JPH11111746A - Method and device for manufacturing semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and device for manufacturing a semiconductor device, wherein the shift of a die pad of a lead frame in vertical and horizontal directions at resin sealing is suppressed fully. SOLUTION: For reducing the shift of a die pad 4a which occurs at resin injection, a die movable pin 6 and a mold movable pin 7 are attached to a die 9 and a mold 10, respectively. In this case, for attaching the position of the die and mold movable pins 6 and 7, the vicinity of a die pad support 8 with less wiring, in other words, corner parts of four sides of the die pad 4a, in short, the four corners of the die pad 4a can be employed for effective prevention of damages to wire and advantages for effective support.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a semiconductor device and a manufacturing apparatus for reducing the movement of a die pad during resin injection in a molding process in the manufacture of a semiconductor device.

[0002]

2. Description of the Related Art Conventionally, techniques in such a field include:
For example, JP-A-3-9538, JP-A-5-326
587 and JP-A-6-29340. As disclosed in these documents, a fixed pin or an upper and lower mold movable pin is provided in a mold die, and a die pad for mounting a chip or a die pad is simply sandwiched, thereby moving the die pad during resin injection (hereinafter, referred to as a die pad). Shift).

[0003]

However, in the above-described conventional apparatus, since the die pad or chip on which the chip is mounted is merely sandwiched, the vertical shift can be restricted to some extent. There was a problem that regulation was not possible and accuracy was lacking.

An object of the present invention is to provide a method and an apparatus for manufacturing a semiconductor device, which can eliminate the above-mentioned problems and can sufficiently suppress the shift of the die pad of the lead frame in the vertical and horizontal directions during resin sealing. Aim.

[0005]

According to the present invention, there is provided a method for manufacturing a semiconductor device, comprising the steps of: setting a lead frame having an IC chip mounted in a mold; The four corners of the die pad where the die pad support is located are pressed by upper and lower movable pins to perform resin sealing.

[2] In the method of manufacturing a semiconductor device according to the above [1], a locking portion is provided at a portion of the die pad where the upper and lower movable pins abut, so as to prevent the movement of the lead frame. It is. [3] The method for manufacturing a semiconductor device according to the above [2], wherein the upper and lower movable pins are brought into contact with and engaged with a concave portion formed in the die pad.

[4] The method of manufacturing a semiconductor device according to the above [2], wherein the upper and lower movable pins are engaged with holes formed in the die pad. [5] In the method for manufacturing a semiconductor device according to the above [2], the upper and lower movable pins include a pressing element biased in a cylinder, and cover a projection formed on the die pad with the cylinder. The projection is held down by the presser and locked.

[6] In the method of manufacturing a semiconductor device according to the above [1], the upper and lower movable pins are pulled out in response to a shift point signal at the time of transfer ascending, and then the cavity is completely filled. Things. [7] In a semiconductor device manufacturing apparatus, a vertical die movable pin is provided at each of four corners of a die pad where a lead frame die pad support having an IC chip mounted on an upper die and a lower die of a mold die is located. It was done.

[8] In the apparatus for manufacturing a semiconductor device according to the above [7], the upper and lower movable pins are arranged so as to be in contact with a concave portion formed in the die pad.

[9] In the semiconductor device manufacturing apparatus according to the above [7], the upper and lower movable pins are arranged so as to be engaged with holes formed in the die pad.

[10] In the apparatus for manufacturing a semiconductor device according to the above [7], the upper and lower movable pins include a presser biased in a cylinder, and cover the projection formed on the die pad with the cylinder. In addition, the projection is arranged so as to be pressed by the pressing element.

[0011]

Embodiments of the present invention will be described below in detail. FIG. 1 is a sectional view of a semiconductor device manufacturing apparatus according to a first embodiment of the present invention, and FIG. 2 is a plan view of a die pad of a lead frame of the semiconductor device. As shown in these figures, the IC chip 1 is bonded to the die pad 4a of the lead frame 5a with a conductive adhesive.
Sealing (packaging) is performed by injecting a mold resin into portions called upper cavities 2 and lower cavities 3 from an injection port called a gate.

In this embodiment, the upper movable pin 6 and the lower movable pin 7 are attached to the upper mold 9 and the lower mold 10, respectively, in order to reduce the shift of the die pad 4a generated at the time of resin injection. In this case, as shown in FIG. 2, the position at which the upper and lower movable pins 6 and 7 are attached is in the vicinity of the die pad support 8 where the wire wiring is small, in other words, the corners of the four sides of the die pad 4a, that is, the die pad 4
The four corners a are effective from the viewpoint of preventing damage to the wire and supporting the wire. In addition, 11 is a recessed part although it mentions later.

Therefore, the upper and lower mold movable pins 6 and 7 are lowered to the bottom surfaces of the upper and lower cavities 2 and 3 of the upper mold 9 and the lower mold 10 in a normal state (a state in which the resin is not injected). Next, after the lead frame 5a to which the IC chip 1 is adhered is set in the lower die 10, it is fitted with the upper die 9, and when a predetermined pressure is reached, molten mold resin is injected from the gate.

In order to prevent the shift of the die pad 4a caused by the pressure at the time of the resin injection and the difference in the filling balance between the upper cavity 2 and the lower cavity 3, the upper and lower movable pins 6 and 7 are used.
Comes out of the upper and lower cavities 2 and 3, sandwiches the die pad 4 a, and fixes it so as not to move. Vertical movable pin 6,
The fixing position of the die pad 7 is, as described above, at each corner of the die pad 4a where wire damage is small and the effect of supporting is large.

The movement of the upper and lower movable pins 6 and 7 is performed by using a signal of a shift point of a transfer rise of a molding device (press) on which a mold is mounted. The shift point of the transfer rise is described in FIG.
As shown in (2), when the transfer 21 rises to some extent and the mold resin 23 fills the majority of the cavity, the shift point 22 is reached. Here, the upper and lower mold movable pins 6 and 7 are removed, and the upper and lower cavities 2 and 3 are completely filled to complete the cavity filling.

Therefore, the upper and lower movable pins 6 and 7 do not hinder the formation of the package. Furthermore,
As shown in FIG. 4, a concave portion 11 is provided in a portion to be held by the die pad 4a so that the upper and lower movable pins 6 and 7 can be inserted. Here, an example is shown in which four upper and lower movable pins are pressed.

With this configuration, in the first embodiment, the concave portion 11 is provided in the die pad 4a pressed by the upper and lower movable pins 6 and 7, thereby preventing the die pad 4a from shifting in the horizontal direction in addition to the vertical direction. be able to. Also,
In the above embodiment, a flat die pad without downset has been described. However, as shown in FIG. 5, the present invention can be applied to a case where there is downset.

That is, the present invention can be similarly carried out when the IC chip 1 is mounted on the die pad 4b of the lead frame 5b having the downset. Next, a second embodiment of the present invention will be described. FIG. 6 is an enlarged sectional view of a main part of a semiconductor device manufacturing apparatus according to a second embodiment of the present invention.

As shown in this figure, in this embodiment, the die pads 4a and 4b have through holes 12A in which the tapered portions 6A at the tips of the upper movable pins 6 are locked, and the taper at the tips of the lower movable pins 7 are provided. Each of the through holes 12B to which the portion 7A is locked is formed. With this configuration, in the second embodiment, the upper die movable pin 6 and the lower die movable pin 7 are locked to the die pads 4a and 4b, respectively, so that the die pads 4a and 4b
The horizontal shift can be prevented in addition to the vertical direction of b.

Further, since the upper and lower movable pins 6 and 7 enter the through holes 12A and 12B and fix the die pads 4a and 4b, more accurate positioning can be performed than in the first embodiment. Next, a third embodiment of the present invention will be described. FIG.
FIG. 9 is an enlarged sectional view of a main part of a semiconductor device manufacturing apparatus according to a third embodiment of the present invention.

As shown in this figure, in this embodiment, the tip of each of the upper movable pin 6 and the lower movable pin 7 has a cylindrical shape, and a pressing element 14 is biased by a spring 15 in the cylinder 13. Attach so that on the other hand,
On the die pads 4a and 4b, protrusions 16 are formed at four corners of the die pads 4a and 4b where the die pad support is located.

Therefore, when injecting the resin, the die pad 4
The cylinder 13 is positioned so as to cover the convex portions 16a and 4b, and the pressing element 14 presses the convex portions 16. With such a configuration, the third embodiment is particularly effective when the thickness of the die pad is small and a recess cannot be formed. It should be noted that the present invention is not limited to the above embodiment, and various modifications are possible based on the gist of the present invention.
They are not excluded from the scope of the present invention.

[0023]

As described above, according to the present invention, the following effects can be obtained. (A) The shift of the die pad of the lead frame in the vertical and horizontal directions at the time of resin sealing can be sufficiently suppressed.

(B) By locking each of the upper movable pin 6 and the lower movable pin to the die pad, it is possible to prevent the die pad not only in the vertical direction but also in the horizontal direction. Further, since the pins are inserted into the holes and the die pad is fixed, more accurate positioning can be performed than in the first embodiment. (C) It is effective when the thickness of the die pad is not so large that a concave portion cannot be formed.

[Brief description of the drawings]

FIG. 1 is a sectional view of an apparatus for manufacturing a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a plan view of a die pad of a lead frame of the semiconductor device according to the first embodiment of the present invention.

FIG. 3 is an explanatory diagram of a shift point when a transfer is raised in manufacturing the semiconductor device according to the first embodiment of the present invention.

FIG. 4 is a sectional view of a main part of a semiconductor device manufacturing apparatus according to a first embodiment of the present invention.

FIG. 5 is a cross-sectional view of a semiconductor device manufacturing apparatus showing a modification of the first embodiment of the present invention.

FIG. 6 is an enlarged sectional view of a main part of an apparatus for manufacturing a semiconductor device according to a second embodiment of the present invention.

FIG. 7 is an enlarged sectional view of a main part of a semiconductor device manufacturing apparatus according to a third embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC chip 2 Upper cavity 3 Lower cavity 4a, 4b Die pad 5a, 5b Lead frame 6 Upper die movable pin 6A, 7A Taper part 7 Lower die movable pin 8 Die pad support 9 Upper die 10 Lower die 11 Concave part 12A, 12B Through hole 13 Cylinder 14 Presser 15 Spring 16 Convex part 21 Transfer 22 Shift point 23 Mold resin

Claims (10)

[Claims] 1. A method for manufacturing a semiconductor device, comprising:
A lead frame on which an IC chip is mounted is set in a mold, and (b) four corners of the die pad on which the die pad support of the lead frame is located are pressed with upper and lower movable pins to perform resin sealing. Semiconductor device manufacturing method. 2. The method of manufacturing a semiconductor device according to claim 1, wherein a locking portion is provided at a portion of the die pad where the upper and lower mold movable pins abut, to prevent the movement of the lead frame. Device manufacturing method. 3. The method of manufacturing a semiconductor device according to claim 2, wherein the upper and lower movable pins abut and lock a recess formed in the die pad. 4. The method of manufacturing a semiconductor device according to claim 2, wherein the upper and lower movable pins are engaged with holes formed in the die pad. 5. The method for manufacturing a semiconductor device according to claim 2, wherein the upper and lower movable pins include a presser biased in a cylinder, and cover the projection formed on the die pad with the cylinder. A method for manufacturing a semiconductor device, comprising: pressing the projection with the pressing element and locking the projection. 6. The method of manufacturing a semiconductor device according to claim 1, wherein the upper and lower movable pins are completely filled with a cavity after being pulled out in response to a shift point signal at the time of transfer rise. A method for manufacturing a semiconductor device. 7. An apparatus for manufacturing a semiconductor device, comprising upper and lower movable pins arranged at four corners of a die pad on which a lead frame die pad support on which an IC chip is mounted on an upper mold and a lower mold of a mold die is located. An apparatus for manufacturing a semiconductor device, comprising: 8. The apparatus for manufacturing a semiconductor device according to claim 7, wherein said upper and lower movable pins are arranged so as to contact a concave portion formed in said die pad. 9. The semiconductor device manufacturing apparatus according to claim 7, wherein said movable pin is disposed so as to engage with a hole formed in said die pad. apparatus. 10. The apparatus for manufacturing a semiconductor device according to claim 7, wherein the upper and lower movable pins include a presser biased in a cylinder, and cover the projection formed on the die pad with the cylinder. An apparatus for manufacturing a semiconductor device, wherein the convex portion is arranged to be pressed by the pressing element.