TW202406718A - Resin-material feeding mechanism, resin molding device, and method for producing molded resin article - Google Patents

Abstract

A resin-material feeding mechanism is provided with which the total weight of resin tablets can be measured with high accuracy. The resin-material feeding mechanism comprises: a sending part for successively sending portions of a resin material; a total-weight measurement part for collectively measuring the weight of the portions of the resin material sent out by the sending part; a transfer part where the portions of the resin material sent out by the sending part are transferred to a conveying mechanism which conveys the resin material to a mold; and a movement part for moving the resin material among the sending part, the total-weight measurement part, and the transfer part.

Description

Resin material supply mechanism, resin molding device, and method for manufacturing resin molded products

The present invention relates to a resin material supply mechanism, a resin molding device, and a method for manufacturing a resin molded product.

Patent Document 1 discloses a technology for individually measuring the weight of a plurality of resin sheets required for a press unit. Specifically, Patent Document 1 discloses a resin material supply mechanism that includes: a pot portion that individually accommodates cylindrical resin sheets; and a load cell that individually measures the force stored in the pot portion. the weight of the resin sheet; and a discharge shutter for discharging the resin sheet contained in the tank.

In the resin material supply mechanism described in Patent Document 1, when the weight of the resin sheet accommodated in the tank part does not satisfy the condition of the reference weight, the resin sheet is determined to be a defective product. The resin sheets judged to be defective products are discharged to the outside through the discharge shutter. In this way, the resin sheets that satisfy the criterion of weight can be sorted and supplied to the press unit. [Prior art documents] [Patent Document]

[Patent Document 1] Japanese Patent Application Laid-Open No. 2019-202436

[Problem to be solved by the invention]

However, in the technology described in Patent Document 1, since a plurality of resin sheets are used for resin molding, there is a concern that the measurement errors of the resin sheets whose weights are measured individually are accumulated and the total weight of the plurality of resin sheets is lost. The error becomes larger.

In particular, in order to achieve high precision of resin molded products, in a resin molding apparatus that controls the position of a plunger based on the total weight of the resin sheets used in resin molding, it is necessary to adjust the weight of the resin sheets used with high precision. Total weight. However, since the resin material supply mechanism described in Patent Document 1 may increase the error in the total weight of the resin sheet, it is difficult to apply it to the resin molding apparatus as described above.

The present invention was made in view of the above situation, and an object to be solved is to provide a resin material supply mechanism, a resin molding apparatus, and a method for manufacturing a resin molded product that can measure the total weight of a resin sheet with high accuracy. [Means to solve the problem]

The problem to be solved by the present invention is as described above. In order to solve the problem, the resin material supply mechanism of the present invention includes: a feeding part that sequentially feeds the resin material; and a total weight measuring part that measures a plurality of the weights fed out by the feeding part. the weight of the resin material; a transfer unit that transfers a plurality of the resin materials sent out by the sending unit to a transfer mechanism that transfers the resin material to a mold; and a moving unit that moves the resin The material moves between the sending part, the total weight measuring part and the transfer part.

Moreover, the resin molding apparatus of this invention includes the said resin material supply mechanism.

In addition, the manufacturing method of a resin molded product of the present invention is a manufacturing method of a resin molded product using the resin molding apparatus, and includes: a wafer volume measuring step of measuring the volume of the wafer arranged on the substrate; and a resin volume measuring step, The volume of the resin material is measured; the plunger position calculation step is to calculate the relationship between the resin filling rate of the mold cavity and the position of the plunger based on the measured volume of the wafer and the volume of the resin material; and the filling rate correspondence The control step is to control actions related to resin molding when the plunger reaches a position corresponding to a predetermined resin filling rate. [Effects of the invention]

According to the present invention, the total weight of the resin sheet can be measured with high accuracy.

Hereinafter, the directions indicated by arrows U, D, L, R, F and B shown in the figure are respectively defined as upward direction, downward direction, left direction, right direction, front direction and rear direction. Explain.

<Overall structure of resin molding device 1> First, the structure of the resin molding apparatus 1 is demonstrated using FIG. 1. The resin molding apparatus 1 is an apparatus that seals electronic components such as semiconductor wafers (hereinafter referred to as "wafer 2 a") with resin to produce resin molded products. In particular, this embodiment illustrates a resin molding device 1 that performs resin molding using a transfer molding method.

The resin molding apparatus 1 includes a supply module 10, a resin molding module 20, and a carry-out module 30 as structural elements. Each structural element is detachable and replaceable relative to other structural elements.

＜Supply module 10＞ The supply module 10 supplies a lead frame (hereinafter simply referred to as the "substrate 2"), which is a type of substrate on which the wafer 2 a is mounted, and the resin sheet T to the resin molding module 20 . In addition, in this embodiment, a lead frame is exemplified as the substrate 2, but in addition to the lead frame, other various substrates (epoxy glass substrate, ceramic substrate, resin substrate, metal substrate, etc.) can also be used. ). The supply module 10 mainly includes a frame delivery part 11 , a frame measurement part 12 , a frame supply part 13 , a resin material supply mechanism 200 , a loader 17 and a control part 18 .

The frame delivery unit 11 delivers the substrate 2 that is not resin-sealed and stored in a unit (not shown) in the cassette to the frame measurement unit 12 . The frame measurement unit 12 measures the volume of the wafer 2 a mounted on the substrate 2 . In addition, the frame measurement unit 12 is an embodiment of the wafer volume measurement unit of the present application. Details regarding the frame measurement unit 12 will be described later. The substrate 2 whose measurement has been completed in the frame measurement unit 12 is sent out to the frame supply unit 13 . The frame supply unit 13 receives the substrates 2 from the frame measurement unit 12 , arranges the received substrates 2 appropriately, and delivers them to the loader 17 .

The resin material supply mechanism 200 supplies the resin sheet T to the loader 17 described later. The resin material supply mechanism 200 can measure the weight of the resin sheet T. Furthermore, details related to the resin material supply mechanism 200 will be described below. In addition, the loader 17 is one embodiment of the transport mechanism of this application.

The loader 17 transports the substrate 2 and the resin sheet T received from the frame supply part 13 and the resin material supply mechanism 200 to the resin molding module 20 .

The control unit 18 controls the operation of each module of the resin molding apparatus 1 . Furthermore, the control unit 18 is an implementation form of the calculation unit of the present application. The control unit 18 controls the operations of the supply module 10 , the resin molding module 20 , and the unloading module 30 . In addition, the control unit 18 can be used to arbitrarily change (adjust) the operation of each module.

Furthermore, in this embodiment, the example in which the control unit 18 is provided in the supply module 10 is shown, but the control unit 18 can also be provided in other modules. In addition, a plurality of control units 18 can also be provided. For example, the control unit 18 may be provided for each module or each device, and the operations of each module or the like may be controlled individually while interlocking with each other.

＜Resin molding module 20＞ The resin molding module 20 resin seals the wafer 2 a mounted on the substrate 2 . In this embodiment, two resin molding modules 20 are arranged in an array. The two resin molding modules 20 perform resin sealing of the substrate 2 simultaneously, thereby improving the manufacturing efficiency of resin molded products. The resin molding module 20 mainly includes a molding mold (lower mold 110 and upper mold 140) and a mold locking mechanism 190 (see FIG. 2).

The molding mold (lower mold 110 and upper mold 140 ) uses a molten resin material to resin-seal the wafer 2 a mounted on the substrate 2 . The forming mold includes a pair of upper and lower molds, that is, a lower mold 110 and an upper mold 140 (see FIG. 2 etc.). The molding die is provided with a heating unit (not shown) such as a heater.

The mold locking mechanism 190 (see FIG. 2 ) moves the lower mold 110 up and down to clamp or open the molding molds (the lower mold 110 and the upper mold 140 ).

＜Moving out module 30＞ The unloading module 30 receives the resin-sealed substrate 2 from the resin molding module 20 and unloads it. The unloading module 30 mainly includes an unloader 31 and a substrate receiving portion 32 .

The unloader 31 holds the resin-sealed substrate 2 and carries it out to the substrate accommodating part 32 . The substrate accommodating portion 32 accommodates the resin-sealed substrate 2 .

<Overview of the operation of the resin molding device 1> Next, an outline of the operation of the resin molding apparatus 1 configured as above (a method of manufacturing a resin molded product using the resin molding apparatus 1) will be described using FIGS. 1 and 2 .

In the supply module 10 , the frame delivery unit 11 delivers the substrate 2 stored in an in-magazine unit (not shown) to the frame measurement unit 12 . The frame measurement unit 12 measures the volume of the wafer 2 a of the received substrate 2 and then sends the substrate 2 out to the frame supply unit 13 . The frame supply unit 13 arranges the received substrates 2 appropriately and delivers them to the loader 17 .

In addition, the resin material supply mechanism 200 measures the total weight of the number of resin sheets T required for one resin molding in the resin molding module 20 and delivers the weight to the loader 17 . The loader 17 transports the received substrate 2 and resin sheet T to the molding die of the resin molding module 20 .

In the resin molding module 20, the mold locking mechanism 190 locks the molding mold. Then, the resin sheet T is heated and melted by a heating portion (not shown) of the mold, and the substrate 2 is resin-sealed using the generated molten resin.

After the resin sealing is completed, the mold clamping mechanism 190 opens the forming mold. Then, the resin-sealed substrate 2 is demolded. Subsequently, the unloader 31 unloads the substrate 2 from the mold and stores it in the substrate accommodating portion 32 of the unloading module 30 . At this time, the excess portion of the resin-molded substrate 2 (excess resin such as cull and runners) is appropriately removed. In this way, the resin-sealed substrate 2 (resin molded product) can be manufactured.

<Detailed structure of the resin molding module 20> Next, the structure of the resin molding module 20 will be described in further detail. As shown in Figure 2, the resin molding module 20 mainly includes a lower mold setting part 100, a lower mold 110, a lower mold cavity adjustment mechanism 120, an upper mold setting part 130, an upper mold 140, a disc spring 150, and an upper mold cavity adjustment mechanism. Mechanism 160, air vent opening and closing mechanism 170, transfer mechanism 180 and mold locking mechanism 190.

<Lower mold setting part 100> The lower mold installation part 100 shown in FIG. 2 is a part where the lower mold 110 is installed. The lower mold setting part 100 mainly includes a lower mold movable base part 101 and a lower mold mounting part 102.

The lower mold movable base portion 101 forms the lower portion of the lower mold setting portion 100 . The lower mold mounting portion 102 is a portion to which the lower mold 110 is mounted. The lower mold mounting part 102 is provided on the upper part of the lower mold movable base part 101.

＜Lower mold 110＞ The lower mold 110 shown in FIGS. 2 and 3(a) and FIGS. 9(a) and 9(b) forms the lower part of the molding die. The lower mold 110 mainly includes a lower mold side block 111, a pot block 112, a lower mold cavity block 113, a lower mold pillar 114 and a lower mold elastic member 115. In the lower mold 110 of this embodiment, as shown in FIG. 3(a) , a tank block 112 is provided in the center, lower mold cavity blocks 113 are arranged on the left and right of the tank block 112 , and lower mold cavity blocks 113 are arranged further outside. There is a lower mold side block 111.

The lower mold side piece 111 forms an outer peripheral portion of the lower mold 110 . The lower mold side block 111 is provided on the upper surface of the lower mold mounting part 102 .

The tank block 112 is a part that accommodates the resin sheet T supplied from the supply module 10 . A plurality of through holes (cans) for accommodating the resin sheet T are formed in the tank block 112 . The tank block 112 is sandwiched between the lower mold cavity block 113 on the left and right sides. The tank block 112 is provided on the upper surface of the lower mold mounting part 102 .

In addition, in (a) of FIG. 3 , in order to simplify the description, the can block 112 formed with two through holes (cans) is illustrated, but the number of cans is not limited to this. The number of tanks can be formed in any number according to the number of resin sheets T required for resin molding. For example, eight tanks capable of accommodating eight resin sheets T supplied from the resin material supply mechanism 200 (see FIG. 12 and the like) described below can also be formed.

The lower mold cavity block 113 is a part on which the substrate 2 is placed. The lower mold cavity block 113 is arranged between the lower mold side block 111 and the can block 112 . The lower mold cavity block 113 is arranged to be relatively movable in the up and down direction with respect to the lower mold side block 111 and the tank block 112 .

The lower mold pillar 114 is a member arranged to extend downward from the lower mold cavity block 113 . The upper end of the lower mold column 114 is fixed to the lower part of the lower mold cavity block 113 .

The lower mold elastic member 115 biases the lower mold cavity block 113 upward. The lower mold elastic member 115 is formed of, for example, a compression coil spring or the like. The lower mold elastic member 115 is arranged between the lower mold cavity block 113 and the lower mold mounting portion 102 . The upward force is always applied to the lower mold cavity block 113 by the biasing force of the lower mold elastic member 115 .

<Lower mold cavity adjustment mechanism 120> The lower mold cavity adjustment mechanism 120 shown in FIG. 2 adjusts the position of the lower mold cavity block 113 . The lower mold cavity adjustment mechanism 120 mainly includes a lower mold first wedge-shaped member 121, a lower mold second wedge-shaped member 122, and a lower mold wedge-shaped member driving part 123.

The lower mold first wedge-shaped member 121 and the lower mold second wedge-shaped member 122 are a pair of members having tapered portions formed on mutually facing surfaces. The lower mold second wedge-shaped member 122 is arranged above the lower mold first wedge-shaped member 121 . The second wedge-shaped member 122 of the lower mold is arranged below the lower mold column 114 . The lower end of the lower mold column 114 is in contact with the second wedge-shaped member 122 of the lower mold, whereby the downward movement of the lower mold cavity block 113 is restricted. Thereby, the position of the lower mold cavity block 113 is defined.

The lower mold wedge member driving unit 123 moves the lower mold first wedge member 121 in the horizontal direction (left-right direction). The lower mold wedge member driving part 123 is formed of, for example, a servo motor, a cylinder, or the like. The lower mold wedge member driving part 123 is connected to the lower mold first wedge member 121 via an appropriate power transmission member. By driving the lower mold wedge-shaped member driving part 123, the lower mold first wedge-shaped member 121 can be arbitrarily moved in the left-right direction.

The position of the lower mold cavity block 113 can be adjusted by the lower mold cavity adjustment mechanism 120 configured as above. Specifically, when the lower mold wedge-shaped member driving part 123 is driven to move the lower mold first wedge-shaped member 121 in the left-right direction, the lower mold second wedge-shaped member 122 in contact with the lower mold first wedge-shaped member 121 follows a tapered shape. Movement up and down. By displacing the second wedge-shaped member 122 of the lower mold up and down, the position where the downward movement of the lower mold column 114 is restricted is displaced, and the position of the lower mold cavity block 113 can even be adjusted.

<Upper mold setting part 130> The upper mold installation part 130 shown in FIG. 2 and FIG. 9(a) and FIG. 9(b) is a part where the upper mold 140 is installed. The upper mold setting part 130 mainly includes an upper mold fixing base part 131, an upper mold mounting part 132, and a heating plate 133.

The upper mold fixing base portion 131 forms the upper portion of the upper mold installation portion 130 . The upper mold mounting portion 132 is a portion to which the upper mold 140 is mounted. The upper mold mounting part 132 is formed by combining a plurality of members. The upper mold mounting portion 132 is provided at the lower portion of the upper mold fixing base portion 131 . A support portion 132 a that supports an upper mold 140 (upper mold base portion 141 ) described later from below is provided on the outer peripheral portion of the upper mold mounting portion 132 . The heating plate 133 is used to heat the upper mold 140 . The heating plate 133 is provided on the bottom surface of the upper mold mounting portion 132 .

＜Upper mold 140＞ The upper mold 140 shown in FIGS. 2 and 3(b) and FIGS. 9(a) and 9(b) forms the upper part of the forming die. The upper mold 140 mainly includes an upper mold base 141, an upper mold side block 142, an upper mold cavity block 143, an upper mold support 145 and an upper mold column 146. In this embodiment, as shown in (b) of FIG. 3 , there is a residual material block 144 in the center, and upper mold cavity blocks 143 are arranged on the left and right thereof. The upper mold side block 142 is arranged.

The upper mold base portion 141 is a member that supports an upper mold side block 142 described later. The upper mold base 141 is formed in a plate shape having a predetermined thickness up and down. The outer peripheral portion of the upper mold base portion 141 is supported from below by the support portion 132 a of the upper mold mounting portion 132 . Thereby, the upper mold base part 141 is supported so that it can move in an up-down direction with respect to the upper mold installation part 130.

The upper mold side pieces 142 form the side surfaces of the mold cavity C formed by the upper mold 140 . Furthermore, the upper mold side block 142 is an implementation form of the side block of the present application. The upper mold side block 142 is formed in a frame shape with an opening formed at a position corresponding to the resin molded product (cavity C). The upper mold side block 142 is provided on the lower surface of the upper mold base 141 . A vent slot 142a is formed in the upper mold side block 142 .

The vent groove 142a shown in FIG. 2 is used to discharge the air in the mold cavity C to the outside. The vent groove 142a is formed at an appropriate position on the lower surface of the upper mold side block 142.

The upper mold cavity block 143 forms the upper surface of the cavity C formed by the upper mold 140 . Furthermore, the upper mold cavity block 143 is an implementation form of the mold cavity block of the present application. The upper mold cavity block 143 is arranged inside the upper mold side block 142 (more specifically, inside the opening of the upper mold side block 142 ). The upper mold cavity block 143 is configured to be relatively movable in the up and down direction relative to the upper mold side block 142 .

The remaining material block 144 is arranged at a position facing the can block 112 of the lower mold 110 and forms a side surface of the mold cavity C formed by the upper mold 140 . A groove-shaped residual portion 144 a and a flow channel portion 144 b for guiding the resin material to the mold cavity C are formed on the lower surface of the remaining material block 144 (see (b) of FIG. 3 ). Furthermore, FIG. 2 schematically shows a situation in which the through hole (can) of the tank block 112 is connected to the mold cavity C to be described later via the remaining material part 144a and the runner part 144b, so as to facilitate understanding of the resin. flow.

The upper mold support 145 restricts upward movement of the upper mold 140 by contacting the upper mold setting portion 130, thereby defining the position of the upper mold 140. The upper mold support 145 is fixed to the upper surface of the upper mold base 141 . A plurality of upper mold supports 145 are provided at appropriate positions on the upper surface of the upper mold base 141 .

The upper mold column 146 is a member arranged to extend upward from the upper mold cavity block 143 . The lower end of the upper mold column 146 is fixed to the upper part of the upper mold cavity block 143 . The upper mold pillar 146 is arranged to penetrate the upper mold base portion 141 .

In addition, FIG. 2 shows the state in which the release film RF is adsorbed to the lower surface of the upper mold 140 (the surface forming the cavity C).

＜Coil Spring 150＞ The coil spring 150 biases the upper mold 140 downward. The coil spring 150 is arranged between the lower surface of the upper mold installation part 130 (heating plate 133) and the upper surface of the upper mold 140 (upper mold base 141). By the biasing force of the coil spring 150 , a force is always applied to the upper mold 140 in a direction away from the upper mold installation portion 130 (downward).

＜Upper mold cavity adjustment mechanism 160＞ The upper mold cavity adjustment mechanism 160 adjusts the position of the upper mold cavity block 143 . The upper mold cavity adjustment mechanism 160 includes an upper mold cavity block holding member 161, an upper mold cavity block driving part 162, a restricting member 163, an upper mold elastic member 164, a first upper mold wedge member 165, and a second upper mold wedge member. 166 and the upper mold wedge member driving part 167.

The upper mold cavity block holding member 161 holds the upper mold cavity block 143 . The upper mold cavity block holding member 161 is formed in a frame shape that is hollow in front view. The upper mold cavity block holding member 161 is formed by combining a plurality of members (upper and lower plate-shaped members, a plurality of cylindrical members connecting the upper and lower plate-shaped members, etc.). The upper mold cavity block holding member 161 is disposed to vertically penetrate the upper mold fixing base portion 131 . The upper mold cavity block holding member 161 is provided to be movable up and down relative to the upper mold fixed base portion 131 . The upper end of the upper mold column 146 is fixed to the lower surface of the upper mold cavity block holding member 161 . Thereby, the upper mold cavity block holding member 161 can hold the upper mold cavity block 143 via the upper mold pillar 146 .

The upper mold cavity block driving part 162 moves the upper mold cavity block holding member 161 in the vertical direction (up and down direction). The upper mold cavity block driving part 162 is formed by, for example, a servo motor or a cylinder. The upper mold cavity block driving part 162 is provided on the upper part of the upper mold cavity block holding member 161 . By driving the upper mold cavity block driving part 162 , the upper mold cavity block holding member 161 (and even the upper mold cavity block 143 ) can be arbitrarily moved in the up and down direction relative to the upper mold setting part 130 .

The restriction member 163 restricts the movement of the upper mold cavity block holding member 161 by contacting the upper mold cavity block holding member 161 . The restriction member 163 is formed by combining a plurality of members (plate-shaped members, etc.). The restriction member 163 includes an upper portion spanning the upper mold cavity block holding member 161 left and right, and a central portion arranged inside the upper mold cavity block holding member 161 . The central portion of the restriction member 163 is disposed so as to be in contact with the lower portion (bottom) of the upper mold cavity block holding member 161 from above. The restriction member 163 can restrict upward movement of the upper mold cavity block holding member 161 by contacting the lower part of the upper mold cavity block holding member 161 from above. By this, the depth of the mold cavity C can be specified.

The upper mold elastic member 164 biases the restriction member 163 upward. The upper mold elastic member 164 is formed of, for example, a compression coil spring or the like. The upper mold elastic member 164 is arranged between the restriction member 163 and the upper mold mounting portion 132 . The upward force is always applied to the restriction member 163 by the biasing force of the upper mold elastic member 164 .

The upper mold first wedge-shaped member 165 and the upper mold second wedge-shaped member 166 are a pair of members having tapered portions formed on mutually facing surfaces. The upper mold second wedge-shaped member 166 is disposed below the upper mold first wedge-shaped member 165 . The upper mold first wedge-shaped member 165 and the upper mold second wedge-shaped member 166 are arranged inside the upper mold cavity block holding member 161 . More specifically, the upper mold first wedge-shaped member 165 and the upper mold second wedge-shaped member 166 are arranged between the upper mold fixing base portion 131 and the restriction member 163 . The second wedge-shaped member 166 of the upper mold is fixed to the upper surface of the restricting member 163 .

The upper mold wedge member driving unit 167 moves the upper mold first wedge member 165 in the horizontal direction (left-right direction). The upper mold wedge member driving unit 167 is formed of, for example, a servo motor, a cylinder, or the like. The upper mold wedge member driving part 167 is connected to the upper mold first wedge member 165 via an appropriate power transmission member. By driving the upper mold wedge-shaped member driving unit 167, the upper mold wedge-shaped member driving unit 167 can be arbitrarily moved in the left-right direction.

Through the upper mold cavity adjustment mechanism 160 configured as described above, the position of the upper mold cavity block 143 can be adjusted. Specifically, when the upper mold cavity block driving part 162 is driven to move the upper mold cavity block holding member 161 downward, a gap is formed between the restriction member 163 and the lower part of the upper mold cavity block holding member 161 . That is, this gap can be used to move the restriction member 163 up and down. In this state, when the upper mold wedge-shaped member driving part 167 is driven to move the upper mold first wedge-shaped member 165 in the left-right direction, the upper mold second wedge-shaped member 166 in contact with the upper mold first wedge-shaped member 165 will move along the The tapered part moves up and down. In addition, the restricting member 163 also moves up and down together with the second wedge-shaped member 166 of the upper mold. After the restricting member 163 is adjusted to a predetermined position, the upper mold cavity block driving part 162 is driven again to move the upper mold cavity block holding member 161 upward until it contacts the restricting member 163 . By displacing the restricting member 163 up and down as described above, the position where the upward movement of the upper mold cavity block holding member 161 is restricted is displaced, so that the position of the upper mold cavity block 143 can be adjusted.

<Vent hole opening and closing mechanism 170> The vent opening and closing mechanism 170 shown in FIG. 2 opens and closes the vent groove 142a that communicates the mold cavity C with the outside. The vent opening and closing mechanism 170 mainly includes a vent pin 171 and a vent driving part 172 .

The vent pin 171 is used to close the vent slot 142a. The vent pin 171 is movably provided in a through hole in the upper mold side block 142 communicating with the vent groove 142a.

The vent driving unit 172 moves the vent pin 171 in the up and down direction. The vent driving part 172 is formed by a servo motor, a cylinder, etc., for example. The vent driving part 172 is connected to the vent pin 171 via an appropriate power transmission member. By driving the vent driving part 172, the vent pin 171 can be arbitrarily moved in the up and down direction. For example, by moving the vent pin 171 downward, the vent groove 142a can be closed.

＜Transfer institution 180＞ The transfer mechanism 180 supplies the resin material to the mold cavity C. The transfer mechanism 180 mainly includes a transfer driving part 181, a plunger 182, and a plunger load measuring part 183.

The transfer drive unit 181 is a drive source that moves a plunger 182 described later in the vertical direction (up-and-down direction). The injection driving part 181 is formed of, for example, a servo motor or a cylinder. The transfer driving unit 181 is provided on the lower mold movable base 101 below the tank block 112 .

The plunger 182 injects the resin sheet T (resin material) accommodated in the tank block 112 and supplies it to the mold cavity C. The plunger 182 is disposed so as to be movable up and down (up and down) within the tank block 112 .

The plunger load measuring unit 183 measures the force (plunger load) applied to the plunger 182 . The force applied to the plunger 182 specifically refers to the force with which the transfusion drive unit 181 presses the plunger 182 . The plunger load measuring unit 183 is formed of, for example, a load cell or the like. The plunger load measuring unit 183 is provided between the injection driving unit 181 and the plunger 182 .

Furthermore, in this embodiment, no means for uniformizing the force imparted to the resin material by each plunger 182 (or even the resin pressure in the cavity C) is disposed between the transfer driving unit 181 and the plunger 182 . Elastic members, etc. (isobaric mechanism). Therefore, the plunger 182 moves with a movement amount proportional to the output of the transfer driving unit 181 . For example, when a cylinder having a telescopic rod is used as the transfer drive unit 181 and the plunger 182 is pushed up from below, the plunger 182 also moves by the same amount as the movement of the rod of the transfer drive unit 181 . In addition, for example, when the transfer driving unit 181 moves the plunger 182 via an appropriate deceleration mechanism, the plunger 182 moves by a movement amount obtained by multiplying the output of the transfer driving unit 181 by the reduction ratio of the deceleration mechanism.

<Shape of remaining material portion 144a> As described above, the plunger 182 is configured to move with a movement amount proportional to the output of the injection driving unit 181. Therefore, when a plurality of plungers 182 are used to supply the resin material to the cavity C, it is ideal that the cavity C The resin pressure within the structure becomes uniform. In this embodiment, the resin material is supplied from the plurality of plungers 182 (cans) to the common cavity C, and the resin pressure becomes uniform through the cavity C. As another method of making the resin pressure in the cavity C uniform, for example, there is a method of forming a connecting groove 144 c that connects the remaining material portions 144 a to each other as shown in FIG. 4( a ); or as shown in FIG. 4( b ). ), when there are a plurality of cavities C, there is a method of further forming connecting grooves 144d that connect the cavities C to each other (resin material is supplied from the plurality of remaining material portions 144a to the common cavity C). By connecting the remaining material portions 144 a to each other as described above, it is possible to suppress variations in the pressure applied to the resin material due to variations in the plunger load of each plunger 182 .

＜Clamping mechanism 190＞ The mold clamping mechanism 190 shown in FIG. 2 raises the lower mold 110 to clamp (clamp) the lower mold 110 and the upper mold 140 . Furthermore, the mold clamping mechanism 190 is an implementation method of the clamping mechanism of the present application. The clamping mechanism 190 mainly includes a fixed plate 191, a support 192, a driving mechanism 193 and a clamping load measuring part 194.

The fixed plate 191 is a part installed on the ground and supports other members. The lower mold 110 (lower mold installation part 100) is provided on the upper part of the fixed plate 191 via a drive mechanism 193 described later.

The support 192 supports the upper mold 140 (upper mold installation part 130). The pillar 192 is provided to extend upward from the fixed plate 191 . The upper mold fixing base part 131 of the upper mold installation part 130 is fixed to the upper part of the support|pillar 192. Thereby, the upper mold 140 (upper mold installation part 130) is arrange|positioned above the lower mold 110 (lower mold installation part 100).

The drive mechanism 193 moves the lower mold 110 (lower mold installation part 100 ) in the vertical direction (up-and-down direction). The driving mechanism 193 is formed by, for example, a driving source such as a servo motor and an appropriate power transmission mechanism. The driving mechanism 193 is arranged between the fixed plate 191 and the lower mold setting part 100 . By driving the driving mechanism 193, the lower mold setting part 100 can be moved (raised and lowered) arbitrarily in the up and down direction. For example, the lower mold 110 is raised toward the upper mold 140 by the driving mechanism 193, thereby performing mold locking. In addition, the lower mold 110 is lowered in a direction away from the upper mold 140 by the driving mechanism 193, thereby opening the mold.

The clamping load measuring unit 194 measures the force (clamping load) when the lower mold 110 and the upper mold 140 are clamped by the mold clamping mechanism 190 . The clamping load measuring unit 194 is formed of, for example, a load cell, a strain gauge, or the like. The clamping load measuring unit 194 is provided on the support column 192 . The clamping load measuring unit 194 can measure the clamping load based on the load applied to the support column 192 .

Furthermore, FIG. 2 shows a state in which the lower mold 110 and the upper mold 140 are mold-locked (clamped) after the substrate 2 and the resin sheet T are transported to the forming mold.

＜Overview of the manufacturing method of resin molded products＞ Hereinafter, a method of manufacturing a resin molded product using the resin molding apparatus 1 configured as above will be described.

In this embodiment, when resin molding is performed in the resin molding module 20, control is performed to improve the dimensional accuracy of the product (specifically, the dimensional accuracy of the thickness of the molded resin). In order to help understand this control, first, the main cause of the deviation in the size of the product in the resin molding apparatus 1 will be explained using FIGS. 5(a) and 5(b) .

As shown in (a) of FIG. 5 , when the lower mold 110 is raised by the mold locking mechanism 190 to clamp the lower mold 110 and the upper mold 140 , the upper mold side block 142 in the upper mold 140 and the lower mold 140 are clamped. Die 110 contacts. Therefore, the clamping load generated by the mold clamping mechanism 190 is mainly applied to the upper mold side block 142 . When a clamping load is applied to the upper mold side block 142 , the upper mold side block 142 is compressed vertically and slightly deformed. Therefore, there is a concern that the depth (thickness in the vertical direction) of the mold cavity C becomes shallow.

In addition, as shown in FIG. 5( b ), when the resin material is supplied into the mold cavity C by the plunger 182 of the transfer mechanism 180 , the pressure from the resin material in the mold cavity C acts upward on the upper mold. Mold cavity block 143. Therefore, the upper mold cavity block 143 is pushed upward and slightly moves or deforms, so that the depth of the cavity C may become deeper.

As described above, when performing resin molding using the resin molding apparatus 1, the depth of the cavity C may change depending on the operation of each part. Therefore, by suppressing this change, the dimensional accuracy of the resin molded product can be improved. . Hereinafter, a method of manufacturing a resin molded product (control mode of clamp load and plunger load) that can achieve such an improvement in dimensional accuracy will be described.

In step S10 of FIG. 6 , the volumes of the resin sheet T and the wafer 2 a on the substrate 2 are measured. The details are explained below.

The volume of the resin sheet T is calculated based on the total weight of the resin sheet T measured in the resin material supply mechanism 200 of the supply module 10 as described above. Specifically, the total weight of the resin sheets T required for one resin molding in the resin molding module 20 is measured in the total weight measurement unit 250 of the resin material supply mechanism 200 described below. The volume of the resin sheet T is calculated based on the weight of the resin sheet T measured by the total weight measurement unit 250 and the specific gravity of the resin sheet T.

In addition, the volume of the wafer 2a on the substrate 2 is measured in the frame measurement unit 12 of the supply module 10 as described above. In the frame measuring unit 12, any measuring device can be used to measure the volume of the wafer 2a on the substrate 2. An example of the frame measurement unit 12 is a volume meter that measures the volume of the wafer 2 a on the substrate 2 . The volumeter is a laser volumeter that measures the shape (even the volume) of the wafer 2 a by detecting the distance to the wafer 2 a on the substrate 2 using laser light. In addition, the method of measuring the volume of the wafer 2a is not particularly limited, and it can be measured using various other machines. For example, various three-dimensional scanners and the like can be used.

Next, in step S20 of FIG. 6 , the position of the plunger 182 at a predetermined resin filling rate of the cavity C is calculated. The details are explained below.

The control unit 18 calculates the size of the mold cavity C based on the dimensions of each component (upper mold side block 142 , upper mold cavity block 143 , tank block 112 , residual material block 144 , etc.) memorized in advance and the upper and lower positions of the upper mold cavity block 143 . capacity. Furthermore, the upper and lower positions of the upper mold cavity block 143 can be grasped based on the driving amount of the upper mold wedge member driving unit 167 and the like. The control unit 18 can calculate, based on the calculated capacity of the cavity C and the volumes of the resin sheet T and the wafer 2 a measured in step S10 , which position the plunger 182 rises to in the capacity of the cavity C. What percent has been filled with molten resin material (resin filling rate).

In this embodiment, as shown in FIGS. 5(a) and 5(b) , the control unit 18 calculates the resin filling rates of the cavity C at 0%, 25%, 50%, 75%, and 100%. The positions of the plunger 182 (hereinafter referred to as position P0, position P25, position P50, position P75 and position P100 respectively).

Furthermore, strictly speaking, when the plunger 182 is located at a position lower than the position P0, the resin filling rate of the cavity C is 0% regardless of the position of the plunger 182. However, in this embodiment, the resin filling rate is 0%. The position where the plunger 182 rises and starts supplying the resin material into the cavity C is defined as the position P0 where the resin filling rate is 0%.

Next, in step S30 of FIG. 6 , the substrate 2 and the resin sheet T are respectively transported to the molding die of the resin molding module 20 . Specifically, the substrate 2 is placed on the lower mold 110 and the resin sheet T is accommodated in the tank of the tank block 112 .

Next, in step S40 of FIG. 6 , the lower mold 110 and the upper mold 140 are clamped by the mold locking mechanism 190 . Specifically, the lower mold 110 rises by the mold locking mechanism 190, and the lower mold 110 contacts the upper mold 140 from below. Thereby, the mold cavity C is closed. At this time, as shown in FIG. 9( a ), the upper mold 140 rises to a position where the upper mold holder 145 comes into contact with the upper mold installation part 130 (heating plate 133 ).

Hereinafter, using the graph shown in FIG. 7 , the clamping load (units are, for example, tonf, N, etc.) and the plunger position (the position of the plunger 182 with the initial position set to 0) accompanying the operation of the resin molding apparatus 1 will also be explained. An example of time changes in the up and down position (units are, for example, mm, etc.) and plunger load (units are, for example, tonf, N, etc.).

In step S40 , by clamping the lower mold 110 and the upper mold 140 , the clamping load rises to CL1 at time t1 in FIG. 7 .

Next, in step S50 of FIG. 6 , the rise of the plunger 182 is started (time t2 of FIG. 7 ).

Next, in step S60 of FIG. 6 , filling rate corresponding control is performed. The filling rate corresponding control refers to controlling the operation of the resin molding device 1 based on the resin filling rate of the cavity C.

An example of filling rate corresponding control is shown in FIG. 8 . FIG. 8 shows an example of controlling the clamping load and the moving speed of the plunger 182 based on the resin filling rate.

Specifically, when the position of the plunger 182 reaches the position P50 (the position where the resin filling rate is 50%) (YES in step S61 ), the clamping load increases from CL1 to CL2 (step S62 ). At time t3 in Figure 7, the plunger 182 reaches position P50. From time t3 to time t4, the clamping load increases from CL1 to CL2.

In addition, when the position of the plunger 182 reaches the position P50 (the position where the resin filling rate is 50%) (YES in step S61), the moving speed of the plunger 182 is adjusted (step S62). At time t3 in FIG. 7 , the temporal change of the plunger 182 (the inclination of the graph of the plunger position) becomes gentle. That is, adjustment is made so that the moving speed of the plunger 182 becomes slower.

Next, when the position of the plunger 182 reaches the position P100 (the position where the resin filling rate is 100%) (YES in step S63), the plunger 182 is stopped (step S64). At time t5 in FIG. 7 , the plunger 182 reaches the position P100 and stops the movement (rising) of the plunger 182 .

Furthermore, FIG. 8 shows an example in which the clamping load and the moving speed of the plunger 182 are adjusted only once when the resin filling rate reaches 50%. However, the number of adjustments is not limited to this and can also be performed multiple times. adjust. For example, the clamping load can be adjusted every time the resin filling rate reaches 25%, 50%, or 75% (the plunger 182 reaches the position P25, the position P50, and the position P75). In addition, the resin filling rate as a trigger for this adjustment is not limited to the above example, and can be set arbitrarily.

By increasing the clamping load step by step according to the resin filling rate as described above, the depth change of the cavity C can be suppressed. Specifically, as the resin filling rate increases, the force of the resin material to push the upper mold cavity block 143 upward increases, so the depth of the cavity C becomes deeper (see (b) of FIG. 5 ). Therefore, by increasing the clamping load according to the resin filling rate as described above, the depth of the cavity C becomes shallower (see (a) of FIG. 5 ), thereby counteracting the tendency of the depth of the cavity C to change. (Increase and decrease of depth), suppress the depth change of cavity C.

In addition, by adjusting the moving speed of the plunger 182 according to the resin filling rate, the occurrence of underfilling of the resin material, etc. can be suppressed. Specifically, the resin material flowing in the mold cavity C flows in a part where it is relatively easy to flow (for example, a part of the substrate 2 where the wafer 2 a is not placed, etc.) and a part where it is relatively difficult to flow (for example, a part of the substrate 2 where the wafer 2 a is not placed, etc.) , so in order to make the resin flow well, it is sometimes desirable to adjust the flow speed. Therefore, by adjusting the moving speed of the plunger 182 according to the resin filling rate as described above, the flow of the resin can be improved.

In addition, in this embodiment, the resin filling rate (the position of the plunger 182 corresponding to the resin filling rate) is calculated based on the values obtained by actually measuring the volumes of the resin sheet T and the wafer 2 a of the substrate 2 . Therefore, regardless of each Regardless of variations in the volume of the resin sheet T, etc., the resin filling rate of the mold cavity C can be accurately grasped. Thereby, the change in the depth of the cavity C can be suppressed with higher accuracy.

Furthermore, an appropriate clamping load value or an appropriate moving speed of the plunger 182 relative to the resin filling rate can be determined in advance through experiments, numerical analysis, or the like.

Next, in step S70 of FIG. 6 , cavity control is performed. The so-called cavity control refers to adjusting the position of the upper mold cavity block 143 before the pressure adjustment control described later.

Specifically, in a state where the lower mold 110 and the upper mold 140 are clamped as shown in FIG. 9( a ), the clamping load is reduced as shown in FIG. 9( b ). At this time, the clamping load is reduced while the upper mold cavity block holding member 161 is pressed downward by the upper mold cavity block driving part 162 . At time t6 in Figure 7, the clamping load decreases from CL2 to CLdown. At this time, there is a concern that the depth of the cavity C may increase due to the decrease in clamping load. However, since the upper mold cavity block driving part 162 presses the upper mold cavity block holding member 161 downward, the cavity C can be suppressed from becoming deeper. deep.

When the clamping load is reduced, as shown in FIG. 9( b ), the upper mold 140 moves relatively in a direction away from the upper mold setting portion 130 by the coil spring 150 , so that the restriction member 163 and the upper mold cavity block are held in place. A slight gap is formed between the members 161 (see part A of Fig. 9(b) ).

By forming such a gap, the movable area of the second wedge-shaped member 166 of the upper mold can be ensured. That is, the second wedge-shaped member 166 of the upper mold is allowed to move up and down. By driving the upper mold wedge member driving part 167 in this state, the position of the upper mold cavity block 143 can be adjusted arbitrarily.

For example, in the example shown in FIG. 7 , the upper mold cavity block 143 is slightly lowered. Thereby, the depth of the mold cavity C can be slightly shallower, making it easier to adjust the mold in the pressure adjustment control (step S80), the first final adjustment control (step S90), and the second final adjustment control (step S100) described later. The resin material in the cavity C imparts high pressure.

Next, in step S80 of FIG. 6 , pressure adjustment control is performed. The so-called pressure adjustment control refers to adjusting the clamping load to increase the pressure applied to the resin material in the cavity C.

Specifically, as shown in Fig. 7, the clamping load is increased from CLdown to CLM (preset clamping load) (time t7). At this time, the plunger 182 is stopped. Therefore, the tendency of the cavity C to become shallower due to an increase in the clamping load is supported by the resin material filled in the cavity C, so that a change in the depth of the cavity C can be suppressed. In addition, this increases the pressure applied to the resin material in the cavity C, suppresses the occurrence of underfilling of the resin, and improves the accuracy of the resin molded product. Furthermore, in FIG. 7 , the plunger load increases as the pressure in the cavity C increases.

Next, in step S90 of FIG. 6 , the first final adjustment control is performed. The so-called first final adjustment control refers to adjusting the clamping load to a preset final clamping load.

Specifically, as shown in Fig. 7, the clamping load is increased from CLM to CLf (final clamping load) (time t8). At this time, the plunger 182 is stopped. Therefore, the tendency of the cavity C to become shallower due to an increase in the clamping load is supported by the resin material filled in the cavity C, so that a change in the depth of the cavity C can be suppressed. In addition, this increases the pressure applied to the resin material in the cavity C, suppresses the occurrence of underfilling of the resin, and improves the accuracy of the resin molded product.

Next, in step S100 of FIG. 6 , the second final adjustment control is performed. The so-called second final adjustment control refers to adjusting the plunger load to a preset final plunger load.

Specifically, as shown in FIG. 7 , the plunger 182 is moved so that the plunger load becomes Trf (time t9). In the example shown in FIG. 7 , the plunger load at the time point when the first final adjustment control is completed (time t8 ) is less than Trf, so the plunger 182 is raised to increase the plunger load to Trf.

Furthermore, for example, when the plunger load is greater than Trf at the time point when the first final adjustment control is completed (time t8), the plunger 182 is lowered in step S100 to reduce the plunger load to Trf. In addition, when the plunger load is Trf at the time when the first final adjustment control is completed (time t8), the plunger 182 is not moved in step S100 and the plunger load is maintained at Trf. By adjusting the final plunger load to a preset value as described above, the accuracy of the resin molded product can be improved.

Furthermore, when the plunger 182 is moved as in the second final adjustment control, the pressure applied to the resin material in the mold cavity C can be efficiently adjusted, and on the other hand, the amount of the resin material in the mold cavity C changes. The depth of the mold cavity C is prone to change. Therefore, in this embodiment, the clamping force is increased to the final clamping force in advance in the first final adjustment control, and along with this, the plunger load is increased to a value close to the final plunger load. Thereby, the movement amount of the plunger 182 in the second final adjustment control can be suppressed to a small value, so that a change in the depth of the cavity C can be suppressed.

Next, in step S110 of FIG. 6 , the system waits until the curing time (hardening time) elapses while maintaining the clamp load and the plunger load.

Next, in step S120 of FIG. 6 , the plunger 182 is lowered to reduce the plunger load, and the lower mold 110 and the upper mold 140 are opened by the mold locking mechanism 190 .

Next, in step S130 of FIG. 6 , the substrate 2 on which resin molding (resin sealing) has been completed is carried out from the molding die. The unloaded substrate 2 is transferred to the unloading module 30 .

As described above, by appropriately controlling the clamp load and plunger load, changes in the depth of the cavity C can be suppressed, thereby improving the dimensional accuracy of the resin molded product.

＜Other examples of control forms＞ Hereinafter, other examples of the manufacturing method of resin molded products (control modes of clamp load and plunger load) will be described.

The example shown in FIG. 10 shows another example of the control form of the clamp load etc. shown in FIG. 7 . In the following, for convenience of explanation, the control mode shown in FIG. 7 is called the first control mode, and the control mode shown in FIG. 10 is called the second control mode. The main difference between the second control form shown in FIG. 10 and the first control form shown in FIG. 7 lies in the control content from time t6 to time t7 (steps S70 and S80 in FIG. 6 ). This difference will be explained below.

In the first control mode, in the mold cavity control in step S70 of FIG. 6 , the position of the upper mold cavity block 143 is adjusted to make the depth of the mold cavity C shallower. However, in the second control mode, the position of the upper mold cavity block 143 is adjusted. The cavity block 143 is positioned so that the depth of the cavity C becomes deeper.

That is, in the second control mode, the upper mold wedge member driving unit 167 is driven while the clamping load is reduced to CLdown in step S70, so that the upper mold cavity block 143 is slightly raised. Thereby, the depth of the mold cavity C becomes slightly deeper.

Next, in step S80 of FIG. 6 , pressure adjustment control is performed. Here, as described above, in the second control mode, adjustment is made in step S70 so that the depth of the cavity C becomes deeper. When the depth of cavity C becomes deeper as described above, the capacity of cavity C also changes (increases), so the resin filling rate, which is already 100%, decreases to less than 100%.

Therefore, the control unit 18 recalculates the relationship between the resin filling rate of the cavity C and the position of the plunger 182 at this point in time. In addition, this calculation method is the same as step S20.

Secondly, the clamping load is increased from CLdown to CLM2 (time t7). At this time, since the resin filling rate is less than 100%, the plunger 182 is raised to supply the resin material into the cavity C, and the clamping load CL is raised step by step. That is, similarly to the filling rate corresponding control (step S60 ), the clamping load is increased stepwise when the plunger 182 reaches the position corresponding to the predetermined resin filling rate. In addition, at this time, the moving speed of the plunger 182 can also be adjusted. The example shown in FIG. 10 shows an example in which the clamping load is increased in two stages, CLM1 and CLM2.

As described above, in the pressure adjustment control (step S80), similarly to the filling rate corresponding control (step S60), the clamping load is increased stepwise according to the resin filling rate, thereby suppressing the expansion of the mold cavity C. Depth changes. However, in the pressure adjustment control, it is also possible to adopt a structure in which the filling rate corresponding control is not performed.

In addition, in the filling rate corresponding control (step S60), the clamping load or the moving speed of the plunger 182 is adjusted according to the resin filling rate. As another example, the clamping load or the moving speed of the plunger 182 can also be adjusted according to the resin filling rate. The operation of the ventilation hole opening and closing mechanism 170 (see FIG. 2 ) is controlled. For example, when the resin filling rate reaches a predetermined value (when the plunger 182 reaches a position corresponding to the predetermined resin filling rate), the vent pin 171 may be lowered to close the vent groove 142 a. Thereby, the opening and closing of the ventilation hole groove 142a can be controlled accurately according to the resin filling rate.

In addition, in the filling rate corresponding control (step S60), it is shown that the position of the plunger 182 corresponding to each resin filling rate (0%, 25%, 50%, 75%, and 100%) is used as an opportunity. Although this is an example of controlling each part, the control method is not limited to this. For example, control based on other positions using these positions as a reference can also be performed.

For example, when the plunger 182 is raised (when the resin material is supplied to the mold cavity C), the following control can be performed: using the position P0 of the plunger 182 with a resin filling rate of 0% as a reference, the plunger 182 reaches The position at a predetermined distance (eg, 5 mm, etc.) downward from the position P0 is used as an opportunity to adjust the moving speed of the plunger 182 and close the vent groove 142a.

As described above, control based on the position of the plunger 182 before the resin material is supplied to the cavity C can be performed using the position P0 as a reference and taking the plunger 182 to reach a position below the position as a trigger. Thereby, for example, each part can be controlled even at the timing immediately before the supply of the resin material to the cavity C is started or at the same time as the supply is started (timing that does not depend on the resin filling rate).

<Resin material supply mechanism 200> The structure of the resin material supply mechanism 200 will be described below. The resin material supply mechanism 200 of this embodiment can measure the total weight of the resin sheet T used for calculating the volume of the resin sheet T with high accuracy. As shown in FIGS. 11 and 12 , the resin material supply mechanism 200 mainly includes a delivery part 210 , an individual weight measurement part 220 , a moving part 230 , a chuck 240 , a total weight measurement part 250 , a transfer part 260 and an extrusion mechanism 270 .

＜Sending unit 210＞ The feeding part 210 sequentially feeds the cylindrical resin sheet T to the individual weight measuring part 220 mentioned later. The delivery unit 210 can deliver the plurality of resin sheets T accommodated inside to the right while arranging them in a line.

<Individual weight measurement unit 220> The individual weight measurement unit 220 shown in FIG. 11 measures the weight of the resin sheet T individually. The individual weight measuring unit 220 is arranged on the right side of the sending unit 210 . The individual weight measurement part 220 mainly includes a main body part 221 and a weight detection part 222.

The main body portion 221 is a portion on which the resin sheet T is placed. The main body portion 221 is formed in a substantially rectangular parallelepiped shape. The main body part 221 mainly includes a placement part 221a.

The placement portion 221a is formed in a groove shape in which the upper surface of the main body portion 221 is recessed downward. The placement portion 221a is formed to extend in the left-right direction. The placement portion 221a is formed in a V-shape in side cross-sectional view. A cylindrical resin sheet T with an axis facing left and right can be placed on the placement portion 221a. By forming the placement portion 221a into a V-shape in side cross-section, the resin sheet T placed on the placement portion 221a can be prevented from rolling.

The weight detection unit 222 measures the weight of the resin sheet T placed on the main body 221 . The weight detection unit 222 is arranged to support the main body unit 221 from below. The weight detection part 222 can measure the load applied to the main body part 221. As the weight detection unit 222, a load cell can be used, for example. In addition, the weight detection unit 222 is not limited to a load cell, and various devices capable of measuring weight, such as a weight sensor using a piezoelectric element and an electrostatic capacitance weight sensor, can be used.

In addition, when the measurement result of the weight of the resin sheet T exceeds a preset range, the individual weight measurement unit 220 is configured to discharge the resin sheet T with the measured weight to the resin material supply mechanism 200 as shown in FIG. 13 . external. When the measurement result of the weight of the resin sheet T exceeds a preset range, for example, it means that the weight of the resin sheet T is greater than the target value or is less than the allowable error range. In this case, it can be determined that the resin sheet T is a defective product. By discharging the resin sheets T considered to be defective products as described above, the resin sheets T of an appropriate weight can be used for resin molding, thereby improving the accuracy of the resin molded products.

As a mechanism for discharging the resin sheet T, various mechanisms can be used. For example, an openable and closable shutter is provided on the bottom surface of the main body 221 and a mechanism that discharges the resin sheet T downward through the shutter; or a mechanism that rotates the main body 221 to drop the resin sheet T and discharge it.

<Moving unit 230> The moving part 230 shown in FIG. 11 to FIG. 14 moves the resin sheet T between the delivery part 210, the total weight measurement part 250 mentioned later, and the transfer part 260 mentioned later. The moving part 230 is formed in a rectangular parallelepiped shape that is long in front and back. The moving part 230 is arranged on the right side of the sending part 210 and the individual weight measuring part 220 . The moving part 230 mainly includes a first placing part 231, a groove part 232, and a first rolling prevention part 233.

The first placing portion 231 shown in FIG. 14 is formed in a groove shape in which the upper surface of the moving portion 230 is recessed downward. The first placing portion 231 is formed to extend from the left end to the right end of the moving portion 230 . The first placing portion 231 is formed in a V-shape in side cross-section. A cylindrical resin sheet T with an axis facing left and right can be placed on the first placement portion 231 . By forming the first placing portion 231 in a V-shape in side cross-section, the resin sheet T placed on the first placing portion 231 can be prevented from rolling. In addition, the resin sheet T can be positioned by the first placing portion 231 . Thereby, the core position of the resin sheet T can be uniquely determined, and malfunctions when the resin sheet T is transferred to the transfer part 260 by the extrusion mechanism 270 to be described later (for example, the resin sheet T and the side surface of the accommodating part 261 can be prevented) collision, etc.) occurs. A plurality of first placing portions 231 are formed at certain intervals along the longitudinal direction of the moving portion 230 . In this embodiment, as shown in FIG. 11 etc., the moving part 230 formed with eight first placing parts 231 is shown, but the present invention is not limited to this, and the number of the first placing parts 231 can be arbitrary. change.

The groove portion 232 shown in FIG. 14 is formed in a groove shape in which the bottom of the first placing portion 231 is further recessed downward. The groove portion 232 is formed to extend from the left end to the right end of the moving portion 230 .

The first rolling prevention part 233 prevents the resin sheet T placed on the first placing part 231 from rolling. The first rolling prevention portion 233 is formed in a rectangular flat plate shape. The first rolling prevention part 233 is fixed to the upper surface of the moving part 230 . The first rolling prevention portions 233 are respectively arranged on the front and rear sides of the first placing portion 231 . By arranging the first rolling prevention portion 233, the resin sheet T placed on the first placing portion 231 can be prevented from rolling forward and backward across the first placing portion 231.

The moving part 230 can linearly move back and forth in the front-rear direction by an appropriate moving mechanism (for example, a rail that guides the moving part 230 so that it can move in the front-rear direction, a servo motor that moves the moving part 230 to any position along the rail, etc.) . The moving part 230 can move in the front-rear direction from the right of the delivery part 210 (individual weight measuring part 220) to the left of the transfer part 260 mentioned later. That is, the moving part 230 can move on the moving path along the direction (front-back direction) perpendicular|vertical to the moving direction (left-right direction) of the resin sheet T sent out from the sending part 210.

＜Collet 240＞ The chuck 240 shown in FIGS. 11 and 13 is used to transfer the resin sheet T. The chuck 240 is provided with a left and right pair. One of the chucks 240 can clamp the resin sheet T sent out from the sending part 210 and place it on the placing part 221 a of the individual weight measuring part 220 . The other chuck 240 can clamp the resin sheet T placed on the individual weight measuring part 220 and place it on the first placing part 231 of the moving part 230 .

<Total weight measurement unit 250> The total weight measurement unit 250 shown in FIGS. 11 , 12 and 14 collectively measures the weights of the plurality of resin sheets T placed on the moving unit 230 . The total weight measuring unit 250 is arranged on the right side of the moving unit 230 (on the opposite side to the individual weight measuring unit 220 across the moving unit 230). The total weight measurement part 250 mainly includes a support part 251, a second rolling prevention part 252, a connection part 253, a weight detection part 254, and a moving part 255.

The support portion 251 supports the resin sheet T from below. The support portion 251 is formed in a square column shape with the longitudinal direction facing the left and right directions. The support part 251 is provided so that it may protrude leftward from the left side of the connection part 253 mentioned later. The support part 251 mainly includes a second placement part 251a.

The second placement portion 251a is formed in a groove shape in which the upper surface of the support portion 251 is recessed downward. The second placement portion 251a is formed to extend along the longitudinal direction of the support portion 251. The second placement portion 251a is formed in a V-shape in side cross-sectional view.

A plurality of support portions 251 are arranged one after the other so as to correspond to the first placing portion 231 of the moving portion 230 . In this embodiment, eight supporting parts 251 are arranged corresponding to the eight first placing parts 231 . The intervals between the plurality of support parts 251 are arranged to be the same as the intervals between the plurality of first placing parts 231 .

The second rolling prevention part 252 prevents the resin sheet T supported by the supporting part 251 from rolling. The second anti-rolling portion 252 is formed in a cylindrical shape with the longitudinal direction facing the left and right directions. The second rolling prevention portion 252 is provided to protrude leftward from the left side of the connection portion 253 described later. The second rolling prevention portion 252 is arranged to correspond to each of the plurality of support portions 251 . A pair of front and rear second rolling prevention portions 252 are arranged above the support portion 251 .

The connection part 253 connects the plurality of support parts 251 and the second anti-rolling part 252 . The connecting portion 253 is formed in a rectangular parallelepiped shape that is long in front and back. The support part 251 and the second rolling prevention part 252 are fixed to the left side of the connection part 253.

The weight detection part 254 shown in FIG. 11, FIG. 12, and FIG. 15 measures the weight of the resin sheet T supported by the support part 251. The weight detection part 254 is fixed to the right side of the connection part 253. The weight detection part 254 can measure the load applied to the connection part 253. As the weight detection unit 254, a load cell can be used, for example. In addition, the weight detection unit 254 is not limited to a load cell, and various devices capable of measuring weight, such as a weight sensor using a piezoelectric element and an electrostatic capacitance weight sensor, can be used.

The moving part 255 moves the connecting part 253 in the up-down direction and the left-right direction. In addition, the moving part 255 is an implementation form of the lifting part of this application. The moving part 255 is connected to the connection part 253 via the weight detection part 254. The moving part 255 can be moved in the up and down direction by an appropriate moving mechanism (for example, a track that guides the moving part 255 so that it can move in the up and down directions and left and right directions, a servo motor that moves the moving part 255 to any position along the track, etc.) and move left and right.

＜Transfer Department 260＞ The transfer unit 260 shown in FIGS. 11 and 12 transfers the resin sheet T sent out by the sending unit 210 to the loader 17 . The transition portion 260 is formed in a rectangular parallelepiped shape that is long in front and back. The transfer unit 260 is arranged in tandem with the total weight measuring unit 250 along the movement path of the moving unit 230 . Specifically, the transfer unit 260 is disposed to the right of the moving unit 230 and behind the total weight measurement unit 250 . Thereby, the total weight measurement part 250 and the delivery part 260 are arrange|positioned along the movement path of the movement part 230 which moves forward and backward. The transfer part 260 mainly includes a receiving part 261 and a rotating shaft 262.

The accommodating part 261 is a part which accommodates the resin sheet T. The accommodating portion 261 is formed in a concave shape opening on the left side of the transfer portion 260 . A plurality of accommodating parts 261 are arranged in a row in front and back so as to correspond to the first placing part 231 of the moving part 230 . In this embodiment, eight receiving portions 261 are formed corresponding to the eight first placing portions 231 . The distance between the plurality of receiving portions 261 is formed to be the same as the distance between the plurality of first placement portions 231 .

The rotation shaft 262 rotatably supports the transfer portion 260 . The rotating shaft 262 is provided at both front and rear ends of the delivery portion 260 . The delivery portion 260 can rotate around the rotation axis 262 by power from a drive source (cylinder, etc.) not shown.

The transfer part 260 can move linearly back and forth in the up and down direction by an appropriate moving mechanism (such as a track that guides the transfer part 260 so that it can move in the up and down direction, a servo motor that moves the transfer part 260 to any position along the track, etc.) . When the transfer part 260 moves upward, the resin sheet T accommodated in the receiving part 261 can be transferred to the loader 17 .

＜Extrusion mechanism 270＞ The extrusion mechanism 270 extrudes the resin sheet T placed on the moving part 230 and delivers it to the transfer part 260 . The extrusion mechanism 270 is arranged on the left side of the moving part 230 (on the opposite side to the transfer part 260 across the moving part 230). The extrusion mechanism 270 mainly includes an extrusion part 271 and a support part 272 .

The extrusion part 271 is a part which extrudes the resin sheet T. The extrusion part 271 is formed in a rectangular flat plate shape. The extrusion part 271 is arranged so that the plate surface is substantially horizontal. The front-to-back width of the extrusion portion 271 is formed so as to cover the entirety of a plurality of (eight in this embodiment) first placing portions 231 formed on the moving portion 230 .

Furthermore, as the extrusion mechanism 270 of this embodiment, a structure in which the resin sheet T is extruded through the extrusion part 271 formed in a flat plate shape is exemplified, but the present invention is not limited to this, and various structures can be adopted. For example, as the extrusion part 271, a cylindrical member whose longitudinal direction faces the left-right direction can also be used. By arranging a plurality of these cylindrical members in front and back in correspondence with the plurality of first placing portions 231 , the resin sheet T placed on the first placing portions 231 can be extruded at once.

The support portion 272 is a portion that supports the extrusion portion 271 . The support portion 272 is formed in a rectangular plate shape with the longitudinal direction facing the front-rear direction. The left end of the extrusion part 271 is fixed to the right side of the support part 272 .

The extrusion mechanism 270 can be moved in the left-right direction by an appropriate moving mechanism (for example, a rail that guides the support portion 272 so that it can move in the left-right direction, a cylinder that moves the support portion 272 along the rail, etc.).

<Supply form of resin sheet T> Hereinafter, the case of supplying the resin sheet T to the loader 17 using the resin material supply mechanism 200 configured as above will be described.

As shown in FIG. 12 , the plurality of resin sheets T accommodated in the delivery unit 210 are arranged in a line and move toward the right end of the delivery unit 210 . The resin sheet T that has reached the right end of the delivery unit 210 is placed on the individual weight measurement unit 220 by the chuck 240 . The weight of the resin sheet T placed on the individual weight measurement unit 220 is measured by the weight detection unit 222 . As described above, the weight of the single resin sheet T sent out from the sending part 210 can be measured by the weight detection part 222 .

When the weight of the resin sheet T measured by the weight detection unit 222 exceeds a preset range, the resin sheet T is considered to be a defective product and is discharged from the individual weight measurement unit 220 . The resin sheet T whose weight does not exceed a preset range is placed on the first placing portion 231 of the moving portion 230 by the chuck 240 .

By placing the resin sheet T whose weight has been measured in the individual weight measuring unit 220 on the moving unit 230 while appropriately moving the moving unit 230 back and forth, the resin sheet T can be placed on each of the individual weight measuring units 220 as shown in FIG. 12 . A placing part 231. The number of resin sheets T required for one resin molding in the resin molding module 20 is placed on the moving part 230 . At this time, as shown in FIG. 13 , the inclined surface of the first placing part 231 and the first rolling prevention parts 233 provided in the front and rear of the first placing part 231 prevent the first placing part 231 from rolling. The resin sheet T rolls.

After the resin sheet T is placed on each first placing portion 231 of the moving portion 230 , as shown in FIGS. 15( a ) and 15 ( b ), the total weight measuring unit 250 moves to the left. Thereby, the plurality of supporting parts 251 provided in the total weight measuring part 250 is inserted into each groove part 232 of the moving part 230 from the right. Thereby, the support part 251 is located below each resin sheet T. In addition, at the same time, the second rolling prevention portions 252 of the total weight measuring portion 250 are respectively located above and on the left and right of each resin sheet T.

In this state, as shown in FIGS. 15(c) and 15(d) , the total weight measurement unit 250 moves upward. Thereby, each supporting part 251 of the total weight measuring part 250 lifts the several resin sheets T upward together. At this time, the resin sheet T is prevented from rolling by the inclined surface formed in the second placement portion 251a of the support portion 251 and the second rolling prevention portions 252 disposed on the left and right sides of the resin sheet T.

In a state where the plurality of resin sheets T are lifted up by the total weight measuring unit 250, the weights of the plurality of resin sheets T are collectively measured by the weight detection unit 254. Thereby, the total weight of the plurality of resin sheets T used in one resin molding in the resin molding module 20 can be measured.

As described above, in this embodiment, in the resin material supply mechanism 200, the total weight of a plurality of resin sheets T used in one resin molding can be measured together. Thereby, compared with a case where the weight of the resin sheets T is measured individually and added up, the measurement error can be suppressed to a smaller value, and the total weight of the resin sheets T can be measured with high accuracy.

After the weight measurement of the resin sheet T by the total weight measurement unit 250 is completed, the total weight measurement unit 250 moves downward, and the resin sheet T is placed on the first placement portion 231 of the moving unit 230 again. Then, the total weight measuring part 250 moves to the right, and the support part 251 retreats from the groove part 232 of the moving part 230.

Subsequently, as shown in FIGS. 11 and 12 , the moving part 230 moves rearward and stops between the transfer part 260 and the extrusion mechanism 270 . In this state, as the extrusion mechanism 270 moves to the right, each resin sheet T is extruded to the right from the extrusion part 271 and is accommodated in each receiving part 261 of the transfer part 260 .

The transfer part 260 which accommodates the resin sheets T rotates so that the accommodating part 261 may move upward, and transfers each resin sheet T to the loader 17 while moving upward.

As described above, the resin material supply mechanism 200 of this embodiment can measure the individual weight of the resin sheet T and the total weight of the plurality of resin sheets T respectively. Information regarding the weight of the resin sheet T can be stored in the control unit 18 and managed.

In addition, as a modification of the resin material supply mechanism 200 , the resin sheets T can be discharged from the total weight measurement unit 250 to the outside of the resin material supply mechanism 200 . For example, when the measurement results of the weights of the plurality of resin sheets T exceed a preset range, the total weight measuring unit 250 discharges the plurality of resin sheets T whose weights have been measured together to the outside. As a mechanism for discharging the plurality of resin sheets T, various mechanisms can be used. For example, the same mechanism as the mechanism in which the individual weight measurement unit 220 discharges the resin sheet T can be used.

The embodiments of the present invention have been described above. However, the present invention is not limited to the embodiments and can be appropriately modified within the scope of the technical idea of the invention described in the claims.

For example, the structural elements (supply module 10 and the like) used in the resin molding apparatus 1 of the above embodiment are examples and can be attached, detached, or replaced as appropriate. For example, the number of resin molding modules 20 can be changed. In addition, the structure and operation|movement of the structural element (supply module 10 etc.) used in the resin molding apparatus 1 of this embodiment are an example, and can be changed suitably.

In addition, in the above embodiment, the example in which the remaining material portion 144a and the flow channel portion 144b are formed in the remaining material block 144 is shown. For example, the remaining material portion 144a and a part of the flow channel portion 144b may be formed in the tank block 112. . In addition, in the embodiment, an example is shown in which the tank block 112 includes a plurality of through holes (cans), but the number of the through holes may be one.

In addition, the control form illustrated in the above embodiment is an example, and the detailed control content (for example, the target value of the clamp load or the plunger load, the control timing, etc.) can be changed arbitrarily. For example, in the embodiment, an example is shown in which the second final adjustment control (step S100) is executed after the first final adjustment control (step S90) is completed. However, the second final adjustment control can also be started before the first final adjustment control is completed. 2. Final adjustment control.

In addition, in the above-described embodiment, the coil spring 150 is exemplified as the imparting portion that imparts force to the upper mold 140, but the present invention is not limited to this, and various other structures can be adopted. For example, as the imparting portion, various elastic members or actuators such as cylinders can also be used.

In addition, in the above-described embodiment, an example is shown in which the volume of the wafer 2 a of the substrate 2 is measured in the frame measurement unit 12 included in the resin molding apparatus 1 , but the present invention is not limited to this. For example, the resin molding apparatus 1 can also perform resin molding using the substrate 2 whose volume is measured externally. In this case, the resin molding apparatus 1 does not need to include the frame measuring part 12 .

In addition, in the above-mentioned embodiment, as examples of the filling rate corresponding control, the clamping force adjustment control for adjusting the clamping load, the plunger speed adjustment control for adjusting the moving speed of the plunger 182, and the ventilation hole groove 142a are exemplified. The present invention is not limited to the ventilation hole switching control of opening and closing, and can control any operation related to resin molding.

In addition, the moving part 230 illustrated in the above-mentioned embodiment is an example, and the specific shape etc. can be changed arbitrarily. For example, the first placing portion 231 may be formed into a curved surface corresponding to the side surface (curved surface) of the resin sheet T. In addition, it is not necessarily necessary to provide the first rolling prevention part 233 in the moving part 230. For example, when the rolling of the resin sheet T can be sufficiently prevented by the first placing part 231, the first rolling prevention part 233 may be omitted. In addition, the shape of the groove portion 232 is not particularly limited, and as long as it can be inserted into the support portion 251 for lifting the resin sheet T, the shape, size, etc. can be changed arbitrarily.

In addition, the total weight measurement unit 250 illustrated in the above embodiment is an example, and the specific shape and the like can be changed arbitrarily. For example, the shape, number, arrangement, etc. of the second rolling prevention portion 252 for preventing the resin sheet T from rolling can be arbitrarily changed. In addition, the shape, size, etc. of the support part 251 for supporting the resin sheet T can be changed arbitrarily. For example, the second placement portion 251 a formed in the support portion 251 may be formed into a curved surface shape corresponding to the side surface (curved surface) of the resin sheet T. In addition, the support portion 251 can also be composed of a plurality of members.

In addition, the arrangement and direction of each part of the resin material supply mechanism 200 illustrated in the above embodiment are not particularly limited, and can be arbitrarily changed according to the shape, size, etc. of the resin molding apparatus 1 .

＜Note＞ The resin material supply mechanism 200 of the first aspect of the present disclosure includes: The feeding part 210 sequentially feeds out the resin material (resin sheet T); The total weight measuring unit 250 collectively measures the weights of the plurality of resin materials sent out by the sending unit 210; The transfer unit 260 transfers the plurality of resin materials sent out by the sending unit 210 to a loader 17 (transfer mechanism) that transfers the resin materials to the molding mold (lower mold 110 and upper mold 140 ). 17 (moving agencies); and The moving part 230 moves the resin material between the sending part 210 , the total weight measuring part 250 and the transfer part 260 . According to the resin material supply mechanism 200 of the first aspect of the present disclosure, the total weight of the resin sheet T can be measured with high accuracy. That is, by collectively measuring the weights of a plurality of resin materials, errors are less likely to accumulate compared to a case where the weights of the resin materials are individually measured and added up, and the total weight of the resin sheet T can be measured with high accuracy. Thereby, the volume of the resin sheet can be calculated with high accuracy based on the total weight of the resin sheet T, and even higher accuracy of the resin molded product can be achieved.

In the resin material supply mechanism 200 according to the second aspect of the first aspect, The total weight measurement unit 250 discharges the plurality of resin materials with measured weights when the measurement results of the weights of the plurality of resin materials exceed a preset range. According to the resin material supply mechanism 200 of the second aspect of the present disclosure, resin sheets T whose weight is greatly different from the desired weight can be discharged together, and resin molding can be performed using the resin sheets T whose weight is close to the desired weight. This enables high-precision resin molded products.

The resin material supply mechanism 200 according to the third aspect of the first or second aspect further includes an individual weight measuring unit 220, The individual weight measuring unit 220 individually measures the weight of the resin material sent out by the sending unit 210, and when the measurement result of the weight of the resin material exceeds a preset range, all measured weights are measured. The resin material is discharged. According to the resin material supply mechanism 200 of the third aspect of the present disclosure, it is possible to discharge the resin sheet T whose weight is greatly different from the desired weight, and to perform resin molding using the resin sheet T close to the desired weight. This enables high-precision resin molded products.

In the resin material supply mechanism 200 according to the fourth aspect of any one of the first to third aspects, The total weight measurement unit 250 and the transfer unit 260 are arranged along the movement path of the movement unit 230 . According to the resin material supply mechanism 200 according to the fourth aspect of the present disclosure, the total weight measurement unit 250 can be disposed at an appropriate position, thereby achieving space saving in the entire resin material supply mechanism 200 .

In the resin material supply mechanism 200 according to the fifth aspect of any one of the first to fourth aspects, The moving part 230 includes: A plurality of first placing portions 231 are formed to correspond to a plurality of the resin materials and can place the resin materials; and A plurality of groove portions 232 are respectively formed below the plurality of resin materials placed on the first placing portion 231, The total weight measurement part 250 includes: A plurality of support portions 251 are formed to correspond to the plurality of groove portions 232, can be inserted into the groove portions 232, and can support the resin material from below; and The moving part 255 (elevating part) can raise and lower the plurality of support parts 251 together. According to the resin material supply mechanism 200 of the fifth aspect of the present disclosure, the weights of a plurality of resin materials can be collectively measured with a simple structure.

In the resin material supply mechanism 200 according to the sixth aspect of the fifth aspect, The moving part 230 includes a first rolling prevention part 233 that prevents the resin material placed on the first placing part 231 from rolling, The total weight measurement part 250 includes a second rolling prevention part 252 that prevents the resin material supported by the supporting part 251 from rolling, A second placement portion 251a having a V-shaped cross-sectional view is formed on the upper surface of the support portion 251 . According to the resin material supply mechanism 200 of the sixth aspect of the present disclosure, the resin material can be effectively prevented from rolling. In particular, in this embodiment, in order to secure a space for inserting the support portion 251 below the resin sheet T, it is assumed that the depth of the first placing portion 231 on which the resin sheet T is placed becomes shallow and the resin sheet T rolls easily. Therefore, by providing the first rolling prevention portion 233 on the upper surface of the moving portion 230, the resin sheet T can be effectively prevented from rolling.

The resin molding apparatus 1 of the seventh aspect of the present disclosure includes: The resin material supply mechanism 200 according to any one of the first to sixth aspects. According to the resin molding apparatus 1 of the seventh aspect of the present disclosure, the total weight of the resin sheet T can be measured with high accuracy. Thereby, the volume of the resin sheet can be calculated with high accuracy based on the total weight of the resin sheet T, and even higher accuracy of the resin molded product can be achieved.

The resin molding apparatus 1 according to the eighth aspect of the seventh aspect includes: The lower mold 110 holds the substrate 2; The upper mold 140 is composed of an upper mold side block 142 (side block) and an upper mold cavity block 143 (cavity block), that is, the upper mold cavity block 143 is arranged to be able to move up and down relative to the upper mold side block 142 (Mold cavity block) forms mold cavity C; The mold locking mechanism 190 (clamping mechanism) clamps the lower mold 110 and the upper mold 140; The transfer mechanism 180 supplies resin material to the mold cavity C through the plunger 182; and The control unit 18 performs filling rate corresponding control (step S60 and step S80 in the second control mode) by using a method based on the volume of the wafer 2 a arranged on the substrate 2 and the volume of the resin material (resin sheet T). Based on the calculated relationship between the resin filling rate of the cavity C and the position of the plunger 182 , operations related to resin molding are controlled based on the arrival of the plunger 182 at a position corresponding to the predetermined resin filling rate. , The volume of the resin material is calculated based on the weights of the plurality of resin materials measured by the total weight measurement unit 250 of the resin material supply mechanism 200 . According to the resin molding apparatus 1 according to the eighth aspect of the present disclosure, a highly precise resin molded product can be manufactured. That is, the resin filling rate can be grasped with high accuracy based on the actually used resin sheet T and the volume of the wafer 2 a of the substrate 2 , and therefore each part can be controlled based on the resin filling rate. This can improve the accuracy of resin molded products.

The resin molding device 1 according to the ninth aspect of the eighth aspect further includes: The frame measurement unit 12 (wafer volume measurement unit) measures the volume of the wafer 2a arranged on the substrate 2; and The calculation unit (control unit 18 ) calculates the relationship between the resin filling rate and the position of the plunger 182 based on the measurement results of the frame measurement unit 12 and the total weight measurement unit 250 . According to the resin molding apparatus 1 of the ninth aspect of the present disclosure, the position of the plunger 182 (resin filling rate) can be grasped based on the actually measured volumes of the wafer 2 a and the resin material. Therefore, for example, even if the resin material (resin sheet T) or the wafer Even if the volume of 2a is deviated, high-precision control is possible.

The manufacturing method of a resin molded product according to the tenth aspect of the present disclosure is a manufacturing method of a resin molded product using the resin molding apparatus 1 according to any one of the seventh to ninth aspects, and includes: The wafer volume measuring step (step S10) measures the volume of the wafer 2a arranged on the substrate 2; The resin volume measuring step (step S10) measures the volume of the resin material; The plunger position calculation step (step S20) calculates the relationship between the resin filling rate of the mold cavity C and the position of the plunger 182 based on the measured volume of the wafer 2a and the volume of the resin material; and The filling rate corresponding control step (step S60 and step S80 in the second control mode) controls operations related to resin molding when the plunger 182 reaches a position corresponding to a predetermined resin filling rate. The method for manufacturing a resin molded article according to the tenth aspect of the present disclosure can manufacture a resin molded article with high precision. That is, the resin filling rate can be grasped with high accuracy based on the actually used resin sheet T and the volume of the wafer 2 a of the substrate 2 , and therefore each part can be controlled based on the resin filling rate. This can improve the accuracy of resin molded products.

1:Resin molding device 10: Supply module 11: Frame delivery department 12:Frame measurement department 13: Frame supply department 17:Loader 18:Control Department 100: Lower mold setting department 101: Lower mold movable base 102: Lower mold installation department 110: Lower mold 111: Lower mold side block 112:tank block 113: Lower mold cavity block 114: Lower mold column 115: Lower mold elastic member 120: Lower mold cavity adjustment mechanism 121: The first wedge-shaped component of the lower mold 122: The second wedge-shaped component of the lower mold 123: Lower mold wedge member driving part 130: Upper mold setting department 131: Upper mold fixed base 132: Upper mold installation department 132a: Support Department 133:Heating plate 140: Upper mold 141: Upper mold base 142: Upper mold side block 142a: Ventilation slot 143: Upper mold cavity block 144:Remnant block 144a: Remaining materials department 144b:Runner part 144c, 144d: connection slot 145: Upper mold support 146: Upper mold column 150: coil spring 160: Upper mold cavity adjustment mechanism 161: Upper mold cavity block holding member 162: Upper mold cavity block driving part 163:Restricted components 164: Upper mold elastic member 165: The first wedge-shaped component of the upper mold 166: The second wedge-shaped member of the upper mold 167: Upper mold wedge member driving part 170: Ventilation hole opening and closing mechanism 171:Vent hole pin 172: Ventilation hole drive part 180:Transfer institution 181: Transfer to driver department 182:Plunger 183: Plunger load measurement part 190: Mold clamping mechanism 191:Fixed disk 192:Pillar 193:Driving mechanism 194: Clamping load measurement part 2:Substrate 2a:wafer 20:Resin molding module 200: Resin material supply organization 210: Delivery Department 220:Individual weight measurement department 221:Main part 221a: Placing part 222:Weight Inspection Department 230:Mobile Department 231: First placement part 232: Groove 233: First rolling prevention part 240:Collet 250:Total weight measurement department 251:Support Department 251a: Second placement part 252: Second rolling prevention part 253:Connection Department 254:Weight Inspection Department 255:Mobile Department 260: Handover Department 261: Containment Department 262:Rotation axis 270:Extrusion mechanism 271:Extrusion department 272:Support Department 30:Move out the module 31:Unloader 32:Substrate receiving section B, D, F, L, R, U: Arrow RF: release film C:Mold cavity CL1, CL2, Cldown, CLM, CLM1, CLM2: clamping load CLf: clamping load (final clamping load) P0, P25, P50, P75, P100: position S10～S130: steps T:Resin sheet t1～t9: time Trf: plunger load

FIG. 1 is a schematic plan view showing the overall structure of a resin molding apparatus according to one embodiment. FIG. 2 is a front cross-sectional view showing the structure of a resin molding module according to one embodiment. FIG. 3( a ) is a schematic plan view showing the structure of the lower mold according to one embodiment as viewed from the mold surface side (from above). FIG. 3( b ) is a schematic bottom view showing the structure of the upper mold according to one embodiment as viewed from the mold surface side (from below). (a) of FIG. 4 is a schematic plan view showing a connecting groove connecting the remaining material parts. (b) of FIG. 4 is a schematic plan view showing an example in which the remaining parts are connected via the mold cavity. (a) of FIG. 5 is a front cross-sectional view showing a state in which the depth of the mold cavity becomes shallow when clamped by the mold clamping mechanism. (b) of FIG. 5 is a front cross-sectional view showing a state in which the depth of the mold cavity becomes deeper when the resin is supplied by the plunger. FIG. 6 is a flowchart showing an example of a method of manufacturing a resin molded product. 7 is a diagram showing temporal changes in the clamp load, plunger position, and plunger load in the first control mode. FIG. 8 is a flowchart showing a specific example of filling rate corresponding control. (a) of FIG. 9 is a front cross-sectional view of the lower mold and the upper mold in a mold-locked state. (b) of FIG. 9 is a front cross-sectional view of the lower mold and the upper mold showing a state in which the clamping load has been reduced. FIG. 10 is a diagram showing temporal changes in the clamp load, plunger position, and plunger load in the second control mode. FIG. 11 is a perspective view showing the structure of the resin material supply mechanism. FIG. 12 is a plan view showing the structure of the resin material supply mechanism. Fig. 13 is a front view showing the delivery unit, individual weight measurement unit, moving unit and chuck. FIG. 14 is an enlarged perspective view and a partially enlarged side view showing the moving part and the total weight measuring part. (a) of FIG. 15 is a side view showing a state in which the support part is inserted into the groove part. (b) of FIG. 15 is a partial front cross-sectional view showing a state in which the support part is inserted into the groove part. (c) of FIG. 15 is a side view showing a state in which the resin sheet is lifted up by the support portion. (d) of FIG. 15 is a partial front cross-sectional view showing a state in which the resin sheet is lifted up by the support portion.

200: Resin material supply organization

210: Delivery Department

220:Individual weight measurement department

221:Main part

221a: Placing part

222:Weight Inspection Department

230:Mobile Department

231: First placement part

232: Groove

233: First rolling prevention part

240:Collet

250:Total weight measurement department

251:Support Department

252: Second rolling prevention part

253:Connection Department

254:Weight Inspection Department

255:Mobile Department

260: Handover Department

261: Containment Department

262:Rotation axis

270:Extrusion mechanism

271:Extrusion department

272:Support Department

B, D, F, L, R, U: Arrow

Claims (10)

A resin material supply mechanism includes: The sending part sends out the resin materials in sequence; a total weight measuring unit that collectively measures the weight of a plurality of the resin materials sent out by the sending unit; a transfer unit that transfers the plurality of resin materials sent out by the sending unit to a transfer mechanism that transfers the resin materials to a mold; and The moving part moves the resin material between the sending part, the total weight measuring part and the transfer part. The resin material supply mechanism according to claim 1, wherein, The total weight measurement unit discharges the plurality of resin materials with measured weights when the measurement results of the weights of the plurality of resin materials exceed a preset range. The resin material supply mechanism as described in claim 1 or 2, further including an individual weight measuring unit, The individual weight measuring unit individually measures the weight of the resin material sent out by the sending unit, and when the measurement result of the weight of the resin material exceeds a preset range, the measured weight of the resin is Material discharge. The resin material supply mechanism according to any one of claims 1 to 3, wherein, The total weight measurement unit and the transfer unit are arranged along the movement path of the movement unit. The resin material supply mechanism according to any one of claims 1 to 4, wherein, The mobile part includes: A plurality of first placing portions are formed corresponding to a plurality of the resin materials and capable of placing the resin materials; and A plurality of groove portions are respectively formed below the plurality of resin materials placed on the first placing portion, The total weight measurement part includes: A plurality of support parts formed to correspond to a plurality of the groove parts, capable of being inserted into the groove parts, and capable of supporting the resin material from below; and The lifting part can lift a plurality of the support parts together. The resin material supply mechanism according to claim 5, wherein, The moving part includes a first rolling prevention part that prevents the resin material placed on the first placing part from rolling, The total weight measurement part includes a second rolling prevention part that prevents the resin material supported by the supporting part from rolling, A second placement portion having a V-shaped cross-section is formed on the upper surface of the support portion. A resin molding device including the resin material supply mechanism according to any one of claims 1 to 6. The resin molding device according to claim 7, including: The lower mold holds the substrate; The upper mold forms a mold cavity by the side block and the following mold cavity block, that is, the mold cavity block that is arranged to be able to move up and down relative to the side block; A clamping mechanism clamps the lower mold and the upper mold; a transfer mechanism that supplies the resin material to the mold cavity through a plunger; and The control unit performs filling rate corresponding control using the relationship between the resin filling rate of the mold cavity and the position of the plunger calculated based on the volume of the wafer arranged on the substrate and the volume of the resin material, so as to When the plunger reaches the position corresponding to the predetermined resin filling rate, actions related to resin molding are controlled. The volume of the resin material is calculated based on the weights of the plurality of resin materials measured by the total weight measurement unit of the resin material supply mechanism. The resin molding device according to claim 8, further comprising: a wafer volume measurement unit that measures the volume of the wafer arranged on the substrate; and The calculation unit calculates the relationship between the resin filling rate and the position of the plunger based on the measurement results of the wafer volume measurement unit and the total weight measurement unit. A method for manufacturing a resin molded article using the resin molding device according to any one of claims 7 to 9, and comprising: The wafer volume measuring step measures the volume of the wafer arranged on the substrate; The resin volume measuring step is to measure the volume of the resin material; The plunger position calculation step is to calculate the relationship between the resin filling rate of the mold cavity and the position of the plunger based on the measured volume of the wafer and the volume of the resin material; and The filling rate corresponding control step controls operations related to resin molding when the plunger reaches a position corresponding to a predetermined resin filling rate.

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