JPH025537A - Resin sealing die - Google Patents

Abstract

PURPOSE:To prevent resin burrs from being formed between the leads of a lead frame at the time of resin sealing by a method wherein the title metal mold is constituted in such a way that when a top force or a bottom force having resin stoppers is fitted into the bottom force or the top force to correspond to the above top force or bottom force, the gap between the surface of the lead frame and the top and bottom forces is eliminated. CONSTITUTION:Resin stoppers 6 formed on a bottom force 3 are fitted into recessed parts 11 formed in a top force 2 and leads 5 of a lead frame 4 are provided between the top and bottom forces 2 and 3. The projecting amount of each stopper 6 is larger than the plate thickness of the lead frame 4, but the stoppers 6 are fitted into the recessed parts 11 of the force 2 and the leads 5 are pinched between the forces 2 and 3 in such a way that no gap is generated between the surface of the lead frame 4 and the forces 2 and 3. In such a way, as the stoppers 6, each consisting of each recessed part projecting larger than the plate thickness of the lead frame, are respectively made to position between the leads of the lead frame 4, a resin does not flow in between the leads at the time of resin sealing and resin burrs are prevented from being formed between the leads. Moreover, as the leads are pinched between the forces 2 and 3 in such a way that no gap is generated between the surface of the lead frame and the forces 2 and 3, resin flashes are prevented from being formed at the time of resin sealing.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resin-sealing mold, and particularly to a resin-sealing mold suitable for use in manufacturing semiconductor devices.

[Conventional technology]

A cull, a launch, a gate, and a cavity are formed in the resin sealing mold, and the lead frame is held between the upper mold and the lower mold to form a passage and a space for resin-sealing the semiconductor device. It is composed of Then, during resin sealing, the cull, launch, and gate of the resin sealing mold are used.
A resin is introduced into the cavity to seal it.

In addition, 1 sudofu 1 is placed between the upper mold and lower mold of the resin sealing mold.
In the state where the lead frame is sandwiched, there is no gap between the lead and the upper mold, and between the lead and the lower mold of the lead frame.

However, between the leads of the lead frame, the thickness of the lead frame (approximately 0.25n) is required between the upper die and the lower die.
There is a gap of minutes. Due to this gap, a resin gap is formed between the leads during resin sealing.

In order to prevent the formation of resin flash, a resin stopper consisting of a convex portion is positioned between the leads of the lead frame where a gap is formed, and the resin sealing reduces the formation of resin flash. Molds are also used. In addition, the technology related to resin sealing and 1 to 1 are disclosed in Japanese Patent Application Laid-open No. 61-26735.
Publication No. 3 is mentioned.

[Problems that the invention attempts to solve]

The above-mentioned conventional technology can reduce the formation of resin particles between leads in resin sealing of a semiconductor device, but cannot prevent it. In other words, if the amount of protrusion of the resin stopper consisting of a convex portion is made larger than the thickness of the lead frame,
Even when the upper and lower molds of the resin sealing mold are fitted together, a gap is formed between the surface of the molded frame and the mold, and the lead frame cannot be reliably held. Therefore, during resin sealing, a resin fludge (a resin film formed on the surface of the lead frame) is formed! , 5°. Therefore, the protrusion of the resin stopper has to be smaller than the thickness of the dome frame, and it is not possible to prevent resin gaps from forming between the leads during resin sealing. .

An object of the present invention is to solve the above-mentioned problems and also to reduce the number of resin sealing molds that prevent the formation of resin pads between the leads during resin sealing.

[Means to solve the problem]

A summary of typical inventions disclosed in this application is as follows.

That is, the present invention provides a resin sealing mold in which a lead frame is sandwiched between an upper mold and a lower mold having a cavity portion, and a resin is introduced into the cavity portions of the upper mold and the lower mold to perform sealing. In the above, the upper mold or the lower mold has a resin stopper made of a convex portion formed to be located between the lead frame glue and the lead frame, and the resin stopper has a protruding amount larger than the plate thickness of the lead frame. The present invention is characterized in that when the upper mold or lower mold having the resin stopper and the corresponding lower mold or upper mold are fitted together, there is no gap between the lead frame and the mold. .

[Effect]

According to the above configuration, since the amount of protrusion of the resin stopper that protrudes between the leads of the lead frame is made larger than the plate thickness of the lead frame, when the upper mold and the lower mold of the resin sealing mold are fitted together, In addition, no gap is created between the upper mold and the lower mold between the leads. Therefore, when sealing with resin, lead deflection occurs.
This can prevent resin particles from forming between the leads of the film. Furthermore, when the upper and lower molds are fitted together, the structure is configured so that there is no gap between the lead 7 frame surface and the upper and lower molds, which prevents resin flash from forming on the leads. can do.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. FIG. 1 is a schematic diagram of a resin-sealed mold according to the present invention. The resin sealing mold 1 consists of an upper mold 2 and a lower mold 3.

The lower mold 3 is formed with a cull 9 serving as a resin injection source, a runner 8 serving as a passage for introducing the resin to the cavity portion 10, and a gate 7.

Then, a resin stopper 6 consisting of a convex portion is formed between the leads 5 of the lead frame 4 disposed on the lower mold 3. The resin stopper 6 has a protruding portion larger in protrusion than the thickness of the bead dome 4, and is configured to fit into a recess formed in the upper mold 2.

FIG. 2 shows the relationship between the lower mold 3 having the resin stopper 6 and the upper mold 2 fitted therein. FIG. 2 is a schematic diagram showing the AA' cross section of the resin-sealing mold 1 shown in FIG. Lower mold 3
The resin stopper 6 formed in the recess 11 formed in the upper mold 2
9, and the leads 5 of the lead frame 4 are held between the upper die 2 and the lower die 3. Protrusion amount of resin stopper 6
-The thickness of the upper mold 2 is larger than that of the mold frame 4.
It fits into the recess 11 of the lead frame 4 and is sandwiched between the surface of the lead frame 4 and the upper mold 2 and lower mold 3 so as not to create a gap. According to this embodiment, the resin stopper 6 consisting of a convex portion that protrudes larger than the plate thickness of the lead frame is positioned between the leads of the lead frame 4, so that the resin does not flow between the leads during resin sealing. It is possible to prevent resin particles from forming between the leads. Furthermore, since the surface of the lead frame is held between the upper mold and the lower mold so that no gap is formed, it is possible to prevent the formation of resin flash during resin sealing.

FIG. 3 is a schematic diagram showing a cross section of another embodiment of the resin-sealed mold of the present invention. This embodiment is the same as the embodiment shown in the Wcz diagram except that a resin removal section 35 is provided (those having the same structure as in FIG. 2 are given the same reference numerals).

The resin removing portion 35 is composed of a plurality of convex portions, and each convex portion is formed to correspond to the position of the resin strafe 60, and also constitutes a part of the concave portion 11 into which the convex portion of the resin stopper 6 fits. ing. This resin removing section 35 is supported by a spring 36 and is configured to move up and down. According to this embodiment, even if the resin flows into the space 37 formed between the resin stopper 6 and the recess 11 during resin sealing and hardens, the resin removal portion 35 can be removed by applying pressure from the arrow F. The sealant that has descended and hardened in the space 37 can be easily removed. Therefore, it is possible to prevent the hardened resin from remaining in the mold, and to reliably fit the upper mold 2 and the lower mold 3 together. Furthermore, resin sealing can be performed that prevents the formation of resin flash and resin flash.

FIG. 4 is a schematic diagram showing a cross section of another embodiment of the resin-sealed mold of the present invention. This drawing shows a portion corresponding to the cross section at A in FIG. 1. Lower mold 2 of resin sealing mold 20
A hole 30 is formed in the hole 30 corresponding to the spacing between the leads 250 of the lead frame 24, and opens into a small chamber 29 provided below. A plurality of resin stoppers 26 made of convex portions formed integrally with the plate body 28 are fitted into the holes 30.

The plate body 28 is supported by a support plate 31 via a spring 27, and the resin stopper 26 can be moved up and down by elastic deformation of the spring 270.

The resin stopper 26 is configured so that the amount of protrusion before the upper mold 22 is fitted to the lower mold 23 is greater than the thickness of the lead frame 24. The upper mold 22 has the structure of a conventional resin-sealed mold. When the lead frame 24 is placed on the lower mold 23 of this resin sealing mold 20 and the upper mold 22 is fitted, the resin stopper 26 is placed between the leads 25 of the lead frame 24, and the gap between the leads 25 is It disappears. Further, since the resin stopper 26 is supported via a spring 27, when the upper mold 22 and the lower mold 23 are fitted together, the resin stopper 26 is pressed by the parting surface of the upper mold 22 and moves downward. A lead frame 24 is held between an upper mold 22 and a lower mold 23. According to this embodiment, since the resin stopper 26 consisting of a convex portion that protrudes larger than the board thickness of the lead frame is located between the leads, it is possible to prevent a resin gap from being formed between the IJ and the IJ. . Also, the lead frame 24 is attached to the upper die 22.
Since the mold 23 and the lower mold 23 are held in such a manner that no gap is formed between them, it is possible to prevent resin flash from being formed. Furthermore, since the resin stopper is movable, the upper mold 22 can have a structure similar to that of a conventional mold, which facilitates manufacturing.

Above, the invention made by the present inventor has been specifically explained based on the examples, but it should be noted that the present invention is not limited to the above examples and can be modified in various ways without departing from the gist thereof. Not even. For example, a structure may be adopted in which the resin stoppers are individually movable.

〔Effect of the invention〕

According to the present invention, since a resin stopper consisting of a convex portion that protrudes larger than the thickness of the lead frame is located between the leads, it is possible to prevent a resin gap from being formed between the leads during resin sealing. I can do it. Furthermore, since the surface of the lead frame is held between the upper mold and the lower mold so that no gap is formed, it is possible to prevent the formation of resin flash during resin sealing.

[Brief explanation of the drawing]

Fig. 1 is a schematic diagram of the resin sealing mold of the present invention, and Fig. 2 is a schematic diagram of the resin sealing mold of the present invention.
FIGS. 3 and 4 are schematic diagrams showing cross sections along line AA' of the resin-sealed mold shown in FIG. 1.20...Resin sealing mold, 2,22...Upper mold, 3
゜23...Lower mold, 4, 24...Lead frame, 5
, 25... Lead, 6, 26... Resin stopper 7
...Gate, 8...Runner, 9...Cal, 10.
... Cavity part, 11... Recessed part, 27.36...
Spring, 28... Plate body, 29... Small chamber, 30.
... hole, 31 ... support plate, 35 ... resin removal part, 3
7...Space. Agent: Patent Attorney Masaru Ogawa Figure 〈-Leadoff 17〇, δ-+)-)' 6-Stone 2) Tsuba゛Diagram

Claims (1)

[Claims] 1. A resin sealing metal that sandwiches a lead frame between an upper mold and a lower mold having a cavity portion, and introduces resin into the cavity portions of the upper mold and the lower mold for sealing. In the mold, the upper mold or the lower mold has a resin stopper made of a convex portion formed to be located between the leads of the lead frame, and the resin stopper has a protruding amount larger than the plate thickness of the lead frame. , a resin-sealed mold characterized in that when the upper mold or lower mold having the resin stopper and the corresponding lower mold or upper mold are fitted together, there is no gap between the lead frame and the mold. . 2. The resin sealing metal according to claim 1, wherein the lower mold or upper mold corresponding to the upper mold or lower mold having the resin stopper has a recessed portion that fits with the resin stopper. Type. 3. The resin-sealed mold according to claim 1 or 2, wherein the upper mold or the lower mold having the resin stopper elastically supports the resin stopper.