TWI809934B - Resin molding device, and method of manufacturing resin molded product - Google Patents

Abstract

The present invention provides a resin molding device capable of grasping resin pressure in detail. The resin molding device includes: a lower mold, which is formed with a tank for containing resin materials; an upper mold, which is arranged opposite to the lower mold and has a scraping pool part formed at a part facing the tank; a plunger, which can be accommodated in The resin material in the tank is transferred; and a first sensor is provided at a position facing the plunger in the upper die, or at the front end of the plunger, and detects pressure-related value is checked.

Description

Resin molding device, and method of manufacturing resin molded product

The present invention relates to a resin molding device and a method for manufacturing a resin molded product.

Patent Document 1 discloses a resin molding apparatus provided with a pressure sensor for measuring resin pressure (cavity pressure) inside a cavity. Specifically, Patent Document 1 discloses a structure in which a pressure sensor is arranged near a gate and at a position away from the gate in a mold cavity. Based on the resin pressure measured by the pressure sensor, the operation of the transfer mechanism is controlled, whereby the resin pressure or the filling speed of the resin can be adjusted. [Prior art literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2019-1122

[Problem to be Solved by the Invention]

However, in the technology described in Patent Document 1, since the pressure sensor is installed in the cavity, the resin pressure cannot be measured before the resin material reaches the cavity, and it is difficult to measure the resin pressure in detail. Since the resin pressure is used, for example, to control the conveying mechanism or set the curing time, a technology capable of grasping the resin pressure in more detail has been demanded.

The present invention is made in view of the above situation, and the problem to be solved is to provide a resin molding apparatus and a method of manufacturing a resin molded product capable of grasping resin pressure in detail. [Means to solve the problem]

The problem to be solved by the present invention is as described above. In order to solve the problem, the resin molding device of the present invention includes: a lower mold formed with a pot for accommodating resin materials; A cull portion is formed at a portion facing the tank; a plunger capable of transferring the resin material accommodated in the tank; and a first sensor provided in the upper mold A position facing the plunger, or a front end portion of the plunger, and a value related to pressure is detected.

Moreover, the manufacturing method of the resin molded article of this invention is resin-molding the object to be molded using the said resin molding apparatus. [Effect of the invention]

According to the present invention, the resin pressure can be grasped in detail.

Hereinafter, the directions indicated by arrow U, arrow D, arrow L, arrow R, arrow F, and arrow B shown in the figure are respectively defined as an upward direction, a downward direction, a left direction, a right direction, a front direction, and a rear direction. Be explained.

<Overall structure of resin molding device 1> First, the configuration of a resin molding apparatus 1 according to a first embodiment of the present invention will be described with reference to FIG. 1 . The resin molding apparatus 1 is an apparatus for manufacturing resin molded products by resin-sealing electronic components such as semiconductor wafers (hereinafter simply referred to as “wafer 2 a ”). Especially in this embodiment, the resin molding apparatus 1 which performs resin molding by the transfer molding method is illustrated.

The resin molding apparatus 1 includes a supply module 10 , a resin molding module 20 , and an unloading module 30 as constituent elements. Each constituent element is detachable and replaceable with respect to other constituent elements.

＜Supply module 10＞ The supply module 10 supplies a lead frame (hereinafter, simply referred to as “substrate 2 ”), which is a type of substrate on which the wafer 2 a is mounted, and a resin sheet T to the resin molding module 20 . The substrate 2 is an embodiment of the molding object of the present invention. In addition, in this embodiment, a lead frame is exemplified as the substrate 2, but other than the lead frame, various other substrates (glass epoxy substrates, ceramic substrates, resin substrates, metal substrates, etc.) can also be used. . The supply module 10 mainly includes a frame delivery unit 11 , a frame supply unit 12 , a resin delivery unit 13 , a resin supply unit 14 , a loader 15 and a control unit 16 .

The frame delivery unit 11 transports the unsealed substrate 2 accommodated in a feed box unit (not shown) to the frame supply unit 12 . The frame supply unit 12 receives the substrates 2 from the frame delivery unit 11 , arranges the received substrates 2 appropriately, and transfers them to the loader 15 .

The resin sending part 13 receives the resin sheet T from a stocker (not shown), and conveys the resin sheet T to the resin supply part 14. The resin supply part 14 receives the resin sheet T from the resin delivery part 13, arranges the received resin sheet T suitably, and transfers it to the loader 15.

The loader 15 transports the substrate 2 and the resin sheet T received from the frame supply unit 12 and the resin supply unit 14 to the resin molding die set 20 .

The control unit 16 controls the operation of each module of the resin molding apparatus 1 . Operations of the supply module 10 , the resin molding module 20 and the unloading module 30 are controlled by the control unit 16 . In addition, the operation of each module can be arbitrarily changed (adjusted) using the control unit 16 .

In addition, in this embodiment, the example which provided the control part 16 in the supply module 10 was shown, However, The control part 16 can also be provided in another module. In addition, it is also possible to provide a plurality of control units 16 . For example, it is also possible to provide the control unit 16 for each module or each device, and to individually control the operations of the modules and the like while interlocking with each other.

＜Resin molding die set 20＞ The resin molding die set 20 resin-seals the wafer 2 a mounted on the substrate 2 . In this embodiment, two resin molding die sets 20 are arranged side by side. By performing the resin sealing of the substrate 2 in parallel by using the two resin molding die sets 20, the manufacturing efficiency of the resin molded product can be improved. The resin molding module 20 mainly includes a molding mold (a lower mold 110 and an upper mold 120 ) and a mold clamping mechanism 21 .

The molding dies (the lower die 110 and the upper die 120 ) resin-seal the wafer 2 a mounted on the substrate 2 using a melted resin material. The molding die includes a pair of upper and lower dies, that is, a lower die 110 and an upper die 120 (see FIG. 3 ). A heating unit (not shown) such as a heater is provided on the molding die.

The mold clamping mechanism 21 clamps or opens the forming molds (the lower mold 110 and the upper mold 120 ) by moving the lower mold 110 up and down.

＜Export module 30＞ The unloading module 30 receives the resin-sealed substrate 2 from the resin molding module 20 and unloads it. The unloading module 30 mainly includes an unloader 31 and a substrate storage unit 32 .

The unloader 31 holds the resin-sealed substrate 2 and unloads it to the substrate storage unit 32 . The substrate housing portion 32 accommodates the resin-sealed substrate 2 .

<Overview of the operation of the resin molding device 1> Next, an outline of the operation of the resin molding apparatus 1 configured as described above (the method of manufacturing a resin molded article using the resin molding apparatus 1 ) will be described using FIGS. 1 and 2 .

The manufacturing method of the resin molded article of this embodiment mainly includes a carrying-in step S10, a resin molding step S20, and a carrying-out step S30.

The loading step S10 is a step of loading the substrate 2 and the resin sheet T into the resin molding module 20 .

In the carrying-in step S10 , the frame delivery unit 11 transports the substrate 2 accommodated in the supply box unit (not shown) to the frame supply unit 12 . The frame supply unit 12 properly arranges the received substrates 2 and transfers them to the loader 15 .

Moreover, the resin sending part 13 conveys the resin sheet T received from the stocker (not shown) to the resin supply part 14. The resin supply unit 14 transfers the required number of the received resin sheets T to the loader 15 .

The loader 15 transports the received substrate 2 and the resin sheet T to the molding dies of the resin molding die set 20 . After the substrate 2 and the resin sheet T are transported to the molding die, the process proceeds from the carrying-in step S10 to the resin molding step S20.

The resin molding step S20 is a step of resin-sealing the wafer 2 a mounted on the substrate 2 .

In the resin molding step S20 , the mold clamping mechanism 21 raises the lower mold 110 to close the molding mold. Then, the resin sheet T is heated and melted by a heating unit (not shown) of the molding die, and the substrate 2 is resin-sealed using the produced molten resin. After a predetermined time (curing time) elapses until the resin material hardens, the process proceeds from the resin molding step S20 to the carrying out step S30 . Specifically, the curing time refers to the time from when the later-described conveying shaft 131 stops rising until the resin material is hardened to a level at which the resin molded product can be properly released from the mold when the mold is opened.

The unloading step S30 is a step of receiving the resin-sealed substrate 2 from the resin molding die set 20 and unloading it.

In the carrying out step S30, the mold clamping mechanism 21 opens the forming mold. Then, the resin-sealed substrate 2 is released from the mold. Thereafter, the unloader 31 unloads the substrate 2 from the molding die and accommodates it in the substrate accommodating portion 32 of the unloading die set 30 . At this time, useless portions of the resin-molded substrate 2 (culls, runners, and the like) are appropriately removed.

<Detailed structure of resin molding die set 20> Next, the structure of the resin molding die set 20 will be described in more detail. As shown in FIG. 3 , the resin molding module 20 mainly includes a lower mold 110 , an upper mold 120 , a transmission mechanism 130 , a pressure sensor 140 , a load cell 150 and a mold clamping mechanism 21 .

＜Die 110＞ The lower die 110 forms a lower portion of the forming die. The lower mold 110 mainly includes a tank block 111 and a lower mold cavity block 112 .

The tank block 111 is a portion that accommodates the resin sheet T supplied from the supply module 10 . In the tank block 111 , a plurality of (five in this embodiment) through-holes (tank 111 a ) for accommodating the resin sheet T are formed in a tandem manner (see FIG. 1 ).

The lower mold cavity block 112 forms the bottom surface of the cavity C. As shown in FIG. The lower mold cavity blocks 112 are arranged on the left and right of the tank block 111 respectively. A recess having a shape corresponding to the substrate 2 is appropriately formed on the upper surface of the lower mold cavity block 112 . The substrate 2 can be disposed in the concave portion of the cavity block 112 of the lower mold.

＜Upper mold 120＞ The upper die 120 forms the upper part of the forming die. The upper mold 120 mainly includes a reject pool block 121 and an upper mold cavity block 122 .

The reject pool block 121 is disposed at a position facing the tank block 111 of the lower mold 110 . A groove-shaped reject pool portion 121 a and a runner portion 121 b for guiding the resin material to the cavity C are formed on the lower surface of the reject pool block 121 . The reject pool part 121a is formed in the position which opposes each tank 111a of the lower mold|type 110 up and down.

The upper mold cavity block 122 forms the upper surface of the cavity C. As shown in FIG. The cavity blocks 122 of the upper mold are respectively disposed on the left and right of the reject pool block 121 . The upper mold cavity block 122 is disposed at a position facing the lower mold cavity block 112 . On the bottom surface of the upper mold cavity block 122, a concave portion having a shape corresponding to the resin molded product is appropriately formed.

In addition, in this embodiment, the example in which the runner part 121b or the upper surface of the cavity C was formed in the upper mold|type 120 was shown, but this invention is not limited to this. For example, the runner portion or the lower surface of the cavity C may be formed on the lower mold cavity block 112 of the lower mold 110 .

A cavity C having a shape corresponding to the resin molded product is formed between the upper and lower pairs of the lower mold 110 and the upper mold 120 thus constituted. In addition, the lower mold 110 can move up and down by the clamping mechanism 21 .

<Transfer Mechanism 130> The conveying mechanism 130 shown in FIGS. 3 and 4 supplies the resin material to the cavity C. As shown in FIG. The transmission mechanism 130 mainly includes a transmission shaft 131 , a mounting portion 132 , a plunger 133 and a load cell 134 .

The transmission shaft 131 is a member capable of moving up and down. The transmission shaft 131 can freely move up and down by power transmitted from a driving source (not shown) such as a servo motor or an air cylinder. A plurality of conveying shafts 131 (two in this embodiment) are provided so as to line up in the front-rear direction with respect to one molding die (lower die 110 ) (see FIG. 4 ).

The mounting portion 132 is used for mounting the plunger 133 on the transmission shaft 131 . The attachment portion 132 is formed in a substantially rectangular parallelepiped shape. The mounting portion 132 is provided across the upper portions of the plurality of transmission shafts 131 .

The plunger 133 injects the resin sheet T (resin material) accommodated in the tank 111a of the tank block 111, and transfers it to the cavity C. The plunger 133 is disposed so as to be able to move up and down (ascending) inside the tank 111a. The lower portion of the plunger 133 is attached to the upper portion of the mounting portion 132 via a load cell 150 described later. A plurality of plungers 133 (five in this embodiment) are provided so as to be aligned in the front-rear direction (see FIG. 4 ).

The load cell 134 is used to detect the load applied to the transmission shaft 131 . The load cell 134 is disposed on the upper portion of the transmission shaft 131 (between the transmission shaft 131 and the mounting portion 132 ). The load cell 134 of this embodiment is provided on one of the transmission shafts 131 among the transmission shafts 131 . By detecting the load applied to the transfer shaft 131 using the load cell 134 , the injection force (transfer output) to the resin material by the transfer mechanism 130 can be detected. The transmission output, the moving speed of the plunger 133, and the like can be controlled based on the detection value.

<Pressure sensor 140> The pressure sensor 140 is used to detect the pressure of the resin material transferred to the cavity C. As shown in FIG. The pressure sensor 140 is an embodiment of the first sensor that detects a value related to pressure in the present invention. The pressure sensor 140 can detect the pressure applied to the detection surface based on the deformation amount of the elastically deformable detection surface (diaphragm) provided on the end surface. As the pressure sensor 140 , for example, a thermosetting resin/in-mold pressure sensor (model number: 6167A) manufactured by Kistler Co., Ltd. can be used.

The pressure sensor 140 is provided at a position facing the plunger 133 in the reject tank part 121 a of the reject tank block 121 . More specifically, the pressure sensor 140 is provided at a position overlapping the plunger 133 when viewed from the moving direction of the plunger 133 (up-and-down direction in this embodiment). In this embodiment, the pressure sensor 140 and the plunger 133 are coaxially arranged. That is, the pressure sensor 140 is located on a straight line passing through the center of the plunger 133 in the vertical direction in the sectional view shown in FIG. 3 . At this time, the pressure sensor 140 is located directly above the plunger 133 . The pressure sensor 140 is arranged to be buried in the reject pool block 121 with the detection surface facing downward. The lower end surface (detection surface) of the pressure sensor 140 and the lower surface of the reject pool part 121a are arrange|positioned on substantially the same plane. With such an arrangement, the detection surface of the pressure sensor 140 can be in direct contact with the resin material transferred to the cavity C. As shown in FIG. That is, the pressure sensor 140 can directly detect the pressure of the resin material without going through other components.

As shown in FIG. 4 , a plurality of pressure sensors 140 are provided corresponding to a plurality of plungers 133 . In this embodiment, one pressure sensor 140 is disposed above each of the five plungers 133 . In this way, by providing the pressure sensor 140 corresponding to each plunger 133 in the reject pool block 121, the resin pressure of each plunger 133 can be individually detected, so that the detection result can be flexibly used in resin molding. Control of the operation of the device 1, grasp of the state during resin molding, etc.

The load cell 150 is used to detect the load applied to the plunger 133 . The load cell 150 is an embodiment of the second sensor for detecting force-related values of the present invention. The load cell 150 is disposed under the plunger 133 (between the plunger 133 and the mounting portion 132 ). In this embodiment, a plurality of load cells 150 are provided corresponding to a plurality of plungers 133 . In this embodiment, one load cell 150 is provided at the lower part of each of the five plungers 133 .

＜How to determine the curing time＞ Next, a method of determining the curing time based on the detection value of the pressure sensor 140 will be described.

FIG. 5 shows an example of temporal changes in the detection value of the pressure sensor 140 when the resin material is transferred to the cavity C and the substrate 2 is resin-sealed in the resin molding step S20 (see FIG. 2 ). The horizontal axis of FIG. 5 represents the elapsed time from the time point when the transfer of the resin material by the transfer mechanism 130 is started. The vertical axis of FIG. 5 represents the detection value of the pressure sensor 140 (ie, the pressure of the resin material). Furthermore, below, for convenience of explanation, the pressure of the resin material detected by the pressure sensor 140 is referred to as “resin pressure”.

The conveying shaft 131 starts to rise by the conveying mechanism 130, and the transfer of the resin material starts. Then, the resin material extruded from the tank block 111 by the plunger 133 immediately contacts the pressure sensor 140 immediately above the plunger 133 (see FIG. 3 ). Therefore, as shown in FIG. 5 , the pressure sensor 140 can detect the resin pressure immediately after starting to transfer the resin material. In addition, the three lines shown in FIG. 5 show the detection result obtained by the detection by three pressure sensors 140 among five pressure sensors 140 provided as an example.

When the conveyance mechanism 130 starts to transfer the resin material, the resin material is supplied to the cavity C through the reject pool part 121a and the runner part 121b. As shown in FIG. 5 , the resin pressure gradually increases while fluctuating up and down according to the flow resistance when the resin material flows through the runner portion 121 b and the like from the start of the transfer of the resin material to time t1 .

When the injection of the resin material into the cavity C is completed at time t1, after time t1 until the curing time elapses, the conveying mechanism 130 stops the lifting of the conveying shaft 131 while applying a predetermined pressure to the injected resin material, and Maintain this state. After the curing time elapses (in the example of FIG. 5 , after time t2 is reached), the process proceeds to the unloading step S30 (see FIG. 2 ), and the resin-sealed substrate 2 is unloaded from the molding die.

Here, from the viewpoint of improving the quality of the resin molded product and increasing the efficiency of production, it is important to determine the value of the curing time. In this embodiment, the curing time can be determined as an appropriate value based on the resin pressure detected by the pressure sensor 140 .

As shown in FIG. 5 , after the injection of the resin material into the cavity C is completed (after time t1 ), the resin pressure gradually decreases. The reason for this is that the resin material gradually hardens and shrinks, and the pressure applied to the pressure sensor 140 decreases. Furthermore, after a certain amount of time has elapsed (after time t2), the resin pressure is substantially constant. This is because the hardening of the resin material is almost completed, and the shrinkage of the resin material is completed.

Therefore, the time t2 when the decrease of the resin pressure is completed and the resin pressure becomes almost constant is determined as the curing time, so that after the curing of the resin material is completed, it is possible to transfer to the unloading step S30 without needlessly waiting for a long time. The curing time can be determined in advance by performing resin molding in an experimental manner and detecting the time change of the resin pressure before actually starting to manufacture the resin molded product.

In addition, the determination of the curing time can also be automatically performed by the control unit 16 . For example, based on the detection result of the pressure sensor 140 shown in FIG. Determined as curing time.

<How to detect the dirt on the tank 111a> Next, a method of comparing the detection values of the pressure sensor 140 and the load cell 150 to detect the presence or absence of dirt in the tank 111a will be described.

FIG. 6 schematically shows a state in which dirt A adheres to the inside of the tank 111 a (the inner surface of the tank 111 a ). It is considered that the dirt A caused by the resin material adhered to the inside of the tank 111 a as shown in FIG. 6 due to repeated resin molding. If the dirt A adheres to the inside of the tank 111a, the sliding of the plunger 133 may be hindered, and the resin material may not be normally transferred to the cavity C. Therefore, it is desirable to detect the presence or absence of the dirt A in the tank 111a and clean it at an appropriate timing.

In this embodiment, the detected values of the pressure sensor 140 and the load cell 150 can be compared to detect whether there is dirt A in the tank 111a. Specifically, the detection value of the pressure sensor 140 when the plunger 133 is raised and the resin material is injected into the cavity C (up to time t1 in FIG. 5 ) when no dirt A adheres to the tank 111 a There is a certain relationship with the detection value of the load cell 150 corresponding to the pressure sensor 140 .

On the other hand, when the dirt A adheres to the inside of the tank 111 a, the sliding resistance of the plunger 133 increases, so that the detection value of the load cell 150 increases relative to the detection value of the pressure sensor 140 . By detecting such a change in the relationship between the detection value of the pressure sensor 140 and the detection value of the load cell 150 , it is possible to detect the adhesion of the dirt A in the tank 111 a. And by detecting the increase of the detection value of the load cell 150 relative to the detection value of the pressure sensor 140, not only the presence or absence of the dirt A, but also the amount of the dirt A (fouling condition) can be detected.

In this embodiment, when the resin molded product is manufactured, the control unit 16 compares the detection value of the pressure sensor 140 with the detection value of the load cell 150 to detect a change in the sliding resistance of the plunger 133, thereby rapidly The dirt A of the tank 111a is accurately detected, and the tank 111a is cleaned at an appropriate timing. Here, the time of manufacture of the resin molded product refers to the time when the plunger 133 is raised and the resin material is injected into the cavity C, for example.

Especially in this embodiment, since the pressure sensor 140 is arranged directly above the plunger 133 (on the extension line of the sliding direction of the plunger 133), the pressure of the resin material extruded by the plunger 133 does not pass through the gate. The channel portion 121b and the like are detected by the pressure sensor 140 . Therefore, the detection value of the pressure sensor 140 is not easily affected by the flow resistance of the resin material, and the relationship between the detection value of the pressure sensor 140 and the detection value of the load cell 150 can be clearly grasped. Therefore, the dirt A can be detected with high precision.

Furthermore, the presence or absence of the dirt A in the tank 111 a can be detected using the detection value of the load cell 134 (see FIG. 4 ) provided on the transmission shaft 131 instead of the detection value of the load cell 150 provided on each plunger 133 . In this case, by comparing the sum of the detection values of the load cell 134 provided on the transfer mechanism 130 with the sum of the detection values of the pressure sensor 140 which detects the pressure of the resin transferred by the transfer mechanism 130 , the dirt A of the tank 111a can be detected. For example, in this embodiment (refer to FIG. 4 ), by comparing the detection value of one load cell 134 provided on the transmission shaft 131 with the total value of detection values of five pressure sensors 140, the tank 111a can be detected. Dirt A.

<Second Embodiment> Hereinafter, a modified example (second embodiment) of the arrangement of the pressure sensor 140 will be described.

In the above-mentioned first embodiment (see FIG. 3 etc.), an example in which the pressure sensor 140 is provided in the reject tank part 121a of the reject tank block 121 is shown, but the arrangement of the pressure sensor 140 is not the same. limited to this. In the second embodiment (see FIG. 7 ), an example in which the pressure sensor 140 is provided at the tip of the plunger 133 is shown.

As shown in FIG. 7 , the pressure sensor 140 of the second embodiment is arranged at the center of the plunger 133 (on the axis of the plunger 133 ). The pressure sensor 140 is provided buried in the plunger 133 with the detection surface facing upward. The upper end surface (detection surface) of the pressure sensor 140 is arranged substantially on the same plane as the upper surface of the plunger 133 . With such an arrangement, the detection surface of the pressure sensor 140 can be in direct contact with the resin material transferred to the cavity C. As shown in FIG.

By using the pressure sensor 140 of the second embodiment, the resin pressure can be detected immediately after the transfer of the resin material by the transfer mechanism 130 is started, similarly to the first embodiment. In addition, determination of the curing time and detection of the dirt A in the tank 111a can be performed using the pressure sensor 140 similarly to the first embodiment.

As described above, the resin molding apparatus 1 of the embodiment includes: a lower mold 110 formed with a tank 111a for containing a resin material; A reject pool part 121a is formed; a plunger 133 capable of transferring the resin material accommodated in the tank 111a; and a pressure sensor 140 (first sensor) is provided in the upper mold 120 The position facing the plunger 133 (refer to FIG. 3 ) or the front end portion of the plunger 133 (refer to FIG. 7 ), and detect values related to pressure.

With such a configuration, the resin pressure can be grasped in detail. Specifically, the pressure sensor 140 provided at the position facing the plunger 133 or at the front end of the plunger 133 can detect the resin pressure immediately after the resin material is transferred by the plunger 133 . Based on the resin pressure detected as described above, it is possible to determine the curing time, the cleaning time of the tank 111a, and the like.

In addition, if a pressure sensor is directly provided in the cavity C to detect resin pressure, traces of the pressure sensor will be formed on the surface of the product after resin molding. When resin-sealed products are singulated into final products, if there are products with traces of pressure sensors on the appearance and products without traces of pressure sensors, these may not be Considered a product of the same quality, it is therefore subpar. In contrast, in the present embodiment (the first embodiment and the second embodiment), since the pressure sensor 140 is not directly provided in the cavity C, the quality of the product will not be affected.

In addition, in order to grasp the resin pressure, a structure may be conceived in which a pressure sensor is provided on the ejector pin facing the cavity C to detect the pressure applied to the ejector pin, thereby detecting the resin pressure. However, due to the sliding resistance of the ejector pin, there will be an error between the actual resin pressure and the detection value of the pressure sensor, so it is difficult to detect the correct resin pressure. On the other hand, in this embodiment (the first embodiment and the second embodiment), since the pressure sensor 140 is provided at the portion (the front end portion of the plunger 133 , etc.) that directly contacts the resin material, no error, and the resin pressure can be detected with high precision.

In addition, there are generally products (resin molding device 1) in which no pressure sensor or ejector pin is installed in the cavity C. In such a product, a configuration in which the pressure sensor 140 is provided at the tip of the plunger 133 or the like like this embodiment (the first embodiment and the second embodiment) is useful.

In addition, the pressure sensor 140 is provided in plural corresponding to the plural plungers 133 provided.

With such a configuration, the pressure of the resin transferred by each plunger 133 can be individually detected, and the resin pressure can be grasped in more detail.

In addition, the resin molding apparatus 1 further includes a control unit 16 for determining a curing time based on the detection value of the pressure sensor 140 .

With such a configuration, the curing time can be easily determined. In particular, as in the above-mentioned embodiment, since the resin pressure detected in detail by the pressure sensor 140 can be used to determine the curing time, an appropriate curing time can be set.

In addition, the resin molding device 1 further includes a load cell 150 (second sensor), which is provided at a part of the plunger 133 different from the front end, and is applied to the plunger. 133 to detect force-related values, and the control unit 16 compares the detection value of the pressure sensor 140 with the detection value of the load cell 150 .

With such a configuration, it is possible to grasp by comparison what value the resin pressure takes with respect to the load applied to the plunger 133 . In addition, the comparison result can be used as information for grasping the state of the resin molding apparatus 1 (for example, whether or not there is an abnormality in the resin pressure).

In addition, the control unit 16 detects the sliding resistance of the plunger 133 by comparing the detection value of the pressure sensor 140 with the detection value of the load cell 150 .

With such a configuration, the presence or absence of dirt in the tank 111a provided with the plunger 133 can be detected. Thereby, tank 111a can be cleaned at an appropriate timing.

In addition, the load cells 150 are provided in plural corresponding to the plural plungers 133 provided.

With such a configuration, it is possible to individually detect the load applied to each plunger 133 . Thereby, the presence or absence of dirt in each tank 111a can be individually detected.

In addition, the manufacturing method of the resin molded article of this embodiment uses the resin molding apparatus 1 to resin-mold the object to be molded.

With such a configuration, the resin pressure can be grasped in detail. In addition, since it is possible to determine an appropriate curing time and detect the presence or absence of dirt in the tank 111a, it is possible to improve the quality of the resin molded product or improve the production efficiency.

As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment, It can change suitably within the range of the technical idea of invention described in the claim.

For example, the components (the supply die set 10 and the like) used in the resin molding apparatus 1 of the above-mentioned embodiment are examples, and can be attached, detached or replaced as appropriate. For example, the number of resin molding die sets 20 can be changed. In addition, the structure and operation|movement of the component (supply module 10 etc.) used for the resin molding apparatus 1 of this embodiment is an example, and can be changed suitably.

Moreover, although the example which used the sheet-shaped resin material (resin sheet T) was shown in the said embodiment, this invention is not limited to this. That is, as the resin material, not only a sheet-like resin material, but also a resin material in any form such as a granular form (including a granular form and a powder form) and a liquid form can be used.

In addition, the number of objects of the conveyance shaft 131, the plunger 133, the tank 111a etc. which were illustrated in the said embodiment is not limited, It can change arbitrarily. In addition, the number of various sensors (the load cell 134 , the pressure sensor 140 and the load cell 150 ) is not particularly limited, and can be changed arbitrarily.

In addition, in the said embodiment, the example which provided the several pressure sensor 140 corresponding to the several plunger 133 was shown, but this invention is not limited to this. That is, there is no need to provide the same number of pressure sensors 140 as the number of plungers 133 , and the number of pressure sensors 140 can be reduced or increased compared with the number of plungers 133 . For example, only one pressure sensor 140 may be provided corresponding to any one plunger 133 . In addition, similarly, the number of load cells 150 does not need to be the same as that of the plurality of plungers 133 , and the number can be set arbitrarily.

In addition, in the said 1st Embodiment, the example which provided the pressure sensor 140 in the reject pool block 121 (the reject tank part 121a) was shown, but this invention is not limited to this. The pressure sensor 140 is not limited to the attached member as long as it is installed at a position facing the plunger 133 or at the front end of the plunger 133 and can detect the pressure of the resin immediately after starting to transfer the resin.

Moreover, in the said embodiment, the example (refer FIG. 140 is provided at the front end of the plunger 133 (see FIG. 7 ), but the present invention is not limited thereto. That is, the pressure sensor 140 is not provided only in any one of the reject pool block 121 or the plunger 133 , but can also be provided in both.

In addition, in the above-described embodiment, an example was shown in which the control unit 16 determines the curing time or detects the sliding resistance (presence or absence of dirt A) of the plunger 133, but the present invention is not limited thereto, and the curing time and the like may be It is up to human judgment to decide. In this case, for example, the control unit 16 can also be configured as follows: by outputting the detection value of the pressure sensor 140 or the like, or the comparison result between the detection value of the pressure sensor 140 and the detection value of the load cell 150, etc. To an output device such as a display, the necessary information such as the determination of the curing time is reported to people.

In addition, in the above-described embodiment, the pressure sensor 140 is used, but the pressure can also be calculated from the value and area detected by using a sensor that detects force. In addition, in the above-mentioned embodiment, the load cell 134 which detects a load is used, but the sensor which detects a force can be used instead.

1: Resin molding device 2: Substrate 2a: Wafer 10:Supply module 11: Frame sending part 12:Frame supply department 13: Resin sending part 14:Resin supply department 15: Loader 16: Control Department 20: Resin molding module 21: Clamping mechanism 30: Move out the module 31: Unloader 32: Substrate storage unit T: resin sheet 110: lower mold 111: tank block 111a: tank 112: Lower mold cavity block 120: upper mold 121: Picking pool block 122: upper mold cavity block 121a: Picking tank part 121b: sprue part 130: Transmission mechanism 131: transmission shaft 132: Installation department 133: plunger 134: load cell C: Cavity 140: Pressure sensor 150: load cell S10: Moving in steps S20: Resin molding step S30: Move out steps t1, t2: time A: Dirt

FIG. 1 is a schematic plan view showing the overall structure of a resin molding apparatus according to a first embodiment. FIG. 2 is a flow chart showing an example of a method of manufacturing a resin molded product. Fig. 3 is a front sectional view showing the structure of a molding die. FIG. 4 is a schematic diagram showing the arrangement of a transfer mechanism, a pressure sensor, and a load cell. FIG. 5 is a graph showing an example of temporal changes in resin pressure. Fig. 6 is a front sectional view schematically showing a state in which dirt adheres to the inside of the tank. Fig. 7 is a front sectional view showing the structure of a molding die according to a second embodiment.

2: Substrate 2a: Wafer 20: Resin molding module 110: lower mold 111: tank block 111a: tank 112: Lower mold cavity block 120: upper mold 121: Picking pool block 121a: Picking tank part 121b: sprue part 122: upper mold cavity block 130: Transmission mechanism 131: transmission shaft 132: Installation Department 133: plunger 134: load cell C: Cavity 140: Pressure sensor 150: load cell

Claims (6)

A resin molding device, comprising: a lower mold, which is formed with a tank for containing resin materials; an upper mold, which is arranged opposite to the lower mold and has a reject pool part formed at a part facing the tank; a plunger, which can be accommodated in The resin material in the tank is transferred; the first sensor is installed at a position facing the plunger in the upper die, or at the front end of the plunger, and detects the pressure-related value detection; the second sensor is provided at a portion of the plunger different from the front end portion, and detects a value related to a force applied to the plunger; and a control unit converts the first The detection value of a sensor is compared with the detection value of the second sensor. The resin molding device according to claim 1, wherein a plurality of the first sensors are provided corresponding to a plurality of the plungers. The resin molding apparatus according to claim 1 or claim 2, wherein the control unit determines a curing time based on a detection value of the first sensor. The resin molding apparatus according to claim 1 or claim 2, wherein the control unit detects the The sliding resistance of the plunger. The resin molding device according to claim 1 or claim 2, wherein a plurality of the second sensors are provided corresponding to a plurality of the plungers. A method for manufacturing a resin molded product, using such as request item 1 to please The resin molding apparatus according to any one of item 5 performs resin molding of an object to be molded.

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