TW202021771A - Resin molding device and method for manufacturing resin molded product - Google Patents

Abstract

The present invention improves a resin molded product by reducing the influence of back pressure due to transfer pressure. The present invention includes: a mold clamping mechanism, clamping a molding die and a molding die; a plunger driving mechanism, moving a plunger within a pot of the molding die; a clamp pressure detection unit, detecting a clamp pressure on a molding die caused by the mold clamping mechanism; a transfer pressure detection unit, detecting a transfer pressure on a resin caused by the plunger driving mechanism; and a control unit, controlling the mold clamping mechanism based on the clamp pressure detected by the clamp pressure detection unit and the transfer pressure detected by the transfer pressure detection unit, wherein when the detected transfer pressure rises, the control unit controls the mold clamping mechanism so that the clamp pressure rises relative to the transfer pressure, and when the detected transfer pressure falls, the control unit controls the mold clamping mechanism so that the clamp pressure becomes a predetermined value regardless of the transfer pressure.

Description

Resin molding device and manufacturing method of resin molded product

The present invention relates to a resin molding device and a method of manufacturing a resin molded product.

Regarding the resin molding device that performs resin molding by the transfer mold method, there are the following resin molding devices, namely: the lower mold and the upper mold are used to clamp the molded product, and the plunger (plunger) is formed from the lower mold The pot is pressure-feeding resin, and the resin is supplied to the cavity formed between the lower mold and the upper mold for resin sealing.

In the resin molding apparatus, during resin molding, the injection pressure (transmission pressure) of the resin caused by the plunger acts as a back pressure in the direction of opening the mold, so it may act on the molded product. The clamping pressure changes, resulting in resin burrs. In addition, it is also conceivable to set the clamping pressure correspondingly large in consideration of the back pressure, but if this is the case, the molded product may be damaged.

Therefore, the resin molding apparatus shown in Patent Document 1 is configured to control the clamping pressure in accordance with the injection pressure (transmission pressure) of the resin by the plunger during resin molding. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 11-58435

[Problems to be solved by the invention] However, in the resin molding apparatus, the clamping pressure is controlled only based on the injection pressure (transmission pressure). When the transmission pressure decreases during resin molding, the clamping pressure also decreases, and it is difficult to solve the back pressure problem.

Therefore, the present invention is to solve the above-mentioned problems, and its main subject is to reduce the influence of the back pressure caused by the transmission pressure to improve the resin molded product. [Technical means to solve the problem]

That is, the resin molding apparatus of the present invention is characterized by including: a mold clamping mechanism to close the molding mold; a plunger driving mechanism to move the plunger in the barrel of the molding mold; a clamping pressure detection unit, Detecting the clamping pressure of the mold clamping mechanism to the forming mold; a transmission pressure detecting unit that detects the transmission pressure of the plunger driving mechanism to the resin; and a control unit based on the detection of the clamping pressure detecting unit The clamping pressure and the transmission pressure detected by the transmission pressure detection unit control the mold clamping mechanism. When the detected transmission pressure rises, the control unit uses the clamping pressure to correspond to the transmission The mold clamping mechanism is controlled so that the pressure increases, and when the detected transmission pressure decreases, the clamping pressure is controlled so that the clamping pressure becomes a predetermined value regardless of the transmission pressure. [Effect of invention]

According to the present invention thus constituted, it is possible to reduce the influence of the back pressure due to the transmitted pressure and to improve the resin molded product.

Next, the present invention will be explained in more detail with examples. However, the present invention is not limited by the following description.

As described above, the resin molding apparatus of the present invention is characterized by including: a mold clamping mechanism to close the molding mold; a plunger drive mechanism to move the plunger in the barrel of the molding mold; and a clamping pressure detection unit , Detecting the clamping pressure of the mold clamping mechanism to the forming mold; a transmission pressure detecting part, detecting the transmission pressure of the plunger driving mechanism to the resin; and a control part, detecting based on the clamping pressure detecting part The clamping pressure and the transmission pressure detected by the transmission pressure detecting unit control the mold clamping mechanism, and when the detected transmission pressure rises, the control unit uses the clamping pressure to correspond to the The mold clamping mechanism is controlled to increase the transmission pressure, and when the detected transmission pressure decreases, the clamping pressure is controlled so that the clamping pressure becomes a predetermined value regardless of the transmission pressure.

In the resin molding apparatus of the present invention, when the detected transmission pressure increases, the clamping pressure is controlled to increase in response to the transmission pressure, and the detected transmission pressure decreases At this time, the clamping pressure is controlled so that it becomes a predetermined value regardless of the transmission pressure. Therefore, the clamping pressure does not decrease in response to the decrease in the transmission pressure, and the back pressure caused by the transmission pressure can be reduced. Influence and improve resin molded products.

Specifically, the control unit desirably controls the mold clamping mechanism so that the clamping pressure becomes a constant value regardless of the transmission pressure when the detected transmission pressure drops. With the above configuration, the control of the mold clamping mechanism can be simplified.

In addition, the control unit may control the mold clamping mechanism so that the clamping pressure becomes a value that changes in a predetermined relationship regardless of the transmission pressure when the detected transmission pressure drops. Here, regarding the value that changes in a predetermined relationship, for example, it is conceivable that the clamping pressure is a value that monotonically increases or decreases in a linear or stepwise manner.

As a specific control form, it is desirable that the control unit compares the previous detection value of the transmission pressure with the current detection value of the transmission pressure, and when the current detection value is less than the previous detection value At this time, the clamping mechanism is controlled so that the clamping pressure does not drop. Here, the control unit may also calculate the difference between the previous detection value of the transmission pressure and the current detection value to compare the previous detection value with the current detection value.

In addition, a method of manufacturing a resin molded product using the above-mentioned resin molding apparatus is also an aspect of the present invention.

<One embodiment of the present invention> Hereinafter, an embodiment of the resin molding apparatus of the present invention will be described with reference to the drawings. In addition, any of the drawings shown below are schematic drawings for ease of understanding and are omitted or exaggerated as appropriate.

<Overall configuration of resin molding apparatus 100> The resin molding apparatus 100 of this embodiment is a resin molding apparatus using a transfer molding method. This resin molding apparatus performs resin molding of a substrate on which a semiconductor wafer is mounted, for example, and uses a cylindrical tablet-shaped thermosetting resin (hereinafter referred to as "resin sheet") as a resin material. In addition, the "substrate" includes general substrates such as glass epoxy substrates, ceramic substrates, resin substrates, and metal substrates, lead frames, and the like.

Specifically, as shown in FIG. 1, the resin molding apparatus 100 includes the following modules as constituent elements: a supply module 2 that supplies a substrate W before resin sealing (hereinafter referred to as "pre-sealing substrate W") and a resin sheet T; For example, two resin molding modules 3A and 3B are used for resin molding; and a carry-out module 4 is used for carrying out resin molded products. In addition, the supply module 2, the resin molding module 3A, the resin molding module 3B, and the unloading module 4 as constituent elements can be attached to and detached from each other, and can be replaced.

In addition, the resin molding apparatus 100 includes a transport mechanism 5 (hereinafter referred to as "loader (loader) 5") that transports the pre-seal substrate W and the resin sheet T supplied from the supply module 2 to the resin molding module 3A and the resin molding module 3B ; And the conveying mechanism 6 (hereinafter referred to as "unloader 6"), the resin molding module 3A, the resin molding module 3B resin molded resin molded products are transported to the unloading module 4.

The supply module 2 of this embodiment is formed by integrating the substrate supply module 7 and the resin supply module 8.

The substrate supply module 7 has a substrate delivery unit 71 and a substrate supply unit 72. The board delivery unit 71 delivers the pre-sealing board W in the magazine to the board arrangement unit. The substrate supply unit 72 receives the pre-sealing substrates W from the substrate delivery unit 71 and arranges the received pre-sealing substrates W in a predetermined direction, and delivers them to the loader 5.

The resin supply module 8 has a resin delivery unit 81 and a resin supply unit 82. The resin delivery unit 81 receives the resin sheet T from a stocker described later, and delivers the resin sheet T to the resin supply unit 82. The resin supply unit 82 receives the resin sheet T from the resin delivery unit 81, arranges the received resin sheet T in a predetermined direction, and delivers it to the loader 5.

The resin molding module 3A and the resin molding module 3B each have a mold portion 31. As shown in FIG. 2, each press portion 31 has a lower mold 311 as a lifting mold, an upper mold 312 as a forming mold fixed opposite to the lower mold 311, and a lower mold 311 and an upper mold. 312 Mold clamping mechanism 313 for mold clamping.

The lower mold 311 is fixed on the upper surface of the movable plate 314, and the upper mold 312 is fixed on the lower surface of the upper fixed plate 315. The mold clamping mechanism 313 clamps or opens the upper mold 312 and the lower mold 311 by moving the movable plate 314 up and down. In addition, the mold clamping mechanism 313 can use a linear motion mechanism that uses a ball screw mechanism that converts the rotation of a servo motor or the like into linear movement and transmits it to the movable plate 314, or uses, for example, a toggle link (toggle link). A link mechanism such as a link mechanism that transmits a power source such as a servo motor to the movable plate 314 is a link type mechanism.

The mold clamping mechanism 313 is provided with a clamping pressure detection unit 10 that detects clamping pressures generated when the lower mold 311 and the upper mold 312 are closed. The clamping pressure detection unit 10 is, for example, a strain gauge, a load cell, or a pressure sensor. The clamping pressure signal detected by the clamping pressure detection unit 10 is sent to the control unit 9.

In the lower mold 311, a mounting portion 311a for mounting the pre-seal substrate W transported by the loader 5 is formed. In addition, the lower mold 311 is formed with a plurality of cylinders 311b in which the resin sheet T conveyed by the loader 5 is mounted. Furthermore, the lower mold 311 is provided with a plunger 316 for injecting the resin sheet T into the resin passage 312a and the cavity 312b formed in the upper mold 312, for example, in the cylinder 311b.

The plunger 316 is moved up and down in the cylinder 311b by the plunger drive mechanism 317. The plunger driving mechanism 317 advances and retreats the plunger 316 with respect to the lower mold 311, and thereby the plunger 316 advances and retreats in the barrel 311b. Here, the plunger drive mechanism 317 can use, for example, a mechanism combining a servo motor and a ball screw mechanism, or a mechanism combining an air cylinder or a hydraulic cylinder, and a rod.

The plunger drive mechanism 317 is provided with a transmission pressure detection unit 11 that detects the transmission pressure of the plunger drive mechanism 317 to the resin. The transfer pressure is, more specifically, the pressure applied to the plunger 316 when the plunger 316 is used to extrude the molten resin formed by heating and melting the resin sheet T in the cylinder 311 b. The transmission pressure detection unit 11 is, for example, a strain gauge, a load sensor, or a pressure sensor. The transmission pressure signal detected by the transmission pressure detection unit 11 is sent to the control unit 9.

In addition, heating parts such as heaters are embedded in the upper mold 312 and the lower mold 311, respectively. By the heating part, the upper mold 312 and the lower mold 311 are usually heated to about 180°C.

<Resin molding operation of resin molding apparatus 100> Hereinafter, the basic operation of resin molding by the resin molding apparatus 100 of this embodiment will be described.

The board delivery unit 71 delivers the pre-sealing board W in the cassette to the board supply unit 72. The substrate supply unit 72 arranges the received pre-sealing substrates W in a predetermined direction and delivers them to the loader 5. At the same time, the resin delivery unit 81 delivers the resin sheet T received from the stocker to the resin supply unit 82. The resin supply unit 82 delivers the required number (four in FIG. 1) of the received resin sheets T to the loader 5.

Next, the loader 5 simultaneously transports the received two sheets of pre-sealing substrate W and four resin sheets T to the mold section 31. The loader 5 supplies the pre-sealing substrate W to the mounting portion 311 a of the lower mold 311, and supplies the resin sheet T to the inside of the cylinder 311 b formed in the lower mold 311.

Then, the upper mold 312 and the lower mold 311 are mold-clamped using the mold clamping mechanism 313. Next, the plunger 316 extrudes the molten resin obtained by heating and melting the resin sheet T in each cylinder 311b. Thereby, the molten resin is injected into the cavity 312b formed in the upper mold 312 through the resin passage 312a. Next, by heating the molten resin for the time required for curing, the molten resin is cured to form a cured resin. As a result, the semiconductor wafer in the cavity 312b and the surrounding substrates are sealed in the cured resin (sealing resin) molded in accordance with the shape of the cavity 312b.

Then, after the time required for curing has elapsed, the upper mold 312 and the lower mold 311 are opened, and the sealed substrate (not shown) is demolded. Then, the unloader 6 is used to house the sealed substrate (resin molded product) resin-sealed by the mold section 31 in the substrate accommodating section 41 of the unloading module 4.

The overall operation of the resin molding apparatus 100 including the series of operations is controlled by the control unit 9. The control unit 9 is provided in the supply module 2 in FIG. 1, but may be provided in another module. In addition, the control unit 9 includes, for example, a dedicated or general-purpose computer including a central processing unit (CPU), an internal memory, an analog-to-digital (AD) converter, an input/output inverter, and the like.

<Specific control content of the control unit 9> Next, the specific control content of the control unit 9 will be described with reference to FIG. 3.

(Step S1: Start of lower die lifting) After the pre-sealing substrate W and the four resin sheets T are supplied to the molding section 31, the control section 9 controls the mold clamping mechanism 313 to raise the lower mold 311.

(Step S2: Clamping pressure detection) At this time, the clamping pressure detection unit 10 provided in the mold clamping mechanism 313 detects the clamping pressure, and sends this clamping pressure signal to the control unit 9.

(Step S3: Clamping pressure, set value a≦detection value P) The control unit 9 determines whether or not the detection value P of the clamping pressure is greater than or equal to a predetermined setting value a (setting value a≦detection value P).

When the detected value P is less than the set value a, the process returns to (step S2: clamping pressure detection), the control unit 9 controls the mold clamping mechanism 313 to make the lower mold 311 continue to rise, and the clamping pressure detection unit 10 detects the clamping pressure.

(Step S4: The lower die rises and stops) On the other hand, when the detection value P becomes equal to or greater than the set value a, the control unit 9 controls the mold clamping mechanism 313 to stop the raising of the lower mold 311.

(Step S5: The plunger rises start) Then, the control unit 9 controls the plunger drive mechanism 317 to start the plunger 316 ascending. The control unit 9 may start the plunger 316 when the detection value P becomes 80% or more of the clamping pressure of the set value a, etc., and may start the plunger 316 rise before the detection value P reaches the set value a. In addition, the control of the plunger driving mechanism 317 by the control unit 9 has a speed control stage and a pressure control stage. For example, the speed control stage is before the position of the plunger reaches a predetermined position, and then the pressure control stage. The plunger position can be detected by an encoder as a servo motor of the plunger drive mechanism 317, for example.

(Step S6: Transmission pressure and plunger position detection) At this time, the transmission pressure detection unit 11 provided in the plunger driving mechanism 317 detects the transmission pressure, and sends this transmission pressure signal to the control unit 9. In addition, a plunger position detection unit (not shown) provided in the plunger drive mechanism 317 detects the position of the plunger 316 and sends this plunger position signal to the control unit 9.

(Step S7: Transmission pressure and plunger position, setting value α≦detection value X) The control unit 9 determines whether the respective detection values X of the transmission pressure and the plunger position are greater than or equal to the predetermined respective setting values α (setting value α≦detection value X). In addition, here, the detection value X of both the transmission pressure and the plunger position is set to be a condition (and (AND) condition) that is greater than the respective set value α, and the detection value X of either one may be set to the set value α or more Set as condition (or (OR) condition).

When the detected value X is less than the set value α, return to (step S6: transmission pressure and plunger position detection), the control unit 9 controls the plunger drive mechanism 317 to make the plunger 316 continue to rise, and the transmission pressure detection unit 11 and the plunger The position detection unit detects the transmission pressure and the plunger position.

(Step S8: The lower die rises and starts again) On the other hand, when the detection value X is greater than or equal to the set value α, the control unit 9 controls the mold clamping mechanism 313 to cause the lower mold 311 to start rising again. As a result, the clamping pressure increases (refer to FIG. 4).

(Step S9: Clamping pressure and transmission pressure detection) At this time, the clamping pressure detection unit 10 detects the clamping pressure and sends it to the control unit 9, and the transmission pressure detection unit 11 detects the transmission pressure and sends it to the control unit 9.

(Step S10: Transfer pressure, the previous detection value ≥ this detection value) The control unit 9 compares the current detection value of the transmission pressure with the previous detection value, and determines whether the current detection value is below the previous detection value (previous detection value ≧this detection value). Here, the detection value this time is the detection value of the transmission pressure newly acquired for the processing of step S10. The previous detection value is the detection value of the transmission pressure acquired before the current detection value is acquired, and it may be the detection value acquired immediately before the current detection value or the detection value acquired before the specified time.

(Step S11: Follow and control the clamping pressure according to the transmission pressure) When the current detection value is greater than the previous detection value, the control unit 9 controls the clamping pressure based on the transmission pressure. That is, in order to increase the clamping pressure following the increase in the transmission pressure, the mold clamping mechanism 313 is controlled (see FIG. 4).

(Step S12: Clamping pressure, set value b≦detection value Q) Then, the control unit 9 determines whether the detected value Q of the clamping pressure is greater than or equal to a predetermined set value b (set value b≦detected value Q).

(Step S13: The lower die rises and stops) When the detected value Q of the clamping pressure is greater than or equal to the set value b, the control unit 9 controls the mold clamping mechanism 313 to stop the raising of the lower mold 311.

When the detected value Q of the clamping pressure is less than the set value b, the control unit 9 proceeds to the next step (step S14: transmission pressure, set value β≦detected value Y).

(Step S14: Transmission pressure, set value β≦detection value Y) Next, the control unit 9 determines whether the detection value Y of the transmission pressure is greater than or equal to a predetermined setting value β (setting value β≦detection value Y).

(Step S15: The plunger rises and stops) When the detection value Y of the transmission pressure is greater than or equal to the set value β, the control unit 9 controls the plunger drive mechanism 317 to stop the plunger 316 from rising. This completes the control before mold opening during resin molding.

On the other hand, when the detection value Y of the transmission pressure is less than the set value β, the process returns to (Step S9: detection of clamping pressure and transmission pressure), and the control unit 9 controls the mold clamping mechanism 313 so that the lower mold 311 continues to rise to clamp The pressure detection unit 10 and the transmission pressure detection unit 11 detect clamping pressure and transmission pressure.

(Step S16: Control the clamping pressure to be constant) In the above (step S10: transmission pressure, previous detection value ≧this detection value), when the current detection value is less than the previous detection value, the control unit 9 makes the clamping pressure a predetermined regardless of the transmission pressure Control is performed in a predetermined value mode (step S16). The control unit 9 of the present embodiment controls the mold clamping mechanism 313 (refer to FIG. 4) so that the clamping pressure becomes a constant value. Specifically, the control unit 9 controls the clamping pressure to be constant at the time when it is detected that the current detection value is equal to or lower than the previous detection value.

In addition, during this constant control, the clamping pressure detection unit 10 and the transmission pressure detection unit 11 detect the clamping pressure and transmission pressure (step S9), and the control unit 9 always judges whether the current detection value of the transmission pressure is the previous detection Value below (previous detection value ≥ current detection value) (step S10).

Here, as shown in FIG. 4, the control unit 9 assumes the following situation: when the clamping pressure is switched from constant control to the clamping pressure follow-up control, the current detection value exceeds the clamping pressure follow-up control. Detected value during certain control of clamping pressure. In addition, a configuration may be adopted in which the current detection value of the transmission pressure and the immediately previous detection value are compared to switch between the follow-up control of the clamping pressure and the constant control of the clamping pressure.

<Effects of this embodiment> According to the resin molding apparatus 100 of this embodiment, when the detected transmission pressure rises, the clamping pressure is controlled so that the clamping pressure rises in response to the transmission pressure, and when the detected transmission pressure drops The clamping pressure is controlled so that the clamping pressure becomes a predetermined value regardless of the transmission pressure. Therefore, the clamping pressure does not decrease in response to the decrease in the transmission pressure, and the back pressure caused by the transmission pressure can be reduced. Influence and improve resin molded products.

<Other Modified Embodiments> In addition, the present invention is not limited to the embodiment.

For example, as long as the clamping pressure detection unit 10 detects the clamping pressure of the mold clamping mechanism 313 on the lower mold 311 and the upper mold 312, it does not need to be provided in the mold clamping mechanism 313, and may be provided between the mold clamping mechanism 313 and the movable plate 314. , Between the movable plate 314 and the lower mold 311, or between the upper fixed plate 315 and the upper mold 312, etc.

In addition, as long as the transmission pressure detection unit 11 detects the transmission pressure of the plunger drive mechanism 317 to the resin, it does not need to be provided in the plunger drive mechanism 317, and may be provided between the plunger 316 and the plunger drive mechanism 317.

In the control flow of the above-mentioned embodiment, after the judgment (step S12: clamping pressure, set value b≦detection value Q), judgment (step S14: transmission pressure, set value β≦detection value Y), but the opposite is also possible. Alternatively, step S12 and step S14 may be processed in parallel.

Furthermore, the control unit 9 may control the mold clamping mechanism 313 so that the clamping pressure becomes a value that changes in a predetermined relationship regardless of the transmission pressure when the detected transmission pressure drops. At this time, it is conceivable that the control unit 9 controls the mold clamping mechanism 313 so that the clamping pressure becomes a value that increases linearly or stepwise and monotonously. At this time, the clamping pressure is set to an increase amount that does not break. In addition, it is conceivable that the control unit 9 makes the clamping pressure a value that monotonously decreases linearly or stepwise. At this time, it is set to a reduction amount that can reduce the influence of the back pressure due to the transmission pressure.

In the above-mentioned embodiment, the two resin molding modules 3A and 3B are connected between the supply module 2 and the unloading module 4. However, the following structure may be adopted: the supply module 2 and the unloading module 4 As a module, the resin molding module 3A and the resin molding module 3B are connected to the module. In addition, the resin molding apparatus may not be modularized into modules as in the above-mentioned embodiment.

In addition, the present invention is not limited to the above-described embodiments, and of course various modifications can be made within a range that does not deviate from the gist.

2: Supply module 3A, 3B: Resin molding module 4: move out the module 5: Transport mechanism (loader) 6: Conveying mechanism (unloader) 7: Substrate supply module 8: Resin supply module 9: Control Department 10: Clamping pressure detection part 11: Transmission pressure detection department 31: Molding department 41: Board storage section 71: Board delivery section 72: Board Supply Department 81: Resin Delivery Department 82: Resin Supply Department 100: Resin molding device 311: Lower mold (forming mold) 311a: Installation Department 311b: Barrel 312: Upper die (forming die) 312a: Resin passage 312b: Mould cavity 313: clamping mechanism 314: movable plate 315: upper fixed plate 316: Plunger 317: Plunger drive mechanism S1～S16: steps T: Resin sheet W: Before sealing the substrate

FIG. 1 is a plan view schematically showing the configuration of the resin molding apparatus of this embodiment. Fig. 2 is a diagram showing a method of manufacturing a resin molded article of the embodiment. Fig. 3 is a control flowchart of the embodiment. Fig. 4 is a schematic diagram of the temporal changes of the transmission pressure and the clamping pressure of the embodiment.

S1~S16: steps

Claims (4)

A resin molding device includes: Clamping mechanism to close the forming mold; Plunger driving mechanism to move the plunger in the barrel of the forming die; A clamping pressure detecting part, which detects the clamping pressure of the mold clamping mechanism on the forming mold; A transmission pressure detection unit that detects the transmission pressure of the plunger drive mechanism to the resin; and A control unit that controls the mold clamping mechanism based on the clamping pressure detected by the clamping pressure detection unit and the transmission pressure detected by the transmission pressure detection unit, When the detected transmission pressure increases, the control unit controls the mold clamping mechanism so that the clamping pressure increases in accordance with the transmission pressure, and when the detected transmission pressure decreases, The mold clamping mechanism is controlled so that the clamping pressure becomes a predetermined value regardless of the transmission pressure. The resin molding apparatus described in claim 1, wherein the control unit controls the clamping pressure so that the clamping pressure becomes a constant value regardless of the transmission pressure when the detected transmission pressure drops The clamping mechanism. In the resin molding apparatus described in item 1 or item 2, the control unit compares the previous detection value of the transmission pressure with the current detection value of the transmission pressure, and When the second detection value is smaller than the previous detection value, the mold clamping mechanism is controlled so that the clamping pressure becomes a predetermined value. A method for manufacturing a resin molded product using the resin molding device described in any one of the first to third items in the scope of the patent application.

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