JP3162528B2 - Resin molding equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molding apparatus used for manufacturing a semiconductor device.

[0002]

2. Description of the Related Art When a lead frame or a TAB tape on which a semiconductor chip is mounted is resin-molded, these moldings are clamped by a mold and the cavity is filled with resin. In the transfer molding method, a resin tablet is supplied to a pot, and the resin melted in the pot is pressure-fed by a plunger and filled into a cavity to form a predetermined shape. In a conventional transfer molding method, a so-called side gate system is generally used in which a resin path leading from a pot to a cavity is provided on a parting surface of a mold and resin is injected from a side surface of the cavity.

In the conventional transfer molding method, FIG.
The plunger 4 is pushed to fill the cavity 5 with the resin as shown in FIG.
Pull back. Since the mold 7 is in a clamped state, the plunger 4 is separated from the cured resin by pulling back the plunger 4, and the mold 7 is removed.
The cured resin remains in the resin. When the mold is opened, the cured resin remaining in the mold is released from the mold together with the molded article by an ejector pin or the like provided on the mold side and removed.

[0004]

As described above, in a general resin molding apparatus, when the plunger returns, the effect resin remains on the mold die side, so that the plunger itself has a function of removing the cured resin. Absent. In the case of extrusion molding or the like, when the plunger is pulled out of the mold, the cured resin after filling with the resin adheres to the pressed end face of the plunger and is pulled out. Therefore, the cured resin must be removed from the end face of the plunger. However, also in this case, the cured resin is manually peeled and removed by a hammer or the like, and the plunger itself is not provided with a function of removing the cured resin.

In recent years, products having an extremely thin resin package, such as when a TAB tape is directly resin-molded, have been produced. Therefore, molding problems such as unfilled resin and generation of voids have occurred. Has occurred. For this reason, as a method for improving the filling property of the resin and performing a reliable resin molding, a method of vertically filling the outer surface of the package with a vertical gate and filling the resin has been studied. In the resin molding method using the vertical gate, the cured resin after the resin molding adheres to the end face of the plunger and is taken out, so that the method of removing the cured resin poses a problem. An object of the present invention is to provide a resin molding apparatus that can easily separate and remove a cured resin adhered to a plunger and taken out from the plunger.

[0006]

The present invention has the following arrangement to achieve the above object. In other words, in a resin molding apparatus in which a molten resin is pressure-fed by a plunger to fill the cavity with the resin, the resin is cured, the plunger is pulled out from the pot, and the unnecessary resin is discharged by attaching the cured resin to the pressing end surface of the plunger. The plunger is provided with a pushing body which is movable with respect to the plunger in the reciprocating direction thereof and whose end face can abut against a resin adhering to the pressing end face of the plunger, and after the resin is filled, the plunger is set in the pot. The pusher or the supporter of the pusher is provided on the drawer side that is pulled out to stop the movement of the pusher, and the plunger moves to relatively push the pusher against the plunger. It is characterized in that a fixing member that pushes in a direction in which the resin adhering to the end face is peeled off is provided. Further, as the pushing body, a slide plunger that slides on an outer surface of a front end portion on a pushing end side of the plunger is provided, and an ejector pin that projects from a pushing end face of the plunger is provided as the pushing body. It is characterized by being arranged in a plunger.

[0007]

After the plunger enters the pot and is molded with resin, the plunger is pulled out of the pot.
At this time, the cured resin adheres to the pressing end surface of the plunger and is pulled out. However, when the plunger moves, the pressing body comes into contact with the fixing member at the moving position to restrict the movement, and the plunger is moved. Is moved further in the protruding direction relative to the plunger, and the resin adhering to the pressing end face of the plunger is removed by being pushed in the peeling direction. As the pushing body, a slide plunger and an ejector pin can be used, and in both cases, the slide plunger and the ejector pin are pushed by the movement of the plunger to peel off the resin adhering to the end face of the plunger.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIGS. 1, 2, and 3 are explanatory views showing the configuration and operation of an embodiment of the resin molding apparatus according to the present invention. The resin molding apparatus of the embodiment is a vertical gate type apparatus in which a gate is provided in a direction perpendicular to the cavity surface. In FIG. 1, 10a and 10b are an upper cavity block and a lower cavity block.
2a and 12b are an upper chase block and a lower chase block. Reference numeral 14 denotes a cavity for molding a molded product.

The cavity 1 of the upper chase block 12a
In the upper position of 4, a pot 16 for charging a resin tablet
Place. The pot 16 is provided so as to penetrate the upper chase block 12a in the thickness direction, and a plunger 18 for pressure-feeding the molten resin is installed so as to be able to enter and exit the pot 16. Numeral 20 denotes a vertical gate communicating between the pot 16 and the cavity 14. The vertical gate 20 is provided parallel to the mold opening / closing direction, that is, perpendicular to the cavity surface, and is formed in a tapered shape in which a gate end is opened on the top surface of the cavity and a leading end side communicating with the cavity 14 has a small diameter.

The plunger 18 feeds the molten resin to the cavity 14 by pressure. The pressing end face of the plunger 18 has a check groove 1 for adhering and pulling out the cured resin after resin molding to the end face.
8a is provided. Further, a slide plunger 22 is provided on the outer surface on the distal end side of the plunger 18 so as to be slidable in the axial direction concentrically with the plunger 18. The slide plunger 22 functions as a pushing body for removing the resin adhered to the end face of the plunger 18. A flange 22 a is provided around the base of the slide plunger 22, and a protruding edge 19 is provided on the outer surface of the plunger 18 to contact the flange 22 a.

A bolt 24 is provided on the flange 22a so as to extend through the through hole provided in the projecting edge 19 and extend toward the projecting edge 19,
The spring 22 is extrapolated from the bolt 24 to the flange 22a.
And the protruding edge 19 is constantly urged. The slide plunger 22 is set such that the end face thereof coincides with the pressing end face position of the plunger 18 in a state where the flange 22a and the protruding edge 19 are in contact with each other.

Next, the resin molding operation of the resin molding apparatus of the above embodiment will be described. First, after a molded article is clamped by the upper cavity block 10a and the lower cavity block 10b, a resin tablet is put into the pot 16 with the plunger 18 pulled up above the pot 16, and the plunger 18 is put into the pot 16. Let me enter.
The resin tablet is melted by the heat of the mold, and the molten resin is pressure-fed by the plunger 18 to fill the cavity 14 with the resin from the vertical gate 20.

FIG. 1 shows a state in which the plunger 18 has been lowered to the lowest point position. The flange 22a of the slide plunger 22 comes into contact with the protruding edge 18a and descends into the pot 16 together with the plunger 18 to press the resin. The molten resin is completely filled in the cavity 14 and remains at the bottom of the vertical gate 14 and the pot 16. After holding the pressurized state for a certain period of time to cure the resin, the plunger 18 is raised to the outside of the pot 16. The resin 26 hardened at the bottom of the pot 16 adheres to the pressing end surface of the plunger 18 by pulling up the plunger 18 and is taken out. It is separated and taken out integrally with the resin 26 (FIG. 2). The check groove 18 a provided on the end face of the plunger 19 is effective for securely adhering the resin 26 to the end face of the plunger 18.

As shown in FIG. 3, the plunger 18 rises to a position where the flange 22a of the slide plunger 22 abuts on a fixing plate 28 which is a fixing member fixed to the side of the plunger 18 at a position above the mold. Stop climbing. When the plunger 18 rises, the fixing plate 28 abuts only on the flange 22a, and the protruding edge 19 of the plunger 18
Is formed with a hole having a diameter size to allow passage. In other words, the outer diameter of the protruding edge 19 is set to be slightly smaller than the outer diameter of the flange 22a, so that only the flange 22a contacts the fixing plate 28 when the plunger 18 moves up.

When the flange 22 a comes into contact with the fixing plate 28, the resilient spring mounted on the bolt 24 is compressed, and the slide plunger 22 is pressed down relatively to the plunger 18. Since the outer peripheral edge portion of the resin 26 is attached to the end surface of the slide plunger 22, the outer peripheral edge of the resin 26 is pushed by pushing down the slide plunger 22, and the resin 26 is separated from the end surface of the plunger 18. Fall. By raising the plunger 18 from the inside of the pot 16 to a position where the flange 22a contacts the fixing plate 28, the cured resin is taken out of the pot 16 and the vertical gate 20 and unnecessary resin 26 is removed from the plunger 18. Can be performed as a series of operations.

When the resin 26 is peeled from the plunger 18 and dropped, the resin receiver 30 is set to discharge the resin 26 to the outside. Plunger 18
During the operation of peeling and removing the resin 26 from the mold, an operation of opening the mold and taking out the molded product is performed. Then, when the article to be molded is newly set and the next resin molding operation becomes possible, the plunger 18 is lowered into the pot 16 again to proceed to the resin filling operation. When the contact between the fixing plate 28 and the flange 22a is released, a resilient spring attached to the bolt 24 makes the flange 22a and the protruding edge 19 come into contact with each other, so that the molten resin is automatically fed under pressure.

The resin molding apparatus of the above embodiment discharges unnecessary resin from the mold by raising and lowering the plunger 18 and removes the resin adhering to the plunger 18 as shown in FIG. FIG. 5 also shows another embodiment of the resin molding apparatus that performs the same operation by the raising and lowering operation of the plunger 18. In the resin molding apparatus of this embodiment, the plunger 18 is provided with a movable flange 32 movably in the reciprocating direction.
An ejector pin 34 is provided in the inside of the plunger 18 such that the ejector pin 34 is movable in the reciprocating direction of the plunger 18 and the tip of the plunger 18 can protrude from the pressing end face of the plunger 18.

The movable flange 32 is urged upward by a resilient spring 36 extrapolated to the ejector pin 34,
The upper position is regulated by contacting the stopper 38. When the movable flange 32 is in the upper position, the ejector pin 34 has a leading end located at a position retracted from the end face of the plunger 18, and the check groove 18 a extends from the retracted position to the end face of the plunger 18.

FIG. 4 shows a state in which the plunger 18 has entered the pot 16 and the cavity 16 has been filled with the molten resin in the pot 16. The resin is injected into the cavity 14 through the vertical gate 20 and slightly remains in the pot 16. After the resin is cured, the plunger 18 is raised, whereby the resin 26 adheres to the end face of the plunger 18 and is taken out. The plunger 18 is further raised, the upper surface of the movable flange 32 contacts the fixed plate 28, and the plunger 18 is further raised, whereby the movable flange 32 is pushed down against the resilient spring 36, and accordingly, the ejector is ejected. The pin 34 is pushed down.

Since the ejector pin 34 is in contact with the resin 26 at the tip of the check groove 18a, the resin 26 is peeled off from the end face of the plunger 18 by pushing down the ejector pin 34. FIG. 5 shows a state in which the ejector pins 34 protrude from the end face of the plunger 18 and peel the resin from the end face of the plunger 18. When the plunger 18 is lowered after the resin 26 is peeled off, the movable flange 32 is pushed up by the elastic force of the elastic spring 36, and the ejector pin 34 is retracted to the retracted position. Thus, the next resin filling operation by the plunger 18 becomes possible.

FIG. 6 shows still another embodiment of the resin molding apparatus. In this embodiment, the slide plunger 22 is slidably provided at the tip end of the plunger 16 as in the first embodiment. However, unlike the first embodiment, the entire slide plunger 22 is in the upper mold. It is configured to enter. At the position where the slide plunger 22 is pulled out, a locate ring 40 is fixed on the upper die, and a plunger guide ring 42 is further fixed. When the plunger 18 rises, the plunger guide ring 42 comes into contact with the peripheral edge of the flange of the slide plunger 22, and the resin 26 is transferred to the plunger 1 in the same manner as in the above embodiment.
8 is for peeling and removing from the end face of FIG.

FIG. 6 shows a state in which the resin is filled by the plunger 18 and a state in which the plunger 18 is moved to the upper position and the resin 26 is peeled off. From the side of the locate ring 40, a resin receiver for receiving the resin 26 dropped and dropped from the plunger 18 can be inserted.
A resin discharging operation is performed in accordance with the resin 26 removing operation.
Reference numeral 44 denotes an upper platen of the press. FIG. 6 shows a state in which the upper die, the plunger 16, the plunger guide ring 42, and the like are attached to the platen 44.

Each of the resin molding apparatuses of the above embodiments is of a type in which the cured resin in the pot is adhered to the plunger and discharged when the plunger 18 returns and moves, and the vertical gate type resin molding apparatus is used. It can be suitably applied to. In the present invention, the unnecessary resin is removed by using the movement of the plunger, so that the operation of removing the unnecessary resin can be performed easily and efficiently. In particular, since the plunger 18 is provided with the slide plunger 22 or the ejector pin 34 to positively peel off the resin 26, unnecessary resin can be reliably removed.

Further, since the resin 26 can be reliably removed by the slide plunger 22, the resin can be removed even if a check groove is provided on the pressing end surface of the plunger 18 as in the embodiment. It has become possible to improve the adhesiveness of the resin on the end face of the substrate and to surely discharge the unnecessary resin. The resin molding apparatus according to the present invention can be applied to a mold having a single pot or a mold having a plurality of pots. Further, the present invention can be similarly applied to a mold of a type in which a plurality of vertical gates are extended from one pot. In the case where a plurality of vertical gates are provided in one pot, it is possible to connect different vertical cavities to each vertical gate and fill a plurality of cavities at once with resin. Further, in the above-described embodiment, a resin molding apparatus using a vertical gate system has been described as an example of a resin molding apparatus that attaches and removes unnecessary resin to the plunger 18, but the same applies to a resin molding apparatus using extrusion molding other than the vertical gate system. Needless to say, it can be applied to

[0025]

According to the resin molding apparatus of the present invention, as described above, when the plunger is provided with the pressing body and the plunger moves, the pressing body comes into contact with the fixing member and the plunger is moved. By being configured to protrude, unnecessary resin adhered to and discharged from the plunger can be reliably removed, and the discharge of unnecessary resin can be automated, and efficient resin molding can be performed. It has a remarkable effect such as possible.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a state in which a cavity is filled with a resin in one embodiment of a resin molding apparatus.

FIG. 2 is an explanatory diagram of a state in which a resin is taken out by raising a plunger.

FIG. 3 is an explanatory view of a state in which unnecessary resin is peeled off from a plunger.

FIG. 4 is an explanatory view showing a state in which a cavity is filled with a resin in another embodiment of the resin molding apparatus.

FIG. 5 is an explanatory view of a state in which the plunger is raised to remove and remove unnecessary resin from the plunger.

FIG. 6 is an explanatory view showing still another embodiment of the resin molding apparatus.

FIG. 7 is an explanatory view showing a state in which a cavity is filled with a resin by a plunger in a conventional resin molding apparatus.

[Explanation of symbols]

 10a Upper cavity block 10b Lower cavity block 12a Upper chase block 12b Lower chase block 14 Cavity 16 Pot 18 Plunger 18a Check groove 19 Ridge 20 Vertical gate 22 Slide plunger 22a Flange 26 Resin 28 Fixing plate 32 Movable flange 34 Ejector pin 36 spring spring 38 stopper 40 locate ring 42 plunger guide ring 44 platen

Claims (3)

(57) [Claims] 1. A resin for pumping molten resin by a plunger to fill a cavity with a resin, curing the resin, pulling out the plunger from a pot, and adhering the cured resin to a pressing end surface of the plunger to discharge unnecessary resin. In the molding apparatus, the plunger is provided with a pushing body which is movable with respect to the plunger in the reciprocating direction and whose end surface can abut against a resin adhering to a pressing end surface of the plunger, and the plunger after filling with resin. Is provided on the drawer side that is pulled out of the pot, the pusher or the supporter of the pusher abuts to stop the movement of the pusher, and further the plunger moves to relatively move the pusher in plan. A resin fixing device provided with a fixing member for pushing in a direction in which the resin adhering to the pressing end surface of the jar is released. . 2. The resin molding apparatus according to claim 1, wherein a slide plunger that slides on an outer surface of a front end portion of the plunger on the pressing end side is provided as the pressing body. 3. The resin molding apparatus according to claim 1, wherein an ejector pin protruding from a pressing end face of the plunger is disposed in the plunger as the pressing body.