TWI795862B - Resin molding apparatus and resin molded product manufacturing method - Google Patents

Abstract

A resin molding apparatus and a resin molded product manufacturing method of the present invention reliably separate a resin molded product from unnecessary resin without increasing the size of a molding die or the size of unnecessary resin, and the resin molding apparatus includes: an upper mold formed with a cavity; a lower mold facing the upper mold and provided with a resin injection part for injecting a resin material into the cavity; and a mold clamping mechanism clamping the upper mold and the lower mold, wherein the resin injection part includes: a pot block formed with a pot for accommodating the resin material, arranged to be able to advance and retreat with respect to the lower mold via an elastic member, and including a protruding part that protrudes from a mold surface of the lower mold; and a transfer mechanism including a plunger provided in the pot and moving the plunger in a state where the upper mold and the lower mold are clamped to inject the resin material from the pot into the cavity. During a mold opening operation where the mold clamping mechanism opens the upper mold and the lower mold, the transfer mechanism moves the plunger toward the upper mold to separate the resin molded product on the mold surface of the lower mold from the unnecessary resin on the pot block.

Description

Resin molding device and method for manufacturing resin molded product

The present invention relates to a resin molding device and a method for manufacturing a resin molded product.

Conventionally, for example, as shown in Patent Document 1, it is conceivable to close the upper mold and the lower mold, and in the state where the gate block installed on the lower mold presses a part of the substrate to the lower mold, from the upper surface of the gate block The space formed between the lower surface of the upper mold and the molten resin is injected into the cavity of the upper mold to perform resin sealing.

In the resin sealing device, a spring for moving the gate block up and down is provided on the lower side of the gate block, and is in a compressed state when the mold is closed. Moreover, when the upper mold and the lower mold are opened, the spring recovers from the compressed state, and the gate block is relatively pushed up with respect to the upper surface (mold face) of the lower mold, and unnecessary The resin flow path is separated from the substrate. [Prior art literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2000-311908

[Problem to be Solved by the Invention] However, since the device separates unnecessary resin from the substrate using the elastic force of the spring, it is necessary to increase the elastic force of the spring in order to reliably separate the unnecessary resin from the substrate. Therefore, the spring must be enlarged, leading to an increase in the size of the molding die or an unnecessary increase in the size of the resin.

Therefore, the present invention is made to solve the above-mentioned problems, and its main problem is to reliably separate the resin molded product from the unnecessary resin without increasing the size of the molding die or the unnecessary resin. separation. [Technical means to solve the problem]

That is, the resin molding apparatus of the present invention includes: a first mold formed with a cavity for injection of a resin material; a second mold facing the first mold and provided with a resin injection mold for injecting a resin material into the cavity. part; and a mold clamping mechanism for clamping the first mold and the second mold, the resin injection part includes: a groove block, which is formed with a groove for accommodating the resin material, and is arranged so as to be relatively The second die advances and retreats, and includes a protruding portion protruding from the die face of the second die; In the state where the second mold is closed, the plunger is moved to inject the resin material from the groove into the cavity, and the first mold and the second mold are separated by the mold clamping mechanism. During the mold opening operation of the mold, the transfer mechanism moves the plunger to the first mold to separate the resin molded product on the mold surface of the second mold from the unnecessary resin on the groove block. separate.

Moreover, the manufacturing method of the resin molded article of this invention is the manufacturing method of the resin molded article using the said resin molding apparatus.

Furthermore, the method of manufacturing a resin molded product of the present invention is a method of manufacturing a resin molded product using a resin molding device comprising: a first mold formed with a cavity for injecting a resin material; a second mold formed with The first molds face each other, and are provided with a resin injection part for injecting resin material into the mold cavity; and a mold clamping mechanism for clamping the first mold and the second mold, and the resin injection part includes: a groove block, formed with a groove for accommodating the resin material, configured to be capable of advancing and retreating relative to the second mold via an elastic member, and including a protruding portion protruding from the mold surface of the second mold; and a transmission mechanism , including a plunger provided in the groove, and the resin is injected from the groove into the cavity by moving the plunger in a state where the first mold and the second mold are closed. material, and in the manufacturing method of the resin molded product, in the mold opening operation of the mold clamping mechanism opening the first mold and the second mold, the transmission mechanism moves the plunger to the The first mold moves to separate the resin molded product on the mold surface of the second mold from unnecessary resin on the tank block. [Effect of the invention]

According to the present invention thus constituted, it is possible to reliably separate the resin molded product from the unnecessary resin without increasing the size of the molding die or the unnecessary resin.

Next, examples are given and the present invention will be described in more detail. However, the present invention is not limited by the following description.

As described above, the resin molding device of the present invention includes: a first mold formed with a cavity for injecting a resin material; a second mold facing the first mold and provided with a cavity for injecting a resin material into the cavity; a resin injection part; and a mold clamping mechanism, which clamps the first mold and the second mold, and the resin injection part includes: a groove block, which is formed with a groove for accommodating the resin material, and is configured to be able to pass through the elastic member advances and retreats relative to the second die, and includes a protruding portion protruding from the die face of the second die; and a transfer mechanism, including a plunger arranged in the groove, and on the first die The plunger is moved while being closed with the second mold to inject the resin material from the groove into the cavity, and the first mold and the second mold are connected by the mold clamping mechanism. In the mold opening action of mold opening, the transfer mechanism moves the plunger to the first mold, and separates the resin molded product on the mold surface of the second mold from the unnecessary mold on the groove block. resin separation. According to the above-mentioned resin molding device, the unnecessary resin on the block is pressed against the first die by the plunger, so that the resin can be reliably molded without increasing the elastic force of the elastic member that moves the block forward and backward. The product is separated from the unwanted resin. In addition, since it is not necessary to increase the elastic force of the elastic member, the size of the elastic member is prevented, and further, the size of the molding die and the size of the unnecessary resin are not increased.

In addition, in order to reliably separate the resin molded product from unnecessary resin by utilizing the elastic force of the elastic member compressed at the time of mold closing, it is desirable that the transfer mechanism receives the pressure from the groove block during the mold opening operation. The plunger is moved toward the first die while the elastic force of the elastic member is used to move toward the first die, thereby separating the resin molded product from unnecessary resin.

Even when the plunger is moved to the first die to separate the resin molded product from unnecessary resin, when the plunger is tightly bonded to the unnecessary resin, there may be a case where thereafter Recycling of unwanted resin can also create undesirable situations. In order to solve the above problem, it is desirable that the transfer mechanism moves the plunger to the side opposite to the first die and from the first die before moving the plunger to the first die. The plunger strips off the unwanted resin. According to the above structure, since the plunger and the unnecessary resin are separated in advance, after separating the resin molded article from the unnecessary resin, the separated unnecessary resin can be easily recovered.

Preferably, the groove block sandwiches the unnecessary resin between the first mold and the first mold by utilizing the restoring force of the elastic member, that is, elastic force, for a predetermined period of time from the start of the mold opening operation. state, and after the predetermined period elapses, the unnecessary resin is held while peeling the unnecessary resin from the first mold. According to the above configuration, the resin molded product is separated from the unnecessary resin in a state where the unnecessary resin is sandwiched between the tank block and the first mold, thereby It is possible to prevent the unwanted resin from falling out accidentally from the block when they are separated.

In order to prevent the resin molded product from floating or shifting from the second mold when the resin molded product is separated from the unnecessary resin, and to reliably separate the resin molded product from the unnecessary resin, desirably, the first mold includes a pressing member that presses the The resin molded product is pressed against the die surface of the second die.

The plunger slides in the groove, but the sliding resistance between the plunger and the groove increases due to the resin adhering to the inner surface of the groove. Then, the groove block will follow the movement of the plunger, so there is a possibility that the elastic member cannot be fully restored and the groove block cannot return to the initial state before mold closing. In this case, when unnecessary resin is recovered, the elastic member may stretch unintentionally, and the unnecessary resin may fall out of the tank due to its elasticity, making it difficult to recover the unnecessary resin. Therefore, it is desirable that the transmission mechanism moves the plunger toward the first die until the elastic member returns to an initial state.

Ideally, as the transfer mechanism moves the plunger toward the first die, the protrusion of the channel block sandwiches the resin from the face of the second die. The state of the molded product is a state where it is not in contact with the resin molded product. According to the above-mentioned configuration, the protrusion portion is reliably kept out of contact with the resin molded product by the movement of the plunger, so the protrusion portion is less likely to become an obstacle in the subsequent unloading of the resin molded product.

Moreover, the manufacturing method of the resin molded article using the said resin molding apparatus is also one aspect of this invention.

Furthermore, the method of manufacturing a resin molded product of the present invention is a method of manufacturing a resin molded product using a resin molding device comprising: a first mold formed with a cavity for injecting a resin material; a second mold formed with The first molds face each other, and are provided with a resin injection part for injecting resin material into the mold cavity; and a mold clamping mechanism for clamping the first mold and the second mold, and the resin injection part includes: a groove block, formed with a groove for accommodating the resin material, configured to be capable of advancing and retreating relative to the second mold via an elastic member, and including a protruding portion protruding from the mold surface of the second mold; and a transmission mechanism , including a plunger provided in the groove, and the resin is injected from the groove into the cavity by moving the plunger in a state where the first mold and the second mold are closed. material, and the manufacturing method of the resin molded product, in the mold opening operation of the mold clamping mechanism to open the first mold and the second mold, the transmission mechanism moves the plunger to the second mold. The first mold moves to separate the resin molded product on the die surface of the second mold from unnecessary resin on the tank block.

<An embodiment of the present invention> Hereinafter, one embodiment of the resin molding apparatus of the present invention will be described with reference to the drawings. In addition, for easy understanding, any of the drawings shown below may be omitted or exaggerated and schematically drawn. The same symbols are assigned to the same constituent elements, and explanations are appropriately omitted.

<Overall structure of resin molding equipment> The resin molding apparatus 100 of the present embodiment performs resin molding on the molding object W1 to which the electronic component Wx is connected by transfer molding using the resin material J. As shown in FIG.

Here, the molding object W1 is, for example, a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit substrate, a semiconductor substrate, a wiring substrate, a lead frame, etc., regardless of the presence or absence of wiring. In addition, the resin material J used for molding is, for example, a composite material containing a thermosetting resin, and the form of the resin material J is granular, powdery, liquid, sheet-like, or flake-like. Furthermore, as the electronic component Wx connected to the upper surface of the molding object W1, it is a bare wafer or a resin-sealed wafer, for example.

Specifically, as shown in FIG. 1, the resin molding apparatus 100 includes the following components as constituent elements: a supply module 100A, which supplies the molding object W1 and the resin material J before molding; a molding module 100B, which performs resin molding; and The storage module 100C accommodates the molded object W2 (hereinafter referred to as the resin molded product W2 ). Furthermore, the supply module 100A, the forming module 100B, and the storage module 100C are mutually attachable and detachable with respect to other constituent elements, and can be replaced. In addition, the forming die set 100B may be provided in two or three, and each constituent element may be increased.

The supply module 100A is provided with the following components: a molding object supply part 11, which supplies the molding object W1; a resin material supply part 12, which supplies the resin material J; The supply unit 11 receives the object W1 to be molded and conveys it to the molding die set 100B, and receives the resin material J from the resin material supply unit 12 and conveys it to the molding die set 100B.

The loader 13 reciprocates between the supply die set 100A and the forming die set 100B, and moves along rails (not shown) provided over the supply die set 100A and the forming die set 100B.

As shown in FIG. 2 , the forming die set 100B includes: a first die 2 (hereinafter referred to as the upper die 2 ), which is one of the forming dies formed with a cavity 2 a for injecting the resin material J; a second die 3 (hereinafter referred to as the upper die 2 ). The lower mold 3) is another forming mold that is arranged opposite to the upper mold 2 and is provided with a resin injection part 4 that injects the resin material J into the mold cavity 2a; and a mold clamping mechanism 5 that connects the upper mold 2 and the lower mold 3 Clamping. The upper mold 2 is held by an upper mold holder 101 , and the upper mold holder 101 is fixed to an upper platen 102 . In addition, the upper mold 2 is attached to the upper mold holder 101 via the upper mold base plate 103 . The lower mold 3 is held by a lower mold holder 104 fixed to a movable platen 105 raised and lowered by the mold clamping mechanism 5 . In addition, the lower mold 3 is attached to the lower mold holder 104 via the lower mold base plate 106 .

The resin injection part 4 includes: a tank block 41 formed with a groove 41a for containing the resin material J; and a transfer mechanism 42 including a plunger 421 disposed in the groove 41a. In addition, the groove 41a is formed by the cylindrical member 410, for example. The cylindrical member 410 is inserted into a through hole formed in the tank block 41 .

The groove block 41 is elastically supported by the elastic member 43 so as to be able to move up and down relative to the lower mold 3 . That is, the block 41 is provided so as to be able to move up and down relative to the lower mold 3 via the elastic member 43 . Moreover, the elastic member 43 is disposed on the lower side of the slot block 41 .

In addition, at the upper end portion of the tank block 41 , a protruding portion 411 protruding from a mold surface serving as an upper surface of the lower mold 3 is formed. Furthermore, on the upper surface of the tank block 41, a reject pool part 41b and a gate part 41c as a resin flow path for introducing the resin material J injected from the tank 41a into the cavity 2a are formed. In addition, in the state where the upper mold 2 and the lower mold 3 are clamped, the upper surface of the protruding part 411 is in contact with the upper mold 2, and the lower surface of the projecting part 411 sandwiches the molding object W1 between the mold surface of the lower mold 3. .

The transfer mechanism 42 moves the plunger 421 to inject the resin material J from the groove 41a into the cavity 2a in a state where the upper mold 2 and the lower mold 3 are clamped. Specifically, the transfer mechanism 42 includes a plunger 421 for pressure-feeding the resin material J heated and melted in the tank 41 a, and a plunger driving unit 422 for driving the plunger 421 .

The upper mold 2 is formed with a cavity 2a for accommodating the electronic component Wx of the object W1 to be molded and for injecting the molten resin material J therein. In addition, in the upper die 2, a concave portion 2b is formed at a portion facing the tank block 41, and a runner portion 2c connecting the reject pool portion 41b and the gate portion 41c of the tank block 41 to the cavity 2a is formed. In addition, although not shown, an exhaust port is formed on the side opposite to the groove block 41 in the upper die 2 . In addition, the runner part 2c may be omitted, and the reject pool part 41b and the cavity 2a may be directly connected via the gate part 41c.

In addition, the upper mold 2 is provided with a plurality of ejector pins 61 for releasing the resin-molded molding object W2 from the upper mold 2 . These ejector pins 61 are provided so as to pass through desired parts of the upper die 2 so as to be able to move up and down relative to the upper die 2 , and are fixed to an ejector plate 62 provided on the upper side of the upper die 2 . The ejector plate 62 is provided on the upper pressing plate 102 and the like via an elastic member 63 and includes a return pin 64 . During mold closing, the return pin 64 comes into contact with the outside of the mounting area of the molding object W1 in the lower mold 3 , thereby raising the ejector plate 62 relative to the upper mold 2 . As a result, the ejector pin 61 is retracted into the mold surface of the upper mold 2 during mold closing. On the other hand, when the mold is opened, the ejector plate 62 descends relative to the upper mold 2 as the lower mold 3 descends, and the ejector pin 61 releases the resin molded product W2 from the upper mold 2 by the elastic force of the elastic member 63 .

Moreover, when the upper mold 2 and the lower mold 3 are clamped by the mold clamping mechanism 5, the resin flow path including the reject pool portion 41b, the gate portion 41c, the concave portion 2b, and the runner portion 2c communicates the groove 41a with the cavity 2a. (Refer to Figure 4). In addition, when the upper mold 2 and the lower mold 3 are clamped, the groove-side end of the object W1 is sandwiched between the lower surface of the protruding portion 411 of the groove block 41 and the mold surface of the lower mold 3 . In this state, when the molten resin material J is injected into the cavity 2a by the plunger 421, the electronic component Wx of the molding object W1 is resin-sealed.

As shown in FIG. 1 , the storage module 100C is provided with a storage unit 14 for storing the resin molded product W2, and a transfer device 15 (hereinafter referred to as an unloader 15 ) that receives the resin molded product W2 from the molding die group 100B and transports it to the storage unit 14 . ).

The unloader 15 reciprocates between the forming die set 100B and the storing die set 100C, and moves along rails (not shown) provided over the forming die set 100B and the storing die set 100C.

<Operation of Resin Molding Device 100> The operation of the resin molding apparatus 100 will be briefly described with reference to FIGS. 3 to 14 . 3 to 14 show only one side (left side) of the tank block 41, omitting the other side (right side), but the state of the other side in each figure is the same as that of one side. In addition, the following operation|movement is performed, for example by controlling each part by the control part COM provided in 100 A of supply modules.

As shown in FIG. 3 , in a state where the upper mold 2 and the lower mold 3 are opened, the object W1 before molding is conveyed by the loader 13 , delivered to the lower mold 3 and placed thereon. At this time, the temperature of the upper mold 2 and the lower mold 3 is raised to a temperature at which the resin material J can be melted and hardened. Thereafter, the resin material J is conveyed by the loader 13 and accommodated in the tank 41 a of the tank block 41 .

In said state, when the lower mold 3 is raised by the clamping mechanism 5, as shown in FIG. The groove-side end portion of the object to be molded W1 is in contact. In addition, the lower surface of the upper mold 2 is in contact with the outer peripheral portion of the object to be molded W1 that the protruding portion 411 is not in contact with. Thus, the upper mold 2 and the lower mold 3 are clamped. After the mold closing, when the transfer mechanism 42 raises the plunger 421 by the plunger driving part 422, as shown in FIG. 5, the molten resin material J in the groove 41a is injected into the cavity 2a through the resin passage. . Then, after a predetermined molding time elapses and the resin material J hardens in the cavity 2a, the mold clamping mechanism 5 opens the upper mold 2 and the lower mold 3.

Here, the resin molding apparatus 100 of this embodiment performs an operation of separating the resin molded product W2 from the unnecessary resin K (gate disconnect action). In addition, the unnecessary resin K is resin which remains and hardens|cures on the tank block 41. As shown in FIG.

For example, immediately before the molding time elapses (before the start of the mold opening operation), as shown in FIG. 421 and unnecessary resin K are not peeled off, so that the contact state can be maintained with a relatively small force). In addition, the pressing force of the plunger 421 is passed through a force sensor (including a weight sensor) such as a load cell (not shown) provided on the drive shaft (transmission shaft) of the plunger drive unit 422 . devices, load cells, etc.)

Then, the control unit COM stores the position of the plunger 421 when the force becomes the predetermined value as the reference position X (see FIG. 6 ). The reference position X is a position that serves as a reference for the gate opening operation and the release/recovery of unnecessary resin K to be described later. Note that the reference position X is not limited to the position of the plunger 421 , and may be the position of other members such as a drive shaft (transmission shaft) of the plunger driving unit 422 connected to the plunger 421 .

Then, before the start of the mold opening operation, as shown in FIG. 7 , the transfer mechanism 42 lowers the plunger 421 to the side opposite to the upper mold 2 to a predetermined peeling position Y. By lowering the plunger 421 to the peeling position Y, the upper surface of the plunger 421 and the lower surface of the unnecessary resin K are peeled off. After the peeling action, the transmission mechanism 42 raises the plunger 421 to the reference position X. At this time, the upper surface of the plunger 421 is in contact with the lower surface of the unnecessary resin K (state of FIG. 6 ).

Next, as shown in FIG. 8 , the lower mold 3 is lowered by the mold clamping mechanism 5 to start the mold opening operation. When the clamping mechanism 5 starts the mold opening action and the clamping force decreases to a specified value (different from the specified value in the transmission mechanism 42), as shown in FIG. 9, the transmission mechanism 42 raises the plunger 421 to the upper mold 2 . Thereby, the unnecessary resin K on the tank block 41 is pressed to the upper die 2 by the plunger 421 . In addition, the clamping force is measured by force sensors (including a weight sensor, a load sensor, etc.) provided on the clamp shaft of the mold clamping mechanism 5 etc., such as a load sensor not shown.

In addition, when the transmission mechanism 42 raises the plunger 421 to the upper die 2, as shown in FIG. That is, during the mold opening operation, the transfer mechanism 42 raises the plunger 421 from the lower mold 3 to the upper mold 2 while the block 41 is lifted from the lower mold 3 to the upper mold 2 by the elastic force of the elastic member 43 .

Furthermore, in the mold opening action, the timing at which the groove block 41 starts to rise from the lower die 3 to the upper die 2 due to the elastic force of the elastic member 43 is the same as the timing at which the plunger 421 starts to rise from the lower die 3 to the upper die 2 by using the transmission mechanism 42. The timing can be the same or different.

By the rise of the plunger 421 by the transmission mechanism 42 and the rise of the groove block 41 by the elastic force of the elastic member 43, as shown in FIG. Unnecessary resin K separation (gate disconnection).

At this time, the molded resin product W2 on the lower mold 3 is pressed against the mold surface of the lower mold 3 by the ejector pin 61 provided on the upper mold 2, and the lower surface of the molded resin product W2 is in a state of being in close contact with the mold surface of the lower mold 3. (Refer to Figure 9). The ejector pin 61 functions as a pressing member that presses the resin molded product W2 against the mold surface of the lower die 3 when separating the resin molded product W2 from the unnecessary resin K. Since the resin molded product W2 is pressed against the die surface of the lower mold 3 by the pressing member as described above, shear stress is easily applied between the resin molded product W2 and unnecessary resin K, and the gate is easily broken.

Here, the ejector pin 61 as a pressing member presses the resin molded product W2 against the mold surface of the lower die 3 at least until the resin molded product W2 is separated from the unnecessary resin K. In other words, during the mold opening operation, while the ejector pin 61 is pressing the resin molded product W2, the separation of the resin molded product W2 and the unnecessary resin K is completed by raising the block 41 and the plunger 421 .

In the gate disconnection, unnecessary resin K is sandwiched between the upper surface of the groove block 41 pressed upward by the elastic force of the elastic member 43 and the lower surface of the upper mold 2 (refer to FIG. 9 and Figure 10). That is, the groove block 41 is in a state where unnecessary resin K is sandwiched between the upper mold 2 and the upper mold 2 by the elastic force of the elastic member 43 for a predetermined period from the start of the mold opening operation. The term "predetermined period" includes at least the period until gate opening is completed, and is the period until the lower mold 3 descends to return to the initial state (state before being pressed and compressed by the upper mold 2 ) of the elastic member 43 .

Then, after a predetermined period of time has elapsed, that is, the lower mold 3 is further lowered by the mold clamping mechanism 5, and as shown in FIG. . Here, the reject pool part 41b and the gate part 41c are formed in the tank block 41, and the contact area of the tank block 41 and the unnecessary resin K is larger than the contact area of the upper mold 2 and the unnecessary resin K, so it is not necessary to The resin K is not peeled from the tank block 41, but peeled from the upper mold 2. Thereby, an ejector pin for contacting unnecessary resin K and peeling the unnecessary resin K from upper mold 2 may be unnecessary.

In addition, as the transfer mechanism 42 raises the plunger 421 to the upper mold 2, the protruding portion 411 of the groove block 41 changes from the state of sandwiching the resin molded product W2 between the mold surface of the lower mold 3 to the state of being in contact with the resin molded product W2. state of no contact.

In addition, the transfer mechanism 42 raises the plunger 421 to the upper mold 2 until the elastic member 43 on the lower side of the block 41 is restored to the initial state before mold closing (see FIG. 11 ) except that the gate is disconnected. Thereby, in the next resin molding, when the object W1 to be molded is placed on the lower side of the overhanging part 411, the overhanging part 411 does not become an obstacle.

After performing the mold opening operation as above to separate the resin molded product W2 from the unnecessary resin K, the resin molded product W2 and the unnecessary resin K are unloaded by the unloader 15 .

As shown in FIG. 12 , the unloader 15 includes a suction unit 15 a for molded articles and a suction unit 15 b for unnecessary resin. Both the suction part 15a for molded product and the suction part 15b for unnecessary resin include a resin suction pad, and the suction part 15b for unnecessary resin is, for example, a bellows type, and is superior in stretchability than the suction part 15a for molded product. . Moreover, the suction part 15a for molded articles and the suction part 15b for unnecessary resin are provided in the base member 151, and are connected to the suction source which is not shown in figure. Furthermore, at least the adsorption part 15a for molded articles is comprised so that it can move to the left-right direction and the up-down direction with respect to the base member 151. As shown in FIG. Furthermore, the unloader 15 is provided with holding claws 152 for holding the resin molded product W2 sucked by the molded product suction unit 15a.

After the mold opening action is finished, the unloader 15 is made to enter between the upper mold 2 and the lower mold 3 . Then, as shown in FIG. 12 , the suction part 15 a for molded product is brought into contact with the upper surface of the resin molded product W2 , and the suction part 15 b for unnecessary resin is brought into contact with the upper surface of the unnecessary resin K.

In this state, as shown in FIG. 13 , the transmission mechanism 42 raises the plunger 421 to lift unnecessary resin K from the tank block 41 . Here, when the remaining part K1 in which the unnecessary resin K remains in the tank 41 a is included, the remaining part K1 is raised to such an extent that recovery of the unnecessary resin K is not hindered. Thereby, unnecessary resin K is released from the tank block 41, and is in close contact with the unnecessary resin adsorption part 15b. At this time, the unnecessary resin adsorption portion 15b is elastically deformed and shrunk.

After the unnecessary resin adsorption unit 15b is contracted, the unnecessary resin adsorption unit 15b starts to adsorb the unnecessary resin K to adsorb the unnecessary resin adsorption unit 15b. Moreover, the adsorption|suction of the adsorption|suction part 15a for molded articles starts, and the adsorption|suction part 15a for molded articles adsorb|sucks the resin molded article W2.

Then, as shown in FIG. 14 , the molded product suction unit 15 a holding the resin molded product W2 is moved in a direction away from the groove block 41 to move the resin molded product W2 out of the extension portion 411 . Thereafter, after raising the unloader 15, the upper die 2 and the lower die 3 are withdrawn. As a result, the resin molded product W2 and unnecessary resin K are unloaded by the unloader 15 .

Here, the unloader 15 may include a cleaning mechanism (not shown) for cleaning the upper mold 2 and the lower mold 3 . In addition, as a cleaning mechanism, it is conceivable to include a rotating brush and a suction unit that sucks and discharges dust.

In this case, the unloader 15 holding the resin molded product W2 and the unnecessary resin K stays between the upper mold 2 and the lower mold 3 and performs a cleaning operation.

Here, first, the transfer mechanism 42 performs an operation of scraping out the resin adhering to the groove 41a. That is, as shown in FIG. 15 , the transmission mechanism 42 raises the plunger 421 to a predetermined extraction position. Here, the predetermined pick-out position is, for example, a position where the upper surface of the plunger 421 is higher than the opening position of the groove 41a. Then, the transfer mechanism 42 descends from the predetermined pick-up position to the loading position for storing the resin material J. As shown in FIG. Thereafter, the transmission mechanism 42 raises the plunger 421 again to a predetermined pulling-out position. Thereby, the resin adhering to the groove|channel is scraped out to the outside of the groove|channel 41a.

Thereafter, the upper mold 2 , the lower mold 3 , the groove block 41 and the plunger 421 are cleaned by using the cleaning mechanism provided on the unloader 15 . After the cleaning operation is completed, the unloader 15 withdraws from the upper mold 2 and the lower mold 3 to unload the resin molded product W2 and unnecessary resin K.

<Effects of this embodiment> According to the resin molding apparatus 100 of this embodiment, during the mold opening operation by the mold clamping mechanism 5 , the transfer mechanism 42 raises the plunger 421 to the upper mold 2 , and therefore, unnecessary resin K on the block 41 is moved by the plunger 421 . Pressing the upper die 2 securely separates the resin molded product W2 from unnecessary resin K without increasing the elastic force of the elastic member 43 that advances and retreats the groove block 41 . In addition, since it is not necessary to increase the elastic force of the elastic member 43, the size of the elastic member 43 is prevented, and further, the size of the molding die 2 and the molding die 3 and the size of the unnecessary resin K are not increased.

In addition, in the present embodiment, during the mold opening operation, the transfer mechanism 42 raises the plunger 421 to separate the molded resin product W2 from unnecessary parts while the block 41 is raised by the restoring force of the elastic member 43 , that is, the elastic force. Since the resin K is separated, the resin molded product W2 can be reliably separated from the unnecessary resin K by the elastic force of the elastic member 43 compressed during mold clamping.

Furthermore, in this embodiment, before the plunger 421 is raised to the upper die 2, the plunger 421 is lowered to the side opposite to the upper die 2, and the lower part of the unnecessary resin K is peeled off from the upper surface of the plunger 421. Therefore, after the resin molded article W2 is separated from the unnecessary resin K by raising the plunger 421 to the upper die 2, the separated unnecessary resin K can be easily recovered.

Furthermore, in this embodiment, unnecessary resin K is sandwiched between the groove block 41 and the upper mold 2 during the period from the start of the mold opening operation to the completion of the gate opening, so that it is possible to prevent Unnecessary resin K falls out of the groove block 41 unexpectedly, such as the reaction of K separating from the resin molded product W2.

In addition, in the present embodiment, until the resin molded product W2 is separated from the unnecessary resin K, the resin molded product W2 is pushed down to the die surface of the lower die 3 by a pressing member such as the ejector pin 61 provided on the upper die 2 . By pressing, it is possible to reliably separate the resin molded product W2 from the unnecessary resin K while preventing the resin molded product W2 from floating or shifting from the lower mold 3 when the unnecessary resin K is separated.

Furthermore, since the transmission mechanism 42 raises the plunger 421 to the upper die 2 until the elastic member 43 returns to its original state, even if the sliding resistance between the plunger 421 and the groove 41a becomes large due to the resin adhering to the inner surface of the groove, The groove block 41 can also be reliably returned to the initial position when the mold is opened.

＜Other Modified Embodiments＞ Furthermore, the present invention is not limited to the embodiments described.

For example, in the above-described embodiment, the plunger 421 is lowered to separate the upper surface of the plunger 421 from the lower surface of the unnecessary resin K before the resin molded product W2 is separated from the unnecessary resin K. After separating the resin molded product W2 from the unnecessary resin K, the plunger 421 may be lowered to peel the upper surface of the plunger 421 from the lower surface of the unnecessary resin K.

In addition, in the above-described embodiment, a structure is adopted in which the resin molded product W2 is pushed into the lower mold 3 by the ejector pin 61 provided on the upper mold 2 until the resin molded product W2 is separated from the unnecessary resin K. However, in addition to the ejector pin 61, a pressing member for pressing the resin molded product W2 against the die surface of the lower die 3 may be provided.

Furthermore, in the above-mentioned embodiment, the reject pool part 41b and the gate part 41c are formed in the tank block 41, However, The reject tank part and the gate part may be formed in the recessed part 2b of the upper mold|type 2. In this case, when the upper mold 2 and the lower mold 3 are opened, the unnecessary resin K may be demoulded from the groove block 41 and stay in the concave portion 2b of the upper mold 2, so the upper mold 2 may also be provided for Ejector pin to release unwanted resin K from the mold.

The resin molding apparatus of the present invention is not limited to general transfer molding, and may be configured as long as it includes a transfer mechanism.

In addition, this invention is not limited to the said embodiment, Of course, a various deformation|transformation is possible in the range which does not deviate from the summary.

2: The first mold (upper mold, forming mold) 2a: Cavity 2b: concave part 2c: runner part 3: Second mold (lower mold, forming mold) 4: Resin injection part 5: Clamping mechanism 11: Molding object supply department 12:Resin material supply department 13: Conveying device (loader) 14: storage department 15: Conveying device (unloader) 15a: Adsorption part for molded products 15b: Adsorption part for unnecessary resin 41: slot block 41a: Slot 41b: Picking tank part 41c: gate part 42: Transfer agency 43: elastic member 61: Ejection pin (press member) 62: Ejection board 63: Elastic member 64: Return pin 100: Resin molding device 100A: supply module 100B: Forming die set 100C: storage module 101: upper die holder 102: upper platen 103: upper mold base plate 104: Lower die holder 105: Movable platen 106: Lower mold base plate 151: Base member 152: holding claw 410: cylindrical member 411: overhang 421: plunger 422:Plunger driving part COM: Control Department J: resin material K: Unnecessary resin K1: residual part W1: Forming object W2: Resin molded product (molded object) Wx: electronic parts X: Reference position Y: peeling position

FIG. 1 is a schematic diagram showing the structure of a resin molding apparatus according to one embodiment of the present invention. FIG. 2 is a schematic diagram showing the structure of the molding die set of the embodiment. Fig. 3 is a schematic view showing a substrate mounting state and a resin material filling state of the molding die set according to the embodiment. Fig. 4 is a schematic diagram showing a mold clamping state of the molding die set according to the embodiment. Fig. 5 is a schematic view showing a resin injection state of the molding die set according to the embodiment. Fig. 6 is a schematic diagram showing a reference position X of the molding die set according to the embodiment. Fig. 7 is a schematic view showing a peeling state of the forming die set according to the embodiment. Fig. 8 is a schematic diagram showing a state of the molding die set in the embodiment when the mold opening operation starts. 9 is a schematic diagram showing a gate break operation in the mold opening operation of the molding die set according to the embodiment. Fig. 10 is a schematic diagram showing a state after the gate is broken during the mold opening operation of the molding die set according to the embodiment. Fig. 11 is a schematic view showing a mold-opening state of the molding die set according to the embodiment. 12 is a schematic view showing a state where each suction unit of the unloader according to the embodiment is in contact with a resin molded product and unnecessary resin. FIG. 13 is a schematic diagram showing a state in which unnecessary resin rises and the unnecessary resin adsorption portion shrinks in the embodiment. 14 is a schematic view showing a state in which the unloader of the embodiment absorbs and unloads a resin molded product and unnecessary resin. FIG. 15 is a schematic view showing (a) a pick-up position and (b) a loading position in a pick-up operation in the embodiment.

2: The first mold (upper mold, forming mold)

3: Second mold (lower mold, forming mold)

5: Clamping mechanism

41: slot block

42: Transfer mechanism

43: elastic member

61: Ejection pin (press member)

62: Ejection board

63: Elastic member

64: Return pin

100B: Forming die set

101: upper die holder

102: upper platen

103: upper mold base plate

104: Lower die holder

105: Movable platen

106: Lower mold base plate

421: plunger

422:Plunger driving part

K: Unnecessary resin

W2: Resin molded product (object to be molded)

Claims (7)

A resin molding device, comprising: a first mold formed with a cavity for injecting a resin material; a second mold opposite to the first mold and provided with a resin injection part for injecting the resin material into the cavity and a mold clamping mechanism for clamping the first mold and the second mold, the first mold includes a pressing member, and the pressing member presses the resin molded product against the mold surface of the second mold, so The resin injection part includes: a groove block, formed with a groove for accommodating the resin material, configured to be able to advance and retreat relative to the second mold through an elastic member, and includes a protruding protrusion protruding from the mold surface of the second mold. an output part; and a transmission mechanism including a plunger provided in the groove, and moves the plunger from the groove to the The resin material is injected into the mold cavity, and the groove block utilizes the elastic member during a predetermined period from the start of the mold opening operation of the mold clamping mechanism to open the first mold and the second mold. In the state where unnecessary resin is sandwiched between the first mold by the restoring force, in the mold opening operation, the pressing member is at least until the resin molded product is separated from the unnecessary resin. During this process, the resin molded product is pressed against the die face of the second die, and at the same time, the transfer mechanism moves the plunger toward the first die, and all the die faces on the die face of the second die The resin molded product and the groove block The unnecessary resin is separated, and after the lapse of the predetermined period, the tank block holds the unnecessary resin while peeling the unnecessary resin from the first mold. The resin molding apparatus according to claim 1, wherein the transfer mechanism causes the channel block to move toward the first mold while receiving the restoring force of the elastic member during the mold opening operation. The plunger moves toward the first die to separate the resin molded product from the unnecessary resin. The resin molding apparatus according to claim 1, wherein the transmission mechanism moves the plunger to a side opposite to the first mold before moving the plunger to the first mold, Instead, the unnecessary resin is stripped from the plunger. The resin molding apparatus according to claim 1, wherein the transfer mechanism moves the plunger toward the first mold until the elastic member is restored to an initial state. The resin molding apparatus according to claim 1, wherein, as the transfer mechanism moves the plunger toward the first die, the protruding portion of the groove block is separated from the second die. The state in which the resin molded product is sandwiched between the mold faces becomes the state where the resin molded product is not in contact with it. A method of manufacturing a resin molded product, using the resin molding apparatus according to any one of claims 1 to 5. A method of manufacturing a resin molded product, which is a method of manufacturing a resin molded product using a resin molding device, the resin molding device comprising: a first mold formed with a cavity for injecting a resin material; exactly the same, and set There is a resin injection part for injecting the resin material into the mold cavity; and a mold clamping mechanism for clamping the first mold and the second mold, the first mold includes a pressing member, and the pressing member will The resin molded product is pressed against the mold surface of the second mold, and the resin injection part includes: a groove block formed with a groove for accommodating the resin material, and provided so as to be able to advance and retreat relative to the second mold through an elastic member, and including a protruding part protruding from the die surface of the second mold; and a transfer mechanism, including a plunger arranged in the groove, and in a state where the first mold and the second mold are closed The plunger is moved to inject the resin material from the groove into the cavity, and in the method of manufacturing the resin molded product, the first mold and the During a predetermined period from the start of the mold opening operation of the second mold opening, the groove block is in a state where unnecessary resin is sandwiched between the first mold and the first mold by the restoring force of the elastic member. During the mold opening operation, the pressing member presses the resin molded product against the die surface of the second mold at least until the resin molded product is separated from the unnecessary resin, and the transfer mechanism moving the plunger toward the first mold to separate the resin molded product on the mold surface of the second mold from the unnecessary resin on the groove block, and after the predetermined period elapses, Then, the block holds the unnecessary resin while peeling the unnecessary resin from the first mold.

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