CN114102981A

CN114102981A - Resin molding apparatus and method for manufacturing resin molded product

Info

Publication number: CN114102981A
Application number: CN202110896810.XA
Authority: CN
Inventors: 奥西祥人; 宫景孝之; 高山敏畅
Original assignee: Towa Corp
Current assignee: Towa Corp
Priority date: 2020-08-28
Filing date: 2021-08-05
Publication date: 2022-03-01
Also published as: JP2022039811A; KR102571952B1; TWI783621B; KR20220030163A; JP7360369B2; TW202209512A

Abstract

The resin molding apparatus and the method for manufacturing a resin molded product of the present invention can stably recover an unnecessary resin and simplify the structure of a transfer mechanism, and include: an upper die having a die cavity; a lower die which faces the upper die and on which a molding object is placed; a mold clamping mechanism for clamping the upper mold and the lower mold; a groove block provided in the lower mold, having a plurality of grooves for receiving the resin material, and including a protruding portion protruding from a mold surface of the lower mold; and a transmission mechanism including a plurality of plungers provided inside each of the plurality of grooves, for moving the plurality of plungers to inject the resin material from the plurality of grooves into the cavity, wherein a connection portion for connecting unnecessary resin remaining in correspondence with each of the plurality of grooves is formed in the upper die or the groove block, and the transmission mechanism moves the plurality of plungers by the same movement amount.

Description

Resin molding apparatus and method for manufacturing resin molded product

Technical Field

The present invention relates to a resin molding apparatus and a method of manufacturing a resin molded product.

Background

Conventionally, for example, as shown in patent document 1, it is conceivable to perform resin sealing by injecting a molten resin into a cavity portion of an upper mold from a space formed between an upper surface of a gate block and a lower surface of the upper mold in a state where the upper mold and the lower mold are clamped and the gate block provided in the lower mold presses a part of a substrate against the lower mold.

In the resin sealing device, a spring for moving the gate block up and down is provided below the gate block, and the gate block is compressed when the mold is clamped. When the upper and lower molds are opened, the spring is restored from the compressed state, and the gate block is pushed up relatively to the upper surface (mold surface) of the lower mold, so that the runner as an unnecessary resin on the gate block is separated from the substrate.

[ Prior art documents ]

[ patent document ]

[ patent document 1] Japanese patent application laid-open No. 2000-311908

Disclosure of Invention

[ problems to be solved by the invention ]

However, in the above resin molding apparatus, since a plurality of runners for unnecessary resin are formed corresponding to the plurality of grooves, respectively, a plurality of unnecessary resins remain in the gate block after the resin molding. Therefore, it is necessary to recover a plurality of unnecessary resins one by one, and there is a concern that the stability of recovery of the unnecessary resins deteriorates as the number of the unnecessary resins on the gate block increases.

In addition, the resin passage portion including the reject pool portion, the runner portion, and the gate portion is formed independently for each groove, and an equalizing mechanism using an elastic member or the like must be provided in a support block supporting the plunger in order to equalize the injection pressure of the resin injected from each groove into the cavity portion.

The present invention has been made to solve the above-described problems, and a main problem of the present invention is to stably recover unnecessary resin and to simplify the structure of a transfer mechanism.

[ means for solving problems ]

That is, the resin molding apparatus of the present invention includes: a first mold formed with a mold cavity; a second die which faces the first die and on which a molding object is placed; a mold clamping mechanism for clamping the first mold and the second mold, wherein a groove block is provided in the second mold, has a plurality of grooves for receiving a resin material, and includes a protruding portion protruding from a mold surface of the second mold; and a transmission mechanism that includes a plurality of plungers provided in the respective grooves, and that moves the plurality of plungers to inject the resin material from the plurality of grooves into the cavity, wherein a connection portion for connecting unnecessary resin remaining in correspondence with each of the plurality of grooves is formed in the first die or the groove block, and the transmission mechanism moves the plurality of plungers by the same amount of movement.

Further, the method for producing a resin molded article of the present invention is a method for producing a resin molded article using the resin molding apparatus.

[ Effect of the invention ]

According to the present invention thus constituted, unnecessary resin can be recovered stably and the structure of the transmission mechanism can be simplified.

Drawings

Fig. 1 is a schematic diagram showing a configuration of a resin molding apparatus according to an embodiment of the present invention.

Fig. 2 is a schematic view showing the structure of the forming module of the embodiment.

Fig. 3 is a plan view schematically showing the groove block (a) in fig. 3 of the above embodiment and a schematic view showing an unnecessary resin (b) in fig. 3.

Fig. 4 is a plan view (a) in fig. 4 and a right side view (b) in fig. 4 schematically showing the configuration of the transmission mechanism according to the embodiment.

Fig. 5 is a schematic view showing a substrate mounting state and a resin material loading state of the molding module according to the embodiment.

Fig. 6 is a schematic view showing a mold clamping state of the molding module according to the embodiment.

Fig. 7 is a schematic view showing a resin injection state of the molding module of the embodiment.

Fig. 8 is a schematic view showing a reference position X of the forming module of the embodiment.

Fig. 9 is a schematic view showing a peeled state of the forming module of the embodiment.

Fig. 10 is a schematic view showing a state at the start of the mold opening operation of the molding module according to the embodiment.

Fig. 11 is a schematic view showing a gate breaking operation in the mold opening operation of the molding module according to the embodiment.

Fig. 12 is a schematic view showing a state after a gate is broken in a mold opening operation of the molding module according to the embodiment.

Fig. 13 is a schematic view showing an open state of the molding module according to the embodiment.

Fig. 14 is a schematic view showing a state where each suction portion of the unloader contacts the resin molded product and the unnecessary resin according to the above embodiment.

Fig. 15 is a schematic view showing a state where the unnecessary resin rises and the unnecessary resin adsorption part shrinks in the above embodiment.

Fig. 16 is a schematic view showing a state where the unloader of the above embodiment adsorbs and carries out a resin molded product and an unnecessary resin.

Fig. 17 is a schematic view showing the removal position (a) in fig. 17 and the loading position (b) in fig. 17 in the removal operation according to the embodiment.

Description of the symbols

2: first mould (Upper mould, forming mould)

2 a: die cavity

2 b: concave part

2 c: flow passage part

3: second mold (lower mold, forming mold)

4: resin injection part

5: mould clamping mechanism

11: molded object supply unit

12: resin material supply part

13: carrying device (loader)

14: storage part

15: conveying mechanism (conveying device, unloader)

15 a: suction part for molded article

15a1, 15b 1: adsorption opening part

15 b: adsorption part for unnecessary resin

41: groove block

41 a: trough

41 b: material picking pool part

41 c: gate part

41 d: connecting part

42: transmission mechanism

43: elastic member

61: ejector pin

62: ejection plate

63: elastic member

64: return pin

100: resin molding apparatus

100A: supply module

100B: forming module

100C: storage module

101: upper die holder

102: upper pressure plate

103: upper die base plate

104: lower die holder

105: movable pressure plate

106: lower die base plate

151: base member

152: holding claw

153: moving mechanism

410: cylindrical member

411: extension part

421: plunger piston

422: fixed block

423: plunger driving part

COM: control unit

J: resin material

K: unwanted resins

K1: residual part

KM: unnecessary resin body

W1: object to be molded

W2: resin molded article (object to be molded)

Wx: electronic component

X: reference position

Y: peeling position

Detailed Description

Next, the present invention will be described in more detail by way of examples. However, the present invention is not limited to the following description.

As described above, the resin molding apparatus of the present invention includes: a first mold formed with a mold cavity; a second die which faces the first die and on which a molding object is placed; a mold clamping mechanism for clamping the first mold and the second mold, wherein a groove block is provided in the second mold, has a plurality of grooves for receiving a resin material, and includes a protruding portion protruding from a mold surface of the second mold; and a transmission mechanism that includes a plurality of plungers provided in the respective grooves, and that moves the plurality of plungers to inject the resin material from the plurality of grooves into the cavity, wherein a connection portion for connecting unnecessary resin remaining in correspondence with each of the plurality of grooves is formed in the first die or the groove block, and the transmission mechanism moves the plurality of plungers by the same amount of movement.

In the resin molding apparatus, since the unnecessary resins remaining in correspondence with the respective plurality of grooves can be connected by the connecting portion, the unnecessary resins on the groove blocks can be integrated after the resin molding. Therefore, not only the unnecessary resin can be stably recovered, but also the structure of the conveying mechanism for recovering the unnecessary resin can be simplified.

Further, since the plurality of grooves communicate with each other through the connecting portion, even in a configuration in which the transmission mechanism moves the plurality of plungers by the same amount of movement, the injection pressure of the resin material can be made uniform by the resin material injected from each groove reciprocating in the connecting portion, and therefore, it is not necessary to include the isobaric mechanism in the transmission mechanism. This makes it possible to simplify the structure of the transmission mechanism.

As a specific embodiment for connecting unnecessary resins, it is considered that the first die or the groove block includes a plurality of reject pool portions formed corresponding to the grooves, respectively, and the connecting portion connects the adjacent reject pool portions to connect the unnecessary resins.

Here, in order to simplify the structure of the first die, it is preferable that the plurality of reject pool portions and the connection portion be formed in the groove block.

In the above configuration, the contact area between the groove block and the unnecessary resin is larger than the contact area between the first mold and the unnecessary resin, and the unnecessary resin is not peeled off from the groove block but is peeled off from the first mold. Thus, the ejector pin for contacting the unnecessary resin and peeling the unnecessary resin from the first mold can be eliminated.

The unnecessary resin is collected from the tank block and then stored in a waste box. Here, if the plurality of unnecessary resins are connected to each other so as to be integrated with each other, the dead space in the waste box increases, and the storage space becomes larger than the actual volume of the unnecessary resins. Therefore, it is desirable that the coupling portion couples the plurality of unnecessary resins into a plurality of groups.

A specific embodiment of the transfer mechanism is considered to be a structure that does not include an isobaric mechanism for making the injection pressure of the resin material uniform, and includes: a fixing block for fixing the plurality of plungers; and a plunger driving unit which moves the plurality of plungers together by moving the fixed block.

The resin molding apparatus of the present invention may further include a conveying mechanism for carrying out the unnecessary resin on the vat block after the resin molding, and the conveying mechanism may include an unnecessary resin adsorption part for adsorbing the unnecessary resin.

In the above configuration, in the present invention, the number of unnecessary resins is reduced by connecting a plurality of unnecessary resins into one block by the connecting portion, and therefore the number of unnecessary resin suction portions can be reduced, and the structure of the conveying mechanism can be simplified.

When the unnecessary resin is adsorbed and recovered, the unnecessary resin is in close contact with the reject pool block and is difficult to separate, and the unnecessary resin may not be recovered. Further, when the unnecessary resin is pulled away from the reject pool block, the pressure in the tank becomes negative pressure, and the unnecessary resin is difficult to separate from the reject pool block. In addition, there is a problem that the unnecessary resin is difficult to separate from the reject pool block due to the frictional force between the unnecessary resin and the upper surface of the reject pool block.

In order to suitably solve the above problem, it is preferable that the transfer mechanism moves the plunger toward the first die to peel off the unnecessary resin from the vat block after the transfer mechanism brings the unnecessary resin adsorption part into contact with the unnecessary resin on the vat block, and thereafter, the transfer mechanism adsorbs the unnecessary resin by the unnecessary resin adsorption part to carry out the unnecessary resin.

With this configuration, the unnecessary resin on the tank block can be stably recovered. Specifically, since the unnecessary resin is peeled off from the tank block by the plunger before the unnecessary resin is adsorbed by the unnecessary resin adsorption portion, the unnecessary resin adsorbed by the unnecessary resin adsorption portion can be reliably recovered and utilized from the tank block. Further, when the unnecessary resin is peeled off from the groove block by the plunger, the unnecessary resin suction portion is brought into contact with the unnecessary resin, and therefore, suction failure due to the unnecessary resin tilting on the groove block or the like can be prevented. With the above, the unnecessary resin on the tank block can be stably recovered.

Even when the plunger is moved toward the first die to peel off the unnecessary resin from the groove block, if the plunger is closely bonded to the unnecessary resin, a trouble may occur in the subsequent recovery of the unnecessary resin.

In order to solve the above problem, it is preferable that the transfer mechanism removes the unnecessary resin from the plunger by moving the plunger to a side opposite to the first die before removing the unnecessary resin from the pocket block by moving the plunger to the first die.

In the above configuration, the plunger and the unnecessary resin are peeled off in advance, and therefore the unnecessary resin can be easily recovered.

Preferably, the conveying means includes a molded article adsorbing portion for adsorbing the resin molded article, and adsorbs the unnecessary resin by the unnecessary resin adsorbing portion, and adsorbs the resin molded article by the molded article adsorbing portion, and carries out the unnecessary resin and the resin molded article.

With this configuration, the resin molded product and the unnecessary resin can be carried out at one time by the common carrying mechanism, and therefore the carrying-out time of the resin molded product and the unnecessary resin can be shortened, and the structure of the resin molding apparatus can be simplified.

In order to prevent the protruding portion of the groove block from interfering with the resin molded article when the resin molded article is carried out, it is preferable that the conveying mechanism includes a moving mechanism that moves the molded article suction portion, to which the resin molded article is sucked, away from the resin injection portion and moves the resin molded article to an outer side than the protruding portion.

As a preliminary stage for stably recovering the unnecessary resin, it is necessary to reliably separate the resin molded article from the unnecessary resin. Therefore, in the mold opening operation in which the mold clamping mechanism opens the first mold and the second mold, the transfer mechanism preferably moves the plunger toward the first mold to separate the resin molded product on the mold surface of the second mold from the unnecessary resin on the cavity block.

Since the resin molded product is separated from the unnecessary resin by using the plunger as described above, the separation can be reliably performed.

In the case where the groove block is provided so as to be able to advance and retreat with respect to the second die via an elastic member, it is preferable that, in a die opening operation in which the clamping mechanism opens the first die and the second die, the groove block is moved toward the first die by a restoring force of the elastic member, thereby separating the resin molded product on the die surface of the second die from the unnecessary resin on the groove block.

With this configuration, the resin molded product can be separated from the unnecessary resin by the elastic force of the elastic member compressed at the time of mold clamping.

Preferably, the groove block is in a state of sandwiching the unnecessary resin between the groove block and the first die by an elastic force of the elastic member for a predetermined period from the start of the mold opening operation, and after the predetermined period has elapsed, the unnecessary resin is peeled from the first die while holding the unnecessary resin.

With this configuration, the resin molded article is separated from the unnecessary resin in a state where the unnecessary resin is sandwiched between the groove block and the first mold, and the unnecessary resin can be prevented from being accidentally dropped from the groove block when the unnecessary resin is separated. In addition, since the unnecessary resin does not fall off from the groove block at the time of separation, it is possible to prevent the adsorption failure due to the inclination of the unnecessary resin in the groove block or the like.

When the groove block is not in the initial state in which the elastic member is restored when the unnecessary resin is recovered after the mold is opened, the groove block may move accidentally before and after the unnecessary resin adsorption portion comes into contact with the unnecessary resin. Then, the adsorption of the unnecessary resin may not be performed, and the recovery may be poor.

In order to solve the above problem, it is preferable that the transfer mechanism moves the plunger toward the first die until an initial state in which the elastic member is restored is reached before the completion of opening the dies by the die clamping mechanism, and the transfer mechanism brings the unnecessary resin suction portion into contact with the unnecessary resin on the slot block in the initial state.

Further, a method for producing a resin molded article using the resin molding apparatus is also an embodiment of the present invention.

< one embodiment of the present invention >

Hereinafter, an embodiment of a resin molding apparatus according to the present invention will be described with reference to the drawings. For ease of understanding, any of the drawings shown below is appropriately omitted or exaggerated and schematically depicted. The same constituent elements are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

< integral Structure of resin Molding apparatus >

The resin molding apparatus 100 of the present embodiment resin-molds the object W1 to which the electronic component Wx is connected by transfer molding using the resin material J.

Here, the object to be molded W1 is, for example, a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit substrate, a semiconductor substrate, a wiring substrate, a lead frame, or the like, and is not limited to the presence or absence of wiring. The resin material J to be molded with a resin is, for example, a composite material containing a thermosetting resin, and the form of the resin material J is, for example, a granular form, a powder form, a liquid form, a sheet form, a pellet form, or the like. The electronic component Wx connected to the upper surface of the object to be molded W1 is, for example, a bare chip or a chip sealed with resin.

Specifically, as shown in fig. 1, the resin molding apparatus 100 includes, as constituent elements, the following members: a supply module 100A for supplying the object W1 to be molded and the resin material J before molding; a molding module 100B for resin molding; and a storage module 100C for storing the molded object W2 (hereinafter, a resin molded product W2). The supply module 100A, the forming module 100B, and the storage module 100C are detachable from and replaceable with respect to other components. Further, the number of the molding blocks 100B may be two or three, and the number of the respective constituent elements may be increased.

The supply module 100A is provided with the following components: a molding object supply unit 11 for supplying a molding object W1; a resin material supply unit 12 for supplying a resin material J; and a conveying device 13 (hereinafter, a loader 13) that receives the molding object W1 from the molding object supply unit 11 and conveys the molding object W1 to the molding module 100B, and that receives the resin material J from the resin material supply unit 12 and conveys the molding module 100B.

The loader 13 reciprocates between the supply module 100A and the forming module 100B, and moves along a rail (not shown) provided over the supply module 100A and the forming module 100B.

As shown in fig. 2, the forming module 100B includes: a first mold 2 (hereinafter, an upper mold 2) which is one of molding molds in which a cavity 2a into which the resin material J is injected is formed; a second mold 3 (hereinafter, lower mold 3) which is the other of the molding molds disposed opposite to the upper mold 2 and provided with a resin injection portion 4 for injecting the resin material J into the cavity 2 a; and a mold clamping mechanism 5 for clamping the upper mold 2 and the lower mold 3. The upper die 2 is held by an upper die holder 101, and the upper die holder 101 is fixed to an upper platen 102. In addition, the upper die 2 is mounted to the upper die holder 101 via an upper die base plate 103. The lower mold 3 is held by a lower mold holder 104, and the lower mold holder 104 is fixed to a movable platen 105 that is raised and lowered by the clamping mechanism 5. In addition, the lower die 3 is mounted to the lower die holder 104 via a lower die base plate 106.

The resin injection part 4 includes: a groove block 41 in which a groove 41a for accommodating the resin material J is formed; and a transmission mechanism 42 including a plunger 421 disposed in the groove 41 a. The groove 41a is formed by a cylindrical member 410 having a cylindrical shape, for example. The cylindrical member 410 is fitted into a through hole formed in the groove block 41.

The slot block 41 is elastically supported by an elastic member 43 so as to be able to be lifted and lowered with respect to the lower die 3. That is, the pocket block 41 is provided to be able to be raised and lowered with respect to the lower die 3 via the elastic member 43. Further, the elastic member 43 is provided below the slot block 41.

Further, at the upper end of the groove block 41, a protruding portion 411 protruding on a die surface which is the upper surface of the lower die 3 is formed. Further, on the upper surface of the groove block 41, a cull pool portion 41b and a gate portion 41c, which are resin flow paths for introducing the resin material J injected from the groove 41a into the cavity 2a, are formed. In a state where the upper mold 2 and the lower mold 3 are clamped, the upper surface of the projecting portion 411 contacts the upper mold 2, and the lower surface thereof sandwiches the object to be molded W1 with the mold surface of the lower mold 3.

In the groove block 41 of the present embodiment, as shown in fig. 3 (a), a plurality of groove blocks 41a are formed in a line, for example. Fig. 3 (a) shows an example in which eight grooves 41a are formed in one groove block 41, but this is not limitative, and modifications may be made as appropriate. Further, on the upper surface of the groove block 41, a plurality of culling pool portions 41b are formed corresponding to the grooves 41a, respectively, and a plurality of gate portions 41c are formed corresponding to the culling pool portions 41b, respectively.

The groove block 41 is provided with a coupling portion 41d for coupling the unnecessary resin K remaining in correspondence with each of the plurality of grooves 41 a. The unnecessary resin K is a resin which remains on the groove block 41 after resin molding and is cured. The connecting portion 41d connects the reject pool portions 41b adjacent to each other, and has, for example, a groove shape. Here, the coupling portion 41d is formed to couple the four reject pool portions 41b in series, thereby dividing the plurality of unnecessary resins K remaining in correspondence with the respective grooves 41a into a plurality of groups (two groups in this case) and coupling them as shown in fig. 3 (b). Hereinafter, a resin obtained by integrally connecting a plurality of unnecessary resins K is also referred to as an unnecessary resin body KM.

The transfer mechanism 42 moves the plurality of plungers 421 in a state where the upper mold 2 and the lower mold 3 are clamped, and injects the resin material J from the plurality of grooves 41a into the cavity 2 a.

The transmission mechanism 42 is configured not to include an isobaric mechanism such as an elastic member for equalizing the injection pressure of the resin material J, and moves the plurality of plungers 421 by the same movement amount in the respective grooves 41 a.

Specifically, as shown in fig. 4, the transmission mechanism 42 includes: a plurality of plungers 421 which are provided inside the respective grooves 41a and which pressure-feed the molten resin material J; a fixing block 422 for fixing the plurality of plungers 421; and a plunger driving unit 423 for moving the fixed block 422 to move the plurality of plungers 421 by the same moving amount.

The fixed block 422 has a substantially rectangular parallelepiped shape, and a plurality of plungers 421 are linearly fixed in a row on one surface (upper surface) of the rectangular shape. The arrangement of the plurality of plungers 421 corresponds to the arrangement of the plurality of grooves 41 a. The plurality of plungers 421 are fixed to the fixing block 422 by, for example, fixing screws. The plurality of plungers 421 have the same shape.

The plunger driving unit 423 moves the fixed block 422 up and down with respect to the lower die 3, thereby moving the plurality of plungers 421 up and down together with the plurality of grooves 41a by the same movement amount. The plunger driving portion 423 of the present embodiment is provided below the fixed block 422. Here, as the plunger driving section 423, for example, a combination of a servo motor and a ball screw mechanism, a combination of an air cylinder, a hydraulic cylinder, and a rod, or the like can be used.

As shown in fig. 2, the upper mold 2 is provided with a cavity 2a, and the cavity 2a accommodates the electronic component Wx of the object W1 to be molded and into which the molten resin material J is injected. In the upper die 2, a recess 2b is formed in a portion facing the groove block 41, and a runner portion 2c is formed to connect the culling pool portion 41b and the gate portion 41c of the groove block 41 to the cavity 2 a. Further, although not shown, an exhaust port is formed in the upper die 2 on the side opposite to the groove block 41. The runner portion 2c may be omitted, and the cull pool portion 41b may be directly connected to the cavity 2a via the gate portion 41 c.

The upper die 2 is provided with a plurality of ejector pins 61, and the plurality of ejector pins 61 are used for releasing the molded object W2 after resin molding from the upper die 2. These ejector pins 61 are provided so as to penetrate a desired portion of the upper die 2, can be raised and lowered with respect to the upper die 2, and are fixed to an ejector plate 62 provided above the upper die 2. The ejector plate 62 is provided to the upper platen 102 or the like via an elastic member 63, and includes a return pin 64. During mold clamping, the return pin 64 comes into contact with the outside of the placement area of the object W1 on the lower mold 3, thereby raising the ejector plate 62 relative to the upper mold 2. Thus, the ejector pin 61 is retracted into the die surface of the upper die 2 during die closing. On the other hand, when opening the mold, the ejector plate 62 is lowered relative to the upper mold 2 as the lower mold 3 is lowered, and the ejector pin 61 releases the resin molded product W2 from the upper mold 2 by the elastic force of the elastic member 63.

When the upper mold 2 and the lower mold 3 are clamped by the clamping mechanism 5, the resin flow path including the reject pool portion 41b, the gate portion 41c, the recess portion 2b, and the runner portion 2c communicates the plurality of grooves 41a with the cavity 2a (see fig. 6). When the upper mold 2 and the lower mold 3 are clamped, the groove-side end of the object W1 is sandwiched between the lower surface of the extension 411 of the groove block 41 and the mold surface of the lower mold 3. When the molten resin material J is injected into the cavity 2a by the plurality of plungers 421 in this state, the electronic component Wx of the object W1 is sealed with resin.

As shown in fig. 1, the storage module 100C is provided with a storage section 14 for storing a resin molded article W2, and a conveying device 15 (hereinafter, an unloader 15) for receiving the resin molded article W2 from the molding module 100B and conveying the resin molded article W2 to the storage section 14.

The unloader 15 reciprocates between the molding module 100B and the storage module 100C, and moves along a rail (not shown) provided over the molding module 100B and the storage module 100C.

< action of the resin molding apparatus 100 >

The operation of the resin molding apparatus 100 will be briefly described with reference to fig. 5 to 16. Fig. 5 to 16 show only one side (left side) of the slot block 41, and the other side (right side) is omitted, but the state of the other side in each drawing is the same as that of the one side. The following operation is performed by controlling each unit by the control unit COM provided in the supply module 100A, for example.

As shown in fig. 5, in a state where the upper mold 2 and the lower mold 3 are opened, the molding object W1 before molding is carried by the loader 13, delivered to the lower mold 3, and placed thereon. At this time, the upper die 2 and the lower die 3 are heated to a temperature at which the resin material J is melted and cured. Thereafter, the resin material J is conveyed by the loader 13 and stored in the plurality of grooves 41a of the groove block 41.

In this state, when the lower die 3 is raised by the clamping mechanism 5, as shown in fig. 6, the groove block 41 touches the upper die 2 and is lowered with respect to the lower die 3, and the lower surface of the protruding portion 411 comes into contact with the groove-side end portion of the object W1. The lower surface of the upper die 2 contacts the outer peripheral portion of the object W1 not contacted by the extension 411. Thereby, the upper mold 2 and the lower mold 3 are clamped. After the mold closing, when the transfer mechanism 42 raises the plurality of plungers 421 by the same movement amount by the plunger driving section 423, as shown in fig. 7, the molten resin material J in the plurality of grooves 41a passes through the resin passage and is injected into the cavity 2 a. At this time, the injection pressure of the resin material J injected from each groove 41a is uniform through the coupling portion 41 d. After a predetermined molding time has elapsed and the resin material J is cured in the cavity 2a, the mold clamping mechanism 5 opens the upper mold 2 and the lower mold 3.

Here, in the resin molding apparatus 100 of the present embodiment, in the mold opening operation in which the mold clamping mechanism 5 opens the upper mold 2 and the lower mold 3, an operation of separating the resin molded product W2 from the unnecessary resin K (gate opening operation) is performed.

For example, immediately before the molding time elapses (before the mold opening operation is started), as shown in fig. 8, the transmission mechanism 42 reduces the force with which the plurality of plungers 421 press the unnecessary resin K to a predetermined value (for example, a relatively small force to the extent that the contact state can be maintained without peeling the plurality of plungers 421 from the unnecessary resin K). The force pressed by the plurality of plungers 421 is measured by a force sensor (including a weight sensor, a load sensor, and the like) such as a load cell (not shown) provided on a drive shaft (transmission shaft) of the plunger drive unit 423.

Then, the control unit COM stores the position of the plunger 421 at the time of the predetermined force as the reference position X (see fig. 8). The reference position X is a position that serves as a reference for a gate breaking operation and for demolding/recovering of the unnecessary resin K, which will be described later. The reference position X is not limited to the position of the plunger 421, and may be a position of another member such as a drive shaft (transmission shaft) of the plunger drive unit 423 connected to the plunger 421.

Then, before the start of the mold opening operation, as shown in fig. 9, the transmission mechanism 42 lowers the plurality of plungers 421 to the side opposite to the upper mold 2 and to a predetermined peeling position Y. By lowering the plurality of plungers 421 to the peeling position Y, the upper surfaces of the plurality of plungers 421 are peeled off from the lower surface of the unnecessary resin K. After the peeling operation, the transmission mechanism 42 raises the plurality of plungers 421 to the reference position X. At this time, the upper surfaces of the plurality of plungers 421 contact the lower surface of the unnecessary resin K (the state of fig. 8).

Next, as shown in fig. 10, the mold clamping mechanism 5 starts lowering the lower mold 3, and starts the mold opening operation. At the timing when the mold clamping mechanism 5 starts the mold opening operation and the clamping force is reduced to a predetermined value (different from the predetermined value in the transmission mechanism 42), the transmission mechanism 42 raises the plurality of plungers 421 toward the upper mold 2 as shown in fig. 11. Thereby, the unnecessary resin K on the groove block 41 is pressed against the upper die 2 by the plurality of plungers 421. The clamping force is measured by a force sensor (including a weight sensor, a load sensor, and the like) such as a load sensor (not shown) provided on a clamping shaft or the like of the clamping mechanism 5.

When the transmission mechanism 42 moves the plurality of plungers 421 up to the upper mold 2, the groove block 41 receives the elastic force, which is the restoring force of the compressed elastic member 43, and moves up from the lower mold 3 to the upper mold 2 as shown in fig. 11. That is, in the mold opening operation, the transmission mechanism 42 raises the plurality of plungers 421 from the lower mold 3 to the upper mold 2 while the groove block 41 receives the elastic force of the elastic member 43 and is raised from the lower mold 3 to the upper mold 2.

In the mold opening operation, the timing at which the groove block 41 starts to ascend from the lower mold 3 to the upper mold 2 by receiving the elastic force of the elastic member 43 may be the same as or different from the timing at which the plurality of plungers 421 start to ascend from the lower mold 3 to the upper mold 2 by the transmission mechanism 42.

By the rise of the plurality of plungers 421 by the transmission mechanism 42 and the rise of the groove block 41 by the elastic force of the elastic member 43, as shown in fig. 12, the resin molded product W2 on the die surface of the lower die 3 is separated from the unnecessary resin K on the groove block 41 (gate is disconnected).

At this time, the resin molded product W2 on the lower die 3 is pressed against the die surface of the lower die 3 by the ejector pins 61 provided on the upper die 2, and the lower surface of the resin molded product W2 is in close contact with the die surface of the lower die 3 (see fig. 11). The ejector pin 61 functions as a pressing member that presses the resin molded product W2 against the mold surface of the lower mold 3 when separating the resin molded product W2 from the unnecessary resin K. Since the resin molded product W2 is pressed against the die surface of the lower die 3 by the pressing member as described above, a shear stress is easily applied between the resin molded product W2 and the unnecessary resin K, and the gate is easily broken.

Here, the ejector pin 61 as the pressing member presses the resin molded product W2 against the die surface of the lower die 3 at least until the resin molded product W2 is separated from the unnecessary resin K. In other words, in the mold opening operation, while the ejector pin 61 presses the resin molded article W2, the separation of the resin molded article W2 from the unnecessary resin K is completed by the rise of the groove block 41 and the rise of the plunger 421.

In the gate breaking, the unnecessary resin K is sandwiched between the upper surface of the groove block 41 pressed upward by the elastic force of the elastic member 43 and the lower surface of the upper die 2 (see fig. 11 and 12). That is, the groove block 41 is in a state of sandwiching the unnecessary resin K with the upper mold 2 by the elastic force of the elastic member 43 in a predetermined period from the start of the mold opening operation. The predetermined period is a period including at least a period until the gate breaking is completed and a period until the lower mold 3 is lowered to be in an initial state (a state before being pressed and compressed by the upper mold 2) in which the elastic member 43 is restored.

After a predetermined period of time has elapsed, that is, the lower mold 3 is further lowered by the mold clamping mechanism 5, and as shown in fig. 13, the unnecessary resin K is peeled off from the upper mold 2 while the unnecessary resin K is held by the groove block 41. Here, since the cull pool portion 41b and the gate portion 41c are formed in the groove block 41 and the contact area between the groove block 41 and the unnecessary resin K is larger than the contact area between the upper die 2 and the unnecessary resin K, the unnecessary resin K is not peeled off from the groove block 41 but is peeled off from the upper die 2. The coupling portion 41d also contributes to an increase in the contact area between the groove block 41 and the unnecessary resin K. Thus, the ejector pin for contacting the unnecessary resin K and peeling the unnecessary resin K from the upper die 2 is not required.

Further, as the transfer mechanism 42 raises the plurality of plungers 421 toward the upper die 2, the protruding portions 411 of the groove block 41 are brought into a state of not contacting the resin molded article W2 from a state of sandwiching the resin molded article W2 between the protruding portions and the die surface of the lower die 3.

In addition to the gate disconnection, the transmission mechanism 42 raises the plurality of plungers 421 toward the upper mold 2 to an initial state before mold clamping in which the elastic member 43 on the lower side of the groove block 41 is restored (see fig. 13). Thus, the protruding portion 411 does not become an obstacle when the object W1 to be molded is placed under the protruding portion 411 in the next resin molding.

After the mold opening operation as described above is performed to separate the resin molded product W2 from the unnecessary resin K, the resin molded product W2 and the unnecessary resin K are carried out by the unloader 15 as shown in fig. 14 to 16.

As shown in fig. 14, the unloader 15 includes a molded article suction portion 15a and an unnecessary resin suction portion 15 b. The molded article adsorption portion 15a and the unnecessary resin adsorption portion 15b each include an adsorption pad made of resin, and particularly, the unnecessary resin adsorption portion 15b is, for example, of a bellows type (also referred to as bellows type) and is more excellent in stretchability than the molded article adsorption portion 15 a. The molded article suction portion 15a and the unnecessary resin suction portion 15b are provided in the base member 151 and connected to a suction source such as a suction pump, not shown. The molded article suction unit 15a sucks air from the suction source, and thereby sucks the resin molded article W2 through the suction opening 15a 1. The unnecessary resin adsorption portion 15b sucks air from the suction source, and thereby adsorbs the unnecessary resin K at the adsorption opening portion 15b 1.

Further, at least the molded article suction portion 15a is configured to be movable in the left-right direction and the up-down direction with respect to the base member 151 by the moving mechanism 153. Further, the moving mechanism 153 includes: a left-right moving section including, for example, a rail and a slider, for moving the molded article suction section 15a in the left-right direction; and a vertical moving portion including, for example, a rail and a slider, for vertically moving the molded article suction portion 15 a. The unloader 15 is provided with a holding claw 152 for preventing the resin molded product W2 sucked by the molded product suction portion 15a from falling while holding the resin molded product W2.

After the mold opening operation is completed, the unloader 15 is moved between the upper mold 2 and the lower mold 3. Then, as shown in fig. 14, the suction opening 15a1 of the molded article suction part 15a is brought into contact with the upper surface of the resin molded article W2, and the suction opening 15b1 of the unnecessary resin suction part 15b is brought into contact with the upper surface of the unnecessary resin K.

In this state, as shown in fig. 15, the transmission mechanism 42 raises the plurality of plungers 421 to lift the unnecessary resin K from the groove block 41. Here, in the case where the residual part K1 in which the unnecessary resin K remains in the plurality of grooves 41a is included, the residual part K1 is raised to such an extent that recovery of the unnecessary resin K is not hindered. Thereby, the unnecessary resin K is released from the groove block 41, and is closely attached to the unnecessary resin adsorption part 15 b. At this time, the unnecessary resin adsorption portion 15b is elastically deformed and contracted in a state where the adsorption opening portion 15b1 is in contact with the unnecessary resin K.

Here, since the plurality of reject pools 41b of the trough 41 are connected to each other by the connection portion 41d as shown in fig. 3 (a), the unnecessary resin K becomes one unnecessary resin body KM connected across the plurality of reject pools 41b as shown in fig. 3 (b), and the number of the unnecessary resins K separated from each other on the trough 41 can be reduced. Accordingly, the number of unnecessary resin adsorption portions 15b can be reduced.

After the unnecessary resin adsorption portions 15b are brought into a contracted state, adsorption by the unnecessary resin adsorption portions 15b is started, and the unnecessary resin K is adsorbed by the adsorption opening portions 15b1 of the unnecessary resin adsorption portions 15 b. Further, the suction of the molded article suction portion 15a is started, and the resin molded article W2 is sucked into the suction opening portion 15a1 of the molded article suction portion 15 a.

Then, as shown in fig. 16, the molded article suction portion 15a to which the resin molded article W2 is sucked is moved in a direction away from the groove block 41 by the moving mechanism 153, and the resin molded article W2 is moved out of the extension portion 411. Thereafter, the unloader 15 is raised, and then, is withdrawn from the upper die 2 and the lower die 3. Thereby, the unloader 15 carries out the resin molded product W2 and the unnecessary resin K. Here, as described above, since the unnecessary resin K is peeled off from the plunger 421 before the unnecessary resin K is peeled off from the groove block 41, the unnecessary resin K is easily recovered.

Here, the unloader 15 may include a cleaning mechanism (not shown) for cleaning the upper and lower dies 2 and 3. Further, as the cleaning mechanism, it is conceivable to include a rotary brush and a suction unit that sucks and discharges dust.

In this case, the unloader 15 that has adsorbed the resin molded product W2 and the unnecessary resin K stays between the upper die 2 and the lower die 3, and performs a cleaning operation.

Here, first, the transfer mechanism 42 performs an operation of removing the resin adhering to the plurality of grooves 41 a. That is, as shown in fig. 17, the transmission mechanism 42 raises the plurality of plungers 421 to a predetermined removal position. Here, the predetermined removal position is, for example, a position at which the upper surface of the plunger 421 is located above the opening position of the groove 41 a. Then, the transfer mechanism 42 is lowered from the predetermined removal position to the loading position for storing the resin material J. Thereafter, the transmission mechanism 42 again raises the plurality of plungers 421 to the predetermined removal position. Thereby, the resin adhering to the inside of the plurality of grooves 41a is scraped out of the plurality of grooves 41 a.

Thereafter, the upper die 2, the lower die 3, the groove block 41, and the plungers 421 are cleaned by a cleaning mechanism provided in the unloader 15. After the cleaning operation is completed, the unloader 15 is retracted from the upper mold 2 and the lower mold 3, and the resin molded product W2 and unnecessary resin K are carried out.

< Effect of the present embodiment >

According to the resin molding apparatus 100 of the present embodiment, since the unnecessary resins K remaining in correspondence with the respective plurality of grooves 41a are connected by the connecting portions 41d, the unnecessary resins K on the groove blocks 41 can be integrated after resin molding. Therefore, not only the unnecessary resin K can be stably recovered, but also the structure of the unloader 15 for recovering the unnecessary resin K can be simplified.

Further, since the plurality of grooves 41a communicate with each other through the coupling portion 41d, even in a configuration in which the transmission mechanism 42 moves the plurality of plungers 421 by the same movement amount, the injection pressure of the resin material J can be made uniform by the resin material J injected from each groove 41a reciprocating in the coupling portion 41d, and it is not necessary that the transmission mechanism 42 includes an isobaric mechanism. This makes it possible to simplify the structure of the transmission mechanism 42.

In addition, in the present embodiment, since the coupling portion 41d couples the plurality of unnecessary resins K into a plurality of groups, when the unnecessary resins K are stored in the waste box, the dead space in the waste box can be reduced, and the number of the unnecessary resins K stored in the waste box can be increased.

In the present embodiment, since the unnecessary resin K is peeled off from the tank block 41 by the plunger 421 before the unnecessary resin K is adsorbed by the unnecessary resin adsorption portion 15b, the unnecessary resin K adsorbed by the unnecessary resin adsorption portion 15b can be reliably recovered from the tank block 41. Further, when the unnecessary resin K is peeled off from the groove block 41 by the plunger 421, the unnecessary resin adsorption portion 15b comes into contact with the unnecessary resin K, and therefore, it is possible to prevent adsorption failure due to the unnecessary resin K tilting or the like in the groove block 41. With the above, the unnecessary resin K on the tank block 41 can be stably recovered.

Here, in the present embodiment, before the unnecessary resin K is peeled off from the groove block 41, the plunger 421 is lowered toward the side opposite to the upper die 2, and the lower surface of the unnecessary resin K is peeled off from the upper surface of the plunger 421, so that the separated unnecessary resin K can be easily recovered.

In the present embodiment, when the unnecessary resin K is peeled from the groove block 41, the unnecessary resin adsorption part 15b is elastically deformed and contracted in a state of being in contact with the unnecessary resin K, and therefore, the unnecessary resin adsorption part 15b can be maintained in a state of being in contact with the unnecessary resin K without hindering the peeling of the unnecessary resin K from the groove block 41. Therefore, the unnecessary resin K after peeling can be reliably adsorbed.

Further, in the present embodiment, since the unloader 15 includes the molded article suction part 15a and the unnecessary resin suction part 15b, the resin molded article W2 and the unnecessary resin K can be carried out at one time by the common carrying mechanism, and the carrying-out time of them can be shortened, and the structure of the resin molding apparatus 100 can be simplified.

In the present embodiment, during the mold opening operation, the transfer mechanism 42 raises the plunger 421 to separate the resin molded product W2 from the unnecessary resin K while the groove block 41 is raised by the elastic force of the elastic member 43, so that the resin molded product W2 can be reliably separated from the unnecessary resin K by the elastic force of the elastic member 43 compressed at the time of mold closing. Further, since the plunger 421 is used for separating the resin molded product W2 from the unnecessary resin K, it is not necessary to increase the elastic force of the elastic member 43, and it is not necessary to increase the size of the elastic member 43, and further, the size of the molding die 2 or 3 and the size of the unnecessary resin K are not increased.

In addition, in the present embodiment, since the unnecessary resin K is sandwiched between the groove block 41 and the upper mold 2 during the period from the start of the mold opening operation to the completion of the gate breaking, the unnecessary resin K can be prevented from being accidentally dropped from the groove block 41 due to a reaction of the unnecessary resin K separating from the resin molded product W2, or the like. Further, since the unnecessary resin K does not fall off from the groove block 41 at the time of separation, it is possible to prevent the adsorption failure due to the inclination of the unnecessary resin K on the groove block or the like.

In the present embodiment, since the transmission mechanism 42 raises the plunger 421 toward the upper die 2 until the elastic member 43 returns to the original state before the unnecessary resin adsorption portion 15b recovers the unnecessary resin K, the front and rear blocks 41 that contact the unnecessary resin adsorption portion 15b with the unnecessary resin do not rise unexpectedly, and the unnecessary resin K can be recovered stably.

< other modified embodiment >

The present invention is not limited to the above embodiments.

For example, in the above embodiment, the plunger 421 is lowered to peel the upper surface of the plunger 421 from the lower surface of the unnecessary resin K before the resin molded product W2 is separated from the unnecessary resin K, but the plunger 421 may be lowered to peel the upper surface of the plunger 421 from the lower surface of the unnecessary resin K after the resin molded product W2 is separated from the unnecessary resin K and before the groove block 41 is peeled from the unnecessary resin K.

In the above embodiment, the plunger 421 is raised when separating the resin molded product W2 from the unnecessary resin K, but the following configuration may be adopted: the resin molded product W2 is separated from the unnecessary resin K only by the elastic member 43 without raising the plunger 421.

Further, in the above embodiment, the resin molded product W2 and the unnecessary resin K are both carried out by the common unloader 15, but the following configuration may be adopted: each of the units includes a conveying mechanism for carrying out the resin molded product W2 and a conveying mechanism for carrying out the unnecessary resin K.

In the above embodiment, the following configuration is adopted: while the resin molded product W2 is pressed against the die surface of the lower die 3 by the ejector pin 61 provided in the upper die 2 before the resin molded product W2 is separated from the unnecessary resin K, a pressing member that presses the resin molded product W2 against the die surface of the lower die 3 may be provided in addition to the ejector pin 61.

Further, in the above embodiment, the culling pool portion 41b, the gate portion 41c, and the connecting portion 41d are formed in the groove block 41, but the culling pool portion, the gate portion, and the connecting portion may be formed in the recess 2b of the upper mold 2. In this case, the unnecessary resin K may be released from the groove block 41 and stay in the concave portion 2b of the upper mold 2 when the upper mold 2 and the lower mold 3 are opened, and therefore, an ejector pin for releasing the unnecessary resin K may be provided in the upper mold 2. In addition, as long as the unnecessary resin K can be connected, the reject pool portion, the gate portion, and the connection portion may be provided in any one of the groove block 41 and the upper die 2. For example, the culling pool portion may be formed in the groove block 41 and the connection portion may be formed in the recess 2b of the upper die 2, or the culling pool portion may be formed in the recess 2b of the upper die 2 and the connection portion may be formed in the groove block 41.

The resin molding apparatus of the present invention is not limited to the general transfer molding, and may be configured to include a transfer mechanism.

In addition, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the invention.

Claims

1. A resin forming apparatus comprising:

a first mold formed with a mold cavity;

a second die which faces the first die and on which a molding object is placed;

a mold clamping mechanism for clamping the first mold and the second mold,

a groove block provided in the second mold, having a plurality of grooves for receiving a resin material, and including a protruding portion protruding from a mold surface of the second mold; and

a transfer mechanism including a plurality of plungers provided in the respective grooves, the transfer mechanism moving the plurality of plungers to inject the resin material from the grooves into the cavity,

a coupling portion for coupling unnecessary resin remaining in correspondence with each of the plurality of grooves is formed in the first die or the groove block,

the transmission mechanism moves the plurality of plungers by the same moving amount.

2. The resin forming apparatus according to claim 1, wherein the first die or the groove block includes a plurality of reject pool portions formed corresponding to the plurality of grooves, respectively,

the coupling portion couples the reject pool portions adjacent to each other to couple the unnecessary resins.

3. The resin molding apparatus according to claim 2, wherein the plurality of reject pool portions and the connecting portion are formed in the groove block.

4. The resin forming apparatus according to any one of claims 1 to 3, wherein the joining portion joins the plurality of unnecessary resins into a plurality of groups.

5. The resin forming apparatus according to any one of claims 1 to 4, wherein the transmission mechanism includes: a fixing block for fixing the plurality of plungers; and a plunger driving unit which moves the plurality of plungers together by moving the fixed block.

6. The resin molding apparatus according to any one of claims 1 to 5, further comprising a conveying mechanism that carries out unnecessary resin on the pocket block after resin molding,

the conveying mechanism includes an unnecessary resin adsorption part for adsorbing the unnecessary resin.

7. The resin molding apparatus according to claim 6, wherein the transfer mechanism moves the plunger toward the first die to peel off the unnecessary resin from the vat block after the conveyance mechanism brings the unnecessary resin suction part into contact with the unnecessary resin on the vat block, and thereafter, the conveyance mechanism sucks the unnecessary resin by the unnecessary resin suction part and carries out the unnecessary resin.

8. The resin molding apparatus according to claim 7, wherein the transfer mechanism moves the plunger to a side opposite to the first die to peel the unnecessary resin from the plunger before moving the plunger to the first die to peel the unnecessary resin from the pocket block.

9. The resin molding apparatus according to any one of claims 6 to 8, wherein the conveying mechanism includes a molded article suction portion for sucking the resin molded article,

the unnecessary resin is adsorbed by the unnecessary resin adsorption part, the resin molded product is adsorbed by the molded product adsorption part, and the unnecessary resin and the resin molded product are carried out.

10. The resin molding apparatus according to claim 9, wherein the conveying mechanism includes a moving mechanism that moves the molded article suction portion, on which the resin molded article is sucked, away from the resin injection portion and moves the resin molded article to an outer side than the protruding portion.

11. The resin molding apparatus according to any one of claims 1 to 10, wherein in a mold opening operation in which the mold clamping mechanism opens the first mold and the second mold, the transfer mechanism moves the plunger toward the first mold to separate the resin molded product on the mold surface of the second mold from the unnecessary resin on the cavity block.

12. The resin molding apparatus according to any one of claims 1 to 11, wherein the slot block is provided so as to be able to advance and retreat with respect to the second die via an elastic member,

in the mold opening operation in which the mold clamping mechanism opens the first mold and the second mold, the groove block is moved toward the first mold by the restoring force of the elastic member, thereby separating the resin molded product on the mold surface of the second mold from the unnecessary resin on the groove block.

13. The resin molding apparatus according to claim 12, wherein the groove block sandwiches the unnecessary resin with the first mold by an elastic force of the elastic member for a predetermined period from a start of the mold opening operation, and peels the unnecessary resin from the first mold while holding the unnecessary resin after the predetermined period has elapsed.

14. The resin molding apparatus according to claim 12 or 13, wherein the transfer mechanism moves the plunger toward the first mold until an initial state in which the elastic member returns to its original state before the mold opening by the mold clamping mechanism is completed,

the conveyance mechanism brings the unnecessary resin adsorption part into contact with the unnecessary resin on the tank block in the initial state.

15. A method for producing a resin molded article, using the resin molding apparatus according to any one of claims 1 to 14.