JP2022039812A - Resin molding device and manufacturing method of the resin molding - Google Patents

Abstract

To obtain a friction force between a pot and a plunger with high accuracy.SOLUTION: A resin molding device 100 that extrudes a resin material J housed in a pot 41a by a plunger 421, and infuses it into a cavity 2a, comprises an operation part 71 that operates a friction force F between the pot 41a and the plunger 421 on the basis of a first weight P1 applied to the plunger 421 when moving the plunger 421 to an extrusion direction and a second weight P2 applied to the plunger 421 when the plunger 421 is moved to the side opposite to the extrusion direction.SELECTED DRAWING: Figure 3

Description

The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product.

Conventionally, as shown in Patent Document 1, for example, in a semiconductor resin encapsulation device in which a resin in a pot is pressed by a plunger and injected into a cavity in a mold to form a resin, a load cell is installed under the plunger. A device is considered in which a device abnormality is determined and the device is controlled by measuring the sliding resistance force when the plunger is raised and comparing it with a predetermined sliding threshold value.

In Patent Document 1, when the force applied to the plunger is detected by the strain gauge, the sliding resistance force when the plunger is raised is measured and compared with a predetermined sliding threshold value, and the plunger is processed. Occasionally, the sliding resistance force is measured and compared with a predetermined sliding threshold value to determine the device abnormality and control the device.

Japanese Unexamined Patent Publication No. 11-260844

However, in the above-mentioned semiconductor resin encapsulation device, the sliding resistance values detected when the plunger is raised and lowered include not only the frictional force between the pot and the plunger but also other loads applied to the plunger. Is also included. That is, in the above-mentioned semiconductor resin encapsulation device, the frictional force between the pot and the plunger cannot be accurately obtained.

On the other hand, the inventor of the present application measures the load of the stopped plunger without accommodating the resin material in the pot, and measures the load of the plunger when the plunger is moved up and down with reference to the load, and then the pot and the I am thinking of a configuration that measures the frictional force with the plunger.

However, in this configuration, it was found that the frictional force obtained from the load when the plunger was raised and the frictional force obtained from the load when the plunger was lowered varied. This variation is considered to be caused by, for example, when the lowered plunger is stopped and used as a reference, the plunger receives an upward frictional force from the pot and is stopped. That is, since the plunger in the stopped state is not in the state where the frictional force is zero, it is considered that the frictional force cannot be accurately obtained even if it is used as a reference.

Therefore, the present invention has been made to solve the above-mentioned problems, and its main task is to obtain the frictional force between the pot and the plunger with high accuracy.

That is, the resin molding apparatus according to the present invention is a resin molding apparatus that pushes out the resin material contained in the pot by a plunger and injects it into the cavity, and is the first to join the plunger when the plunger is moved in the pushing direction. It is provided with a calculation unit that calculates the frictional force between the pot and the plunger based on the load and the second load applied to the plunger when the plunger is moved to the side opposite to the pushing direction. It is a feature.

Further, the method for producing a resin molded product according to the present invention is a method for producing a resin molded product using the above-mentioned resin molding apparatus.

According to the present invention configured as described above, the frictional force between the pot and the plunger can be accurately obtained.

It is a schematic diagram which shows the structure of the resin molding apparatus of one Embodiment which concerns on this invention. It is a schematic diagram which shows the structure of the molding module of the same embodiment. It is a schematic diagram which shows the structure for realizing the friction force measurement function of the same embodiment. It is a schematic diagram which shows the substrate mounting state and the resin material loading state of the molding module of the same embodiment. It is a schematic diagram which shows the mold clamping state of the molding module of the same embodiment. It is a schematic diagram which shows the resin injection state of the molding module of the same embodiment. It is a schematic diagram which shows the reference position X of the molding module of the same embodiment. It is a schematic diagram which shows the peeling state of the molding module of the same embodiment. It is a schematic diagram which shows the state at the time of starting the mold opening operation of the molding module of the same embodiment. It is a schematic diagram which shows the gate break operation during the mold opening operation of the molding module of the same embodiment. It is a schematic diagram which shows the state after the gate break during the mold opening operation of the molding module of the same embodiment. It is a schematic diagram which shows the mold opening state of the molding module of the same embodiment. It is a schematic diagram which shows the state in which each suction part of the unloader of the same embodiment is in contact with a resin molded product and unnecessary resin. It is a schematic diagram which shows the state which the unnecessary resin rises and the adsorption part for unnecessary resin shrinks in the same embodiment. It is a schematic diagram which shows the state which the unloader of the same embodiment adsorbs and carries out a resin molded product and unnecessary resin. It is a schematic diagram which shows (a) scraping position and (b) loading position in the scraping operation of the same embodiment. It is a schematic diagram which shows the measurement section of the 1st load P1 and the 2nd load P2 in the cleaning operation of the same embodiment.

Next, the present invention will be described in more detail with reference to examples. However, the present invention is not limited by the following description.

As described above, the resin molding apparatus of the present invention is a resin molding apparatus that pushes out the resin material contained in the pot by a plunger and injects it into the cavity, and joins the plunger when the plunger is moved in the pushing direction. (1) Provided with a calculation unit that calculates the frictional force between the pot and the plunger based on the load and the second load applied to the plunger when the plunger is moved to the side opposite to the pushing direction. It is characterized by.
With this resin molding device, the pot is based on the first load applied to the plunger when the plunger is moved in the pushing direction and the second load applied to the plunger when the plunger is moved in the direction opposite to the pushing direction. Since the frictional force between the machine and the plunger is calculated and the load of the plunger in the stopped state is not used as a reference, the frictional force between the pot and the plunger can be obtained accurately.

As a specific calculation method of the frictional force, it is conceivable that the calculation unit calculates the frictional force based on the maximum value of the first load and the minimum value of the second load.

As a more detailed method for calculating the frictional force, it is conceivable that the calculation unit calculates the frictional force based on the difference between the maximum value of the first load and the minimum value of the second load.

In order to accurately control the injection pressure of the resin material, it is desirable to provide an adjusting unit that adjusts the force for pushing out the resin material by the plunger by using the frictional force obtained by the calculation unit.

It is desirable to include a determination unit for determining whether or not the device can be operated based on the comparison result between the frictional force obtained by the calculation unit and the preset reference value.
With this configuration, for example, when it is determined that the device cannot be operated, the operation can be stopped at an appropriate timing to perform maintenance.

Some resin molding devices perform a cleaning operation of scraping the resin adhering to the inside of the pot to the outside of the pot using the plunger after the resin molding.
In this case, it is desirable that the calculation unit acquires the first load and the second load during the cleaning operation.
With this configuration, by utilizing the existing operation of the resin molding apparatus, it is not necessary to separately perform the operation for acquiring the first load and the second load.

Specifically, the cleaning operation is performed by moving the plunger between a predetermined scraping position and a loading position for accommodating the resin material.
In this cleaning operation, the calculation unit acquires the first load when moving the plunger from the loading position to the scraping position, and the second load when moving the plunger from the scraping position to the loading position. To get.

It is conceivable that the resin molding apparatus of the present invention performs edge gate type transfer molding. Specifically, the resin molding apparatus of the present invention includes a first mold in which the cavity is formed, a second mold facing the first mold and provided with a resin injection portion having the pot and the plunger. The resin injection portion is provided with a mold clamping mechanism for molding the first mold and the second mold, and the resin injection portion is provided so as to be able to advance and retreat with respect to the second mold via an elastic member in which the pot is formed. It is conceivable to include a pot block having an overhanging portion on the mold surface of the second type, and a transfer mechanism having the plunger and moving the plunger to inject the resin material from the pot into the cavity. Be done.

During the mold opening operation in which the mold clamping mechanism molds the first mold and the second mold, the transfer mechanism moves the plunger toward the first mold on the mold surface of the second mold. It is desirable to separate the resin molded product from the above and the unnecessary resin on the pot block.
With this configuration, the unnecessary resin on the pot block is pushed toward the first mold by the plunger, so that the resin molded product and the unnecessary resin can be reliably secured without increasing the elastic force of the elastic member that advances and retreats the pot block. Can be separated into. Further, since it is not necessary to increase the elastic force of the elastic member, it is not necessary to increase the size of the elastic member, and further, the size of the molding die and the size of the unnecessary resin are not increased.
In particular, in the present invention, since the frictional force between the pot and the plunger can be obtained with high accuracy, the force for pushing the unnecessary resin can be accurately controlled by the plunger, and the resin molded product and the unnecessary resin can be obtained by using the plunger. It is possible to reliably perform the operation of separating the.

The resin molding apparatus of the present invention includes a transport mechanism for carrying out unnecessary resin on the pot block after resin molding, and the transport mechanism has a suction portion for unnecessary resin for sucking the unnecessary resin. After the transport mechanism brings the unnecessary resin suction portion into contact with the unnecessary resin on the pot block, the transfer mechanism moves the plunger toward the first mold and peels the unnecessary resin from the pot block. After that, it is desirable that the transport mechanism adsorbs the unnecessary resin by the unnecessary resin adsorption portion and carries out the unnecessary resin.
With this configuration, after the unwanted resin adsorption part is brought into contact with the unwanted resin on the pot block, the plunger is moved toward the first mold to peel off the unwanted resin from the pot block, and then the unwanted resin is adsorbed. Since the unnecessary resin is adsorbed by the portion, the unnecessary resin on the pot block can be stably recovered.
Specifically, since the unnecessary resin is peeled off from the pot block by the plunger before the unnecessary resin is adsorbed by the unnecessary resin adsorption portion, even if the contact area between the unnecessary resin and the pot block is increased, the unnecessary resin is not required. Unnecessary resin adsorbed by the suction unit can be reliably recovered from the pot block. Further, when the unnecessary resin is peeled off from the pot block by the plunger, the unnecessary resin adsorption portion is in contact with the unnecessary resin, so that it is possible to prevent the adsorption failure caused by the unnecessary resin tilting on the pot block or the like. As a result, unnecessary resin on the pot block can be stably recovered.
In particular, in the present invention, since the frictional force between the pot and the plunger can be obtained accurately, the force for pushing the unnecessary resin can be accurately controlled by the plunger, and the unnecessary resin is peeled from the pot block by using the plunger. It is possible to surely perform the operation to be performed.

Further, a method for manufacturing a resin molded product using the above-mentioned resin molding apparatus is also one aspect of the present invention.

<One Embodiment of the present invention>
Hereinafter, an embodiment of the resin molding apparatus according to the present invention will be described with reference to the drawings. All of the figures shown below are schematically drawn by omitting or exaggerating them for the sake of clarity. The same components are designated by the same reference numerals and the description thereof will be omitted as appropriate.

<Overall configuration of resin molding equipment>
The resin molding apparatus 100 of the present embodiment resin-molds the molded object W1 to which the electronic component Wx is connected by transfer molding using the resin material J.

Here, the object to be molded W1 is, for example, a metal substrate, a resin substrate, a glass substrate, a ceramics substrate, a circuit board, a semiconductor substrate, a wiring board, a lead frame, or the like, regardless of the presence or absence of wiring. Further, the resin material J for resin molding is, for example, a composite material containing a thermosetting resin, and the form of the resin material J is granular, powdery, liquid, sheet-like, tablet-like, or the like. Further, the electronic component Wx connected to the upper surface of the object to be molded W1 is, for example, a bare chip or a resin-sealed chip.

Specifically, as shown in FIG. 1, the resin molding apparatus 100 includes a supply module 100A for supplying a molding target W1 before molding and a resin material J, a molding module 100B for resin molding, and a molding target W2 after molding. A storage module 100C for accommodating (hereinafter, resin molded product W2) is provided as a component. The supply module 100A, the molding module 100B, and the storage module 100C can be attached to and detached from each other and can be exchanged with each other with respect to other components. Further, each component can be increased, for example, the number of molding modules 100B may be two or three.

The supply module 100A receives the molding target W1 from the molding target supply unit 11 for supplying the molding target W1, the resin material supply unit 12 for supplying the resin material J, and the molding target W1 from the molding target supply unit 11, and the molding module 100B. A transport device 13 (hereinafter referred to as a loader 13) is provided, which transports the resin material J from the resin material supply unit 12 to the molding module 100B.

The loader 13 moves back and forth between the supply module 100A and the molding module 100B, and moves along a rail (not shown) provided between the supply module 100A and the molding module 100B.

As shown in FIG. 2, the molding module 100B faces the first mold 2 (hereinafter referred to as the upper mold 2), which is one of the molding molds in which the cavity 2a into which the resin material J is injected is formed, and the upper mold 2. The second mold 3 (hereinafter referred to as the lower mold 3), which is the other side of the molding mold provided with the resin injection portion 4 for injecting the resin material J into the cavity 2a, and the upper mold 2 and the lower mold 3 are molded. It has a mold clamping mechanism 5. The upper mold 2 is held by the upper mold holder 101, and the upper mold holder 101 is fixed to the upper platen 102. Further, the upper mold 2 is attached to the upper mold holder 101 via the upper mold base plate 103. The lower mold 3 is held by the lower mold holder 104, and the lower mold holder 104 is fixed to the movable platen 105 that moves up and down by the mold clamping mechanism 5. Further, the lower mold 3 is attached to the lower mold holder 104 via the lower mold base plate 106.

The resin injection unit 4 includes a pot block 41 in which a pot 41a for accommodating the resin material J is formed, and a transfer mechanism 42 having a plunger 421 provided in the pot 41a. The pot 41a is formed of, for example, a cylindrical member 410 having a cylindrical shape. The tubular member 410 is fitted into a through hole formed in the pot block 41.

The pot block 41 is elastically supported by an elastic member 43 so as to be able to move up and down with respect to the lower mold 3. That is, the pot block 41 is provided so as to be able to move up and down with respect to the lower mold 3 via the elastic member 43. The elastic member 43 is provided on the lower side of the pot block 41.

Further, at the upper end portion of the pot block 41, an overhanging portion 411 is formed overhanging on the mold surface which is the upper surface of the lower mold 3. Further, on the upper surface of the pot block 41, a cal portion 41b and a gate portion 41c, which serve as a resin flow path for introducing the resin material J injected from the pot 41a into the cavity 2a, are formed. Further, the overhanging portion 411 has the upper surface of the overhanging portion 411 in contact with the upper mold 2 in a state where the upper mold 2 and the lower mold 3 are molded, and the lower surface thereof places the molding object W1 between the mold surface of the lower mold 3 and the mold surface of the lower mold 3. It will be pinched.

The transfer mechanism 42 moves the plunger 421 in a state where the upper mold 2 and the lower mold 3 are molded, and injects the resin material J from the pot 41a into the cavity 2a. Specifically, the transfer mechanism 42 has a plunger 421 for pumping the resin material J heated and melted in the pot 41a, and a plunger driving unit 422 for driving the plunger 421.

The upper mold 2 is formed with a cavity 2a for accommodating the electronic component Wx of the object to be molded W1 and injecting the molten resin material J. Further, in the upper mold 2, a recess 2b is formed in a portion facing the pot block 41, and a runner portion 2c connecting the cal portion 41b and the gate portion 41c of the pot block 41 and the cavity 2a is formed. .. Although not shown, the upper mold 2 has an air vent formed on the opposite side of the pot block 41. Further, the runner portion 2c can be omitted, and the cal portion 41b and the cavity 2a can be directly connected via the gate portion 41c.

Further, the upper mold 2 is provided with a plurality of ejector pins 61 for releasing the molding object W2 after resin molding from the upper mold 2. These ejector pins 61 are provided so as to be able to move up and down with respect to the upper die 2 by penetrating the required points of the upper die 2, and are fixed to the ejector plate 62 provided on the upper side of the upper die 2. The ejector plate 62 is provided on the upper platen 102 or the like via the elastic member 63, and has a return pin 64. At the time of mold clamping, the return pin 64 comes into contact with the outside of the mounting area of the object W1 to be molded in the lower mold 3, so that the ejector plate 62 is raised with respect to the upper mold 2. As a result, the ejector pin 61 is retracted into the mold surface of the upper mold 2 at the time of mold clamping. On the other hand, at the time of mold opening, as the lower mold 3 descends, the ejector plate 62 descends with respect to the upper mold 2, and the ejector pin 61 pulls the resin molded product W2 from the upper mold 2 by the elastic force of the elastic member 63. Release the mold.

Then, when the upper mold 2 and the lower mold 3 are molded by the mold clamping mechanism 5, the resin flow path composed of the cal portion 41b, the gate portion 41c, the recess 2b and the runner portion 2c communicates the pot 41a and the cavity 2a ( See FIG. 4). Further, when the upper mold 2 and the lower mold 3 are molded, the pot side end portion of the object to be molded W1 is sandwiched between the lower surface of the overhanging portion 411 of the pot block 41 and the mold surface of the lower mold 3. When the resin material J melted by the plunger 421 is injected into the cavity 2a in this state, the electronic component Wx of the object to be molded W1 is resin-sealed.

As shown in FIG. 1, the storage module 100C includes a storage unit 14 for storing the resin molded product W2, and a transport device 15 (hereinafter, unloader 15) that receives the resin molded product W2 from the molding module 100B and transports the resin molded product W2 to the storage unit 14. ) And are provided.

The unloader 15 moves back and forth between the molding module 100B and the storage module 100C, and moves along a rail (not shown) provided between the molding module 100B and the storage module 100C.

<Friction force measurement function between pot 41a and plunger 421>
The resin molding apparatus 100 of the present embodiment has a function of measuring the frictional force (sliding resistance value) generated between the pot 41a and the plunger 421. The frictional force calculation and measurement function is exhibited by, for example, the control unit COM provided in the supply module 100A.

Specifically, as shown in FIG. 3, the resin molding apparatus 100 is provided with a force sensor PS for measuring the load applied to the plunger 421, and the pot 41a and the plunger 421 are provided by using the load obtained by the force sensor PS. The frictional force F between and is calculated.

In the present embodiment, a force sensor PS is provided between the plunger 421 and the plunger drive unit 422, and it is conceivable to use, for example, a tensile compression type load cell as the force sensor. In addition, as the force sensor PS, a weight sensor, a load sensor, or the like can also be used.

Further, the control unit COM has a calculation unit 71 for calculating the frictional force F between the pot 41a and the plunger 421 in a state where the resin material J is not housed in the pot 41a.

The calculation unit 71 moves the first load P1 applied to the plunger 421 when the plunger 421 is moved in the pushing direction (when the plunger 421 rises) and when the plunger 421 is moved in the direction opposite to the pushing direction (plunger 421). The second load P2 applied to the plunger 421 at the time of descent of 421 is acquired from the force sensor PS, and the frictional force F between the pot 41a and the plunger 421 is based on the acquired first load P1 and second load P2. Is calculated.

Specifically, the calculation unit 71 calculates the frictional force F based on the maximum value P1 _max of the first load P1 and the minimum value P2 _min of the second load P2.

Here, the maximum value P1 _max of the first load P1 is obtained from the frictional force (F) and the load (L) other than the frictional force (P1 _max = F + L). Here, since the plunger 421 is raised, the frictional force is a positive value.

Further, the minimum value P2 _min of the second load P2 is obtained from the frictional force (−F) and the load (L) other than the frictional force (P2 _min = −F + L). Here, since the plunger 421 is lowered, the frictional force is a negative value.

Then, the calculation unit 71 uses the following equation [1] to determine the frictional force based on the difference (P1 _max − P2 _min ) between the maximum value P1 _max of the first load P1 and the minimum value P2 _min of the second load P2. Calculate F.
P1 _max -P2 _min = (F + L)-(-F + L) = 2F
F = (P1 _max -P2 _min ) / 2 [1]
From the above, the frictional force F can be obtained. The timing of acquiring the first load P1 and the second load P2 and the timing of obtaining the frictional force F will be described later.

Then, the control unit COM includes an adjustment unit 72 that adjusts the force for pushing out the resin material J by the plunger 421 by using the frictional force F obtained by the calculation unit 71.

The adjusting unit 72 controls the plunger driving unit 422 so as to obtain a preset injection pressure by using the frictional force F obtained by the calculation unit 71. Thereby, the injection pressure of the resin material J can be controlled to a desired value regardless of the frictional force F. For example, when the set value of the injection pressure is set to P _set , the actual injection pressure becomes P _set −F under the influence of the frictional force F. Therefore, the adjusting unit 72 controls the plunger driving unit 422 so that the force pushed out by the plunger 421 is P _set + F in consideration of the frictional force F.

Further, the control unit COM includes a determination unit 73 for determining whether or not the device can be operated based on the comparison result between the frictional force F obtained by the calculation unit 71 and the preset reference value.

The determination unit 73 compares the frictional force F obtained by the calculation unit 71 with a preset reference value, and if the frictional force F is equal to or higher than the reference value, for example, issues an alarm for encouraging maintenance. , The resin molding apparatus 100 is stopped.

<Operation of resin molding apparatus 100>
The operation of the resin molding apparatus 100 will be briefly described with reference to FIGS. 4 to 15. Although FIGS. 4 to 15 show only one side (left side) of the pot block 41 and omit the other side (right side), the state of the other side in each figure is the same as the state of the one side. .. Further, in FIGS. 4 to 16, the force sensor PS is not shown. The following operations are performed, for example, by controlling each unit by the control unit COM provided in the supply module 100A.

As shown in FIG. 4, in a state where the upper mold 2 and the lower mold 3 are opened, the loader 13 conveys the object to be molded W1 before molding, passes it to the lower mold 3, and places it on the lower mold 3. At this time, the upper mold 2 and the lower mold 3 are heated to a temperature at which the resin material J can be melted and cured. After that, the resin material J is conveyed by the loader 13 and accommodated in the pot 41a of the pot block 41.

In this state, when the lower mold 3 is raised by the mold clamping mechanism 5, as shown in FIG. 5, the pot block 41 hits the upper mold 2 and descends with respect to the lower mold 3, and the lower surface of the overhanging portion 411 is the object of molding. Contact the pot side end of the object W1. Further, the lower surface of the upper die 2 comes into contact with the outer peripheral portion of the molded object W1 to which the overhanging portion 411 does not contact. As a result, the upper mold 2 and the lower mold 3 are molded. When the transfer mechanism 42 raises the plunger 421 by the plunger drive unit 422 after this mold clamping, as shown in FIG. 6, the molten resin material J in the pot 41a is injected into the cavity 2a through the resin passage. Then, after a predetermined molding time elapses and the resin material J is cured in the cavity 2a, the mold clamping mechanism 5 opens the upper mold 2 and the lower mold 3.

Here, the resin molding apparatus 100 of the present embodiment has an operation (gate) of separating the resin molded product W2 and the unnecessary resin K during the mold opening operation in which the mold clamping mechanism 5 opens the upper mold 2 and the lower mold 3. Break operation). The unnecessary resin K is a resin that remains on the pot block 41 and is cured.

For example, immediately before the above-mentioned molding time elapses (before the start of the mold opening operation), the transfer mechanism 42 sets the force by which the plunger 421 pushes the unnecessary resin K to a predetermined value (for example, the plunger 421) as shown in FIG. The force is reduced to a relatively small value so that the contact state can be maintained without peeling from the unnecessary resin K). Here, since the frictional force F between the pot 41a and the plunger 421 is accurately obtained by the calculation unit 71, the force with which the plunger 421 pushes the unnecessary resin K can be controlled with high accuracy. The force pushed by the plunger 421 is measured by the force sensor PS.

Then, the control unit COM stores the position of the plunger 421 when the force reaches the predetermined value as the reference position X (see FIG. 7). This reference position X is a position that serves as a reference for the gate break operation and the mold release / recovery of the unnecessary resin K, which will be described later. The reference position X is not limited to the position of the plunger 421, and may be the position of other members such as the drive shaft (transfer shaft) of the plunger drive unit 422 connected to the plunger 421.

Then, before the start of the mold opening operation, the transfer mechanism 42 lowers the plunger 421 to the side opposite to the upper mold 2 and lowers it to a predetermined peeling position Y, as shown in FIG. By pulling the plunger 421 down to the peeling position Y, the upper surface of the plunger 421 and the lower surface of the unnecessary resin K are peeled off. After this peeling operation, the transfer mechanism 42 raises the plunger 421 to the above-mentioned reference position X. At this time, the upper surface of the plunger 421 comes into contact with the lower surface of the unnecessary resin K (state in FIG. 7).

Next, as shown in FIG. 9, the mold clamping mechanism 5 starts lowering the lower mold 3 to start the mold opening operation. As shown in FIG. 10, at the timing when the mold clamping mechanism 5 starts the mold opening operation and the clamping force drops to a predetermined value (different from the predetermined value in the transfer mechanism 42 described above), the transfer mechanism 42 is a plunger. Raise 421 toward the upper mold 2. As a result, the unnecessary resin K on the pot block 41 is pushed toward the upper mold 2 by the plunger 421. The clamping force is measured by a force sensor (including a weight sensor, a load sensor, etc.) such as a load cell (not shown) provided on the clamp shaft or the like of the mold clamping mechanism 5.

Further, when the transfer mechanism 42 raises the plunger 421 toward the upper die 2, the pot block 41 receives an elastic force which is a restoring force of the compressed elastic member 43 as shown in FIG. 10, and the lower die. It rises from 3 toward the upper mold 2. That is, during the mold opening operation, the pot block 41 rises from the lower mold 3 toward the upper mold 2 due to the elastic force of the elastic member 43, and at the same time, the transfer mechanism 42 moves the plunger 421 from the lower mold 3 to the upper mold 2. It will be raised toward 2.

During the mold opening operation, the pot block 41 starts to rise from the lower mold 3 toward the upper mold 2 due to the elastic force of the elastic member 43, and the transfer mechanism 42 raises the plunger 421 from the lower mold 3. It may or may not coincide with the timing at which the ascent starts toward the mold 2.

As shown in FIG. 11, the resin molded product W2 on the mold surface of the lower mold 3 and the pot block 41 are on the pot block 41 due to the rise of the plunger 421 by the transfer mechanism 42 and the rise of the pot block 41 by the elastic force of the elastic member 43. The unnecessary resin K is separated (gate break).

At this time, the resin molded product W2 on the lower mold 3 is pressed toward the mold surface of the lower mold 3 by the ejector pin 61 provided on the upper mold 2, and the lower surface of the resin molded product W2 is the lower mold 3. It is in close contact with the mold surface of No. 10 (see FIG. 10). The ejector pin 61 functions as a pressing member that presses the resin molded product W2 against the mold surface of the lower mold 3 when separating the resin molded product W2 and the unnecessary resin K. Since the resin molded product W2 is pressed against the mold surface of the lower mold 3 by the pressing member in this way, shear stress is likely to be applied between the resin molded product W2 and the unnecessary resin K, and gate break is likely to occur.

Here, the ejector pin 61, which is a pressing member, presses the resin molded product W2 toward the mold surface of the lower mold 3 at least until the resin molded product W2 and the unnecessary resin K are separated. In other words, during the mold opening operation, while the ejector pin 61 is pressing the resin molded product W2, the resin molded product W2 and the unnecessary resin K are separated by the above-mentioned raising of the pot block 41 and the raising of the plunger 421. Is completed.

During the above gate break, the unnecessary resin K is sandwiched between the upper surface of the pot block 41 pushed upward by the elastic force of the elastic member 43 and the lower surface of the upper mold 2 (FIGS. 10 and 11). reference). That is, the pot block 41 is in a state where the unnecessary resin K is sandwiched between the pot block 41 and the upper mold 2 by the elastic force of the elastic member 43 in a predetermined period from the start of the mold opening operation. The predetermined period is a period including at least until the gate break is completed, and the lower mold 3 is in the initial state where the elastic member 43 is restored (the state before being pushed and compressed by the upper mold 2). Is the period until.

Then, after a lapse of a predetermined period, that is, when the mold clamping mechanism 5 further lowers the lower mold 3, as shown in FIG. 12, the pot block 41 holds the unnecessary resin K and the unnecessary resin K is transferred to the upper mold 2. Peel off from. Here, since the cal portion 41b and the gate portion 41c are formed in the pot block 41, the contact area between the pot block 41 and the unnecessary resin K is larger than the contact area between the upper mold 2 and the unnecessary resin K. The unnecessary resin K is peeled from the upper mold 2 without peeling from the pot block 41. This makes it possible to eliminate the need for an ejector pin for contacting the unnecessary resin K and peeling the unnecessary resin K from the upper mold 2.

Further, as the transfer mechanism 42 raises the plunger 421 toward the upper mold 2, the overhanging portion 411 of the pot block 41 sandwiches the resin molded product W2 with the mold surface of the lower mold 3. It is in a non-contact state with the resin molded product W2.

Apart from the above gate break, the transfer mechanism 42 raises the plunger 421 toward the upper mold 2 until the elastic member 43 on the lower side of the pot block 41 is in the initial state before the restored mold clamping. See FIG. 12). As a result, in the next resin molding, the overhanging portion 411 does not get in the way when the molding target W1 is placed under the overhanging portion 411.

After performing the mold opening operation as described above to separate the resin molded product W2 and the unnecessary resin K, the resin molded product W2 and the unnecessary resin K are carried out by the unloader 15.

As shown in FIG. 13, the unloader 15 has a suction portion 15a for a molded product and a suction portion 15b for an unnecessary resin. Both the adsorption unit 15a for molded products and the adsorption unit 15b for unnecessary resin are composed of adsorption pads made of resin. In particular, the adsorption unit 15b for unnecessary resin is of a bellows type, for example, from the adsorption unit 15a for molded products. Is also excellent in elasticity. Further, the suction portion 15a for the molded product and the suction portion 15b for the unnecessary resin are provided on the base member 151 and are connected to a suction source (not shown). Further, at least the suction portion 15a for a molded product is configured to be movable in the left-right direction and the up-down direction with respect to the base member 151. Further, the unloader 15 is provided with a holding claw 152 for holding the resin molded product W2 adsorbed by the adsorbed portion 15a for the molded product.

After the mold opening operation described above is completed, the unloader 15 is inserted between the upper mold 2 and the lower mold 3. Then, as shown in FIG. 13, the adsorption portion 15a for the molded product is brought into contact with the upper surface of the resin molded product W2, and the adsorption portion 15b for the unnecessary resin is brought into contact with the upper surface of the unnecessary resin K.

In this state, as shown in FIG. 14, the transfer mechanism 42 raises the plunger 421 to lift the unnecessary resin K from the pot block 41. Here, when the unnecessary resin K has the remaining portion K1 remaining in the pot 41a, the remaining portion K1 is raised to such an extent that it does not interfere with the recovery of the unnecessary resin K. As a result, the unnecessary resin K is released from the pot block 41 and comes into close contact with the unnecessary resin adsorption portion 15b. At this time, the adsorption portion 15b for unnecessary resin is in a state of being elastically deformed and shrunk. Here, since the frictional force F between the pot 41a and the plunger 421 is accurately obtained by the calculation unit 71, the force for pushing the unnecessary resin K can be accurately controlled by the plunger 421.

After the unnecessary resin adsorbing portion 15b is brought into a shrunk state, the unnecessary resin adsorbing portion 15b is started to be adsorbed, and the unnecessary resin K is adsorbed to the unnecessary resin adsorbing portion 15b. Further, the adsorption of the molded product suction portion 15a is started, and the resin molded product W2 is adsorbed on the molded product suction portion 15a.

Then, as shown in FIG. 15, the suction portion 15a for the molded product that has adsorbed the resin molded product W2 is moved in the direction away from the pot block 41, and the resin molded product W2 is moved to the outside of the overhanging portion 411. Then, after raising the unloader 15, it exits from the upper mold 2 and the lower mold 3. As a result, the unloader 15 carries out the resin molded product W2 and the unnecessary resin K.

Here, some unloaders 15 have a cleaning mechanism (not shown) for cleaning the upper mold 2 and the lower mold 3. As the cleaning mechanism, a rotating brush and a suction unit that sucks and discharges dust can be considered.

In this case, the unloader 15 adsorbing the resin molded product W2 and the unnecessary resin K stays between the upper mold 2 and the lower mold 3 and performs a cleaning operation. Further, during this cleaning operation, the control unit COM exerts a frictional force calculation function.

Here, first, the transfer mechanism 42 performs an operation of scraping out the resin adhering to the inside of the pot 41a. That is, as shown in FIG. 16, the transfer mechanism 42 raises the plunger 421 to a predetermined scraping position. Here, the predetermined scraping position is, for example, a position where the upper surface of the plunger 421 is above the opening position of the pot 41a.

Then, the transfer mechanism 42 lowers the transfer mechanism 42 from a predetermined scraping position to a loading position for accommodating the resin material J. As shown in FIG. 17, in the descending operation (section a) in which the plunger 421 is lowered from the scraped position to the load position, the arithmetic unit 71 acquires the second load P2 from the force sensor PS such as the load cell.

After that, the transfer mechanism 42 raises the plunger 421 to a predetermined scraping position again. As a result, the resin adhering to the inside of the pot is scraped out of the pot 41a. As shown in FIG. 17, in the ascending operation (section b) in which the plunger 421 is raised from the scraped position from the load position, the arithmetic unit 71 acquires the first load P1 from the force sensor PS such as the load cell.

After that, the upper die 2, the lower die 3, the pot block 41 and the plunger 421 are cleaned by the cleaning mechanism provided in the unloader 15. Further, the calculation unit 71 uses the minimum value P2 _min of the second load P2 acquired in the section a and the maximum value P1 _max of the first load acquired in the section b, and the frictional force F is calculated by the above equation [1]. Is calculated.

In the cleaning operation, the lowering operation of lowering from the scraping position to the loading position and the ascending operation of raising from the loading position to the scraping position may be performed a plurality of times.

Further, when the lowering operation and the ascending operation of the plunger 421 are performed a plurality of times, the second load P2 is acquired in each of the descending operation (section a), and the first load P1 is applied in each of the ascending operation (section b). You may get it. In this case, the minimum value P2 _min of the acquired plurality of second loads P2 is averaged, the maximum value P1 _max of the acquired plurality of first loads P1 is averaged, and the frictional force F is calculated by the above equation [1]. It is conceivable to do. Further, the frictional force F is calculated by the above-mentioned equation [1] using the minimum value P2 _min of one second load P2 and the maximum value P1 _max of one first load P1, and the plurality obtained by this calculation. The frictional force F of the above may be averaged. In addition, when the frictional force F obtained by one vertical movement is equal to or higher than a predetermined value, it may be configured to determine whether or not to further move the plunger 421 up and down.

After the above cleaning operation is completed, the unloader 15 exits from the upper mold 2 and the lower mold 3 to carry out the resin molded product W2 and the unnecessary resin K.

Further, the frictional force F calculated by the calculation unit 71 in the cleaning operation is transmitted to the adjustment unit 72. Then, in the next resin molding, the adjusting unit 72 controls the plunger driving unit 422 so that the injection pressure of the resin material J becomes a predetermined set value by using the calculated frictional force F.

Further, the frictional force F calculated by the calculation unit 71 in the cleaning operation is transmitted to the determination unit 73. Then, the determination unit 73 compares the calculated frictional force F with the preset reference value, and if the frictional force is equal to or higher than the reference value, for example, issues an alarm for urging maintenance or a resin molding apparatus. Stop 100.

<Effect of this embodiment>
According to the resin molding apparatus 100 of the present embodiment, the pot 41a and the plunger 412 are based on the first load P1 applied to the plunger 421 when the plunger 421 is raised and the second load P2 applied to the plunger 421 when the plunger 421 is lowered. Since the frictional force F between the two is calculated and the load of the plunger in the stopped state is not used as a reference, the frictional force F between the pot 41a and the plunger 421 can be accurately obtained.

Further, since the first load P1 and the second load P2 are acquired during the cleaning operation after the resin molding, the existing operation of the resin molding apparatus 100 can be used, and the first load P1 and the second load P2 can be used. There is no need to perform a separate operation to acquire.

<Other modified embodiments>
The present invention is not limited to the above embodiment.

In the above embodiment, the first load P1 and the second load P2 are acquired during the cleaning operation to calculate the frictional force F, but the first load P1 and the second load P2 are applied at a timing other than the cleaning operation. It may be configured to acquire and calculate the frictional force F. For example, before the resin material J is housed in the pot 41a, the plunger 421 may be moved up and down to acquire the first load P1 and the second load P2, and the frictional force F may be calculated.

Further, the range for raising and lowering the plunger 421 is not limited to between the scraping position and the loading position as in the above embodiment, and is appropriately set such as between the injection completion position where the injection of the resin material J is completed and the loading position. It is possible.

Further, the calculation unit 71 of the embodiment obtains the frictional force F using the maximum value P1 _max of the first load P1 and the minimum value P2 _min of the second load P2, but the maximum value in the first load P1. The frictional force F may be obtained by using a value other than P1 _max and a value other than the minimum value P2 _min in the second load P2. Further, the frictional force F may be obtained by using the average value of the section a of the first load P1 and the average value of the section b of the second load P2.

In the resin molding apparatus of the above embodiment, the pot block 41 has an overhanging portion 411 to perform edge gate type transfer molding, but a side gate type transfer molding may be performed.

The resin molding apparatus of the present invention is not limited to ordinary transfer molding, and may have a configuration provided with a transfer mechanism.

In addition, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications can be made without departing from the spirit of the present invention.

100 ・ ・ ・ Resin molding device W1 ・ ・ ・ Molding object J ・ ・ ・ Resin material W2 ・ ・ ・ Resin molded product K ・ ・ ・ Unnecessary resin 2 ・ ・ ・ First type (upper mold)
2a ・ ・ ・ Cavity 3 ・ ・ ・ Second type (lower type)
4 ・ ・ ・ Resin injection part 41 ・ ・ ・ Pot block 41a ・ ・ ・ Pot 411 ・ ・ ・ Overhanging part 42 ・ ・ ・ Transfer mechanism 421 ・ ・ ・ Plunger 43 ・ ・ ・ Elastic member 5 ・ ・ ・ Mold tightening mechanism 15 ・・ ・ Transfer mechanism 15b ・ ・ ・ Adsorption unit for unnecessary resin 71 ・ ・ ・ Calculation unit 72 ・ ・ ・ Adjustment unit 73 ・ ・ ・ Judgment unit

Claims (11)

A resin molding device that extrudes a resin material contained in a pot with a plunger and injects it into a cavity.
The pot and the above based on a first load applied to the plunger when the plunger is moved in the pushing direction and a second load applied to the plunger when the plunger is moved in the direction opposite to the pushing direction. A resin molding device equipped with a calculation unit that calculates the frictional force between the plunger and the plunger. The resin molding apparatus according to claim 1, wherein the calculation unit calculates the frictional force based on the maximum value of the first load and the minimum value of the second load. The resin molding apparatus according to claim 1 or 2, wherein the calculation unit calculates the frictional force based on the difference between the maximum value of the first load and the minimum value of the second load. The resin molding apparatus according to any one of claims 1 to 3, further comprising an adjusting unit for adjusting a force for pushing out the resin material by the plunger by using the frictional force obtained by the calculation unit. The resin according to any one of claims 1 to 4, further comprising a determination unit for determining whether or not the device can be operated based on a comparison result between the frictional force obtained by the calculation unit and a preset reference value. Molding equipment. A cleaning operation is performed in which the resin adhering to the inside of the pot is scraped out of the pot by using the plunger.
The resin molding apparatus according to any one of claims 1 to 5, wherein the calculation unit acquires the first load and the second load during the cleaning operation. The cleaning operation is performed by moving the plunger between a predetermined scraping position and a loading position for accommodating the resin material.
The calculation unit acquires the first load when the plunger is moved from the load position to the scraping position, and acquires the second load when the plunger is moved from the scraping position to the loading position. Item 6. The resin molding apparatus according to Item 6. The first type in which the cavity was formed and
A second mold facing the first mold and provided with a resin injection portion having the pot and the plunger.
It is provided with a mold clamping mechanism for molding the first mold and the second mold.
The resin injection part is
A pot block in which the pot is formed, is provided so as to be able to move forward and backward with respect to the second mold via an elastic member, and has an overhanging portion overhanging on the mold surface of the second mold.
The resin molding apparatus according to any one of claims 1 to 7, further comprising a transfer mechanism having the plunger and moving the plunger to inject the resin material from the pot into the cavity. During the mold opening operation in which the mold clamping mechanism molds the first mold and the second mold, the transfer mechanism moves the plunger toward the first mold on the mold surface of the second mold. The resin molding apparatus according to claim 8, wherein the resin molded product of the above and the unnecessary resin on the pot block are separated. Equipped with a transport mechanism to carry out unnecessary resin on the pot block after resin molding.
The transport mechanism has an unnecessary resin adsorbing portion for adsorbing the unnecessary resin.
After the transport mechanism brings the unnecessary resin adsorption portion into contact with the unnecessary resin on the pot block, the transfer mechanism moves the plunger toward the first mold and peels the unnecessary resin from the pot block. The resin molding apparatus according to claim 8 or 9, wherein the transport mechanism adsorbs the unnecessary resin by the unnecessary resin adsorbing portion and carries out the unnecessary resin. A method for manufacturing a resin molded product using the resin molding apparatus according to any one of claims 1 to 10.

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