JPH0794541A - Resin sealing system for semiconductor - Google Patents
Resin sealing system for semiconductorInfo
- Publication number
- JPH0794541A JPH0794541A JP5239428A JP23942893A JPH0794541A JP H0794541 A JPH0794541 A JP H0794541A JP 5239428 A JP5239428 A JP 5239428A JP 23942893 A JP23942893 A JP 23942893A JP H0794541 A JPH0794541 A JP H0794541A
- Authority
- JP
- Japan
- Prior art keywords
- plunger
- resin
- pot
- frictional resistance
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体樹脂封止装置で
プランジャと金型ポットの摩擦抵抗力を検出し常に一定
注入圧力にすると共に、プランジャ交換タイミング，ク
リーニング動作を自動的に換える半導体樹脂封止装置に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor resin encapsulation device which detects the frictional resistance between a plunger and a mold pot to constantly maintain a constant injection pressure, and automatically changes the plunger replacement timing and cleaning operation. The present invention relates to a sealing device.
【０００２】[0002]
【従来の技術】半導体樹脂封止装置は、金型内のポット
に樹脂が投入され、プランジャがモータ等の駆動源によ
って上下動させられ、樹脂がカル・ランナを通って注入
される。この時の注入圧力の制御は圧力検出器によって
得られる圧力が常に設定圧力になるように制御したり、
油圧などにより設定圧力以下で注入するようになってい
る。又、プランジャとポットとの摩擦抵抗力を測定する
手段がないため、プランジャやポットの交換タイミング
などは生産ショット数などで決められている。さらに注
入圧力の設定はプランジャとポットとの摩擦抵抗力をあ
る程度見込んだ値に設定されている。2. Description of the Related Art In a semiconductor resin encapsulation apparatus, resin is poured into a pot in a mold, a plunger is moved up and down by a driving source such as a motor, and the resin is injected through a cull runner. The injection pressure at this time is controlled so that the pressure obtained by the pressure detector is always the set pressure,
It is designed to inject below the set pressure by hydraulic pressure. Further, since there is no means for measuring the frictional resistance force between the plunger and the pot, the timing of exchanging the plunger and the pot is determined by the number of production shots. Further, the injection pressure is set to a value that allows for the frictional resistance between the plunger and the pot to some extent.
【０００３】[0003]
【発明が解決しようとする課題】ところが、金型のポッ
トとプランジャとの摩耗抵抗はポットとプランジャのク
リアランスや摩耗状態により変化する。また、ポットと
プランジャとの間に入る樹脂滓の量などにも影響を受け
るため常時一定とはならない。従って注入圧力を常時一
定にしていると、カル・ランナに加わる実際の圧力は注
入圧力から摩擦抵抗を引いた値になるため、ポットとプ
ランジャとのクリアランスや摩耗状態並びに樹脂滓の状
態によって変化する。そのため従来の装置ではカル・ラ
ンナにかかる圧力が変動し、場合によっては注入圧力が
摩擦抵抗力に殆ど消費され、カル・ランナには圧力が加
わらず、巣が発生する等の品質問題が発生することがあ
った。However, the abrasion resistance between the pot and the plunger of the mold changes depending on the clearance between the pot and the plunger and the abrasion state. Further, it is not always constant because it is affected by the amount of resin slag entering between the pot and the plunger. Therefore, if the injection pressure is always constant, the actual pressure applied to the cal / runner will be the injection pressure minus the frictional resistance, and will change depending on the clearance between the pot and the plunger, the state of wear and the state of the resin slag. . Therefore, in the conventional device, the pressure applied to the cull runner fluctuates, and in some cases, the injection pressure is almost consumed by the frictional resistance force, the pressure is not applied to the cull runner, and quality problems such as nest formation occur. There was an occasion.
【０００４】半導体の封止に使用される樹脂は一般にエ
ポキシ系であるため、ポットやプランジャは相当摩耗さ
れ一定期間使用後は交換しなけければならない。従来こ
の交換タイミングを検出する手段がなかったため、生産
ショット数により定期的に交換するのが一般的であっ
た。しかし、ポットとプランジャの摩耗は部品の出来具
合に大きく左右されるため、あるものでは交換タイミン
グが遅くなって品質問題が発生する。また、あるもので
はまだ十分使用できるのにポットとプランジャを交換す
るという不具合が発生していた。Since the resin used for sealing a semiconductor is generally an epoxy resin, the pot and the plunger are considerably worn and must be replaced after a certain period of use. Conventionally, since there is no means for detecting the replacement timing, it is common to replace it periodically according to the number of production shots. However, the wear of the pot and the plunger largely depends on the quality of the parts, and therefore, the replacement timing of some of them is delayed, which causes a quality problem. In addition, there was a problem in that the pot and the plunger were exchanged although some of them were still usable.
【０００５】更に、ポットとプランジャとの間に入った
樹脂滓を取除く作業は通常の作業の中でも行われるが、
完全に取除くことはできず少しずつ蓄積されていく。こ
の残った樹脂滓がポットとプランジャとの摩耗を加速す
るため、ある程度樹脂滓が留った所でポットとプランジ
ャとのクリーニングを十分行わなければならないが、従
来ではどの時点において行ったら良いのか分かからない
という問題があった。Further, the work of removing the resin slag that has entered between the pot and the plunger is carried out during normal work.
It cannot be completely removed, and it accumulates little by little. Since the remaining resin slag accelerates the wear of the pot and the plunger, it is necessary to sufficiently clean the pot and the plunger when the resin slag remains to some extent, but in the past, at what time should it be done? There was a problem that it would not take.
【０００６】そこで、本発明の目的はポットとプランジ
ャとの摩擦抵抗を検出し、樹脂がカル・ランナに注入さ
れる時の注入圧力が常に一定になるようにする。摩擦抵
抗力よりポットとプランジャとの交換タイミングを検出
する。摩擦抵抗力によりポットとプランジャとの間に入
った樹脂滓を取除くクリーニング動作を自動的に替える
半導体樹脂封止装置を提供することにある。Therefore, an object of the present invention is to detect the frictional resistance between the pot and the plunger so that the injection pressure when the resin is injected into the cal runner is always constant. The timing of replacing the pot with the plunger is detected from the frictional resistance. It is an object of the present invention to provide a semiconductor resin sealing device that automatically changes the cleaning operation for removing the resin slag that has entered between the pot and the plunger by the frictional resistance force.
【０００７】[0007]
【課題を解決するための手段】本発明の半導体樹脂封止
装置は、駆動源によってプランジャが樹脂を注入する時
以外で上下動する時、即ちプランジャが空動作する時、
ポットとプランジャとの間に発生する摩擦抵抗力を検出
する圧力検出器とこの圧力検出器からの検出圧力信号を
受けると共に駆動源に駆動信号を出す制御部とを有する
ことに特徴を有する。The semiconductor resin encapsulation device of the present invention, when the plunger moves up and down except when the resin is injected by the drive source, that is, when the plunger is idle,
It is characterized by having a pressure detector that detects a frictional resistance force generated between the pot and the plunger, and a control unit that receives a pressure signal detected from the pressure detector and outputs a drive signal to a drive source.
【０００８】[0008]
【作用】本発明の半導体樹脂封止装置によれば、ポット
２とプランジャ４との間に発生する摩擦抵抗力をプラン
ジャ４が空動作する時に圧力検出器７で測定し、プラン
ジャ４が樹脂３を押し上げてカル・ランナ６を通って注
入する時の注入圧力が摩擦抵抗力＋設定注入圧力とする
ことにより、ポット２とプランジャ４の摩擦抵抗力に関
係なく一定の注入圧力のもとに半導体を樹脂封止するこ
とができる。また、ポット２とプランジャ４の摩耗が進
んで樹脂滓が入り込んで摩擦抵抗が増大し、この摩擦抵
抗力を設定注入圧力との合計が駆動源５の出力と等しく
なった時がポット２とプランジャ４の交換タイミングで
あるため、摩擦抵抗力を測定することによりポット２と
プランジャ４の交換タイミングを知ることができる。According to the semiconductor resin sealing device of the present invention, the frictional resistance generated between the pot 2 and the plunger 4 is measured by the pressure detector 7 when the plunger 4 is idle, and the plunger 4 makes the resin 3 The injection pressure when pushing up and injecting through the cull runner 6 is equal to the frictional resistance force + the set injection pressure, so that the semiconductor is kept under a constant injection pressure regardless of the frictional resistance force of the pot 2 and the plunger 4. Can be resin-sealed. Further, the abrasion of the pot 2 and the plunger 4 progresses, the resin slag enters and the frictional resistance increases, and when the total of this frictional resistance force and the set injection pressure becomes equal to the output of the drive source 5, the pot 2 and the plunger 4 Since it is the replacement timing of 4, the replacement timing of the pot 2 and the plunger 4 can be known by measuring the frictional resistance force.
【０００９】更に、連続運転の中でポット２とプランジ
ャ４のクリーニング動作は行われるが、少しずつ樹脂滓
がポット２とプランジャ４との間に入り込んでいき、ポ
ット２とプランジャ４との摩擦抵抗が大きくなってく
る。この摩擦抵抗値が初期値よりある程度大きくなった
らクリーニング動作を十分に行い、樹脂滓による摩擦抵
抗力を小さく抑えると共に、樹脂滓によるポット２とプ
ランジャ４の摩耗も低く抑えることができる。Further, the cleaning operation of the pot 2 and the plunger 4 is performed during the continuous operation, but the resin slag gradually enters between the pot 2 and the plunger 4, and the frictional resistance between the pot 2 and the plunger 4 is gradually increased. Is getting bigger. When the frictional resistance value becomes larger than the initial value to some extent, the cleaning operation is sufficiently performed to suppress the frictional resistance force due to the resin slag to be small, and the abrasion of the pot 2 and the plunger 4 due to the resin slag can be suppressed to be low.
【００１０】[0010]
【実施例】以下本発明の一実施例について図１を参照し
て説明する。まず、４はプランジャで、圧力検出圧器７
を介して駆動源５に接続されており、この駆動源５によ
って上下に移動させられるようになっている。１は半導
体を樹脂封止するための金型で、この金型１にはカル・
ランナ６があり、ポット２内を上下動するプランジャ４
により樹脂３がカル・ランナ６を通って半導体が樹脂封
止される。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG. First, 4 is a plunger, which is a pressure detecting pressure device 7.
It is connected to the driving source 5 via the, and can be moved up and down by the driving source 5. 1 is a mold for resin-sealing a semiconductor.
There is a runner 6 and the plunger 4 moves up and down in the pot 2.
As a result, the resin 3 passes through the cull runner 6 and the semiconductor is resin-sealed.
【００１１】この時の注入圧制御は制御部８によって行
われ、圧力検出器７から得られる検出圧力が所定の圧力
になるように駆動源５を駆動するようになっている。ま
た、図２ではプランジャ４の動作位置を示しており、Ｐ
１は樹脂投入位置でプランジャ４がこの位置にいる時に
樹脂３が投入される。Ｐ２はクリーニング位置で、プラ
ンジャ４の金型１より出張った部分と金型１の表面が図
示されていないクリーニング機構によってクリーニング
される。The injection pressure control at this time is performed by the control unit 8 so that the drive source 5 is driven so that the detected pressure obtained from the pressure detector 7 becomes a predetermined pressure. Further, FIG. 2 shows the operating position of the plunger 4, and P
1 is a resin feeding position, and the resin 3 is fed when the plunger 4 is in this position. P2 is a cleaning position, and the portion of the plunger 4 that has traveled from the mold 1 and the surface of the mold 1 are cleaned by a cleaning mechanism (not shown).
【００１２】Ｐ３は樹脂投入位置Ｐ１より下の位置で、
ポット２の樹脂投入位置Ｐ２より下側に入り込んだ樹脂
滓を、プランジャ４で掻き出すための樹脂滓除去下位置
である。Ｐ４は樹脂投入位置Ｐ２より上の位置で、プラ
ンジャ４の周囲についた樹脂滓をプランジャ４の下降動
作時、ポット２の金型１表面部で掻き落す樹脂滓除去上
位置である。P3 is a position below the resin feeding position P1,
This is a resin slag removal lower position for scraping the resin slag that has entered below the resin input position P2 of the pot 2 with the plunger 4. P4 is a position above the resin feeding position P2, and is a resin slag removal upper position where the resin slag around the plunger 4 is scraped off by the surface of the mold 1 of the pot 2 when the plunger 4 is lowered.
【００１３】半導体樹脂封止装置においては、プランジ
ャ４によって樹脂３を注入する成型サイクルと、成型後
に樹脂投入位置Ｐ１とクリーニング位置Ｐ２との間を往
復動作にするクリーニングサイクルとに分かれる。この
クリーニングサイクル時に圧力検出器７で検出される力
は、ポット２とプランジャ４の摩擦抵抗力である。The semiconductor resin sealing device is divided into a molding cycle in which the resin 3 is injected by the plunger 4 and a cleaning cycle in which the resin injection position P1 and the cleaning position P2 are reciprocated after molding. The force detected by the pressure detector 7 during this cleaning cycle is the frictional resistance force between the pot 2 and the plunger 4.
【００１４】この摩擦抵抗力は成型サイクル時に樹脂３
をカル・ランナ６を通して注入するときの注入圧力を減
少させる方向に働く。即ち、圧力検出器７で検出される
圧力は、カル・ランナ６部の注入圧力とポット２及びプ
ランジャ４間の摩擦抵抗力の和となる。This frictional resistance is caused by the resin 3 during the molding cycle.
Acts to reduce the injection pressure when the is injected through the cal runner 6. That is, the pressure detected by the pressure detector 7 is the sum of the injection pressure of the cull runner 6 and the frictional resistance force between the pot 2 and the plunger 4.
【００１５】そこで、クリーニングサイクル時に得られ
るポット２とプランジャ４の摩擦抵抗力を制御部８に記
憶しておき、次の成型サイクル時の注入圧力が設定され
ている注入圧力値とこの摩擦抵抗力との和になるように
駆動源５を制御する。これによって、ポット２とプラン
ジャ４との摩擦抵抗の影響を受けずに、常に一定の注入
圧力で樹脂３をカルランナ６に注入することができる。
従って、駆動源５の駆動力がポット２とプランジャ４と
の摩擦抵抗に消費されて、注入圧力が小さいために巣が
発生する等の問題を防止することができる。Therefore, the frictional resistance force of the pot 2 and the plunger 4 obtained during the cleaning cycle is stored in the control section 8, and the injection pressure value at which the injection pressure at the next molding cycle is set and this frictional resistance force. The drive source 5 is controlled so that the sum becomes. As a result, the resin 3 can be injected into the car runner 6 at a constant injection pressure without being affected by the frictional resistance between the pot 2 and the plunger 4.
Therefore, the driving force of the driving source 5 is consumed by the frictional resistance between the pot 2 and the plunger 4, and it is possible to prevent a problem that a nest is generated due to a small injection pressure.
【００１６】プランジャ４が樹脂投入位置Ｐ１とクリー
ニング位置Ｐ２を往復動作するクリーニングサイクルに
よってポット２とプランジャ４との間に入る樹脂滓はほ
ぼ除去されるが、完全に除去することはできず、少しず
つ蓄積されて行く。この樹脂カスはポット２とプランジ
ャ４の摩耗を促進するため、定期的に除去する必要があ
る。又、樹脂滓の蓄積はポット２とプランジャ４との摩
擦抵抗力に比例する。The cleaning cycle in which the plunger 4 reciprocates between the resin feeding position P1 and the cleaning position P2 almost completely removes the resin slag that enters between the pot 2 and the plunger 4, but it cannot completely remove it. They are accumulated one by one. This resin debris accelerates the wear of the pot 2 and the plunger 4, and therefore needs to be removed regularly. Further, the accumulation of the resin slag is proportional to the frictional resistance force between the pot 2 and the plunger 4.
【００１７】そこで図に示すように、摩擦抵抗初期値ａ
0 に対して摩擦抵抗増加分ｂだけ摩擦抵抗が増加した
時、樹脂滓除去動作即ち、プランジャ４を樹脂滓除去下
位置Ｐ３と樹脂滓除去上位置Ｐ４との間を往復動作させ
ることによって摩擦抵抗をａ1まで落すことができる。
この動作をａ2 ，ａ3 …というように繰り返して行くこ
とにより、ポット２とプランジャ４の摩耗を低く抑える
ことができ、交換タイミングを長くすることができる。Therefore, as shown in the figure, the initial frictional resistance value a
When the frictional resistance increases by an increment b with respect to 0 , the frictional resistance is removed by reciprocating the resin dregs removing operation, that is, the plunger 4 between the resin dregs removal lower position P3 and the resin dregs removal upper position P4. Can be dropped to a 1 .
By repeating this operation as a 2 , a 3, ..., The wear of the pot 2 and the plunger 4 can be suppressed low, and the replacement timing can be lengthened.
【００１８】また、図３におけるＬは、駆動源５の能力
を半導体を樹脂封止するのに、必要となる設定注入圧力
とから決まるポット２とプランジャ４の最大摩擦抵抗の
大きさである。従って、プランジャ４がクリーニングサ
イクル時に、検出する摩擦抵抗Ｌになった時、ポット２
とプランジャ４を交換するタイミングである。そこで、
ポット２とプランジャ４の摩耗が限界の状態まで使用す
ることができるようになると共に、交換タイミングが遅
くなって不良品を作るようなことを防止することができ
る。Further, L in FIG. 3 is the maximum frictional resistance between the pot 2 and the plunger 4, which is determined by the set injection pressure required to seal the semiconductor with resin by the ability of the drive source 5. Therefore, when the plunger 4 reaches the friction resistance L to be detected during the cleaning cycle, the pot 2
It is time to replace the plunger 4. Therefore,
It is possible to use the pot 2 and the plunger 4 up to the limit of wear, and it is possible to prevent the replacement timing from being delayed and produce a defective product.
【００１９】上記実施例によれば、クリーニングサイク
ルのようなプランジャ４の空動作時に、ポット２とプラ
ンジャ４の摩擦抵抗を圧力検出器７によって測定し、こ
の摩擦抵抗力を樹脂注入時に与えられる設定圧力に加え
て注入することにより、ポット２とプランジャ４との摩
擦抵抗力に影響されず、常に一定の注入圧力で半導体を
樹脂封止することができる。According to the above embodiment, the frictional resistance between the pot 2 and the plunger 4 is measured by the pressure detector 7 during the idle operation of the plunger 4 such as the cleaning cycle, and the frictional resistance force is set when the resin is injected. By injecting in addition to the pressure, the semiconductor can be sealed with resin at a constant injection pressure without being affected by the frictional resistance between the pot 2 and the plunger 4.
【００２０】また、ポット２とプランジャ４との摩擦抵
抗から樹脂滓の詰り状態を検知することができ、自動的
に樹脂滓除去動作を行わせることによって、ポット２及
びプランジャ４の摩耗を低く抑えることができ、交換タ
イミングを長くすることができる。さらに、設定注入
圧，プランジャ４の駆動源５の能力，ポット２とプラン
ジャ４との摩擦抵抗とから、ポット２とプランジャ４の
限界摩耗状態を知ることができ、ポット２とプランジャ
４の交換タイミングが遅すぎ不良品を作ることを防止す
ることができる。Further, the clogging state of the resin slag can be detected from the frictional resistance between the pot 2 and the plunger 4, and the resin slag removing operation is automatically performed, so that the abrasion of the pot 2 and the plunger 4 is suppressed to a low level. Therefore, the replacement timing can be extended. Furthermore, the limit wear state of the pot 2 and the plunger 4 can be known from the set injection pressure, the capacity of the drive source 5 of the plunger 4, and the frictional resistance between the pot 2 and the plunger 4, and the replacement timing of the pot 2 and the plunger 4 can be determined. Can be prevented from making a defective product too late.
【００２１】ところで、上記説明の中で、圧力検出器７
は１つで注入時の圧力検出とポット２とプランジャ４の
摩擦抵抗測定が同時にできるものという仮定をしたが、
別に注入時の圧力検出とポット２及びプランジャ４の摩
擦抵抗とを測定するものが別々であっても良い。また、
樹脂滓除去動作を行うタイミングは摩擦抵抗の初期値に
対して一定量増加した所としたが、別に図４のように樹
脂滓除去動作の開始摩擦抵抗Ｋを決めておき、ポット２
とプランジャ４の摩擦抵抗がこの値になったら樹脂滓除
去動作を行うようにしても問題はない。ただし、この場
合、ポット２とプランジャ４の交換タイミングは樹脂滓
除去動作のインターバルによって決定する必要がある。By the way, in the above description, the pressure detector 7
It is assumed that one can detect the pressure during injection and measure the frictional resistance of the pot 2 and the plunger 4 at the same time.
Separately, the pressure detection at the time of injection and the frictional resistance of the pot 2 and the plunger 4 may be separately measured. Also,
Although the timing for performing the resin dregs removing operation was set to be a certain amount of increase with respect to the initial value of the frictional resistance, the starting frictional resistance K of the resin dregs removing operation is determined separately as shown in FIG.
When the frictional resistance of the plunger 4 reaches this value, there is no problem even if the resin dregs removing operation is performed. However, in this case, the replacement timing of the pot 2 and the plunger 4 needs to be determined by the interval of the resin slag removing operation.
【００２２】[0022]
【発明の効果】本発明は以上説明したように、プランジ
ャの空動作時にポットとプランジャとの摩擦抵抗力を測
定し、この摩擦抵抗力に影響されず、常に一定の注入圧
力で半導体を樹脂封止する。並びに、この摩擦抵抗力に
よりポット，プランジャの交換タイミングや、樹脂滓除
去タイミングを検知するところに特徴を有する。この結
果、注入圧力不足による巣の発生を防止することができ
ると共に、ポット及びプランジャの寿命を長くすること
とができ、さらにポット及びプランジャの摩耗限界状態
まで使用することができるという効果がある。As described above, according to the present invention, the frictional resistance force between the pot and the plunger is measured when the plunger is idle, and the semiconductor is resin-sealed at a constant injection pressure without being affected by the frictional resistance force. Stop. Further, it is characterized in that the timing of exchanging the pot and the plunger and the timing of removing the resin dregs are detected by the frictional resistance force. As a result, it is possible to prevent the formation of cavities due to insufficient injection pressure, to prolong the life of the pot and the plunger, and to use the pot and the plunger even in the wear limit state.
【図１】本発明の構成図、FIG. 1 is a block diagram of the present invention,
【図２】プランジャの動作位置を示す図、FIG. 2 is a diagram showing an operating position of a plunger,
【図３】樹脂滓除去動作が入るタイミングを示す図、FIG. 3 is a diagram showing a timing at which a resin slag removing operation is performed,
【図４】図３における他の実施例を示す図。FIG. 4 is a diagram showing another embodiment in FIG.
１…金型， ２…ポット，３…樹
脂， ４…プランジャ，５…駆動
源， ６…カル・ランナ，７…圧力
検出器， ８…制御部，Ｐ１…樹脂
投入位置， Ｐ２…クリーニング位置，
Ｐ３…樹脂滓除去下位置， Ｐ４…樹脂滓除去
上位置，ａ0 …摩擦抵抗の初期値， ｂ…摩
擦抵抗増加分，ａ1 …樹脂滓除去後の摩擦抵抗， Ｌ
…最大許容摩擦抵抗，ａ2 …樹脂滓除去後の摩擦抵抗，
ａ3 …樹脂滓除去後の摩擦抵抗。DESCRIPTION OF SYMBOLS 1 ... Mold, 2 ... Pot, 3 ... Resin, 4 ... Plunger, 5 ... Drive source, 6 ... Cull runner, 7 ... Pressure detector, 8 ... Control part, P1 ... Resin injection position, P2 ... Cleaning position,
P3 ... resin dregs removed under position, P4 ... resin dregs removal on position, a 0 ... initial value of the frictional resistance, b ... frictional resistance increase, a 1 ... frictional resistance after resin dregs removal, L
… Maximum allowable friction resistance, a 2 … Friction resistance after removing resin slag,
a 3 ... Friction resistance after removing resin slag.
Claims (3)
る時の圧力を圧力検出手段により検出して常に設定圧力
になるように制御している半導体樹脂封止装置におい
て、プランジャが樹脂を注入する以外の空動作時にプラ
ンジャと金型ポットの摩擦抵抗を圧力検出手段により検
出し、この摩擦抵抗力を注入時に与えられる設定圧力に
加えて樹脂注入することによりプランジャと金型ポット
の摩擦抵抗力の影響を受けずに、樹脂注入圧力を常に設
定圧力にすることを特徴とする半導体樹脂封止装置。1. A semiconductor resin encapsulation apparatus in which a pressure when a resin is injected into a mold by a plunger is detected by a pressure detection means and is controlled to always be a set pressure, the plunger injects the resin. The friction resistance between the plunger and the mold pot is detected by the pressure detection means during the empty operation other than the above, and this friction resistance force is added to the set pressure given at the time of injection to inject the resin, and the friction resistance force between the plunger and the mold pot is A semiconductor resin encapsulation device characterized in that the resin injection pressure is always set to a set pressure without being affected.
とポットの摩擦抵抗力がある値以上になった時、プラン
ジャと金型ポットの交換要求を出すことを特徴とする半
導体樹脂封止装置。2. The semiconductor resin sealing device according to claim 1, wherein when the frictional resistance between the plunger and the pot exceeds a certain value, a request for replacement of the plunger and the mold pot is issued.
動作している状態でプランジャとポットの摩擦抵抗力が
徐々に増加してきた時、プランジャのクリーニング動作
を自動的に換えて、プランジャとポットの間に入った樹
脂カスを取り除き摩擦抵抗力を小さくすることを特徴と
する半導体樹脂封止装置。3. The structure according to claim 1, wherein when the friction resistance between the plunger and the pot gradually increases in a state where the device is continuously operating, the plunger cleaning operation is automatically changed to A semiconductor resin encapsulation device, characterized in that a resin scrap entering between pots is removed to reduce frictional resistance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23942893A JP3376037B2 (en) | 1993-09-27 | 1993-09-27 | Semiconductor resin sealing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23942893A JP3376037B2 (en) | 1993-09-27 | 1993-09-27 | Semiconductor resin sealing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0794541A true JPH0794541A (en) | 1995-04-07 |
| JP3376037B2 JP3376037B2 (en) | 2003-02-10 |
Family
ID=17044632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23942893A Expired - Fee Related JP3376037B2 (en) | 1993-09-27 | 1993-09-27 | Semiconductor resin sealing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3376037B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114103040A (en) * | 2020-08-28 | 2022-03-01 | 东和株式会社 | Resin molding apparatus and method for manufacturing resin molded product |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50109254A (en) * | 1974-02-06 | 1975-08-28 | ||
| JPS5235252A (en) * | 1975-09-16 | 1977-03-17 | Hitachi Ltd | Transfer molding machine controller |
| JPS59174334A (en) * | 1983-03-22 | 1984-10-02 | Mitsubishi Electric Corp | Apparatus for sealing with resin |
| JPS6275910U (en) * | 1986-10-16 | 1987-05-15 | ||
| JPH03147340A (en) * | 1989-11-01 | 1991-06-24 | Matsushita Electric Ind Co Ltd | Mold press of semiconductor chip |
-
1993
- 1993-09-27 JP JP23942893A patent/JP3376037B2/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50109254A (en) * | 1974-02-06 | 1975-08-28 | ||
| JPS5235252A (en) * | 1975-09-16 | 1977-03-17 | Hitachi Ltd | Transfer molding machine controller |
| JPS59174334A (en) * | 1983-03-22 | 1984-10-02 | Mitsubishi Electric Corp | Apparatus for sealing with resin |
| JPS6275910U (en) * | 1986-10-16 | 1987-05-15 | ||
| JPH03147340A (en) * | 1989-11-01 | 1991-06-24 | Matsushita Electric Ind Co Ltd | Mold press of semiconductor chip |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114103040A (en) * | 2020-08-28 | 2022-03-01 | 东和株式会社 | Resin molding apparatus and method for manufacturing resin molded product |
| KR20220030161A (en) * | 2020-08-28 | 2022-03-10 | 토와 가부시기가이샤 | Resin molding apparatus and resin molded product manufacturing method |
| TWI834055B (en) * | 2020-08-28 | 2024-03-01 | 日商Ｔｏｗａ股份有限公司 | Resin molding apparatus and resin molded product manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3376037B2 (en) | 2003-02-10 |
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