TWI795615B - Resin molding device and method for manufacturing resin molded product - Google Patents

Abstract

The present invention improves a resin molded product by reducing the influence of back pressure due to transfer pressure. The present invention includes: a mold clamping mechanism, clamping a molding die and a molding die; a plunger driving mechanism, moving a plunger within a pot of the molding die; a clamp pressure detection unit, detecting a clamp pressure on a molding die caused by the mold clamping mechanism; a transfer pressure detection unit, detecting a transfer pressure on a resin caused by the plunger driving mechanism; and a control unit, controlling the mold clamping mechanism based on the clamp pressure detected by the clamp pressure detection unit and the transfer pressure detected by the transfer pressure detection unit, wherein when the detected transfer pressure rises, the control unit controls the mold clamping mechanism so that the clamp pressure rises relative to the transfer pressure, and when the detected transfer pressure falls, the control unit controls the mold clamping mechanism so that the clamp pressure becomes a predetermined value regardless of the transfer pressure.

Description

Resin molding device and method for manufacturing resin molded product

The present invention relates to a resin molding device and a method for manufacturing a resin molded product.

Regarding the resin molding apparatus for resin molding by transfer molding, there is a resin molding apparatus in which a molded product is clamped between a lower mold and an upper mold, and a molded product is formed from the lower mold by a plunger. The resin is pressure-fed from the barrel (pot), and the resin is supplied to the cavity (cavity) formed between the lower mold and the upper mold to perform resin sealing.

In the above-mentioned resin molding device, during resin molding, the injection pressure (transmission pressure) of the resin by the plunger acts in the direction of opening the mold as a back pressure (back pressure), so it may act on the molded product. Clamping pressure changes, resulting in resin burrs. In addition, it is conceivable to set the clamping pressure relatively high in consideration of the back pressure, but this may damage the molded product.

Therefore, the resin molding apparatus disclosed in Patent Document 1 is configured to control the clamping pressure in accordance with the injection pressure (transmission pressure) of the resin by the plunger during resin molding. [Prior art literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 11-58435

[Problem to be Solved by the Invention] However, in the above-mentioned resin molding apparatus, the clamping pressure is controlled only by the injection pressure (transmission pressure), and when the transmission pressure drops during resin molding, the clamping pressure also drops, and it is difficult to solve the problem of back pressure.

Therefore, the present invention is made to solve the above-mentioned problems, and its main subject is to reduce the influence of the back pressure due to the transmission pressure and improve the resin molded product. [Technical means to solve the problem]

That is, the resin molding device of the present invention is characterized in that it includes: a mold clamping mechanism for clamping the molding mold; a plunger driving mechanism for moving the plunger in the barrel of the molding mold; a clamping pressure detection unit, detecting the clamping pressure of the molding die by the mold clamping mechanism; a transmission pressure detecting unit detecting the transmission pressure of the plunger driving mechanism to the resin; and a control unit based on the clamping pressure detected by the clamping pressure detecting unit. The clamping pressure and the transmission pressure detected by the transmission pressure detection unit control the mold clamping mechanism, and the control unit adjusts the clamping pressure to the transmission pressure when the detected transmission pressure rises. The mold clamping mechanism is controlled so that the pressure increases, and the mold clamping mechanism is controlled so that the clamping pressure becomes a predetermined value regardless of the transmission pressure when the detected transmission pressure decreases. [Effect of the invention]

According to the present invention thus constituted, it is possible to improve the resin molded product by reducing the influence of the back pressure due to the transmission pressure.

Next, the present invention will be described in more detail with examples. However, the present invention is not limited by the following description.

As described above, the resin molding device of the present invention is characterized in that it includes: a mold clamping mechanism for clamping the forming mold; a plunger driving mechanism for moving the plunger in the barrel of the forming mold; a clamping pressure detection unit , detecting the clamping pressure of the forming mold by the mold clamping mechanism; the transmission pressure detection part, detecting the transmission pressure of the plunger driving mechanism to the resin; and the control part, based on the clamping pressure detection part detected The mold clamping mechanism is controlled by the clamping pressure and the transmission pressure detected by the transmission pressure detection part. When the detected transmission pressure rises, the control part uses the clamping pressure corresponding to the The mold clamping mechanism is controlled so that the transmission pressure increases, and when the detected transmission pressure decreases, the clamping pressure is controlled so that it becomes a predetermined value regardless of the transmission pressure.

According to such a resin molding apparatus of the present invention, when the detected transmission pressure rises, the clamping mechanism is controlled so that the clamping pressure rises corresponding to the transmission pressure, and when the detected transmission pressure decreases, the clamping mechanism is controlled. In this case, the mold clamping mechanism is controlled so that the clamping pressure becomes a predetermined value regardless of the transmission pressure, so that the clamping pressure does not decrease in response to a drop in the transmission pressure, and the amount of back pressure caused by the transmission pressure can be reduced. Improve resin molded products by influence.

Specifically, the control unit preferably controls the mold clamping mechanism so that the clamping pressure becomes a constant value regardless of the transmission pressure when the detected transmission pressure drops. According to the above configuration, the control of the mold clamping mechanism can be simplified.

In addition, the control unit may control the mold clamping mechanism so that the clamping pressure becomes a value that changes in a predetermined relationship regardless of the transmission pressure when the detected transmission pressure drops. Here, regarding the value that changes in a predetermined relationship, for example, a value in which the clamping pressure monotonically increases or decreases linearly or stepwise is conceivable.

As a specific control form, it is desirable that the control unit compares the previous detection value of the delivery pressure with the current detection value of the transmission pressure, and when the current detection value is smaller than the previous detection value , the clamping mechanism is controlled so that the clamping pressure does not drop. Here, the control unit may compare the previous detection value and the current detection value by calculating the difference between the previous detection value and the current detection value of the delivery pressure.

Moreover, the manufacturing method of the resin molded article using the above-mentioned resin molding apparatus is also an aspect of this invention.

<An embodiment of the present invention> Hereinafter, one embodiment of the resin molding apparatus of the present invention will be described with reference to the drawings. In addition, in any of the drawings shown below, for easy understanding, they are appropriately omitted or exaggerated and schematically drawn.

<Overall Configuration of Resin Molding Device 100> The resin molding apparatus 100 of this embodiment is a resin molding apparatus using transfer molding. This resin molding apparatus performs resin molding on, for example, a substrate on which a semiconductor chip is mounted, and uses a cylindrical tablet-shaped thermosetting resin (hereinafter referred to as “resin tablet”) as a resin material. In addition, the "substrate" includes general substrates such as glass epoxy substrates, ceramic substrates, resin substrates, and metal substrates, lead frames, and the like.

Specifically, as shown in FIG. 1 , the resin molding apparatus 100 includes the following modules as constituent elements: a supply module 2 for supplying a substrate W before resin sealing (hereinafter referred to as "substrate W before sealing") and a resin sheet T; For example, two resin molding modules 3A and 3B are used to perform resin molding; and an unloading module 4 is used to unload resin molded products. In addition, the supply module 2, the resin molding module 3A, the resin molding module 3B, and the carry-out module 4 which are constituent elements are each detachable and replaceable from other constituent elements.

In addition, the resin molding apparatus 100 is provided with a conveyance mechanism 5 (hereinafter referred to as "loader (loader) 5") for conveying the pre-sealing substrate W and the resin sheet T supplied from the supply module 2 to the resin molding module 3A and the resin molding module 3B. and a transport mechanism 6 (hereinafter referred to as “unloader 6 ”) that transports the resin molded product that has been resin-molded by the resin molding module 3A and the resin molding module 3B to the unloading module 4 .

The supply module 2 of this embodiment integrates the substrate supply module 7 and the resin supply module 8 .

The substrate supply module 7 has a substrate delivery unit 71 and a substrate supply unit 72 . The substrate delivery unit 71 sends out the unsealed substrate W in the magazine to the substrate alignment unit. The substrate supply unit 72 receives the un-sealed substrates W from the substrate delivery unit 71 , arranges the received un-sealed substrates W in a predetermined direction, and delivers them to the loader 5 .

The resin supply module 8 has a resin delivery unit 81 and a resin supply unit 82 . The resin sending part 81 receives the resin sheet T from the stocker (stocker) mentioned later, and sends the resin sheet T to the resin supply part 82. The resin supply part 82 receives the resin sheet T from the resin delivery part 81, arranges the received resin sheet T in a predetermined direction, and delivers it to the loader 5.

The resin molding block 3A and the resin molding block 3B each have a molded part 31 . As shown in Figure 2, each molding part 31 has the lower die 311 as the forming die that can be lifted, the upper die 312 as the forming die that is fixed on the top of the lower die 311 oppositely, and is used for lower die 311 and upper die. The clamping mechanism 313 of 312 clamping molds.

The lower mold 311 is fixed on the upper surface of the movable plate 314 , and the upper mold 312 is fixed on the lower surface of the upper fixed plate 315 . The mold clamping mechanism 313 clamps or opens the upper mold 312 and the lower mold 311 by moving the movable platen 314 up and down. In addition, the mold clamping mechanism 313 may use a linear motion mechanism that converts the rotation of a servo motor or the like into a linear motion and transmits it to the movable platen 314, or may use, for example, a toggle link. link) and other link mechanisms that transmit a power source such as a servo motor to the movable plate 314 in a link system.

The clamping mechanism 313 is provided with a clamping pressure detector 10 that detects clamping pressure generated when the lower mold 311 and the upper mold 312 are clamped. The clamping pressure detection unit 10 is, for example, a strain gauge, a load cell, or a pressure sensor. The clamping pressure signal detected by the clamping pressure detection unit 10 is sent to the control unit 9 .

On the lower mold 311, a mounting portion 311a for mounting the pre-sealed substrate W conveyed by the loader 5 is formed. Moreover, in the lower mold|type 311, the several cylinder 311b in which the resin sheet T conveyed by the loader 5 is mounted is formed. Furthermore, the lower die 311 is provided with a plunger 316 for injecting the resin sheet T into, for example, the resin passage 312 a and the cavity 312 b formed in the upper die 312 in the cylinder 311 b.

The plunger 316 moves up and down in the cylinder 311b by the plunger driving mechanism 317 . The plunger driving mechanism 317 moves the plunger 316 forward and backward with respect to the lower mold 311, whereby the plunger 316 moves forward and backward in the cylinder 311b. Here, for the plunger driving mechanism 317 , for example, a combination of a servo motor and a ball screw mechanism, a combination of an air cylinder or hydraulic cylinder and a rod (rod), or the like can be used.

The plunger driving mechanism 317 is provided with a transmission pressure detection unit 11 that detects the transmission pressure of the plunger driving mechanism 317 to the resin. More specifically, the transfer pressure is the pressure applied to the plunger 316 when the plunger 316 squeezes the molten resin obtained by heating and melting the resin sheet T in the cylinder 311b. The transmission pressure detection unit 11 is, for example, a strain gauge, a load sensor, or a pressure sensor. The transmission pressure signal detected by the transmission pressure detection unit 11 is sent to the control unit 9 .

In addition, heating parts such as heaters are embedded in the upper mold 312 and the lower mold 311 , respectively. The upper mold 312 and the lower mold 311 are usually heated to about 180° C. by the heating unit.

<Resin molding operation of the resin molding device 100> Hereinafter, the basic operation of resin molding by the resin molding apparatus 100 of this embodiment will be described.

The substrate delivery unit 71 sends out the unsealed substrate W in the cassette to the substrate supply unit 72 . The substrate supply unit 72 arranges the received substrates W before sealing in a predetermined direction, and delivers them to the loader 5 . At the same time, the resin sending part 81 sends out the resin sheet T received from the stocker to the resin supply part 82 . The resin supply unit 82 delivers the required number (four in FIG. 1 ) of the received resin sheets T to the loader 5 .

Next, the loader 5 conveys the received two pre-sealed substrates W and the four resin sheets T to the molding unit 31 at the same time. The loader 5 supplies the pre-sealing substrate W to the mounting portion 311 a of the lower mold 311 , and supplies the resin sheet T to the inside of the cylinder 311 b formed in the lower mold 311 .

Then, the upper mold 312 and the lower mold 311 are clamped using the mold clamping mechanism 313 . Next, the molten resin obtained by heating and melting the resin sheet T in each cylinder 311b is squeezed by the plunger 316 . Thus, molten resin is injected into the cavity 312b formed in the upper mold 312 through the resin passage 312a. Next, the molten resin is hardened by heating the molten resin for a required time required for hardening to form a hardened resin. Thereby, the semiconductor wafer in the cavity 312b and the surrounding substrate are sealed in the cured resin (sealing resin) molded in accordance with the shape of the cavity 312b.

Then, after the time required for curing has elapsed, the upper mold 312 and the lower mold 311 are opened, and the sealed substrate (not shown) is released from the mold. Then, the sealed substrate (resin molded product) resin-sealed by the press part 31 is accommodated in the substrate accommodating part 41 of the carry-out module 4 using the unloader 6 .

The overall operation of the resin molding apparatus 100 including the series of operations described above is controlled by the control unit 9 . The control unit 9 is provided in the supply module 2 in FIG. 1 , but may be provided in another module. In addition, the control unit 9 includes, for example, a dedicated or general-purpose computer including a central processing unit (Central Processing Unit, CPU), an internal memory, an analog-to-digital (Analog-to-Digital, AD) converter, an input-output inverter, and the like.

<Specific control content of the control unit 9> Next, specific control contents of the control unit 9 will be described with reference to FIG. 3 .

(Step S1: The lower mold starts to rise) After the pre-sealing substrate W and the four resin sheets T are supplied to the molding unit 31 , the control unit 9 controls the mold clamping mechanism 313 to raise the lower mold 311 .

(Step S2: clamping pressure detection) At this time, the clamping pressure detection unit 10 provided in the mold clamping mechanism 313 detects the clamping pressure, and sends the clamping pressure signal to the control unit 9 .

(Step S3: clamping pressure, setting value a≦detection value P) The control unit 9 determines whether or not the detected value P of the clamping pressure is equal to or greater than a predetermined set value a (set value a≦detected value P).

When the detection value P is less than the set value a, return to (step S2: detection of clamping pressure), the control unit 9 controls the clamping mechanism 313 to make the lower mold 311 continue to rise, and the clamping pressure detection unit 10 detects the clamping pressure.

(Step S4: The lower mold rises and stops) On the other hand, when the detected value P becomes equal to or greater than the set value a, the control unit 9 controls the mold clamping mechanism 313 to stop the lower mold 311 from ascending.

(Step S5: Start of plunger rising) Then, the control unit 9 controls the plunger drive mechanism 317 to start the plunger 316 to rise. The control unit 9 may start to lift the plunger 316 when the detected value P becomes 80% or more of the clamping pressure of the set value a, etc., and start the lift of the plunger 316 before the detected value P reaches the set value a. In addition, the control of the plunger drive mechanism 317 by the controller 9 has a speed control stage and a pressure control stage, for example, a speed control stage until the plunger position reaches a predetermined position, and a pressure control stage thereafter. The plunger position can be detected by, for example, an encoder of a servo motor as the plunger driving mechanism 317 .

(Step S6: Transmission pressure and plunger position detection) At this time, the transmission pressure detection unit 11 provided in the plunger driving mechanism 317 detects the transmission pressure, and sends the transmission pressure signal to the control unit 9 . In addition, a plunger position detection unit (not shown) provided in the plunger driving mechanism 317 detects the position of the plunger 316 and sends the plunger position signal to the control unit 9 .

(Step S7: transmit pressure and plunger position, setting value α≦detection value X) The control unit 9 determines whether the detected value X of the transmission pressure and the plunger position is equal to or greater than a predetermined set value α (set value α≦detected value X). In addition, here, the detection value X of both the transmission pressure and the plunger position is set as a condition (and (AND) condition) that the detection value X of both the transmission pressure and the plunger position is equal to or greater than the set value α, and the detection value X of either one may be greater than the set value α. Set as a condition (or (OR) condition).

When the detection value X is less than the set value α, return to (step S6: transmission pressure and plunger position detection), the control part 9 controls the plunger driving mechanism 317 to make the plunger 316 continue to rise, and the transmission pressure detection part 11 and the plunger The position detection unit detects the transmission pressure and the position of the plunger.

(Step S8: lower mold rise starts again) On the other hand, when the detected value X is equal to or greater than the set value α, the control unit 9 controls the mold clamping mechanism 313 to start raising the lower mold 311 again. As a result, the clamping pressure increases (see FIG. 4 ).

(Step S9: detection of clamping pressure and transmission pressure) At this time, the clamping pressure detection unit 10 detects the clamping pressure and sends it to the control unit 9 , and the transmission pressure detection unit 11 detects the transmission pressure and sends it to the control unit 9 .

(Step S10: transmit the pressure, the previous detection value≧this detection value) The control unit 9 compares the current detection value of the delivery pressure with the previous detection value, and determines whether the current detection value is equal to or lower than the previous detection value (previous detection value≧current detection value). Here, the detected value this time is the detected value of the delivery pressure newly acquired for performing the process of step S10. The previous detection value is a detection value of the transmission pressure obtained before the current detection value, and may be a detection value obtained before the current detection value or a detection value obtained before a predetermined time.

(Step S11: follow and control the clamping pressure according to the transmission pressure) When the current detection value is greater than the previous detection value, the control unit 9 controls the clamping pressure according to the transmission pressure. That is, the mold clamping mechanism 313 is controlled so that the clamping pressure increases following the increase in the transmission pressure (see FIG. 4 ).

(Step S12: clamping pressure, setting value b≦detection value Q) Then, the control unit 9 judges whether or not the detected value Q of the clamping pressure is equal to or greater than a predetermined set value b (set value b≦detected value Q).

(Step S13: The lower mold rises and stops) When the detected value Q of the clamping pressure is equal to or greater than the set value b, the control unit 9 controls the mold clamping mechanism 313 to stop the lower mold 311 from ascending.

When the detected value Q of the clamping pressure is smaller than the set value b, the control unit 9 proceeds to the next step (step S14: transmit pressure, set value β≦detected value Y).

(Step S14: Transmission pressure, set value β≦detection value Y) Next, the control unit 9 judges whether or not the detected value Y of the transmission pressure is equal to or greater than a predetermined set value β (set value β≦detected value Y).

(Step S15: The plunger rises and stops) When the detected value Y of the transmission pressure is equal to or greater than the set value β, the control unit 9 controls the plunger drive mechanism 317 to stop the plunger 316 from ascending. This completes the control before mold opening during resin molding.

On the other hand, when the detected value Y of the transmission pressure is less than the set value β, return to (step S9: clamping pressure and transmission pressure detection), the control part 9 controls the mold clamping mechanism 313 so that the lower mold 311 continues to rise, clamping The pressure detection unit 10 and the transmission pressure detection unit 11 detect the clamping pressure and the transmission pressure.

(Step S16: Controlling the clamping pressure to be constant) In the above (step S10: transmission pressure, previous detection value≧this detection value), when the current detection value is lower than the previous detection value, the control unit 9 makes the clamping pressure a predetermined value irrespective of the transmission pressure. The control is performed in the manner of a predetermined value (step S16). The control unit 9 of the present embodiment controls the mold clamping mechanism 313 so that the clamping pressure becomes a constant value (see FIG. 4 ). Specifically, the control unit 9 controls the clamping pressure to be constant at the point in time at which the present detection value is detected to be equal to or less than the previous detection value.

In addition, also in this constant control, the clamping pressure detection unit 10 and the transmission pressure detection unit 11 detect the clamping pressure and the transmission pressure (step S9), and the control unit 9 always judges whether the current detection value of the transmission pressure is equal to the previous detection value. value or less (previous detection value≧this detection value) (step S10).

Here, as shown in FIG. 4 , the control unit 9 is set as follows: When switching from the constant control of the clamping pressure to the follow-up control of the clamping pressure, the current detection value exceeds the switching from the follow-up control of the clamping pressure to The detection value when the clamping pressure is under constant control. In addition, a configuration may be adopted in which the follow-up control of the clamping pressure and the constant control of the clamping pressure are switched by comparing the current detected value of the transmission pressure with the immediately previous detected value.

<Effects of this embodiment> According to the resin molding apparatus 100 of the present embodiment, when the detected transmission pressure increases, the clamping mechanism 313 is controlled so that the clamping pressure increases according to the transmission pressure, and when the detected transmission pressure decreases, the clamping mechanism 313 is controlled. Since the mold clamping mechanism 313 is controlled so that the clamping pressure becomes a predetermined value irrespective of the transmission pressure, the clamping pressure does not decrease corresponding to the drop in the transmission pressure, and the effect of the back pressure caused by the transmission pressure can be reduced. Improve resin molded products by influence.

＜Other Modified Embodiments＞ In addition, the present invention is not limited to the embodiments.

For example, as long as the clamping pressure detection part 10 detects the clamping pressure of the mold clamping mechanism 313 on the lower mold 311 and the upper mold 312, it does not need to be installed in the mold clamping mechanism 313, and can also be installed between the mold clamping mechanism 313 and the movable plate 314. , Between the movable plate 314 and the lower mold 311, or between the upper fixed plate 315 and the upper mold 312, etc.

The transmission pressure detector 11 need not be provided in the plunger driving mechanism 317 as long as it detects the transmission pressure of the resin by the plunger driving mechanism 317 , and may be provided between the plunger 316 and the plunger driving mechanism 317 .

In the control flow of the above-mentioned embodiment, after judging (step S12: clamping pressure, setting value b≦detection value Q), it is judged (step S14: transmission pressure, setting value β≦detection value Y), but it can also be reversed, Alternatively, step S12 and step S14 may be processed in parallel.

Furthermore, the control unit 9 may control the mold clamping mechanism 313 so that the clamping pressure becomes a value that changes in a predetermined relationship regardless of the transmission pressure when the detected transmission pressure drops. At this time, it is conceivable that the control unit 9 controls the mold clamping mechanism 313 so that the clamping pressure becomes a value that increases linearly or monotonously in steps. At this time, the clamping pressure is set to an increase amount that does not cause damage. In addition, it is conceivable that the control unit 9 sets the clamping pressure to a value that monotonously decreases linearly or stepwise. In this case, the reduction amount is set to such an extent that the influence of the back pressure due to the transmission pressure can be reduced.

In the above-described embodiment, the configuration in which the two resin molding modules 3A and 3B are connected between the supply module 2 and the carry-out module 4 may be a configuration in which the supply module 2 and the carry-out module 4 are connected to each other. One module is used, and the resin molding module 3A and the resin molding module 3B are connected to the module. In addition, the resin molding apparatus does not have to be modularized into individual modules like the embodiment described above.

In addition, this invention is not limited to the said embodiment, Of course, a various deformation|transformation is possible in the range which does not deviate from the summary.

2: supply module 3A, 3B: Resin molding module 4: Move out the module 5: Transport mechanism (loader) 6: Transport mechanism (unloader) 7: Substrate supply module 8: Resin supply module 9: Control Department 10: Clamping pressure detection part 11: Transmission pressure detection part 31:Molding department 41: substrate housing 71: Substrate sending part 72: Substrate supply department 81:Resin sending part 82: Resin supply department 100: Resin molding device 311: Lower mold (forming mold) 311a: Installation Department 311b: Barrel 312: upper mold (forming mold) 312a: Resin pathway 312b: mold cavity 313: Clamping mechanism 314: Movable disk 315: upper fixed plate 316: plunger 317:Plunger drive mechanism S1～S16: Steps T: resin sheet W: sealed front substrate

FIG. 1 is a plan view schematically showing the configuration of a resin molding apparatus according to the present embodiment. FIG. 2 is a diagram showing a method of manufacturing a resin molded article according to the embodiment. FIG. 3 is a control flow diagram of the embodiment. FIG. 4 is a schematic diagram of temporal changes in transmission pressure and clamping pressure in the embodiment.

S1~S16: Steps

Claims (3)

A resin molding device, comprising: a mold clamping mechanism for clamping a forming mold; a plunger driving mechanism for moving a plunger in a barrel of the forming mold; a clamping pressure detection unit for detecting the impact of the mold clamping mechanism on the the clamping pressure of the molding die; the transmission pressure detection unit detects the transmission pressure of the plunger drive mechanism to the resin; and the control unit based on the clamping pressure detected by the clamping pressure detection unit and the The mold clamping mechanism is controlled by transmitting the transmission pressure detected by the pressure detection unit, and the clamping pressure and the transmission pressure are kept constant until the molding die and the plunger are stopped from rising. The control unit compares the previous detection value of the transmission pressure with the current detection value of the transmission pressure, and when the current detection value is greater than the previous detection value, the clamping pressure corresponds to The mold clamping mechanism is controlled so that the transmission pressure rises, and when the current detection value is smaller than the previous detection value, the clamping pressure becomes a constant value regardless of the transmission pressure. The mode of constant control of the mold clamping mechanism, and when the current detection value exceeds the detection value when the follow-up control is switched to the constant control, the control unit switches from the constant control to the follow-up control . The resin molding device according to claim 1, wherein the control unit detects that when the current detection value is smaller than the previous detection value, the The clamping pressure is controlled to be constant at the time point of the current detection value which is smaller than the previous detection value. A method of manufacturing a resin molded product, using the resin molding device described in claim 1 or 2.

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