JP2957565B1 - Resin sealing mold for semiconductor element - Google Patents

Abstract

An object of the present invention is to provide a resin sealing mold for a semiconductor element capable of completely separating an ejector pin and a product without providing a new drive source on the resin sealing device side. SOLUTION: An upper chase block 7 and a lower chase block 8 for forming a product, an ejector pin 6 for releasing the product from a resin sealing mold, a pin plate 4 for holding the ejector pin 6, and A knockout plate, a pin sealing plate, and a resin sealing mold for a semiconductor device having a spring for operating the knockout plate, wherein a sub plate is provided between the spring and a lower chase block; Is established,
A return spring 1 having a smaller reaction force than the spring 5 between the sub-plate 10 and the lower die chase block 8.
1 was provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin mold for a semiconductor device, and more particularly, to a method for completely releasing an ejector pin and a product without providing a new drive source on the resin seal device side. The present invention relates to a resin mold that can be used.

[0002]

2. Description of the Related Art FIG. 2 shows a conventional resin mold. An upper chase block 7 and a lower chase block 8 for forming a product, an ejector pin 6 for releasing the product from the resin sealing mold, a pin plate 4 for holding the ejector pin 6, and a knockout plate. 2, a pin plate 4 and a spring 5 for operating the knockout plate 2. The main mold 1 equipped with the resin sealing mold is used for the resin sealing device.
And a knockout rod 3 for pushing up the knockout plate 2.

In the resin-sealed mold shown in FIG. 2, there is only one pair of the spring 5 and the pin plate 4, and it is impossible to move the ejector pins 6 up and down by the mold alone. An example of a technique for releasing the product from the ejector pin 6 is described in Japanese Patent Laid-Open No. 4-147633. That is, the publication includes a knockout pin that serves as a flat portion of a lower recess forming one side surface of the outer shell of the IC, and that projects the solidified outer shell of the IC from the lower mold surface,
There is disclosed a resin sealing mold for a semiconductor element in which a knockout pin is peeled off after an outer package of an IC is solidified.

[0004]

The resin-sealed mold shown in FIG. 2 has only one pair of the spring 5 and the pin plate 4 as described above, so that the ejector pin 6 cannot be moved up and down by the mold alone. Was. At present, a large number of semiconductor elements are arranged on one lead frame and resin-sealed for the purpose of cost reduction of a product, improvement of productivity, and the like. Thereby, after resin sealing, the number of ejector pins for releasing the product from the resin sealing mold increases, and the contact area between the product and the ejector pin also increases. Although the product can be released from the resin-sealed mold by the ejector pin, the product and the ejector pin remain in close contact, and it is difficult to completely remove the product from the ejector pin. Therefore, there is a limit on the number of semiconductor elements arranged in the lead frame.

In the resin sealing mold disclosed in Japanese Patent Application Laid-Open No. 4-1476333, it is necessary to newly provide a cylinder and a control device for driving an ejector pin in a general resin sealing device. Must be fundamentally changed. Therefore, when applied to an existing resin sealing device, it becomes a significant modification, and there is a problem in cost in terms of its feasibility. SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has been made in consideration of a problem that a resin sealing of a semiconductor element can be completely separated from an ejector pin and a product without providing a new driving source on the resin sealing device side. It is intended to provide a die.

[0006]

In order to achieve the above object, the present invention provides an upper chase block and a lower chase block for forming a product, and a method for releasing a product from a resin mold. An ejector pin, a pin plate and a knockout plate for holding the ejector pin, and a resin sealing mold for a semiconductor element having a spring for operating the pin plate and the knockout plate. A sub-plate is provided between the sub-plate and a return spring having a smaller reaction force than the spring is provided between the sub-plate and the lower chase block.

According to the present invention, the sub-plate and the return spring are incorporated in the lower portion of the lower chase block, so that the ejector pin and the product can be completely separated without providing a new drive source on the resin sealing device side. Can be typed. Therefore, the mold release can be realized at low cost without modifying the existing resin sealing device.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a bag sealing device according to the present invention will be described below with reference to the drawings. In addition,
The same members or those having the same functions as those in FIG. 2 are denoted by the same reference numerals. FIG. 1 is a cross-sectional view of a resin mold according to an embodiment of the present invention. The resin mold includes an upper chase block 7 and a lower chase block 8 for forming a product, an ejector pin 6 for releasing the product from the resin mold, and an ejector pin 6 for holding the ejector pin 6. A spring 5 for operating the pin plate 4 and the knockout plate 2 and the pin plate 4 and the knockout plate 2 is provided.

In the present invention, the spring 5
A sub-plate 10 is provided between the lower plate and the lower chase block 8, and a return spring 11 is provided between the sub-plate 10 and the lower chase block 8. The resin sealing device includes a main mold 1 on which a resin sealing mold is mounted and a knockout rod 3 for pushing up a knockout plate 2.

Next, the operation of the resin-sealed mold of the present embodiment will be described with reference to FIG. The wire-bonded lead frame and resin are sealed with resin by injection molding. After resin sealing is completed, the upper chase block 7
Rises and is separated from the lower die chase block 8. At the time of opening the mold, the upper chase block 7 rises and at the same time, the reaction force of the return spring 11 provided between the lower chase block 8 and the sub-plate 10 causes
Only the lower die chase block 8 rises.

Meanwhile, the position of the pin plate 4 and the knockout plate 2 and the position of the ejector pin 6 held by the same are maintained by the reaction force of the return spring 11. At this stage, the product and the ejector pin 6 can be released from the mold. The strength of the spring force is
The return spring 11 needs to be weaker than the spring 5.

Next, the knockout plate 2 is pushed up by the ejector mechanism of the resin sealing device, and the product and the resin sealing mold are released by the ejector pins 6 held thereon. Therefore, it is possible to completely release the product and the resin sealing mold simply by performing a normal mold opening operation.

The resin-sealed mold according to the present invention incorporates the sub-plate 10 and the spring 11 having a smaller reaction force than the spring 5 in the lower part of the lower mold chase block 7 as described above, thereby forming the upper mold chase block 8. In response to the mold opening operation, only the lower mold chase block 7 can move up and down by the set amount, that is, the gap h between the lower mold chase block 7 and the sub-plate 10. Therefore, when the upper chase block 8 is started to open after the resin sealing is completed, only the lower chase block 7 rises and the position of the pin plate 4 holding the ejector pins 6 does not change. And the product can be released simply by opening the mold. Thereafter, the pin plate 4 is pushed up by the ejector mechanism on the resin sealing device side, and the product is released from the mold, similarly to the conventional resin sealing mold. Therefore, the product and the mold can be completely separated from each other.

[0014]

As described above in detail, according to the present invention, a new driving source is provided on the resin sealing device side by incorporating the sub-plate and the return spring below the lower chase block. Without releasing, the ejector pin and the product can be completely released from the mold. Therefore, the mold release can be realized at low cost without modifying the existing resin sealing device.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional side view showing an embodiment of a resin sealing mold for a semiconductor element of the present invention.

FIG. 2 is a vertical sectional side view of a conventional resin-sealing mold for a semiconductor element.

[Explanation of symbols]

 2 Knockout plate 4 Pin plate 5 Spring 6 Ejector pin 7 Upper chase block 8 Lower chase block 11 Return spring

Claims (1)

(57) [Claims] 1. An upper chase block and a lower chase block for forming a product, an ejector pin for releasing the product from a resin mold, a pin plate and a knockout plate for holding the ejector pin, In a resin sealing mold for a semiconductor element having a spring for operating a pin plate and a knockout plate, a sub-plate is provided between the spring and the lower chase block, and the sub-plate and the lower chase block are provided. And a return spring having a reaction force weaker than the spring is provided between the mold and the resin.