JP2004235530A - Sealing and molding apparatus and manufacturing method of sealed molding body using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sealing and molding apparatus in which a wire flow hardly occurs even when a wire is made thin, and is capable of coping with thickness-reduction. <P>SOLUTION: The sealing and molding apparatus 10 includes a metallic mold 3 consisting of a cope 2 having a clamping mechanism 15 and a drag 1, where the drag 1 is provided with a pot 4 receiving a sealing resin tablet 23 for sealing a semiconductor device, a sealing drag cavity 5 that a resin received into the pot 4 is supplied from a gate 9 through a runner 6, and a plunger 7 that is movably attached to the pot 4 and supplies a sealing resin received in the pot 4 to the drag cavity 5. In the drag cavity 5, a resin receiving unit 20 is formed which receives the sealing resin on the upper part of a top end face 18 at a backed state, and the sealing resin is compressed by the top end face 18a at an approached state, and a molding plunger 18 for compression molding is movably loaded which molds by forming the bottom face (a molding surface) of the drag cavity part 5. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a sealing molding apparatus for molding a semiconductor resin sealing body in which a semiconductor device such as a transistor or an IC is sealed with a resin, and a method for manufacturing a sealing molding using the same.
[0002]
[Prior art]
Transfer molding is applied as a method for efficiently molding a semiconductor resin sealed body (so-called package) by sealing a semiconductor device (semiconductor chip) such as a transistor or an IC with resin, and a transfer molding apparatus is used for such transfer molding. (For example, Patent Document 1).
[0003]
The molding section of the transfer molding apparatus includes a pair of molding dies 3 including, for example, a lower mold 1 and an upper mold 2 as shown in FIG. A cavity 5 for molding a resin sealing body is formed around the pot 4 arranged at the center of the mold 3 in a clamped state. The pot 4 and the cavity 5 are connected by a runner 6 as a resin passage. A plunger 7 that can move up and down is mounted on the pot 4, and the periphery of the pot 4 is called a cull portion 8.
[0004]
A tablet of the sealing resin is put into the pot 4, and the plunger 7 is raised in a state where the sealing resin is melted, so that the molten resin in the pot 4 is transferred from the gate 9 to the cavity 5 through the runner 6. Supplied to With the sealing resin sufficiently filled in the cavity 5, curing (curing) proceeds to form a resin sealing body.
[0005]
Resin (cal resin or cull) remaining in a mold runner portion or pot portion is connected to a resin sealing body (molded product) molded by such a transfer molding apparatus, and these resins are It is called gate runner resin or cull resin (cal) depending on the position. The gate runner resin and the cull resin are taken out of the mold together with the molded product. For example, the molded product is released from the upper mold 2 by an eject pin (not shown) of the upper mold 2 simultaneously with opening of the mold. Further, the molded product is taken out together with the gate runner resin and the cull resin by raising the eject pin (not shown) and the plunger 7 of the lower mold 1 to advance into the cavity portion 5.
[0006]
In the molded product obtained by connecting the gate runner resin and the cull resin, the molded product and unnecessary portions thereof are separated by a break process, and a package (resin sealed body; molded product) as a product is obtained.
[0007]
A tablet made of an epoxy molding material mainly composed of an epoxy resin and a filler as a sealing resin is put into a mold pot held at a high temperature (160 to 180 ° C.), heated and melted, and 70 to 100 kg. / Cm ² Molded with a mold clamping pressure of about, the epoxy resin cured epoxy resin composition, since the epoxy resin composition completely covers the semiconductor chip, the resulting resin encapsulated body has excellent reliability, In addition, since the package is formed using a mold, the appearance of the package is good. Therefore, at present, most resin sealing bodies are manufactured by this method.
[0008]
[Patent Document 1]
JP 2000-43099 A
[0009]
[Problems to be solved by the invention]
However, semiconductor chips are rapidly increasing in integration density and thinner due to technological advances and social demands to reduce power consumption. Accordingly, the dimension (pitch) between the line widths of the wires taken out of the semiconductor chip is, for example, about 100 μm, but is recently required to be about 50 μm. Became. For this reason, according to the semiconductor manufacturing apparatus using the conventional transfer molding apparatus, the problem that the wires easily flow and the defective products easily occur is rapidly developing. This is because, in the conventional semiconductor manufacturing apparatus, the sealing resin is instantaneously injected from the gate 6 into the cavity 5 as a molding portion, and the sealing resin flows instantaneously in the planar direction through the thinned cavity 5. Because it must be.
[0010]
Further, in such a conventional sealing molding apparatus, there is a problem that unnecessary resin generated as a gate runner resin or a cull resin is discarded, and the yield of the sealing resin is low.
[0011]
Then, this invention makes it a subject to solve these conventional technologies.
[0012]
Further, the present invention makes use of the conventional encapsulation molding apparatus, which is widely used as a transfer molding apparatus, as much as possible, and hardly causes wire flow even when the wire is thinned. It is an object of the present invention to provide a sealing molding apparatus that can perform the molding.
[0013]
Another object of the present invention is to provide a sealing molding device capable of reducing waste resin.
[0014]
[Means for Solving the Problems]
According to the study of the present inventors, when supplying resin from the runner to the cavity, a resin receiving portion for receiving the sealing resin is provided below the cavity, and the resin receiving portion receives one end of the sealing resin. After that, if the received sealing resin is supplied from the lower surface of the thin semiconductor device to perform sealing, it is possible to use a conventional sealing molding device and to prevent wire flow even in an integrated package. The present inventors have found that sealing can be performed, and arrived at the present invention.
[0015]
That is, the present invention includes a mold including an upper mold and a lower mold having a mold clamping mechanism, and the lower mold has a pot for receiving a sealing resin for sealing a semiconductor device, A lower cavity for sealing, in which the resin received in the pot is supplied from the gate via a runner portion, and a resin which is mounted on the pot so as to be able to move forward and backward and is received in the pot is supplied to the lower cavity. And a plunger that performs
In the lower mold cavity portion, a resin receiving portion for receiving the sealing resin is formed at an upper portion of the front end surface in a retracted state, and the sealing resin supplied to the resin receiving portion is compressed by the front end surface in the entered state. A sealing molding apparatus characterized in that a molding plunger for compression molding, which forms and forms a bottom surface (molding surface) of a lower mold cavity, while being movable forward and backward, is provided.
[0016]
According to such a sealing molding apparatus, (a) a resin charging step of charging a sealing resin tablet into a pot with the mold opened, and (b) at least one of the upper and lower dies is raised and lowered. (C) a resin supply step in which the supply plunger is raised to supply the resin charged into the pot to the resin receiving portion in a molten state, and (d) a tip of the molding plunger. A compression molding step of elevating the surface to the molding surface and sealing and curing the semiconductor device with the molten resin received in the resin receiving portion, (e) opening the mold and removing the obtained resin sealing body A sealing molded body can be manufactured by sequentially performing the steps.
[0017]
Here, it is preferable that the gate is located below the molding surface. As a result, the gate is shut off at the side surface of the molding plunger by moving the molding plunger to a position where a desired molding surface is formed, so that a gate break can be performed at the time of molding and the gate breaking step can be omitted. Can be.
[0018]
Further, it is preferable that the distal end surface of the molding plunger is configured to project further upward than the molding surface so as to be able to project into the cavity portion. In the demolding step after molding, the molded product obtained by projecting the tip end surface from the molding surface can be demolded from the cavity.
[0019]
At this time, if the area of the front end surface is the same as the bottom surface of the lower mold cavity, the entire surface of the molded product can be extruded in the demolding step, so that the molded product can be demolded without providing an eject pin. Can be done. The area of the tip surface can be freely designed as long as it is equal to or less than the area of the bottom surface of the lower mold cavity.
[0020]
Further, it is preferable to provide a dummy cavity for receiving the surplus resin on the periphery of the cavity portion. Thus, even if the amount of resin supplied to the resin receiving section is excessive, the excess resin can be received in the dummy cavity.
[0021]
In addition, if the position of the tip surface of the plunger can be controlled by the servomotor, the amount of resin supplied to the resin receiving unit can be appropriately controlled.
[0022]
According to the sealing molding apparatus configured as described above, as a lower mold for forming the cavity portion, the lower mold is provided so as to be able to advance and retreat, and the tip end surface is in contact with the bottom surface (molding surface) of the lower mold cavity. By forming and remodeling, loading the molding plunger that forms the resin receiving part for receiving the sealing resin in the upper part in the retracted state, the conventional mold including the pot part, the cull part, and the upper mold is used as it is. Can be used.
[0023]
In addition, with this configuration, the resin is sealed from below the sealing member such as a semiconductor device to be sealed. Therefore, when the sealing member is thin, the inside of the sealing member including the wire is sealed. Since the distance of the moving sealing resin may be short and the flow velocity of the resin across the wire is low, even when the wire is thinned, the wire does not easily flow.
[0024]
The flow direction of the sealing resin in the sealing member is substantially perpendicular to the thin sealing member, and is caused by the fact that the resin is uniformly melted and the amount of resin to be flowed is small. Thus, the flow rate of the sealing resin around the sealing member may be low, and even if the sealing member is loaded with a very fine wire, no wire flow occurs.
[0025]
In addition, according to such a sealing molding apparatus, the sealing resin is supplied through the runner, so that it is supplied to the resin receiving section in a uniformly molten state. Since the supply of the sealing resin to the resin receiving portion does not require a special high pressure, the volume of the cull portion and the cross-sectional area of the runner portion may be small. In designing a semiconductor manufacturing apparatus, the volume of the cull portion and the runner portion can be reduced, thereby greatly reducing the amount of resin used. The amount of waste resin is reduced.
[0026]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. Parts that are the same as or equivalent to those of the sealing molding apparatus described in the related art will be described with the same reference numerals.
[0027]
FIG. 1 is a view showing an example of a sealing molding apparatus according to an embodiment of the present invention, and is a mounting view showing a state where a sealing molding die is mounted, and FIG. It is the end elevation which showed the principal part with the end surface in the state where the metallic mold was opened.
[0028]
In FIG. 1, reference numeral 10 denotes a sealing molding device, in which a fixed plate 11 at an upper end and a base plate 12 at a lower end are fixed in parallel at upper and lower ends of a plurality of guide posts 13. The movable plate 14 is mounted so as to penetrate therethrough. A mold clamping mechanism 15 is provided between the base plate 12 and the movable plate 14 to move the movable plate 14 up and down. Further, a transfer mechanism 16 for raising and lowering the plunger 7 (not shown) is fixed to the base plate 12. Further, in the present invention, an elevating mechanism 17 for elevating and lowering a plunger 18 for compression molding (details will be described later) is fixed to the base plate 14.
[0029]
Here, the mold 3 of the present invention comprises a lower mold 1 and an upper mold 2. The lower mold 1 is fixed to a movable plate 14 to be a movable mold, and the upper mold 2 is fixed to a fixed plate 11 and fixed. It is a type. Note that, in the sealing molding apparatus 10, the lower mold 1 is a movable mold, but the upper mold 2 may be a movable mold, and both the upper mold and the lower mold are movable molds. Is also good.
[0030]
As shown in FIG. 2, a dividing line (joining surface) PL where the lower mold 1 and the upper mold 2 are joined together has a cavity (mold cavity) 5 serving as a resin molded portion of the sealing body, and the cavity 5. A runner section 6 and a pot (shot cavity) 4 as a flow path for supplying the molten resin are formed. The gate portion 9 has a weir shape in which the cross-sectional area of the runner portion 6 is reduced and the flow path of the molten resin is narrowed. The upper mold 2 has an upper mold cavity surface 5b, and the lower mold 1 has a lower mold cavity surface 5a.
[0031]
A plunger 7 for tablet molding is arranged in the pot 4 so as to be vertically movable. The plunger 7 is moved up and down by a transfer mechanism 16. The elevating mechanism is not particularly limited. For example, a mechanism capable of accurately controlling the elevating amount by a servomotor, an encoder, or the like is used. The ball screw is rotated by a timing belt or the like under the control of the rotation of a servo motor (not shown) to convert the rotation of the servo motor into a vertical movement. The position of the upper surface (tip surface) 7a of the plunger 7 can be moved up and down to a desired position by controlling the rotational speed of the servomotor with an encoder.
[0032]
The lower surface of the cavity 5 (that is, the upper surface of the lower mold 1 corresponding to the cavity 5) is penetrated, and the penetrating portion has a tip surface 18a as a mold cavity together with the lower mold cavity surface 5a and the upper mold cavity surface 5b. The plunger 18 for compression molding which forms the cavity portion 5 is mounted. The plunger 18 can be moved up and down by an elevating mechanism 17 for compression molding.
[0033]
The lifting mechanism 17 is, for example, substantially the same as or equivalent to the transfer mechanism 16 described above. For example, a servo motor, an encoder, or the like that can accurately control the amount of elevation is used. The ball screw is rotated by a timing belt or the like under the control of the rotation of a servo motor (not shown) to convert the rotation of the servo motor into a vertical movement. The position of the upper surface (tip surface) 18a of the plunger 18 can move the plunger 18 up and down to a desired position while controlling the rotational speed of the servomotor by the encoder.
[0034]
Here, for compression molding means a lifting mechanism capable of holding the pressure required for compression molding, and when it is necessary to control the pressure, it can be placed at an arbitrary position via a pressure detector such as a pressure sensor. It is assumed that a mechanism capable of controlling the molding pressure is provided. Such a pressure control mechanism is known. For example, it is possible to interpose a pressure detector such as a load cell between the plunger 18 and the elevating mechanism 17 to maintain a required pressure by the pressure detected by the pressure detector. it can.
[0035]
The elevating mechanism 17 moves the position of the distal end face 18a of the plunger 18 to a position (hereinafter, referred to as a mold matching position) 19 on the lower surface of the cavity 5 and retreats from the mold matching position 19 to move the runner section 6 onto the distal end face 18a. It is necessary that the position can be controlled to a position (hereinafter, referred to as a resin receiving position) 21 in which a resin receiving portion 20 for receiving the resin supplied from the device is formed. Here, in FIG. 2, the plunger 18 is retracted, and the position of the distal end face 18a matches the resin receiving position 21 in this sectional view.
[0036]
Further, the elevating mechanism 17 can further advance beyond the mold matching position 19 after the molding, whereby the resin sealing body molded in the cavity 5 can be formed even if the ejection pins are not arranged on the lower mold 1. Can be taken out of the cavity 5. Hereinafter, the position advanced by the elevating mechanism 17 beyond the mold matching position 19 is referred to as an extraction position 22.
[0037]
The elevating mechanism 17 is located at the resin receiving position 21 at the retracted position, and at the extracting position 22 at the advanced position. In addition, it can be controlled to the mold matching position 19 as an intermediate position. Thus, when the tip surface 18a is located at the mold matching position 19 in a state where the lower mold 1 and the upper mold 2 are clamped, the resin sealing cavity 5 matches the shape of the molded product. I do.
[0038]
Here, the mold shown in FIG. 2 is designed such that the mold matching position 19 is located above the gate portion 9.
[0039]
The steps in the case where the sealing molding apparatus having the above configuration is used in a semiconductor manufacturing apparatus will be described below.
(A) Resin loading step (tablet loading)
The movable plate 14 is lowered by the mold clamping mechanism 15 to open the mold 3 (FIG. 2). Next, the preheated resin tablet 23 is put into the pot 4. Around this, a lead frame 28 (not shown) preheated by a loader (not shown) is positioned and loaded into the cavity 5 (FIG. 3). Here, in this embodiment, a CSP holding a semiconductor device on one side of a plastic film is used, and the surface to be sealed is loaded toward the lower surface.
(B) Clamping process
The movable plate 14 is raised by the mold clamping mechanism 15 to close the mold 3.
(C) Resin supply process (elevation of molding plunger)
The plunger 7 is raised by the transfer mechanism 16 by driving and controlling the servomotor. Since the mold 3 is heated to a predetermined temperature, the resin in the pot 4 is melted by passing through the runner section 6 and the gate section 9, and the molten resin is transferred to the resin receiving section 20 located below the CSP. Inject and supply. Here, this resin is in a state of being melted by the heat of the pot 4, the runner part 6, and the gate part 9, and the resin has a low viscosity when the curing of the resin is not progressed. The resin injected into the resin receiving portion 20 is quickly developed in a plane direction substantially parallel to the tip surface 18a.
[0040]
As shown in an enlarged view in FIG. 5, a semiconductor device 28a such as a semiconductor chip is fixed to the lower surface of the lead frame 28, and a large number of thin wires 28b are bonded.
(D) Compression molding process
Here, the mold shown in FIG. 2 is designed such that the mold matching position 19 is located above the gate portion 9.
[0041]
Immediately, the servomotor is controlled, and the plunger 18 for compression molding is raised by the lifting mechanism 17 (FIG. 6). Since the molten resin is sealed from below the semiconductor device 28a to be sealed, in the sealing member 28 such as a CSP, the distance of the molten resin traveling in the sealing member including the wire 28b may be short, and Since the flow rate of the molten resin 24 across the wire 28b is low, even when the wire 28b is thinned, wire flow is less likely to occur.
[0042]
Further, in this embodiment, the mold portion 19 is located above the gate portion 9, and therefore, when the plunger 18 is raised and the tip end surface 18 a is aligned with the mold portion 19, the gate portion 9 is not moved. It is completely shut off by the side surface 18b of the plunger 18, and the inside of the cavity 5 is sealed, so that a required molding pressure can be maintained. Thereby, the heat of the mold (for example, 160 to 180 ° C.) and the predetermined pressure (for example, 70 to 100 kg / cm) ² ) For a predetermined time (several seconds to several tens of seconds), the curing reaction of the resin proceeds, and the molded product 24 sealed with the cured resin is obtained.
[0043]
Here, these mold temperature, pressure and holding time vary depending on the performance of the resin to be used, the size of the mold, the size of the package, and the like. The curing holding time and the like are not limited to the above example.
(E) Demolding process
After the curing is completed, the movable plate 14 is lowered by the mold clamping mechanism 15, and the mold 3 is opened as shown in FIG. In the case of the CSP, since the molded product 24 is easily peeled off from the cavity surface 5b of the upper mold 2, an eject pin is substantially unnecessary for the upper mold 2, but an eject pin is provided on the upper mold 2. You may. In this case, the eject pin provided on the upper mold is released from the mold by operating a pin plate or the like (not shown) at the timing of removing the molded product after the mold is opened to advance the eject pin into the cavity portion 5. I do.
[0044]
Then, the sealing molded body (molded product) 24 can be taken out by raising the elevating mechanism 17 to raise the plunger 18 to the take-out position 22. Thus, the molded product can be taken out even if the lower die 1 does not have an ejection device such as an eject pin for taking out the molded product.
[0045]
Here, according to the sealing molding apparatus of the present invention, the gate portion 9 is completely shut off in the compression molding step, so that the runner resin remaining in the runner portion 6 and the like as in the conventional sealing molded body. It is possible to obtain a sealed molded body 24 having a gate break without passing through a so-called gate break step of separating the unnecessary resin 25 such as the unnecessary resin 25 from the molded product 24.
[0046]
Further, in the embodiment of the present invention, since the area of the front end surface 18a is equal to the bottom surface of the molded product, even if the molded product 24 is thin, it is molded from the side in the plane direction in which the molded product 24 is developed. Since the product is extruded, there is also an advantage that the molded product can be taken out of the cavity 5 (or the cavity surface 5a) without being damaged. In addition, for example, even if there is no draft angle (or a small draft angle) for facilitating die-cutting of the side surface of the cavity portion 5, it can be taken out.
[0047]
Thus, if the sealing molding apparatus of the present invention is used as an automated molding apparatus for a semiconductor manufacturing apparatus, the demolded molded product 24 is taken out by a take-out means provided with suction means and the like, and a break process is performed. And can be stored as a product in the next step or stored.
[0048]
Unnecessary resin 25 such as cull resin can be removed by further raising plunger 7 in the same manner. The timing of raising the plungers 7 and 18 may be simultaneous or different.
[0049]
With the mold opened, the plungers 7 and 18 are lifted, and the unnecessary resin 25 is removed and the lower mold 1 and the upper mold 2 are cleaned by a cleaning unit having a suction device, a brush device, and the like, and the next molding cycle is performed. Can be prepared.
[0050]
Further, according to the sealing molding apparatus configured as described above, the lower die 1 forming the cavity portion 5 incorporates the plunger 18 for compression molding and the drive control mechanism (elevation mechanism) for driving and controlling the plunger 18. By performing the remodeling, the conventional semiconductor manufacturing apparatus can be used as it is.
[0051]
Embodiment 2 of the present invention
Second Embodiment A second embodiment of the present invention will be described with reference to FIGS. The same or equivalent parts as those of the embodiment will be described with the same reference numerals. Here, FIGS. 8 and 9 are a plan view and a sectional view, respectively, showing a main part of the lower mold 1 of the sealing molding apparatus according to the second embodiment of the present invention. In order to explain the relationship with the lead frame for convenience, the lead frame 28 is drawn on the lower mold 1 only by the outline.
[0052]
In the second embodiment of the present invention, as shown in FIG. 9, a cavity 5, a gate 9, a runner 6, and a cull 8 are formed in the lower die 1 at substantially the same depth from the dividing line PL. It is designed to be. A dummy cavity 26 is provided around the cavity 5. The dummy cavity 26 allows excess resin to escape from the periphery of the cavity 5 to the periphery.
[0053]
As shown in FIG. 10, in the communication portion 27 between the dummy cavity portion 26 and the cavity portion 5, the gap d in the thickness direction is narrowed to, for example, an interval of about 0.1 to 0.3 mm. The gap d is a gap which allows air to pass easily but viscous resin does not easily pass therethrough, but allows excess resin to escape under pressure. This gap d is appropriately selected by experiments or the like depending on the performance of the sealing resin used. When a gap naturally occurs when the lead frame 28 is interposed between the lower mold 1 and the upper mold 2, the gap d may not necessarily be provided in the lower mold 1.
[0054]
Thereby, in the compression molding step, the air in the cavity 5 is exhausted through the gap d, and the molten resin is filled up to the corners of the cavity 5 so that defective products including voids can be reduced.
[0055]
The steps in the case where the sealing molding apparatus thus designed is used in a semiconductor manufacturing apparatus will be described below.
[0056]
The pot 4 is formed above the plunger 7 by lowering the plunger 7 from the position shown in FIG. Further, the plunger 18 is lowered by driving the elevating mechanism 17 to form the resin receiving portion 20 above the plunger 18.
(A) Resin loading step (tablet loading)
The movable plate 14 is lowered by the mold clamping mechanism 15 to open the mold 3, and then a preheated resin tablet is put into the pot 4. Before or after this, the lead frame 28 preheated by a loader (not shown) is positioned above the cavity 5 and loaded.
(B) Clamping process
The movable plate 14 is raised by the mold clamping mechanism 15 to close the mold 3.
(C) Resin supply process (elevation of molding plunger)
The servomotor is driven and controlled, and the plunger 7 is raised by the transfer mechanism 16 to the position shown in FIG. Since the mold 3 is heated, the resin in the pot 4 is melted by passing through the runner section 6 and the gate section 9, and the molten resin is injected into the resin receiving section 20 located below the lead frame 28. Supply. Here, this resin is in a state of being melted by the heat of the pot 4, the runner portion 6, and the gate portion 9. Since the resin has low viscosity when the curing of the resin is not progressed, the cross-sectional area of the runner portion 6 is small. Even if the cross-sectional area of the conventional runner portion is reduced, the resin can be fed to the resin receiving portion 20. Similarly, the amount of resin remaining as the cull portion 8 can be reduced. In the present invention, a predetermined amount of molten resin may be fed to the resin receiving section 20, and the resin injected into the resin receiving section 20 is quickly developed in the plane direction.
(D) Compression molding process
Immediately, the servomotor is controlled, and the plunger 18 for compression molding is raised to the position shown in FIG. Since the molten resin (not shown) seals from below the semiconductor device 28a to be sealed, the lead frame 28 may have a short distance of the molten resin 24 moving in the sealing member including the wire 28b. Since the flow rate of the molten resin 24 crossing the wire 28b is low, even when the wire 28b is thinned, the wire flow rarely occurs.
[0057]
By holding the required molding pressure in the cavity 5, the curing reaction of the resin proceeds by the heat of the mold, and the molten resin is cured.
(E) Demolding process
After the curing is completed, the movable plate 14 is lowered by the mold clamping mechanism 15 to open the mold 3. The eject pin provided in the upper mold is released from the mold by operating a pin plate (not shown) or the like at the timing of taking out the molded product after the mold is opened, to advance the eject pin into the cavity 5.
[0058]
Next, by raising the transfer mechanism 16 and the elevating mechanism 17 to raise the plunger 7 and the plunger 18, the sealing molded body (molded product) 24 is taken out while being connected to the unnecessary resin 25. The molded product can be taken out even if the lower die 1 does not have an ejection device such as an eject pin for taking out the molded product.
[0059]
Here, the difference from the first embodiment of the invention is that a molded product 24 is obtained in a state where the unnecessary resin 25 such as a runner resin is connected, so that a so-called gate for separating the unnecessary resin 25 from the molded product 24 is provided. The sealing molded body 24 can be obtained through the breaking step. In this gate break step, unnecessary resin eluted into the dummy cavity 26 is also removed.
[0060]
With the mold opened, the plungers 7 and 18 are raised, and the lower mold 1 and the upper mold 2 are cleaned by the cleaning means including a suction device, a brush device, and the like, so that the next molding cycle can be prepared.
[0061]
Further, according to the sealing molding device configured as described above, the thickness of the cavity 5 can be made substantially equal to the thickness of the cull portion and the runner portion. Surplus resin can be extremely reduced.
[0062]
This has the advantage that the amount of unnecessary resin can be reduced and the mold including the lower mold can be designed to be compact.
[0063]
That is, according to the sealing molding apparatus according to the present invention, since the sealing resin is supplied to the resin receiving section 20 through the runner section 6, it is supplied to the resin receiving section 20 in a uniformly molten state. Since the supply of the molten resin to the resin receiving portion 20 does not require a special high pressure, the volume of the cull portion 8 and the cross-sectional area of the runner portion 6 may be small. When a new semiconductor manufacturing apparatus is designed, the volume can be reduced by making the thickness of the cull portion 8 and the runner portion 6 substantially equal to the thickness of the molded product as in the second embodiment of the present invention. As a result, the amount of resin used can be significantly reduced, and the amount of waste resin is reduced along with the miniaturization (compactness) of the apparatus.
[0064]
Other functions and effects are the same as those in the first embodiment, and thus detailed description is omitted.
[0065]
The embodiment of the present invention has been described in detail with reference to the drawings. However, the specific configuration is not limited to this embodiment, and the present invention is not limited to this embodiment even if there is a design change within a scope not departing from the gist of the present invention. included.
[0066]
For example, in the above embodiment, a single plunger type sealing molding apparatus has been described, but substantially the same operation and effect can be obtained by applying to a multi-plunger type sealing molding apparatus.
[0067]
Further, the portion where the cavity portion 5 is formed or its periphery may be configured to be replaceable by a chase block or the like.
[0068]
【The invention's effect】
As described above, according to the present invention, since the sealing resin is supplied through the runner, it is supplied to the resin receiving portion in a uniformly molten state. Since no special high pressure is required for the supply to the resin receiving portion, the volume of the cull portion and the cross-sectional area of the runner portion may be small, so that the amount of resin used can be greatly reduced. The amount of waste resin is reduced along with the miniaturization (compactness) of the apparatus.
[0069]
Also, the flow direction of the molten resin in the sealing member is a direction substantially perpendicular to the thin sealing member, and is caused by the fact that the resin is uniformly melted and the amount of resin to flow is small. Therefore, the flow rate of the molten resin around the sealing member may be low, and even if the sealing member is loaded with a very fine wire, no wire flow occurs.
[0070]
Such a molding apparatus has a practically useful effect of being able to cope with a modification of only a mold portion of an existing semiconductor device.
[Brief description of the drawings]
FIG. 1 is a diagram illustrating an example of a sealing molding apparatus according to an embodiment of the present invention, and is a mounting diagram illustrating a state where a sealing molding die is mounted.
FIG. 2 is an end view showing a main part of the molding die with an end surface in a state where the die is opened.
FIG. 3 is a diagram illustrating a process when the sealing molding device according to the embodiment of the present invention is used in a semiconductor manufacturing device, and is a diagram illustrating a resin charging process.
FIG. 4 is a diagram illustrating a process when the encapsulation molding apparatus according to the embodiment of the invention is used in a semiconductor manufacturing device, and is a diagram illustrating a resin supply process.
FIG. 5 is an enlarged view of a main part of FIG. 5;
FIG. 6 is a diagram illustrating a process when the sealing molding device according to the embodiment of the present invention is used in a semiconductor manufacturing device, and is a diagram illustrating a compression molding process.
FIG. 7 is a diagram illustrating a process when the encapsulation molding apparatus according to the embodiment of the invention is used in a semiconductor manufacturing device, and is a diagram illustrating a demolding process.
FIG. 8 is a plan view showing a main part of a lower mold of a sealing molding apparatus according to Embodiment 2 of the present invention.
FIG. 9 is a sectional view of FIG. 8;
FIG. 10 is a partial cross-sectional view illustrating an enlarged portion A of FIG. 9;
FIG. 11 is a cross-sectional view illustrating a conventional molding die.
[Explanation of symbols]
1: Lower mold
2: Upper mold
3: Mold (molding mold)
4: Pot (shot cavity)
5: cavity
5a: Lower mold cavity surface
5b: Upper mold cavity surface
6: Runner section
7: Plunger
7a: Top surface (tip surface)
8: Cull part
9: Gate section
10: Sealing molding device
11: fixed plate
12: Base plate
13: Guide post
14: movable plate
15: Mold clamping mechanism
16: Transfer mechanism
17: Elevating mechanism
18: Plunger (for compression molding)
18a: Top surface (tip surface)
18b: side surface
19: Matching position
20: Resin receiving section
21: Resin receiving position
22: Removal position
23: Tablet
24: Sealed molded product (molded product; product)
25: Unnecessary resin (runner resin, cal resin)
26: Dummy cavity
27: Liaison department
28: Frame
28a: Semiconductor device (chip)
28b: Wire

Claims (7)

Equipped with a mold composed of an upper mold and a lower mold with a mold clamping mechanism,
A pot for receiving a sealing resin for sealing the semiconductor device in the lower mold, a sealing lower mold cavity in which the resin received in the pot is supplied from a gate via a runner portion, A plunger that is mounted on the pot so as to be able to move forward and backward and supplies the resin received in the pot to the lower mold cavity,
In the lower mold cavity portion, a resin receiving portion for receiving the sealing resin is formed at an upper portion of the front end surface in a retracted state, and the sealing resin supplied to the resin receiving portion is compressed by the front end surface in an intruded state. A sealing molding device, characterized in that a molding plunger for compression molding for forming and forming a bottom surface (molding surface) of a lower mold cavity while being movable is provided. The sealing molding apparatus according to claim 1, wherein the gate is located below the molding surface. The sealing molding apparatus according to claim 1, wherein a tip end surface of the molding plunger is configured to protrude further above the molding surface so as to project into the cavity. The sealing molding apparatus according to claim 1, wherein the area of the tip surface is the same as the area of the bottom surface of the lower mold cavity. The sealing molding apparatus according to claim 1, wherein a dummy cavity for receiving surplus resin is provided at a periphery of the lower mold cavity. 2. The sealing molding apparatus according to claim 1, wherein the plunger is capable of controlling the position of the distal end surface thereof by a servomotor. Using the device according to any one of claims 1 to 6,
(A) a resin charging step of charging a sealing resin tablet into a pot with the mold opened;
(B) a mold clamping step in which at least one of the upper mold and the lower mold is raised and lowered to perform mold clamping;
(C) a resin supply step of raising the supply plunger and supplying the resin charged into the pot in a molten state to the resin receiving portion;
(D) a compression molding step in which the tip surface of the molding plunger is raised to the molding surface, and the semiconductor device is sealed and cured with the molten resin received in the resin receiving portion;
(E) A method for producing a sealed molded article, comprising sequentially performing a demolding step of opening a mold and taking out the obtained resin sealed article.

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