JP6087859B2 - Resin molding apparatus and resin molding method - Google Patents

Description

  The present invention relates to a resin molding apparatus and a resin molding method used when resin-sealing an electronic component including a chip such as an integrated circuit (IC) mounted on a substrate.

  Conventionally, an electronic device such as an IC mounted on a substrate such as a lead frame or a printed circuit board by using a resin molding technique such as a transfer molding method, a compression molding method (compression molding method), or an injection molding method (injection molding method). A component is resin-sealed with a cured resin.

  For example, in a resin molding apparatus using a transfer mold method, resin sealing is performed as follows. The upper mold and the lower mold, which are forming molds, are opened. Depending on the configuration of the apparatus, an intermediate mold may be provided between the upper mold and the lower mold. Next, the substrate before molding is arranged at a predetermined position on the mold surface of the lower mold using the transport mechanism, and the resin tablet is supplied into the pot provided in the lower mold. Next, the lower mold is moved upward to clamp the upper mold and the lower mold. At this time, the electronic component and the peripheral substrate are accommodated in a cavity provided in at least one of the upper mold and the lower mold. Next, the resin tablet in the pot is pressed by the plunger and heated to melt. The molten fluid resin is further pressed by a plunger, and the fluid resin is injected into the cavity via resin passages called cal, runner, and gate. Subsequently, the flowable resin is heated for the time required for curing to cure the flowable resin to form a cured resin. As a result, the electronic components in the cavity and the peripheral substrate are resin-sealed in a cured resin molded corresponding to the shape of the cavity. Next, the upper mold and the lower mold are opened, and the sealed substrate is released. Throughout this application, the term “gate” means “a channel or throttle hole through which material is injected from a sprue (or runner in the case of a multi-cavity mold) into a mold cavity”. See JIS K 6900).

  By the way, an injection port for injecting a fluid resin is provided on either the side surface or the top surface (inner bottom surface) of the cavity. The mold is provided with a gate composed of a space connected to the injection port. The cured resin formed on the cal, runner, and gate serving as the resin passage becomes unnecessary resin, and the unnecessary resin is separated from the sealed substrate by degating. In order to easily separate unnecessary resin, the tip of the gate connected to the cavity is thinly tapered with respect to the runner side. However, when the unnecessary resin is separated, the cured resin formed at the gate tip may be broken. The broken cured resin remains at the end of the gate even if unnecessary resin formed on the cal, runner and gate is discarded. When resin sealing is performed with the cured resin remaining on the gate, the remaining cured resin partially or completely blocks the gate. When the resin is continuously sealed, injection of the fluid resin into the cavity is prevented by the remaining cured resin. This causes molding defects such as unfilling of the cured resin in the cavity. Therefore, it is important to detect whether there is no cured resin remaining in the gate, in other words, whether there is residual cured resin (hereinafter referred to as “resin residual”) in the gate.

As a gate clogging detection device for a resin molding die, “in a resin molding die having a gate for communicating a runner and a cavity, an air supply for leading gate clogging detection air supplied from an air supply source into the runner. A passage, an opening / closing valve for opening / closing the air supply passage, and pressure detecting means for detecting the pressure of air supplied to the runner through the air supply passage with the opening / closing valve open. A gate clogging detection device is proposed that is configured to determine whether or not a gate clogging in which the molding material remains in the gate has occurred according to the change state of the air pressure detected by the detecting means (for example, (Patent Document 1, page 2, FIG . 1, FIG . 2 ).

JP-A-2-289325

  However, the gate jam detection device disclosed in Patent Document 1 has the following problems. As shown in FIGS. 1 and 2 of Patent Document 1, in the above-described apparatus, the upper mold 1 and the lower mold 2 are clamped before injection molding, and the air supply source enters the communication pipe 6. Supply air with a predetermined pressure. When the gate is clogged and the submarine gate 5 is blocked by the molding material 16, the inflow of air from the runner 3 to the cavity 4 is prevented, so that the air pressure reaches the discharge pressure of the air supply source early. To rise. It is determined whether or not gate clogging has occurred by comparing the rising speed of the air pressure determined based on the detection value of the pressure detection means 14 with a reference speed previously obtained by calculation or the like in the determination means 15.

  In this way, the air pressure rising speed is detected, in other words, the time taken to reach the discharge pressure of the air supply source is measured to calculate the air pressure rising speed. The air pressure rises with time, eventually reaches a predetermined pressure and becomes a constant pressure. Therefore, it is important to accurately monitor the time to reach a certain pressure. Eventually, the pressure converges to a constant pressure. Therefore, it is necessary to closely monitor the change in pressure over time to accurately determine when the predetermined pressure has been reached. However, although the pressure change immediately after supplying air is large, the pressure change becomes very small when the pressure is close to a predetermined pressure. The pressure gradually changes and reaches a predetermined pressure. Therefore, it is difficult to accurately determine when the predetermined pressure is reached. If the time when the predetermined pressure is reached cannot be accurately determined, it is difficult to determine whether or not a gate clogging has occurred.

  In the gate jam detection device, production is temporarily stopped and the resin molding die is clamped to determine whether or not a gate jam has occurred. Therefore, it cannot be detected whether or not a gate jam has occurred immediately before production. If gate clogging occurs during production, the gate clogging cannot be detected, so the next injection molding is performed. As a result, defective molding due to gate clogging occurs. Therefore, there is also a problem that it is not possible to determine whether or not a gate jam has occurred immediately before injection molding the product.

  The present invention solves the above-described problems, and provides a resin molding apparatus and a resin molding method capable of accurately determining whether or not resin residue is generated in a gate with a simple apparatus configuration and a simple method. With the goal.

  In order to solve the above problems, a resin molding apparatus according to the present invention includes a first molding die, a second molding die provided opposite to the first molding die, and a first molding. A cavity that is provided on the side of the mold that faces the second mold and the injected flowable resin is cured to form a cured resin; and a top surface of the cavity that is provided in the first mold Resin molding for molding a molded product having a cured resin, comprising a gate formed of a space connected to the mold, and a clamping mechanism for clamping a molding die group having at least a first molding die and a second molding die An apparatus, a gate suction mechanism disposed between the first mold and the second mold so as to overlap the cavity; a suction portion provided in the gate suction mechanism; and a gate suction mechanism A suction passage that is connected to the suction section and is in contact with the suction passage A flow rate based on the measured flow rate information received from the flow rate measuring means, the suction mechanism connected to the pipe, the flow rate measurement means for generating the measured flow rate information according to the flow rate provided in the pipe and passing through the pipe And a flow rate measuring means, wherein the tip of the suction part is in close contact with the mold surface of the first mold around the gate opening, and The measurement flow rate information is generated in a state where the gas existing in the gate is sucked by the suction mechanism, and the predetermined judgment is based on the reference flow rate information measured and stored in advance in the state where the cured resin does not remain in the gate. It is characterized by determining whether or not the cured resin remains in the gate by comparing with the measured flow rate information.

  The resin molding apparatus according to the present invention is characterized in that in the above-described resin molding apparatus, a plurality of gates are provided, and a plurality of suction portions are provided corresponding to the plurality of gates, respectively.

  The resin molding apparatus according to the present invention is characterized in that in the above-described resin molding apparatus, a plurality of cavities are provided corresponding to the plurality of gates.

  Further, the resin molding apparatus according to the present invention is the above-described resin molding apparatus, wherein the plurality of suction portions includes one row including m suction portions arranged along the first direction when viewed in plan. There are m × n suction sections (m and n are positive integers) each consisting of n rows of suction sections arranged along a second direction intersecting the first direction. , Each of the n rows of suction portions has n suction passages communicating with the m suction portions, and the n suction passages are on the opposite side of the suction mechanism as viewed from the flow rate measuring means in a common pipe. It is characterized by being connected to each part.

  Moreover, the resin molding apparatus according to the present invention is provided with n pipes connected to the suction mechanism in the above-described resin molding apparatus, and the plurality of suction portions are along the first direction when viewed in plan. One row consisting of m suction portions arranged is m × n suction portions consisting of n rows of suction portions arranged along a second direction intersecting the first direction (m, n Are all positive integers.), The gate suction mechanism has n suction passages communicating with the m suction portions in each of the n rows of suction portions, and the n suction passages include the n suction passages. It is characterized by being connected to each pipe.

  Moreover, the resin molding apparatus according to the present invention is characterized in that in the above-described resin molding apparatus, an elastic body that supports each of the suction portions is provided.

  Further, the resin molding apparatus according to the present invention is the above-described resin molding apparatus, wherein at least one of the operation of carrying in and delivering the material for molding the molded product to the molding die group and the operation of taking out the molding product from the molding die group. And a gate suction mechanism is provided in the transport mechanism.

  In order to solve the above-described problems, a resin molding method according to the present invention includes a first mold having a cavity including a space in which a fluid resin is cured and a cured resin is to be formed, and the first mold A step of preparing a molding die group having at least a second molding die provided opposite to the side where the cavity is formed in the molding die, a step of clamping the molding die group, and a first molding die A step of injecting a fluid resin into the cavity via a gate comprising a space connected to the top surface of the cavity, a step of curing the fluid resin to form a cured resin, and a mold group A resin molding method comprising a step of opening and a step of taking out a molded product having a cured resin from a group of molding dies, wherein the tip of the suction portion is in close contact with the mold surface of the first molding die around the opening of the gate Process and gate smell A step of measuring a reference flow rate passing through the pipe in the pipe connected to the suction section while sucking the gas present in the gate through the suction section using the suction mechanism in a state where the cured resin does not remain; , Memorize the reference flow rate information generated based on the reference flow rate, and measure the flow rate passing through the pipe in the pipe while sucking the gas present in the gate through the suction part using the suction mechanism A step of generating measured flow rate information based on the flow rate, and a step of determining whether or not the cured resin remains in the gate by comparing the reference flow rate information and the measured flow rate information. It is characterized by.

  In the resin molding method according to the present invention, in the above-described resin molding method, a plurality of gates and suction portions corresponding to the gates are provided, and in the step of closely contacting the tips of the suction portions, a plurality of gates are formed. In the step of bringing the tips of the plurality of suction portions into close contact with the mold surface of the first molding die around the opening and sucking the gas present in the gate, a plurality of portions are respectively passed through the plurality of suction portions. The gas existing in the gate is sucked.

  Further, the resin molding method according to the present invention is the above-described resin molding method, wherein a plurality of cavities are provided corresponding to the plurality of gates, respectively, and a plurality of suction is performed in the step of sucking the gas existing in the gates. The gas present in the plurality of gates is sucked through the respective sections.

  Further, the resin molding method according to the present invention is the above-described resin molding method, wherein the plurality of suction portions includes a single row of m suction portions arranged along the first direction when viewed in plan. M × n suction parts (m and n are positive integers) composed of n rows of suction parts arranged in a second direction intersecting the first direction, and exist in the gate. In the step of sucking the gas, the gas existing in the plurality of gates is collectively sucked and measured through n suction passages communicating with the m suction portions in each of the n rows of suction portions. In the step of generating the flow rate information, when the gas is sucked in a lump, the flow rate is measured on the side closer to the suction mechanism than the n suction passages in the pipe commonly connected to the n suction passages, The measurement flow rate information is generated.

  Further, the resin molding method according to the present invention is the above-described resin molding method, wherein the plurality of suction portions includes a single row of m suction portions arranged along the first direction when viewed in plan. M × n suction parts (m and n are positive integers) composed of n rows of suction parts arranged in a second direction intersecting the first direction, and exist in the gate. In the step of sucking the gas, each of the n suction units included in each of the n rows of suction units passes through each of the n suction passages communicating with the m suction units in each of the n rows of suction units. In the step of sucking each gas present in the corresponding m gates and generating the measured flow rate information, the flow rate in the piping corresponding to each of the n rows of suction units is measured to obtain the n measured flow rate information. It is characterized by generating.

  The resin molding method according to the present invention is characterized in that, in the above-described resin molding method, the suction part is supported by an elastic body in the step of closely contacting the tip of the suction part.

  Further, the resin molding method according to the present invention is the above-described resin molding method, the step of preparing a transport mechanism provided with a suction portion, and the step of carrying a material for molding a molded product into a molding die group and delivering it. And a step of taking out the molded product from the molding die group, and performing at least one of a delivery step or a removal step using the transport mechanism, and at least a step of bringing the tip of the suction part into close contact with a gas present in the gate The step of sucking and the step of measuring the flow rate are performed in the delivery step or in the removal step.

  According to the present invention, the gate suction mechanism is provided with the suction portion and the suction passage connected to the suction portion, and the suction passage and the suction mechanism are connected by the pipe. The piping includes a flow rate measuring unit and a determination unit that determines the measured flow rate information. The suction part provided in the gate suction mechanism is brought into close contact with the periphery of the opening of the gate connected to the top surface of the cavity, and the gas existing in the gate is sucked by the suction mechanism. By comparing the measured flow rate information measured by suction with the reference flow rate information measured and stored in advance, it is determined whether or not the cured resin remains in the gate. Whether or not residual resin is generated can be easily determined by a simple apparatus configuration and a simple method of measuring the flow rate of the sucked gas.

In Example 1 of the resin molding apparatus which concerns on this invention, it is a front view which shows the outline | summary of an apparatus. FIG. 2 is a schematic partial cross-sectional view showing the configuration of a mold in the resin molding apparatus shown in FIG. 1. FIG. 3 is a schematic diagram showing a configuration of an intermediate mold in the molding die shown in FIG. 2. 3A is a top view, and FIG. 3B is a cross-sectional view taken along the line AA. FIG. 4 is a schematic diagram showing a first configuration of a gate suction mechanism corresponding to the gate shown in FIG. 3 in Embodiment 1 of the resin molding apparatus according to the present invention. 4A is a top view, and FIG. 4B is a cross-sectional view of the gate suction mechanism as seen from the line AA. FIG. 5 is a schematic view showing a configuration of a suction mechanism in the gate suction mechanism shown in FIG. 4. FIG. 5A is a schematic diagram showing a configuration of a suction mechanism provided with one flow rate sensor, and FIG. 5B is a schematic diagram showing a configuration of a suction mechanism provided with a plurality of flow rate sensors. FIG. 5 is a schematic partial cross-sectional view showing a state in which the resin residue in the intermediate gate is detected by the gate suction mechanism shown in FIG. 4. FIG. 6A is a schematic partial cross-sectional view showing a state before the gate suction mechanism is in close contact with the intermediate gate, and FIG. 6B is a schematic partial cross-sectional view showing a state after the gate suction mechanism is in close contact with the intermediate gate. is there. FIG. 4 is a schematic diagram showing a second configuration of a gate suction mechanism corresponding to the gate shown in FIG. 3 in Embodiment 2 of the resin molding apparatus according to the present invention. FIG. 7A is a top view, and FIG. 7B is a cross-sectional view taken along line AA. In Example 3 of the resin molding apparatus which concerns on this invention, it is a general | schematic fragmentary sectional view which shows the state by which the loader comprised by integrating the gate suction mechanism was arrange | positioned in the predetermined position of the shaping | molding die. In Example 3 of the resin molding apparatus which concerns on this invention, it is a general | schematic fragmentary sectional view which shows the state which detects the resin residue in an intermediate | middle type gate with a loader. In Example 3 of the resin molding apparatus which concerns on this invention, it is a general | schematic fragmentary sectional view which shows the state in which the cured resin is produced | generated. In Example 3 of the resin molding apparatus which concerns on this invention, it is a general | schematic fragmentary sectional view which shows the state which takes out the unnecessary resin which remained with the degate by the unloader. In Example 3 of the resin molding apparatus which concerns on this invention, it is a general | schematic fragmentary sectional view which shows the state which takes out the molded article which resin sealing was completed with an unloader.

  As shown in FIG. 4, a suction part 27 and a suction passage 28 connected to the suction part 27 are provided in the gate suction mechanism 26 so as to correspond to the gate 24 connected to the top surface of the cavity 23. The suction passage 28 is connected to the suction mechanism 30 by a pipe 29. The pipe 29 is provided with a flow rate sensor 31 for measuring the flow rate of the sucked air. Control means CTL for collecting and processing the flow value measured by the flow sensor 31 is connected to the flow sensor 31. The tip of the suction part 27 is brought into close contact with the periphery of the opening 24 b of the gate 24, and air in the atmosphere is sucked through the gate 24 using the suction mechanism 30. By comparing the flow rate value measured by the flow rate sensor 31 with the reference flow rate value stored in the control means CTL in advance, it is determined whether or not the resin residue has occurred in the gate 24.

  Example 1 of the resin molding apparatus according to the present invention will be described with reference to FIGS. Any figure in the present application document is schematically omitted or exaggerated as appropriate for easy understanding. About the same component, the same code | symbol is attached | subjected and description is abbreviate | omitted suitably.

  As shown in FIG. 1, the resin molding apparatus 1 includes a base 2, tie bars 3 provided at four corners on the base 2, and a stationary platen 4 fixed to the upper end of the tie bar 3. An upper mold plate 5 is provided on the lower surface of the fixed platen 4, and an upper mold 6 for resin molding is provided in the upper mold plate 5. A movable platen 7 is provided below the fixed platen 4 so as to face the fixed platen 4. The movable platen 7 is attached to the tie bar 3 so that it can be moved up and down with respect to the fixed platen 4. A lower mold plate 8 is provided on the upper surface of the movable plate 7 so as to face the upper mold plate 5, and a lower mold 9 for resin molding is provided in the lower mold plate 8. The upper mold 6 and the lower mold 9 are provided opposite to each other, and an intermediate mold 10 is provided between the upper mold 6 and the lower mold 9. The upper mold 6, the lower mold 9, and the intermediate mold 10 together form a mold.

  The drive mechanism 11 is a drive mechanism that raises and lowers the intermediate mold 10 between the upper mold 6 and the lower mold 9. For example, the intermediate mold 10 can be moved up and down by a drive mechanism 11 including a rack and pinion mechanism. By raising and lowering the intermediate mold 10 using the drive mechanism 11, mold clamping and mold opening are partially performed between the upper mold 5 and the intermediate mold 11 and between the intermediate mold 10 and the lower mold 9. Do. The clamping and opening of the intermediate mold 10 are not limited to the case where the drive mechanism 11 is used. The intermediate mold 10 may be fixed to the upper mold plate 5 or the lower mold plate 8 by a clamping mechanism provided on the upper mold plate 5 and the lower mold plate 8.

  The upper mold plate 5 and the lower mold plate 8 incorporate a heater (not shown) for heating the upper mold 6 and the lower mold 9. The upper mold plate 5 and the upper mold 6 and the lower mold plate 8 and the lower mold 9 are heated to about 170 ° C. The upper mold 6, the lower mold 9, and the intermediate mold 10 are configured so that they can be easily replaced in the resin molding apparatus 1 according to the object to be resin-sealed.

  The mold clamping mechanism 12 is a mechanism that raises and lowers the movable platen 7 in order to perform mold clamping and mold opening completely. For example, the mold clamping mechanism 12 includes a toggle mechanism or a hydraulic cylinder. By moving the movable platen 7 up and down using the mold clamping mechanism 12, mold clamping and mold opening are performed for the upper mold 6, the lower mold 9, and the intermediate mold 10. At the time when the upper mold 6, the lower mold 9, and the intermediate mold 10 start to be clamped or opened, the intermediate mold 10 may already be clamped to the upper mold 6 or the lower mold 9, and the upper mold 6 is clamped by the clamp mechanism. 6 or the lower mold 9 may be fixed.

  In the actual resin molding apparatus 1, the upper mold 6 and the lower mold 9 are constituted by an outer portion called a chase holder, an inner portion called a chase, and a portion provided with a cavity called a cavity block. Often done. In FIG. 1, these components are not shown.

  With reference to FIG. 2, the structure of the upper mold | type 6, the lower mold | type 9, and the intermediate mold | type 10 is demonstrated in the resin molding apparatus 1 which concerns on this invention. As shown in FIG. 2, the upper mold 6, the lower mold 9, and the intermediate mold 10 are in a state where they are opened. The loader 13 is a transport mechanism that transports the substrate 15 on which the semiconductor chip 14 is mounted and the resin tablet 16, which is a resin material, to a predetermined position between the upper mold 6 and the lower mold 9. The terminals of the chip 14 and the terminals of the substrate 15 are electrically connected by wires 17. In this case, the substrate 15 and the resin tablet 16 are simultaneously conveyed by the loader 13. You may make it convey the board | substrate 15 and the resin tablet 16 separately.

  The lower mold 9 is provided with a pot 18 for accommodating the resin tablet 16 supplied by the loader 13 and a recess 19 for arranging the substrate 15 supplied by the loader 13 at a predetermined position of the lower mold 9. A plunger 20 is provided in the pot 18 to press the accommodated resin tablet 16. The upper die 6 is provided with a cull 21 and a runner 22 that serve as passages for the fluid resin in which the resin tablet 16 is heated and melted.

  The intermediate mold 10 is provided with a cavity 23 that accommodates a chip 14 mounted on the substrate 15 and serves as a space in which a cured resin is formed, and a gate 24 that supplies fluid resin to the cavity 23. Further, the intermediate mold 10 is provided with a through hole 25 serving as a resin passage for pumping the fluid resin from the pot 18 to the cull 21. In a state in which the upper mold 6, the lower mold 9, and the intermediate mold 10 are clamped, the pot 18, the through hole 25, the cal 21, the runner 22, the gate 24, and the cavity 23 communicate with each other. Injected.

  An example of the configuration of the cavity 23 and the gate 24 in the intermediate mold 10 shown in FIG. 2 will be described with reference to FIG. As shown in FIG. 3A, for example, the cavity 23 and the gate 24 are provided in a lattice shape (matrix shape) in the horizontal direction and the vertical direction. The arrangement along the horizontal direction (X direction) is called “row”, and the arrangement along the vertical direction (Y direction) is called “column”. In this case, a total of 20 cavities 23 and gates 24 are provided in the intermediate mold 10 along the horizontal direction (X direction) and five along the vertical direction (Y direction). The number of cavities 23 and gates 24 provided in the intermediate mold 10 can be arbitrarily determined according to the product.

  As shown in FIG. 3B, the tip of the gate 24 is connected to a predetermined position (for example, a central position) on the top surface (upper surface in the drawing) of the cavity 23 corresponding to each cavity 23. The gate 24 is a cylindrical space and is formed to have a conical shape. The gate 24 is formed so that the diameter of the opening 24a on the side connected to the runner 22 (see FIG. 2) is large and the diameter of the opening 24b on the side connected to the cavity 23 is small. Thus, by narrowing the gate on the side connected to the cavity 23, the molded product molded in the cavity 23 can be easily degated. However, by narrowing the gate on the side connected to the cavity 23, the hardened resin formed at the gate tip when the gate is defeated is broken, and this hardened resin remains on the gate as a residual resin. It tends to occur.

  With reference to FIG. 4, the structure of the gate suction mechanism 26 for detecting whether or not the resin residue is generated in the gate 24 shown in FIG. As shown in FIG. 4A, the gate suction mechanism 26 is provided with suction portions 27 for sucking air so as to correspond to the positions of the respective gates 24 shown in FIG. As shown in FIG. 3A and FIG. 4A, corresponding to the gate 24, four along the horizontal direction (X direction) and five along the vertical direction (Y direction), a total of 20 A single suction portion 27 is provided in the gate suction mechanism 26.

  For example, in each row from the first row to the fifth row, the four suction portions 27 arranged along the horizontal direction (X direction) are respectively connected by suction passages 28 extending along the horizontal direction (X direction). The The four suction portions 27 arranged along the lateral direction are connected to the outside via a suction passage 28. Accordingly, five suction passages 28 are provided along the vertical direction (Y direction) to connect the four suction portions 27 provided in the first to fifth rows to the outside. Not only this but the suction passage 28 can also be provided along the vertical direction (Y direction). In this case, the five suction portions 27 arranged along the vertical direction are respectively connected by the suction passages 28 extending along the vertical direction (Y direction). Four suction passages 28 for connecting the five suction portions 27 provided in each of the first to fourth rows to the outside are provided along the lateral direction (X direction).

  As shown in FIG. 4B, the suction part 27 includes a suction part main body 27a and a suction pad 27b made of an elastic member attached to the tip of the suction part main body 27a. The suction pad 27b has a cylindrical shape or a tapered cross-sectional shape in which the tip expands. As the suction pad 27b, for example, nitrile rubber, silicone rubber, fluorine rubber, or the like is used. In the resin molding apparatus 1, the upper mold 6 and the lower mold 9 are heated to about 170 ° C. to perform resin sealing. Therefore, it is preferable to use heat-resistant silicone rubber or fluorine rubber as the suction pad 27 b. .

  Each suction passage 28 provided in the gate suction mechanism 26 is connected to the suction mechanism 30 by a pipe 29 made of a flexible tube, a fluororesin tube, a nylon tube, or the like. The piping 29 preferably has flexibility and heat resistance. As the suction mechanism 30, a vacuum ejector, a vacuum pump, or the like is used. Between each of the suction passages 28 and the suction mechanism 30, a flow rate sensor 31 that measures the total flow rate of air sucked in all of the five suction passages 28 is provided. Control means CTL for collecting the flow value measured by the flow sensor 31 and performing data processing such as data storage and calculation is connected to the flow sensor 31. Using the suction mechanism 30, the gas present in the gate 24 is sucked from the 20 suction portions 27 provided in the gate suction mechanism 26. In this embodiment, since the gate 24 is open to the atmosphere, air in the atmosphere is sucked from the 20 suction portions 27.

  As shown in FIG. 5, one or a plurality of flow rate sensors 31 can be provided corresponding to the number of suction portions 27 provided in the gate suction mechanism 26. FIG. 5A shows a case where one flow rate sensor 31 and control means CTL corresponding to one flow rate sensor 31 are provided for the 20 suction units 27 provided in the gate suction mechanism 26. Indicates. The five suction passages 28 provided along the lateral direction are connected to the suction mechanism 30 via a single flow rate sensor 31 by a pipe 29. Accordingly, the flow rate sensor 31 measures the total flow rate of air sucked from the 20 suction portions 27 provided in the gate suction mechanism 26.

  FIG. 5B shows one flow rate corresponding to each suction passage 28 connecting the four suction portions 27 provided in each of the first to fifth rows of the gate suction mechanism 26. The case where the sensor 31 is provided is shown. In this case, the total flow rate of air sucked from the four suction portions 27 connected to each suction passage 28 is measured by the five flow rate sensors 31. Control means CTL is provided so as to correspond to the five flow sensors 31. Therefore, the control means CTL collects all the flow values measured by the five flow sensors 31, and performs processing such as data storage and calculation. The number of the flow sensors 31 is arbitrarily determined by the number of suction portions 27 provided in the gate suction mechanism 26, the number of suction passages 28, the total flow rate of air to be sucked, and the like.

  5 (a) and 5 (b), the total flow rate of air sucked in a normal state with no resin residue is measured in advance using the gate suction mechanism 26, and the total flow rate is used as reference flow rate information. Stored in the control means CTL. Then, the control means CTL compares the measured flow rate information corresponding to the total flow rate actually measured using the gate suction mechanism 26 with the reference flow rate information stored in advance. As a result, it is possible to determine whether or not resin residue is generated in the gate 24. Therefore, the control unit CTL functions as a determination unit.

  With reference to FIG. 3 to FIG. 6, an operation for detecting whether or not resin residue has occurred in the gate 24 provided in the intermediate mold 10 shown in FIG. 3 using the gate suction mechanism 26 will be described. First, as shown in FIG. 6A, the gate suction mechanism 26 is set so that the suction portions 27 provided in the gate suction mechanism 26 correspond to the positions of the respective gates 24 provided in the intermediate mold 10. Move to a predetermined position below the intermediate mold 10.

  Next, as shown in FIG. 6B, the gate suction mechanism 26 is raised to bring the suction pad 27 b into close contact with the periphery of the opening 24 b of the gate 24 connected to the cavity 23. The suction pad 27b has a tapered cross-sectional shape whose tip expands. Since the suction pad 27b is formed of an elastic member such as silicone rubber or fluorine rubber, the suction pad 27b can be brought into close contact with the periphery of the opening 24b. In this way, air existing in the gate 24 is prevented from leaking into the cavity 23 from the opening 24 b of the gate 24.

Next, the air present in the gate 24 is sucked using the suction mechanism 30. The space in the gate 24 is in a state communicating with the outside of the intermediate mold 10, in other words, communicating with the atmosphere. Therefore, the suction mechanism 30 sucks air in the atmosphere. Air sucked from the atmosphere flows from a gate 24 provided in the intermediate mold 10 to a suction pad 27b provided in the gate suction mechanism 26, a suction part body 27a, a suction passage 28, and a pipe connected to the suction passage 28. 29, exhausted from the suction mechanism 30 via the flow sensor 31 in sequence. The total flow rate of the air sucked from the gate 24 is measured by the flow rate sensor 31. The control flow rate CTL compares the measured flow rate information corresponding to the measured total flow rate with the reference flow rate information stored in advance. In this way, it can be determined whether or not resin residue has occurred in the gate 24.

  In the intermediate mold 10 shown in FIG. 3A, it is assumed that all the 20 gates 24 are in a normal state with no resin remaining. In this normal state, as shown in FIG. 5A, the total flow rate of air sucked from the 20 gates 24 is measured by one flow rate sensor 31 using the suction mechanism 30.

  The suction amount of the suction mechanism 30 is set so that the measured value of the total flow rate of air sucked from the 20 gates 24 becomes an appropriate value, for example, 2 L / min. In other words, 2 L / min is set as a measured value of the total air flow rate. If there is no residual resin, the flow rate of air sucked from one gate 24 is the same, so the flow rate of air sucked from one gate 24 is 0.1 L / min. (= 2L / min / 20). In this way, the suction mechanism 30 performs suction so that the measured value of the flow rate of air sucked from one gate 24 becomes a constant value (0.1 L / min) in a normal state where there is no resin residue. The amount is set in advance. Therefore, by comparing the measured value (2 L / min) of the set total flow rate of the air with the measured value of the total flow rate of the air actually sucked by the gate suction mechanism 26, whether or not the resin residue has occurred. Can be judged.

  For example, the cured resin remains in one gate 24 out of the 20 gates 24 provided in the intermediate mold 10 shown in FIG. 3A, and the resin residue completely blocks the gate 24. Assume. In this state, air in the atmosphere is sucked from the gate 24 using the gate suction mechanism 26. The total flow rate of the air sucked from the 20 gates 24 is measured by the flow rate sensor 31. Of the 20 gates 24, air is not sucked from one of the gates 24 that is completely blocked by residual resin, so the total flow rate measured by the flow sensor 31 is 19 (20-1 ) The total flow rate of air sucked from the individual gates 24. Therefore, the total flow rate of air sucked from the 19 gates 24 is 1.9 L / min (= 2 L / min−0.1 L / min). When the total flow rate measured is less than 2 L / min, which is the total flow rate set as a measurement value in a normal state, it can be determined that resin residue is occurring in some gate 24. . In this way, it is possible to determine whether or not resin residue has occurred using the gate suction mechanism 26.

  In the above embodiment, the suction amount of the suction mechanism 30 is set so that the measured value of the total flow rate of air sucked from the 20 gates 24 is 2 L / min. The flow rate of air sucked from one gate 24 is 0.1 L / min (= 2 L / min ÷ 20). Accordingly, the total flow rate when there is complete resin residue in the two gates 24 is 1.8 L / min (= 2 L / min-0.2 L / min), and the total flow rate when there is resin residue in the three gates 24. The flow rate is 1.7 L / min (= 2 L / min-0.3 L / min). Thus, by setting the measured value of the flow rate of air sucked from one gate 24, it is possible to determine the number of gates 24 in which resin residue has occurred. However, it is impossible to determine which of the 20 gates 24 has resin residue.

  As shown in FIG. 5B, the case where the flow rate sensors 31 are provided for each of the four suction portions 27 provided in the suction passages 28 from the first row to the fifth row will be described. In this case, five flow rate sensors 31 are connected to each suction passage 28. Each suction passage 28 is connected to the suction mechanism 30 via five flow rate sensors 31. As in the case of FIG. 5A, the measured value of the total flow rate of air sucked by the suction mechanism 30 is set to 2 L / min. Therefore, the measured value of the total air flow rate measured by each flow sensor 31 is 0.4 L / min (= 2 L / min ÷ 5). Therefore, when the resin residue is generated in one gate 24 among the gates 24 corresponding to the four suction portions 27 connected to each suction passage 28, the total flow rate to be measured is 0.3L. / Min (= 0.4 L / min-0.1 L / min). Further, when the resin residue is generated in the two gates 24, the total flow rate to be measured is 0.2 L / min (= 0.4 L / min−0.2 L / min). In this case, it is possible to determine whether or not the resin residue is generated in the gate 24 corresponding to the suction portion 27 provided in which suction passage 28 among the five suction passages 28.

  Further, the suction passages 28 can be provided in all “rows” and “columns” along the horizontal direction (X direction) and the vertical direction (Y direction). The flow rate sensor 31 is provided corresponding to all the suction passages 28 provided along the horizontal direction and the vertical direction. Specifically, five flow rate sensors 31 corresponding to the five suction passages 28 provided from the first row to the fifth row and four suction passages provided from the first row to the fourth row are provided. 28, four flow sensors 31 are provided, and nine flow sensors 31 are provided in total. In this case, the flow rate of air sucked from all the suction passages 28 provided in the horizontal direction and the vertical direction can be measured independently. Therefore, it is possible to identify the gate 24 located at the intersection where the “row” and the “column” intersect each other, where the measured flow rate is smaller than the preset measured flow rate. It can be determined that the resin residue is generated in the gate 24 located at this intersection. In this way, it is possible to determine in which position of the 20 gates 24 the resin residue is generated at the gate 24 formed.

  In addition, independent suction passages 28 can be provided corresponding to the respective suction portions 27. In this case, independent flow rate sensors 31 are provided corresponding to the respective suction passages 28. Accordingly, one flow sensor 31 is provided independently corresponding to one suction part 27. A total of 20 flow sensors 31 are connected to the respective suction passages 28 provided in the gate suction mechanism 26. In this case, it is possible to individually determine whether or not the resin residue is generated in each of the gates 24 depending on whether or not air is flowing through each flow rate sensor 31. In this way, it is possible to directly specify which gate 24 out of the 20 gates 24 has residual resin.

  Up to this point, using the gate suction mechanism 26, the total flow rate of air sucked from the suction portions 27 corresponding to all the gates 24 provided in the intermediate mold 10 (see FIG. 3A) is collectively (1 The case where the measurement is performed by one flow sensor 31) or divided (by a plurality of flow sensors 31) is shown. Not limited to this, as shown in FIG. 3A, a gate suction mechanism 26 can be provided for each of a plurality of gates 24 provided along “rows” or “columns”.

  For example, as shown in FIG. 4A, a gate suction mechanism 26 having four suction portions 27 provided in the first row and suction passages 28 connecting these suction portions 27 as structural units. Provide. A suction mechanism 30 and a flow sensor 31 are connected to the suction passage 28. Using the gate suction mechanism 26, first, the flow rate sensor 31 measures the flow rate of air sucked from the four suction portions 27 corresponding to the four gates 24 provided in the first row of the intermediate mold 10. . Next, the flow rate of the sucked air corresponding to the four gates 24 provided in the second row is measured. Sequentially, the flow rate of the air sucked corresponding to the four gates 24 provided in each row is measured. In this way, the flow rate of the sucked air corresponding to the gates 24 provided in all “rows” is measured. This makes it possible to determine in which “row” the resin residue has occurred.

  Furthermore, a gate suction mechanism 26 corresponding to one gate 24 provided in the intermediate mold 10 can be provided. In this case, the gate suction mechanism 26 is provided with one suction portion 27 and one suction passage 28. Using the gate suction mechanism 26, the flow rate of the sucked air corresponding to all the gates 24 provided in the intermediate mold 10 is sequentially measured. By sucking all the gates 24, it is possible to determine which gate 24 has residual resin.

  According to this embodiment, the suction portion 27 provided in the gate suction mechanism 26 is in close contact with the periphery of the opening 24 b of the gate 24 provided in the intermediate mold 10, and the gate 24 is used by using the suction mechanism 30. Aspirate atmospheric air from The total flow rate of the sucked air is measured by the flow sensor 31. By comparing the measured total flow rate of air with the measured value of the total flow rate of air sucked in a normal state where there is no residual resin, it can be determined whether or not residual resin has occurred.

  Further, according to the present embodiment, the flow rate of the air sucked from the atmosphere is measured as a means for detecting the resin residue. The suction mechanism 30 is set in advance so that a measurement value of a predetermined flow rate can be obtained. Even if time elapses from the time when suction is started using the suction mechanism 30, the flow rate of the air to be sucked is always constant and does not depend on time. Therefore, it is not necessary to strictly monitor the flow rate of the air to be sucked, and it is possible to easily determine whether or not resin residue has occurred.

  Further, according to the present embodiment, the flow rate sensor 31 measures the flow rate of air sucked from the suction portion 27 provided in the gate suction mechanism 26. By detecting the change in the flow rate, it can be determined whether or not resin residue has occurred. It is set in advance so that a measurement value of a predetermined flow rate can be obtained using the suction mechanism 30 in a normal state with no resin residue. Accordingly, it is possible to arbitrarily determine the flow rate of air sucked from the suction portion 27 per piece. When the resin residue is generated and the gate 24 is completely blocked, air is not sucked from the suction portion 27 corresponding to the gate. Therefore, the total flow rate of the air sucked from the suction part 27 is reduced accordingly. Since the flow rate of air sucked from each suction portion 27 can be set as the sensitivity for detecting the resin residue, it can be accurately determined whether or not the resin residue is generated.

  Further, according to the present embodiment, a plurality of flow rate sensors 31 connected to the gate suction mechanism 26 can be provided along the horizontal direction or the vertical direction in accordance with the number of gates 24 provided in the intermediate mold 10. . Therefore, even when the number of gates 24 provided in the intermediate mold 10 becomes very large, the flow rate of air sucked from the suction portion 27 per piece can be set to an optimum value. Since the flow rate of the air sucked from the atmosphere is used as means for detecting the resin residue, the sensitivity for detecting the resin residue can be optimized according to the product.

  Further, the flow rate sensor 31 can be connected to the suction passages 28 provided in all “rows” and “columns” along the horizontal direction and the vertical direction of the gate suction mechanism 26. In this way, it is also possible to specify the gate 24 where the resin residue is generated by measuring the flow rate of the flow rate sensor 31 provided in all of the horizontal direction and the vertical direction.

  Further, according to the present embodiment, independent suction passages 28 and flow rate sensors 31 can be provided corresponding to the respective suction portions 27 provided in the gate suction mechanism 26. In this way, it is possible to directly identify the gate 24 where the resin residue is generated depending on whether or not air is flowing through the flow rate sensors 31 provided corresponding to all the gates 24.

  Further, according to the present embodiment, the gate suction mechanism 26 can be provided for a plurality of gates 24 provided along “rows” or “columns”. Using this gate suction mechanism 26, the flow rate of the sucked air is measured corresponding to the gates 24 provided in all the “rows” or “columns” sequentially. This makes it possible to confirm in which “row” or “column” the resin residue has occurred.

  Furthermore, a gate suction mechanism 26 corresponding to one gate 24 can be provided. In this case, the flow rate of the sucked air is measured using one suction part 27 corresponding to all the gates 24 provided in the intermediate mold 10 sequentially. By sucking all the gates 24, it is possible to determine which gate 24 has residual resin.

  Further, according to the present embodiment, the suction portion 27 is brought into close contact with the periphery of the opening 24b of the gate 24, and the flow rate of air sucked from the atmosphere via the gate 24 is measured. Since air in the atmosphere is sucked, the resin residue can be detected with a simple apparatus configuration and with a simple detection method. Therefore, the cost of the resin molding apparatus 1 can be reduced.

  With reference to FIG. 7, the structure of the gate suction mechanism 26 in the second embodiment will be described. The difference from the first embodiment is that the gate suction mechanism 26 is provided with an elastic member that supports the suction portion 27. As shown in FIG. 7, the gate suction mechanism 26 is provided with a recess 32 into which the suction part 27 is inserted. For example, a spring 33 or the like, which is an elastic member, is inserted into the recess 32, and the suction portion 27 is disposed thereon.

  In addition to the suction pad 27b formed of an elastic member, the suction portion 27 is also elastically supported by the spring 33. This can further enhance the adhesion of the suction pad 27b around the opening 24b of the gate 24 (see FIG. 3B). In this case, a spring 33 is provided in the recess 32 so as to elastically support the suction portion 27. Not only this but the structure which incorporates the spring which is an elastic member in the inside of the suction part main body 27a can also be made.

  With reference to FIGS. 8-12, the structure and operation | movement which perform resin sealing using the gate suction mechanism 26 in the resin molding apparatus 1 which concerns on this invention are demonstrated.

  As shown in FIG. 8, the loader 13 included in the resin molding apparatus 1 is configured such that a gate suction mechanism 26 according to the present invention is added to and integrated with a conventional transport mechanism. Therefore, the loader 13 has a function of placing the substrate 15 on which the chip 14 is mounted in the concave portion 19 of the lower mold 9, a function of supplying the resin tablet 16 to the pot 18, and sucking air in the atmosphere to remove the resin residue. A function of sucking the gate 24 for detection. FIG. 8 shows a configuration in which the loader 13 includes a gate suction mechanism 26 and the loader 13 and the gate suction mechanism 26 are integrated. Not limited to this, the loader 13 and the gate suction mechanism 26 can be separately configured and assembled.

  An operation of performing resin sealing using the gate suction mechanism 26 in the resin molding apparatus 1 will be described. First, the upper mold 6, the lower mold 9, and the intermediate mold 10 are opened. Next, the loader 13 is moved to a predetermined position between the intermediate mold 10 and the lower mold 9.

  As shown in FIG. 9, the loader 13 is moved up to bring the suction pad 27 b attached to the tip of the suction portion 27 into close contact with the periphery of the opening 24 b of the gate 24. Next, using the suction mechanism 30, air in the atmosphere is sucked through the gate 24 under conditions set in advance in a state where there is no residual resin (normal state). The total flow rate of the air sucked by the suction mechanism 30 is measured by the flow sensor 31.

  In FIG. 9, when the measured total air flow rate is different from the reference flow rate value measured in a normal state (when it is small), it is determined that any one of the gates 24 has residual resin. In that case, the resin sealing step is temporarily stopped. Then, the intermediate mold 10 is removed from the resin molding apparatus 1 and the gate 24 is cleaned. By washing, the resin residue of the cured resin is removed from the gate 24. Next, the cleaned intermediate mold 10 is attached to the resin molding apparatus 1 to check whether the measured value of the total flow rate of air sucked by the suction mechanism 30 is normal. If the measured value of the total flow rate is normal, the resin sealing process is restarted.

  As shown in FIG. 10, if the measured total air flow rate is the same as the reference flow rate value (reference flow rate information) measured in a normal state, it is determined that no resin residue has occurred in the gate 24. . If it is determined that there is no resin residue, the substrate 15 on which the chip 14 is mounted is placed in the recess 19 of the lower mold 9. Next, the resin tablet 16 is supplied to the pot 18. Next, the loader 13 is moved backward from a predetermined position. Next, the upper mold 6, the lower mold 9, and the intermediate mold 10 are clamped. After clamping, the resin tablet 16 is pressed and heated. The resin tablet 16 is melted by heating to produce a fluid resin. Next, the fluid resin is pressed by the plunger 20. The pressed fluid resin is injected from the pot 18 into the cavity 23 through the through hole 25, the cull 21, the runner 22, and the gate 24 in order. The curable resin 34 is formed by heating the fluid resin injected into the cavity 23 for a predetermined time. In this state, the chip 15 is sealed with the cured resin 34.

  As shown in FIG. 11, the intermediate mold 10 and the lower mold 9 are lowered from the upper mold 6 in a state where the intermediate mold 10 and the lower mold 9 are clamped. As a result, the molded product 35 sealed with the cured resin 34 is degaussed. By being degated, the cured resin formed in the cal 21, the runner 22, and the gate 24 is separated from the molded product 35 as an unnecessary resin 36. The separated unnecessary resin 36 remains in the upper mold 6. Next, the unloader 37 is moved to a predetermined position between the upper mold 6 and the intermediate mold 10. The unloader 37 is used to take out the unnecessary resin 36 from the upper mold 6.

  As shown in FIG. 12, the middle mold 10 and the lower mold 9 are opened. In this state, the upper mold 6, the lower mold 9 and the intermediate mold 10 are completely opened. The molded product 35 remains in the recess 19 of the lower mold. Next, the unloader 37 is moved again to a predetermined position between the intermediate mold 10 and the lower mold 9. Then, using the unloader 37, the molded product 35 is taken out. In this way, resin sealing is completed.

  According to this embodiment, the loader 13 is integrated with the gate suction mechanism 26. Therefore, the loader 13 has a function of transporting the substrate 15 and the resin tablet 16 on which the chip 14 is mounted and a function of sucking the gate 24 in order to detect the resin residue. Therefore, in the resin sealing step, it is possible to inspect whether or not resin residue has occurred immediately before resin sealing. Since the resin residue is inspected immediately before resin sealing, if the resin residue is detected, production can be stopped at that point. Therefore, it is possible to prevent molding defects due to resin residue.

  Further, according to the present embodiment, it is determined whether or not resin residue has occurred by using the gate suction mechanism 26 integrated with the loader 13. Air in the atmosphere is sucked from the gate 24 using the suction mechanism 30. The total flow rate of the sucked air is measured by the flow rate sensor 31 and compared with a reference flow rate value measured in a normal state with no resin residue. The total air flow rate measured by the flow rate sensor 31 has no time dependency and is a constant flow rate. Even if time elapses from the time when the suction is started, the total flow rate of air to be measured does not vary at a constant value. Therefore, it can be easily determined whether or not resin residue has occurred.

  Further, according to the present embodiment, the flow rate value of the air sucked from the suction portion 27 per piece using the suction mechanism 30 is set in advance in a normal state with no resin residue. Therefore, the flow rate of air sucked from one suction portion 27 can be set as the sensitivity for detecting the resin residue. When the resin residue is generated, air is not sucked from the suction portion 27, so that the flow rate of air to be measured is reduced by that amount. Therefore, if the measured total flow rate is smaller than a preset total flow rate measurement value, it can be determined that resin residue has occurred. In addition, the number of gates 24 where resin residue is generated can be estimated from the reduced flow rate.

  Further, according to the present embodiment, the suction portion 27 provided in the loader 13 is closely attached to the periphery of the opening 24b of the gate 24, and the flow rate of air sucked from the atmosphere via the gate 24 is measured. Therefore, the resin residue can be detected with a simple apparatus configuration and a simple detection method. Therefore, the cost of the resin molding apparatus 1 can be reduced.

  In each embodiment, the cavity 23 is provided on the lower surface side of the intermediate die 10 and the gate 24 is provided on the upper surface side of the intermediate die 10. The present invention is not limited to this, and the same effect can be obtained even when the cavity 23 is provided on the upper surface side of the intermediate mold 10 and the gate 24 is provided on the lower surface side of the intermediate mold 10.

  Moreover, in Example 3, the case where the gate suction mechanism 26 was incorporated in the loader 13 of the resin molding apparatus 1 was shown. Not only this but the gate suction mechanism 26 can be provided in the resin molding apparatus 1 separately from the loader 13. Furthermore, the gate suction mechanism 26 can be separated from the resin molding apparatus 1 and configured separately. In this case, in the resin molding apparatus group using the same intermediate mold 10 and the molding module group using the same intermediate mold 10, it is possible to detect whether or not the resin residue is generated using the gate suction mechanism 26. it can.

  In each of the above-described embodiments, the case where the resin remains, that is, the state where the cured resin remaining in the gate 24 completely blocks the gate 24 has been described. The present invention is not limited to this, and the present invention is applied even when the cured resin remaining in the gate 24 incompletely blocks the gate 24, that is, when the cross-sectional area of the space in which the fluid resin flows in the gate 24 becomes narrow. can do.

  In each embodiment, air in the atmosphere is sucked from a predetermined number of suction portions 27 provided in the gate suction mechanism 26 using the suction mechanism 30. However, the present invention is not limited thereto, and the gas existing inside the gate 24 may be sucked from a predetermined number of suction portions 27 in a state where the upper mold 6 and the intermediate mold 10 are clamped. In this case, since the flow rate changes transiently after the suction is started, it can be determined whether or not the resin residue has occurred based on the measured change in the flow rate. In this case, it is preferable to provide a seal member between the upper mold 6 and the intermediate mold 10 so that the inside of the gate 24 is completely closed.

  In each of the embodiments, a resin molding apparatus that uses transfer molding and has been described as a resin molding apparatus that seals the chip 14 mounted on the substrate 15 with resin. The object to be resin-sealed may be a semiconductor chip such as an IC, LED, or transistor, or may be a passive element. The present invention can be applied when resin-sealing one or a plurality of electronic components mounted on a substrate such as a lead frame, a printed circuit board, or a ceramic substrate.

  The present invention is applied not only to resin-sealing electronic components, but also to optical components such as lenses, light guide plates, reflectors (reflectors), optical modules, and other general resin products manufactured by resin molding. can do.

  The resin molding apparatus using two molding dies is not limited to the resin molding apparatus using three molding dies. In this case, one of the upper mold and the lower mold corresponds to 10 shown in FIG.

  Furthermore, the present invention can be applied not only to transfer molding but also to a resin molding apparatus that performs injection molding. The term “injection molding” means “the process of injecting material from a heated cylinder through a sprue (runner, gate) into a closed mold cavity under pressure (JIS K 6900). reference).

  The present invention is not limited to the above-described embodiments, and can be arbitrarily combined, modified, or selected and adopted as necessary within the scope not departing from the gist of the present invention. It is.

DESCRIPTION OF SYMBOLS 1 Resin molding apparatus 2 Base 3 Tie bar 4 Fixed platen 5 Upper mold plate 6 Upper mold (molding die group)
7 Movable platen 8 Lower mold plate 9 Lower mold (second mold, mold group)
10 Intermediate mold (first mold, mold group)
11 Drive mechanism (clamping mechanism)
12 Clamping mechanism 13 Loader (conveyance mechanism)
14 Chip 15 Substrate 16 Resin Tablet 17 Wire 18 Pot 19 Recess 20 Plunger 21 Cal 22 Runner 23 Cavity 24 Gate 24a Open 24b Open 25 Through Hole 26 Gate Suction Mechanism 27 Suction Part 27a Suction Part Main Body (Suction Part)
27b Suction pad (suction part)
28 Suction passage 29 Piping 30 Suction mechanism 31 Flow rate sensor (flow rate measuring means)
32 Concave portion 33 Spring (elastic body)
34 Cured resin 35 Molded product 36 Unnecessary resin 37 Unloader (conveyance mechanism)
CTL judgment means

Claims (14)

A first mold, a second mold provided opposite to the first mold, and a side of the first mold facing the second mold and injected. A cavity comprising a space in which the fluid resin is cured to form a cured resin, a gate comprising a space provided in the first mold and connected to the top surface of the cavity, and the first A resin molding apparatus comprising a mold clamping mechanism for clamping a mold group having at least a molding die and the second molding die, and molding a molded product having the cured resin,
A gate suction mechanism disposed between the first mold and the second mold so as to overlap the cavity;
A suction part provided in the gate suction mechanism;
A suction passage provided in the gate suction mechanism and connected to the suction portion;
Piping connected to the suction passage;
A suction mechanism connected to the pipe;
A flow rate measuring means for generating measured flow rate information according to a flow rate provided in the pipe and passing through the pipe;
A determination unit that calculates the flow rate based on the measured flow rate information received from the flow rate measurement unit and performs a predetermined determination based on the flow rate;
In the flow rate measuring means, the tip of the suction part is in close contact with the mold surface of the first mold around the opening of the gate, and the gas present in the gate is sucked by the suction mechanism Generating the measured flow rate information in a state;
The predetermined determination is performed by comparing the measured flow rate information with reference flow rate information measured and stored in advance in a state where the cured resin does not remain in the gate, so that the cured resin remains in the gate. A resin molding apparatus characterized by determining whether or not the In the resin molding apparatus described in claim 1,
A plurality of the gates are provided;
A resin molding apparatus, wherein a plurality of suction portions are provided corresponding to the plurality of gates, respectively. In the resin molding apparatus described in claim 2,
A resin molding apparatus comprising a plurality of cavities corresponding to the plurality of gates, respectively. In the resin molding device according to claim 2 or 3,
The plurality of suction portions are arranged along a second direction in which one row of m suction portions arranged along the first direction when viewed in a plan view intersects the first direction. M × n suction parts composed of n rows of suction parts (m and n are both positive integers),
The gate suction mechanism has n suction passages communicating the m suction portions in each of the n rows of suction portions,
The resin molding apparatus according to claim 1, wherein the n suction passages are respectively connected to a portion of the common pipe opposite to the suction mechanism as viewed from the flow rate measuring unit. In the resin molding device according to claim 2 or 3,
N pipes connected to the suction mechanism;
The plurality of suction portions are arranged along a second direction in which one row of m suction portions arranged along the first direction when viewed in a plan view intersects the first direction. M × n suction parts composed of n rows of suction parts (m and n are both positive integers),
The gate suction mechanism has n suction passages communicating the m suction portions in each of the n rows of suction portions,
The n number of suction passages are respectively connected to the n number of pipes. In the resin molding apparatus as described in any one of Claims 1-5,
A resin molding apparatus comprising an elastic body that supports each of the suction portions. In the resin molding apparatus as described in any one of Claims 1-6,
A transport mechanism that performs at least one of an operation of carrying in and delivering a material for molding the molded product to the mold group or an operation of taking out the molded product from the mold group;
The resin molding apparatus, wherein the gate suction mechanism is provided in the transport mechanism. A first mold having a cavity composed of a space in which the flowable resin is cured and a cured resin is to be formed, and the first mold is provided opposite to the side where the cavity is formed. A step of preparing a mold group having at least a second mold, a step of clamping the mold group, and a space provided in the first mold and connected to the top surface of the cavity. A step of injecting the flowable resin into the cavity via a gate, a step of curing the flowable resin to form the cured resin, a step of opening the mold group, and the cured resin. A resin molding method comprising a step of removing a molded product having the mold from the mold group,
Adhering the tip of the suction part to the mold surface of the first mold around the gate opening;
In the state where the cured resin does not remain in the gate, the pipe passes through the pipe connected to the suction section while sucking the gas existing in the gate through the suction section using a suction mechanism. Measuring a reference flow rate; and
Storing reference flow rate information generated based on the reference flow rate;
Measuring the flow rate passing through the pipe in the pipe while sucking the gas present in the gate via the suction section using the suction mechanism;
Generating measured flow rate information based on the flow rate;
And comparing the reference flow rate information with the measured flow rate information to determine whether or not the cured resin remains in the gate. In the resin molding method according to claim 8,
A plurality of the gates and the suction portions corresponding to the gates are provided,
In the step of bringing the tips of the suction portions into close contact, the tips of the plurality of suction portions are brought into close contact with the mold surface of the first mold around the openings of the plurality of gates, respectively.
In the step of sucking the gas existing in the gate, the resin molding method is characterized by sucking the gas existing in the plurality of gates through the plurality of suction portions. In the resin molding method according to claim 9,
A plurality of the cavities are provided corresponding to a plurality of the gates,
In the step of sucking the gas existing in the gate, the resin molding method is characterized by sucking the gas existing in the plurality of gates through the plurality of suction portions. In the resin molding method according to claim 9 or 10,
The plurality of suction portions are arranged along a second direction in which one row of m suction portions arranged along the first direction when viewed in a plan view intersects the first direction. M × n suction parts composed of n rows of suction parts (m and n are both positive integers),
In the step of sucking the gas existing in the gate, the gas existing in the plurality of gates via the n suction passages communicating with the m suction portions in each of the n rows of suction portions. Aspirate all at once,
In the step of generating the measurement flow rate information, the side closer to the suction mechanism than the n suction passages in the pipe commonly connected to the n suction passages when sucking the gas in a lump And measuring the flow rate to generate the measured flow rate information. In the resin molding method according to claim 9 or 10,
The plurality of suction portions are arranged along a second direction in which one row of m suction portions arranged along the first direction when viewed in a plan view intersects the first direction. M × n suction parts composed of n rows of suction parts (m and n are both positive integers),
In the step of sucking the gas existing in the gate, each of the n rows of suction portions passes through each of the n rows of suction portions, and each of the n rows of suction portions communicates with the m suction portions. Sucking each gas present in the m gates corresponding to the m suction parts of
In the step of generating the measurement flow rate information, the resin flow molding method is characterized in that n pieces of the measurement flow rate information are generated by measuring the flow rates in the pipes corresponding to the suction units of the n rows, respectively. In the resin molding method as described in any one of Claims 8-12,
In the step of closely contacting the tip of the suction part, the suction part is supported by an elastic body. In the resin molding method as described in any one of Claims 8-13,
Preparing a transport mechanism provided with the suction part;
Carrying the material for molding the molded article into the mold group and delivering it;
Removing the molded product from the mold group,
Using the transport mechanism, perform at least one of the delivery step or the removal step,
The resin molding method characterized in that at least the step of bringing the tip of the suction part into close contact, the step of sucking the gas existing in the gate, and the step of measuring the flow rate are performed in the handing over or in the step of taking out. .

Images