1253724 九、發明說明： 【’务明所屬#支彳，奸領】 技術領域 本發明係有關於將安裝於印㈣板等電路基板（以下 5稱作「基板」）之晶片狀元件（以下視情況稱作「晶片」）樹 脂密封，藉此形成電子零件之樹脂密封裝置及樹脂密封方 法。 C先前才支冬餘j 背景技術 10 苓妝第7圖〜第10圖說明習知之樹脂密封裝置。另，以 下所不之圖式皆為了方便說明而誇大描繪。 如第7圖〜第10圖所示，樹脂密封裝置設有包含下模工 及上模2之樹脂密封模3。又，在下模丨設有凹部4。將構成 下杈1的一部分之基板塊5設置於凹部4，且基板塊5由盤形 15彈簧6所構成之盤形彈簧單元7彈性地支持。又，在盤形彈 耳7與凹部4的底面之間設有具有預定厚度之分隔器8。又， 罐塊9固疋於凹部4且與基板塊5相鄰接。換言之，基板塊5 藉由盤形彈簧單元7彈性地支持，可一面與罐塊9之側壁接 觸一面上升及下降。又，在罐塊9設有具有圓筒狀空間之罐 2〇部1〇。在罐部10内設有可上升及下降之圓柱形柱塞11。在 桂基11上載置有作為流動性樹脂之原材料之樹脂錠12。 另一方面，在上模2上與罐部10相向之位置設有凹部狀 之殘料廢品部13。並設置溝狀之流槽14以與殘料廢品部13 相連。又，設置凹部之模穴15以與流槽14相連。即，在上 1253724 板2與下模1業經合模之狀態下，透過由殘料廢品部i3與流 槽14所構成之樹脂流路使罐部1〇與模穴15相連通。再者， 在基板塊5上，將安裝有丨個或多個晶片（未圖示）之基板 的端面（圖中右側之側面）與基板塊5的端面（圖中右側之側 5面）設置成包含在同一平面上。又，基板16在上模2與下模工 業經合模之狀態下設置成安裝於基板16之晶片會收容在模 穴15内之狀態。 、 W述習知之樹脂密封裝置係進行下列動作。首先，在 第7圖所示之狀態中，使上模2下降。藉此，下模i中罐塊9 10的上面與上模2的下面會在合模面p丄接觸，而使上模2與下 杈1合椟。在該合模狀態下，藉由利用盤形彈簧單元7彈性 地支持之基板塊5與上模2以預定夾持壓力夾住基板16。 又’罐塊9會抵壓於上模2。 在上模2契下模1合模時，基板塊$一面與罐塊9之側壁 15接觸-面下降。接著，如第8圖所示，藉由設於下模工之加 熱器（未圖示）加熱樹脂錠12，以使其溶融。、结果產生流動性 樹脂17。 接者，使柱塞11上升。藉此，如第8圖所示，流動性樹 月曰17因為來自柱基u的壓力，依序經由殘料廢品部^及流 心14/主人模人15。接著，再次加熱流動性樹船7，以使其 硬化。絲，會形成硬化樹脂。如此一來，可完成包含基 板日日片及硬化树脂之樹脂成形體。然《炱，使上模2與下模 1開杈且取出包含基板16與硬化樹脂之樹脂成形體。在上 模人下模1開模¥，基板塊5_面與罐塊9之側壁接觸一面 6 1253724。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The case is referred to as "wafer" resin sealing, thereby forming a resin sealing device and a resin sealing method for electronic parts. C. Previously, the winter j background. 10 苓 makeup Fig. 7 to Fig. 10 illustrate a conventional resin sealing device. In addition, the following drawings are exaggerated for convenience of explanation. As shown in Figs. 7 to 10, the resin sealing device is provided with a resin sealing mold 3 including a lower mold and an upper mold 2. Further, a recess 4 is provided in the lower mold. The substrate block 5 constituting a part of the lower jaw 1 is placed in the concave portion 4, and the disk block spring unit 7 composed of the disc-shaped spring 6 is elastically supported by the substrate block 5. Further, a separator 8 having a predetermined thickness is provided between the disk-shaped latch 7 and the bottom surface of the recess 4. Further, the can 9 is fixed to the recess 4 and adjacent to the substrate block 5. In other words, the substrate block 5 is elastically supported by the disc spring unit 7, and can be raised and lowered while being in contact with the side wall of the can block 9. Further, the tank block 9 is provided with a tank 2 having a cylindrical space. A cylindrical plunger 11 that can be raised and lowered is provided in the can portion 10. A resin ingot 12 as a raw material of a fluid resin is placed on the Guiji 11. On the other hand, a recessed waste portion 13 having a concave portion is provided at a position facing the tank portion 10 on the upper mold 2. A groove-like flow groove 14 is provided to be connected to the residue waste portion 13. Further, a cavity 15 of the recess is provided to be connected to the launder 14. In other words, in the state where the upper plate 1 and the lower die 1 are closed by the upper 1253724, the can portion 1 is communicated with the cavity 15 through the resin flow path formed by the residue waste portion i3 and the flow groove 14. Further, on the substrate block 5, an end surface of the substrate on which one or more wafers (not shown) are mounted (the side surface on the right side in the drawing) and an end surface of the substrate block 5 (the side on the right side in the figure) are disposed. The inclusions are on the same plane. Further, the substrate 16 is placed in a state in which the upper mold 2 and the lower mold are clamped so that the wafer mounted on the substrate 16 is housed in the cavity 15. The conventional resin sealing device performs the following actions. First, in the state shown in Fig. 7, the upper mold 2 is lowered. Thereby, the upper surface of the can block 9 10 in the lower mold i and the lower surface of the upper mold 2 are brought into contact with the lower surface of the upper mold 2, and the upper mold 2 and the lower mold 1 are joined together. In the mold clamping state, the substrate 16 is sandwiched by the substrate block 5 and the upper mold 2 which are elastically supported by the disk spring unit 7 at a predetermined nip pressure. Further, the can 9 will be pressed against the upper mold 2. When the upper mold 2 is closed by the lower mold 1, the side of the substrate block $ is in contact with the side wall 15 of the can 9 and the surface is lowered. Next, as shown in Fig. 8, the resin ingot 12 is heated by a heater (not shown) provided in a lower mold to be melted. As a result, a fluidity resin 17 is produced. The picker raises the plunger 11. As a result, as shown in Fig. 8, the fluidity tree 17 is sequentially passed through the residue waste portion and the fluid core 14/master mold 15 because of the pressure from the column base u. Next, the fluid tree boat 7 is heated again to harden it. Silk, will form a hardening resin. In this way, the resin molded body including the substrate day sheet and the cured resin can be completed. Then, the upper mold 2 and the lower mold 1 are opened, and the resin molded body including the substrate 16 and the cured resin is taken out. In the upper mold, the lower mold 1 is opened, and the surface of the substrate block 5_ is in contact with the side wall of the can 9 6 1253724
上升D 然而，上述先前技術會有以下的問題。 第1，如第9圖所示’會有在基板16的端面（圖中右側之 側面）與罐塊9的側壁（圖中左側之側面）之間產生間隙所引 5 起的問題。在習知之樹脂密封裝置中，藉由在基板塊5的側 壁與罐塊9的側壁之間設有間隙18，以避免損及基板塊5上 升及下降的功能。因此，流動性樹脂17會侵入間隙18，然 後硬化。如此一來，如第9圖所示，在間隙18中會形成不必 要的硬化樹脂19。此時，不必要的硬化樹脂19在間隙18中 1〇 會被基板塊5與罐塊9夾住，或者附著於基板塊5。因此，在 下一樹脂密封步驟中，硬化樹脂19會阻礙基板塊5的上升及 下降。藉此，首先，如第10圖所示，上模2與下模1之合模 會不充分，因而在罐塊9的上面與上模2的下面之間產生間 隙20。流動性樹脂17會流入該間隙20，且流動性樹脂17會 15在間隙20内硬化，如此一來，會形成樹脂溢料。結果，樹 脂成形體會成為不良品。又，當如上所述形成樹脂溢料時， 會阻礙基板塊5的下降。因此，基板16會被上模2以過大的 夾持壓力向下壓。結果，隨著基板16特性的不同，會在基 板16產生損傷，或者有損壞基板16之虞。 20 第2，會有利用盤形彈簧單元7的彈性力夾持基板16所 引起的問題。首先，當每個基板16的厚度不均很大時，相 對地有較大厚度的基板16會被以過大的夾持壓力抵壓上模 2而損傷。接著，此時也會在罐塊9的上面與上模2的下面之 間產生間隙20，且在該間隙20形成樹脂溢料，結果，樹脂 7 1253724 成形體會成為不良品。再者，即使變更基板16的種類而使 用厚度不同之其他種類的基板16，由於繼續使用變更基板 16的種類之丽的盤形彈簧單元7，故盤形彈簧單元7仍無法 吸收變更基板16的種類所產生的厚度差。因此，必須作分 ' 5解下模1來增加或減少盤形彈簧6的數量或者將分隔器峨 _ 《其他厚度不同的東西等之調整，結果，會有增加製造步 驟的問題。這些問題在以利用適當的夾持壓力來爽持基板 鲁 16為目的個其他種_彈簧或高分子㈣等其他彈性構 件來取代盤形彈簧單元7時也會發生。 又，上速多數問題中關於不必要的硬化樹脂19，即， 樹脂溢料的問題，隨著因應想讓電子零件變薄的需求而廣 為使用黏性低的流動性樹脂的情況會更容易發生。 C發明内容3 發明之揭示 15 #鑑於上述問題，本發明之目的在於提供可防止形成 φ 樹脂溢料、損傷樹脂成形品及增加調整樹脂成形品的高度 的時間與勞力之樹脂密封裝置及樹脂密封方法。 為了達成上述目的，本發明之其中一局面的樹脂密封 裝置具有可設置安裝有晶片狀元件之基板之下模，且=塊 2〇可上升及下降地嵌入下模。罐塊具有可儲存流動性樹脂之 罐部。柱塞可上升及下降地塞入罐部。柱塞用以推出流動 性樹脂。上模具有可收容晶片狀元件之模穴及可使罐部與 模八相連通之樹脂流路。在該樹脂密封裝置中，藉由、、主入 模穴之流動性樹脂硬化後之硬化樹脂將晶片狀元件樹脂密 8 125372.4 封。 又，該樹脂密縣置更具有可使罐塊升降之升 構。在上模與下模業經合模之狀態下，藉由上模盘下模以 適當的壓力夾持基板，同時，藉由升降機構使罐塊抵壓上 松。另-方面，在已解除上模與下模之合模的狀態下，藉 由升降機構使罐塊與下模接觸並上升。 曰Rising D However, the above prior art has the following problems. First, as shown in Fig. 9, there is a problem that a gap is formed between the end surface of the substrate 16 (the side surface on the right side in the drawing) and the side wall of the can 9 (the side surface on the left side in the drawing). In the conventional resin sealing device, a gap 18 is provided between the side wall of the substrate block 5 and the side wall of the can block 9 to avoid the function of damaging the rise and fall of the substrate block 5. Therefore, the fluid resin 17 intrudes into the gap 18 and then hardens. As a result, as shown in Fig. 9, an unnecessary hardening resin 19 is formed in the gap 18. At this time, the unnecessary hardened resin 19 is sandwiched by the substrate block 5 and the can block 9 in the gap 18, or adhered to the substrate block 5. Therefore, in the next resin sealing step, the hardening resin 19 hinders the rise and fall of the substrate block 5. Thereby, first, as shown in Fig. 10, the mold clamping of the upper mold 2 and the lower mold 1 is insufficient, so that a gap 20 is formed between the upper surface of the can block 9 and the lower surface of the upper mold 2. The fluid resin 17 flows into the gap 20, and the fluid resin 17 is hardened in the gap 20, and as a result, a resin flash is formed. As a result, the resin molded body becomes a defective product. Further, when the resin flash is formed as described above, the lowering of the substrate block 5 is hindered. Therefore, the substrate 16 is pressed downward by the upper mold 2 with an excessive nip pressure. As a result, damage may occur in the substrate 16 or damage to the substrate 16 depending on the characteristics of the substrate 16. 20 Second, there is a problem caused by the sandwiching of the substrate 16 by the elastic force of the disc spring unit 7. First, when the thickness of each of the substrates 16 is not uniform, the substrate 16 having a relatively large thickness is relatively damaged by pressing the upper mold 2 with an excessive nip pressure. Next, at this time, a gap 20 is also formed between the upper surface of the can 9 and the lower surface of the upper mold 2, and a resin overflow is formed in the gap 20. As a result, the molded body of the resin 7 1253724 becomes a defective product. Further, even if the other types of substrates 16 having different thicknesses are used to change the type of the substrate 16, the disk spring unit 7 which changes the type of the substrate 16 is continuously used, so that the disk spring unit 7 cannot absorb the change of the substrate 16. The difference in thickness produced by the type. Therefore, it is necessary to divide the mold 1 to increase or decrease the number of the disc springs 6 or to adjust the separator 峨 _ "other things having different thicknesses, and as a result, there is a problem that the manufacturing steps are increased. These problems also occur when the disc spring unit 7 is replaced by another elastic member such as a spring or a polymer (four) for the purpose of using the appropriate nip pressure to hold the substrate. Further, in the case of the above-mentioned problem of the unnecessary hardening resin 19, that is, the resin flashing, it is easier to use a fluid resin having a low viscosity in response to the demand for thinning of the electronic component. occur. C. Disclosure of the Invention 3 In view of the above problems, an object of the present invention is to provide a resin sealing device and a resin seal which can prevent the formation of φ resin flash, damage resin molded articles, and increase the time and labor of adjusting the height of the resin molded article. method. In order to achieve the above object, a resin sealing device of one aspect of the present invention has a substrate lower mold which can be provided with a wafer-like element, and the block 2 can be inserted into the lower mold so as to be raised and lowered. The can has a can that can store a flowable resin. The plunger can be pushed up and down into the can. The plunger is used to push out the fluid resin. The upper mold has a cavity for accommodating the wafer-like member and a resin flow path for allowing the can portion to communicate with the die. In the resin sealing device, the wafer-shaped element resin is sealed by a hardening resin which is cured by a fluid resin which is mainly introduced into the cavity. Further, the resin dense county has an additional structure for raising and lowering the can. In the state where the upper mold and the lower mold are closed, the substrate is held at an appropriate pressure by the upper mold lower mold, and at the same time, the can is pressed and loosened by the lifting mechanism. On the other hand, in a state where the clamping of the upper mold and the lower mold has been released, the can body is brought into contact with the lower mold by the lifting mechanism and raised.曰
又，本發明之另-局面的樹脂密封裳置具有可設置安 裳有晶片狀元件之基板之下模。罐塊嵌人下模。罐塊呈有 可儲存流動性職之罐部。餘可上升及下降地夷入罐 部。柱塞用以推出流動性樹脂。又，上模係設置成與下模 相向。上模具有可收容晶片狀元件之模穴及可使罐部盘模 穴相連通之樹脂流路。X，在該樹脂密封裝置中，藉由注 入模穴之流動性樹脂硬化後之硬化樹脂將晶片狀元件樹脂 密封。 15 韻絲封裝置更具有可在上模與下模之合模完成之 前，使基板抵壓罐塊之側壁之可動構件。在該樹脂密封裝 置中，罐塊與下模可相對地上升及下降，1，在基板抵壓 罐塊之側壁的狀態下，將流動性樹脂注入模穴。 又，在本發明之其中一局面的樹脂密封方法中使用下 20 述樹脂密封裝置。 該樹脂密封裝置具有可設置安裝有晶片狀元件之基板 之下模。罐塊可上升及下降地嵌入下模。罐塊具有可儲存 流動性樹脂之罐#。柱s可上升及下降地塞入罐部。柱塞 用以推出流動性樹脂。又，上模係設置成與下模相向。上 9 1253724 杈具有可收容前述晶片狀件 述模穴相連通之樹脂流路。^八及了㈣述罐部與前 封裝==其中：!樹脂密封方法中使用樹脂密 曰由左入杈八之流動性樹脂硬化後之 將晶片狀元件樹脂密封。 咖 * 在該樹脂密封方法中，首l使上模與下模以適 10 吾的塗力失持基板。接著，使罐塊抵壓上模。藉由前述夹 持=板之步驟與抵壓罐塊之步驟，使上模與下模合模。又， $刖述樹脂密封方法中，藉由柱塞將流動性樹脂注入模 穴，然後，使流動性樹脂硬化。接著，在解除上模與下模 之合模後’使罐塊與下模接觸並上升。 又，在本發明之另一局面的樹脂密封方法中使用下述 樹脂密封裝置。 該樹脂密封裝置具有可設置安裝有晶片狀元件之基板 15之下模。罐塊可上升及下降地嵌入下模。罐塊具有可儲存 飢動性樹脂之罐部。柱塞可上升及下降地塞入罐部。柱塞 用以推出流動性樹脂。又，上模係設置成與下模相向。上 有了收谷兩述晶片狀元件之模穴^及可使前述罐部與前 述模穴相連通之樹脂流路。 力 在本發明之另一局面的樹脂密封方法中使用樹脂密封 衣置且藉由注入模穴之流動性樹脂硬化後之硬化樹脂將 晶片狀元件樹脂密封。 在該樹脂密封方法中，首先，使上模與下模夾持基板。 接著使罐塊抵壓上模。藉由前述夾持基板之步驟與抵壓 1253724 5 10 15 罐塊之步驟’使上模與下模合模。又，在前述樹脂密封方 法中’在上模與下模之合模完成之前，使基板抵壓罐塊之 側壁’且在該狀態下，藉由柱塞將流祕樹脂注入模六， 然後’使流動性樹脂硬化。接著，使上模與下模開模。 根據本發明之其中一局面的樹脂密封裝置及樹脂密封 方法’在已解除上模與下模之合模的狀態下，罐塊一面與 基板塊接冑©上升。藉此，即使形成侵人間隙的流動性 樹脂硬化後之不必要的硬化翻，亦可藉由罐塊的上升， 刮除該不衫的硬化樹脂。因此，可韻下模與罐塊的平 滑滑動。藉此，首先，由於可防止在罐塊的上面與上模的 下面之間形成間隙’故可防止該間隙中產生樹脂溢料。又， 在基板中可防止損傷。 又，不透過盤形彈簧單元而藉由下模與上模以適當的 夾持壓力來夾持基板。藉此，相較於使用盤形彈箬單元的 Γ生來夾持基板時，可藉由控制下模或上模的動作，以適 二的«壓力來夹持基板。因此，即使每個基板的厚度不 ^母個基板的規格不同，亦可防止發生基板損傷的情 ^同時，無制㈣形彈簧-«等來調整基板的高 度位置。 又’ f上模與下模業經合模之狀態下，藉由升降機構 罐塊抵壓上模。藉此，由於可防止在罐塊的上面與上模 的下面之間形成_，故可防止該_巾產生樹脂溢料。 根據本發明之另-局面的樹脂密封裝置及樹脂密封方 法’在基板抵壓罐塊之側壁的狀態下，即，在罐塊之側壁 20 1253724 與基板之端面之間未產生間隙的狀態下，將流動性樹脂注 入模穴。藉此，可防止流動性樹脂侵入設於下模與罐塊之 間的間隙。因此，由於該間隙未形成不必要的硬化樹脂， 因此，可確保下模與罐塊的平滑滑動。藉此，可防止在罐 5 塊的上面與上模的下面之間的間隙產生樹脂溢料。同時， 可防止基板損傷。 本發明之上述及其他目的、特徵、局面及優點從與所 附圖式相關連所理解之與本發明相關之下列詳細的說明中 可理解。 10 圖式簡單說明 第1圖係顯示實施形態1之樹脂密封裝置之合模前的狀 態之截面圖。 第2圖係顯示在實施形態1之樹脂密封裝置業經合模 後，將流動性樹脂注入模穴内的狀態之截面圖。 15 第3圖係顯示在實施形態2之樹脂密封裝置之合模前， 基板與罐塊接觸後的狀態之截面圖。 第4圖係顯示在實施形態2之樹脂密封裝置業經合模 後，將流動性樹脂注入模穴内的狀態之截面圖。 第5圖係顯示在實施形態3之樹脂密封裝置業經合模且 20 基板與罐塊接觸後，將流動性樹脂注入模穴内的狀態之截 面圖。 第6圖係顯示實施形態3之樹脂密封裝置業經開模的狀 態之截面圖。 第7圖係顯示習知之樹脂密封裝置之合模前的狀態之 12 1253724 截面圖。 第8圖係顯示在習知之樹脂密封裝置業經合模後，將流 動性樹脂注入模穴内的狀態之截面圖。 第9圖係顯示習知之樹脂密封裝置中，流動性樹脂侵入 5 間隙的狀態之截面圖。 第10圖係顯示因侵入間隙的流動性樹脂產生硬化而阻 礙基板塊之上升及下降的狀態之截面圖。 I：實施方式；3 實施發明之最佳形態 10 以下，一面參照圖式一面說明本發明之各實施形態之 樹脂密封裝置。本發明之各實施形態之樹脂密封裝置的基 本構造與習知之樹脂密封裝置的基本構造大致相同。另， 在第7圖〜第10圖所示之先前技術之樹脂密封裝置及第i圖〜 第6圖所示之實施形態之樹脂密封裝置中分別在具有相同 15 構造及功能之部位賦予同一符號。 (實施形態1) -面蒼照第1圖及第2圖-面說明本發明之實施形態i 之樹脂密封裝置。如第i圖所丨，在本實施形態之樹脂密封 裝置中，在下模1設置凹部4。在凹部4設置構成下模i的一 2〇部份之基板塊5且接在凹部4的底面。即，基板彰係設置成 不透過盤形彈簧單元等彈性構件而直接與下模i之凹部4接 觸。又，在本實施形態中，罐塊9由支持於下模k線圈彈 黃21彈性地支持。更具體而言，線圈彈菁21分別彼入設於 罐塊9下面的敌合孔22與設於下模i之凹部4的纟面至預定 13 1253724 深度的位置且與嵌合孔22相向之嵌合孔Μ。 」妾著’說明本實施形態之樹脂密封裝置的動作。首先， 如第1圖所示，在上模2與下模1業經開模之狀態下，罐塊9 的上面會突出至基板16的上面。 5 接著，上模2的模面依序與罐塊9的上面和基板16的上 面接觸。藉此’如第2圖所示，以預定夾持壓力使上模2分 別抵壓罐塊9及基板16。II此，罐塊9的下降會使線圈彈菁 21縮小，同時，會使上模2與下模⑷莫。接著，將流動性 樹脂17注入模穴15内，然後使其硬化。結果會形成硬化樹 10 脂（未圖示）。 〃本貫施形態中，上模2抵壓罐塊9與基板16的夹持壓力 係預先CT定以滿足下列2個條件。 第1 ’夾持壓力依照基板16的特性訂定成*會損傷基板 16的值。又’該夾持壓力可藉由控制下模！與上模2的動作 U來變更。換言之，該夾持壓力係藉由用以檢測該值之壓力 感測器與根據壓力感測器所測出的值來控制上模2或下模 1(第1圖中是上模2)的上升及下降之控制機構來調整。 第2，夾持壓力係將該夾持壓力與罐塊9藉由線圈彈菩 21抵®上模2之壓力的和設定成非常大的值，以達到罐塊9 20與上模2之間不會產生間隙的程度，即，不會發生流動性樹 脂Π漏出的情況之程度。又，基板16不透過彈性構件而藉 由上模2與設置於下模丨上之基板塊5來夹持。因此，在該步 k中，首先，藉由上模2將依照基板16的特性之適當的夾持 壓力直接施加於基板16，故可防止基板16損傷。又，由於 1253724 5 可防止罐塊9與上模2之間產生間隙，故可 料。因^可防止產生樹脂成形品的不良品。f月曰温 接者使上权2上升，以使上模2與下模 當上模軸上料，即，#柄已解除地 = 模的狀態時，藉由使線圈彈簧21伸長，以將物向上 藉此，返回第1圖所示之位置。又，伴隨於此，罐塊9^面 與基板塊5接觸—面上升。藉此，即使侵人物與基板塊5 之間的間隙18的流動性樹脂17硬化，且形成不必要的硬化 樹脂（參照第_的不必要的硬化樹脂19)，亦可藉由上升之 1〇罐塊9將不必要的硬化樹脂觀。因此，不會損害罐塊9平 滑的上升及下降的功能。接著，設於下模1之頂出銷（未圖 不）使樹脂成形體從下模i突出，然後，搬送機構（未圖示） 將樹脂成形體送出。 根據本實施形態之樹脂密封裝置，形成於罐塊9與基板 15塊5之間的間隙18的不必要的硬化樹脂可藉由罐塊9的上升 加以刮除。因此，可確保下模丨之基板塊5與罐塊9的平滑滑 動。又，在上模2與下模i業經合模之狀態下，使罐塊9以適 當的壓力抵壓上模2。因此，可防止在罐塊9的上面與上模2 的下面形成間隙，故可防止該間隙中產生樹脂溢料。又， 2〇在上模2與下模1業經合模之狀態下，以適當的夾持壓力藉 由上模2與下模1夾持基板16。因此，可防止基板16損傷， 同日守’在每個基板16的厚度不均及每個基板16的規格不同 ^ ’無須利用盤形彈簧或分隔器等（參照第7圖〜第1〇圖之盤 形彈簧6及分隔器8)來調整基板的高度位置。 15 1253724 另，在本實施形態、中，彈性構件之線圈彈如具有使 罐塊9上升及下降之升降機構的功能。即，在上模2與下代1 業經合模肖，上模2會推壓罐塊9，藉此，、線圈彈菩2】會广 =，且罐塊9會下降。又，在上模2與下模i開模日^線二 黃21會伸長，且罐塊9會上升。 (實施形態2) -面參照第3圖及第4圖一面說明本發明之實施形態2 =脂密封裝置。如第3圖及第4圖所示，本實施形態^樹 脂密封裝置除了實施形態！之樹脂密封裝置以外，更在將、、古 10動性樹㈣注入模心時，使基板16抵壓罐塊9。具體： 言，將可朝水平方向前進及後退之可動構件，即，鎖嫩 於上模2。又，在下模〗之與銷24相對之位置設置具有對^ 於銷24所動作之範_寬度之妨。因此，在上模2與下模 1業經合模之狀態下，將銷24收容於溝25。 15 本實施形態之樹脂密封裝置係進行下列動作。首先， 在朝第3圖之箭頭所示之方向完成上模2與下模丨之合模之 月”使用銷24以適當的力量使基板16抵壓罐塊9。接著，使 上杈2下降，以使上模2與下模丨合模。在該過程中，銷％及 罐塊9分別一面與基板16接觸一面下降。Further, in another aspect of the present invention, the resin sealing skirt has a substrate lower mold which can be provided with a wafer-like member. The tank block is embedded in the lower mold. The tanks are available in tanks for storing liquidity. I can rise and fall into the can. The plunger is used to push out the fluid resin. Further, the upper mold is disposed to face the lower mold. The upper mold has a cavity for accommodating the wafer-like member and a resin flow path for allowing the can plate to communicate with each other. X. In the resin sealing device, the wafer-shaped member resin is sealed by a hardening resin which is cured by a fluid resin injected into a cavity. 15 The silk sealing device further has a movable member that presses the substrate against the side wall of the can before the mold clamping of the upper mold and the lower mold is completed. In the resin sealing device, the can and the lower mold can be relatively raised and lowered. 1. The fluid resin is injected into the cavity while the substrate is pressed against the side wall of the can. Further, in the resin sealing method of one of the aspects of the present invention, the resin sealing device of the following 20 is used. The resin sealing device has a lower mold which can be provided with a wafer-like component. The cans can be inserted into the lower mold in a rising and falling manner. The can has a tank # for storing a flowable resin. The column s can be pushed up and down into the can. The plunger is used to push out the fluid resin. Further, the upper mold is disposed to face the lower mold. The upper 9 1253724 杈 has a resin flow path for accommodating the aforementioned wafer-like members to communicate with each other. ^八和了 (4) The can and the front package == Among them: The resin sealing method uses a resin seal which is cured by the flow resin of the left-in-the-eighth resin to seal the wafer-like element resin. In the resin sealing method, the first one causes the upper mold and the lower mold to lose the holding substrate with a suitable coating force. Next, the can is pressed against the upper die. The upper mold and the lower mold are closed by the steps of holding the = plate and pressing the can. Further, in the resin sealing method described above, the fluid resin is injected into the cavity by the plunger, and then the fluid resin is cured. Then, after the mold clamping of the upper mold and the lower mold is released, the can block is brought into contact with the lower mold and raised. Further, in the resin sealing method of another aspect of the present invention, the following resin sealing device is used. The resin sealing device has a lower mold of a substrate 15 on which a wafer-like member is mounted. The cans can be inserted into the lower mold in a rising and falling manner. The can has a can that can store hunger resin. The plunger can be pushed up and down into the can. The plunger is used to push out the fluid resin. Further, the upper mold is disposed to face the lower mold. There is a cavity for the wafer-like elements of the valleys and a resin flow path for allowing the cans to communicate with the aforementioned cavities. In the resin sealing method of another aspect of the present invention, a resin-sealing garment is used, and the wafer-shaped member resin is sealed by a hardening resin which is cured by a fluid resin injected into a cavity. In the resin sealing method, first, the upper mold and the lower mold are sandwiched between the substrates. The can is then pressed against the upper die. The upper mold and the lower mold are closed by the step of holding the substrate and the step of pressing the 1253724 5 10 15 can. Further, in the resin sealing method, 'the substrate is pressed against the side wall of the can before the mold clamping of the upper mold and the lower mold is completed', and in this state, the fluid resin is injected into the mold by the plunger, and then ' The fluid resin is hardened. Next, the upper mold and the lower mold are opened. According to the resin sealing device and the resin sealing method in one of the aspects of the present invention, the one side of the can block rises with the substrate block in a state where the upper mold and the lower mold are closed. Thereby, even if the fluid resin which forms the invading gap is formed to be hardened by unnecessary hardening, the hardened resin of the shirt can be scraped off by the rise of the can. Therefore, it is possible to smoothly slide the mold and the can. Thereby, first, since it is possible to prevent a gap from being formed between the upper surface of the can and the lower surface of the upper mold, it is possible to prevent the occurrence of resin flash in the gap. Moreover, damage can be prevented in the substrate. Further, the substrate is held by the lower mold and the upper mold at an appropriate nip pressure without passing through the disk spring unit. Thereby, when the substrate is held by the twins using the disc-shaped magazine unit, the substrate can be held by the appropriate pressure by controlling the operation of the lower mold or the upper mold. Therefore, even if the thickness of each of the substrates is different from that of the mother substrate, the damage of the substrate can be prevented, and the height position of the substrate can be adjusted without the (four) springs. Further, in the state where the upper mold and the lower mold are closed, the upper mold is pressed by the lifting mechanism can. Thereby, since the formation of _ between the upper surface of the can block and the lower surface of the upper mold can be prevented, it is possible to prevent the resin from overflowing. According to another aspect of the present invention, the resin sealing device and the resin sealing method are in a state in which the substrate is pressed against the side wall of the can, that is, in a state where no gap is formed between the side wall 20 1253724 of the can and the end surface of the substrate. The fluid resin is injected into the cavity. Thereby, the fluid resin can be prevented from intruding into the gap provided between the lower mold and the can. Therefore, since the gap does not form an unnecessary hardening resin, smooth sliding of the lower mold and the can block can be ensured. Thereby, it is possible to prevent the occurrence of resin flash in the gap between the upper surface of the can 5 and the lower surface of the upper mold. At the same time, substrate damage can be prevented. The above and other objects, features, aspects and advantages of the present invention will become apparent from the <RTIgt; BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a state before the mold clamping of the resin sealing device of the first embodiment. Fig. 2 is a cross-sectional view showing a state in which a fluid resin is injected into a cavity after the resin sealing device of the first embodiment is subjected to mold clamping. 15 is a cross-sectional view showing a state in which the substrate and the can block are in contact with each other before the mold sealing device of the second embodiment is clamped. Fig. 4 is a cross-sectional view showing a state in which a fluid resin is injected into a cavity after the resin sealing device of the second embodiment is subjected to mold clamping. Fig. 5 is a cross-sectional view showing a state in which the resin sealing device of the third embodiment is subjected to mold clamping and 20 substrates are brought into contact with the can, and the fluid resin is injected into the cavity. Fig. 6 is a cross-sectional view showing the state in which the resin sealing device of the third embodiment is opened. Fig. 7 is a cross-sectional view showing a state before the mold clamping of the conventional resin sealing device 12 1253724. Fig. 8 is a cross-sectional view showing a state in which a fluid resin is injected into a cavity after the conventional resin sealing device is subjected to mold clamping. Fig. 9 is a cross-sectional view showing a state in which a fluid resin intrudes into a gap in a conventional resin sealing device. Fig. 10 is a cross-sectional view showing a state in which the fluid resin in the intrusion gap is hardened to hinder the rise and fall of the substrate block. I: Embodiments; 3 Best Mode for Carrying Out the Invention 10 Hereinafter, a resin sealing device according to each embodiment of the present invention will be described with reference to the drawings. The basic structure of the resin sealing device according to each embodiment of the present invention is substantially the same as that of the conventional resin sealing device. Further, in the resin sealing device of the prior art shown in Figs. 7 to 10 and the resin sealing device of the embodiment shown in Figs. i to 6 respectively, the same symbol is given to the portions having the same 15 structures and functions. . (Embodiment 1) - A resin sealing device according to Embodiment 1 of the present invention will be described with reference to Fig. 1 and Fig. 2 . As shown in Fig. i, in the resin sealing device of the present embodiment, the concave portion 4 is provided in the lower mold 1. A substrate block 5 constituting a portion of the lower mold i is provided in the concave portion 4 and is attached to the bottom surface of the concave portion 4. That is, the substrate is provided so as not to be in contact with the concave portion 4 of the lower mold i without being transmitted through an elastic member such as a disk spring unit. Further, in the present embodiment, the can block 9 is elastically supported by the bobbin spring 21 supported by the lower mold k. More specifically, the coils 21 are respectively inserted into the entrainment holes 22 provided under the can block 9 and the kneading faces of the recesses 4 provided in the lower die i to a predetermined depth of 13 1253724 and facing the fitting holes 22 Fitted holes. Next, the operation of the resin sealing device of the present embodiment will be described. First, as shown in Fig. 1, in the state where the upper mold 2 and the lower mold 1 are opened, the upper surface of the can 9 protrudes to the upper surface of the substrate 16. 5 Next, the die faces of the upper die 2 are sequentially brought into contact with the upper surface of the can block 9 and the upper surface of the substrate 16. Thereby, as shown in Fig. 2, the upper mold 2 is pressed against the can 9 and the substrate 16 at a predetermined nip pressure. II. The lowering of the can 9 causes the coil spring 21 to shrink, and at the same time, the upper mold 2 and the lower mold (4) are removed. Next, the fluid resin 17 is injected into the cavity 15, and then hardened. As a result, a hardened tree 10 fat (not shown) is formed. In the present embodiment, the clamping pressure of the upper mold 2 against the can 9 and the substrate 16 is predetermined to satisfy the following two conditions. The first 'nip pressure' is set to *damn the value of the substrate 16 in accordance with the characteristics of the substrate 16. Again, the clamping pressure can be controlled by the lower die! Change with the action U of the upper die 2. In other words, the clamping pressure controls the upper mold 2 or the lower mold 1 (the upper mold 2 in FIG. 1) by the pressure sensor for detecting the value and the value measured according to the pressure sensor. The control mechanism of rising and falling is adjusted. Secondly, the clamping pressure is set to a very large value between the clamping pressure and the pressure of the can 9 by the coil spring 21 against the upper mold 2 to reach between the can 920 and the upper mold 2. The extent to which no gap is generated, that is, the extent to which the fluid resin bleeds out does not occur. Further, the substrate 16 is sandwiched by the upper mold 2 and the substrate block 5 provided on the lower mold without passing through the elastic member. Therefore, in this step k, first, an appropriate nip pressure according to the characteristics of the substrate 16 is directly applied to the substrate 16 by the upper mold 2, so that the substrate 16 can be prevented from being damaged. Further, since 1253724 5 can prevent a gap between the can 9 and the upper mold 2, it is possible. It is possible to prevent the occurrence of defective products of the resin molded article. The f 曰 曰 使 使 使 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上The object is turned up to return to the position shown in Fig. 1. Further, along with this, the surface of the can block 9 is in contact with the substrate block 5, and the surface rises. Thereby, even if the fluid resin 17 of the gap 18 between the invading person and the substrate block 5 is hardened and an unnecessary hardening resin is formed (refer to the unnecessary hardening resin 19 of the first), it can be raised by 1〇. The can 9 will have an unnecessary hardened resin view. Therefore, the function of the smooth rise and fall of the can 9 is not impaired. Then, the resin molded body is protruded from the lower mold i by the ejector pin (not shown) provided in the lower mold 1, and then the transport mechanism (not shown) feeds the resin molded body. According to the resin sealing device of the present embodiment, the unnecessary hardening resin formed in the gap 18 between the can block 9 and the substrate 15 can be scraped off by the rise of the can 9. Therefore, the smooth sliding of the substrate block 5 and the can block 9 of the lower mold can be ensured. Further, in a state where the upper mold 2 and the lower mold i are clamped, the can 9 is pressed against the upper mold 2 with an appropriate pressure. Therefore, it is possible to prevent a gap from being formed on the upper surface of the can block 9 and the lower surface of the upper mold 2, so that occurrence of resin flash in the gap can be prevented. Further, in the state where the upper mold 2 and the lower mold 1 are clamped, the upper mold 2 and the lower mold 1 sandwich the substrate 16 at an appropriate nip pressure. Therefore, it is possible to prevent the substrate 16 from being damaged. On the same day, the thickness of each substrate 16 is not uniform and the specifications of each substrate 16 are different. ^ It is not necessary to use a disk spring or a separator, etc. (refer to Fig. 7 to Fig. 1) The disc spring 6 and the spacer 8) adjust the height position of the substrate. Further, in the present embodiment, the coil of the elastic member functions as a lifting mechanism for raising and lowering the can 9 . That is, in the upper mold 2 and the lower mold 1 , the upper mold 2 pushes the can 9 , whereby the coil is widened and the can 9 is lowered. Further, in the upper mold 2 and the lower mold i, the mold line 21 is elongated, and the can 9 is raised. (Embodiment 2) - Embodiment 2 of the present invention = fat sealing device will be described with reference to Figs. 3 and 4 . As shown in Fig. 3 and Fig. 4, the resin sealing device of this embodiment is in addition to the embodiment! In addition to the resin sealing device, the substrate 16 is pressed against the can 9 when the galvanic tree (4) is injected into the mold core. Specifically: the movable member that can advance and retreat in the horizontal direction, that is, the lock is tender to the upper mold 2. Further, in the position opposite to the pin 24 of the lower mold, the width of the movement of the pin 24 is set. Therefore, the pin 24 is housed in the groove 25 in a state where the upper mold 2 and the lower mold 1 are clamped. The resin sealing device of this embodiment performs the following operations. First, the mold of the upper mold 2 and the lower mold is completed in the direction indicated by the arrow in Fig. 3". The pin 24 is pressed with the pin 24 to press the can 9 with an appropriate force. Then, the upper jaw 2 is lowered. In order to mold the upper mold 2 and the lower mold, in the process, the pin % and the can 9 are lowered while contacting the substrate 16 on one side.
)Q 接著，如第3圖所示，在上模2與下模丨業經合模，且， 错由銷24以適當的力量使基板16抵壓罐塊9之狀態下，將流 力陡树月曰17/主入模穴丨5，然後，使其硬化。在該步驟中， 由於基板16抵壓罐塊9，故可防止在基板16的端面（圖中右 側）人罐塊9的側壁之間產生間隙。因此，流動性樹脂丨了不 16 1253724 會杈入形成於基板塊5的側壁與罐塊9的侧壁之間的間隙 18。結果’可防止在間隙18巾形成不必要的硬化樹脂（參照 弟10圖的不必要的硬化樹脂19)。 如上所述，根據本實施形態之樹脂密封裝置，除了從 5貫施形態1之樹脂密封裝置所得到的效果以外，更可得到下 列效果。即，可防止在形成於基板塊5與罐塊9之間的間隙 18中形成不必要的硬化樹脂。因此，可確保下模1與罐塊9 的平滑滑動。 另在上述°兒明中，使用將可使基板16抵壓罐塊9之銷 1〇 24設於上模2之樹脂密封裝置。然❿，本發明並不限於前述 構造，亦可為將銷24設於下模1之職密聰置。又，本發 明亦可為鎖24與下模！及上模2分離而設於下模】之側邊之 樹脂密封裝置。再者，在上述任一構造中，銷24可在上模2 與下杈1合模之前前進，使基板16抵壓罐塊9，且，在上模2 15與下模1合模後後退，以與罐塊9分離。又，銷琳可在上 模2與下模1業經合模之狀態下，繼續使基板職壓罐塊9。 又，本實施形態之樹脂密封裝置中，基板塊5設置成直 接接在下模1之凹部4的底面。然而，並不限於該構造’亦 可在基板塊5藉丨彈性構件（參照第7圖〜第1〇圖之盤形彈簧 20 f元^彈性地支持之狀態下，由銷％使基板她麼罐塊9'。、 藉由边構造亦可防止在基板塊5與罐塊9之間的間隙1 $中形 成不必要的硬化樹脂，因此，可分別確保基板塊5及罐塊9 的平滑滑動。再者，亦可採用將罐塊9直接設置於凹部4之 底面，同時由任何的彈性構件彈性地支持基板塊5之構造。 17 1253724 由於藉由該構造亦可防止在間隙18中形成不必要的硬化樹 脂’故可分別確保基板塊5及罐塊9的平滑滑動。又，在前 述任一構造中亦可使用其他形式的彈簧，例如，使用金屬 材料、包含金屬材料之複合材料或高分子材料等之彈簧作 5 為彈性構件。 (貫施形態3) 面參照第5圖及第6圖一面說明本發明之實施形態3Q Next, as shown in Fig. 3, the upper mold 2 and the lower mold are clamped, and the pin 24 is pressed against the can 9 with an appropriate force, and the flow is steep. The moon 曰 17 / the main mold hole 丨 5, and then, it hardens. In this step, since the substrate 16 is pressed against the can block 9, it is possible to prevent a gap from being formed between the side walls of the human can 9 on the end surface (the right side in the drawing) of the substrate 16. Therefore, the fluid resin entangles the gap 18 formed between the side wall of the substrate block 5 and the side wall of the can block 9 without being etched. As a result, it is possible to prevent the unnecessary hardening resin from being formed in the gap 18 (refer to the unnecessary hardening resin 19 in the drawing of Fig. 10). As described above, according to the resin sealing device of the present embodiment, in addition to the effects obtained by the resin sealing device of the first embodiment, the following effects can be obtained. That is, unnecessary hardening resin can be prevented from being formed in the gap 18 formed between the substrate block 5 and the can block 9. Therefore, smooth sliding of the lower mold 1 and the can block 9 can be ensured. Further, in the above, a resin sealing device in which the pins 16 to 24 of the can block 9 are placed on the upper mold 2 is used. Then, the present invention is not limited to the above-described configuration, and it is also possible to provide the pin 24 to the lower die 1 of the lower die. Moreover, the present invention can also be the lock 24 and the lower die! A resin sealing device provided on the side of the lower mold with the upper mold 2 separated. Furthermore, in any of the above configurations, the pin 24 can be advanced before the upper die 2 and the lower jaw 1 are clamped, the substrate 16 is pressed against the can 9 and the upper die 2 15 is retracted after being clamped to the lower die 1 To separate from the tank block 9. Further, Pinlin can continue to make the substrate pressure tank 9 in the state where the upper mold 2 and the lower mold 1 are closed. Further, in the resin sealing device of the present embodiment, the substrate block 5 is provided so as to be directly connected to the bottom surface of the concave portion 4 of the lower mold 1. However, the present invention is not limited to this configuration. It is also possible to use the elastic member in the substrate block 5 (refer to the state in which the disk spring 20 f is elastically supported in the drawing of Fig. 7 to Fig. 1). The can block 9' can prevent unnecessary hardening resin from being formed in the gap 1$ between the substrate block 5 and the can block 9 by the edge structure, and therefore, smooth sliding of the substrate block 5 and the can block 9 can be ensured, respectively. Furthermore, it is also possible to arrange the can 9 directly on the bottom surface of the recess 4 while elastically supporting the structure of the substrate block 5 by any elastic member. 17 1253724 By this configuration, it is also possible to prevent formation in the gap 18 The necessary hardening resin can ensure smooth sliding of the substrate block 5 and the can 9 respectively. Further, other forms of springs can be used in any of the foregoing configurations, for example, using a metal material, a composite material containing a metal material, or a high The spring 5 made of a molecular material or the like is an elastic member. (Section 3) The embodiment 3 of the present invention will be described with reference to FIGS. 5 and 6
之樹脂密封裝置。如第5圖及第6圖所示，本實施形態之樹 脂密封裝置在解除上模2與下模1之合模後，使作為不同於 10線圈彈耳21之升降機構所設置之向上推棒26動作。該向上 推棒26為筒狀構件或多數板狀構件，且設於用以保持柱塞 11的軸之保持構件27外側。又，向上推棒26與具有適當的 向上推力之驅動機構(未圖示)相連接，且藉由該驅動機構之 ^動上升及下卜。又，藉由向上推棒％向上推的罐塊9可上 升至較由線圈彈簧21推壓時在線圈彈菁取全伸長之時點 下到達的位置更上側的位置。 本實施形態之樹脂密封裝置係進行下列動作。首先， 與，1業經開模之狀態下，向上推棒26與罐塊9隔 者間^在初期位置上待機。 20 干之圖所示，藉由使上模2下降，可與第2圖所 構湖，使上模2與下模1合模。接著，在該狀能中， 線圈彈簣仙適當的力量使罐魏μ地。又，rl 之樹脂密封裝置相同，在完成上模2與下模]之合^ 則’使關24’以適當的力量使基板16㈣罐塊％另，雖 18 1253724 …以後’銷24進行與實施形態2同樣的動作，但， 本發财亦可使用未設置銷24的構造。 #藉由將流動性樹脂17注入模穴15内，然後使其 硬化可凡成包含基板16與硬化樹脂28之樹脂成形體29。 5 =者，使上模2上升。在本實施形態中，當上模2開始上升 時’即，當成為已解除上模2與下模！之合模的狀態時，藉 由使線圈彈更21伸長，以相對於下模1將罐塊9往上推，使 罐塊9返回初期位置（蒼照第1圖）。又，在該步驟以後，設於 下模1之頂出義與罐塊9的上升同時，使樹脂成形體29從 下核1(基板塊5)朝上方突出。再者，設於上模2之頂出銷（未 圖示）使樹脂成形體29從上模2朝下方突出。 ^接著，如第6圖所示，使向上推棒26上升，以進一步將 罐塊9向上推。然後，搬送機構(未圖示）將藉由頂出銷邓從 下模1突出之樹脂成形體29送出。 15 — 根據本實施形態之樹脂密封裝置，向上推棒26使罐塊9 鲁上升至較藉由線圈彈簧21之伸長可使罐塊9上升之位置更 側的位置。藉此，即使罐塊9與基板塊5的間隙18下方形 成不必要的硬化樹脂，亦可藉由向上推棒26使罐塊9上升， 从將該不必要的硬化樹脂刮除。又，即使在間隙18中不必 〇要的硬化樹脂牢牢地附著於罐塊9及基板塊5兩者，亦可藉 由大的向上推力使向上推棒26上升，以將該不必要的硬化 樹脂到除。因此，即使在間隙18形成不必要的硬化樹脂， 亦可進一步有效地確保下模1與罐塊9的平滑滑動。 另，本實施形態中雖然採用使用線圈彈簧21與向上推 19 1253724 棒26兩者料升_叙料，㈣可採職使 棒26之構造來取代該構造。 σ上推 升降之升Μ構的魏二^轉26具有使罐塊9 經合模之狀態下，宜藉由向上推;::，在上模2與下模1業 抵壓上模2。因此，宜且有用：#的壓力使罐塊9 a有用乂铋測罐塊9抵壓上模2時的厨 力之壓力感測ϋ及依照壓力感測器之檢難來控制向场 棒26的升降之控制機構。 隹 另，在本貫施形態之樹脂密封裳置中，使用線圈彈笼 21作為支持罐塊9之彈性構件。然而，亦可仙其他形式二 1〇弹黃作為彈性構件來取代線圈彈簧21。又，若是具有預定 彈性、耐久性及财熱性的材料，則亦可使用金屬材料、^ 含金屬材料之複合材料或高分子材料等作為彈性構件。 又，本貫施形悲中採用藉由使上模2下降以使上模2與 下模1合模的方法。然而，本發明中除了該方法以外亦可採 15用藉由使下模1上升或者使上模2與下模丨相對地移動以使 上模2與下模1合模的方法。 又，本發明亦可使用在第1圖〜第6圖中在罐塊9的兩側 分別設置基板16，且同時將在2個基板16各安裝1個的2個晶 片狀元件兩者樹脂岔封之樹脂密封裝置中。藉由該樹脂密 2〇 封裝置’可進一步提局樹脂密封步驟的效率。 雖已詳細地說明本發明，但這些只是例子而已，並不 限於此，應可清楚地理解僅由所附之申請專利範圍來限定 發明的精神與範圍。 【圖式簡單說明3 20 1253724 第1圖係顯示實施形態1之樹脂密封裝置之合模前的狀 態之截面圖。 第2圖係顯示在實施形態1之樹脂密封裝置業經合模 後，將流動性樹脂注入模穴内的狀態之截面圖。 5 第3圖係顯示在實施形態2之樹脂密封裝置之合模前， 基板與罐塊接觸後的狀態之截面圖。 _ 第4圖係顯示在實施形態2之樹脂密封裝置業經合模 後，將流動性樹脂注入模穴内的狀態之截面圖。 • 第5圖係顯示在實施形態3之樹脂密封裝置業經合模且 10 基板與罐塊接觸後，將流動性樹脂注入模穴内的狀態之截 面圖。 第6圖係顯示實施形態3之樹脂密封裝置業經開模的狀 態之截面圖。 第7圖係顯示習知之樹脂密封裝置之合模前的狀態之 15 截面圖。 第8圖係顯示在習知之樹脂密封裝置業經合模後，將流 ® 動性樹脂注入模穴内的狀態之截面圖。 第9圖係顯示習知之樹脂密封裝置中，流動性樹脂侵入 間隙的狀態之截面圖。 20 第10圖係顯示因侵入間隙的流動性樹脂產生硬化而阻 礙基板塊之上升及下降的狀態之截面圖。 【圖式之主要元件代表符號表】 1.. .下模 3...樹脂密封模 2.. .上模 4·.·凹部 21 1253724 5.. .基板塊 6.. .盤形彈簧 7.. .盤形彈簧單元 8.. .分隔器 9.. .罐塊 10…罐部 11.. .柱塞 12…樹脂錠 13.. .殘料廢品部 14…流槽 15…模穴 16.. .基板 17.. .流動性樹脂 18.. .間隙 19.. .硬化樹脂 20.. .間隙 21.. .線圈彈簧 22、23...嵌合孔 24.. .銷 25···溝 26.. .向上推棒 27.. .保持構件 28.. .硬化樹脂 29.. .樹脂成形體 30.. .頂出銷 P.L....合模面Resin sealing device. As shown in Fig. 5 and Fig. 6, in the resin sealing device of the present embodiment, after the mold clamping of the upper mold 2 and the lower mold 1 is released, the push-up rod provided as a lifting mechanism different from the 10-coil spring 21 is provided. 26 actions. The upward pusher 26 is a cylindrical member or a plurality of plate members, and is provided outside the holding member 27 for holding the shaft of the plunger 11. Further, the push-up bar 26 is connected to a drive mechanism (not shown) having an appropriate upward thrust, and is moved up and down by the drive mechanism. Further, the can 9 pushed up by pushing up the bar % can be raised to a position higher than the position reached when the coil spring 21 is fully extended at the time when the coil spring 21 is pressed. The resin sealing device of this embodiment performs the following operations. First, in the state where the mold is opened, the push rod 26 and the tank block 9 are alternately placed in the initial position. As shown in the dry figure, by lowering the upper mold 2, the upper mold 2 and the lower mold 1 can be closed with the lake constructed in Fig. 2. Then, in this shape, the coil bounces the appropriate force to make the can. Moreover, the resin sealing device of rl is the same, and the combination of the upper die 2 and the lower die] is completed, and the closing of the substrate 24 is performed with an appropriate force to make the substrate 16 (four) cans %, although 18 1253724 ... later 'pin 24 is carried out and implemented In the same manner as in the second embodiment, the present invention can also use a structure in which the pin 24 is not provided. # By injecting the fluid resin 17 into the cavity 15, and then hardening it into a resin molded body 29 including the substrate 16 and the hardened resin 28. 5 =, the upper die 2 is raised. In the present embodiment, when the upper mold 2 starts to rise, that is, when the upper mold 2 and the lower mold are released! In the state of the mold clamping, by pushing the coil spring 21 further, the tank block 9 is pushed up with respect to the lower mold 1, and the tank block 9 is returned to the initial position (the first picture). In addition, after the step, the embossing of the lower mold 1 and the rise of the can block 9 are performed, and the resin molded body 29 is protruded upward from the lower core 1 (substrate block 5). Further, the ejector pin (not shown) provided in the upper mold 2 causes the resin molded body 29 to protrude downward from the upper mold 2. Then, as shown in Fig. 6, the push-up bar 26 is raised to further push the can 9 upward. Then, a conveying mechanism (not shown) feeds the resin molded body 29 protruding from the lower mold 1 by the ejector pin Deng. In the resin sealing device of the present embodiment, the rod 26 is pushed up to raise the tank block 9 to a position closer to the side where the tank block 9 is raised by the elongation of the coil spring 21. Thereby, even if the gap 18 of the can block 9 and the substrate block 5 is squared to form an unnecessary hardened resin, the can 9 can be raised by pushing up the rod 26, and the unnecessary hardened resin can be scraped off. Further, even if it is not necessary for the hardened resin to be firmly adhered to both the can 9 and the substrate block 5 in the gap 18, the upward push bar 26 can be raised by a large upward thrust to unnecessarily harden the hardened bar 26 Resin to remove. Therefore, even if unnecessary hardening resin is formed in the gap 18, smooth sliding of the lower mold 1 and the can block 9 can be further effectively ensured. Further, in the present embodiment, the coil spring 21 and the push-up 19 1253724 rod 26 are used to raise the material, and (4) the structure of the rod 26 can be replaced by the structure. The σ 上 升降 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏Therefore, it is preferable and useful: the pressure of the tank 9a is useful for detecting the pressure of the kitchen force when the tank block 9 is pressed against the upper mold 2, and controlling the field rod 26 according to the inspection of the pressure sensor. The control mechanism for the lift. Further, in the resin sealing skirt of the present embodiment, the coil cage 21 is used as the elastic member for supporting the can block 9. However, it is also possible to replace the coil spring 21 with another form of elastic spring as an elastic member. Further, in the case of a material having predetermined elasticity, durability, and finernity, a metal material, a composite material containing a metal material, or a polymer material may be used as the elastic member. Further, a method of closing the upper mold 2 and the lower mold 1 by lowering the upper mold 2 is employed in the present embodiment. However, in the present invention, in addition to the method, a method of closing the upper mold 2 and the lower mold 1 by raising the lower mold 1 or moving the upper mold 2 and the lower mold 丨 relative to each other may be employed. Further, in the present invention, it is also possible to use the substrate 16 on both sides of the can 9 in the first to sixth figures, and at the same time, two wafer-like elements each mounted on each of the two substrates 16 are resin-coated. Sealed resin sealing device. The efficiency of the resin sealing step can be further improved by the resin sealing device. The present invention has been described in detail, but these are only examples, and the scope of the invention is to be understood by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a state before the mold clamping of the resin sealing device of the first embodiment. Fig. 2 is a cross-sectional view showing a state in which a fluid resin is injected into a cavity after the resin sealing device of the first embodiment is subjected to mold clamping. 5 is a cross-sectional view showing a state in which the substrate and the can block are in contact with each other before the mold sealing device of the second embodiment is clamped. Fig. 4 is a cross-sectional view showing a state in which the fluid resin is injected into the cavity after the resin sealing device of the second embodiment is clamped. Fig. 5 is a cross-sectional view showing a state in which the resin sealing device of the third embodiment is subjected to mold clamping and the substrate is brought into contact with the can, and the fluid resin is injected into the cavity. Fig. 6 is a cross-sectional view showing the state in which the resin sealing device of the third embodiment is opened. Fig. 7 is a cross-sectional view showing a state before the mold clamping of the conventional resin sealing device. Fig. 8 is a cross-sectional view showing a state in which a flow-through resin is injected into a cavity after the conventional resin sealing device is subjected to mold clamping. Fig. 9 is a cross-sectional view showing a state in which a fluid resin intrudes into a gap in a conventional resin sealing device. 20 Fig. 10 is a cross-sectional view showing a state in which the fluid resin in the intrusion gap is hardened to hinder the rise and fall of the substrate block. [Main component representative symbol table of the drawing] 1.. Lower die 3... Resin sealing die 2.. Upper die 4·.·Recess 21 1253724 5.. Substrate block 6.. Disc spring 7 .. Disc Spring Unit 8.. Separator 9.. Tank 10... Tank 11: Plunger 12... Resin Ingot 13. Residue Waste Section 14... Flow Cell 15... Cavity 16 .. . Substrate 17.. Flowable resin 18.. Gap 19.. Hardened resin 20.. Gap 21.. Coil springs 22, 23... Fitting holes 24.. Pin 25·· · Ditch 26.. Push up the bar 27.. Hold member 28.. Hardened resin 29. Resin molded body 30... Eject pin PL... Molding surface
22twenty two