CN105313279A - Resin sealing device - Google Patents
Resin sealing device Download PDFInfo
- Publication number
- CN105313279A CN105313279A CN201510445912.4A CN201510445912A CN105313279A CN 105313279 A CN105313279 A CN 105313279A CN 201510445912 A CN201510445912 A CN 201510445912A CN 105313279 A CN105313279 A CN 105313279A
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- mould
- block
- mold cavity
- die
- movable block
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
- B29C45/4005—Ejector constructions; Ejector operating mechanisms
- B29C45/401—Ejector pin constructions or mountings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14336—Coating a portion of the article, e.g. the edge of the article
- B29C2045/14459—Coating a portion of the article, e.g. the edge of the article injecting seal elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/33—Moulds having transversely, e.g. radially, movable mould parts
- B29C45/332—Mountings or guides therefor; Drives therefor
- B29C2045/334—Mountings or guides therefor; Drives therefor several transversely movable mould parts driven by a single drive means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3406—Components, e.g. resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The invention provides a resin sealing device provides a resin sealing device which is simple and reliable in structure, arranged on the side of the resin packaging side without other driving sources and reliably enables the jigger pin to be separated from the finished good. In the resin sealing device (1), when the upper die (2) and the lower die (3), the upper die (3) is pressed into the female die (31), the resetting spring (38) is shortened, and the lower female die (31) sank, the jigger pin (34) is positioned in the bottom of the recess, when the upper die (2) and the lower die (3) open, the pin plate (35a) supported by the seat plate (37) and the resetting spring (38) between the top plate (35b) and the lower female die (31) is recovered, the lower female die (31) is supported upwardly, the jigger pin (34) is pulled away to form a finished good. The push rod (5) pushes the pin plate (35a) and the top plate (35b) upwardly so as to enable the top jigger pin (34) to be projected from the recess (31a) to form a pint die.
Description
Technical field
The present invention relates to the resin sealing apparatus with sealing resin sealed electronic part, Specifically, the present invention relates to by with sealing resin by seal the electronic component demoulding time electronic component will push up the resin sealing apparatus of the demoulding by jigger pin.
Background technology
Semiconductor element and the electronic component such as resistive element, capacitor are sealed by sealing resin to protect.Resin sealing apparatus is have employed with during obtained formed products at sealed electronic part.
At this, according to Fig. 7, traditional resin sealing apparatus 100 is described.Traditional resin sealing apparatus 100 shown in Fig. 7 is such devices, it is (not shown that it seals by sealing resin the semiconductor element be installed on lead frame L, semiconductor element S see Fig. 1) thus be made as the formed products M of electronic component D (not shown, the electronic component D see Fig. 1).Resin sealing apparatus 100 is made up of patrix 2 and the counterdie 3x be positioned at below patrix 2.Counterdie 3x is can relative to the flexible mould of patrix 2 oscilaltion be fixed by unshowned lowering or hoisting gear, moved up and down relative to patrix 2 by counterdie 3x, mould assembling action that patrix 2 and counterdie 3x be bonded with each other and the die sinking action that counterdie 3x is separated with patrix 2 can be carried out.Patrix 2 has the patrix former 21 that is formed with recess 21a in bottom surface and around upper framed 22 around patrix former 21.Be formed in the bottom surface of patrix former 21 by the rejecting portion 21c of resin filling and the resin passage 21b becoming the sealing resin stream from rejecting portion 21c to recess 21a.Counterdie 3x has and is formed with the counterdie former 31 of recess 31a, low mold frame 32, jigger pin 34, movable block 35 and the back-moving spring 38 around around counterdie former 31 at end face.Overlapping by the recess 21a of patrix the former 21 and recess 31a of counterdie former 31, form die cavity C.Movable block 35 is made up of pin plate 35a and top board 35b.The lower end of jigger pin 34 is fixed on the end face of top board 35b, and jigger pin 34 is extended to above pin plate 35a by the through hole formed on pin plate 35a.Under at pin plate 35a and top board 35b, by interfixing, both integrally move up and down situation, top board 35b prevents jigger pin 34 from extracting from pin plate 35a.Counterdie former 31 is formed the through hole 31b passed through for jigger pin 34, and jigger pin 34 arrives the recess 31a of counterdie former 31 from movable block 35 via through holes 31b.Back-moving spring 38 is made up of helical spring and is maintained at the state be located between counterdie former 31 and movable block 35.Counterdie former 31 and movable block 35 are biased on the direction be separated from each other by the elastic force of back-moving spring 38.Form in the central authorities of counterdie former 31 and movable block 35 through hole passed through for plunger 6, and the special driving mechanism (not shown) of plunger 6 by plunger 6 in this through hole moves up and down independently relative to counterdie 3x.The upper end of push rod 5 is against the bottom surface of movable block 35, and by upwards driving push rod 5, movable block 35 and jigger pin 34 are also urged upwardly.
As shown in Figure 7, when patrix 2 and counterdie 3x be in be separated from each other state time, electronic component is disposed in die cavity C.In this case, movable block 35 does not upwards push by push rod 5.Thus, counterdie former 31 and movable block 35 are in the state of being separated from each other, and back-moving spring 38 is in the state of extending between counterdie former 31 and movable block 35.Therefore, the front end face of jigger pin 34 is in the state (shown in Fig. 2 described later state) of the recess 31a facing counterdie former 31.
After electronic component is disposed in die cavity C, counterdie 3x rise and relative to the 2-in-1 mould of patrix.Plunger 6 rises further, is contained in space 33 (space formed by plunger 6 and counterdie former 31) the inner sealing resin formed above plunger 6 and is injected into rejecting portion 21c.When plunger 6 rises further, sealing resin to be injected into through resin passage 21b the die cavity C be made up of two recesses 21a, 31a from rejecting portion 21c.Thus, inject sealing resin to die cavity C and terminate, electronic component is covered by sealing resin, becomes formed products M.
When taking out formed products M, along with counterdie former 31 and low mold frame 32 decline, movable block 35, against movable block 35, upwards pushes by push rod 5.Thus, back-moving spring 38 one side of extending between counterdie former 31 and movable block 35 is shunk, and jigger pin 34 one side rises relative to counterdie former 31 and low mold frame 32.
The recess 31a that the jigger pin 34 risen is projected into counterdie former 31 is inner, ejects formed products M.Thus, formed products M is from die cavity C and and then the demoulding counterdie 3x.Now, with the action of formed products M demoulding from counterdie 3x side by side, make plunger 6 increase and jack-up clout E (resin solidified in rejecting portion 21c) until the height identical with formed products M, prevent that clout is cracked to be separated with formed products M with clout.
Under the occasion that formed products M is little, set thin jigger pin 34.Therefore, when being taken out from counterdie 3x by formed products M after forming, the contact area between jigger pin 34 and formed products M is little, therefore successfully can make the formed products M demoulding.But under the occasion that formed products M is large, set large jigger pin 34, therefore the contact area between jigger pin 34 and formed products M increases, exist and become the situation that jigger pin 34 is attached to formed products M and the difficult state departed from.Especially in recent years along with halogen-freeization of sealing resin be in progress, the composition transfer etc. of nonflammable material, to the adhesive force of shaping dies in raising, therefore, estimate that such trend is day by day serious.
Be attached to formed products M at jigger pin 34 and under the occasion that cannot depart from, formed products M can not be taken out from counterdie 3x.In that case, if arrange other drive source, then jigger pin 34 can be pulled away from open formed products M.But must be arranged on mould due to such drive source or have to fundamentally to change press structure, therefore causing the complicated and cost of device to increase such problem.
Therefore, as the resin sealing apparatus not arranging other new drive source reliably make jigger pin be separated with formed products on resin sealing apparatus, the device described in patent document 1 is aware of.The semiconductor element resin seal mould described in patent document 1 as shown in Figure 8 has patrix concave template 1001 for the formation of goods (formed products) and counterdie concave template 1002, for making goods from the jigger pin 1003 of the resin seal mould demoulding, keep pin plate 1004 and the top board 1005 of jigger pin 1003, for the spring 1006 of start pin plate 1004 and top board 1005, be arranged on the backing plate 1007 between spring 1006 and counterdie concave template 1002, be arranged between backing plate 1007 and counterdie concave template 1002 and there is the counteractive back-moving spring 1008 more weak than spring 1006.
In the semiconductor element resin seal mould described in patent document 1, when demoulding resin seal goods middle from mould (patrix former 1001 and counterdie former 1002), so make goods and jigger pin 1003 demoulding against the counterdie concave template 1002 of the downside keeping the コ font groove of counterdie concave template after die sinking at once, namely counterdie concave template 1002 is only made to increase by the reaction of back-moving spring 1008, utilize the upper side against described コ font groove, the die cavity bottom surface of counterdie concave template is separated with jigger pin 1003.Then, the ejecting mechanism of this resin sealing apparatus upwards pushes top board 1005, makes goods and counterdie concave template 1002 demoulding by the jigger pin 1003 remained on top board.So, in the semiconductor element resin seal mould described in patent document 1, the goods of the front end face being attached to jigger pin 1003 can be made to depart from when the demoulding.
Prior art
Patent document
Japanese invention patent application publication number 2000-31179 publication.
Summary of the invention
The problem that invention will solve
But, in the semiconductor element resin seal mould described in patent document 1, by clamping backing plate 1007, in spring 1006 and the relation with the delicate bias force between the counteractive back-moving spring 1008 more weak than spring 1006, only make counterdie concave template 1002 increase, make article removal by jigger pin 1003 simultaneously.Therefore, in the semiconductor element resin seal mould described in patent document 1, the bias force balance of spring 1006 and back-moving spring 1008 is important, therefore these selections are difficult, and the stability probably ejecting action is not enough.And because the semiconductor element resin seal mould described in patent document 1 is provided with backing plate 1007 and back-moving spring 1008, therefore parts are many, mould structure is complicated, and cost increases.
Therefore, the object of this invention is to provide a kind of resin sealing apparatus reliably making formed products disengaging jigger pin without the need to arranging other new drive source.
The means of dealing with problems
The invention provides a kind of resin sealing apparatus, it is by the first mould and forming relative to moveable second mould on the direction of closing of described first mould and departure direction, after being arranged in the electronic component sealing resin in the die cavity formed by described first mould and described second mould and being sealed and obtaining formed products, described electronic component is ejected the demoulding from described die cavity, wherein, described second mould has the second mold cavity block forming described die cavity together with described first mould, can at the movable block relative to movement on the direction of closing of described second mold cavity block and departure direction, to be fixed on described movable block and to be projected into the jigger pin in described die cavity by the through hole be formed in described second mold cavity block, push described movable block towards described second mold cavity block and make described jigger pin be projected into push rod in described die cavity, to be arranged between described second mold cavity block and described movable block and to make bias force act on both elastic components and limit the mobile restriction mechanism of described movable block by the bias force movement of described elastic component on the direction making both be separated, and described mobile restriction mechanism is such mechanism, at described first mould and described second mould on matched moulds direction during relative movement, while described first mould and described second mold cavity block make described elastic component reduce with contacting with each other, make described movable block relative to described second mold cavity block relatively close to and make the front end face of described jigger pin be positioned at the bottom surface place of the described die cavity of described second mold cavity block, and at described first mould and described second mould on die sinking direction during relative movement, while the bias force by described elastic component makes described second mold cavity block abut described first mould, make described movable block relative to the relative movement make the sinking from the bottom surface of the described die cavity of described second mold cavity block of the front end face of described jigger pin on detaching direction of described second mold cavity block.
Invention effect
According to resin sealing apparatus of the present invention, by arranging fixed block and making elastic component be biased relative to the second mold cavity block on the direction making movable block and fixed block relative separation, just reliably jigger pin and formed products pulling can be opened with simple structure without the need to arranging other new drive source.Therefore, resin sealing apparatus structure of the present invention is simple, thus can reduce costs and easily safeguard.
Accompanying drawing explanation
Fig. 1 is the front section view of resin sealing apparatus according to the embodiment of the present invention.
Fig. 2 is the view of the action for illustration of the resin sealing apparatus shown in Fig. 1, is the sectional view of upper die and lower die matched moulds state.
Fig. 3 is the view for illustration of the resin sealing apparatus action after Fig. 2, is the sectional view of the state by plunger, sealing resin being forced into rejecting portion.
Fig. 4 is the view for illustration of the resin sealing apparatus action after Fig. 3, is the sectional view of the state by plunger, sealing resin being injected die cavity.
Fig. 5 is the view for illustration of the resin sealing apparatus action after Fig. 4, is the sectional view being pulled away from out the state of formed products at upper die and lower die die opening state bottom knockout pin.
Fig. 6 is the view for illustration of the resin sealing apparatus action after Fig. 5, is push rod pushes up, jigger pin to be projected in die cavity and to take out by the sectional view of the state of the electronic component of resin seal.
Fig. 7 is the general profile chart for illustration of traditional resin sealing apparatus.
Fig. 8 shows the sectional view of the mold for resin-molding device described in patent document 1.
Detailed description of the invention
Fig. 1 is the longitudinal section of the resin sealing apparatus 1 according to embodiment of the present invention.Resin sealing apparatus 1 according to the present embodiment adds the mobile restriction mechanism of movable block 35 movement limited by the bias force of elastic component 38 compared with conventional resins sealing device 100 as shown in Figure 7.Except adding mobile restriction mechanism, resin sealing apparatus 1 according to the present embodiment has the structure identical with traditional resin sealing apparatus 100 as shown in Figure 7.Specifically, mobile restriction mechanism is made up of fixed block 37, ladder pin 7 and the low mold frame 32A that is formed with the container cavity 32b holding ladder pin 7.Fixed block 37 is arranged in the below of movable block 35, is formed by the seat board of movable support block 35.Fixed block 37 can move in the vertical direction relative to movable block 35 (fixed block 37 and movable block 35 are not one).Fixed block 37 has the size larger than movable block 35 and the position extended to below low mold frame 32A.Fixed block 37 is formed the through hole 37a that can pass for push rod 5.Push rod 5, through through hole 37a, abuts movable block 35, pushes up on movable block 35.Ladder pin 7 by lower end be fixed on Part I 7a on fixed block 37 and with the upper end of Part I 7a formed with continuing mutually and the Part II 7b with the sectional area larger than Part I 7a form.Part I 7a and Part II 7b is cylindrical.The second through hole 32C that the Part II 7b being formed in the first through hole 32B that the container cavity 32b on low mold frame 32A can slide past by the Part I 7a of ladder pin 7 and ladder pin 7 can slide past is formed.Boundary between the first through hole 32B and the second through hole 32C forms stage portion 32a.Formation low mold frame 32A like this, it surrounds counterdie former 31 ground and is fixed on around counterdie former 31, also surrounds movable block 35 from counterdie former 31 to downward-extension ground simultaneously.The end face of low mold frame 32A is set to equally high with the end face of counterdie former 31.In addition, low mold frame 32A is formed to the height touching fixed block 37 according under the state being in the position roughly the same with the recess 31a bottom surface of counterdie former 31 at the front end face 34a of jigger pin 34 when patrix 2 and counterdie 3 matched moulds as shown in Figure 2.That is, the height (length) of low mold frame 32A is as shown in the formula definition: the length in the gap of the height of the height+movable block 35 of the height=counterdie former 31 of low mold frame 32A+between counterdie former 31 and movable block 35.Fixed block 37 has the end 37b as the part more outer than movable block 35.The bottom 32c that end 37b plays the low mold frame 32A when patrix 2 and counterdie 3 matched moulds abuts end 37b and limits the effect of a part for the die-closed position restriction mechanism of the die-closed position of counterdie former 31 thus.That is, the die-closed position that mobile restriction mechanism has in the position of patrix 2 and counterdie 3 matched moulds limit counterdie former 31 and movable block 35 limits mechanism, and this die-closed position limits mechanism and is made up of fixed block 37 and low mold frame 32A.When patrix 2 and counterdie 3 are on matched moulds direction during relative movement, the front end 32c of low mold frame 32A abuts fixed block 37, defines the position relationship between counterdie former 31 and movable block 35.
And when fixed block 37 is declined by the decline of lowering or hoisting gear (not shown) and then counterdie 3, patrix 2 and counterdie 3 die sinking.Now counterdie former 31 is biased by back-moving spring 38, and counterdie former 31 is separated with movable block 35.When counterdie former 31 is separated with movable block 35, the Part II 7b of ladder pin 7 abuts stage portion 32a.Like this, the Part II 7b of ladder pin 7 plays the effect of a part for the die sinking position restriction mechanism of the position (die sinking position) that restriction counterdie former 31 utilizes the bias force of back-moving spring 38 to be separated with movable block 35.Namely, this mobile restriction mechanism also has die sinking position and limits mechanism except described die-closed position limits mechanism, die sinking position limit mechanism patrix 2 with abut stage portion 32a by the Part II 7b of ladder pin 7 during counterdie 3 die sinking and limit the position that counterdie former 31 and movable block 35 be separated by the bias force of back-moving spring 38.Specifically, this die sinking position limit mechanism by contact with the bottom surface of movable block 35 arrange fixed block 37, and the contacts side surfaces of counterdie former 31 arrange and extend on matched moulds direction or die sinking direction and be formed with the low mold frame 32A of the container cavity 32b holding ladder pin 7 and ladder pin 7 is formed.
Action and the using state of the resin sealing apparatus 1 of the embodiment of the present invention that basis is formed as described above are described according to accompanying drawing.First, as shown in Figure 1, under the state of patrix 2 and the non-matched moulds of counterdie 3, counterdie former 31 is biased by back-moving spring 38, therefore is in die sinking position.Die sinking position is now located relative to fixed block 37 by the Part II 7b being inserted into the ladder pin 7 in the low mold frame 32A that is connected with counterdie former 31 with having certain distance.In FIG, push rod 5 contacts movable block 35, but due to this moment not in the state of upper top movable block 35, therefore push rod 5 also can leave gap with movable block 35 discretely between.
As shown in Figure 2, be disposed in after in recess 31a at electronic component D, fixed block 37 and and then counterdie 3 risen by lowering or hoisting gear (not shown), counterdie 3 abuts patrix 2.Abut patrix 2 by counterdie 3, lead frame L is sandwiched between patrix former 21 and counterdie former 31.When fixed block 37 rises further, the movement of counterdie former 31 is restricted because abutting patrix 2, therefore the gap 4 between counterdie former 31 and movable block 35 reduces, and back-moving spring 38 shortens.Risen until low mold frame 32A encounters fixed block 37 by fixed block 37, counterdie former 31 is displaced to die-closed position from die sinking position.The lower end 32c of the low mold frame 32A be connected with counterdie former 31 is die-closed position to the position of the end 37b encountering fixed block 37.
When counterdie former 31 is in die-closed position, the front end face 34a of jigger pin 34 arrives the height and position (see Fig. 2) much the same with the bottom surface of the recess 31a of counterdie former 31.When patrix 2 and counterdie 3 matched moulds, even if owing to there being pressure to be applied on counterdie former 31, this low mold frame 32A is also resisted against on fixed block 37, therefore counterdie former 31 cannot be shifted.Therefore, usually the front end face 34a of jigger pin 34 can be placed in the height (position) identical with the bottom surface of the recess 31a of counterdie former 31.
Then, as shown in Figure 3, plunger 6 is risen by unshowned lowering or hoisting gear, sealing resin is injected rejecting portion 21c.Plunger 6 rises further, and the sealing resin in rejecting portion 21c is injected in die cavity C as shown in Figure 4 by resin passage 21b.
Terminate to inject sealing resin to die cavity C, electronic component D is covered by sealing resin, when becoming formed products M as shown in Figure 4, as shown in Figure 5, make fixed block 37 and and then counterdie 3 decline, make counterdie 3 leave patrix 2, open mould.Now, in patrix 2, by being contained in the jigger pin (not shown) of patrix 2 inside, formed products M is pressed downward out from patrix former 21, and formed products M stays in counterdie 3.
And, by counterdie 3 decline move up in die sinking side relative to patrix 2, counterdie former 31 by back-moving spring 38 bias force abut patrix 2 state under, movable block 35 and fixed block 37 decline.Thus, movable block 35 and fixed block 37 are relative to counterdie former 31 relative movement on detaching direction.
Moved up by movable block 35 and side that fixed block 37 is leaving counterdie former 31, front end face 34a sinking from the recess 31a bottom surface of counterdie former 31 of jigger pin 34, is displaced to the position lower than the recess 31a bottom surface of counterdie former 31.Thus, the front end face 34a of jigger pin 34 that formed products M attaches is separated with formed products M.
When movable block 35 and fixed block 37 decline further, counterdie former 31 leaves patrix 2, and the Part II 7b of ladder pin 7 abuts the stage portion 32a (see Fig. 5) of low mold frame 32A.Thus, counterdie former 31 also declines together with fixed block 37 with movable block 35, and counterdie 3 gets back to die sinking position.
As shown in Figure 6, by utilize lowering or hoisting gear (not shown) make fixed block 37 and and then counterdie 3 decline, make push rod 5 relatively increase relative to counterdie 3.Like this, movable block 35 is upwards pushed by push rod 5, movable block 35 and counterdie former 31 close.When movable block 35 is close to counterdie former 31, jigger pin 34 rises, and its front end 34a is projected in the inside of recess 31a of counterdie former 31.By being projected in the recess 31a inside of jigger pin 34, formed products M must be raised, formed products M demoulding from counterdie 3.
Now, owing to being coordinated with the Part II 7b of ladder pin 7 by back-moving spring 38 pairs of counterdie former 31 bias voltages and the stage portion 32a of low mold frame 32A, therefore the die sinking position of counterdie former 31 is limited.Therefore, it is possible to setting is pushed up on movable block 35 by push rod 5, movable block 35 rises, and also rises in the position of back-moving spring 38, and counterdie former 31 rises together with movable block 35.
As above, even if formed products M is attached at the front end face 34a of jigger pin 34, resin sealing apparatus 1 is also without the need to newly establishing drive source that formed products M just can be made to depart from jigger pin 34 as the drive unit ground of jigger pin 34.
Like this, resin sealing apparatus 1 is by arranging to support from below the mobile restriction mechanism that the fixed block 37 of the movable block 35 being provided with jigger pin 34 is its part relative to traditional resin sealing apparatus 100 as shown in Figure 7, the direction upwards pushing counterdie former 31 makes back-moving spring 38 bias voltage, jigger pin 34 can be pulled away from open formed products M.Therefore, resin sealing apparatus 1 need not arrange other new drive source and just jigger pin 34 and formed products M pulling can be opened.And resin sealing apparatus 1 without the need to increasing new elastic component and increasing new backing plate as the semiconductor element resin seal mould described in patent document 1 as shown in Figure 8 between counterdie former 31 and movable block 35.Therefore, jigger pin can be pulled away from open formed products with simple structure by resin sealing apparatus 1 exactly.Therefore, resin sealing apparatus 1 can reduce costs because structure is simple and easily safeguards.
Further, except using back-moving spring 38 as start except the elastic component of counterdie former 31, if the spring block etc. of leaf spring and cuboid can impose bias force to counterdie former 31, then also can adopt other elastic component.And, in the present embodiment with the first mould for patrix 2, second mould for counterdie 3 illustrates, but the first mould also can for counterdie and the second mould is patrix.And, engage matched moulds by making counterdie 3 rise with patrix 2 in the present embodiment, patrix 2 also can be made to decline and matched moulds to counterdie 3.
Industrial applicibility
The present invention is applicable to the resin sealing apparatus utilizing sealing resin sealing semiconductor element, is especially best suited for and will be formed with the resin sealing apparatus of the electronic component demoulding in resin seal portion with jigger pin.
Description of reference numerals
1 resin sealing apparatus; 2 patrixes; 21 patrix formers; 21a recess; Framed on 22; 3 counterdies; 31 counterdie formers (the second mold cavity block); 31a recess; 32 low mold frame; 32a stage portion; 32b container cavity; 32c bottom; 34 jigger pins; 35 movable blocks; 37 fixed blocks; 37b end; 38 back-moving springs; 5 push rods; 6 plungers; 7 ladder pins.
Claims (7)
1. a resin sealing apparatus, it is by the first mould and can form at the second mould relative to movement on the direction of closing of described first mould and departure direction, after being arranged in the electronic component in the die cavity formed by described first mould and described second mould and utilizing sealing resin to be sealed and being made for formed products, described electronic component is ejected the demoulding from described die cavity, wherein said second mould has the second mold cavity block forming described die cavity together with described first mould, can at the movable block relative to movement on the direction of closing of described second mold cavity block and departure direction, be fixed on described movable block and be projected into the jigger pin in described die cavity by the through hole be formed in described second mold cavity block, towards described second mold cavity block push described movable block and make described jigger pin be projected into push rod in described die cavity, be arranged between described second mold cavity block and described movable block and make bias force act on both elastic components and limit the mobile restriction mechanism of described movable block by the bias force movement of described elastic component on the direction making both be separated, and described mobile restriction mechanism is such mechanism, at described first mould and described second mould on matched moulds direction during relative movement, while described first mould and described second mold cavity block make described elastic component reduce with contacting with each other, make described movable block relative to described second mold cavity block relatively close to and make the front end face of described jigger pin be positioned on the bottom surface of the described die cavity of described second mold cavity block, and at described first mould and described second mould on die sinking direction during relative movement, while the bias force by described elastic component makes described second mold cavity block abut described first mould, make described movable block relative to the relative movement make the sinking from the bottom surface of the described die cavity of described second mold cavity block of the front end face of described jigger pin on detaching direction of described second mold cavity block.
2. resin sealing apparatus according to claim 1, is characterized in that, the die-closed position that described mobile restriction mechanism has when the position of the second mold cavity block described in described first mould and described second mould matched moulds limit and described movable block limits mechanism.
3. resin sealing apparatus according to claim 2, wherein, described die-closed position limit mechanism by contact described movable block sole arrangement fixed block with contact described second mold cavity block side arrangement and the first component extended on matched moulds direction or die sinking direction form, when described first mould and described second mould are on matched moulds direction during relative movement, the front end of described first component abuts described fixed block, defines the position relationship between described second mold cavity block and described movable block.
4. according to the resin sealing apparatus one of claims 1 to 3 Suo Shu, it is characterized in that, described mobile restriction mechanism has the die sinking position restriction mechanism being limited the disconnected position of described second mold cavity block and described movable block when described first mould and described second mould die sinking by described elastic component.
5. resin sealing apparatus according to claim 4, wherein, described die sinking position limits mechanism by the fixed block of sole arrangement contacting described movable block, contact the side arrangement of described second mold cavity block and the first component extended on matched moulds direction or die sinking direction and be fixed on described fixed block and form towards the pin that described second mold cavity block extends, described pin by the Part I be fixed on described fixed block and with the front end of described Part I formed with continuing mutually and the Part II with the sectional area larger than described Part I form, the second through hole that the described Part II of the first through hole that the described Part I that described first component is formed described pin can slide past and described pin can slide past, boundary between described first through hole and described second through hole forms stage portion, when described first mould and described second mould die sinking, the described Part II of described pin is resisted against described stage portion, limit the position that described second mold cavity block is separated with described movable block thus.
6. resin sealing apparatus according to claim 5, is characterized in that, described Part I and the described Part II of described pin are columniform.
7. the resin sealing apparatus according to claim 3,5 or 6, is characterized in that, the perisporium ground of described second mold cavity block of described first component contact is formed.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014154247A JP5854096B1 (en) | 2014-07-29 | 2014-07-29 | Resin sealing device |
| JP2014-154247 | 2014-07-29 |
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| Publication Number | Publication Date |
|---|---|
| CN105313279A true CN105313279A (en) | 2016-02-10 |
| CN105313279B CN105313279B (en) | 2017-06-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510445912.4A Active CN105313279B (en) | 2014-07-29 | 2015-07-27 | Resin sealing apparatus |
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| JP (1) | JP5854096B1 (en) |
| CN (1) | CN105313279B (en) |
Cited By (6)
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| CN105810594A (en) * | 2015-01-21 | 2016-07-27 | 瑞萨电子株式会社 | Manufacturing method of semiconductor device |
| CN112297474A (en) * | 2020-10-15 | 2021-02-02 | 江西视晶光电有限公司 | Transfer film casting equipment for chip packaging |
| CN112476990A (en) * | 2020-11-11 | 2021-03-12 | 重庆千晓机械工业有限公司 | Forming lower die and forming die for ultra-thin fan blade of cooling fan and manufacturing method |
| CN112976666A (en) * | 2019-12-12 | 2021-06-18 | 东莞市天贺电子科技有限公司 | Dynamic balance buffer mechanism applied to compression forming die |
| TWI750369B (en) * | 2017-06-02 | 2021-12-21 | 日商山田尖端科技股份有限公司 | Resin molding die and resin molding device |
| CN114102981A (en) * | 2020-08-28 | 2022-03-01 | 东和株式会社 | Resin molding apparatus and method for manufacturing resin molded product |
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| JP6580519B2 (en) * | 2016-05-24 | 2019-09-25 | Ｔｏｗａ株式会社 | Compression molding apparatus, resin-encapsulated product manufacturing apparatus, compression molding method, and resin-encapsulated product manufacturing method |
| CN107186112A (en) * | 2017-07-26 | 2017-09-22 | 江苏苏高流体机械有限公司 | A kind of fast demolding device |
| CN108943552A (en) * | 2018-08-09 | 2018-12-07 | 深圳市阿莱思斯科技有限公司 | A kind of accurate die pressing encapsulating mould |
| CN110421805A (en) * | 2019-08-30 | 2019-11-08 | 昆山嘉华汽车电子科技有限公司 | A kind of die assembly with novel opening and closing device assembly |
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| CN114102981A (en) * | 2020-08-28 | 2022-03-01 | 东和株式会社 | Resin molding apparatus and method for manufacturing resin molded product |
| CN112297474A (en) * | 2020-10-15 | 2021-02-02 | 江西视晶光电有限公司 | Transfer film casting equipment for chip packaging |
| CN112476990A (en) * | 2020-11-11 | 2021-03-12 | 重庆千晓机械工业有限公司 | Forming lower die and forming die for ultra-thin fan blade of cooling fan and manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105313279B (en) | 2017-06-23 |
| JP5854096B1 (en) | 2016-02-09 |
| JP2016032046A (en) | 2016-03-07 |
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