JP7331571B2 - Resin encapsulation mold and resin encapsulation method - Google Patents

Description

The present invention relates to a resin encapsulation mold and a resin encapsulation method.

2. Description of the Related Art In resin sealing of a semiconductor element, depending on the type of electronic component such as a semiconductor element to be resin-sealed, exposure molding is performed to form a portion not sealed with resin on the surface of the semiconductor element. In this exposure molding, for example, part of the surface of the semiconductor element is not covered with resin and is exposed to the outside.

In addition, in exposure molding, the resin may leak to the surface to be exposed due to variations in the height and inclination of the semiconductor element, and it is necessary to prevent this resin leakage.

Therefore, in order to prevent resin from leaking onto the surface of the semiconductor element to be exposed, for example, a masking body having required elasticity and heat resistance is provided at the tip of the core fixed to the concave portion of the cavity of the mold. A fixing die has been proposed (see Patent Document 1).

In the mold for resin encapsulation described in Patent Document 1, the front end surface of the masking body is liquid-tightly adhered to the surface of the semiconductor element and presses the semiconductor element to perform exposure molding on the surface of the semiconductor element. Mechanical influence on the semiconductor element is reduced.

Japanese Patent No. 6086166

However, in the mold for resin sealing described in Patent Document 1, there is a problem that the side surface of the masking body and the resin come into wide contact, and the resin sticks to the masking body.

Since the resin sticks to the masking body in this manner, there is a risk that the part of the masking body that is adhered to the resin will be torn off during demolding, resulting in damage to the masking body.

In addition, friction is generated at the point where the masking body and the resin come into contact with each other, resulting in poor releasability and the masking body being easily damaged.

DISCLOSURE OF THE INVENTION The present invention has been devised in view of the above points. An object of the present invention is to provide a sealing method.

In order to achieve the above object, the mold for resin encapsulation of the present invention comprises a first mold on which a substrate on which a semiconductor element is mounted is placed, and a resin on the surface facing the first mold. a mold for resin encapsulation, comprising: a second mold formed with a cavity for filling and sealing the semiconductor element, and provided with an insert for pressing a part of the surface of the semiconductor element; and the insert is formed so as to protrude from the second mold toward the semiconductor element in the facing direction, and is arranged with a first gap from the semiconductor element. and the enclosing portion, has a required elasticity, and has a tip in the opposing direction that presses the surface of the semiconductor element located closer to the semiconductor element than the enclosing portion. and a pressing portion.

Here, the surrounding part is formed so as to protrude from the second mold toward the semiconductor element in the direction in which the first mold and the second mold face each other, and is formed between the semiconductor element and the first mold. The tip of the pressing portion for pressing the surface of the semiconductor element is positioned closer to the semiconductor element than the enclosing portion, so that when the tip of the pressing portion presses the surface of the semiconductor element , the enclosing portion does not come into contact with the surface of the semiconductor element, and the semiconductor element can be prevented from being damaged by the impact.

Further, since the surrounding portion and the surface of the semiconductor element are not in contact with each other, the resin can flow into the first gap between the surrounding portion and the semiconductor element, and pressure loss of the melted resin can be caused. As a result, the pressure of the melted resin is weakened, and it is possible to prevent the resin from entering between the tip of the pressing portion and the surface of the semiconductor element, thereby preventing thin burrs from being formed.

In addition, since the pressing portion having the required elasticity is arranged so as to be surrounded by the enclosing portion, it is possible to prevent the pressing portion from adhering to the molten resin. That is, it is possible to prevent the hardened resin from sticking to the pressing portion in the range surrounded by the enclosing portion of the pressing portion. In addition, the force with which the resin sticks to the pressing portion is reduced, and the portion of the pressing portion that is adhered to the resin is less likely to break, thereby preventing damage to the pressing portion. In addition, it is possible to improve the releasability of the molded article when it is removed from the mold. Furthermore, since the friction generated between the resin and the pressing portion is reduced at the time of mold release, the pressing portion is less likely to be damaged and the durability can be improved.

In addition, the pressing part is elastically deformed by pressing, and the first mold and the second mold are opposed between the tip and the surrounding part in the direction in which the first mold and the second mold are opposed. When the second gap is closed in the direction perpendicular to the direction in which the second gap is formed, it is possible to prevent the resin from entering the second gap, thereby making it difficult for vertical burrs to occur.

Further, if the surrounding portion has a hardness that allows it to maintain its shape when subjected to an external force due to elastic deformation of the pressing portion, the surrounding portion can support the elastically deformed pressing portion. The adhesion of the part is guaranteed, and the occurrence of vertical burrs can be suppressed.

In addition, the pressing portion is formed with an allowance portion whose outer diameter decreases toward the tip in the direction in which the first mold and the second mold face each other, so that the range surrounded by the surrounding portion is the first mold. When the elastically deformed pressing part is configured to fit within the range where the mold and the second mold are extended in the direction facing each other, the first mold and the second mold When tightened, a part of the pressing portion elastically deformed by pressing does not protrude toward the first gap between the enclosing portion and the semiconductor element. As a result, the resin does not adhere to the protruding portion of the pressing portion, and it is possible to prevent deterioration of the releasability when the molded product is removed from the mold. It is possible to prevent the parts and the pressing part from being damaged.

Further, the pressing part has a hole formed along the direction in which the first mold and the second mold face each other, and has a core capable of supporting the pressing part. In the direction in which the second mold faces the second mold, if the surface facing the semiconductor element is accommodated in the hole so that the surface facing the semiconductor element is positioned further away from the semiconductor element than the pressing portion, the elastically deformed pressing portion will be the core portion is supported by and a reaction force is generated. This reaction force is applied as a force that closes the second gap by the elastically deformed pressing portion in a direction perpendicular to the direction in which the first mold and the second mold face each other, and further increases the second gap. In addition, the intrusion of resin can be suppressed.

Furthermore, the area of the pressing portion that presses the surface of the semiconductor element is reduced by the provision of the core portion. As a result, when the pressing portion presses the surface of the semiconductor element, the surface is less likely to be affected by the pressure, and the possibility of damaging the semiconductor element can be reduced.

Further, in the case where a recess is formed at the tip of the pressing portion and the surface of the tip and the periphery of the recess presses the surface of the semiconductor element, the area of the pressing portion that presses the surface of the semiconductor element is increased by the amount of the recess provided. narrow. As a result, when the pressing portion presses the surface of the semiconductor element, the surface is less likely to be affected by the pressure, and the possibility of damaging the semiconductor element can be reduced.

In addition, when a through hole is formed in the pressing portion along the direction in which the first mold and the second mold face each other, and the surface of the tip and the periphery of the through hole presses the surface of the semiconductor element, the through hole is formed. The area of the pressing portion that presses the surface of the semiconductor element is reduced by the amount of the holes. As a result, when the pressing portion presses the surface of the semiconductor element, the surface is less likely to be affected by the pressure, and the possibility of damaging the semiconductor element can be reduced.

Further, in order to achieve the above object, the resin sealing method of the present invention includes covering the surface of a semiconductor element mounted on a substrate placed on a first mold, the first mold and A resin encapsulation method for encapsulating the semiconductor element by matching a second mold facing the first mold and filling resin into a cavity formed in the second mold. a step of pressing the surface of the semiconductor element with a pressing portion having required elasticity provided in the second mold; and a step of pouring resin into a first gap formed by the front end of the enclosing portion surrounding the semiconductor element separated from the surface of the semiconductor element and the surface of the semiconductor element.

Here, when the cavity is filled with the resin, in the direction in which the first mold and the second mold face each other, the tip of the enclosing part surrounding the pressing part separated from the surface of the semiconductor element and the surface of the semiconductor element The step of pouring the resin into the formed first gap can cause the resin to flow into the first gap and cause a pressure drop in the molten resin. As a result, the pressure of the melted resin is weakened, and it is possible to prevent the resin from entering between the tip of the pressing portion and the surface of the semiconductor element, thereby preventing thin burrs from being formed.

Moreover, since the pressing portion having the required elasticity is surrounded by the enclosing portion, it is possible to prevent the pressing portion from adhering to the molten resin. That is, it is possible to prevent the hardened resin from sticking to the pressing portion in the range surrounded by the enclosing portion of the pressing portion. In addition, the force with which the resin sticks to the pressing portion is reduced, and the portion of the pressing portion that is adhered to the resin is less likely to break, thereby preventing damage to the pressing portion. In addition, it is possible to improve the releasability of the molded article when it is removed from the mold. Furthermore, since the friction generated between the resin and the pressing portion is reduced at the time of mold release, the pressing portion is less likely to be damaged and the durability can be improved.

In addition, the step of pouring the resin into the first gap is performed by elastically deforming the pressing portion by pressing, and the direction in which the first mold and the second mold face each other between the pressing portion and the tip of the surrounding portion. When the second gap in the orthogonal direction is closed, the resin can be prevented from entering the second gap, and vertical burrs are less likely to occur.

Further, in the step of pressing the surface of the semiconductor element, the pressing portion is elastically deformed by pressing within a range where the range surrounded by the enclosing portion is extended in the direction in which the first mold and the second mold face each other. In this case, when the first mold and the second mold are clamped, a part of the pressing portion elastically deformed by pressing is directed toward the first gap between the tip of the enclosing portion and the semiconductor element. It never sticks out. As a result, the resin does not adhere to the protruding portion of the pressing portion, and it is possible to prevent deterioration of the releasability when the molded product is removed from the mold. It is possible to prevent the parts and the pressing part from being damaged.

INDUSTRIAL APPLICABILITY A resin encapsulation mold and a resin encapsulation method according to the present invention can suppress breakage of a pressing portion in resin encapsulation of a semiconductor element that is subjected to exposure molding.

BRIEF DESCRIPTION OF THE DRAWINGS It is explanatory drawing which shows the structure of the mold-matching surface side of the upper mold and lower mold which comprise the resin sealing mold of this invention, (a) is a figure of an upper mold, (b) is a lower mold. is a diagram. In the resin sealing mold shown in FIG. 1, (a) is a schematic cross-sectional view showing a state before mold clamping, and (b) is a schematic cross-sectional view showing a state during molding. It is a schematic sectional drawing which shows a masking body and its peripheral structure. In the masking body shown in FIG. 3, (a) is a bottom view, (b) is a side sectional view, and (c) is a plan view. In the masking body shown in FIG. 3, (a) is a schematic perspective view of a socket, (b) is a schematic perspective view of a pressing body, and (c) is a schematic perspective view of a pin. FIG. 4 is a schematic diagram showing the shape of the pressing body before the pressing body presses the surface of the semiconductor element; 1A is a schematic cross-sectional view of a masking body and its peripheral structure, and FIG. It is a schematic enlarged cross-sectional view showing. FIG. 4A is a schematic cross-sectional view of a masking body and its peripheral structure, and FIG. 4B is a schematic showing the surface of the semiconductor device and its peripheral region. It is an expanded sectional view. FIG. 4A is a schematic cross-sectional view of a masking body and its peripheral structure, and FIG. 4B is a schematic diagram showing the semiconductor device surface and its peripheral region. It is an expanded sectional view. FIG. 4 is a schematic diagram showing a state in which a pressing body is elastically deformed; FIG. 11 is a schematic cross-sectional view showing a masking body having a pressing body adopting another shape and its peripheral structure; In the masking body shown in FIG. 11, (a) is a bottom view, (b) is a side sectional view, and (c) is a plan view. In the masking body shown in FIG. 11, (a) is a schematic perspective view of a socket, and (b) is a schematic perspective view of a pressing body. 1A is a schematic cross-sectional view of a masking body and its peripheral structure, and FIG. It is a schematic enlarged cross-sectional view showing. FIG. 4A is a schematic cross-sectional view of a masking body and its peripheral structure, and FIG. 4B is a schematic showing the surface of the semiconductor device and its peripheral region. It is an expanded sectional view. FIG. 4A is a schematic cross-sectional view of a masking body and its peripheral structure, and FIG. 4B is a schematic diagram showing the semiconductor device surface and its peripheral region. It is an expanded sectional view. FIG. 11 is a schematic diagram showing a state in which a pressing body adopting another shape is elastically deformed;

EMBODIMENT OF THE INVENTION Hereafter, with reference to drawings, the form for implementing this invention (it is called "embodiment" hereafter) is demonstrated.

[First embodiment]
A first embodiment of a resin sealing mold according to the present invention will be described in detail with reference to FIGS. 1 to 10. FIG.
As shown in FIGS. 1 and 2, the resin sealing device M has a mold A composed of an upper mold 1 and a lower mold 2 . The mold A is an example of a resin sealing mold according to the present invention. The resin sealing device M is a device that clamps a substrate 30 (see FIG. 3) on which a semiconductor element 3 is placed between an upper mold 1 and a lower mold 2 to perform resin sealing.

In the following description, with reference to FIG. shall be referred to as "above" or "above". 3, the position of the pin 7 with respect to the pressing body 5 is called "inside" or "inside", and the position of the pressing body 5 with respect to the pin 7 is called "outside" or "outside". .

As shown in FIG. 1(a), the upper die 1 has an upper die chess 10 on the die matching surface. Further, the upper die chess 10 is provided with a cull portion 11 , an upper cavity 12 and a plurality of masking bodies 13 . The masking body 13 referred to here corresponds to the nest in the claims of the present application.

Further, as shown in FIG. 1(b), the lower die 2 has a lower die chess 20 on the die matching surface. Also, the lower die chess 20 is provided with a pot portion 21 and a frame mounting surface 22 .

Further, as shown in FIG. 2( a ), the cull portion 11 of the upper die chess 10 is provided at a position facing the pot portion 21 of the lower die chess 20 . The cull portion 11 is a portion that becomes a resin reservoir for the resin 40 extruded from the pot portion 21 when the upper mold 1 and the lower mold 2 are mated (see FIG. 2B).

Also, the upper cavity 12 of the upper die chess 10 is a portion that forms a cavity 120 (see FIG. 2(b)) in a state where the upper die 1 and the lower die 2 are mated. Cavity 120 is filled with resin, and a resin molded portion is formed on the surface of semiconductor element 3 .

A frame mounting surface 22 of the lower die chess 20 is a portion on which a substrate 30 on which a semiconductor element 3 to be sealed with resin is mounted is placed. Further, a cavity 120 is formed by the substrate 30 and the upper cavity 12 in a clamped state.

A plurality of masking bodies 13 of the upper die chess 10 are provided at positions facing the frame mounting surface 22 of the lower die chess 20 (see FIG. 2(a)).

As shown in FIG. 2( a ), the upper die chess 10 has a holder base 14 , a cavity block 15 and a back plate 16 .

Also, the masking body 13 is supported via a holder base 14 , a cavity block 15 and a back plate 16 . That is, the masking body 13 is structured so as to move integrally with the upper die chess 10 when the upper die 1 and the lower die 2 are clamped.

A resin tablet 4 is arranged in the pot portion 21 (see FIG. 2(a)). As shown in FIG. 2(b), with the upper mold 1 and the lower mold 2 clamped, the resin 40 melted from the resin tablet 4 flows through the cull portion 11, runners and gates (reference numerals omitted). and is configured to flow into cavity 120 .

Moreover, the masking body 13 is a structure for forming an exposed portion on a part of the surface of the semiconductor element 3 . The masking body 13 is arranged so as to press part of the surface of the semiconductor element 3 in a clamped state. The number of masking bodies 13 is not particularly limited, and can be appropriately changed according to the type of semiconductor element to be resin-encapsulated. The detailed structure of the masking body 13 will be described below.

As shown in FIG. 3, one masking body 13 has a pressing body 5, a socket 6 and a pin 7. As shown in FIG. The pressing body 5 referred to here corresponds to the pressing portion in the claims of the present application. Also, the socket 6 referred to here corresponds to the enclosing portion in the claims of the present application. Moreover, the pin 7 here corresponds to the core portion in the claims of the present application.

The pressing body 5 is a member that presses the surface of the semiconductor element 3 in a clamped state. By partially pressing the surface of the semiconductor element 3 with the pressing body 5 , a part of the surface of the semiconductor element 3 is formed where resin sealing is not performed, and a part of the surface of the semiconductor element 3 is exposed.

When the pressing body 5 presses the surface of the semiconductor element 3, the pressing body 5 is elastically deformed such that the entire length is compressed and the diameter is partially increased. Then, the gap between the outer surface 5a of the pressing body 5 located at the lower tip of the pressing body 5 and the inner surface 6a of the socket 6 can be closed by the elastically deformed pressing body 5 (FIGS. 3 and 9). (b) and see FIG. 10). In addition, the gap referred to here corresponds to the second gap in the claims of the present application.

The socket 6 is a member that surrounds the outer peripheral surface of the pressing body 5 over substantially the entire length of the pressing body 5 in the longitudinal direction. Also, the pin 7 is a member arranged inside the pressing body 5 .

More specifically, the pressing body 5 is an elastic member made of fluororubber or the like, and its tip 50 presses the surface of the semiconductor element 3 in a clamped state (FIGS. 3 and 5B). , FIGS. 8(b), 9(b) and 10). The pressing body 5 is configured to be elastically deformed by a reaction force received from the surface of the semiconductor element 3 in a state where the tip 50 presses the surface of the semiconductor element 3 .

A flange portion 51 is formed on the pressing body 5 (see FIGS. 3, 4(b) and 5(b)). The flange portion 51 is sandwiched between the socket 6 and the back plate 16 to support the pressing body 5 (see FIG. 3).

Further, the pressing body 5 is formed with a through hole 52 parallel to the longitudinal direction at the center of the inside thereof. In addition, the through-hole 52 here corresponds to the hole in the claims of the present application.

Further, the pressing body 5 is formed with a permissive portion 54 at the outer peripheral corner of the tip 50 so that the pressing body 5 is elastically deformed within a range extending downward from the range surrounded by the socket 6 (Fig. 5(b)). ), see FIGS. 6, 7(b) and 8(b)).

The permissible portion 54 has an outer peripheral diameter that decreases downward at the outer peripheral corner portion of the tip 50 of the pressing body 5, and the end surface of the permissible portion 54 is formed in a straight line.

In addition, the pressing body 5 is elastically deformed outside the range defined by the outer surface 7a (see FIGS. 9B and 10) of the pin 7 (see FIGS. 9B and 10). A permissive portion 55 is formed at the peripheral corner (see FIGS. 5(b), 6, 7(b) and 8(b)).

The permissible portion 55 has an inner peripheral diameter that increases downward at the inner peripheral corner portion of the tip 50 of the pressing body 5, and the end surface of the permissible portion 55 is formed in a straight line.

The socket 6 is a member made of a material having a hardness higher than that of the pressing body 5 . Furthermore, the socket 6 is made of a material having a hardness that allows the socket 6 to maintain its shape when subjected to an external force generated by elastic deformation of the pressing body 5 .

Further, an accommodating portion 60, which is a hole parallel to the longitudinal direction, is formed in the center of the inside of the socket 6 (see FIG. 5(a)). The inner diameter of the accommodating portion 60 is formed to be larger than the outer diameter of the pressing body 5 so that the pressing body 5 can be arranged.

Further, in the clamped state, the tip 62 of the socket 6 is located apart from the surface of the semiconductor element 3 in the vertical direction (see FIG. 10).

As a result, a required gap S1 is formed between the tip 62 of the socket 6 and the surface of the semiconductor element 3 when the tip 50 of the pressing body 5 presses the surface of the semiconductor element 3 and is elastically deformed. (See FIG. 10). The gap S1 here corresponds to the first gap in the claims of the present application.

A flange portion 63 is formed on the socket 6 (see FIGS. 3, 4(b) and 5(a)). The flange portion 63 is sandwiched between the cavity block 15 and the back plate 16 to support the socket 6 (see FIG. 3).

The pin 7 is a member formed of a material having a higher hardness than the pressing body 5, and is formed of a large diameter portion 70 and a small diameter portion 71 having different diameters (see FIG. 5(c)).

Further, in the clamped state, the tip 72 of the pin 7 is located above the surface of the semiconductor element 3 (see FIG. 9B).

As a result, a required gap S12 is formed between the tip 72 of the pin 7 and the surface of the semiconductor element 3 when the tip 50 of the pressing body 5 presses the surface of the semiconductor element 3 and is elastically deformed. (See FIG. 9(b)). This gap S<b>12 is a gap that is smaller than the gap S<b>2 due to the deformation of the pressing body 5 . The gap S2 is the gap formed between the tip 72 of the pin 7 and the surface of the semiconductor element 3 before the tip 50 of the pressing body 5 contacts and presses the surface of the semiconductor element 3. is.

Here, the masking body 13 does not necessarily have to include the pin 7 , and the masking body may be composed of the pressing body 5 and the socket 6 . However, as will be described later, by adopting a structure in which the elastically deformed pressing body 5 is supported by the pin 7, the elastically deformed pressing body 5 is less likely to escape in the direction of the pin 7. , the gap with the inner surface 6a of the socket 6 can be more easily closed. Therefore, it is preferable that the masking body 13 includes the pin 7 .

In addition, the pressing body 5 is not necessarily made of fluororubber, and the socket 6 is made of a material having a hardness that allows the socket 6 to maintain its shape when subjected to an external force generated by elastic deformation of the pressing body 5. does not need to be However, since the elastically deformed pressing body 5 tends to close the gap between the outer surface 5a of the pressing body 5 and the inner surface 6a of the socket 6, the socket 6 is formed by the elastic deformation of the pressing body 5. It is preferable that the socket 6 is made of a material having a hardness that allows the socket 6 to maintain its shape when subjected to an external force. In addition, when the resin comes into contact with the molten resin, it becomes difficult for the resin to stick to the socket 6 , and accordingly, sticking of the resin to the pressing body 5 can be prevented or reduced. As a result, the portion of the pressing body 5 that is adhered to the resin is less likely to tear when the mold is released, and the pressing body 5 can be prevented from being damaged. preferably.

Moreover, it is not always necessary for the pressing body 5 to be formed with the permissible portion 54 at the tip 50 so that the pressing body 5 is elastically deformed within a range extending downward from the range surrounded by the socket 6 . However, as will be described later, the side surface 54a (see FIGS. 9B and 10) of the elastically deformed pressing body 5 has a shape that does not protrude toward the gap S1, and the releasability of the resin molded product is improved. Moreover, breakage of the resin molded portion and the pressing body 5 can be suppressed. Therefore, it is preferable that the pressing body 5 is formed with a permissive portion 54 at the tip 50 so that the pressing body 5 is elastically deformed within a range extending downward from the range surrounded by the socket 6 .

Note that the side surface 54a is a surface formed on the outer peripheral portion of the lower tip of the pressing body 5, which is located on a line extending downward from the outer surface 5a of the pressing body 5 that has been elastically deformed while maintaining the same diameter. is.

Moreover, the end surface of the allowance portion 54 does not necessarily have to be formed in a straight line, and for example, the end surface may be formed in a curved shape.

Further, it is not always necessary to form the permissive portion 55 at the tip end 50 of the pressing body 5 so that the pressing body 5 is elastically deformed outside the downwardly extended range of the range surrounded by the outer surface 7a of the pin 7. . However, as will be described later, the elastically deformed side surface 55b (see FIG. 9B) of the pressing body 5 has a shape that does not protrude into the gap S12, and damage to the pressing body 5 can be suppressed. Therefore, it is preferable that the pressing body 5 is formed with a permissive portion 55 at its tip 50 so that the pressing body 5 is elastically deformed outside the downward extension of the range surrounded by the outer surface 7a of the pin 7 .

The side surface 55b is the inner surface 5b of the elastically deformed pressing body 5, which is located inside the outer surface 5a and faces the outer surface 7a of the pin 7, and extends downward with the same diameter. This surface is positioned on a line and is formed on the inner peripheral portion of the lower tip of the pressing body 5 .

Moreover, the end face of the allowance portion 55 does not necessarily have to be formed in a straight line, and for example, the end face may be formed in a curved shape.

Next, a series of operations for pressing the surface of the semiconductor element 3 with the masking body 13 when clamping the upper mold 1 and the lower mold 2 and the effects of the present invention will be described with reference to FIGS. 6 to 10. explain. The following description is also an example of a resin sealing method to which the present invention is applied.

First, before mold clamping, the substrate 30 on which the semiconductor element 3 is mounted is placed at a predetermined position on the frame mounting surface 22 of the lower die chess 20, and the masking body 13 is positioned above the semiconductor element 3. (See FIG. 7(a)).

In addition, before mold clamping, there is a predetermined distance in the vertical direction between the tip 50 of the pressing body 5 and the surface of the semiconductor element 3, and the allowable portion 54 of the outer peripheral edge and the allowable portion of the inner peripheral edge. The shape of 55 is maintained (see FIGS. 6 and 7(b)).

Subsequently, the lower die 2 is lifted by a die clamping device (not shown), and the upper die chess 10 and the lower die chess 20 are brought into contact with each other for die clamping (see FIG. 8(a)). As a result, the tip 50 of the pressing body 5 comes into contact with the surface of the semiconductor element 3 (see FIG. 8B). A gap S<b>2 is formed between the tip 72 of the pin 7 and the surface of the semiconductor element 3 .

A cavity 120 is formed between the upper die chess 10 and the substrate 30 placed on the lower die chess 20 (see FIG. 9A).

In addition, when the mold clamping is completed, the pressing body 5 presses the semiconductor element 3 due to the clamping force, and the pressing body 5 is elastically deformed by the reaction force received from the semiconductor element 3 (see FIG. 9B). ).

At this time, a gap S<b>1 is formed between the tip 62 of the socket 6 and the surface of the semiconductor element 3 . A gap S12 is formed between the tip 72 of the pin 7 and the surface of the semiconductor element 3 (see FIG. 9B). Further, the area of the surface of the semiconductor element 3 where the gap S<b>12 is formed is a portion that is not pressed by the masking body 13 .

As a result, a part of the surface of the semiconductor element 3 is pressed by the tip 50 of the pressing body 5, and of the surface, the range in contact with the tip 50 of the pressing body 50 and the range surrounded by the tip 50 are made of resin. It becomes an exposed portion that is not sealed (see FIGS. 9(a), 9(b) and 10).

The elastically deformed pressing member 5 is brought into close contact with the surface of the semiconductor element 3 to prevent the molten resin from entering between the tip of the pressing member 5 and the surface of the semiconductor element 3 and the gap S12.

In addition, by elastically deforming the pressing body 5, variations in height and inclination of the semiconductor element 3 are absorbed, and adhesion is ensured. can be suppressed. As a result, it is possible to carry out exposure molding in which a part of the surface of the semiconductor element 3 is exposed.

Further, the pressing body 5 is elastically deformed so as to swell outward, so that the gap (illustration and reference numerals omitted) between the outer surface 5a of the pressing body 5 and the inner surface 6a of the socket 6 is elastically deformed. 5 (see FIGS. 9(b) and 10).

As a result, the melted resin does not flow into the gap between the outer surface 5a of the pressing body 5 located at the lower tip of the pressing body 5 and the inner surface 6a of the socket 6, resulting in an upward burr. It is possible to suppress the occurrence of vertical burrs.

In addition, due to the elastic deformation of the pressing body 5, the inner surface 5b of the pressing body 5 comes into contact with the outer surface 7a of the pin 7, and the pressing body 5 is supported by the pin 7 at the same portion (Fig. 9(b) and FIG. 10). Further, the pressing body 5 receives a reaction force from the pin 7 because it is supported by the pin 7 .

The reaction force that the pressing body 5 receives from the pin 7 is added to the force that causes the elastically deformed pressing body 5 to close the gap between the outer surface 5 a of the pressing body 5 and the inner surface 6 a of the socket 6 .

As a result, the melted resin does not flow into the gap between the outer surface 5a of the pressing body 5 and the inner surface 6a of the socket 6, and the occurrence of vertical burrs can be suppressed. In FIG. 10, the direction in which the elastically deformed pressing body 5 stretches inward and outward is indicated by a double-ended arrow with a symbol T. As shown in FIG.

In addition, by forming a gap S1 between the tip 62 of the socket 6 and the surface of the semiconductor element 3 in a clamped state, the tip 62 of the socket 6 is prevented from contacting the surface of the semiconductor element 3. can. As a result, damage to the semiconductor element 3 due to contact between the tip 62 of the socket 6 and the surface of the semiconductor element 3 can be prevented.

In addition, when the mold is clamped, a gap S1 is formed between the tip 62 of the socket 6 and the surface of the semiconductor element 3, so that the tip 50 of the pressing body 5 and the surface of the semiconductor element 3 can be It becomes difficult for the molten resin to enter, and the generation of thin burrs can be suppressed.

That is, when the molten resin tries to flow into the gap S1, pressure loss of the molten resin occurs. As a result, the pressure of the melted resin is weakened, making it difficult for the melted resin to enter between the front end 50 of the pressing body 5 in close contact with the surface of the semiconductor element 3 and the surface of the semiconductor element 3 .

In addition, since the socket 6 surrounds the pressing body 5, the area where the molten resin sticks to the outer surface 5a of the pressing body 5 made of an elastic material is limited to the area facing the gap S1.

That is, the melted resin sticks to the pressing body 5 in the range corresponding to the gap S1, so that the force with which the resin sticks to the outer surface 5a of the pressing body 5 can be reduced. As a result, the portion of the outer surface 5a of the pressing member 5 that is adhered to the resin is less likely to break when the pressing member 5 is released, and damage to the pressing member 5 can be suppressed. Moreover, the releasability of the resin molded product can be improved. Moreover, it is possible to prevent the pressing body from being damaged when the pressing body 5 is demolded due to the resin sticking to the outer surface 5 a of the pressing body 5 .

Further, of the surface of the semiconductor element 3 , the range where the gap S<b>12 is formed is a region that is not pressed by the tip 50 of the pressing body 5 . According to this, the masking body is structured such that the area surrounded by the tip 50 of the pressing body 5 on the surface of the semiconductor element 3 is also pressed by the pressing body. The area of the range to be pressed by the pressing body can be reduced as compared with a structure in which the through hole 52 is not provided and has a solid shape.

In this way, by reducing the area of the range where the pressing body presses the surface of the semiconductor element 3 , when the pressing body 5 presses the surface of the semiconductor element 3 , the surface is covered with the resin by the pressing body 5 . The possibility of damage to the semiconductor element 3 can be reduced by widening the portion unaffected by the pressure while pressing the semiconductor element 3 with a pressure that does not invade the semiconductor element 3 .

In addition, when the pressing body 5 is elastically deformed in a state in which mold clamping is completed, the permissible portion 54 on the outer peripheral edge of the tip 50 of the pressing body 5 is directed downward with the outer surface 5a of the pressing body 5 remaining the same diameter. The shape of the side surface 54a is extended (see FIGS. 9B and 10).

The shape of the side surface 54 a of the pressing body 5 is formed at a portion near the tip 62 of the socket 6 at the outer peripheral edge of the tip 50 of the pressing body 5 .

Further, the side surface 54a of the pressing body 5, which is close to the tip 62 of the socket 6, is located inside the inner surface 6a of the socket 6 in the inside-outside direction. In other words, the side surface 54a of the pressing body 5 has a shape that does not protrude into the gap S1 located outside the side surface 54a (see FIGS. 9B and 10).

Further, when the pressing body 5 is elastically deformed in a state in which mold clamping is completed, the allowance portion 55 of the inner peripheral edge portion of the tip 50 of the pressing body 5 pushes the outer surface 7a (see FIG. 9B) of the pin 7 downward. The shape of the side surface 55b is such that the side surface 55b is extended toward the direction with the same diameter (see FIGS. 9B and 10).

The shape of the side surface 55 b of the pressing body 5 is formed at a portion near the tip 72 of the pin 7 at the inner peripheral edge of the tip 50 of the pressing body 5 .

Further, the side surface 55b of the pressing body 5, which is close to the tip 62 of the socket 6 in the vertical direction, is positioned further outward than the outer surface 7a of the pin 7 in the internal and external directions. In other words, the side surface 55b of the pressing body 5 has a shape that does not protrude into the gap S12 located inside the side surface 55b (see FIGS. 9B and 10).

In this way, in a state where mold clamping is completed, the permissible portion 54 and the permissible portion 55 of the outer peripheral edge portion of the tip 50 of the pressing body 5 are formed into the shapes of the side surfaces 54a and 55b, so that the following effects can be obtained. occur.

First, on the side surface 54a of the pressing body 5 near the tip 62 of the socket 6, if the side surface 54a protrudes into the gap S1, the area where the molten resin adheres to the side surface 54a of the pressing body 5 is limited. As the area becomes wider and the adhesive force becomes stronger, the releasability of the resin molded product becomes worse.

Further, if the resin molded product is separated from the mold against the force of the resin adhering to the pressing body 5, there is a risk that the resin molded part will be broken or that the pressing body 5 will be torn off.

Therefore, the elastically deformed side surface 54a of the pressing body 5 has a shape that does not protrude into the gap S1.

Moreover, the side surface 54a of the pressing body 5 is less likely to be caught between the tip 62 of the socket 6 and the surface of the semiconductor element 3 in the clamped state. As a result, it is possible to prevent damage to the pressing body 5 due to the pressing body 5 being sandwiched between the tip 62 of the socket 6 and the surface of the semiconductor element 3 .

Further, the side surface 55b of the pressing body 5 near the tip 72 of the pin 7 has a shape that does not protrude into the gap S12. The side surface 55b is less likely to be pinched. As a result, it is possible to prevent damage to the pressing body 5 due to the pressing body 5 being sandwiched between the tip 72 of the pin 7 and the surface of the semiconductor element 3 .

As described above, the mold A, which is an example of a mold for resin sealing to which the present invention is applied, forms an exposed portion on a part of the surface of the semiconductor element 3 with the pressing body 5, while preventing the generation of vertical burrs. can be suppressed.

[Second embodiment]
Next, a second embodiment of the invention will be described. The second embodiment differs from the first embodiment in that the shape of the pressing body is different and that pins are not included as constituent members of the masking body.

In the following description, detailed descriptions of the structures that overlap with the contents of the first embodiment already described will be omitted, and the description will focus on the parts that are different in structure from the first embodiment.

As shown in FIGS. 11, 12 and 14, the mold of the second embodiment has a masking body 130, a socket 6, and a pressing body 105. As shown in FIGS. The structure of the socket 6 is shown in FIG. 13(a), but since it is the same structure as in the first embodiment, the explanation of the socket 6 is omitted.

The pressing member 105 is an elastic member made of fluororubber, and is a member that presses the surface of the semiconductor element 3 in a clamped state. A concave portion 152 is formed in the tip surface 150 of the pressing body 105 (see FIGS. 11, 12 and 13B). This tip surface 150 is a portion that presses the surface of the semiconductor element 3 .

Further, since the depression 152 of the pressing body 105 is provided, a gap S3 is formed between the pressing body 105 and the surface of the semiconductor element 3 when the tip surface 150 of the pressing body 105 presses the surface of the semiconductor element 3 . (See FIG. 15(b)).

In addition, the pushing body 105 is formed with a permissible portion 154 at the outer peripheral corner of the tip 150 so that the pressing body 105 is elastically deformed within a range extending downward from the range surrounded by the socket 6 (FIG. 13(b)). ), see FIGS. 14(b) and 15(b)). Unlike the pressing body 5 described above, the pressing body 105 does not have a permissive portion formed at the inner peripheral corner of the tip 150 thereof.

The permissive portion 154 has an outer peripheral diameter that decreases downward at the outer peripheral corner portion of the tip 150 of the pressing body 105, and the end surface of the permissible portion 154 is formed in a straight line.

Here, the end face of the allowance portion 154 does not necessarily have to be formed in a straight line, and for example, the end face may be formed in a curved shape.

Masking body 130 is supported via cavity block 15 and back plate 160 (see FIG. 11). A flange portion 151 is formed on the pressing body 105 (see FIG. 13(b)). The flange portion 151 is sandwiched between the socket 6 and the back plate 160 to support the pressing body 105 .

Further, in the clamped state, the tip 62 of the socket 6 is located apart from the surface of the semiconductor element 3 in the vertical direction (see FIGS. 16(b) and 17).

As a result, a required gap S4 is formed between the tip 62 of the socket 6 and the surface of the semiconductor element 3 when the tip 50 of the pressing body 5 presses the surface of the semiconductor element 3 and is elastically deformed. (see FIGS. 16(b) and 17). The gap S4 here corresponds to the first gap in the claims of the present application.

14 to 17, a series of operations for pressing the surface of the semiconductor element 3 with the masking body 130 and the effects of the present invention when the upper mold 1 and the lower mold 2 are clamped. explain.

First, before mold clamping, the substrate 30 on which the semiconductor element 3 is mounted is placed at a predetermined position on the frame mounting surface 22 of the lower die chess 20, and the masking body 130 is positioned above the semiconductor element 3. (See FIG. 14(a)).

In addition, before mold clamping, there is a predetermined distance in the vertical direction between the tip 150 of the pressing body 105 and the surface of the semiconductor element 3, and the shape of the permissible portion 154 on the outer peripheral edge is maintained. (See FIG. 14(b)).

Subsequently, the lower die 2 is lifted by a die clamping device (not shown), and the upper die chess 110 and the lower die chess 20 are brought into contact with each other to perform die clamping (see FIG. 15(a)). The tip 150 contacts the surface of the semiconductor element 3 (see FIG. 15(b)).

A cavity 120 is formed between the upper die chess 110 and the substrate 30 placed on the lower die chess 20 when the clamping is completed (see FIG. 16(a)).

In addition, when the mold clamping is completed, the pressing body 105 presses the semiconductor element 3 due to the clamping force, and the pressing body 105 is elastically deformed by the reaction force received from the semiconductor element 3 (see FIG. 16B). ).

At this time, a gap S4 is formed between the tip 62 of the socket 6 and the surface of the semiconductor element 3 (see FIG. 16(b)). A gap S<b>13 is formed by the concave portion 152 of the pressing body 105 and the surface of the semiconductor element 3 . This gap S<b>13 is a gap that is reduced from the gap S<b>3 due to the deformation of the pressing body 5 . Further, of the surface of the semiconductor element 3, the area where the gap S13 is formed is a portion that is not pressed by the masking member 130. As shown in FIG.

As a result, a part of the surface of the semiconductor element 3 is pressed by the tip 150 of the pressing body 105, and of the surface, the range in contact with the tip 150 of the pressing body 105 and the range surrounded by the tip 150 are covered with the resin. 16(a), 16(b) and 17).

The elastically deformed pressing body 105 adheres to the surface of the semiconductor element 3, and can prevent the molten resin from entering between the tip 150 of the pressing body 105 and the surface of the semiconductor element 3 and the gap S13.

In addition, by elastically deforming the pressing body 105, variations in height and inclination of the semiconductor element 3 are absorbed, and adhesion is ensured, thereby preventing the resin from entering the portion of the surface of the semiconductor element 3 to be exposed. can be suppressed. As a result, it is possible to carry out exposure molding in which a part of the surface of the semiconductor element 3 is exposed.

In addition, due to the elastic deformation of the pressing body 105, the gap (illustration and reference numerals omitted) between the outer surface 105a of the pressing body 105 located at the lower tip of the pressing body 105 and the inner surface 6a of the socket 6 is elastically deformed. It is closed by the pressed pressing body 105 (see FIGS. 16(b) and 17).

As a result, the melted resin does not flow into the gap between the outer surface 105a of the pressing body 105 located at the lower tip of the pressing body 105 and the inner surface 6a of the socket 6, thereby suppressing the occurrence of vertical burrs. can. In FIG. 17, the direction in which the elastically deformed pressing body 105 stretches inward and outward is indicated by a double-ended arrow with a symbol T. As shown in FIG.

Further, of the surface of the semiconductor element 3 , the range where the gap S 13 is formed is a region that is not pressed by the tip 150 of the pressing body 105 . As a result, as in the first embodiment, it is possible to reduce the area of the range in which the pressing body presses the surface of the semiconductor element 3 .

As a result, when the pressing body 105 presses the surface of the semiconductor element 3 , the surface is pressed by the pressing body 5 with a pressure that does not allow the resin to penetrate, and the area where the pressure does not affect is widened, so that the semiconductor element 3 is It can reduce the possibility of damage.

Here, as the shape of the pressing body 105, in addition to the shape in which the recess 152 is formed, instead of the recess 152, a through hole is formed inside the pressing body 105, and a pin is not arranged in the through hole. Structures can also be employed. Even in this case, it is possible to reduce the area of the range where the pressing body 105 presses against the surface of the semiconductor element 3 .

In addition, when the pressing body 105 is elastically deformed in a state in which mold clamping is completed, the permissible portion 154 of the outer peripheral edge of the tip 150 of the pressing body 105 faces downward with the outer surface 105a of the pressing body 105 remaining the same diameter. The shape of the side surface 154a looks like an extension (see FIGS. 16(b) and 17).

The shape of the side surface 154a of the pressing body 105 is located inside the inner surface 6a of the socket 6 in the inside-outside direction, similar to the shape of the side surface 54a of the pressing body 5 in the first embodiment. In other words, the side surface 154a of the pressing body 105 has a shape that does not protrude into the gap S4 located outside the side surface 154a (see FIGS. 16B and 17).

In this way, the elastically deformed side surface 154a of the pressing body 105 has a shape that does not protrude into the gap S4. .

In addition, the side surface 154a of the pressing body 105 is less likely to be caught between the tip 62 of the socket 6 and the surface of the semiconductor element 3 in the clamped state. As a result, it is possible to prevent damage to the pressing body 105 due to the pressing body 105 being sandwiched between the tip 62 of the socket 6 and the surface of the semiconductor element 3 .

Thus, in the second embodiment as well, the pressing body 105 forms an exposed portion on the surface of the semiconductor element 3 while suppressing the occurrence of vertical burrs.

INDUSTRIAL APPLICABILITY As described above, the resin encapsulation mold according to the present invention can prevent the pressing portion (masking body) from being damaged in resin encapsulation of a semiconductor element that is subjected to exposure molding.
Further, the resin sealing method according to the present invention is a method capable of suppressing breakage of the pressing portion (masking body) in resin sealing of a semiconductor element that is subjected to exposure molding.

The terms and expressions used in the specification and claims are for the purpose of description only and should not be regarded as limiting the features described and claimed herein. There is no intention to exclude some equivalent terms or expressions. Moreover, it goes without saying that various modifications are possible within the scope of the technical idea of the present invention.

M resin sealing device 1 upper mold 10 upper mold chess 11 cull part 12 upper cavity 120 cavity 13 masking body (insertion)
14 holder base 15 cavity block 16 back plate 2 lower mold 21 pot part 22 frame mounting surface 3 semiconductor element 30 substrate 4 resin tablet 40 resin 5 pressing body (pressing part)
5a outer surface 5b inner surface 50 tip 51 flange portion 52 through hole 54 allowance portion 54a side surface 55 allowance portion 55b side surface 6 socket (surrounding portion)
6a Inner surface 60 Receiving part 62 Tip 63 Flange part 7 Pin (core part)
7a outer surface 70 large diameter portion 71 small diameter portion 72 tip S1 gap S2 gap S12 gap 105 pressing member (pressing portion)
105a outer surface 150 tip surface 151 flange portion 152 recessed portion 154 allowance portion 154a side surface 110 upper die chess 160 back plate S3 gap S13 gap S4 gap

Claims (10)

A first mold on which a substrate on which a semiconductor element is placed is placed, and a resin is filled in a surface facing the first mold to form a cavity for sealing the semiconductor element, and the semiconductor A resin sealing mold comprising: a second mold provided with an insert that presses a part of the surface of the element,
The nesting is
an enclosing portion protruding from the second mold toward the semiconductor element in the facing direction and arranged with a first gap from the semiconductor element;
a pressing portion that is surrounded by the enclosing portion, has a required elasticity, and presses the surface of the semiconductor element, the tip of which in the facing direction is positioned closer to the semiconductor element than the enclosing portion; A mold for resin sealing. The mold for resin sealing according to claim 1, wherein the pressing portion closes a second gap in a direction perpendicular to the opposing direction between the tip and the enclosing portion by elastic deformation due to pressing. 3. The mold for resin sealing according to claim 1, wherein the enclosing portion has a hardness capable of maintaining its shape when receiving an external force due to elastic deformation of the pressing portion. The pressing portion is provided with an allowance portion having an outer peripheral diameter that decreases toward the distal end in the facing direction, so that the pressing portion has an elastic range within a range obtained by extending the range surrounded by the surrounding portion in the facing direction. 4. The mold for resin sealing according to claim 1, wherein the deformed pressing portion is accommodated therein. The pressing portion has a hole formed along the facing direction,
Having a core portion capable of supporting the pressing portion,
The core portion is accommodated in the hole portion so that a surface facing the semiconductor element is located further away from the semiconductor element than the pressing portion in the facing direction. The mold for resin sealing according to claim 3 or 4. 5. The resin according to claim 1, 2, 3, or 4, wherein the pressing portion has a recess formed at the tip, and the surface of the tip and the periphery of the recess presses the surface of the semiconductor element. Mold for encapsulation. 1, 2, 3 or claim 1, wherein the pressing portion has a through hole formed along the facing direction, and the surface of the semiconductor element is pressed by the tip and a surface around the through hole. Item 5. The mold for resin sealing according to item 4. covering the surface of the semiconductor element mounted on the substrate placed on the first mold, and matching the first mold and a second mold facing the first mold; A resin sealing method for sealing the semiconductor element by filling a resin into a cavity formed in a second mold,
a step of pressing the surface of the semiconductor element with a pressing portion having required elasticity provided in the second mold;
When the cavity is filled with resin, the first gap formed by the surface of the semiconductor element and the tip of the enclosing portion surrounding the pressing portion separated from the surface of the semiconductor element in the facing direction is filled with the resin. A resin sealing method, comprising: a step of pouring. The step of pouring the resin into the first gap includes:
9. The resin sealing method according to claim 8, wherein the pressing portion is elastically deformed by pressing to close a second gap between the pressing portion and the tip in a direction orthogonal to the facing direction. The step of pressing the surface of the semiconductor element includes:
10. The resin sealing method according to claim 8, wherein the pressing portion is elastically deformed within a range obtained by extending the range surrounded by the enclosing portion in the facing direction.

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