited.

If it is assumed that the size of the substrate Sa before resin molding becomes larger, the cavity MC of the upper mold cavity block 64 becomes larger, corresponding to the area outside the cavity MC of the upper mold cavity block 64 that is in contact with the upper surface 56 of the substrate Sa before resin molding. The land becomes smaller. In this case, the pressure exerted by the mold clamping force on the upper surface 56 of the pre-resin molding substrate Sa becomes larger than in the case of using the upper mold cavity block 64 with a small mold cavity MC. However, if the resin molding device 100 using the mold C of this embodiment is used, the mold clamping force when supplying the molten resin Ta becomes the first mold clamping force in which only the second elastic member 66 exerts elastic force. Therefore, even before resin molding, Even when the size of the substrate Sa is large, it is possible to prevent excessive pressing force from acting on the substrate Sa before resin molding.

<4> In the above embodiment, the time (timing) of changing the mold clamping force shown in graph (B) in Fig. 4 from the first mold clamping force to the second mold clamping force is time (c) (from time (b) ) elapsed time) is set in advance by the control unit 10, but is not limited to this. For example, the mold clamping force may be controlled based on the resin pressure of the molten resin Ta calculated by the load sensor Wb. Furthermore, the mold clamping force can also be controlled based on the position of the transfer mechanism 39 (the position of the plunger 54a) shown in graph (A) of FIG. 4 .

<5> In the above embodiment, the scrap block 65 is arranged only on the upper mold UM, but it is not limited to this. The scrap blocks may also be configured to be separately arranged in the upper mold UM and the lower mold LM.

[Outline of the above embodiment] Hereinafter, an outline of the manufacturing method of the mold C, the resin molding apparatus 100, and the resin molded product (resin molded substrate Sb) described in the above embodiment will be described.

(1) The characteristic structure of the mold C is to include a lower mold LM, including a lower mold cavity block 53 on which a molding object (pre-resin molding substrate Sa) is placed, and a mold filled with a resin material (resin sheet T, molten The barrel block 54 of the barrel 54b of the resin Ta); the upper mold UM includes: an upper mold cavity block 64 having a mold cavity MC and an air hole groove 64a, and is disposed above the barrel block 54 and can be connected to the upper mold The scrap block 65 of the cavity block 64 rises and falls independently; the first elastic member 55 pushes the lower mold cavity block 53 toward the upper mold UM; elastically deformable plural support members (floating pins 63) push the upper mold cavity block 64 and the waste material block 65; the second elastic member 66 can push the waste material block 65, so that the waste material block 65 protrudes downward than the lower surface of the upper mold cavity block 64.

In the forming mold C constructed with this feature, before the mold is closed, that is, in the un-clamped state, the waste block 65 protrudes downward from the lower surface 68 of the upper mold cavity block 64 through the second elastic member 66 way, push the waste block 65. Thereby, when the mold is closed, the scrap block 65 contacts the barrel block 54 of the lower mold LM before the upper mold cavity block 64 . After that, the upper mold cavity block 64 comes into contact with the upper surface 56 of the molding object (pre-resin molding substrate Sa) due to the deformation of the second elastic member 66, so that the resin material (molten resin Ta) can be supplied to the mold cavity MC. It is possible to prevent excessive pressing force from being applied to the molding object (substrate Sa before resin molding) when the mold is closed (during resin molding).

(2) In the mold C described in (1) above, the first elastic member 55 may be set so that the first elastic member 55 starts elastic deformation before the plurality of support members (floating pins 63) when the mold is closed. 55 elasticity.

In this structure, the object to be molded (the substrate before resin molding Sa) is held by the elastic force of the first elastic member 55, so it can be prevented from acting on the object to be molded (the substrate before resin molding Sa) when the mold is clamped (during resin molding). Excessive pushing force.

(3) In the forming mold C described in (1) or (2) above, the second elasticity can also be set in such a way that the second elastic member 66 starts elastic deformation before the first elastic member 55 when the mold is closed. The elastic force of member 66.

In this structure, the object to be molded (substrate before resin molding Sa) is held by the elastic force of the second elastic member 66, so it can be prevented from acting on the object to be molded (substrate before resin molding Sa) when the mold is clamped (during resin molding). Excessive pushing force.

(4) The characteristic structure of the resin molding apparatus 100 is to include: the molding die C described in any one of (1) to (3) above; and the mold clamping mechanism 35 to clamp the molding mold C.

In the resin molding apparatus 100 having this characteristic configuration, a resin molded product (resin molded substrate Sb) can be manufactured using the mold C described in any one of (1) to (3) above.

(5) The manufacturing method of a resin molded product (resin molded substrate Sb) using the resin molding apparatus 100 described in (4) above is characterized by including the following steps: a supply step of supplying the molding object (resin) to the mold C The substrate Sa) and the resin material (resin sheet T) before forming; in the mold clamping step, the second elastic member 66 is elastically deformed by the first mold clamping force, so that the waste block 65 is in contact with the barrel block 54, and the upper mold The lower surface 68 of the cavity block 64 is in contact with the upper surface 56 of the molding object (pre-resin molding substrate Sa), and the resin material (resin sheet T, molten resin Ta) filled in the barrel 54b is supplied to the mold cavity MC. The second mold clamping force closes the air hole groove 64a; and the molding step performs resin molding of the molding object (substrate Sa before resin molding).

In the manufacturing method of a resin molded product (resin-molded substrate Sb) having this characteristic, after supplying the molding object (pre-resin molding substrate Sa) and the resin material (resin sheet T) to the mold C in the supply step, the mold C is closed. Step: Use the first mold clamping force of the elastically deformed second elastic member 66 to bring the scrap block 65 into contact with the barrel block 54, and bring the lower surface 68 of the upper mold cavity block 64 into contact with the molding object (pre-resin molding substrate Sa) The upper surface 56 contacts. Then, in this state, the resin material (molten resin Ta) is supplied to the mold cavity MC, and thereafter, the air hole groove 64a is closed by the second mold clamping force to produce a mold-clamped resin molded product (resin-molded substrate Sb) (molding step ). In this way, until the air hole groove 64a is closed by the second mold clamping force, the resin material (molten resin Ta) is supplied with the first mold clamping force to manufacture the resin molded product (resin molded substrate Sb). Therefore, it is possible to avoid molding the object (resin molded product) The front substrate Sa) exerts excessive pushing force to produce a resin molded product (resin molded substrate Sb).

Furthermore, by this, compared with the mold clamping force in the second mold clamping step of the resin sealing device disclosed in Patent Document 1, the second mold clamping force can be significantly reduced, and the press that performs mold clamping can be miniaturization. Furthermore, the pressing force acting on the air hole grooves 64a in contact with the upper surface 56 of the molding object (pre-resin molding substrate Sa) can also be reduced, so that collapse of the air hole grooves 64a can be prevented.

(6) The manufacturing method of the resin molded product (resin molded substrate Sb) described in the above (5) can also be used to move the scrap block 65 and the barrel by the elastic force of the second elastic member 66 in the mold closing step. After the blocks 54 come into contact, the second elastic member 66 is compressed, causing the lower surface 68 of the upper mold cavity block 64 to contact the upper surface 56 of the molding object (pre-resin molding substrate Sa).

According to this method, due to the elastic deformation of the second elastic member 66, the scrap block 65 comes into contact with the barrel block 54, and the lower surface 68 of the upper mold cavity block 64 comes into contact with the upper surface of the molding object (pre-resin molding substrate Sa). 56 contact, it is possible to manufacture a resin molded product (substrate Sb after resin molding) without applying excessive pressing force to the object to be molded (substrate Sa before resin molding).

(7) The manufacturing method of the resin molded product (resin molded substrate Sb) described in the above (5) or (6) may also use the second mold clamping force to move the supporting member (floating pin 63) in the mold clamping step. When the amount of compression reaches the maximum, the air hole groove 64a is closed.

Normally, the air in the mold cavity MC is discharged from the air hole groove 64a, so the air hole groove 64a is not closed until the mold cavity MC is filled with the resin material (molten resin Ta). Therefore, according to this method, when the compression amount of the support member (floating pin 63) reaches the maximum by the second mold clamping force, the air hole groove 64a is closed, so that the molded object can be prevented from being filled with the resin material (molten resin Ta). The pressing force of the second mold clamping force is applied to the object (substrate Sa before resin molding) to produce a resin molded product (substrate Sb after resin molding).

(8) The manufacturing method of the resin molded product (resin molded substrate Sb) described in any one of the above (5) to (7) may also be used when the elastic deformation amount of the first elastic member 55 reaches the maximum. The upper surface 56 of the object (pre-resin molding substrate Sa) and the upper surface 57 of the barrel block 54 are flush with each other.

According to this method, the timing at which the pressing force of the elastic force of the first elastic member 55 acts on the object to be molded (substrate Sa before resin molding) can be delayed, and therefore the pressing force acting on the object to be molded (substrate Sa before resin molding) can be shortened. of time.

industrial availability The present invention can utilize a mold, a resin molding device, and a method for manufacturing a resin molded article.

1:CPU 2: Forming mechanism 7:Input box 8:Memory department 9:Touch panel 10:Control Department 31:Lower fixed plate 32:Tie rod 33: Upper fixed plate 34: Movable platform 35: Mold clamping mechanism 36: Lower mold heater 37: Upper mold heater 38:Down template 39:Transfer institution 40:Loader 40a: Loader pickup section 40b: Actuator 42:Substrate supply unit 42b: Actuator 44:Unloader 44a: Unloader pickup section 44b: Actuator 51:Base block 52: Side block 53:Lower cavity block 54: Barrel block 54a:Plunger 54b: Barrel 55: First elastic member 56: Upper surface 57: Upper surface 58: Upper surface 61: Cage base 62: Pin cage 63: Floating pin 64: Upper mold cavity block 64a: Air hole groove 65: Scrap block 65a:Flow channel 65b: Gate 66: Second elastic member 67: Stomatal block 68: Lower surface 69: Lower surface 70: Arrangement mechanism 70a: Rotating disc 71: Gate disconnect mechanism 72:Output box 79:Resin supply device 100: Resin molding device C: Forming mold G: guide rail LM: lower mold M1: Supply module M2: Forming module M3: Containment Module MC: mold cavity Ma: electric motor Mb: electric motor Sa: Resin molding front substrate Sb: Resin molded substrate Sc: semiconductor wafer T:Resin sheet Ta: molten resin UM: upper mold Wa: load sensor Wb: load sensor

Fig. 1 is a schematic diagram showing a resin molding apparatus according to this embodiment. FIG. 2 is a schematic diagram showing the mold clamping mechanism of the resin molding device. FIG. 3 is a schematic diagram showing the molding steps including the mold closing step. 4 is a diagram showing the relationship between the molding time, the position of the transfer mechanism, the mold clamping force, and the supply pressure of the molten resin in the molding step.

31:Lower fixed plate

32:Tie rod

33: Upper fixed plate

34: Movable platform

35: Mold clamping mechanism

36: Lower mold heater

37: Upper mold heater

38:Down template

39:Transfer institution

51:Base block

52: Side block

53:Lower cavity block

54: Barrel block

54a:Plunger

54b: Barrel

55: First elastic member

56: Upper surface

57: Upper surface

58: Upper surface

61: Cage base

62: Pin cage

63: Floating pin

64: Upper mold cavity block

64a: Air hole groove

65: Scrap block

65a:Flow channel

65b: Gate

66: Second elastic member

67: Stomatal block

68: Lower surface

69: Lower surface

C: Forming mold

LM: lower mold

Ma: electric motor

Mb: electric motor

MC: mold cavity

Sa: Resin molding front substrate

Sc: semiconductor wafer

T:Resin sheet

UM: upper mold

Wa: load sensor

Wb: load sensor

Claims (8)

A forming mold, which has: The lower mold includes: a lower mold cavity block in which the molded object is placed, and a barrel block in which a barrel filled with resin material is formed; The upper mold includes: an upper mold cavity block having a mold cavity and an air hole groove, and a waste material block arranged above the barrel block and capable of lifting independently of the upper mold cavity block; A first elastic member pushes the lower mold cavity block toward the upper mold; A plurality of elastically deformable support members push the upper mold cavity block and the waste block; The second elastic member can push the waste material block so that the waste material block protrudes downwardly from the lower surface of the upper mold cavity block. The forming mold as described in claim 1, wherein, When the mold is closed, the elastic force of the first elastic member is set in such a way that the first elastic member starts to elastically deform before the plurality of supporting members. The forming mold as described in claim 1 or 2, wherein, When the mold is closed, the elastic force of the second elastic member is set in such a way that the second elastic member starts to elastically deform before the first elastic member. A resin molding device, which is provided with: A forming mold as described in any one of claims 1 to 3; and The mold clamping mechanism clamps the forming mold. A method of manufacturing a resin molded article using the resin molding apparatus as described in claim 4, which method includes the following steps: A supply step of supplying the molding object and the resin material to the mold; In the mold closing step, the second elastic member is elastically deformed by the first mold clamping force, so that the waste block is in contact with the barrel block, and the lower surface of the upper mold cavity block is in contact with the barrel block. The upper surface of the molded object is in contact, the resin material filled in the barrel is supplied to the mold cavity, and the air hole groove is closed by the second mold clamping force; and In the molding step, the object to be molded is resin molded. The manufacturing method of a resin molded article as described in Claim 5, wherein: In the mold closing step, after the waste material block is brought into contact with the barrel block by the elastic force of the second elastic member, the second elastic member is compressed to make the upper mold cavity The lower surface of the block is in contact with the upper surface of the molded object. The manufacturing method of a resin molded article as described in claim 5 or 6, wherein: In the mold closing step, when the compression amount of the support member reaches the maximum by the second mold closing force, the air hole groove is closed. The method for manufacturing a resin molded article as described in any one of claims 5 to 7, wherein: When the elastic deformation amount of the first elastic member becomes maximum, the upper surface of the molding object becomes flush with the upper surface of the barrel block.