TW202208145A - Resin molding apparatus and resin molded product manufacturing method - Google Patents

Abstract

A resin molding apparatus and resin molded product manufacturing method of the present invention obtain a frictional force between a pot and a plunger with high accuracy, and is a resin molding apparatus (100) that uses a plunger (421) to extrude a resin material (J) contained in a pot (41a) and inject into a cavity (2a) and includes a computing part (71) calculating a frictional force (F) between the pot (41a) and the plunger (421) based on a first load (P1) applied to the plunger (421) when the plunger (421) is moved in an extrusion direction and a second load (P2) applied to the plunger (421) when the plunger (421) is moved in a direction opposite to the extrusion direction.

Description

Resin molding apparatus and method for producing resin molded product

The present invention relates to a resin molding apparatus and a method for producing a resin molded product.

Conventionally, as shown in Patent Document 1, for example, in a semiconductor resin sealing device in which a plunger pressurizes a resin in a groove and injects it into a cavity in a mold to perform resin molding, it is considered that a load sense is provided at the lower part of the plunger. The measuring device measures the sliding resistance when the plunger is raised, and compares it with a predetermined sliding threshold value, thereby determining the abnormality of the device and controlling the device.

Furthermore, in Patent Document 1, when the force applied to the plunger is detected by a strain gauge, the sliding resistance when the plunger is raised is measured and compared with a predetermined sliding threshold value, and the measurement is performed during the processing of the plunger. The sliding resistance is compared with a predetermined sliding threshold, and the device is determined to be abnormal to control the device. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 11-260844

[Problems to be Solved by Invention] However, in the semiconductor resin sealing device, the sliding resistance values detected when the plunger ascends and descends include not only the frictional force between the groove and the plunger, but also other loads applied to the plunger. That is, in the above-described semiconductor resin sealing device, the frictional force between the groove and the plunger cannot be obtained with high accuracy.

On the other hand, the inventors of the present application have considered a configuration in which the load of the stopped plunger is measured in a state where the resin material is not contained in the groove, and the load of the plunger when the plunger is moved up and down is measured based on this. load to measure the friction between the groove and the plunger.

However, in the above-described configuration, it can be seen that the friction force obtained from the load when the plunger is raised differs from the friction force obtained from the load when the plunger is lowered. It is considered that the cause of the deviation is that, for example, when the descending plunger is stopped and used as a reference, the plunger receives an upward frictional force from the groove and stops. That is, since the frictional force of the plunger in the stopped state is not a state of zero, it is considered that the frictional force cannot be accurately obtained even if it is used as a reference.

Therefore, the present invention is made in order to solve the above-mentioned problems, and the main problem is to obtain the frictional force between the groove and the plunger with high accuracy. [Technical means to solve the problem]

That is, the resin molding apparatus of the present invention uses a plunger to extrude and inject the resin material accommodated in the groove into the cavity, and the resin molding apparatus includes an arithmetic unit based on the extrusion of the plunger to the extrusion. The groove is calculated by the first load applied to the plunger when moving in the direction, and the second load applied to the plunger when the plunger is moved to the side opposite to the extrusion direction friction with the plunger.

Furthermore, the manufacturing method of the resin molding of this invention is the manufacturing method of the resin molding using the said resin molding apparatus. [Effect of invention]

According to the present invention thus constituted, the frictional force between the groove and the plunger can be obtained with high accuracy.

Next, the present invention will be described in more detail by way of examples. However, the present invention is not limited by the following description.

As described above, the resin molding apparatus of the present invention uses the plunger to extrude and inject the resin material accommodated in the groove into the cavity, and the resin molding apparatus includes an arithmetic unit based on the operation of the plunger Calculate the first load applied to the plunger when moving in the extrusion direction and the second load applied to the plunger when the plunger is moved to the side opposite to the extrusion direction friction between the slot and the plunger. In the case of the resin molding apparatus, the first load applied to the plunger when the plunger is moved in the extrusion direction and the load applied to the plunger when the plunger is moved to the side opposite to the extrusion direction The second load is used to calculate the frictional force between the groove and the plunger, and the load of the plunger in the stopped state is not used as a reference, so the frictional force between the groove and the plunger can be obtained with high accuracy.

As a specific calculation method of the frictional force, it is considered that the calculation unit calculates the frictional force based on the maximum value of the first load and the minimum value of the second load.

As a more detailed calculation method of the frictional force, it is considered that the calculation unit calculates the frictional force based on the difference between the maximum value of the first load and the minimum value of the second load.

In order to control the injection pressure of the resin material with high accuracy, it is desirable to include an adjustment unit that adjusts the force for extruding the resin material by the plunger using the frictional force obtained by the calculation unit.

It is desirable to include a judgment unit that judges whether or not the operation of the device is possible based on a comparison result of the frictional force obtained by the calculation unit and a predetermined reference value. With this configuration, for example, when it is determined that the device cannot be operated, the operation can be stopped at an appropriate timing and maintenance can be performed.

The resin molding apparatus may perform a cleaning operation of scraping out the resin adhering to the tank to the outside of the tank using the plunger after resin molding. In this case, it is desirable that the computing unit acquires the first load and the second load during the cleaning operation. With the above-described configuration, the operation for acquiring the first load and the second load does not need to be performed separately by utilizing the conventional operation of the resin molding apparatus.

Specifically, the cleaning operation is performed by moving the plunger between a predetermined scraping position and a loading position for accommodating the resin material. In the cleaning operation, the computing unit acquires the first load when moving the plunger from the loading position to the scraping position, and moves the plunger from the scraping position The second load is acquired upon reaching the loading position.

The resin molding apparatus of the present invention is considered to perform edge-gated transfer molding. Specifically, the resin molding apparatus of the present invention is considered to include: a first mold in which a cavity is formed; and a second mold facing the first mold and provided with a resin injection portion including the groove and the plunger and a mold clamping mechanism for clamping the first mold and the second mold, the resin injection part comprising: a groove block formed with the groove, arranged to be able to be relative to the second mold via an elastic member advancing and retreating, and including a protruding part protruding from the mold surface of the second mold; and a transmission mechanism, including the plunger, and moves the plunger to inject the required amount from the groove into the mold cavity. the resin material.

Preferably, in the mold opening operation of the mold clamping mechanism for opening the first mold and the second mold, the transmission mechanism moves the plunger toward the first mold to move the plunger to the first mold. The resin molded product on the die face of the second die is separated from the unnecessary resin on the groove block. With this structure, unnecessary resin on the groove block is pressed against the first die by the plunger, so that the resin molded product can be reliably moved to the first die without increasing the elastic force of the elastic member that moves the groove block forward and backward. Unwanted resin separation. In addition, since there is no need to increase the elastic force of the elastic member, an increase in the size of the elastic member is prevented, and an increase in the size of the molding die or the unnecessary increase in the size of the resin is also prevented. In particular, in the present invention, since the frictional force between the groove and the plunger can be obtained with high accuracy, the force of pressing the unnecessary resin by the plunger can be controlled with high accuracy, and the plunger can be used reliably. The action of separating resin moldings from unnecessary resins.

Preferably, the resin molding apparatus of the present invention includes a conveying mechanism for carrying out unnecessary resin on the tank block after resin molding, and the conveying mechanism includes an unnecessary resin for adsorbing the unnecessary resin. an adsorption part, after the conveying mechanism brings the unnecessary resin adsorption part into contact with the unnecessary resin on the groove block, the transmission mechanism moves the plunger to the first mold to remove The tank block peels off the unnecessary resin, and after that, the conveying mechanism adsorbs the unnecessary resin by the unnecessary resin adsorption part and carries out the unnecessary resin. In the above configuration, after the unnecessary resin adsorption part is brought into contact with the unnecessary resin on the tank block, the plunger is moved to the first mold to peel off the unnecessary resin from the tank block, and thereafter, the unnecessary resin is removed from the tank block with The unnecessary resin adsorption part adsorbs the unnecessary resin, so the unnecessary resin on the tank block can be collected stably. Specifically, before the unnecessary resin is adsorbed by the unnecessary resin adsorption part, the unnecessary resin is peeled off from the tank block by the plunger, so even if the contact area between the unnecessary resin and the tank block is increased, it is possible to The unnecessary resin adsorbed by the unnecessary resin adsorption part is reliably recovered from the tank block. In addition, when the unnecessary resin is peeled off from the tank block by the plunger, the adsorption part for the unnecessary resin contacts the unnecessary resin, so that it is possible to prevent poor adsorption due to the inclination of the unnecessary resin on the tank block, etc. . According to the above, unnecessary resin on the tank block can be stably recovered. In particular, in the present invention, since the frictional force between the groove and the plunger can be obtained with high accuracy, the force of pressing the unnecessary resin with the plunger can be controlled with high accuracy, and the plunger can be used to reliably carry out the operation from the groove. The act of stripping the block of unwanted resin.

Moreover, the manufacturing method of the resin molded article using the said resin molding apparatus is also one aspect of this invention.

<One Embodiment of the Present Invention> Hereinafter, an embodiment of the resin molding apparatus of the present invention will be described with reference to the drawings. In addition, for the sake of easy understanding, any of the drawings shown below are appropriately omitted or exaggerated and schematically drawn. The same symbols are attached to the same constituent elements, and descriptions thereof are appropriately omitted.

<Overall structure of resin molding apparatus> The resin molding apparatus 100 of the present embodiment performs resin molding on the molding object W1 to which the electronic components Wx are connected by transfer molding using the resin material J.

Here, the molding object W1 is, for example, a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit substrate, a semiconductor substrate, a wiring substrate, a lead frame, etc., regardless of the presence or absence of wiring. In addition, the resin material J used for resin molding is, for example, a composite material containing a thermosetting resin, and the form of the resin material J is granular, powder, liquid, sheet, or small flake. Furthermore, as the electronic component Wx connected to the upper surface of the molding object W1, for example, a bare wafer or a resin-sealed wafer is used.

Specifically, as shown in FIG. 1 , the resin molding apparatus 100 includes the following components as constituent elements: a supply module 100A for supplying a pre-molded object W1 and a resin material J; a molding module 100B for resin molding; and The accommodation module 100C accommodates the molded object W2 (hereinafter referred to as the resin molded article W2 ) after molding. Furthermore, the supply module 100A, the forming module 100B, and the storage module 100C are respectively detachable and replaceable with respect to other constituent elements. In addition, the number of forming modules 100B may be two or three, etc., and each constituent element may be added.

The supply module 100A is provided with the following components: a molding object supply unit 11 for supplying the molding object W1; a resin material supply unit 12 for supplying the resin material J; The supply part 11 receives the molding object W1 and conveys it to the molding die set 100B, and receives the resin material J from the resin material supply part 12 and conveys it to the molding die set 100B.

The loader 13 reciprocates between the supply module 100A and the forming module 100B, and moves along a rail (not shown) provided over the supply module 100A and the forming module 100B.

As shown in FIG. 2 , the molding die set 100B includes: a first mold 2 (hereinafter referred to as an upper mold 2 ), which is one of the molding molds in which a cavity 2 a into which a resin material J is injected is formed; a second mold 3 (hereinafter referred to as the upper mold 2 ) The lower mold 3) is the other of the molding molds that is disposed opposite to the upper mold 2 and is provided with a resin injection portion 4 that injects the resin material J into the cavity 2a; Clamp the mold. The upper mold 2 is held by the upper mold holder 101 , and the upper mold holder 101 is fixed to the upper pressing plate 102 . In addition, the upper mold 2 is attached to the upper mold holder 101 via the upper mold base plate 103 . The lower mold 3 is held by a lower mold holder 104 , and the lower mold holder 104 is fixed to a movable platen 105 raised and lowered by the mold clamping mechanism 5 . In addition, the lower mold 3 is attached to the lower mold holder 104 via the lower mold base plate 106 .

The resin injection unit 4 includes a groove block 41 in which a groove 41a for accommodating the resin material J is formed, and a transmission mechanism 42 including a plunger 421 provided in the groove 41a. In addition, the groove|channel 41a is formed by the cylindrical member 410 which has a cylindrical shape, for example. The cylindrical member 410 is inserted into the through hole formed on the groove block 41 .

The groove block 41 is elastically supported by the elastic member 43 so as to be able to move up and down with respect to the lower mold 3 . That is, the groove block 41 is provided so as to be able to move up and down with respect to the lower mold 3 via the elastic member 43 . Furthermore, the elastic member 43 is provided on the lower side of the groove block 41 .

In addition, at the upper end portion of the groove block 41 , an overhang portion 411 that protrudes from the die surface, which is the upper surface of the lower die 3 , is formed. Further, on the upper surface of the groove block 41, a reject pool portion 41b and a gate portion 41c are formed as a resin flow path for introducing the resin material J injected from the groove 41a into the cavity 2a. In addition, in the state where the upper mold 2 and the lower mold 3 are clamped, the upper surface of the protruding portion 411 is in contact with the upper mold 2 , and the lower surface of the protruding portion 411 sandwiches the molding object W1 with the mold surface of the lower mold 3 . .

The transmission mechanism 42 moves the plunger 421 in a state in which the upper mold 2 and the lower mold 3 are clamped to inject the resin material J into the cavity 2a from the groove 41a. Specifically, the transmission mechanism 42 includes a plunger 421 for press-feeding the resin material J heated and melted in the groove 41 a , and a plunger driving part 422 for driving the plunger 421 .

The upper mold|type 2 is formed with the cavity 2a which accommodates the electronic component Wx of the molding object W1, and the molten resin material J is injected|thrown-in. In addition, in the upper mold 2, the recessed portion 2b is formed in the portion facing the groove block 41, and the runner portion 2c connecting the pick pool portion 41b and the gate portion 41c of the groove block 41 and the cavity 2a is formed. In addition, although not shown, in the upper mold|type 2, the exhaust port is formed in the side opposite to the groove block 41. As shown in FIG. In addition, the runner portion 2c may be omitted, and the reject pool portion 41b and the cavity 2a may be directly connected via the gate portion 41c.

In addition, the upper mold 2 is provided with a plurality of ejection pins 61 for releasing the molded object W2 after resin molding from the upper mold 2 . These ejector pins 61 are provided so as to penetrate through a desired portion of the upper mold 2 and can be raised and lowered relative to the upper mold 2 , and are fixed to the ejection plate 62 provided on the upper side of the upper mold 2 . The ejector plate 62 is provided on the upper pressing plate 102 and the like via the elastic member 63 , and includes a return pin 64 . At the time of mold clamping, the return pin 64 is brought into contact with the outside of the placement area of the object to be molded W1 in the lower mold 3 , thereby raising the ejector plate 62 with respect to the upper mold 2 . Thereby, at the time of mold clamping, the ejector pins 61 are in a state of being retracted from the mold surface of the upper mold 2 . On the other hand, during mold opening, the ejector plate 62 descends relative to the upper mold 2 as the lower mold 3 descends, and the ejector pin 61 ejects the resin molded product W2 from the upper mold 2 by the elastic force of the elastic member 63 .

Then, when the upper mold 2 and the lower mold 3 are clamped by the mold clamping mechanism 5, the resin flow path including the reject pool portion 41b, the gate portion 41c, the concave portion 2b, and the runner portion 2c communicates the groove 41a and the cavity 2a. (Refer to Figure 4). In addition, when the upper mold 2 and the lower mold 3 are clamped, the groove-side end of the molding object W1 is sandwiched between the lower surface of the protruding portion 411 of the groove block 41 and the mold surface of the lower mold 3 . When the molten resin material J is injected into the cavity 2a by the plunger 421 in this state, the electronic component Wx of the molding object W1 is sealed with the resin.

As shown in FIG. 1 , the storage module 100C is provided with a storage portion 14 for storing the resin molded product W2, and a transfer device 15 (hereinafter referred to as the unloader 15) that receives the resin molded product W2 from the molding module 100B and conveys it to the storage portion 14 ).

The unloader 15 reciprocates between the forming module 100B and the storage module 100C, and moves along a rail (not shown) provided over the forming module 100B and the storage module 100C.

<Frictional force measurement function between groove 41a and plunger 421> Further, the resin molding apparatus 100 of the present embodiment has a function of measuring the frictional force (sliding resistance value) generated between the groove 41 a and the plunger 421 . In addition, the said frictional force calculation and measurement function is performed by the control part COM provided in the supply module 100A, for example.

Specifically, as shown in FIG. 3 , the resin molding apparatus 100 is provided with a force sensor PS that measures the load applied to the plunger 421, and the groove is calculated using the load obtained by the force sensor PS. The frictional force F between 41a and the plunger 421.

In the present embodiment, a force sensor PS is provided between the plunger 421 and the plunger driving part 422 , and as the force sensor, for example, a tension-compression type load sensor can be used. In addition to this, as the force sensor PS, a weight sensor, a load sensor, or the like can be used.

In addition, the control unit COM includes a calculation unit 71 that calculates the frictional force F between the groove 41a and the plunger 421 in a state where the resin material J is not accommodated in the groove 41a.

The computing unit 71 acquires, from the force sensor PS, the first load P1 applied to the plunger 421 when the plunger 421 is moved in the extrusion direction (when the plunger 421 is raised), and when the plunger 421 is moved to and The groove 41 a and the plunger 421 are calculated based on the second load P2 applied to the plunger 421 when the side opposite to the extrusion direction moves (when the plunger 421 descends) based on the acquired first load P1 and second load P2 The frictional force between F.

Specifically, the calculation unit 71 calculates the frictional force F based on the maximum value P1 _max of the first load P1 and the minimum value P2 _min of the second load P2.

Here, the maximum value P1 _max of the first load P1 is obtained from the friction force (F) and the load (L) other than the friction force (P1 _max =F+L). Here, since the plunger 421 is raised, the frictional force is a positive value.

In addition, the minimum value P2 _min of the 2nd load P2 is calculated|required from the frictional force (-F) and the load (L) other than the frictional force (P2 _min =-F+L). Here, since the plunger 421 is lowered, the frictional force has a negative value.

Then, the calculation unit 71 calculates the frictional force F based on the difference (P1 _max −P2 _min ) between the maximum value P1 _max of the first load P1 and the minimum value P2 _min of the second load P2 according to the following formula [1]. P1 _max -P2 _min =(F+L)-(-F+L)=2F F=(P1 _max -P2 _min )/2 [1] From the above, the friction force F can be obtained. In addition, the timing for obtaining the first load P1 and the second load P2 and the timing for obtaining the frictional force F will be described later.

Further, the control unit COM includes an adjustment unit 72 that adjusts the force for extruding the resin material J by the plunger 421 using the frictional force F obtained by the arithmetic unit 71 .

The adjustment unit 72 controls the plunger drive unit 422 using the frictional force F obtained by the calculation unit 71 so that it becomes a preset injection pressure. Thereby, regardless of the frictional force F, the injection pressure of the resin material J can be controlled to a desired value. For example, when the set value of the injection pressure is set to P _set , the actual injection pressure is affected by the friction force F, and becomes P _set −F. Therefore, the adjusting part 72 controls the plunger driving part 422 to take the frictional force F into consideration, so that the force pushed out by the plunger 421 becomes P _set +F.

In addition, the control unit COM includes a judgment unit 73 that judges whether or not the operation of the apparatus can be performed based on the comparison result of the frictional force F obtained by the calculation unit 71 and a predetermined reference value.

The determination unit 73 compares the frictional force F obtained by the calculation unit 71 with a predetermined reference value, and if the frictional force F is equal to or greater than the reference value, for example, an alarm for prompting maintenance is issued, or the resin molding apparatus 100 is stopped.

<Operation of the resin molding apparatus 100> The operation of the resin molding apparatus 100 will be briefly described with reference to FIGS. 4 to 15 . 4 to 15 show only one side (left side) of the groove block 41, and the other side (right side) is omitted, but the state of the other side is the same as that of one side in each figure. In addition, in FIGS. 4-16, illustration of the force sensor PS is abbreviate|omitted. The following operations are performed by, for example, controlling each part by the control part COM provided in the supply module 100A.

As shown in FIG. 4 , in a state in which the upper mold 2 and the lower mold 3 are opened, the molding object W1 before molding is conveyed by the loader 13, handed over to the lower mold 3, and placed thereon. At this time, the upper mold 2 and the lower mold 3 are heated to a temperature at which the resin material J can be melted and hardened. After that, the resin material J is conveyed by the loader 13 and accommodated in the groove 41 a of the groove block 41 .

In this state, when the lower mold 3 is raised by the mold clamping mechanism 5, as shown in FIG. The groove-side end of the molding object W1 is in contact with each other. In addition, the lower surface of the upper mold 2 contacts the outer peripheral portion of the molding object W1 which the overhang 411 does not contact. Thereby, the upper mold 2 and the lower mold 3 are clamped. After the mold clamping, when the transmission mechanism 42 uses the plunger driving portion 422 to raise the plunger 421, as shown in FIG. 6, the molten resin material J in the groove 41a passes through the resin passage and is injected into the cavity 2a . Then, after a predetermined molding time has elapsed and the resin material J is hardened in the cavity 2a, the mold clamping mechanism 5 opens the upper mold 2 and the lower mold 3.

Here, the resin molding apparatus 100 of the present embodiment performs the operation of separating the resin molded product W2 from the unnecessary resin K in the mold opening operation of the mold clamping mechanism 5 for opening the upper mold 2 and the lower mold 3 (gate disconnect action). In addition, the unnecessary resin K is resin which remains on the groove block 41 and hardens.

For example, immediately before the lapse of the molding time (before the mold opening operation is started), as shown in FIG. 7 , the transmission mechanism 42 reduces the force with which the plunger 421 presses the unnecessary resin K to a force of a predetermined value (for example, when the plunger 421 is a relatively small force to the extent that the contact state can be maintained without peeling off the unnecessary resin K). Here, since the frictional force F between the groove 41a and the plunger 421 is obtained with high accuracy by the computing unit 71, the force with which the plunger 421 presses the resin K which is not necessary can be precisely controlled. Furthermore, the force pressed by the plunger 421 is measured by the force sensor PS.

Then, the control unit COM stores the position of the plunger 421 when the force of the predetermined value is obtained as the reference position X (see FIG. 7 ). The reference position X is a position serving as a reference for the gate opening operation and the mold release/recovery of the unnecessary resin K, which will be described later. In addition, the reference position X is not limited to the position of the plunger 421 , and may be the position of other members such as the drive shaft (transmission shaft) of the plunger drive unit 422 connected to the plunger 421 .

Then, before the start of the mold opening operation, as shown in FIG. 8 , the transmission mechanism 42 lowers the plunger 421 to the side opposite to the upper mold 2 to the predetermined peeling position Y. By lowering the plunger 421 to the peeling position Y, the upper surface of the plunger 421 is peeled off from the lower surface of the unnecessary resin K. After the peeling operation, the transmission mechanism 42 raises the plunger 421 to the reference position X. At this time, the upper surface of the plunger 421 is in contact with the lower surface of the unnecessary resin K (the state of FIG. 7 ).

Next, as shown in FIG. 9 , the lower mold 3 is started to descend by the mold clamping mechanism 5, and the mold opening operation is started. When the mold clamping mechanism 5 starts the mold opening operation and the clamping force decreases to a predetermined value (different from the predetermined value in the transmission mechanism 42 ), as shown in FIG. 10 , the transmission mechanism 42 raises the plunger 421 to the upper mold 2 . . Thereby, the unnecessary resin K on the groove block 41 is pressed by the plunger 421 to the upper die 2 . Note that the clamping force is measured by a force sensor (including a weight sensor, a load sensor, etc.) such as a load sensor (not shown) provided on the clamping shaft of the mold clamping mechanism 5 or the like.

In addition, when the transmission mechanism 42 raises the plunger 421 to the upper die 2, as shown in FIG. That is, during the mold opening operation, while the groove block 41 is lifted from the lower mold 3 to the upper mold 2 by the elastic force of the elastic member 43 , the transmission mechanism 42 raises the plunger 421 from the lower mold 3 to the upper mold 2 .

Furthermore, in the mold opening operation, the timing when the groove block 41 starts to rise from the lower mold 3 to the upper mold 2 due to the elastic force of the elastic member 43, and the timing when the plunger 421 starts to rise from the lower mold 3 to the upper mold 2 by the transmission mechanism 42. The timing can be the same or different.

By the rise of the plunger 421 by the transmission mechanism 42 and the rise of the groove block 41 by the elastic force of the elastic member 43, as shown in FIG. of unwanted resin K separation (gate disconnection).

At this time, the resin molded product W2 on the lower mold 3 is pressed by the ejector pins 61 provided in the upper mold 2 to the mold surface of the lower mold 3, and the lower surface of the resin molded product W2 is in a state of being in close contact with the mold surface of the lower mold 3. (Refer to Figure 10). The ejector pin 61 functions as a pressing member that presses the resin molded product W2 against the die surface of the lower mold 3 when the resin molded product W2 is separated from the unnecessary resin K. Since the resin molded product W2 is pressed against the die surface of the lower mold 3 by the pressing member as described above, shear stress is easily applied between the resin molded product W2 and the unnecessary resin K, and gate disconnection is easy.

Here, the ejector pin 61 as the pressing member presses the resin molded article W2 against the die surface of the lower mold 3 at least until the resin molded article W2 is separated from the unnecessary resin K. In other words, during the mold opening operation, while the ejector pin 61 presses the resin molded article W2, the separation of the resin molded article W2 and the unnecessary resin K is completed by the rise of the groove block 41 and the rise of the plunger 421.

During the gate opening, the unnecessary resin K is in a state of being sandwiched between the upper surface of the groove block 41 and the lower surface of the upper mold 2 which are pressed upward by the elastic force of the elastic member 43 (see FIGS. 10 and 10 ). Figure 11). That is, the groove block 41 is in a state in which the unnecessary resin K is sandwiched between the groove block 41 and the upper mold 2 by the elastic force of the elastic member 43 for a predetermined period from the start of the mold opening operation. In addition, the predetermined period includes at least the period until the gate opening is completed, and is the period until the lower mold 3 descends to the initial state (the state before being pressed and compressed by the upper mold 2 ) in which the elastic member 43 is restored.

Then, after a predetermined period of time has elapsed, that is, the lower mold 3 is further lowered by the mold clamping mechanism 5, and as shown in FIG. . Here, the trough block 41 is formed with a pick pool portion 41b and a gate portion 41c, and the contact area between the tank block 41 and the unnecessary resin K is larger than the contact area between the upper mold 2 and the unnecessary resin K, so it is not necessary to The resin K is not peeled off from the groove block 41 , but from the upper die 2 . Thereby, the ejector pins for contacting with the unnecessary resin K and peeling the unnecessary resin K from the upper mold 2 can be unnecessary.

In addition, as the transmission mechanism 42 lifts the plunger 421 to the upper die 2, the protruding portion 411 of the groove block 41 changes from the state where the resin molded product W2 is sandwiched between the die surface of the lower die 3 and the resin molded product W2. non-contact state.

In addition, the transmission mechanism 42 raises the plunger 421 to the upper die 2 until the elastic member 43 on the lower side of the groove block 41 is restored to the initial state before clamping (refer to FIG. 12 ), except for the gate opening. Accordingly, in the next resin molding, when the object to be molded W1 is placed on the lower side of the overhanging portion 411, the overhanging portion 411 does not become an obstacle.

After the above-described mold opening operation is performed to separate the resin molded article W2 from the unnecessary resin K, the resin molded article W2 and the unnecessary resin K are unloaded by the unloader 15 .

As shown in FIG. 13, the unloader 15 is provided with the adsorption|suction part 15a for molded products, and the adsorption|suction part 15b for unnecessary resins. The adsorption part 15a for molded articles and the adsorption part 15b for unnecessary resin both include adsorption pads made of resin. In particular, the adsorption part 15b for unnecessary resin is, for example, a bellows type, and has better stretchability than the adsorption part 15a for molded articles. . Moreover, the adsorption|suction part 15a for molded articles and the unnecessary adsorption|suction part 15b for resins are provided in the base member 151, and are connected to the suction source which is not shown in figure. Furthermore, at least the adsorption|suction part 15a for molded products is comprised so that it may move in the left-right direction and the up-down direction with respect to the base member 151. Furthermore, the unloader 15 is provided with holding claws 152 for holding the resin molded product W2 adsorbed by the molded product adsorption portion 15a.

After the mold opening operation is completed, the unloader 15 is moved between the upper mold 2 and the lower mold 3 . Then, as shown in FIG. 13, the adsorption|suction part 15a for molded articles is brought into contact with the upper surface of resin molded article W2, and the adsorption|suction part 15b for unnecessary resins is brought into contact with the upper surface of unnecessary resin K.

In this state, as shown in FIG. 14 , the transmission mechanism 42 lifts the plunger 421 to lift the unnecessary resin K from the groove block 41 . Here, when the residual portion K1 in which the unnecessary resin K remains in the tank 41 a is included, the residual portion K1 is raised to such an extent that the collection of the unnecessary resin K is not hindered. Thereby, the unnecessary resin K is released from the tank block 41, and it is in close contact with the unnecessary resin adsorption portion 15b. At this time, the unnecessary resin adsorption portion 15b is in a state of being elastically deformed and contracted. Here, since the frictional force F between the groove 41a and the plunger 421 is obtained with high accuracy by the arithmetic unit 71, the force of pressing the unnecessary resin K by the plunger 421 can be controlled with high accuracy.

After the unnecessary resin adsorption portion 15b is in a contracted state, the adsorption of the unnecessary resin adsorption portion 15b is started, and the unnecessary resin K is adsorbed by the unnecessary resin adsorption portion 15b. Moreover, adsorption|suction of the adsorption|suction part 15a for molded products is started, and the adsorption|suction part 15a for molded products is made to adsorb|suck the resin molded product W2.

Then, as shown in FIG. 15 , the resin molded product W2 is moved out of the extension portion 411 by moving the molded product adsorption portion 15 a to which the resin molded product W2 is adsorbed in a direction away from the groove block 41 . Then, after the unloader 15 is raised, it is withdrawn from the upper die 2 and the lower die 3 . Thereby, the resin molded product W2 and the unnecessary resin K are carried out by the unloader 15 .

Here, the unloader 15 may include a cleaning mechanism (not shown) for cleaning the upper mold 2 and the lower mold 3 . In addition, as a cleaning mechanism, it is possible to include a rotating brush and a suction part that suctions and discharges dust.

In this case, the unloader 15 on which the resin molded product W2 and the unnecessary resin K are adsorbed stays between the upper mold 2 and the lower mold 3, and performs a cleaning operation. In addition, in the cleaning operation, the control unit COM performs a frictional force calculation function.

Here, first, the transmission mechanism 42 performs the operation of scraping out the resin adhering to the groove 41a. That is, as shown in FIG. 16, the transmission mechanism 42 raises the plunger 421 to a predetermined|prescribed pick-out position. Here, the predetermined scraping position is, for example, a position where the upper surface of the plunger 421 is positioned above the opening position of the groove 41a.

Then, the transfer mechanism 42 descends from the predetermined scraping position to the loading position for accommodating the resin material J. As shown in FIG. As shown in FIG. 17 , in the lowering operation (section a) of lowering the plunger 421 from the pick-up position to the loading position, the computing unit 71 acquires the second load P2 from the force sensor PS such as the load sensor.

Then, the transmission mechanism 42 raises the plunger 421 again to a predetermined pick-out position. Thereby, the resin adhering to the tank is scraped out of the tank 41a. As shown in FIG. 17 , in the upward movement (section b) of raising the plunger 421 from the loading position to the raking position, the computing unit 71 acquires the first load P1 from the force sensor PS such as the load sensor.

Then, the upper mold|type 2, the lower mold|type 3, the groove block 41, and the plunger 421 are cleaned by the cleaning mechanism provided in the unloader 15. In addition, the calculation unit 71 calculates the frictional force F by the above-mentioned formula [1] using the minimum value P2 _min of the second load P2 obtained in the section a and the maximum value P1 _max of the first load obtained in the section b.

In addition, in the cleaning operation, the descending operation from the pick-up position to the loading position and the ascending operation from the loading position to the pick-off position may be performed a plurality of times, respectively.

In addition, when the plunger 421 is each performed a plurality of times of descending and ascending operations, the second load P2 may be acquired during the descending operation (section a), and the first load may be acquired during the ascending operation (section b). P1. In this case, consider averaging the obtained minimum values P2 _min of the plurality of second loads P2, and average the obtained maximum values P1 _max of the plurality of first loads P1, and according to the formula [ 1] to calculate the friction force F. In addition, the minimum value P2 _min of the second load P2 and the maximum value P1 _max of the first load P1 can be used to calculate the frictional force F according to the formula [1], and to calculate the frictional forces obtained from the above-mentioned formula [1]. F is averaged. In addition to this, when the frictional force F obtained by one up-and-down movement is equal to or greater than a predetermined value, it may be determined whether or not to move the plunger 421 further up and down.

After the cleaning operation is completed, the unloader 15 is withdrawn from the upper mold 2 and the lower mold 3 to carry out the resin molded product W2 and unnecessary resin K.

In addition, the frictional force F calculated by the calculation unit 71 during the cleaning operation is sent to the adjustment unit 72 . Then, in the next resin molding, the adjustment unit 72 controls the plunger drive unit 422 using the calculated frictional force F so that the injection pressure of the resin material J becomes a predetermined set value.

Furthermore, the frictional force F calculated by the calculation unit 71 during the cleaning operation is sent to the determination unit 73 . Then, the determination unit 73 compares the calculated frictional force F with a predetermined reference value, and if the frictional force is equal to or larger than the reference value, for example, an alarm for prompting maintenance is issued, or the resin molding apparatus 100 is stopped.

<Effects of the present embodiment> According to the resin molding apparatus 100 of the present embodiment, the calculation is performed based on the first load P1 applied to the plunger 421 when the plunger 421 ascends and the second load P2 applied to the plunger 421 when the plunger 421 descends The frictional force F between the groove 41a and the plunger 412 is not based on the load of the plunger in the stopped state, so the frictional force between the groove 41a and the plunger 421 can be obtained with high accuracy.

In addition, since the first load P1 and the second load P2 are acquired in the cleaning operation after resin molding, the existing operation of the resin molding apparatus 100 can be used, and there is no need to separately perform the acquisition of the first load P1 and the second load P2 Actions.

<Other variant embodiments> In addition, this invention is not limited to the said embodiment.

In the above-described embodiment, the friction force F is calculated by acquiring the first load P1 and the second load P2 during the cleaning operation, but a configuration may be adopted in which the first load P1 and the first load P1 and the second load P2 are acquired at a timing other than the cleaning operation. The friction force F is calculated by the second load P2. For example, before the resin material J is accommodated in the groove 41a, the plunger 421 may be raised and lowered to obtain the first load P1 and the second load P2, and the frictional force F may be calculated.

In addition, the range for raising and lowering the plunger 421 is not limited to between the pick-up position and the loading position as in the above-described embodiment, and can be appropriately set, for example, between the injection completion position where the injection of the resin material J is completed, and the loading position.

Furthermore, the calculation unit 71 of the above-described embodiment obtains the frictional force F using the maximum value P1 _max of the first load P1 and the minimum value P2 _min of the second load P2, but the maximum value P1 of the first load P1 may be used. The frictional force F is obtained by a value other than _max and a value other than the minimum value P2 _min in the second load P2. In addition, the frictional force F may be obtained using the average value of the section a of the first load P1 and the average value of the section b of the second load P2.

In the resin molding apparatus of the above-described embodiment, the edge gate type transfer molding is performed by including the protrusion 411 in the groove block 41 , but the side gate type transfer molding may also be performed.

The resin molding apparatus of the present invention is not limited to ordinary transfer molding, and may be a structure including a transfer mechanism.

In addition to this, the present invention is not limited to the above-described embodiments, and it goes without saying that various modifications can be made without departing from the gist of the present invention.

2: First mold (upper mold) 2a: Cavity 2b: Recessed part 2c: Runner part 3: Second mold (lower mold) 4: Resin injection part 5: Clamping mechanism 11: Molded object supply part 12: Resin Material supply unit 13: Conveying device (loader) 14: Storage unit 15: Conveying mechanism (conveying device, unloader) 15a: Adsorption part for molded products 15b: Adsorption part for unnecessary resin 41: Groove block 41a: Groove 41b : Reject pool part 41c : Gate part 42 : Transmission mechanism 43 : Elastic member 61 : Ejector pin 62 : Ejector plate 63 : Elastic member 64 : Return pin 71 : Calculation part 72 : Adjustment part 73 : Judgment part 100 : Resin molding apparatus 100A: Supply module 100B: Forming module 100C: Storage module 101: Upper die holder 102: Upper pressing plate 103: Upper die base plate 104: Lower die holder 105: Movable pressure plate 106: Lower die base plate 151: base member 152: holding claw 410: cylindrical member 411: projecting portion 421: plunger 422: plunger driving portion a, b: section COM: control portion J: resin material K: unnecessary resin K1: residue Part P1: first load P1 _max : maximum value P2: second load P2 _min : minimum value PS: force sensor W1: molding object W2: resin molding (molding object) Wx: electronic component X: reference position Y: peeling position

FIG. 1 is a schematic view showing the configuration of a resin molding apparatus according to an embodiment of the present invention. FIG. 2 is a schematic diagram showing the structure of the molding die set of the embodiment. FIG. 3 is a schematic diagram showing a configuration for realizing the friction force measurement function of the embodiment. FIG. 4 is a schematic view showing a substrate mounting state and a resin material loading state of the molding die set of the embodiment. FIG. 5 is a schematic view showing a mold clamping state of the molding die set of the embodiment. 6 is a schematic view showing a resin injection state of the molding die set of the embodiment. FIG. 7 is a schematic diagram showing the reference position X of the molding die set of the embodiment. 8 is a schematic view showing a peeling state of the molding die set of the embodiment. FIG. 9 is a schematic diagram showing a state at the start of the mold opening operation of the molding die set of the embodiment. 10 is a schematic view showing a gate break operation in the mold opening operation of the molding die set of the embodiment. 11 is a schematic view showing a state after the gate is disconnected in the mold opening operation of the molding die set of the embodiment. FIG. 12 is a schematic view showing a mold opening state of the molding die set of the embodiment. 13 is a schematic diagram showing a state in which each suction part of the unloader according to the embodiment is in contact with a resin molded product and unnecessary resin. FIG. 14 is a schematic view showing a state in which the unnecessary resin is raised and the unnecessary resin adsorption part is contracted in the embodiment. FIG. 15 is a schematic diagram showing a state in which the unloader of the embodiment adsorbs and unloads a resin molded product and unnecessary resin. FIG. 16 is a schematic diagram showing (a) a plucking position and (b) a loading position in the plucking operation of the embodiment. FIG. 17 is a schematic diagram showing measurement intervals of the first load P1 and the second load P2 in the cleaning operation of the embodiment.

41: slot block

41a: slot

42: Transmission Agency

71: Computing Department

72: Adjustment Department

73: Judgment Department

421: Plunger

422: Plunger drive part

COM: Control Department

PS: force sensor

Claims (11)

A resin molding device, which utilizes a plunger to extrude and inject a resin material contained in a groove into a mold cavity, wherein the resin molding device includes a computing part, The computing unit is based on a first load applied to the plunger when the plunger is moved in the extrusion direction, and a load applied to the plunger when the plunger is moved to the side opposite to the extrusion direction. The second load of the plunger is used to calculate the frictional force between the groove and the plunger. The resin molding apparatus according to claim 1, wherein the calculation unit calculates the frictional force based on a maximum value of the first load and a minimum value of the second load. The resin molding apparatus according to claim 1 or claim 2, wherein the calculation unit calculates the frictional force based on a difference between the maximum value of the first load and the minimum value of the second load. The resin molding apparatus according to any one of Claims 1 to 3, comprising an adjustment portion that adjusts extrusion of the resin material by the plunger using the frictional force obtained by the computing portion strength. The resin molding apparatus according to any one of Claims 1 to 4, further comprising a judgment unit that judges whether or not to proceed based on a comparison result between the frictional force obtained by the calculation unit and a preset reference value Device operates. The resin molding apparatus according to any one of Claims 1 to 5, wherein a cleaning operation is performed to scrape out the resin adhering to the tank to the outside of the tank using the plunger, The computing unit acquires the first load and the second load during the cleaning operation. The resin molding apparatus according to claim 6, wherein the cleaning operation is performed by moving the plunger between a predetermined scraping position and a loading position for accommodating the resin material, The computing unit acquires the first load when moving the plunger from the loading position to the pick-up position, and acquires the first load when moving the plunger from the pick-up position to the loading position the second load. The resin molding apparatus according to any one of claim 1 to claim 7, comprising: a first mold, formed with the mold cavity; a second mold facing the first mold and provided with a resin injection portion including the groove and the plunger; and a mold clamping mechanism for clamping the first mold and the second mold, The resin injection part includes: a groove block formed with the groove, disposed to be able to advance and retreat relative to the second mold via an elastic member, and including a protruding portion protruding from a mold surface of the second mold; and A transmission mechanism includes the plunger and moves the plunger to inject the resin material from the groove into the cavity. The resin molding apparatus according to claim 8, wherein in the mold opening operation of the mold clamping mechanism for opening the first mold and the second mold, the transmission mechanism causes the plunger to move toward the The first mold is moved, and the resin molded product on the mold surface of the second mold is separated from the unnecessary resin on the groove block. The resin molding apparatus according to claim 8 or claim 9, comprising a conveying mechanism for carrying out unnecessary resin on the tank block after resin molding, The conveying mechanism includes an unnecessary resin adsorption part for adsorbing the unnecessary resin, After the conveying mechanism brings the unnecessary resin suction portion into contact with the unnecessary resin on the groove block, the transmission mechanism moves the plunger to the first mold to remove the unnecessary resin from the groove. The block peels off the unnecessary resin, and thereafter, the conveying mechanism adsorbs the unnecessary resin by the unnecessary resin adsorption part and carries out the unnecessary resin. A method of manufacturing a resin molded product using the resin molding apparatus according to any one of Claims 1 to 10.

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