TW202209512A - Resin molding apparatus and resin molded product manufacturing method - Google Patents

Abstract

The resin molding apparatus and resin molded product manufacturing method of the invention allows stable recovery of unnecessary resin and simplifies the structure of a transfer mechanism. The invention includes: an upper mold, formed with a cavity; a lower mold, facing the upper mold and carrying a molding object; a mold clamping mechanism, clamping the upper mold and the lower mold; a pot block, disposed at the lower mold and formed with a plurality of pots accommodating resin material, and including a protrusion portion protruding from the mold surface of the lower mold; and a transfer mechanism, including a plurality of plungers disposed inside each of the plurality of pots and moving the plurality of plungers to inject the resin material from the plurality of pots into the cavity, wherein the upper mold or the pot block is formed with a connecting portion for connecting remaining unnecessary resin corresponding to each of the plurality of pots, and the transfer mechanism moves the plurality of plungers by the same amount of movement.

Description

Resin molding apparatus and method for producing resin molded product

The present invention relates to a resin molding apparatus and a method for producing a resin molded product.

Conventionally, for example, as shown in Patent Document 1, it is considered that the upper mold and the lower mold are clamped, and a gate block provided in the lower mold presses a part of the substrate to the lower mold, and the upper mold is removed from the upper surface of the gate block. The space formed between the upper mold and the lower surface of the upper mold injects molten resin into the cavity portion of the upper mold for resin sealing.

In the resin sealing device, a spring for moving the sprue block up and down is provided on the lower side of the sprue block, and it is in a compressed state when the mold is clamped. In addition, when the upper mold and the lower mold are opened, the spring is restored from the compressed state, and the gate block is relatively pushed up with respect to the upper surface (die surface) of the lower mold, and the action on the gate block is not required. The resin flow channel is separated from the substrate. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2000-311908

[Problems to be Solved by Invention] However, in the resin molding apparatus described above, since a plurality of unnecessary resin runners are formed corresponding to the plurality of grooves, a plurality of unnecessary resins remain in the gate block after resin molding. Therefore, it is necessary to collect these multiple unnecessary resins one by one, and as the number of unnecessary resins on the gate block increases, there is a fear that the stability of the collection of the unnecessary resins will be deteriorated.

In addition, the resin passages including the reject pool, the runner, and the gate are formed independently for each groove. In order to make the injection pressure of the resin injected from each groove to the cavity part uniform, a support column must be provided. The support block of the plug is provided with an isobaric mechanism using an elastic member or the like.

Therefore, this invention is made in order to solve the said problem, and the main problem is that unnecessary resin can be collected stably, and the structure of a transmission mechanism can be made simple. [Technical means to solve the problem]

That is, the resin molding apparatus of the present invention includes: a first mold in which a cavity is formed; a second mold facing the first mold and placing an object to be molded; and a mold clamping mechanism for aligning the first mold with the The second mold is closed, and the groove block is arranged on the second mold, and is formed with a plurality of grooves for accommodating the resin material, and includes a protruding part protruding from the mold surface of the second mold; and a transmission mechanism , which includes a plurality of plungers provided in the respective interiors of the plurality of grooves, and moves the plurality of plungers to inject the resin material from the plurality of grooves into the mold cavity, in the first The die or the groove block is formed with a connecting portion for connecting unnecessary resin remaining corresponding to the plurality of grooves, and the transmission mechanism moves the plurality of plungers by the same amount of movement.

Furthermore, the manufacturing method of the resin molding of this invention is the manufacturing method of the resin molding using the said resin molding apparatus. [Effect of invention]

According to the present invention thus constituted, unnecessary resin can be stably recovered and the structure of the transfer mechanism can be simplified.

Next, the present invention will be described in more detail by way of examples. However, the present invention is not limited by the following description.

As described above, the resin molding apparatus of the present invention includes: a first mold having a cavity formed therein; a second mold facing the first mold and placing an object to be molded; and a mold clamping mechanism for placing the first mold Clamping with the second mold, a groove block, disposed on the second mold, formed with a plurality of grooves for accommodating the resin material, and including a protruding portion protruding from the mold surface of the second mold; and a transmission mechanism including a plurality of plungers provided inside each of the plurality of grooves, the plurality of plungers are moved to inject the resin material from the plurality of grooves into the cavity, and the The first mold or the groove block is formed with a connecting portion for connecting unnecessary resin remaining corresponding to the plurality of grooves, and the transmission mechanism moves the plurality of plungers by the same amount of movement. In the case of the resin molding apparatus, the unnecessary resin remaining corresponding to the plurality of grooves can be connected by the connecting portion, so that the unnecessary resin on the groove block can be integrated after resin molding. Therefore, not only the unnecessary resin can be stably recovered, but also the structure of the conveying mechanism used to recover the unnecessary resin is simple. In addition, since the plurality of grooves are communicated through the connecting portion, even if the transmission mechanism moves the plurality of plungers by the same amount of movement, the resin material injected from the respective grooves reciprocates in the connecting portion, so that the resin material can be injected. Homogenization of the pressure, so there is no need for the transmission mechanism to include an isobaric mechanism. Thereby, the structure of the transmission mechanism can be simplified.

As a specific embodiment for connecting unnecessary resins, it is considered that the first mold or the groove block includes a plurality of reject pool portions formed corresponding to the plurality of grooves, and the connecting portion is formed by connecting The said reject pool part adjacent to each other is connected, and the said unnecessary resin is connected.

Here, in order to simplify the structure of the first mold, it is desirable that the plurality of reject pool portions and the connecting portion are formed in the groove block. In addition, in the above configuration, the contact area between the groove block and the unnecessary resin is larger than the contact area between the first mold and the unnecessary resin, and the unnecessary resin is not peeled from the groove block but from the first mold. As a result, ejector pins for contacting and stripping unwanted resin from the first mold may not be required.

After the unnecessary resin is collected from the tank block, it is stored in a waste box. Here, when a plurality of unnecessary resins are all connected together, the dead space in the waste box increases, and the storage space becomes larger than the actual volume of the unnecessary resins. Therefore, it is desirable for the said connection part to divide the said some unnecessary resin into a some group, and to connect it.

As a specific embodiment of the transmission mechanism, a configuration that does not include an isobaric mechanism for making the injection pressure of the resin material uniform, and includes: a fixing block for fixing the plurality of plungers; and a plunger driving unit , the plurality of plungers are moved together by moving the fixing block.

The resin molding apparatus of the present invention is considered to further include a conveying mechanism for carrying out unnecessary resin on the tank block after resin molding, and the conveying mechanism includes an unnecessary resin for adsorbing the unnecessary resin. adsorption part. In the above structure, in the present invention, a plurality of unnecessary resins are connected into one block by the connecting portion, thereby reducing the number of unnecessary resins, so that the number of unnecessary resin adsorption portions can be reduced, thereby reducing the number of unnecessary resins. The structure of the conveying mechanism can be simplified.

When the unnecessary resin is adsorbed and recovered, the unnecessary resin may be in close contact with the reject tank block and it is difficult to leave, and the unnecessary resin may not be recovered. In addition, when the unnecessary resin is pulled away from the reject pool block, the pressure in the tank becomes negative pressure, so there is a problem that the unnecessary resin is difficult to leave from the reject pool block. In addition to this, there is also a problem that the unnecessary resin is difficult to leave from the pick pool block due to the friction between the unnecessary resin and the upper surface of the pick pool block. In order to appropriately solve the above-mentioned problem, it is desirable that the transfer mechanism causes the plunger to move toward the undesired resin after the transfer mechanism has brought the unnecessary resin adsorption portion into contact with the unnecessary resin on the groove block. The first mold moves to peel off the unnecessary resin from the tank block, and thereafter, the conveying mechanism adsorbs the unnecessary resin by the unnecessary resin adsorption part and removes the unnecessary resin. resin is removed. With this structure, unnecessary resin on the tank block can be stably recovered. Specifically, before the unnecessary resin is adsorbed by the adsorption part for unnecessary resin, the unnecessary resin is peeled off from the tank block by the plunger, so that the unnecessary resin adsorption part for the adsorption part can be reliably recovered from the tank block. of unwanted resins. In addition, when the unnecessary resin is peeled off from the tank block by the plunger, the adsorption part for the unnecessary resin contacts the unnecessary resin, so that it is possible to prevent poor adsorption due to the inclination of the unnecessary resin on the tank block, etc. . According to the above, unnecessary resin on the tank block can be stably recovered.

Even when the plunger is moved to the first mold and the unnecessary resin is peeled off from the groove block, when the plunger and the unnecessary resin are closely joined, the subsequent Recycling of unwanted resins can also create undesirable conditions. In order to solve the above-mentioned problem, it is desirable that the transmission mechanism causes the plunger to move toward the first mold to peel off the unnecessary resin from the groove block. The opposite side of the first die moves to strip the unwanted resin from the plunger. With this structure, since the plunger and the unnecessary resin are peeled off in advance, the unnecessary resin can be easily recovered.

Preferably, the conveying mechanism includes an adsorption part for molded products for adsorbing the resin molded product, and the unnecessary resin is adsorbed by the adsorption part for unnecessary resin, and the adsorption part for molded products is used for adsorption. The part adsorbs the resin molded product, and carries out the unnecessary resin and the resin molded product. With the above-described configuration, the resin molded product and unnecessary resin can be unloaded at one time by the common conveyance mechanism, so that the unloading time can be shortened, and the structure of the resin molding apparatus can be simplified.

In order to prevent the protruding portion of the groove block from interfering with the resin molded product when the resin molded product is carried out, it is preferable that the conveying mechanism includes a moving mechanism that causes the molded product to which the resin molded product is adsorbed. The resin molded product is moved to the outside of the overhanging portion by moving away from the resin injection portion by the suction portion.

As a pre-stage of stably recovering unnecessary resin, it is necessary to reliably separate the resin molded article from the unnecessary resin. Therefore, in the mold opening operation of the mold clamping mechanism for opening the first mold and the second mold, it is desirable that the transmission mechanism moves the plunger toward the first mold to move the plunger toward the first mold. The resin molded product on the die surface of the second die is separated from the unnecessary resin on the groove block. Since the resin molded article is separated from the unnecessary resin using the plunger as described above, the separation can be performed reliably.

When the groove block is provided so as to be capable of advancing and retracting with respect to the second mold via an elastic member, it is desirable that the mold opening operation of the mold clamping mechanism to mold-open the first mold and the second mold is performed. In the process, the groove block is moved toward the first mold by the restoring force of the elastic member, whereby the resin molded product on the mold surface of the second mold and the unnecessary resin on the groove block are separated. separation. With this structure, the resin molded product can be separated from unnecessary resin by the elastic force of the elastic member compressed during mold clamping.

Preferably, the groove block is in a state in which the unnecessary resin is sandwiched between the groove block and the first mold by the elastic force of the elastic member during a predetermined period from the start of the mold opening operation, and After the predetermined period has elapsed, the unnecessary resin is held while being peeled off from the first mold. With this structure, the resin molded product and the unnecessary resin can be separated in a state where the unnecessary resin is sandwiched between the groove block and the first mold, and the unnecessary resin can be prevented from being separated when they are separated. Resin accidentally fell off the tank block. In addition, unnecessary resin is not dropped from the tank block when they are separated, and thus it is possible to prevent poor adsorption due to inclination of the unnecessary resin on the tank block or the like.

When the unnecessary resin is recovered after mold opening, if the groove block is not in the initial state in which the elastic member is restored, the groove block may move unexpectedly before and after the unnecessary resin adsorption part is brought into contact with the unnecessary resin. . Therefore, there is a possibility that the adsorption of the unnecessary resin cannot be performed, resulting in poor recovery. In order to solve the above problem, it is desirable that the transmission mechanism moves the plunger toward the first mold until the elastic member returns to an initial state before the mold opening by the mold clamping mechanism is completed. , and the conveying mechanism brings the unnecessary resin adsorption portion into contact with the unnecessary resin on the tank block in the initial state.

Furthermore, the manufacturing method of the resin molded article using the said resin molding apparatus is also one aspect of this invention.

<One Embodiment of the Present Invention> Hereinafter, an embodiment of the resin molding apparatus of the present invention will be described with reference to the drawings. In addition, for the sake of easy understanding, any of the drawings shown below are appropriately omitted or exaggerated and schematically drawn. The same symbols are attached to the same constituent elements, and descriptions thereof are appropriately omitted.

<Overall structure of resin molding apparatus> The resin molding apparatus 100 of the present embodiment performs resin molding on the molding object W1 to which the electronic components Wx are connected by transfer molding using the resin material J.

Here, the molding object W1 is, for example, a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit substrate, a semiconductor substrate, a wiring substrate, a lead frame, etc., regardless of the presence or absence of wiring. In addition, the resin material J used for resin molding is, for example, a composite material containing a thermosetting resin, and the form of the resin material J is granular, powder, liquid, sheet, or small flake. Furthermore, as the electronic component Wx connected to the upper surface of the molding object W1, for example, a bare wafer or a resin-sealed wafer is used.

Specifically, as shown in FIG. 1 , the resin molding apparatus 100 includes the following components as constituent elements: a supply module 100A for supplying a pre-molded object W1 and a resin material J; a molding module 100B for resin molding; and The accommodation module 100C accommodates the molded object W2 (hereinafter referred to as the resin molded article W2 ) after molding. Furthermore, the supply module 100A, the forming module 100B, and the storage module 100C are respectively detachable and replaceable with respect to other constituent elements. In addition, the number of forming modules 100B may be two or three, etc., and each constituent element may be added.

The supply module 100A is provided with the following components: a molding object supply unit 11 for supplying the molding object W1; a resin material supply unit 12 for supplying the resin material J; The supply part 11 receives the molding object W1 and conveys it to the molding die set 100B, and receives the resin material J from the resin material supply part 12 and conveys it to the molding die set 100B.

The loader 13 reciprocates between the supply module 100A and the forming module 100B, and moves along a rail (not shown) provided over the supply module 100A and the forming module 100B.

As shown in FIG. 2 , the molding die set 100B includes: a first mold 2 (hereinafter referred to as an upper mold 2 ), which is one of the molding molds in which a cavity 2 a into which a resin material J is injected is formed; a second mold 3 (hereinafter referred to as the upper mold 2 ) The lower mold 3) is the other of the molding molds that is disposed opposite to the upper mold 2 and is provided with a resin injection portion 4 that injects the resin material J into the cavity 2a; Clamp the mold. The upper mold 2 is held by the upper mold holder 101 , and the upper mold holder 101 is fixed to the upper pressing plate 102 . In addition, the upper mold 2 is attached to the upper mold holder 101 via the upper mold base plate 103 . The lower mold 3 is held by a lower mold holder 104 , and the lower mold holder 104 is fixed to a movable platen 105 raised and lowered by the mold clamping mechanism 5 . In addition, the lower mold 3 is attached to the lower mold holder 104 via the lower mold base plate 106 .

The resin injection unit 4 includes a groove block 41 in which a groove 41a for accommodating the resin material J is formed, and a transmission mechanism 42 including a plunger 421 provided in the groove 41a. In addition, the groove|channel 41a is formed by the cylindrical member 410 which has a cylindrical shape, for example. The cylindrical member 410 is inserted into the through hole formed on the groove block 41 .

The groove block 41 is elastically supported by the elastic member 43 so as to be able to move up and down with respect to the lower mold 3 . That is, the groove block 41 is provided so as to be able to move up and down with respect to the lower mold 3 via the elastic member 43 . Furthermore, the elastic member 43 is provided on the lower side of the groove block 41 .

In addition, at the upper end portion of the groove block 41 , an overhang portion 411 that protrudes from the die surface, which is the upper surface of the lower die 3 , is formed. Further, on the upper surface of the groove block 41, a reject pool portion 41b and a gate portion 41c are formed as a resin flow path for introducing the resin material J injected from the groove 41a into the cavity 2a. In addition, in the state where the upper mold 2 and the lower mold 3 are clamped, the upper surface of the protruding portion 411 is in contact with the upper mold 2 , and the lower surface of the protruding portion 411 sandwiches the molding object W1 with the mold surface of the lower mold 3 . .

In the groove block 41 of the present embodiment, as shown in FIG. 3( a ), a plurality of groove blocks 41 a are formed in a line, for example, linearly. In addition, although the example in which eight groove|channels 41a are formed in one groove block 41 is shown to FIG.3(a), it is not limited to this, You may change suitably. In addition, on the upper surface of the groove block 41, a plurality of knock pool portions 41b are formed corresponding to the plurality of grooves 41a, respectively, and a plurality of gate portions 41c are formed corresponding to the plurality of the reject pool portions 41b, respectively.

Furthermore, the groove block 41 is formed with a connecting portion 41d for connecting the unnecessary resin K remaining corresponding to each of the plurality of grooves 41a. In addition, the unnecessary resin K is resin which remains on the groove block 41 after resin molding, and is hardened. Moreover, the connection part 41d connects the mutually adjacent reject pool part 41b, and has a groove shape, for example. Here, the connection portion 41d is formed so as to connect the four consecutive reject pool portions 41b, and thereby, as shown in FIG. 3(b) , the plurality of unnecessary resins K remaining corresponding to the plurality of grooves 41a are respectively formed. Divide into multiple groups (in this case, two groups) to connect. In addition, below, the thing which couple|connected the some unnecessary resin K integrally is also called unnecessary resin body KM.

The transmission mechanism 42 moves the plurality of plungers 421 in a state where the upper mold 2 and the lower mold 3 are clamped to inject the resin material J into the cavity 2a from the plurality of grooves 41a.

The transmission mechanism 42 has a structure that does not include an isostatic mechanism using, for example, an elastic member to make the injection pressure of the resin material J uniform, and moves the plurality of plungers 421 by the same amount of movement in each groove 41a.

Specifically, as shown in FIG. 4 , the transmission mechanism 42 includes: a plurality of plungers 421 , which are arranged in the respective interiors of the plurality of grooves 41 a and are used to press-feed the molten resin material J; a fixing block 422 is used for The plurality of plungers 421 are fixed; and the plunger driving unit 423 moves the plurality of plungers 421 together by the same movement amount by moving the fixing block 422 .

The fixing block 422 has a substantially rectangular parallelepiped shape, and a plurality of plungers 421 in a row are fixed linearly on one surface (upper surface) of the rectangular shape. The arrangement of the plurality of plungers 421 corresponds to the arrangement of the plurality of grooves 41a. Furthermore, the plurality of plungers 421 are fixed to the fixing block 422 by, for example, fixing screws or the like. Furthermore, the plurality of plungers 421 have the same shape as each other.

The plunger drive unit 423 moves the fixed block 422 up and down relative to the lower mold 3 to move the plurality of plungers 421 up and down together with the plurality of grooves 41 a by the same movement amount. The plunger drive part 423 of this embodiment is provided on the lower side of the fixed block 422 . Here, as the plunger drive unit 423, for example, a servomotor and a ball screw mechanism are combined, an air cylinder, a hydraulic cylinder, and a rod are combined, or the like.

As shown in FIG. 2, the upper mold|type 2 is formed with the cavity 2a which accommodates the electronic component Wx of the molding object W1, and the molten resin material J is injected|thrown-in. In addition, in the upper mold 2, the recessed portion 2b is formed in the portion facing the groove block 41, and the runner portion 2c connecting the pick pool portion 41b and the gate portion 41c of the groove block 41 and the cavity 2a is formed. In addition, although not shown, in the upper mold|type 2, the exhaust port is formed in the side opposite to the groove block 41. As shown in FIG. In addition, the runner portion 2c may be omitted, and the reject pool portion 41b and the cavity 2a may be directly connected via the gate portion 41c.

In addition, the upper mold 2 is provided with a plurality of ejection pins 61 for releasing the molded object W2 after resin molding from the upper mold 2 . These ejector pins 61 are provided so as to penetrate through a desired portion of the upper mold 2 and can be raised and lowered relative to the upper mold 2 , and are fixed to the ejection plate 62 provided on the upper side of the upper mold 2 . The ejector plate 62 is provided on the upper pressing plate 102 and the like via the elastic member 63 , and includes a return pin 64 . At the time of mold clamping, the return pin 64 is brought into contact with the outside of the placement area of the object to be molded W1 in the lower mold 3 , thereby raising the ejector plate 62 with respect to the upper mold 2 . Thereby, at the time of mold clamping, the ejector pins 61 are in a state of being retracted from the mold surface of the upper mold 2 . On the other hand, during mold opening, the ejector plate 62 descends relative to the upper mold 2 as the lower mold 3 descends, and the ejector pin 61 ejects the resin molded product W2 from the upper mold 2 by the elastic force of the elastic member 63 .

Furthermore, when the upper mold 2 and the lower mold 3 are clamped by the mold clamping mechanism 5, the resin flow path including the pick pool portion 41b, the gate portion 41c, the concave portion 2b, and the runner portion 2c connects the plurality of grooves 41a to the cavity. 2a is connected (see Figure 6). In addition, when the upper mold 2 and the lower mold 3 are clamped, the groove-side end of the molding object W1 is sandwiched between the lower surface of the protruding portion 411 of the groove block 41 and the mold surface of the lower mold 3 . When the molten resin material J is injected into the cavity 2a by the plurality of plungers 421 in this state, the electronic component Wx of the molding object W1 is sealed with resin.

As shown in FIG. 1 , the storage module 100C is provided with a storage portion 14 for storing the resin molded product W2, and a transfer device 15 (hereinafter referred to as the unloader 15) that receives the resin molded product W2 from the molding module 100B and conveys it to the storage portion 14 ).

The unloader 15 reciprocates between the forming module 100B and the storage module 100C, and moves along a rail (not shown) provided over the forming module 100B and the storage module 100C.

<Operation of the resin molding apparatus 100> The operation of the resin molding apparatus 100 will be briefly described with reference to FIGS. 5 to 16 . 5 to 16 show only one side (left side) of the groove block 41, and the other side (right side) is omitted, but the state of the other side is the same as that of one side in each figure. In addition, the following operation|movement is performed by controlling each part by the control part COM provided in the supply module 100A, for example.

As shown in FIG. 5 , in the state where the upper mold 2 and the lower mold 3 are opened, the molding object W1 before molding is conveyed by the loader 13 , handed over to the lower mold 3 and placed thereon. At this time, the upper mold 2 and the lower mold 3 are heated to a temperature at which the resin material J can be melted and hardened. After that, the resin material J is conveyed by the loader 13 and accommodated in the plurality of grooves 41 a of the groove block 41 .

In this state, when the lower mold 3 is raised by the mold clamping mechanism 5, as shown in FIG. The groove-side end of the molding object W1 is in contact with each other. In addition, the lower surface of the upper mold 2 contacts the outer peripheral portion of the molding object W1 which the overhang 411 does not contact. Thereby, the upper mold 2 and the lower mold 3 are clamped. After the mold clamping, when the transmission mechanism 42 raises the plurality of plungers 421 by the same amount of movement by the plunger driving unit 423, as shown in FIG. 7, the molten resin material J in the plurality of grooves 41a passes through The resin passage is injected into the cavity 2a. At this time, the injection pressure of the resin material J injected from each groove 41a is made uniform through the connecting portion 41d. Then, after a predetermined molding time has elapsed and the resin material J is hardened in the cavity 2a, the mold clamping mechanism 5 opens the upper mold 2 and the lower mold 3.

Here, the resin molding apparatus 100 of the present embodiment performs the operation of separating the resin molded product W2 from the unnecessary resin K in the mold opening operation of the mold clamping mechanism 5 for opening the upper mold 2 and the lower mold 3 (gate disconnect action).

For example, immediately before the lapse of the molding time (before the mold opening operation starts), as shown in FIG. 8 , the transmission mechanism 42 reduces the force with which the plurality of plungers 421 press the unnecessary resin K to a force of a predetermined value (for example, in the A force of a relatively small value to the extent that the plurality of plungers 421 and the unnecessary resin K can be maintained in a contact state without peeling off. In addition, the force pressed by the plurality of plungers 421 is a force sensor (including a weight) such as a load cell (not shown) provided on a drive shaft (transmission shaft) of the plunger drive unit 423 or the like. sensors, load cells, etc.).

Then, the control unit COM stores the position of the plunger 421 when the force of the predetermined value is obtained as the reference position X (see FIG. 8 ). The reference position X is a position serving as a reference for the gate opening operation and the mold release/recovery of the unnecessary resin K, which will be described later. In addition, the reference position X is not limited to the position of the plunger 421 , and may be the position of other members such as the drive shaft (transmission shaft) of the plunger drive unit 423 connected to the plunger 421 .

Then, before the start of the mold opening operation, as shown in FIG. 9 , the transmission mechanism 42 lowers the plurality of plungers 421 to the side opposite to the upper mold 2 to a predetermined peeling position Y. By lowering the plurality of plungers 421 to the peeling position Y, the upper surfaces of the plurality of plungers 421 and the lower surface of the unnecessary resin K are peeled off. After the peeling operation, the transmission mechanism 42 raises the plurality of plungers 421 to the reference position X. At this time, the upper surfaces of the plurality of plungers 421 are in contact with the lower surfaces of the unnecessary resin K (the state in FIG. 8 ).

Next, as shown in FIG. 10 , the lower mold 3 is started to descend by the mold clamping mechanism 5, and the mold opening operation is started. When the mold clamping mechanism 5 starts the mold opening operation and the clamping force decreases to a predetermined value (different from the predetermined value in the transmission mechanism 42 ), as shown in FIG. 11 , the transmission mechanism 42 pushes the plurality of plungers 421 to the upper mold. 2 rise. Thereby, the unnecessary resin K on the groove block 41 is pressed by the plurality of plungers 421 to the upper die 2 . Note that the clamping force is measured by a force sensor (including a weight sensor, a load sensor, etc.) such as a load sensor (not shown) provided on the clamping shaft of the mold clamping mechanism 5 or the like.

When the transmission mechanism 42 raises the plurality of plungers 421 to the upper die 2, as shown in FIG. That is, during the mold opening operation, while the groove block 41 is lifted from the lower mold 3 to the upper mold 2 by the elastic force of the elastic member 43 , the transmission mechanism 42 raises the plurality of plungers 421 from the lower mold 3 to the upper mold 2 .

In addition, in the mold opening operation, the timing when the groove block 41 starts to rise from the lower mold 3 to the upper mold 2 due to the elastic force of the elastic member 43, and the transmission mechanism 42 causes the plurality of plungers 421 to start from the lower mold 3 to the upper mold 2. The timing of the ascent can be the same or different.

By the rise of the plurality of plungers 421 by the transmission mechanism 42 and the rise of the groove block 41 by the elastic force of the elastic member 43, as shown in FIG. Unwanted resin K on 41 separates (gate is broken).

At this time, the resin molded product W2 on the lower mold 3 is pressed by the ejector pins 61 provided in the upper mold 2 to the mold surface of the lower mold 3, and the lower surface of the resin molded product W2 is in a state of being in close contact with the mold surface of the lower mold 3. (See Figure 11). The ejector pin 61 functions as a pressing member that presses the resin molded product W2 against the die surface of the lower mold 3 when the resin molded product W2 is separated from the unnecessary resin K. Since the resin molded product W2 is pressed against the die surface of the lower mold 3 by the pressing member as described above, shear stress is easily applied between the resin molded product W2 and the unnecessary resin K, and gate disconnection is easy.

Here, the ejector pin 61 as the pressing member presses the resin molded article W2 against the die surface of the lower mold 3 at least until the resin molded article W2 is separated from the unnecessary resin K. In other words, during the mold opening operation, while the ejector pin 61 presses the resin molded article W2, the separation of the resin molded article W2 and the unnecessary resin K is completed by the rise of the groove block 41 and the rise of the plunger 421.

In the gate opening, the unnecessary resin K is in a state of being sandwiched between the upper surface of the groove block 41 and the lower surface of the upper mold 2 which are pressed upward by the elastic force of the elastic member 43 (see FIGS. 11 and 11 ). Figure 12). That is, the groove block 41 is in a state in which the unnecessary resin K is sandwiched between the groove block 41 and the upper mold 2 by the elastic force of the elastic member 43 for a predetermined period from the start of the mold opening operation. In addition, the predetermined period includes at least the period until the gate opening is completed, and is the period until the lower mold 3 descends to the initial state (the state before being pressed and compressed by the upper mold 2 ) in which the elastic member 43 is restored.

Then, after a predetermined period of time has elapsed, that is, the lower mold 3 is further lowered by the mold clamping mechanism 5, and as shown in FIG. . Here, the trough block 41 is formed with a pick pool portion 41b and a gate portion 41c, and the contact area between the tank block 41 and the unnecessary resin K is larger than the contact area between the upper mold 2 and the unnecessary resin K, so it is not necessary to The resin K is not peeled off from the groove block 41 , but from the upper die 2 . In addition, the connection portion 41d also contributes to an increase in the contact area between the groove block 41 and the unnecessary resin K. Thereby, the ejector pins for contacting with the unnecessary resin K and peeling the unnecessary resin K from the upper mold 2 can be unnecessary.

In addition, as the transmission mechanism 42 raises the plurality of plungers 421 to the upper die 2 , the protruding portion 411 of the groove block 41 changes from the state of sandwiching the resin molded product W2 with the die surface of the lower die 3 to molding with the resin. Product W2 is not in contact.

Furthermore, in addition to the opening of the gate, the transmission mechanism 42 raises the plurality of plungers 421 to the upper die 2 until the elastic member 43 on the lower side of the groove block 41 is restored to the initial state before clamping (refer to FIG. 13 ). ). Accordingly, in the next resin molding, when the object to be molded W1 is placed on the lower side of the overhanging portion 411, the overhanging portion 411 does not become an obstacle.

After the mold opening operation as described above is performed to separate the resin molded article W2 from the unnecessary resin K, as shown in FIGS. 14 to 16 , the resin molded article W2 and the unnecessary resin K are unloaded by the unloader 15 .

As shown in FIG. 14, the unloader 15 is provided with the adsorption|suction part 15a for molded products, and the adsorption|suction part 15b for unnecessary resins. Both the adsorption part 15a for molded articles and the adsorption part 15b for unnecessary resin include adsorption pads made of resin. In particular, the adsorption part 15b for unnecessary resin is, for example, a bellows type (also referred to as a bellows type), and has a higher elasticity ratio. The adsorption|suction part 15a for molded products is excellent. Moreover, the adsorption|suction part 15a for molded articles and the unnecessary adsorption|suction part 15b for resins are provided in the base member 151, and are connected to a suction source, such as a suction pump which is not shown in figure. The adsorption|suction part 15a for molded articles sucks air by a suction source, and the resin molded article W2 is adsorb|sucked by the adsorption|suction opening part 15a1. The unnecessary resin adsorption part 15b sucks air by a suction source, and thereby the unnecessary resin K is adsorbed in the adsorption opening part 15b1.

Furthermore, at least the adsorption|suction part 15a for molded products is comprised so that it may move in the left-right direction and the up-down direction with respect to the base member 151 by the moving mechanism 153. As shown in FIG. In addition, the moving mechanism 153 includes: a left-right direction moving part including, for example, rails and sliders for moving the molded product suction part 15a in the left-right direction; and a vertical direction movement of the molded product suction part 15a For example, it includes rails and sliders that move up and down. Furthermore, the unloader 15 is provided with holding claws 152 for holding and preventing the resin molded product W2 adsorbed by the molded product adsorbing portion 15a from falling.

After the mold opening operation is completed, the unloader 15 is moved between the upper mold 2 and the lower mold 3 . Then, as shown in FIG. 14 , the suction opening 15a1 of the suction part 15a for a molded article is brought into contact with the upper surface of the resin molded article W2, and the suction opening 15b1 of the suction part 15b for an unnecessary resin is brought into contact with an unnecessary resin. The upper surface of K contacts.

In this state, as shown in FIG. 15 , the transmission mechanism 42 lifts up the plurality of plungers 421 to lift the unnecessary resin K from the groove block 41 . Here, when the residual portion K1 in which the unnecessary resin K remains in the plurality of grooves 41 a is included, the residual portion K1 is raised to such an extent that the collection of the unnecessary resin K is not hindered. Thereby, the unnecessary resin K is released from the tank block 41, and it is in close contact with the unnecessary resin adsorption portion 15b. At this time, the adsorption|suction part 15b for unnecessary resin elastically deforms and contracts in the state which the adsorption|suction opening part 15b1 contacts the unnecessary resin K.

Here, as shown in FIG. 3( a ), the tank block 41 is connected to each other by the connecting portion 41 d, so that the unnecessary resin K spans the plurality of rejects as shown in FIG. 3( b ). One unnecessary resin body KM connected to the pool portion 41b can reduce the number of unnecessary resins K separated from each other on the tank block 41 . Correspondingly, the number of unnecessary resin adsorption|suction parts 15b can also be reduced.

After the unnecessary resin adsorption part 15b is in a contracted state, adsorption of the unnecessary resin adsorption part 15b is started, and the unnecessary resin K is adsorbed to the adsorption opening 15b1 of the unnecessary resin adsorption part 15b. Moreover, adsorption|suction of the adsorption|suction part 15a for molded products is started, and the adsorption|suction opening part 15a1 of the adsorption|suction part 15a for molded products is made to adsorb|suck the resin molded product W2.

Then, as shown in FIG. 16 , the molded product suction portion 15 a that has adsorbed the resin molded product W2 is moved in a direction away from the groove block 41 by the moving mechanism 153 , and the resin molded product W2 is moved out of the extension portion 411 . . Then, after the unloader 15 is raised, it is withdrawn from the upper die 2 and the lower die 3 . Thereby, the resin molded product W2 and the unnecessary resin K are carried out by the unloader 15 . Here, as described above, since the unnecessary resin K is peeled off from the plunger 421 before the unnecessary resin K is peeled off from the tank block 41, the unnecessary resin K can be easily recovered.

Here, the unloader 15 may include a cleaning mechanism (not shown) for cleaning the upper mold 2 and the lower mold 3 . In addition, as a cleaning mechanism, it is possible to include a rotating brush and a suction part that suctions and discharges dust.

In this case, the unloader 15 that has adsorbed the resin molded product W2 and the unnecessary resin K stays between the upper mold 2 and the lower mold 3, and performs a cleaning operation.

Here, first, the transmission mechanism 42 performs the operation of scraping out the resin adhering to the plurality of grooves 41a. That is, as shown in FIG. 17, the transmission mechanism 42 raises the some plunger 421 to a predetermined|prescribed pick-out position. Here, the predetermined scraping position is, for example, a position where the upper surface of the plunger 421 is positioned above the opening position of the groove 41a. Then, the transfer mechanism 42 descends from the predetermined scraping position to the loading position for accommodating the resin material J. As shown in FIG. After that, the transmission mechanism 42 raises the plurality of plungers 421 to the predetermined pick-up position again. As a result, the resin adhering to the plurality of grooves 41a is scraped out of the plurality of grooves 41a.

Then, the upper mold|type 2, the lower mold|type 3, the groove block 41, and the some plunger 421 are cleaned by the cleaning mechanism provided in the unloader 15. After the cleaning operation is completed, the unloader 15 is withdrawn from the upper mold 2 and the lower mold 3 to carry out the resin molded product W2 and the unnecessary resin K.

<Effects of the present embodiment> According to the resin molding apparatus 100 of the present embodiment, the unnecessary resin K remaining corresponding to each of the plurality of grooves 41 a is connected by the connecting portion 41 d, so that the unnecessary resin K on the groove block 41 after resin molding can be one. Therefore, not only can the unnecessary resin K be stably recovered, but also the unloader 15 that can be used to recover the unnecessary resin K has a simple structure. In addition, since the plurality of grooves 41a are communicated through the connecting portion 41d, even if the transmission mechanism 42 moves the plurality of plungers 421 by the same amount of movement, the resin material J injected from each groove 41a reciprocates in the connecting portion 41d. It is also possible to achieve uniformity of the injection pressure of the resin material J, so that the transmission mechanism 42 does not need to include an isostatic mechanism. Thereby, the structure of the transmission mechanism 42 can be simplified.

In addition, in the present embodiment, since the connection portion 41d divides a plurality of unnecessary resins K into a plurality of groups and connects them, when the unnecessary resin K is accommodated in the waste box, the amount of the unnecessary resin K in the waste box can be reduced. The dead space can increase the unnecessary resin K that can be accommodated in the waste box.

In addition, in the present embodiment, the unnecessary resin K is peeled off from the groove block 41 by the plunger 421 before the unnecessary resin K is adsorbed by the unnecessary resin adsorption portion 15b, so that it can be reliably removed from the groove block 41 The unnecessary resin K adsorbed by the unnecessary resin adsorption unit 15b is recovered. In addition, when the unnecessary resin K is peeled off from the groove block 41 by the plunger 421, the unnecessary resin adsorption portion 15b is brought into contact with the unnecessary resin K, so that the unnecessary resin K can be prevented from being deposited on the groove block 41. Poor adsorption due to tilting, etc. According to the above, the unnecessary resin K on the tank block 41 can be stably recovered.

Here, in this embodiment, before the unnecessary resin K is peeled off from the groove block 41, the plunger 421 is lowered to the side opposite to the upper mold 2, and the unnecessary resin is peeled off from the upper surface of the plunger 421. The lower surface of K, so the separated unnecessary resin K can be easily recovered.

In addition, in the present embodiment, when the unnecessary resin K is peeled off from the tank block 41, the unnecessary resin adsorption portion 15b elastically deforms and contracts in a state in which the unnecessary resin K is in contact, so it is possible to avoid When the peeling of the unnecessary resin K from the tank block 41 is hindered, the state in which the unnecessary resin adsorption part 15b is in contact with the unnecessary resin K is maintained. Therefore, the unnecessary resin K after peeling can be reliably adsorbed.

Furthermore, in this embodiment, since the unloader 15 includes the adsorption part 15a for molded products and the adsorption part 15b for unnecessary resin, the resin molded product W2 and the unnecessary resin K can be unloaded at one time by the common conveying mechanism, As a result, the time for carrying them out can be shortened, and the structure of the resin molding apparatus 100 can be simplified.

In addition, in the present embodiment, during the mold opening operation, while the groove block 41 is raised by the elastic force of the elastic member 43, the transmission mechanism 42 raises the plunger 421 to separate the resin molded product W2 from the unnecessary resin K Therefore, the resin molded product W2 can be reliably separated from the unnecessary resin K by the elastic force of the elastic member 43 compressed at the time of mold clamping. In addition, since the plunger 421 is used to separate the resin molded product W2 from the unnecessary resin K, it is not necessary to increase the elastic force of the elastic member 43, thereby preventing an increase in the size of the elastic member 43, and also does not cause the molding die 2, Increase in size of the molding die 3 or increase in size of the resin K that is not required.

Furthermore, in the present embodiment, unnecessary resin K is sandwiched between the groove block 41 and the upper mold 2 during the period from the start of the mold opening operation to the completion of gate opening, so that it is possible to prevent unnecessary resin Unnecessary resin K is unexpectedly dropped from the groove block 41 due to the reaction of K separation from the resin molded product W2 and the like. In addition, the unnecessary resin K does not come off from the tank block 41 at the time of their separation, so that it is possible to prevent poor adsorption due to inclination of the unnecessary resin K on the tank block or the like.

In addition, in the present embodiment, before the unnecessary resin adsorption part 15b collects the unnecessary resin K, the transmission mechanism 42 raises the plunger 421 to the upper die 2 until the elastic member 43 is restored to the initial state. The front and rear tank blocks 41 in which the unnecessary resin adsorption part 15b is in contact with the unnecessary resin do not rise unexpectedly, and the unnecessary resin K can be collected stably.

<Other variant embodiments> In addition, this invention is not limited to the said embodiment.

For example, in the above-described embodiment, before the resin molded product W2 is separated from the unnecessary resin K, the plunger 421 is lowered to peel off the upper surface of the plunger 421 and the lower surface of the unnecessary resin K, but After the resin molded product W2 is separated from the unnecessary resin K and before the groove block 41 is separated from the unnecessary resin K, the plunger 421 can be lowered to separate the upper surface of the plunger 421 from the unnecessary resin K. The lower surface peels off.

In addition, in the above-described embodiment, the plunger 421 is raised when the resin molded product W2 is separated from the unnecessary resin K, but a configuration may be adopted in which the plunger 421 is not raised and only the elastic member 43 is used to raise the plunger 421 . The resin molded product W2 is separated from the unnecessary resin K.

Furthermore, in the above-described embodiment, the structure in which both the resin molded product W2 and the unnecessary resin K are carried out by the common unloader 15, may be a structure in which each of the resin molded products W2 is carried out. A transfer mechanism and a transfer mechanism for carrying out unnecessary resin K.

In addition, in the above-described embodiment, a structure is adopted in which the resin molded product W2 is pushed to the lower mold 3 by the ejector pins 61 provided in the upper mold 2 before the resin molded product W2 is separated from the unnecessary resin K. However, in addition to the ejector pins 61, a pressing member for pressing the resin molded product W2 against the mold surface of the lower mold 3 may be provided.

Furthermore, in the above-described embodiment, the tank block 41 is formed with the pick pool portion 41b, the gate portion 41c, and the connection portion 41d, but the pick pool portion, the gate portion, and the connection portion may be formed in the recessed portion 2b of the upper mold 2. . In this case, there is a possibility that the resin K, which is unnecessary when the upper mold 2 and the lower mold 3 are opened, is released from the groove block 41 and stays in the concave portion 2b of the upper mold 2. Therefore, the upper mold 2 may be provided with a Ejector pin for releasing unwanted resin K. In addition, as long as it is a structure which can connect unnecessary resin K, a pick pool part, a gate part, and a connection part may be provided in any of the tank block 41 or the upper mold|type 2, respectively. For example, the trough block 41 may be formed with a picking pool portion, and the connecting portion may be formed on the concave portion 2b of the upper die 2, or the picking pool portion may be formed on the recessed portion 2b of the upper die 2, and the connecting portion may be formed on the trough block 41.

The resin molding apparatus of the present invention is not limited to ordinary transfer molding, and may be a structure including a transfer mechanism.

In addition to this, the present invention is not limited to the above-described embodiments, and it goes without saying that various modifications can be made without departing from the gist of the present invention.

2: The first mold (upper mold, forming mold) 2a: Cavity 2b: Recess 2c: runner part 3: The second mold (lower mold, forming mold) 4: Resin injection part 5: Clamping mechanism 11: Forming object supply section 12: Resin material supply department 13: Conveying device (loader) 14: Storage Department 15: Conveying mechanism (conveying device, unloader) 15a: Adsorption part for molded product 15a1, 15b1: suction opening 15b: Unnecessary resin adsorption part 41: slot block 41a: slot 41b: Reject pool 41c: Gate part 41d: Links 42: Transmission Agency 43: Elastic member 61: Ejector pin 62: Ejector plate 63: Elastic member 64: Return pin 100: Resin molding device 100A: Supply module 100B: Forming module 100C: Storage module 101: Upper die holder 102: Upper platen 103: Upper mold base plate 104: Lower die holder 105: Movable platen 106: Lower die base plate 151: Base member 152: Keep Claws 153: Mobile Mechanism 410: Cylindrical member 411: Extension 421: Plunger 422: Fixed block 423: Plunger drive part COM: Control Department J: Resin material K: Unwanted resin K1: Residual part KM: unwanted resin body W1: object to be formed W2: Resin molded product (molded object) Wx: Electronic Parts X: Reference position Y: peeling position

FIG. 1 is a schematic view showing the configuration of a resin molding apparatus according to an embodiment of the present invention. FIG. 2 is a schematic diagram showing the structure of the molding die set of the embodiment. FIG. 3 is a schematic plan view showing (a) a tank block and a schematic view showing (b) unnecessary resin in the embodiment. Fig. 4 is a (a) plan view and (b) a right side view schematically showing the configuration of the transmission mechanism of the embodiment. FIG. 5 is a schematic view showing a substrate mounting state and a resin material loading state of the molding die set of the embodiment. FIG. 6 is a schematic view showing a mold clamping state of the molding die set of the embodiment. 7 is a schematic view showing a resin injection state of the molding die set of the embodiment. FIG. 8 is a schematic diagram showing the reference position X of the molding die set of the embodiment. 9 is a schematic view showing a peeling state of the molding die set of the embodiment. FIG. 10 is a schematic diagram showing a state at the start of the mold opening operation of the molding die set of the embodiment. 11 is a schematic diagram showing a gate opening operation in a mold opening operation of the molding die set of the embodiment. 12 is a schematic view showing a state after the gate is disconnected in the mold opening operation of the molding die set of the embodiment. FIG. 13 is a schematic view showing a mold opening state of the molding die set of the embodiment. 14 is a schematic view showing a state in which each suction part of the unloader according to the embodiment is in contact with a resin molded product and unnecessary resin. FIG. 15 is a schematic diagram showing a state in which the unnecessary resin is raised and the unnecessary resin adsorption part is contracted in the embodiment. 16 is a schematic view showing a state in which the unloader of the embodiment adsorbs and unloads resin molded products and unnecessary resins. FIG. 17 is a schematic diagram showing (a) a plucking position and (b) a loading position in the plucking operation of the embodiment.

41: slot block

41a: slot

41b: Reject pool

41c: Gate part

41d: Links

411: Extension

K: Unwanted resin

KM: unwanted resin body

Claims (15)

A resin molding device, comprising: The first mold is formed with a mold cavity; a second mold facing the first mold and placing the object to be formed; a mold clamping mechanism for clamping the first mold and the second mold, a groove block provided on the second mold, formed with a plurality of grooves for accommodating the resin material, and including a protruding portion protruding from the mold surface of the second mold; and a transmission mechanism including a plurality of plungers provided inside each of the plurality of grooves, and moving the plurality of plungers to inject the resin material from the plurality of grooves into the mold cavity, The first mold or the groove block is formed with a connecting portion for connecting unnecessary resins remaining corresponding to the plurality of grooves, respectively, The transmission mechanism moves the plurality of plungers by the same amount of movement. The resin molding apparatus according to claim 1, wherein the first mold or the groove block includes a plurality of reject pools formed corresponding to the plurality of grooves, respectively, The said connection part connects the said unnecessary resin by connecting the mutually adjacent said reject pool part. The resin molding apparatus according to claim 2, wherein the plurality of reject pool portions and the connecting portion are formed in the groove block. The resin molding apparatus according to any one of Claims 1 to 3, wherein the connecting portion divides the plurality of unnecessary resins into a plurality of groups and connects them. The resin molding apparatus according to any one of Claims 1 to 4, wherein the transmission mechanism includes: a fixing block for fixing the plurality of plungers; and a plunger driving part for moving the plunger A fixed block moves the plurality of plungers together. The resin molding apparatus according to any one of claim 1 to claim 5, further comprising a conveying mechanism for carrying out unnecessary resin on the tank block after resin molding, The conveyance mechanism includes an unnecessary resin adsorption part for adsorbing the unnecessary resin. The resin molding apparatus according to claim 6, wherein the transfer mechanism causes the column to be brought into contact with the unnecessary resin adsorbing part for the unnecessary resin by the conveying mechanism. The plug moves toward the first mold to peel off the unnecessary resin from the groove block, and then the conveying mechanism adsorbs the unnecessary resin by the unnecessary resin adsorption part and removes the unnecessary resin. Unwanted resin is removed. The resin molding apparatus according to claim 7, wherein the transfer mechanism causes the plunger to peel off the unnecessary resin from the groove block by moving the plunger toward the first mold. The unnecessary resin is peeled off from the plunger by moving to the side opposite to the first mold. The resin molding apparatus according to any one of Claims 6 to 8, wherein the conveying mechanism includes a molded product adsorption portion for adsorbing the resin molded product, The unnecessary resin is adsorbed by the unnecessary resin adsorption part, the resin molded article is adsorbed by the molded article adsorption part, and the unnecessary resin and the resin molded article are carried out. The resin molding apparatus according to claim 9, wherein the conveying mechanism includes a moving mechanism that moves the molded article to which the resin molded article is adsorbed away from the resin injection unit by moving the molded article to be separated from the resin injection unit. The resin molded product is moved to the outer side of the overhang portion. The resin molding apparatus according to any one of Claims 1 to 10, wherein in the mold-opening operation of the mold clamping mechanism for opening the first mold and the second mold, the transmission The mechanism moves the plunger toward the first mold to separate the resin molded product on the mold surface of the second mold from the unnecessary resin on the groove block. The resin molding apparatus according to any one of Claims 1 to 11, wherein the groove block is provided so as to be able to advance and retreat relative to the second mold via an elastic member, During the mold-opening operation of the mold-clamping mechanism for opening the first mold and the second mold, the groove block is moved toward the first mold by the restoring force of the elastic member. The resin molded product on the die surface of the second die is separated from the unnecessary resin on the groove block. The resin molding apparatus according to claim 12, wherein the groove block is sandwiched between the groove block and the first mold by utilizing the elastic force of the elastic member for a predetermined period from the start of the mold opening operation. The state of the unnecessary resin, and after the predetermined period has elapsed, the unnecessary resin is kept and the unnecessary resin is peeled from the first mold. The resin molding apparatus according to claim 12 or claim 13, wherein the transfer mechanism moves the plunger toward the first mold until the mold opening by the mold clamping mechanism ends until the mold opening is completed. the initial state in which the elastic member is restored, The conveyance mechanism brings the unnecessary resin adsorption portion into contact with the unnecessary resin on the tank block in the initial state. A method for producing a resin molded product using the resin molding apparatus according to any one of Claims 1 to 14.

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