JP4885260B2 - Resin sealing device and resin sealing method - Google Patents

Description

  The present invention relates to a resin sealing device and a resin sealing method for sealing an electronic component such as a semiconductor element mounted on a substrate with a resin material.

Conventionally, in a resin sealing device, for example, the lead frame 1 is held by a pair of slide chucks 19b and 19b, carried into the mold 5 and positioned, and then the slide chuck 19b is retracted. After the molding, the pair of slide chucks 31b and 31b are advanced into the mold 5, and the molded product 2 obtained by molding the lead frame 1 is held by the slide chuck 31b and carried out. (See Patent Document 1).
In another resin sealing device, the lead frame supplied from the lead frame supply unit 3 is held by the chuck hand 29, and is placed between the upper mold 13 and the lower mold 14 for positioning, and then the chuck hand 29 Was leaving. After the molding, the chuck hand 39 is advanced again to grip the molded product and carry it out (see Patent Document 2).
Further, in the different resin sealing devices, the lead frame 2 is sucked and held by the sucking portion 33, and is transported and positioned between the upper and lower molds 11 and 12, and is retracted. After the molding, the suction portion 33 is advanced between the upper and lower molds 11 and 12, and the molded product obtained by molding the lead frame 2 is sucked and carried out by the suction portion 33 ( (See Patent Document 3).

JP 62-70012 A Japanese Patent Laid-Open No. 10-286699 JP-A-9-153505

However, in the above-described conventional example, the substrate supplied from the substrate supply apparatus is held by the chuck or the suction unit, and is loaded and positioned between the upper and lower molds. The lower mold was clamped. Further, a chuck or the like is advanced again between the upper and lower molds that are opened after molding, and the molded substrate is carried out. For this reason, none of the conventional resin sealing devices has a long resin molding cycle time, and high production efficiency cannot be obtained.
In particular, among conventional examples, there is a resin sealing device that uses separate chucks or the like for carrying in and positioning of a substrate supplied from a substrate supply device and for taking out and carrying out a molded substrate. For this reason, there are problems that not only the number of parts is large and the apparatus becomes large, but also the control mechanism becomes complicated and maintenance is not easy.
In view of the above-described problems, an object of the present invention is to provide a resin sealing device having high production efficiency, a small and simple structure, and easy maintenance.

In order to solve the above problems, the resin sealing device according to the present invention transports the substrate supplied from the substrate supply device between the upper and lower molds by the substrate transport device, and the upper and lower surfaces of the substrate are A resin sealing device that sandwiches an electronic component mounted on the substrate with a lower mold and seals the resin within a cavity provided in the mold,
Guide grooves capable of slidingly fitting both side edges of the substrate from the side are provided on the inner side surfaces of the opposite sides of the substrate transport device having a frame structure, and the sides of the substrate are provided on the sides provided with the guide grooves. Provide at least one clamp block to hold in pressure contact with the edge,
While holding the clamp block from above and below with the return pins provided in the upper and lower molds when the mold is opened and closed, with both side edges of the substrate being slid and supported in the guide grooves , The front and back surfaces of the substrate are sandwiched between upper and lower molds and sealed with resin.

According to the present invention, after the substrate carried between the upper and lower molds is positioned by the substrate carrying device, it is not necessary to leave the substrate carrying device and to advance again. For this reason, the resin molding cycle is short and the production efficiency is high.
In addition, since the substrate is carried in and the molded product is released from the same substrate transport device, not only the number of components is reduced and the size can be easily reduced, but also the control mechanism is simplified and a resin sealing device that is easy to maintain can be obtained. It is done.

Furthermore, according to the present invention, the side edge portions of the substrate are slidably fitted into the guide grooves of the substrate transport device, so that the positional displacement of the substrate is less likely to occur and the falling off is less likely to occur.

And according to this invention, the edge part of a board | substrate is press-contacted and hold | maintained via the said clamp block, and while the said board | substrate becomes much more difficult to position-shift, it becomes difficult to drop out.

Next, according to the present invention, by adding the holding force of the return pin, it is possible to more effectively prevent the positional deviation of the substrate that may occur before and after molding. In particular, even when the molded product is removed from the upper and lower molds after molding, the edge of the substrate can be firmly held by the pressure of the return pin, so that the substrate may fall off from the substrate transfer device. Absent.

In particular, as an embodiment of the present invention, the clamp pins of the substrate transfer apparatus may be clamped from the top and bottom on the same axis with the return pins provided on the upper and lower molds respectively.
According to the present embodiment, since the return pin sandwiches the substrate transfer device on the same axis, there is no possibility that problems such as twisting and bending occur in the substrate transfer device.

As different embodiments of the present invention, an ejector pin for projecting a molded product from a cavity of a mold, an ejector plate to which the ejector pin is attached, a substrate transfer device that is provided integrally with the ejector plate and is opened and closed when the mold is opened and closed It may be a mold provided with a return pin for sandwiching.
According to the present embodiment, the ejector pin can be moved backward and forward in synchronization with the return pin and the substrate transfer device can be moved up and down without using a complicated drive mechanism and control mechanism, and thus the molded product can be Good mold release from mold cavity.

Further, as another embodiment of the present invention, an ejector pin that protrudes a molded product from a cavity of a mold, an ejector plate to which the ejector pin is attached, a coil spring attached to the ejector plate, and a mold It may be a mold provided with a return pin for holding the substrate transfer device at the time of opening and closing.
According to this embodiment, the ejector pin can be moved backward and forward with a predetermined time difference with respect to the return pin and the substrate transfer device without using a complicated drive mechanism and control mechanism, so that the molded product can be easily removed from the mold cavity. Can be released.

As a new embodiment of the present invention, a temporary placement device for temporarily placing a molded product which is a resin-sealed substrate on the downstream side of the upper and lower molds, and a degaiter for removing unnecessary resin from the molded product The apparatus and the molded product storage device that stacks and stores the molded products from which unnecessary resin is removed may be sequentially arranged in a line.
According to this embodiment, the molded substrate can be easily taken out and carried out at the shortest distance, so that a resin sealing device with a small floor area and high production efficiency can be obtained.

In the resin sealing method according to the present invention, the substrate supplied from the substrate supply device is transferred between the upper and lower molds by the substrate transfer device, and the front and back surfaces of the substrate are sandwiched between the upper and lower molds. A resin sealing method for resin sealing an electronic component mounted on the substrate in a cavity provided in the mold,
Guide grooves capable of slidingly fitting both side edges of the substrate from the side are provided on the inner side surfaces of the opposite sides of the substrate transport device having a frame structure, and the sides of the substrate are provided on the sides provided with the guide grooves. Provide at least one clamp block to hold in pressure contact with the edge,
While holding the clamp block from above and below with the return pins provided in the upper and lower molds when the mold is opened and closed, with both side edges of the substrate being slid and supported in the guide grooves , This comprises a step of sandwiching the front and back surfaces of the substrate with upper and lower molds and sealing with resin.

According to the present invention, after the substrate carried between the upper and lower molds is positioned by the substrate carrying device, it is not necessary to leave the substrate carrying device and to advance again. For this reason, the resin molding cycle is short, and a resin sealing method with high production efficiency is obtained.
In addition, since the substrate is carried in and the molded product is released by the same substrate transport device, not only the number of parts is reduced and the size can be easily reduced, but also the control mechanism is simplified and a resin sealing method that is easy to maintain is obtained. There is an effect that it is.

It is a top view which shows embodiment of the resin sealing apparatus which concerns on this invention. It is the II-II sectional view taken on the line shown in FIG. It is the side view seen from the direction of arrow III shown in FIG. It is the IV-IV sectional view taken on the line shown in FIG. FIG. 5 is a partial enlarged sectional view taken along line VV shown in FIG. 2. FIG. 6 is a partial enlarged cross-sectional view taken along line VV for explaining the manufacturing process subsequent to FIG. 5. FIG. 7 is a partial enlarged cross-sectional view taken along the line VV for explaining the manufacturing process subsequent to FIG. 6. FIG. 8 is a partial enlarged cross-sectional view taken along line VV for explaining the manufacturing process subsequent to FIG. 7. FIG. 10 is a partial enlarged cross-sectional view taken along the line VV for explaining the manufacturing process subsequent to FIG. 8. FIG. 10 is a partial enlarged cross-sectional view taken along the line VV for explaining the manufacturing process following FIG. 9. FIG. 11 is a partial enlarged cross-sectional view taken along the line VV for explaining the manufacturing process subsequent to FIG. 10. FIG. 12 is a partial enlarged cross-sectional view taken along the line VV for explaining the manufacturing process subsequent to FIG. 11. FIG. 13 is a partial enlarged cross-sectional view taken along the line VV for explaining the manufacturing process following FIG. 12. FIG. 14 is a partial enlarged cross-sectional view taken along the line VV for explaining the manufacturing process subsequent to FIG. 13. FIG. 15 is a partial enlarged cross-sectional view taken along the line VV for explaining the manufacturing process subsequent to FIG. 14. FIG. 16 is a partial enlarged cross-sectional view taken along line VV for explaining the manufacturing process following FIG. 15. FIG. 17 is a partial enlarged cross-sectional view taken along line VV for explaining the manufacturing process following FIG. 16. FIG. 18 is a partial enlarged cross-sectional view taken along the line VV for explaining the manufacturing process subsequent to FIG. 17. It is the elements on larger scale of the VV line | wire partial expanded sectional view shown in FIG. It is a principal part disassembled perspective view of the resin sealing apparatus which concerns on this invention. It is the principal part partial side view which looked at the resin sealing apparatus which concerns on this invention from the side. It is the perspective view which looked at the board | substrate sealed with the resin sealing apparatus which concerns on this invention from the back surface. It is the perspective view which looked at the board | substrate sealed with the resin sealing apparatus which concerns on this invention from the surface.

In the resin sealing device according to the present invention, as shown in FIG. 1, a substrate supply device 80 and a resin material supply device 120 are arranged in parallel on the upstream side of the mold device 20 disposed in the center of the main base 10. On the other hand, on the downstream side, the molded product temporary placing device 140, the degate device 150, and the molded product storage device 160 are arranged in one row.
A substrate transfer device 100 is disposed between the substrate supply device 80 and the mold device 20 so as to be reciprocally movable. Further, a resin material transfer device 130 is disposed between the resin material supply device 120 and the mold device 20 so as to be reciprocally movable.
A second guide unit 170 is arranged in parallel along the molded product temporary placement device 140 and the molded product storage device 160. The second guide unit 170 pulls out a molded product 96 obtained by resin-sealing the substrate 90 from the substrate transport device 100, and sequentially supplies the molded product temporary storage device 140, the degate device 150, and the molded product storage device 160 to each other. Transport.

  As shown in FIG. 3, the mold apparatus 20 has an upper mold base 22 bridged between upper ends of a pair of side bases 21 and 21 erected at the center of the upper surface of the main base 10. An upper mold chess 30 is installed on the lower surface of the upper mold die set 23 suspended from the center of the upper mold base 22. The upper die set 23 and the upper die chess 30 are supported by a drive motor 24 so as to be reciprocally movable up and down.

As shown in FIG. 5, the upper mold chess 30 includes first and second upper mold ejector plates 32 between side plates 31 and 31 provided on both side edges of the lower surface of the upper mold die set 23. 33 and the upper mold cavity plate 40 are sequentially arranged. In particular, the first and second upper mold ejector plates 32 and 33 are integrated and always move up and down integrally. A plurality of upper mold cavities 41 are formed on the lower surface of the upper mold cavity plate 40.
A first coil spring 34 is disposed between the upper mold die set 23 and the first upper mold ejector plate 32. On the other hand, the upper mold support pin 35 fixed to the upper surface of the upper mold cavity plate 40 is inserted into the first and second upper mold ejector plates 32 and 33 at the upper end thereof, and the upper mold die set 23 It extends to the vicinity of the lower surface. The upper mold support pin 35 has a cylindrical shape that receives a mold clamping pressure and prevents bending, and is arranged around the upper mold cavity 41 in a well-balanced manner.
Further, a second coil spring 36 is disposed between the first and second upper mold ejector plates 32 and 33 to urge the upper mold return pin 37 downward. For this reason, when the upper mold return pin 37 is pushed in, the second coil spring 36 is compressed, the upper mold return pin 37 is raised, and the upper surface of the upper mold return pin 37 and the lower surface of the first ejector plate 32 are moved. After the contact, the first upper mold ejector plate 32 is pushed up. As a result, the first and second ejector plates 32 and 33 are pushed up integrally, and the upper die ejector pin 38 is pulled up.

  In the state shown in FIG. 5, the upper mold cavity plate 40 is placed on the upper surface of the upper mold cavity plate 40 so as to maintain a certain distance between the upper surface of the upper mold cavity plate 40 and the lower surface of the second upper mold ejector plate 33. Is provided with a stopper (not shown). Further, a drop-off preventing structure (not shown) is provided between the joint surfaces of the side plate 31 and the upper mold chess 30.

  As shown in FIG. 2, the mold apparatus 20 includes a lower mold base 25 and a lower mold die set 26 so as to be positioned below the upper mold chess 30 on the upper surface of the main base 10. And the lower mold chess 50 are sequentially stacked. As shown in FIG. 5, the lower mold chess 50 includes first and second lower mold ejector plates 52 between side plates 51, 51 provided on both side edges of the upper surface of the lower mold die set 26. 53 and the lower mold cavity plate 60 are sequentially arranged. In the lower mold cavity plate 60, as shown in FIG. 20, a pair of adjacent lower mold cavities 61, 61 formed on the upper surface thereof communicate with each other via a runner 62 to a pot 63 (FIG. 5). Yes. Further, the lower mold cavity plate 60 has a pair of resin material charging blocks 66 and 66 assembled to its side surface (FIG. 20). The resin material input block 66 includes a slit-shaped resin material supply groove 64 and a resin material input port 65 communicating with the pot 63.

  Further, as shown in FIG. 5, a third coil spring 54 is disposed between the lower mold die set 26 and the first lower mold ejector plate 52. The lower mold support pin 55 fixed to the lower surface of the lower mold cavity plate 60 is inserted at the lower end thereof into the first and second lower mold ejector plates 52 and 53, and the lower mold die set 26. It is in contact with the upper surface of. The lower mold support pin 55 has a cylindrical shape that receives a clamping pressure and prevents bending, and is disposed in a balanced manner around the lower mold cavity 61. Further, a lower mold ejector pin 58 and a lower mold return pin 57 are attached to the lower mold second ejector plate 53. For this reason, when the lower mold return pin 57 is pushed down, the third coil spring 54 is compressed and the lower mold ejector pin 58 is integrally lowered.

  As shown in FIG. 2, the plunger blade 73 is moved up and down via the rod 72 by driving the plunger driving device 70 arranged below the main base 10 to move the plunger block 71 up and down. As shown in FIG. 5, the plunger blade 73 compresses and melts a later-described plate-shaped resin material 121 supplied into the pot 63, and also melts the molten resin material via the runner 62. And the upper mold cavity 41 is filled.

  The first, second, and third coil springs 34, 36, and 54 have the smallest spring force of the second coil spring 36 and the largest spring force of the third coil spring 54. The spring force of the third coil spring 54 is set to be larger than the total spring force of the first and second coil springs 34 and 36.

  As shown in FIG. 1 and FIG. 2, the substrate supply device 80 is configured to mount a substrate magazine 81 in which a plurality of substrates 90 (see FIGS. 22 and 23) are stacked and stored at predetermined intervals in the vertical direction. It is detachably mounted on the mounting table 82. Further, the substrate supply device 80 includes a first pusher 83 for pushing out the substrates 90 from the substrate magazine 81 side by side. Each time the first pusher 83 pushes the substrates 90 from the substrate magazine 81 one by one, the mounting table 82 is raised by the thickness of one substrate 90 to adjust the height.

  As shown in FIGS. 22 and 23, the substrate 90 has four sets of electronic components 91 combined in a set of four on the same straight line on the front and back surfaces of a strip-shaped lead frame. The resin filling slits 92 are formed so as to partition the combined electronic components 91, and positioning holes 93 are provided at both side edges of the lead frame.

  As shown in FIG. 1, the substrate transport apparatus 100 has a frame structure having a planar shape on which a substrate 90 pushed out from a substrate magazine 81 can be placed. Further, as shown in FIG. 20, the substrate transfer apparatus 100 has a pair of guide grooves 101, 101 provided on the inner surfaces of the long sides facing each other in order to restrict the floating of the substrate 90. Is configured to slide fit. Furthermore, the substrate transport apparatus 100 is provided with a clamp block 102 for preventing the substrate 90 from dropping off at the opposing long sides. As shown in FIG. 19, the clamp block 102 is rotatably supported via a rotating shaft 103 and is biased via a biasing coil spring 104. For this reason, the clamp claw 105 of the clamp block 102 can be pressed against one side edge of the substrate 90. The upper mold return pin 37 presses the tip of the clamp claw 105, so that the substrate 90 can be held more firmly. Further, the substrate transfer apparatus 100 has a central portion that is open at the top and bottom, and is formed so as to fit in the central portion of the upper surface of the lower mold cavity plate 60, while the central portion of the upper surface of the opposing short side. Each of the relief portions 106 (FIG. 20) is formed by cutting out.

Accordingly, the substrate 90 pushed out from the substrate magazine 81 is held at the tip by the first clamper 111 of the first guide unit 110 and pulled out by driving of a driving device (not shown), and both side edges thereof are conveyed to the substrate. The pair of guide grooves 101 and 101 of the apparatus 100 are respectively fitted. At that time, the substrate 90 slides while pushing up the clamp claws 105 of the clamp block 102 at both side edges thereof, so that both side edges are pressed by the clamp claws 105 and are prevented from coming off. The substrate transfer apparatus 100 is supported so as to be reciprocally movable and vertically movable through a pair of arm portions 107 and 107 (FIGS. 20 and 21).
That is, the arm portion 107 is supported so as to be slidable along the guide rail 108, and the guide rail 108 is supported by a plurality of support pins 109a so as to be reciprocally movable up and down. Therefore, the arm portion 107 can be slid in the horizontal direction by a driving device (not shown), and the guide rail 108 can be reciprocated up and down by the driving device 109b.

  As shown in FIGS. 1 and 3, the resin material supply device 120 includes a resin material magazine 122 in which a plurality of plate-shaped resin materials 121 are arranged and stored, and one sheet-shaped resin material 121 from the resin material magazine 122. And a second pusher 123 that pushes out side by side. And the resin material conveyance apparatus 130 is arrange | positioned between the said resin material supply apparatus 120 and the said mold apparatus 20 so that a reciprocation is possible.

  As shown in FIG. 1, the resin material transport device 130 includes a holder 132 having a pair of slits 131 that can hold the extruded plate-like resin material 121, and a resin provided with the holder 132 in a resin material input block 66. And an XY table 133 that conveys to above the material input port 65.

On the other hand, the molded product temporary placing device 140 is a device in which a pair of guide rails 141 and 141 are arranged side by side. For this reason, one end portion of the molded product 96 sealed with resin by the mold apparatus 20 is held by a second clamper 171 of a second guide unit 170 described later, pulled out from the substrate transfer apparatus 100, and then the molded article. An article 96 can be temporarily placed between the guide rails 141 and 141.
As will be described later, the second clamper 171 is supported so as to reciprocate along a pair of parallel guide rails 172 and 172.

  As shown in FIG. 4, the degate device 150 hangs a fixed bar 152 over the upper ends of a pair of support columns 151 and 151 erected on the main base 10 and moves a movable bar 153 up and down on the pair of support columns 151 and 151. Is slidably slidable. A driving device 154 is installed on the fixed bar 152, while a punch unit 156 having a punch 155 is provided on the movable bar 153. A receiving die 157 having a guide post 157a and a positioning pin 157b (FIG. 2) is disposed immediately below the punch unit 156. The receiving die 157 is supported by a pair of drive pistons 158 and 158 so as to be vertically movable. A chute 159 is disposed between the drive pistons 158 and 158.

  As shown in FIGS. 1 and 2, the molded product storage device 160 is disposed on the downstream side of the degate device 150, and the movable plate 163 is disposed in the molded product magazine 162 mounted on the mounting table 161 so as to be movable up and down. It is. A pair of output rails 164 are disposed on both sides of the upper opening of the molded product magazine 162. The output rail 164 has a substantially L-shaped cross section and can be opened and closed by a driving device 165. For this reason, a second clamper 171 described later grips one end of the molded product 96 and positions it between the output rails 164 and 164. Next, after the second clamper 171 is opened and retracted, the output rail 164 is opened outward by the driving device 165, whereby the molded products 96 are stacked one by one on the movable plate 163. Each time one molded product 96 is stacked, the movable plate 163 is lowered by the thickness dimension of the molded product 96 to adjust the height.

  As shown in FIG. 1, the second guide unit 170 is configured such that a second clamper 171 is reciprocally moved by a driving device 173 along two parallel guide rails 172 and 172. As shown in FIG. 2, the second clamper 171 is composed of a pair of upper and lower claws capable of gripping one end of the molded product 96, and performs an operation of pulling the molded product 96 to a predetermined position.

  The resin sealing device according to the present invention includes a cleaner device 180 as shown in FIGS. The cleaner device 180 has a pair of rotary brushes 182 and 182 that can be moved in the vertical direction by a driving device (not shown) on the front side of the upper and lower surfaces of the device main body 181 and a duct 183 connected to the rear side thereof. It is. The cleaner device 180 is opened and advanced between the lower mold chess 30 and 50 to suck and remove the resin waste and the like by the duct 183 while scraping out the resin waste and the like by the rotating brush 182.

Next, the operation of the resin sealing device according to the present invention will be described.
First, as shown in FIGS. 1 and 2, the substrate 90 housed in the substrate magazine 81 of the substrate supply device 80 is pushed out by the first pusher 83, and one end of the pushed-out substrate 90 is moved to the first guide unit 110. Grip it with the first clamper 111 and pull it out. Then, both side edges of the substrate 90 are fitted along the guide grooves 101 (FIG. 20) of the substrate transport apparatus 100, and are slid against a biasing force of the clamp claws 105 of the clamp block 102 to be in a predetermined position. Pull in. For this reason, since the substrate 90 is pressed by the clamp claws 105, there is no position shift due to vibration or the like during conveyance.

Then, the substrate transport device 100 is slid along the guide rail 108 (FIG. 21), so that the substrate 90 held by the substrate transport device 100 is transported and positioned above the lower mold cavity plate 60. (FIG. 6). Next, by driving the driving device 109b (FIG. 21) to lower the guide rail 108, the substrate transfer device 100 is lowered and placed on the lower die return pin 57 of the lower die chess 50 (see FIG. 21). FIG. 7). At this time, out of a set of four electronic components 91 arranged on the front and back surfaces of the substrate 90, a total of 16 electronic components 91 arranged on the first and third sets on the front and back surfaces are sealed with resin. This is possible (FIG. 1).
The substrate transfer device 100 is in a no-load state in which the drive device 109b is not involved until the resin sealing is completed after the substrate 90 is positioned at a predetermined position, and the upper metal plate The operation of the mold return pin 37 and the lower mold return pin 57 is left to the operation.

  On the other hand, as shown in FIGS. 1 and 3, the resin material supply device 120 pushes the plate-shaped resin material 121 stored in the resin material magazine 122 with the second pusher 123 and pushes it into the slit 131 of the holder 132. Then, the holder 132 is conveyed through the XY table 133, and the holder 132 is positioned immediately above the resin material inlet 65 of the resin material input block 66 as shown in FIG.

Next, as shown in FIG. 9, when the upper mold chess 30 is lowered, the positioning pins 42 are inserted into the positioning holes 93 of the substrate 90. Then, the upper mold return pin 37 is in pressure contact with the substrate transfer apparatus 100, and the lower mold return pin 57 is held between the upper mold return pin 37 and the lower mold return pin 57 while holding the substrate transfer apparatus 100. Pushed down. For this reason, after the 2nd coil spring 36 with the smallest spring force is compressed, the 1st coil spring 34 is compressed. As a result, the first and second upper mold ejector plates 32 and 33 are relatively pushed up, the upper mold ejector pin 38 is raised, and the lower end of the upper mold ejector pin 38 protrudes slightly from the bottom surface of the upper mold cavity 41. Move (FIG. 10). Further, when the upper mold chess 30 is lowered, the lower mold return pin 57 is pushed down and the third coil spring 54 is compressed, so that the first and second lower mold ejector plates 52 and 53 are lowered, The lower die ejector pin 58 is lowered, and the upper end of the lower die ejector pin 58 moves to a position slightly protruding from the bottom surface of the lower die cavity 61 (FIG. 11).
Since the upper mold return pin 37 presses the clamp block 102 of the substrate transport apparatus 100, the substrate 90 is held more firmly.

Then, as shown in FIG. 12, the shutter 134 arranged on the bottom surface of the holder 132 is pulled out, and the plate-shaped resin material 121 is pushed out from the slit 131 by the third pusher 135, and the resin material supply groove 64 is inserted into the resin material supply groove 64. In And after pushing the plate-shaped resin material 121 into the pot 63 with the 4th pusher 67 (FIG. 12), the 4th pusher is set so that the front end surface of the said 4th pusher 67 and the inner surface of the pot 63 may become flush. Pull 67 back a little. Further, the plunger driving device 70 is driven to push up the plunger blade 73, and the plate-like resin material 121 in the pot 63 is heated and pressurized to melt. The molten resin material is filled into the lower mold cavity 61 through the runner 62 and filled into the upper mold cavity 41 through the gaps (not shown) between the leads of the lead frame 90, whereby the electronic component 91 is filled. Is sealed with resin (FIG. 13).
Instead of pulling back the fourth pusher 67 as described above, a stopper is provided between the fourth pusher 67 and the resin material charging block 66 so that the tip surface of the fourth pusher 67 and the inner surface of the pot 63 are connected. You may set so that it may become flush.

The resin material transport device 132 is returned to the original position, and after a predetermined clamping time has elapsed, the plunger blade 73 is lowered, and the tip (upper end) of the plunger blade 73 and the unnecessary resin 95 located in the pot 63 Eliminate sticking. Then, the plunger blade 73 is raised again, the unnecessary resin 95 located in the pot 63 is protruded, and the upper mold chess 30 is raised. At this time, the first and second lower mold ejector plates 52 and 53 are biased upward by the spring force of the third coil spring 54. Therefore, the lower mold ejector pin 58 is pushed into the lower mold cavity 61 while maintaining the state in which the substrate transfer apparatus 100 is sandwiched between the upper mold return pin 37 and the lower mold return pin 57, and the lower mold The molding part 94 is protruded from the cavity 61 (FIG. 14).
That is, the upper mold return pin 37 and the lower mold return pin 57 are synchronized with each other to push the lower mold ejector pin 58 into the lower mold cavity 61 and raise the substrate transfer apparatus 100. As a result, the molded part 94 and the substrate 90 rise synchronously, so that the molded product can be favorably released without damaging the molded product.

  In the present embodiment, the upper mold return pin 37 and the lower mold return pin 57 sandwich the substrate transport apparatus 100, and in particular, the upper mold return pin 37 presses the clamp block 102. For this reason, the substrate 90 does not fall out of the guide groove 101 of the substrate transport apparatus 100 when the molding portion 94 protrudes from the upper mold cavity 41 and the lower mold cavity 61.

  Next, as shown in FIG. 15, when the upper mold chess 30 is raised, the first and second upper mold ejector plates 32 and 33 urged by the spring force of the first coil spring 34 are relatively lowered. . Therefore, the upper mold ejector pin 38 is pushed into the upper mold cavity 41 while maintaining the state in which the substrate transfer apparatus 100 is sandwiched between the upper mold return pin 37 and the lower mold return pin 57, and the upper mold The molding part 94 is protruded from the cavity 41.

  In the present embodiment, the upper mold ejector pin 38 is pushed into the upper mold cavity 41 while maintaining the state in which the upper mold return pin 37 and the lower mold return pin 57 sandwich the substrate transfer apparatus 100. That is, the upper mold return pin 37 and the lower mold return pin 57 are synchronized to push the upper mold ejector pin 38 into the upper mold cavity 41. Therefore, the upper mold ejector pin 38 is pushed out into the upper mold cavity 41 as the upper mold chess 30 are raised, and the substrate transfer apparatus 100 is separated from the upper mold chess 30. For this reason, the molding part 94 and the substrate 90 can be released from the upper mold chess 30 in synchronization with each other, and can be released satisfactorily without damaging the molded product 94.

  In the present embodiment, the upper mold return pin 37 and the lower mold return pin 57 sandwich the substrate transport apparatus 100, and in particular, the upper mold return pin 37 presses the clamp block 102. For this reason, the substrate 90 does not fall out of the guide groove 101 of the substrate transport apparatus 100 when the molding portion 94 protrudes from the lower mold cavity 61 and the upper mold cavity 41.

  Since the upper mold return pin 37 is urged downward by the spring force of the second coil spring 36, when the upper mold chess 30 is further raised, the upper mold return pin 37 and the lower mold return pin 57 Thus, the upper mold ejector pin 38 is raised while maintaining the state where the substrate transfer apparatus 100 is sandwiched. As a result, the upper mold ejector pin 38 is raised while the substrate 90 is held by the substrate transfer apparatus 100, and the sticking between the tip of the upper mold ejector pin 38 and the molding portion 94 is eliminated. Further, when the upper mold chess 30 is lifted, as shown in FIG. 16, the upper mold return pin 37 is released from the substrate transfer device 100, and then the positioning pin 42 is pulled out from the positioning hole 93 of the lead frame 90. The substrate transfer apparatus 100 is supported only by the lower mold return pin 57.

  In the present embodiment, the upper mold ejector pin 38 is raised while maintaining the state where the upper mold return pin 37 and the lower mold return pin 57 sandwich the substrate transfer apparatus 100. That is, the upper mold return pin 37, the lower mold return pin 57, and the substrate transport apparatus 100 can be raised by a predetermined time difference. For this reason, it is possible to release the molded article 94 without damaging the molded product 94 without separately using a complicated drive device or control mechanism.

  Next, the guide rail 108 to which the arm portion 107 (FIGS. 20 and 21) of the substrate transport apparatus 100 is attached is driven and lifted by the driving device 109b. Thereby, as shown in FIG. 17, the substrate 90 is lifted, and the sticking between the tip of the lower die ejector pin 58 and the molding portion 94 can be eliminated. Then, by retracting the arm portion 107 via the guide rail 108, the substrate transfer apparatus 100 is retracted from between the lower mold cavity plate 60 and the upper mold cavity plate 40. Furthermore, as shown in FIG. 18, the cleaner device 180 is advanced between the upper mold chess 30 and the lower mold chess 50 and moved back and forth while rotating the rotary brush 182, so that scraped resin scraps and the like are removed. Suction and removal by duct 183.

  On the other hand, after the substrate transfer apparatus 100 is withdrawn from between the lower mold cavity plate 60 and the upper mold cavity plate 40, the front end portion of the substrate 90 is held by the first clamper 111 of the first guide unit 110. Then, among the electronic components 91 arranged on the substrate 90, the electronic components 91 arranged in the second set and the fourth set are advanced by one pitch so as to be resin-sealed. Then, the substrate transfer apparatus 100 is advanced again between the upper mold chess 30 and the lower mold chess 50 and positioned in the same manner as in FIG. Thereafter, the operations shown in FIGS. 6 to 17 are repeated to seal all the electronic components 91 provided on the substrate 90 with resin.

In the present embodiment, the electronic component 91 of the substrate 90 is resin-sealed by shifting the substrate 90 by one pitch. For this reason, the floor area of the upper and lower mold cavity plates 40 and 60 can be reduced, and the mold apparatus 20 can be miniaturized, so that the entire resin sealing apparatus can be miniaturized.
Furthermore, since the first clamper 111 drawn out from the substrate magazine 81 into the substrate transport apparatus 100 is also used as a positioning means for performing the second resin sealing, there is no need to separately provide a substrate pitch feeding device, There is an advantage that the size can be further reduced.

  After all of the electronic components 91 mounted on the substrate 90 are sealed with resin and the upper mold chess 30 and the lower mold chess 50 are opened, as shown in FIG. One end of 96 is held and pulled out by the second clamper 171 of the second guide unit 170 and placed on the molded product temporary placement device 140. Then, the substrate transfer device 100 is returned to the original position next to the substrate supply device 80.

  As shown in FIG. 4, when the molded product 96 placed on the temporary placement device 140 is positioned by being pulled out by being gripped by the second clamper 171, the drive piston 158 is lifted and received. The positioning pins 157 b (FIG. 2) of the die 157 are fitted into the positioning holes 93 of the molded product 96 and positioned. Then, the driving device 154 of the digger device 150 lowers the movable bar 153, and a guide hole (not shown) provided in the punch unit 156 is fitted into the guide post 157a. Then, when the punch 155 punches out the unnecessary resin 95, the unnecessary resin 95 falls onto the chute 159. Thereafter, by repeating the same operation, all of the unnecessary resin 95 of the molded product 96 shown in FIGS. 22 and 23 is removed. The unnecessary resin 95 is not limited to being removed one by one, but may be removed in one step.

  As shown in FIGS. 1 and 2, after the second clamper 171 transfers the molded product 96 to a pair of output rails 164, the second clamper 171 moves away from the molded product 96. Next, when the drive device 165 is driven to open the output rail 164, the molded product 96 falls on the movable plate 163 and is stacked. Thereafter, the same operation is repeated until the molded product magazine 162 is full. When the molded product magazine 162 becomes full, the molded product magazine 162 is replaced with an empty molded product magazine 162, and the resin sealing operation is continued.

  Of course, the resin sealing device according to the present invention can be applied not only to the above-mentioned substrate but also to other substrates. For example, a substrate on which electronic components are mounted only on one side may be resin-sealed.

10: Main base 20: Mold device 30: Upper mold chess 32, 33: First and second upper mold ejector plates 34: First coil spring 35: Upper mold support pin 36: Second coil spring 37: Upper mold Mold return pin 38: Upper mold ejector pin 40: Upper mold cavity plate 41: Upper mold cavity 50: Lower mold chess 52, 53: First and second lower mold ejector plates 54: Third coil spring 55: Lower Mold support pin 57: Lower mold return pin 58: Lower mold ejector pin 60: Lower mold cavity plate 61: Lower mold cavity 62: Runner 63: Pot 70: Plunger drive device 71: Plunger block 72: Rod 73: Plunger blade 80: Substrate supply device 90: Substrate 91: Electronic component 92: Slit for filling resin 9 : Positioning hole 100: Substrate transport device 101: Guide groove 102: Clamp block 103: Rotating shaft 104: Biasing coil spring 105: Clamp claw 107: Arm part 108: Guide rail 109 a: Support pin 109 b: Drive device 110: 1st guide unit 111: 1st clamper 120: Resin material supply apparatus 121: Plate-shaped resin material 122: Resin material magazine 123: 2nd pusher 130: Resin material conveyance apparatus 131: Slit 132: Holder 140: Temporary placement apparatus 141: Guide rail 150: Digger device 155: Punch 156: Punch unit 157a: Guide post 157b: Positioning pin 160: Molded product storage device 162: Molded product magazine 164: Output rail 170: Second guide unit 171 The second clamper 172: guide unit 180: a cleaning unit 182: rotating brush 183: Duct

Claims (6)

The substrate supplied from the substrate supply device is transferred between the upper and lower molds by the substrate transfer device, the front and back surfaces of the substrate are sandwiched between the upper and lower molds, and the electronic component mounted on the substrate is A resin sealing device for resin sealing in a cavity provided in a mold,
Guide grooves capable of slidingly fitting both side edges of the substrate from the side are provided on the inner side surfaces of the opposite sides of the substrate transport device having a frame structure, and the sides of the substrate are provided on the sides provided with the guide grooves. Provide at least one clamp block to hold in pressure contact with the edge,
While holding the clamp block from above and below with the return pins provided in the upper and lower molds when the mold is opened and closed, with both side edges of the substrate being slid and supported in the guide grooves , A resin sealing device, wherein the front and back surfaces of the substrate are sandwiched between upper and lower molds and sealed with resin. The resin sealing device according to claim 1 , wherein the return pin clamps the clamp block of the substrate transfer device from above and below on the same axis. An ejector pin that protrudes the molded product from the cavity of the mold,
An ejector plate to which the ejector pins are attached;
3. The resin sealing device according to claim 1 , further comprising: a die provided integrally with the ejector plate and having a return pin that sandwiches the substrate transfer device when the die is opened and closed. An ejector pin that projects a molded product from a cavity of a mold, an ejector plate to which the ejector pin is attached, and a return pin that is attached to the ejector plate via a coil spring and sandwiches the substrate transfer device when the mold is opened and closed. The resin sealing device according to claim 1, further comprising a mold provided. Temporary placement device for temporarily placing a molded product, which is a resin-sealed substrate, on the downstream side of the upper and lower molds, a degaiter device for removing unnecessary resin from the molded product, and a molded product from which unnecessary resin has been removed 5. The resin sealing device according to claim 1 , wherein the molded product storage devices that stack and store the components are sequentially arranged in a line. The substrate supplied from the substrate supply device is transferred between the upper and lower molds by the substrate transfer device, the front and back surfaces of the substrate are sandwiched between the upper and lower molds, and the electronic component mounted on the substrate is A resin sealing method for resin sealing in a cavity provided in a mold,
Guide grooves capable of slidingly fitting both side edges of the substrate from the side are provided on the inner side surfaces of the opposite sides of the substrate transport device having a frame structure, and the sides of the substrate are provided on the sides provided with the guide grooves. Provide at least one clamp block to hold in pressure contact with the edge,
While holding the clamp block from above and below with the return pins provided in the upper and lower molds when the mold is opened and closed, with both side edges of the substrate being slid and supported in the guide grooves , A resin sealing method, wherein the front and back surfaces of the substrate are sandwiched between upper and lower molds and sealed with resin.

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