CN108162300B - Resin sealing mold, primary molding mold, secondary molding mold, and method for producing resin molded article - Google Patents
Resin sealing mold, primary molding mold, secondary molding mold, and method for producing resin molded article Download PDFInfo
- Publication number
- CN108162300B CN108162300B CN201710996372.8A CN201710996372A CN108162300B CN 108162300 B CN108162300 B CN 108162300B CN 201710996372 A CN201710996372 A CN 201710996372A CN 108162300 B CN108162300 B CN 108162300B
- Authority
- CN
- China
- Prior art keywords
- mold
- resin
- molded article
- primary
- primary molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 212
- 239000011347 resin Substances 0.000 title claims abstract description 212
- 238000000465 moulding Methods 0.000 title claims abstract description 138
- 238000007789 sealing Methods 0.000 title claims abstract description 54
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 230000002093 peripheral effect Effects 0.000 claims abstract description 34
- 239000012778 molding material Substances 0.000 claims description 30
- 229920001187 thermosetting polymer Polymers 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 26
- 239000000463 material Substances 0.000 abstract description 45
- 238000000034 method Methods 0.000 abstract description 19
- 230000003287 optical effect Effects 0.000 abstract description 12
- 230000035515 penetration Effects 0.000 abstract description 6
- 239000003822 epoxy resin Substances 0.000 description 15
- 229920000647 polyepoxide Polymers 0.000 description 15
- 230000001681 protective effect Effects 0.000 description 6
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 230000000873 masking effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000004512 die casting Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The invention provides a mold for resin sealing, a primary molding mold, a secondary molding mold and a method for manufacturing a resin molded article, wherein the resin molded article having an exposed portion formed on the surface of an optical element by a two-color molding technique can be molded by suppressing leakage of a resin material to the exposed portion without applying excessive pressure to the primary molded article. A cavity recess (13) of a secondary upper mold (1) is formed with a resin molding section (16), a recessed section (17), and a projection section (18) located on the outer peripheral edge of the recessed section (17). The resin molding section (16) is a portion where a support member of the primary molded article (8) is formed on the outer peripheral surface of the primary molded article (8) molded from a transparent resin. The recessed part (17) is a part that covers the lens part (19) of the primary molded article (8) when resin-sealed. The convex portion (18) is a portion which comes into contact with the outer peripheral edge of the lens portion (19) of the primary molded article (8) when resin sealing is performed, thereby suppressing the penetration of resin into the lens portion (19) side and exposing the lens portion (19).
Description
Technical Field
The present invention relates to a mold for resin sealing, a primary molding mold, a secondary molding mold, and a method for manufacturing a resin molded article.
Background
Conventionally, insert molding has been performed to manufacture a resin-sealed package by sealing electronic components such as semiconductors with resin. In the insert molding, the electronic component or the substrate with the electronic component or the like is fixed inside the mold, and the resin molding portion is integrated with the substrate with the electronic component or the like by filling the cavity with the molten resin and solidifying the resin.
Depending on the type of electronic component such as a semiconductor sealed and encapsulated with a resin, there is a resin molded article in which an optical element such as a lens is primarily molded with a resin so that a part of the surface thereof is exposed to the outside, and the primary molded article supporting the optical element is integrally molded with a resin for secondary molding.
In such a resin molded article, for example, a two-color molding technique can be used in which an optical element such as a lens is primarily molded using a transparent resin material, and then the primary molded article supporting the optical element is secondarily molded using a colored resin material such as black.
In the two-color molding technique, a primary mold filled with a transparent resin material to mold a primary molded article and a secondary mold filled with a colored resin material to expose an optical element and mold a support member supporting the optical element are used.
As a method for integrally molding an optical element such as a lens and a support member by a two-color molding technique, for example, a method for producing a resin molded article and a mold for resin sealing described in patent document 1 are proposed.
In the resin sealing mold described in patent document 1, a resin molded article 100 shown in fig. 11 is molded. The resin molded article 100 is formed by primarily molding the optical element 101 with a transparent resin to expose the optical element 101, and integrally molding the support member 102 with a colored resin material in secondary molding.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open No. 2012 and 51291
Disclosure of Invention
Problems to be solved by the invention
Here, in insert molding using a two-color molding technique, as typified by the resin molded article described in patent document 1, when a resin molded article in which a part of a primary molded article is exposed to the outside is manufactured, the exposed part needs to be shielded when resin sealing is performed in secondary molding. The masking is performed, for example, by bringing an insert having a recessed shape provided in the secondary molding die into close contact with the outer peripheral surface of the exposed portion.
When this masking is performed, a gap is generated between the exposed portion and the insert or when the force for bringing the exposed portion and the insert into close contact with each other is insufficient, there is a problem that when a colored resin material for secondary molding is filled, the resin material leaks into the exposed portion, and the resin adheres to the surface of the exposed portion. If the resin adheres to the exposed portion, the function to be performed by the exposed portion is damaged, and product failure may occur.
Therefore, in the conventional process for producing a resin molded article, when the secondary molding die is used for clamping in order to suppress the penetration of the resin into the exposed portion, a constant pressure is applied to the peripheral portion of the exposed portion while the insert is in contact with the exposed portion.
Here, a transparent resin material such as polycarbonate, which is molded to form the exposed portion, generally has low hardness, and may be deformed inside the transparent resin due to a pressure generated during masking.
If the deformation occurs inside the transparent resin, the following problems occur: peeling from the substrate side of the primary molded product and deformation of the wire connected to the semiconductor chip occur.
The present invention has been made in view of the above problems, and an object of the present invention is to provide a resin sealing mold, a primary molding mold, a secondary molding mold, and a method for manufacturing a resin molded article, which can mold a resin molded article having an exposed portion formed by a two-color molding technique by suppressing leakage of a resin material to the exposed portion without applying excessive pressure to the primary molded article.
Means for solving the problems
In order to achieve the above object, a mold for resin sealing according to the present invention includes a primary molding mold for filling a translucent molding material into a first internal space formed by a pair of molds to resin-seal a substrate with an electronic component, and a secondary molding mold; the secondary molding die is used for filling a thermosetting molding material into a second inner space formed by another pair of dies and sealing the primary molded product by resin in a manner of exposing a part of the primary molded product molded by the primary molding die, wherein the primary molding die comprises: a first mold for placing the substrate with electronic component; and a second mold for forming a small space in the first internal space formed together with the first mold, the small space simulating a recess in which an exposed portion is formed and a step formed on a peripheral edge of the recess, the secondary molding mold comprising: a third mold for placing the primary molded article; and a fourth mold that forms the second internal space together with the third mold in a state in which the exposed portion modeled by the small space and the portion formed by the step in the primary molded article are covered.
Here, a primary molded article in which the electronic component-attached base material is resin-sealed in the first internal space of the primary mold filled with a light-transmitting molding material and the electronic component-attached base material is resin-sealed can be molded by the primary mold. The electronic component-attached base material referred to herein is, for example, various substrates such as an electronic circuit board including a printed circuit board, or a base material including a lead frame.
In addition, a resin molded article in which a part of the primary molded article is exposed and resin-sealed in the second internal space of the second molding die can be molded by a secondary molding die which fills a thermosetting molding material in the second internal space formed by the other pair of dies and resin-seals the primary molded article so that a part of the primary molded article molded by the primary molding die is exposed.
In addition, the first inner space of the primary molding die may be formed with a small space that conforms to the recess in which the exposed portion is formed and the step formed on the periphery of the recess, and the second inner space may be formed with a shape corresponding to the step on the periphery of the exposed portion. The exposed portion formed on the primary molded product as referred to herein is a portion to be an optical element such as a lens, for example.
In addition, in a state in which the exposed portion simulated by the small space and the portion formed by the step in the primary molded article are covered, the exposed portion of the primary molded article formed by the cavity of the second mold can be exposed to the outside without being covered with the thermosetting resin by the fourth mold which forms the second internal space together with the third mold, and the penetration of the resin into the exposed portion can be suppressed. That is, when the thermosetting resin is filled in the second internal space, the fourth mold covers the exposed portion and the portion formed by the step, which are simulated by the small space in the primary molded product, and thus intrusion of the resin into the exposed portion can be suppressed.
Further, in the case where the contact portion that abuts against the portion of the primary molded article that is formed by the step and is simulated by the small space in the second internal space is simulated in the fourth mold, when the primary molded article is clamped by the third mold and the fourth mold, the contact portion of the fourth mold contacts the portion of the primary molded article that is formed by the step and is simulated by the small space in the primary molded article. This contact can prevent the molten thermosetting resin from entering the exposed portion of the primary molded article. Further, for example, when the portion formed by the step simulated by the small space in the primary molded article has a recessed shape, since the molten thermosetting resin passes through the recessed portion, the moving distance of the resin becomes long, and therefore the resin can be made difficult to adhere to the exposed portion of the primary molded article.
In the case where the second mold has a recessed shape disposed on the periphery of the recess and a step is formed, and the fourth mold has a second internal space formed therein in a state where the exposed portion of the primary molded article formed by the recess and the convex portion formed by the recessed shape are covered, when the primary molded article is clamped by the third mold and the fourth mold, the convex portion formed corresponding to the recessed shape of the second mold of the primary molded article, that is, the convex portion formed on the periphery of the exposed portion is covered by the fourth mold. This can prevent the molten thermosetting resin from entering the exposed portion of the primary molded article. Further, the flow of the molten thermosetting resin can be prevented by applying pressure to the convex portion of the primary molded article, and the resin can be made less likely to adhere to the exposed portion of the primary molded article.
In order to achieve the above object, a primary molding die according to the present invention is a primary molding die for molding a primary molded article by filling a light-transmitting molding material into a first internal space formed by a pair of dies and resin-sealing a substrate with an electronic component, the primary molded article being formed by filling a thermosetting molding material into a second internal space formed by another pair of dies as a secondary molding die in a subsequent step and resin-sealing the secondary molded article so as to expose a part of the primary molded article, the primary molding die including: a first mold for placing the substrate with electronic component; and a second mold that forms a small space in the first internal space formed together with the first mold, the small space simulating a recess forming the exposed portion and a step formed at a peripheral edge of the recess.
Here, the first internal space formed by the pair of molds is filled with a translucent molding material to seal the electronic component-attached base material with resin, whereby a primary molded article in which the electronic component-attached base material is sealed with resin in the first internal space can be molded.
Further, by filling a thermosetting molding material into a second internal space formed by the other pair of molds of the secondary molding mold and resin-sealing the second internal space so as to expose a part of the primary molded article, a resin molded article obtained by resin-sealing the primary molded article so as to expose a part of the primary molded article in the second internal space of the secondary molding mold can be molded.
Further, by using the second mold in which a small space is formed in the first internal space formed together with the first mold, the small space simulating the recess in which the exposed portion is formed and the step formed at the peripheral edge of the recess, the exposed portion can be formed on the primary molded article sealed with the resin in the first internal space, and the shape corresponding to the step can be formed at the peripheral edge of the exposed portion. Therefore, for example, when the primary molded article is resin-sealed with the secondary molding die, the exposed portion of the primary molded article and the portion formed on the peripheral edge of the exposed portion corresponding to the step are covered with the secondary molding die, whereby the resin material can be prevented from entering the exposed portion.
In order to achieve the above object, a secondary molding die according to the present invention is a secondary molding die for resin-sealing a primary molded article, which is obtained by filling a first internal space formed by a pair of dies with a light-transmitting molding material to resin-seal a substrate with an electronic component, in a second internal space formed by another pair of dies with a thermosetting molding material, and exposing a part of the primary molded article, the secondary molding die including: a third mold on which the primary molded article having a lens portion exposed to the outside and a convex portion or a concave portion arranged on a peripheral edge of the lens portion, which is molded by the primary molding mold, is placed; and a fourth mold that forms the second internal space together with the third mold in a state in which the lens portion and the convex portion or the concave portion in the primary molded article are covered, wherein the secondary molded mold abuts against the convex portion or the concave portion of the primary molded article to suppress the resin from entering the lens portion.
Here, the resin sealing of the primary molded article obtained by filling the light-transmitting molding material into the first internal space formed by the pair of molds and resin-sealing the electronic component-equipped substrate is performed by filling the thermosetting molding material into the second internal space formed by the other pair of molds, and the molding of the resin molded article obtained by further resin-sealing the primary molded article formed by resin-sealing the electronic component-equipped substrate in the first internal space with the thermosetting molding material can be performed.
Further, by filling a thermosetting molding material into a second internal space formed by another pair of molds and resin-sealing the primary molded article so as to expose a part of the primary molded article, a resin molded article obtained by resin-sealing the primary molded article so as to expose a part of the primary molded article can be molded.
Further, the lens portion of the primary molded article can be exposed to the outside without being covered with the thermosetting resin by using the third mold on which the primary molded article having the lens portion exposed to the outside and the convex portion or the concave portion arranged at the periphery of the lens portion molded by the primary molded article is placed, and the fourth mold forming the second internal space together with the third mold in a state of covering the lens portion and the convex portion or the concave portion of the primary molded article. That is, when the thermosetting resin is filled in the second internal space, the lens portion of the primary molded product is covered with the fourth mold, and a region where the resin is not filled can be formed. Further, the lens portion of the primary molded product can be exposed to the outside without being covered with the thermosetting resin, and the penetration of the resin into the exposed portion can be suppressed. That is, when the thermosetting resin is filled in the second internal space, the convex portion or the concave portion arranged at the periphery of the lens portion in the primary molded product is covered with the fourth mold, and the resin can be prevented from entering the lens portion.
Further, by abutting the convex portion or the concave portion of the primary molded product, the resin is prevented from entering the lens portion, and the resin can be made less likely to adhere to the exposed lens portion of the resin molded product.
In order to achieve the above object, a method for producing a resin molded article according to the present invention includes: a primary molding step of molding a primary molded product having a lens portion exposed to the outside and a convex portion or a concave portion disposed around the lens portion by filling a translucent molding material into a first internal space of a primary molding die; and a secondary molding step of bringing the convex portion or the concave portion of the primary molded article into contact with a concave portion or a convex portion provided in a second internal space of a secondary molding die, and filling the second internal space with a thermosetting molding material to suppress the molding material from entering the lens portion.
Here, a primary molded article obtained by resin-sealing a light-transmitting molding material in the first internal space can be molded by a primary molding step of filling the light-transmitting molding material into the first internal space of the primary mold to mold a primary molded article having a lens portion exposed to the outside and a convex portion or a concave portion disposed around the lens portion. The primary molded article is provided with a lens portion exposed to the outside and a convex portion or a concave portion arranged around the lens portion.
In addition, the lens portion of the primary molded article can be covered with the thermosetting resin and exposed to the outside by the secondary molding step in which the convex portion or concave portion of the primary molded article is brought into contact with the concave portion or convex portion provided in the second internal space of the secondary molding die, and the second internal space is filled with the thermosetting molding material to suppress the intrusion of the molding material into the lens portion. That is, when the thermosetting resin is filled in the second internal space, the convex portion or the concave portion of the primary molded product is brought into contact with the concave portion or the convex portion provided in the second internal space, whereby the lens portion can be formed as a region in which the resin is not filled. In addition, the lens portion of the primary molded product is exposed without being covered with the thermosetting resin, and the penetration of the resin into the exposed portion can be suppressed.
Effects of the invention
The present invention provides a mold for resin sealing, a primary molding mold, a secondary molding mold, and a method for manufacturing a resin molded article, which can suppress leakage of a resin material to an exposed portion of a resin molded article formed by a two-color molding technique without applying excessive pressure to the primary molded article, and can mold the resin molded article.
Drawings
Fig. 1 is a schematic explanatory view showing an embodiment of a resin sealing apparatus using a mold for resin sealing to which the present invention is applied.
Fig. 2 is a schematic perspective view of a resin sealing apparatus using a resin sealing mold to which the present invention is applied.
Fig. 3(a) is a perspective explanatory view showing a state where an upper mold and a lower mold of a secondary mold provided in a mold for resin sealing are separated from each other, and (b) is a perspective explanatory view showing an internal structure of the secondary mold shown in fig. 3 (a).
Fig. 4 is a partially enlarged view showing the periphery of the cavity recess and the upper mold of the secondary molding die.
Fig. 5(a) is a plan view and a sectional view of a primary molded article molded by a primary molding die, (b) is a plan view of a secondary upper die of a secondary molding die and a plan view and a sectional view when the primary molded article is clamped, and (c) is a plan view and a sectional view of a resin molded article.
Fig. 6(a) is a plan view and a sectional view of a primary molded article molded by a primary molding die, (b) is a plan view of a secondary upper die of a secondary molding die and a plan view and a sectional view when the primary molded article is clamped, and (c) is a plan view and a sectional view of a resin molded article.
Fig. 7(a) is a sectional view showing an upper cavity block according to another embodiment, and (b) is a sectional view showing an upper cavity block according to another embodiment.
Fig. 8(a) is a sectional view showing an upper mold cavity block on which a protective film is laid, and (b) is a sectional view showing an upper mold cavity block in another embodiment on which a protective film is laid.
Fig. 9(a) to (d) are sectional views of patterns showing the shape of the convex portion formed in the cavity concave portion.
Fig. 10(a) to (c) are process diagrams showing a flow of resin sealing of a primary molded article by a secondary molding die.
Fig. 11 is a cross-sectional view showing a conventional resin molded article molded by a two-color molding technique.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
As shown in fig. 1, the resin sealing apparatus a is constituted by: a secondary molding die B composed of a secondary molding upper die composed of an upper die base 420 and a secondary upper die (japanese: チェス)1, and a secondary molding lower die composed of a lower die base 430 and a secondary lower die 2; a resin injection device 3; and a mold clamping device 4 for driving the mold up and down to open and close the mold. The resin sealing apparatus a includes a substrate conveying device for conveying the substrate and the primary molded article, and a product conveying device for conveying the molded article after resin sealing (both are not shown). The secondary molding die B is an example of the secondary molding die of the present invention. In the present embodiment, the position of the lower die holder 430 with respect to the upper die holder 420 is "lower", and the position of the upper die holder 420 with respect to the lower die holder 430 is "upper".
The secondary molding die B is a die in which a primary molded article is sealed with black epoxy resin, and the primary molded article is obtained by resin-sealing a substrate with an electronic component with transparent resin by a resin sealing device (not shown) in which the primary molding die is disposed. The secondary molding die B is resin-sealed so that the lens portion molded from the transparent resin of the primary molded article is exposed to the outside. The resin sealing apparatus a is an apparatus in which the secondary molding die B is disposed, but the primary molding die is also a similar apparatus configuration (the primary upper die and the primary lower die are different in part) and is disposed in another resin sealing apparatus. In the resin sealing apparatus in which the primary molding die is disposed, the primary molded article is molded, and the primary molded article is conveyed to the resin sealing apparatus a by the substrate conveying apparatus.
The upper die holder 420 is a member for supporting the secondary upper die 1, and the lower die holder 430 is a member for supporting the secondary lower die 2. The secondary upper mold 1 and the secondary lower mold 2 have cavities into which resin materials are injected, and cooperatively produce resin molded products. The secondary upper die 1 and the secondary lower die 2 can be replaced according to the type of the molded product, and the detailed configuration thereof will be described later. In principle, the same upper die holder 420 and lower die holder 430 can be used regardless of the type of molded product.
The resin injection device 3 is a device that extrudes a thermosetting resin material while melting a resin sheet of epoxy resin heated by a can (japanese patent No. ポット) described later in a state where the secondary molding device B is clamped.
As shown in fig. 1, the mold clamping unit 4 includes a plurality of tie bars 41 arranged substantially parallel to each other in the vertical direction. The upper ends of the connecting rods 41 are connected by a fixed platen 42. The lower end of each tie rod 41 is connected to a base plate, not shown.
Further, a movable platen 43 is fitted to each link 41 so as to be movable up and down through each link 41. The movable platen 43 can be lifted and lowered by a required stroke by a lift drive unit (not shown) including an actuator such as a hydraulic cylinder or a toggle device driven by a motor via a ball screw.
An upper die base 420 is fixed to the lower surface of the fixed platen 42. A secondary upper die 1 is fixed to the lower side of the upper die holder 420. A lower die holder 430 is fixed to the upper surface of the movable platen 43. A secondary lower mold 2 is fixed to an upper side of the lower mold base 430.
As shown in fig. 2, the secondary lower die 2 is formed in a thick plate shape by integrating a lower cavity block 5 and a can block 6. A primary molded product 8 in which a substrate 7 is sealed with a transparent resin is placed on the upper surface of the lower cavity block 5. A tank 9 for heating the resin material is formed in the tank block 6.
As shown in fig. 3(a) and 3(b), the upper surface of the lower cavity block 5 of the secondary lower mold 2 and the lower surface of the upper cavity block 10 of the secondary upper mold 1 cooperate to form a mold clamping surface for clamping the primary molded article 8.
The secondary upper mold 1 is formed in a thick plate shape by integrating an upper cavity block 10 and a cull (japanese: カル) block 11. The cull block 11 is formed with a cull portion 12 (see fig. 3(b)) that communicates with the can block 6 during mold clamping. Further, a cavity recess 13 is formed in the upper cavity block 10, and the cull portion 12 and the cavity recess 13 are connected by a resin passage 14.
When the secondary upper mold 1 and the secondary lower mold 2 are closed, the cavity recess 13 is formed at a position facing a region where the primary molded article 8 is placed, and is a region where the resin material is filled. A resin molded article 15 is molded in accordance with the shape of the cavity recess 13, and the primary molded article 8 is resin-sealed with an epoxy resin to form the resin molded article 15 (see fig. 5 c). The shape of the resin molded article 15 will be described later.
The primary molded article 8 has a hemispherical lens portion 19 formed of a transparent resin (see fig. 3a and 3 b). The lens portion 19 has, for example, an optical element, and is a portion exposed to the outside of the resin molded product 15 after the secondary molding.
As shown in fig. 4, a cavity recess 13 of the secondary upper mold 1 is formed with a resin molding portion 16, a recessed portion 17, and a protruding portion 18 located at the outer peripheral edge of the recessed portion 17. The resin molded portion 16 is a portion where a support member of the primary molded article 8 is formed on the outer peripheral surface of the primary molded article 8 molded by the transparent resin. The concave portion 17 is a portion covering the lens portion 19 of the primary molded article 8 at the time of resin sealing. The convex portion 18 is a portion which comes into contact with the outer peripheral edge of the lens portion 19 of the primary molded article 8 at the time of resin sealing, suppresses the penetration of resin into the lens portion 19 side, and exposes the lens portion 19. The projection 18 corresponds to a member of the "contact portion" in the claims of the present application.
The primary molded article 8 and the secondary molding die B will be further described with reference to fig. 5(a) to 5 (c). The primary molded article 8 is formed by resin-sealing the upper surface of the substrate 7 with a transparent resin, and includes a main body portion 20 and the lens portion 19 described above, as shown in fig. 5 (a). Further, a recessed portion 21 is formed in the main body portion 20 at the outer peripheral edge of the lens portion 19.
The recessed portion 21 of the primary molded article 8 is a portion that comes into contact with the convex portion 18 of the cavity concave portion 13 in the secondary upper mold 1 when the secondary molding mold B is clamped. The shapes of the main body portion 20, the lens portion 19, and the recessed portion 21 in the primary molded article 8 are molded by a primary molding die not shown. That is, the cavity recess of the primary upper mold constituting the primary molding die follows the shape of the primary molded article 8 (both are not shown). A small space is formed in the cavity recess of the primary upper mold, and the small space is configured to conform to a hemispherical recess corresponding to the lens portion 19 of the primary molded article 8 and a projection formed as a step on the outer periphery of the recess.
As shown in fig. 5(B), in a state where the secondary molding die B is clamped, the primary molded article 8 placed on the upper surface of the lower cavity block 5 in the secondary lower die 2 is positioned to face the cavity recess 13 of the upper cavity block 10 in the secondary upper die 1.
The lens portion 19 of the primary molded article 8 is covered with the recess portion 17 of the cavity recess 13. The concave portion 21 of the primary molded article 8 abuts against the convex portion 18 of the cavity concave portion 13 (see the lower side of fig. 5 b). The outer peripheral surface of the main body portion 20 of the primary molded article 8 is covered with the resin molded portion 16 of the cavity recess 13. The resin molding portion 16 is connected to a resin passage 14 (see the lower side of fig. 5 b) for supplying epoxy resin, which communicates with the tank 9 and the residue portion 12. The molten epoxy resin is filled into the resin molding portion 16 of the cavity recess 13 through the resin passage 14.
When the epoxy resin is filled, the resin molding portion 16 is filled with the molten resin material, but the convex portion 18 of the cavity concave portion 13 abuts against the concave portion 21 of the primary molded article 8, and the resin material can be suppressed from entering the lens portion 19. Further, when the resin material is to be impregnated into the lens portion 19, the resin material flows along the shape of the recessed portion 21, so that the moving distance required for the resin material to reach the lens portion 19 becomes long, and the resin can be made less likely to adhere to the lens portion 19. In this case, since the recessed portion 21 is shaped to prevent the resin from entering the lens portion 19, the lens portion 19 and the peripheral region thereof can be clamped without applying pressure during clamping of the secondary mold.
As shown in fig. 5(c), the resin molded article 15 in which the primary molded article 8 is sealed with an epoxy resin has a support member 22 molded with an epoxy resin on the outer peripheral surface of the primary molded article 8. The lens portion 19 is an exposed portion 23 exposed to the outside without being covered by the support member 22.
In the above-described primary molded article 8 and secondary molded mold B, when the secondary molded mold B is closed, the recessed portions 17 and the projecting portions 18 of the cavity recessed portion 13 in the secondary upper mold 1 are in a state of covering the lens portion 19 of the primary molded article 8 and the recessed portion 21 of the outer peripheral edge thereof. Thus, in the resin molded product 15 after the secondary molding, the lens portion 19 is exposed to the outside, and the epoxy resin does not adhere to the lens portion 19.
Other embodiments of the primary molded article (primary mold) and the secondary mold will be described. As shown in fig. 6(a), the primary molded article 24 is formed by sealing a transparent resin on the upper surface of the substrate 25. The primary molded article 24 includes a main body portion 26 and a lens portion 27. Further, a convex portion 28 is formed on the outer peripheral edge of the lens portion 27 in the main body portion 26.
The convex portion 28 of the primary molded article 24 is a portion that comes into contact with the concave portion 31 of the cavity concave portion 30 formed in the secondary upper mold 29 when the secondary molding mold is closed (see fig. 6 (b)). The shapes of the main body portion 26, the lens portion 27, and the convex portion 28 in the primary molded article 24 are molded by a primary molding die not shown. That is, the cavity recess of the primary upper mold constituting the primary molding die follows the shape of the primary molded article 24 (both are not shown). A small space is formed in the cavity recess of the primary upper mold, and the small space is a concave portion having a step shape conforming to a hemispherical shape corresponding to the lens portion 27 of the primary molded article 24, and a concave portion having a step shape formed on the outer peripheral edge of the concave portion.
As shown in fig. 6(b), in a state where the secondary molding die is clamped, the primary molded article 24 placed on the upper surface of the lower cavity block 33 in the secondary lower die 32 is positioned to face the cavity recess 30 of the upper cavity block 34 in the secondary upper die 29.
The lens portion 27 of the primary molded article 24 is covered with the recess portion 35 of the cavity recess 30. The convex portion 28 of the primary molded article 24 abuts against the concave portion 31 of the cavity concave portion 30 (see the lower side of fig. 6 b). The outer peripheral surface of the main body 26 of the primary molded article 24 is covered with the resin molded portion 36 of the cavity recess 30. The resin molding portion 36 is connected to a resin passage 37, and the resin passage 37 communicates with the tank and a residue portion (both not shown) (see the lower side of fig. 6 b). The molten epoxy resin is filled in the resin molding portion 36 of the cavity recess 30 through the resin passage 37.
When the epoxy resin is filled, the resin molded portion 36 is filled with the molten resin material, but the concave portion 31 of the cavity concave portion 30 abuts against the convex portion 31 of the primary molded article 24, and the resin material can be suppressed from entering the lens portion 27. Further, when the secondary molding die is clamped, the resin material can be further suppressed from entering the lens portion 27 by applying a constant pressure to the position of the convex portion 31 of the primary molded article 24. At this time, since the pressure at the time of mold clamping is applied not to the portion of the lens portion 27 but to the convex portion 31 located at the outer peripheral edge thereof, the occurrence of deformation inside the lens portion 27 can be suppressed.
As shown in fig. 6(c), the resin molded article 38 obtained by sealing the primary molded article 24 with an epoxy resin has a support member 39 formed by molding an epoxy resin on the outer peripheral surface of the primary molded article 24. The lens portion 27 is an exposed portion 40 that is exposed to the outside without being covered by the support member 39.
In the primary molded article 24 and the secondary molded mold described above, when the secondary molded mold is closed, the recessed portions 35 and the recessed portions 31 of the cavity recessed portions 30 in the secondary upper mold 29 are in a state of covering the lens portions 27 of the primary molded article 24 and the projecting portions 28 on the outer peripheral edge thereof. Thus, in the resin molded article 38 after the secondary molding, the lens portion 27 is exposed to the outside, and the epoxy resin does not adhere to the lens portion 27.
Next, another embodiment of the secondary molding die will be explained.
The cavity concave portion 45 in the cavity block 44 of the secondary upper mold shown in fig. 7(a) has a concave portion 46 and a convex portion 47. The concave portion 46 has a shape fitting along the outer peripheral surface of the hemispherical lens portion 49 of the primary molded article 48. The cavity recess 51 in the cavity block 50 of the secondary upper mold shown in fig. 7(b) has a dimple 52 and a recess 53. The concave portion 52 has a shape fitting along the outer peripheral surface of the hemispherical lens portion 55 of the primary molded article 54.
The dimple portions 46 and 52 shown in fig. 7a and 7b are slightly different from the upper portions of the lens portions 19 and 27 in the dimple portions 17 and 35 (see fig. 5b and 6 b), and have a shape that completely fits along the hemispherical outer peripheral surfaces of the hemispherical lens portions 49 and 55. Even in the cavity blocks 44 and 50 of the secondary upper mold having the concave portions 46 and 52 of the above-described shape, the convex portions 47 and the concave portions 53 abut on the outer peripheral edge portions of the lens portions 49 and 55, so that the molten resin material 56 is prevented from entering the lens portions 49 and 55, and a resin molded product in which the lens portions 49 and 55 are exposed can be molded.
As shown in fig. 8(a) and 8(b), the secondary molding die may be configured such that a buffer protective film 61 is brought into close contact with the cavity recesses 59 and 60 of the cavity blocks 57 and 58 of the secondary upper die. By making the protective film 61 follow the outer peripheral surfaces of the primary molded articles 62, 63, the influence of the pressure on the primary molded articles 62, 63 when the secondary molding die is clamped can be reduced. In the structure using the protective film 61, the projection 66 and the recess 67 abut against the outer peripheral edge portions of the lens portions 64 and 65 of the primary molded article, whereby the molten resin material 68 is prevented from entering the lens portions 64 and 65, and a resin molded article in which the lens portions 64 and 65 are exposed can be molded.
The change in the shape of the convex portion of the cavity concave portion formed in the upper cavity block of the secondary upper mold will be described with reference to fig. 9(a) to 9 (d). The convex portion 18 of the cavity concave portion 13 formed in the upper cavity block of the secondary upper mold 1 shown in fig. 9(a) has a flat shape in cross section at the tip end surface thereof which abuts on the primary molded article 8, and has a slope from the tip end surface to the base side.
Not only the shape of the convex portion 18, but also, for example, the convex portion 70 formed in the cavity concave portion 69 has a rounded shape on the front end surface and has a slope from the front end surface to the base portion side (see fig. 9 (b)). The convex portion 72 formed in the cavity recess 71 has a flat front end surface, has an inclined surface from the front end surface to the base side, and has a shape in which the front end surface and the inclined surface are connected by a smooth curved surface (see fig. 9 (c)). The convex portion 74 formed in the cavity concave portion 73 has a sharp distal end (see fig. 9 d).
Each of the projections 18, 70, 72, and 74 shown in fig. 9(a) to 9(d) abuts against a portion of the outer peripheral edge of each lens portion of the primary molded article, and suppresses the molten resin material from entering the lens portion. The primary molded articles corresponding to the projections 18, 70, 72, and 74 form recesses conforming to the shape of the respective projections. In the primary molded article corresponding to the convex portion 74, the peripheral edge of the lens portion is molded flat, the sharp tip of the convex portion 74 penetrates the flat surface, and the primary molded article abuts the cavity concave portion 73, so that the resin material can be inhibited from entering the lens portion. In this manner, various shapes of the convex portion of the cavity concave portion formed in the secondary upper mold can be adopted.
The following describes a flow of manufacturing a resin-sealed molded article using the secondary mold B.
As shown in fig. 10(a), the primary molded article 8 is conveyed between the secondary upper mold 1 and the secondary lower mold 2 constituting the secondary molding mold B. The primary molded article 8 is molded by sealing the base material with a transparent resin by a primary molding die, and is transported by a substrate transport device (both not shown). The conveyed primary molded article 8 is placed on the upper surface of the lower mold cavity block 5.
Thereafter, the movable platen 43 is raised, and the secondary lower mold 2 fixed to the movable platen 43 and the lower mold base 430 is raised in accordance with this operation, and the lower cavity block 5 of the secondary lower mold 2 and the upper cavity block 10 of the secondary upper mold 1 are brought into a state of being clamped.
At this time, the cavity recess 13 of the upper mold cavity block 10 covers the primary molded product 8, and an internal space (corresponding to a second internal space in the claims of the present application) is formed between the lower mold cavity block 5 and the upper mold cavity block 10. In the internal space, the concave portion 17 of the cavity recess 13 covers the lens portion 19 of the primary molded article 8. The convex portion 18 of the cavity concave portion 13 abuts against the concave portion 21 of the primary molded article 8.
In a state where the secondary molding die B is clamped, the thermosetting resin material 75 is extruded by the resin injection device 3 while melting the resin sheet of the epoxy resin heated by the tank 9. The resin material 75 flows from the tank 9 through the cull portion 12 and the resin passage 14, and is filled in the cavity recess 13. Then, the molten thermosetting resin 75 is cured while maintaining the pressure, and the primary molded article 8 is sealed to form the resin molded article 15 shown in fig. 10 (c).
After the resin sealing, the movable platen 43 is lowered, and the secondary lower mold 2 is lowered in accordance with this operation, and the lower cavity block 5 of the secondary lower mold 2 and the upper cavity block 10 of the secondary upper mold 1 are opened (see the left side of fig. 10 (c)). The resin molded article 15 has an exposure portion 23 where the lens portion 19 is exposed to the outside, and is conveyed from the lower mold cavity block 5 of the secondary lower mold 2 by a product conveying device (not shown) in a state where the remnant 76 is connected, and the resin molded article 15 is molded by completing the secondary molding by the secondary molding die B through the above-described flow.
As described above, in the resin molded article in which the exposed portion is formed by the two-color molding technique, the resin sealing mold of the present invention can suppress leakage of the resin material to the exposed portion without applying excessive pressure to the primary molded article, and can mold the resin molded article.
Further, in the case of a resin molded article in which an exposed portion is formed by a two-color molding technique, the primary molding die of the present invention can suppress leakage of the resin material to the exposed portion without applying excessive pressure to the primary molded article, and can mold the resin molded article.
In addition, in the case of a resin molded article in which an exposed portion is formed by a two-color molding technique, the secondary molding die of the present invention can suppress leakage of the resin material to the exposed portion without applying excessive pressure to the primary molded article, and can mold the resin molded article.
Further, the method for producing a resin molded article according to the present invention can form a resin molded article in which an exposed portion is formed by a two-color molding technique, by suppressing leakage of a resin material to the exposed portion without applying excessive pressure to a primary molded article.
Description of the reference numerals
1: secondary die-casting; 2: secondary lower die mold; 3: a resin injection device; 4: a mold clamping device (press device); 5: a lower mold cavity block; 6: a can block; 7: a substrate; 8: a primary molded article; 9: a tank; 10: an upper mold cavity block; 11: a residue block; 12 a residue part; 13; a cavity recess; 14: a resin passage; 15: a resin molded article; 16: a resin molding section; 17: a pit portion; 18: a convex portion; 19: a lens section; 20: a main body portion; 21: a recessed portion; 22: a support member; 23: an exposed portion; 24: a primary molded article; 25: a substrate; 26: a main body portion; 27: a lens section; 28: a convex portion; 29: secondary die-casting; 30: a cavity recess; 31: a recessed portion; 32: secondary lower die mold; 33: a lower mold cavity block; 34: an upper mold cavity block; 35: a pit portion; 36: a resin molding section; 37: a resin passage; 38: a resin molded article; 39: a support member; 40: an exposed portion; 41: a connecting rod; 42: fixing the bedplate; 43: a movable platen; 44: an upper mold cavity block; 45: a cavity recess; 46: a pit portion; 47: a convex portion; 48: a primary molded article; 49: a lens section; 50: an upper mold cavity block; 51: a cavity recess; 52: a pit portion; 53: a recessed portion; 54: a primary molded article; 55: a lens section; 56: a resin material; 57: an upper mold cavity block; 58: an upper mold cavity block; 59: a cavity recess; 60: a cavity recess; 61: a protective film; 62: a primary molded article; 63: a secondary molded article; 64: a lens section; 65: a lens section; 66: a convex portion; 67: a recessed portion; 68: a resin material; 69: a cavity recess; 70: a convex portion; 71: a cavity recess; 72: a convex portion; 73: a cavity recess; 74: a convex portion; 75: a resin material; 76: residual materials; 420: an upper die holder; 430 lower die holder.
Claims (6)
1. A resin sealing mold comprises a primary molding mold and a secondary molding mold, wherein a first inner space formed by a pair of molds is filled with a light-transmitting molding material, and a substrate with an electronic component is sealed by resin; the secondary molding die is characterized in that a thermosetting molding material is filled into a second inner space formed by another pair of dies, and the primary molded product is sealed by resin in a manner that a part of the primary molded product molded by the primary molding die is exposed,
the primary molding die comprises: a first mold for placing the substrate with electronic component; and a second mold that forms a small space in the first internal space formed together with the first mold, the small space simulating a recess forming the exposed portion and a convex or concave portion formed along the entire circumference of the periphery of the recess,
the secondary forming die comprises: a third mold for placing the primary molded article; and a fourth mold that forms the second internal space together with the third mold in a state of covering the exposed portion modeled by the small space and the portion formed by the convex portion or the concave portion in the primary molded article.
2. The mold for resin sealing according to claim 1,
the fourth mold is configured to form a contact portion in the second internal space, the contact portion being in contact with a portion of the primary molded article formed by the convex portion or the concave portion formed by the small space.
3. The mold for resin sealing according to claim 1 or 2,
the second mold is formed as the convex portion or the concave portion in a concave shape arranged at a peripheral edge of the concave portion,
the fourth mold forms the second internal space while covering the exposed portion formed by the dent and the convex portion formed by the concave shape in the primary molded article.
4. A primary molding die for molding a primary molded article by filling a first internal space formed by a pair of dies with a light-transmitting molding material and resin-sealing a substrate with an electronic component, the primary molded article being formed by filling a second internal space formed by another pair of dies as a secondary molding die with a thermosetting molding material in a subsequent step and resin-sealing the secondary molded article so as to expose a part of the primary molded article,
the primary molding die comprises: a first mold for placing the substrate with electronic component; and a second mold for forming a small space in the first internal space formed together with the first mold, the small space simulating a recess in which an exposed portion is formed and a convex portion or a concave portion formed along the entire circumference of the periphery of the recess.
5. A secondary molding die in which a thermosetting molding material is filled into a second internal space formed by a pair of dies, and a primary molded product obtained by resin-sealing a substrate with an electronic component by filling a first internal space formed by a pair of dies with a light-transmitting molding material is resin-sealed so that a part of the primary molded product is exposed,
the secondary forming die comprises:
a third mold on which the primary molded article having a lens portion exposed to the outside and a convex portion or a concave portion arranged along the entire circumference of the periphery of the lens portion, which is molded by the primary molding mold, is placed; and
a fourth mold that forms the second internal space together with the third mold in a state of covering the lens portion and the convex portion or the concave portion in the primary molded article,
the secondary molding die is in contact with the convex portion or the concave portion of the primary molded article to suppress the resin from entering the lens portion.
6. A method for producing a resin molded article, characterized in that,
the method for producing a resin molded article comprises:
a primary molding step of molding a primary molded product having a lens portion exposed to the outside and a convex portion or a concave portion arranged along the entire circumference of the periphery of the lens portion by filling a translucent molding material into a first internal space of a primary molding die; and
and a secondary molding step of bringing the convex portion or the concave portion of the primary molded article into contact with a concave portion or a convex portion provided in a second internal space of a secondary molding die, and filling the second internal space with a thermosetting molding material to suppress the molding material from entering the lens portion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-209934 | 2016-10-26 | ||
| JP2016209934A JP6217998B1 (en) | 2016-10-26 | 2016-10-26 | Resin sealing mold, primary molding mold, secondary molding mold, and resin molded product manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108162300A CN108162300A (en) | 2018-06-15 |
| CN108162300B true CN108162300B (en) | 2020-04-10 |
Family
ID=60156727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710996372.8A Expired - Fee Related CN108162300B (en) | 2016-10-26 | 2017-10-24 | Resin sealing mold, primary molding mold, secondary molding mold, and method for producing resin molded article |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6217998B1 (en) |
| CN (1) | CN108162300B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6923820B2 (en) * | 2018-10-31 | 2021-08-25 | 日亜化学工業株式会社 | Manufacturing method of package and manufacturing method of light emitting device |
| CN111175859B (en) * | 2018-11-13 | 2021-10-22 | 株式会社小糸制作所 | 2-color formed lens |
| WO2020129728A1 (en) * | 2018-12-21 | 2020-06-25 | 第一精工株式会社 | Resin molding mold and resin molding method |
| CN113921426B (en) * | 2021-10-08 | 2022-08-30 | 江苏联康测控有限公司 | Novel radio frequency chip packaging equipment |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102237381A (en) * | 2010-04-22 | 2011-11-09 | 采钰科技股份有限公司 | Method for forming image sensing device and molding apparatus |
| CN103108736A (en) * | 2010-09-02 | 2013-05-15 | 奥林巴斯株式会社 | Method for producing resin molded article and mold for resin molded article |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3026426B2 (en) * | 1996-08-29 | 2000-03-27 | 沖電気工業株式会社 | Resin-sealed semiconductor device, method of manufacturing the same, and mold structure thereof |
| JP2004127962A (en) * | 2002-09-30 | 2004-04-22 | Mitsui High Tec Inc | Resin sealing method of semiconductor device |
| JP4432090B2 (en) * | 2007-07-02 | 2010-03-17 | 株式会社山武 | Multi-molded body |
| JP5076198B2 (en) * | 2008-02-15 | 2012-11-21 | 三菱電機株式会社 | Resin molded part and its manufacturing method |
| JP2012254538A (en) * | 2011-06-07 | 2012-12-27 | Shinsei:Kk | Manufacturing method of complex optical component |
| JP5816399B2 (en) * | 2012-07-19 | 2015-11-18 | Ｔｏｗａ株式会社 | Mold, substrate adsorption mold, resin sealing device, and method for manufacturing resin-sealed electronic component |
-
2016
- 2016-10-26 JP JP2016209934A patent/JP6217998B1/en active Active
-
2017
- 2017-10-24 CN CN201710996372.8A patent/CN108162300B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102237381A (en) * | 2010-04-22 | 2011-11-09 | 采钰科技股份有限公司 | Method for forming image sensing device and molding apparatus |
| CN103108736A (en) * | 2010-09-02 | 2013-05-15 | 奥林巴斯株式会社 | Method for producing resin molded article and mold for resin molded article |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108162300A (en) | 2018-06-15 |
| JP6217998B1 (en) | 2017-10-25 |
| JP2018069503A (en) | 2018-05-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108162300B (en) | Resin sealing mold, primary molding mold, secondary molding mold, and method for producing resin molded article | |
| US7753667B2 (en) | Resin-sealed mold and resin-sealed device | |
| JP2701649B2 (en) | Method and apparatus for sealing a semiconductor device | |
| US7681308B2 (en) | Fabrication method of semiconductor integrated circuit device | |
| KR101657639B1 (en) | Manufacturing method for resin sealed molded product and manufacturing apparatus for resin sealed molded product | |
| CN107263827A (en) | The method for detecting abnormality of resin sealing apparatus and resin sealing apparatus | |
| JP3722240B2 (en) | Resin sealing device and manufacturing method for electronic parts | |
| JP2626971B2 (en) | Resin encapsulation molding method and mold for electronic parts | |
| JP6397808B2 (en) | Resin molding die and resin molding method | |
| JPH11126787A (en) | Method and mold for resin sealing electronic component | |
| CN209738182U (en) | Injection mold of glue-overflow-preventing structure | |
| JP2000311909A (en) | Molding apparatus for resin-sealed semiconductor devices | |
| JP2014017390A (en) | Lead frame, pre-mold lead frame, semiconductor device, pre-mold lead frame manufacturing method and semiconductor device manufacturing method | |
| JP2857075B2 (en) | Semiconductor package manufacturing method, and film and mold used therefor | |
| JP3793633B2 (en) | Resin sealing molding method for electronic parts | |
| JPH07100835A (en) | Die for manufacturing optical parts, optical part manufacturing device using die and manufacture of optical parts | |
| KR101562773B1 (en) | Side view package and die set and method for forming its body | |
| KR19990029447A (en) | Semiconductor device and manufacturing method thereof | |
| JPH071769B2 (en) | Mold for resin encapsulation of semiconductor device | |
| JPH0982736A (en) | Method of molding package mold part in electronic component and device | |
| JP5401703B2 (en) | Mold | |
| JPH08124954A (en) | Method and device for resin molding of electronic part | |
| JPH09205109A (en) | Manufacture of semiconductor device | |
| JPH0994834A (en) | Resin molding apparatus and semiconductor integrated circuit apparatus made with the use of the same | |
| JPH0964079A (en) | Method of molding resin product and lead frame used for it |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200410 Termination date: 20211024 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |