CN102361740A - Mold for injection molding, injection molding method, and injection molded article - Google Patents
Mold for injection molding, injection molding method, and injection molded article Download PDFInfo
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- CN102361740A CN102361740A CN2010800132585A CN201080013258A CN102361740A CN 102361740 A CN102361740 A CN 102361740A CN 2010800132585 A CN2010800132585 A CN 2010800132585A CN 201080013258 A CN201080013258 A CN 201080013258A CN 102361740 A CN102361740 A CN 102361740A
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- injection molding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0025—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2628—Moulds with mould parts forming holes in or through the moulded article, e.g. for bearing cages
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- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Disclosed is a mold for injection molding, which enables the formation of a plurality of through holes, while effectively suppressing the formation of burrs. Specifically disclosed is a mold (2) for injection molding, which comprises a fixed mold (40) and a movable mold (50) and forms a cavity (51) between the fixed mold (40) and the movable mold (50). The mold (2) for injection molding has a plurality of rod-like pins (63, 64) which are provided on the movable mold (50), and the front end of each pin is brought into contact with the fixed mold (40) within the cavity (51) when the two molds are clamped together. The mold (2) for injection molding is also provided with an elastic pressing member (65) which is arranged outside the cavity (51) for the purpose of pressing the plurality of pins (63, 64) towards the fixed mold (40) all at once when the two molds are clamped together.
Description
Technical field
The present invention relates to injection molding forming with mould, injection molding method and injection molding forming article.
Background technology
In the past, as the method for forming resin products and injection molding forming is widely used.When forming the resin with through hole, generally be to erect in a side that is divided into two mould to be provided with pin, when matched moulds and the cavity surface butt of opposite side mould, utilize this to sell and form through hole utilizing this injection molding forming.
At this moment, the front end of opposite side mould and pin is in order to sustain damage the opposite side mould then not make tight ground butt, even when matched moulds, have the minim gap about 20 μ m yet owing to contacting.For general formed products and forming process, resin gets into this small gap hardly, burr do not occur in through-hole section, also is as goods and the size of no problem degree even perhaps occur.
But special even surface for the high-precision optical mirror plane of special demands, optical spherical surface, optical aspherical surface or freeform optics surface etc.; The resin that perhaps has fine structure for microchip like this is even then small burr also influences its function and performance.Particularly improve resin flow property and realize the manufacturing process that height duplicates; The gas assist formation method of the use nitrogen of near the thermal cycle forming process more than using the heat distortion temperature of bringing up to the temperature of die surface injecting molded resin, carbonic acid gas that raising makes the resin plasticization and die cavity internal pressure for example; Perhaps use the low adiabatic metal of thermal conductivity and make under the situation of adiabatic forming process that resin is difficult to cool off etc. for mould; Even above-mentioned small gap; Resin also gets into easily, is easy to generate burr in through-hole section.
So such motion is arranged: the cardinal extremity at pin is provided with helical spring; Through making this pin push suitably to the opposite side mould that the opposite side mould does not sustain damage when making at matched moulds, make front end and the opposite side mould butt of pin and do not have gapped method (for example with reference to patent documentation 1).
Patent documentation 1: (Japan) spy opens the 2004-114334 communique
But in the method for above-mentioned patent documentation 1 record, owing to must so the quantity of the pin that can push is limited by helical spring size with size, be difficult to form a plurality of through holes, particularly a plurality of small through holes in the cardinal extremity difference arrangement of helical springs of each pin.And in this structure, helical spring is relative tilt for mould and easily, so be difficult to evenly push a plurality of pins, might the gap occur and produce big burr in the part.
Each pin is being provided with respectively under the situation of helical spring structure, might producing deviation owing to each helical spring deterioration etc. makes pressing force, and then as above-mentioned, be difficult to keep uniformly push.
To this, not at the cardinal extremity of pin but in the opposite side die side of pin institute butt helical spring method is set and is considered.
But the such elastomeric element of helical spring can not tolerate the injection-molded pressure of resin and also not have necessary hear resistance, so can not be configured in the die cavity.So have in the opposite side mould with the abutting part of pin as being provided with to contacting the structure that departure direction can slide; Make helical spring push this abutting part from the inside of opposite side mould; But in this structure, resin gets into the gap of slipper, produces burr.
The 3rd embodiment at patent documentation 1 discloses: integrated and utilize the form of common force application part to the opposite side mold compresses to it a plurality of pins.But the shortcoming of this method is that the machining accuracy of integrated pin self must be high, and also necessary high with the relative positional accuracy of mould insertion embedded hole.
Summary of the invention
The present invention is In view of the foregoing and exploitation, and problem is to provide a kind of injection molding forming with mould, injection molding method with this injection molding forming article, can suppress to produce burr effectively, and form a plurality of through holes.
First content of the present invention is that injection molding forming is used mould, and it possesses fixed mould and moveable die, between this fixed mould and this moveable die, is formed with the die cavity that injects resin, wherein,
Comprise:
Mould, it is any mould of said fixed mould and said moveable die, has a plurality of insertion embedded holes; Bar-shaped a plurality of pins, it inserts said insertion embedded hole and in said die cavity, makes leading section and another mould butt when matched moulds;
Pressing component, it is configured in outside the said die cavity, when said matched moulds, pushes said a plurality of pins from said another die side of the base end part side direction of said a plurality of pins in the lump.
This injection molding forming with mould in,
The material of said pressing component is elastomer (elastic resin, rubber etc.) preferably, or parallel spring or be filled with gas or the buffer unit of liquid.At this, elastic resin and rubber be not only in elastomeric term among the present invention, even but performance in the present invention is not necessary that the also involved broad sense terms such as resin of pressing force use as generally not being classified into elastic resin.
This injection molding forming with mould in,
Be preferred at least a of thermal cycle forming process, gas assist formation method and adiabatic forming process.
This injection molding forming with mould in,
The pressing force that said pressing component gives said a plurality of pins is 2～55MPa preferably, is more preferably 2～15MPa.
This injection molding forming with mould in,
Said pressing component is the tabular elastomeric element that disposes the base end part end face that is arranged on a plurality of pins of a said mould towards said another mold compresses.
This injection molding forming with mould in,
Said another mould is preferably formed by soft or high fragile material.
Second content of the present invention is an injection molding method, wherein,
Use injection molding forming of the present invention to use mould,
In said die cavity, fill the shape that moulding material duplicates this die cavity.
The 3rd content of the present invention is resinous injection molding forming article, wherein,
Use injection molding forming of the present invention to form with mould,
Have at least one of optical mirror plane, optical spherical surface, optical aspherical surface, freeform optics surface and fine structure.
In these injection molding forming article,
The microchip that preferably has trickle stream in width and the degree of depth 10～200 mu m ranges is with the injection molding forming article.
According to the present invention; Owing to be configured in the pressing component of pushing a plurality of pins in the lump outside the die cavity; So can reduce a plurality of pins deviation of pressing force separately; And can also reduce by pressing component and worsen the pressing force deviation cause, can suppress because resin gets into the big burr that produces between the leading section sold and another mould.
Therefore; Under the situation of high-precision special even surface of forming requirements and formed products with fine structure; Use under the situation that realizes high forming process of duplicating improving resin flow property, can both suppress to produce big burr effectively, and form a plurality of through holes.
Description of drawings
Fig. 1 is the vertical view of present embodiment microchip;
Fig. 2 is Fig. 1 microchip (a) III-III cutaway view, (b) IV-IV cutaway view;
Fig. 3 is formed with the vertical view of stream with the resin system substrate of groove;
Fig. 4 is the sectional view of injection molding forming of the present invention with mould;
Fig. 5 is the upward view of injection molding forming of the present invention with fixed mould in the mould;
Fig. 6 is the vertical view of injection molding forming of the present invention with moveable die in the mould;
Fig. 7 is the cutaway view of expression pin holding member one example;
Fig. 8 is the cutaway view of other examples of expression pin holding member.
The specific embodiment
Below, with reference to the description of drawings embodiments of the invention.
Fig. 1 is that injection molding forming article one embodiment of the present invention is the vertical view of microchip 1, and Fig. 2 (a) is the III-III cutaway view of Fig. 1, and Fig. 2 (b) is the IV-IV cutaway view of Fig. 1, Fig. 3 be microchip 1 possessed after state the vertical view of resin system substrate 10.
Fine structures such as the trickle stream of stating after microchip 1 has 15,16, within it portion's chemical reaction of carrying out liquid samples such as nucleic acid, protein, blood with separate, analysis etc.
Like Fig. 1～shown in Figure 3, this microchip 1 possesses the resin system substrate 10,20 of two rectangular plate shape that laminated and inboard outside of belly 10A, 20A fit each other each other.
Wherein, be formed with Fig. 2 (a), linearity stream shown in Figure 3 with groove 12,13 at the outside of belly 10A of resin system substrate 10.And as shown in Figure 3, be formed with the through hole 14 of the thickness direction of the resin system of perforation substrate 10 respectively with the both ends of groove 12,13 at these streams.Stream is mutually orthogonal formation with stream with groove 13 with groove 12 in the present embodiment, but also can not form quadrature.And, when seeing, near the bight, two positions that is in the diagonal angle of resin system substrate 10, be formed with the through hole 18 that connects at thickness direction respectively from above like Fig. 2 (b), shown in Figure 3.
And like Fig. 2 (a), Fig. 2 (b), shown in Figure 3, in the 10B of the back side of resin system substrate 10, around each through hole 14, be provided with jut 31 cylindraceous, around each through hole 18, be provided with jut 32 cylindraceous.These juts 31,32 surround through hole 14,18 and outstanding to resin system substrate 10 thickness directions.Wherein, jut 31 is chimeric with pipe, the nozzle of analytical equipment (not shown), carries out importing, the discharge of sample etc., and jut 32 is uses such as microchip 1 position when analytical equipment is provided with.This jut 31,32 can have shape cylindraceous, also can have other shapes such as polygon shape.The size of jut 31 can coincidence tube, jet size ground is set arbitrarily.
On the other hand, shown in Fig. 2 (a), resin system substrate 20 is parts of surface smoothing, engages with the outside of belly 10A (forming the face of stream with groove 12,13) of resin system substrate 10.Resin system substrate 20 has as the function of stream with the lid (cover) of groove 12,13 and through hole 14 through this joint, and the stream of resin system substrate 10 with form between the groove 12 trickle stream 15, with stream with the trickle stream of formation between the groove 13 16, form peristome 17 by through hole 14.
And shown in Fig. 2 (b), resin system substrate 20 is being formed with the through hole 21 that connects to thickness direction with through hole 18 each corresponding position of resin system substrate 10.This through hole 21 uses with through hole 18 carries out each substrate when engaging resin system substrate 10 with resin system substrate 20 location.And through hole 21 is communicated with through hole 18 with the joint of resin system substrate 20 through resin system substrate 10, utilizes this through hole 18 and formation locating hole 19.Microchip 1 when not shown analytical equipment is provided with, this locating hole 19 uses as the location.
At this; The shape of trickle stream 15,16 (stream is with groove 12,13) wants to reduce the use amount of analyzing samples, reagent; Consider making precision, replicability, somatotype property of shaping dies etc.; The preferable width and the degree of depth all are the shapes in 10 μ m～200 mu m ranges, do not have special qualification, as long as just can according to the purposes decision of microchip.The width of trickle stream 15,16 (stream is with groove 12,13) can be all identical with the degree of depth, also can be different.The shape in trickle stream 15,16 cross sections is rectangles in the present embodiment, but this shape is an example, also can be that circle waits other shapes.
As stated, because the through hole 14 of resin system substrate 10 links to each other with groove 12,13 with stream, so the peristome 17 that is formed by this through hole 14 links to each other with trickle stream 15,16.This peristome 17 is holes of the importing that is used to carry out gel, sample, buffer solution, preservation, discharge; Pipe, the nozzle set with analytical equipment (not shown) are connected; Import gel, sample, buffer solution etc. to trickle stream 15,16 via this pipe, nozzle, or discharge from trickle stream 15,16.
It is circular that the shape of peristome 17 (through hole 14) and locating hole 19 (through hole 18) does not limit, and also can be other different shapes such as rectangle.And peristome 17 (through hole 14) and locating hole 19 (through hole 18) if internal diameter meet analytical method and analytical equipment just can, for example preferably about 1～4mm.
The shape of above resin system substrate 10,20, so long as easy to handle shape and the shape of analyzing easily then also can be Any shape, but shapes such as for example preferred square, rectangle, circle.The preferred 10mm of size of resin system substrate 10,20 is square～about 200mm is square, more preferably 10mm square～100mm is square.Be formed with the plate thickness of stream, consider formability and about preferred 0.2mm～5mm, more preferably 0.5mm～2mm with the resin system substrate 10 of groove 12,13.
As the plate thickness of the resin system substrate 20 that plays a role of lid (cover), consider formability and preferably about 0.2mm～5mm, more preferably 0.5mm～2mm.But as present embodiment, not forming under the situation of stream with groove at resin system substrate 20, also can not be tabular parts as resin system substrate 20, and uses film (sheet component).At this moment, the preferred 30 μ m of the thickness of film～300 μ m, more preferably 50 μ m～150 μ m.
The injection moulding method of stating after resin system substrate 10,20 utilizes is shaped, and moulding material uses resin.As this resin and preferred formability (replicability, somatotype property) is good, the transparency is high, ultraviolet ray and visible light and autofluorescence property is low relatively, for example can use thermoplastic resin.
For example preferably use as thermoplastic resin: Merlon, polymethyl methacrylate, polystyrene, polyacrylonitrile, polyvinyl chloride, PETG, nylon 6, nylon 66, polyvinyl acetate, polyvinylidene chloride, polypropylene, polyisoprene, polyethylene, dimethyl silicone polymer, cyclic polyolefin etc.Especially preferably use polymethyl methacrylate, cyclic polyolefin.Identical materials can be used for resin system substrate 10 and resin system substrate 20, also material different can be used.
For not being formed with the resin system substrate 20 of stream, except thermoplastic resin, also can use heat-curing resin, uv curing resin etc. with groove.Then preferably use dimethyl silicone polymer as heat-curing resin.
The microchip 1 that possesses above structure is while form through pushing two resin system substrates 10,20 to heat to engage.As heating bonding method and coupling device at this moment, can use existing known device.
Employed injection molding forming was with mould (below be called molding die) when then explanation was carried out injection molding forming to the resin system substrate of microchip 1.
At this, the employed molding die 2 of injection molding forming of resin system substrate 10 only is described, then omit explanation for the employed molding die of the injection molding forming of resin system substrate 20.Resin system substrate 20 is owing to being the shape that is formed with through hole 21 at flat board only, so just can form through the molding die that uses and be used for behind resin system substrate 10 formation through holes 14,18, stating molding die 2 to possess with spline structure.
Fig. 4 is the sectional view of molding die 2, and Fig. 5 states the upward view of fixed mould 40 after being, Fig. 6 states the vertical view of moveable die 50 after being.
As shown in Figure 4, molding die 2 possesses: fixed mould 40, moveable die 50 and pin holding member 60.
Like Fig. 4, shown in Figure 5, fixed mould 40 is formed the substantially planar than the big circle of resin system substrate 10, and 40a is formed with and is used to form stream with a part of protuberance 41 of groove 12,13 and through hole 14 below relative with moveable die 50.This protuberance 41 be formed with stream with the corresponding anti-shapes of groove 12,13 and through hole 14 parts; Says in detail exactly from stream to be formed the upset shape when seeing above groove 12,13 and the through hole 14, and to be formed with stream are identical height with the degree of depth of groove 12,13.
In the present embodiment; Fixed mould 40 is suitable for electroforming processing and is formed on the not shown main mould; Say to be exactly after utilizing galvanoplastic that metals such as nickel, nickel-cobalt alloy, nickel-cobalt-phosphorus alloy, copper are separated out, to peel off formation to this metal from main mould in detail.Thus, fixed mould 40 utilizes above-mentioned electroforming processing and is formed by soft such as nickel, copper or high fragile material.At this, said soft or high fragile material are the materials (hardness=HRC 58～60 of SKH51) lower than SKH51 hardness.
Like Fig. 4, shown in Figure 6; Moveable die 50 likewise is formed the substantially planar than resin system substrate 10 big circles with fixed mould 40; And 50a on relative with fixed mould 40, except stream with groove 12,13 and the through hole 14,18 and form the die cavity 51 of the anti-shape corresponding with the shape of resin system substrate 10.This die cavity 51 has the recess 52,53 with the corresponding anti-shape of this jut 31,32 with jut 31,32 each corresponding position.Be formed with the insertion embedded hole 54,55 with the pin 63,64 that is used to state after inserting in through hole 14,18 roughly the same footpaths in the bottom surface of recess 52,53, this inserts embedded hole 54,55 and connects at the thickness direction of moveable die 50.
Be formed with in the side of moveable die 50 and be used for the resin inlet 56 that in die cavity 51, injects the resin of moulding material.Moveable die 50 likewise is to be processed to form by electroforming with above-mentioned fixed mould 40.
As shown in Figure 4, pin holding member 60 possesses: cover 61, base member 62, bar-shaped a plurality of pins 63,64 and elastomeric element 65.
Be formed the substantially planar identical shaped when wherein, cover 61 is seen from above with fixed mould 40 and moveable die 50.Below cover 61, be formed with recess 61a, the 61b of opening downwards, be through with insertion embedded hole 61c, the 61d that is used to insert chimeric pin 63,64 to thickness direction with insertion embedded hole 54, the 55 corresponding positions of moveable die 50 in the bottom surface of this recess 61a, 61b with recess 52, the 53 corresponding positions of moveable die 50.
The material of elastomeric element 65 is so long as any of elastomer (resin, rubber), or parallel spring or be filled with gas or the buffer unit of liquid just can, also can make up them.Thus, be used to push that respectively to sell 63,64 space only be that the area portions of these pin 63,64 cardinal extremity faces is just enough.Respectively sell the existing different of cardinal extremity as elastomeric element (pressing component) and with being arranged on helical spring, the quantity of the pin that can push and size are not limited by helical spring size, even a plurality of small pin 63,64 also can be pushed reliably.And through setting elastomeric element 65 for above-mentioned that kind; This elastomeric element 65 is configured to stable state; Different with existing helical spring; Can prevent relative mould and tilt, and owing to can be adjacent to the whole face of elastomeric element 65 and pin 63,64 cardinal extremity faces and push this pin 63,64, so can push a plurality of pins 63,64 equably.Thus, can be suppressed at the situation that the gap occurs partly between pin 63,64 and the fixed mould 40 and produce burr effectively.
As elastomer (resin, rubber); For example preferably use: the thermoplastic elastomer (TPE) of fluorubber, silicon rubber, fluorosioloxane rubber, lactoprene, ethylene-propylene rubber, polyurethane rubber, acrylic compounds, polyurethanes, phenylethylene etc. etc. are more preferably the high fluorubber of use heat resisting temperature, silicon rubber, fluorosioloxane rubber etc.
This elastomeric element 65 is to the pressing force of pin 63,64, and the temperature of moulding material and mould etc. is suitably adjusted during according to the size of pin 63,64 (through hole 14,18), injection molding forming, but is the above pressing force of 2MPa substantially.As long as the upper limit of pressing force with can produce elastomeric element 65 self, fixed mould 40 and sell 63,64 be not damaged degree pressing force just can, more preferably be set in the scope of 2～55MPa.And then be 2～15MPa for well with pressing force.Pressing component is selected from the material of the rubber hardness of bringing into play this scope pressing force and compression ratio just can.
Then the injection molding method of the resin system substrate 10 of molding die 2 is used in explanation.
At first; Inserted chimeric erect the pin 63,64 that is provided with by pin holding member 60 to the insertion embedded hole 54,55 of corresponding respectively moveable die 50; Make moveable die 50 below with the state of butt above the cover 61 under, fixing moveable die 50 with pin holding member 60.Like this, pin 63,64 connects moveable die 50 and erects the state in the die cavity 51 that is arranged on this moveable die 50 with regard to becoming, and the parts in this die cavity 51 become the anti-shape corresponding with the through hole of resin system substrate 10 14,18.
Then fixed mould 40 and moveable die 50 be combined into one (matched moulds).At this; The pin holding member while make the moveable die 50 that is fixed above 50a mutual circumferential edges of 40a with fixed mould 40 below consistent make moveable die 50 above 50a and fixed mould 40 below the 40a butt, fix these fixed moulds 40 and moveable die 50.At this moment, also can be coated with parting compound by 40a in the die cavity 51 of moveable die 50 and below the fixed mould 40.
At this moment, pin 63,64 leading section be used to own elasticity parts 65 pressing force and die cavity 51 in and fixed mould 40 butts.Be exactly the leading section of pin 63 and the protuberance of fixed mould 40 41 following butts, the leading section of pin 64 and the following 40a butt of fixed mould 40 specifically.At this moment, pin 63,64 flange part 63a, above the 64a with the recess 61a of cover 61,61b bottom surface butt not, utilize the pressing force of elastomeric element 65 to make pin 63,64 and fixed mould 40 reliable butts.
Then filling moulding material is resin.Be exactly in die cavity 51, to inject filling to the resin that is heated to set point of temperature with the injection-molded pressure of stipulating from resin inlet 56 specifically.And after the cool time of regulation, take out the resin that solidifies from molding die 2, obtained being replicated the shape of die cavity 51 grades thus, and utilize and sell 63,64 and be formed with the resin system substrate 10 of through hole 14,18.
When carrying out above-mentioned injection molding forming, also can use at least a of following forming process: the thermal cycle forming process of going up and down at least one temperature of fixed mould 40 and moveable die 50 repeatedly, the gas assist formation method that to die cavity 51 in, continues moulding material is injected gases at high pressure such as carbonic acid gas, nitrogen, the adiabatic forming process of the heat insulation layer of thermal insulation at least one of fixed mould 40 and moveable die 50 is provided for die cavity 51.Can improve resin flow property through using them and realize that height duplicates.And, can use existing technique known as these forming processes.
According to above molding die 2; Connect at moveable die 50 and to make leading section die cavity 51 in and a plurality of pins 63,64 of fixed mould 40 butts when these moveable die 50 ground are provided with at matched moulds; Base end part at pin 63,64 is provided with the elastomeric element of pushing this all pins 63,64 to each leading section 65; Therefore, utilize this elastomeric element 65 and can push all pins 63,64 simultaneously, make the leading section and fixed mould 40 butts of these pins 63,64.Thus, can suppress between leading section and the fixed mould 40 that resin enters into pin 63,64 and produce big burr.
The material of elastomeric element 65 is elastomer (resin, a rubber), or parallel spring or be filled with gas or the buffer unit of liquid, and respectively to sell 63,64 space only be that the area portions of these pin 63,64 cardinal extremity faces is just enough so be used to push.Thus, respectively sell the existing different of cardinal extremity as elastomeric element (pressing component) and with being arranged on helical spring, even a plurality of small pin 63,64 also can be pushed reliably.
And through setting elastomeric element 65 for above-mentioned that kind; This elastomeric element 65 is configured to stable state; Different with existing helical spring; Can prevent relative mould and tilt, and owing to can be adjacent to the whole face of elastomeric element 65 and pin 63,64 cardinal extremity faces and push this pin 63,64, so can push a plurality of pins 63,64 equably.Thus, can be suppressed at the situation that the gap occurs partly between pin 63,64 and the fixed mould 40 and produce burr effectively.
Therefore; Under the situation of high-precision special even surface of forming requirements and formed products with fine structure; Use under the situation that realizes high forming process of duplicating improving resin flow property, can both suppress to produce big burr effectively, and be shaped a plurality of through holes 14,18.
Because pin 63,64 is moderately pushed by elastomeric element 65, so even the fixed mould 40 that is formed by soft or high fragile material can not sustain damage owing to the butt of pin 63,64 yet.Even and have under the situation of change at mold clamping force and mold temperature, also can absorb the strain of the variation of the pressing force of following this change by elastomeric element 65, make pin 63,64 reliably with fixed mould 40 butts.
Since utilize elastomeric element 65 can make pin 63,64 reliably with fixed mould 40 butts, so do not need to manage accurately the length dimension of pin 63,64.Therefore, can reduce cost of manufacture, and just can make the short time.
The present invention should not be interpreted as the above embodiments with limiting, certainly suitable change and improvement can be arranged.
For example in the above-described embodiments; Lifting the microchip 1 with fine structure as the injection molding forming article that use molding die 2 to be shaped is illustrated; But as this injection molding forming article also can be optical mirror plane, optical spherical surface, optical aspherical surface, the freeform optics surface with optical lens etc., also can be to have at least one of they and fine structure.
Die cavity 51 is illustrated as being formed on moveable die 50, but so long as be formed between fixed mould 40 and the moveable die 50 just can, for example also can be formed on fixed mould 40.
Pin the 63, the 64th utilizes moveable die 50 and pin holding member 60 to fix and is illustrated as being arranged on moveable die 50 sides, but also can be arranged on fixed mould 40 sides.
It is cylindric that pin 63,64 does not limit, and for example also can be towards leading section and the taper that the footpath diminishes.The injection molding forming article are carried out from pin 63,64 somatotypes more easily.Pin 63,64 also can flat column.
Embodiment
Below come more specifically to explain the present invention through lifting embodiment.
As embodiments of the invention 1,2 and comparative example,, use the molding die that is provided with the molding die 2 of elastomeric element 65 and elastomeric element is not set, respectively resin system substrate 10 injection molding formings of microchip 1 according to following condition.
< resin system substrate >
Size: 50mm is square
Thickness: 1.5mm
Stream is with the degree of depth and the width of groove 12,13: 50 μ m
The internal diameter of through hole 14,18: 2mm
< elastomeric element >
As the elastomeric element 65 of embodiment 1 and use: material is that fluorubber, thickness are that 2mm, compression ratio are 50%, are 40MPa to the pressing force of pin 63,64.As the elastomeric element 65 of embodiment 2 and use: material is that fluorubber, thickness are that 2mm, compression ratio are 10%, are 4MPa to the pressing force of pin 63,64.That the fluorubber that in embodiment 1,2, uses is concrete is the ProductName F201 of NOK Corp.'s system, the fluorubber of rubber hardness A70.
< injection molding forming >
Use the propylene (Delpet: society of Asahi Chemical Industry system, the login trade mark of Chemical Co., Ltd of Asahi Chemical Industry) of transparent resin material as moulding material, utilize the thermal cycle forming process to carry out injection molding forming.
< evaluation >
For the resin system substrate (comparative example) that use is provided with the resin system substrate 10 (embodiment 1,2) that the molding die 2 of elastomeric element 65 forms and uses the molding die that is not provided with elastomeric element 65 to form, confirm the generation of burr respectively with the peristome of microscopic examination through hole 14,18.And the pin that the such length in the above gap of 5 μ m is arranged between the front end of pin and mould when the pin of comparative example has been to use the mould matched moulds.
The resin system substrate 10 of embodiment 1,2 does not consequently all produce burr at the peristome of any through hole 14,18.On the other hand, the resin system of comparative example substrate all produces the burr about 100 μ m at the peristome of any through hole.
Can confirm according to above result, form a plurality of through holes 14,18 while be provided with the molding die 2 of elastomeric element 65 and can suppress to produce burr through use.
Symbol description
1 microchip (injection molding forming article) 2 molding dies (injection molding forming is used mould)
10,20 resin system substrates (injection molding forming article), 40 fixed moulds
50 moveable dies, 51 die cavitys 54,55 insert embedded hole 63,64 pins
65 elastomeric elements (pressing component)
Claims (10)
1. an injection molding forming is used mould, possesses fixed mould and moveable die, between this fixed mould and this moveable die, is formed with the die cavity that injects resin, it is characterized in that, comprising:
Mould, it is any mould of said fixed mould and said moveable die, has a plurality of insertion embedded holes; Bar-shaped a plurality of pins, it inserts said insertion embedded hole and in said die cavity, makes leading section and another mould butt when matched moulds;
Pressing component, it is configured in outside the said die cavity, when said matched moulds, pushes said a plurality of pins from said another die side of the base end part side direction of said a plurality of pins in the lump.
2. injection molding forming as claimed in claim 1 is used mould, it is characterized in that,
The material of said pressing component is an elastomer, or parallel spring, or is filled with the buffer unit of gas or liquid.
3. according to claim 1 or claim 2 injection molding forming is used mould, it is characterized in that,
The pressing force that said pressing component gives said a plurality of pins is 2～55MPa.
4. according to claim 1 or claim 2 injection molding forming is used mould, it is characterized in that,
The pressing force that said pressing component gives said a plurality of pins is 2～15MPa.
5. use mould like each described injection molding forming of claim 1～4, it is characterized in that,
It is used at least a of thermal cycle forming process, gas assist formation method and adiabatic forming process.
6. use mould like each described injection molding forming of claim 1～5, it is characterized in that,
Said pressing component is the tabular elastomeric element that disposes the base end part end face that is arranged on a plurality of pins of a said mould towards said another mold compresses.
7. use mould like each described injection molding forming of claim 1～6, it is characterized in that,
Said another mould is formed by soft or high fragile material.
8. an injection molding method uses each described injection molding forming of claim 1～7 to use mould, it is characterized in that,
In said die cavity, fill the shape that moulding material duplicates this die cavity.
9. resinous injection molding forming article use each described injection molding forming of claim 1～7 to form with mould, it is characterized in that,
Have at least one of optical mirror plane, optical spherical surface, optical aspherical surface, freeform optics surface and fine structure.
10. injection molding forming article as claimed in claim 9 is characterized in that,
It is that the microchip with trickle stream in width and the degree of depth 10～200 mu m ranges is used resin forming product.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-078119 | 2009-03-27 | ||
| JP2009078119 | 2009-03-27 | ||
| PCT/JP2010/053224 WO2010110014A1 (en) | 2009-03-27 | 2010-03-01 | Mold for injection molding, injection molding method, and injection molded article |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102361740A true CN102361740A (en) | 2012-02-22 |
| CN102361740B CN102361740B (en) | 2015-04-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201080013258.5A Expired - Fee Related CN102361740B (en) | 2009-03-27 | 2010-03-01 | Mold for injection molding, injection molding method, and injection molded article |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5578169B2 (en) |
| CN (1) | CN102361740B (en) |
| TW (1) | TW201102252A (en) |
| WO (1) | WO2010110014A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109318428A (en) * | 2017-08-01 | 2019-02-12 | 东和株式会社 | The manufacturing method of forming device and resin forming product |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012057101A1 (en) * | 2010-10-29 | 2012-05-03 | コニカミノルタオプト株式会社 | Microchip, microchip shaping die, and manufacturing apparatus for manufacturing microchip |
| EP2687348A4 (en) * | 2011-03-17 | 2014-10-15 | Konica Minolta Inc | Method for producing resin molding die, resin molding die, resin molding die set, method for producing microchip substrate, and method for producing microchip using said die |
| JP6686539B2 (en) * | 2016-03-04 | 2020-04-22 | 住友ベークライト株式会社 | Injection molding die and injection molding method using the same |
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| JPH025537A (en) * | 1988-06-24 | 1990-01-10 | Hitachi Ltd | Resin sealing die |
| CN1348206A (en) * | 2000-10-06 | 2002-05-08 | 日本电气株式会社 | Resin encapsulation modle |
| JP2003251660A (en) * | 2002-03-05 | 2003-09-09 | Fuji Photo Film Co Ltd | Method for manufacturing porous body |
| JP2004114334A (en) * | 2002-09-24 | 2004-04-15 | Ono Sangyo Kk | Mold assembly and molding method |
| CN1993215A (en) * | 2005-05-24 | 2007-07-04 | 株式会社村田制作所 | Method of manufacturing insert-molded article and apparatus thereof |
| US20080185747A1 (en) * | 2007-02-05 | 2008-08-07 | Canon Kabushiki Kaisha | Injection mold and partial compression molding method |
-
2010
- 2010-03-01 JP JP2011505940A patent/JP5578169B2/en not_active Expired - Fee Related
- 2010-03-01 CN CN201080013258.5A patent/CN102361740B/en not_active Expired - Fee Related
- 2010-03-01 WO PCT/JP2010/053224 patent/WO2010110014A1/en active Application Filing
- 2010-03-24 TW TW99108707A patent/TW201102252A/en unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH025537A (en) * | 1988-06-24 | 1990-01-10 | Hitachi Ltd | Resin sealing die |
| CN1348206A (en) * | 2000-10-06 | 2002-05-08 | 日本电气株式会社 | Resin encapsulation modle |
| JP2003251660A (en) * | 2002-03-05 | 2003-09-09 | Fuji Photo Film Co Ltd | Method for manufacturing porous body |
| JP2004114334A (en) * | 2002-09-24 | 2004-04-15 | Ono Sangyo Kk | Mold assembly and molding method |
| CN1993215A (en) * | 2005-05-24 | 2007-07-04 | 株式会社村田制作所 | Method of manufacturing insert-molded article and apparatus thereof |
| US20080185747A1 (en) * | 2007-02-05 | 2008-08-07 | Canon Kabushiki Kaisha | Injection mold and partial compression molding method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109318428A (en) * | 2017-08-01 | 2019-02-12 | 东和株式会社 | The manufacturing method of forming device and resin forming product |
| CN109318428B (en) * | 2017-08-01 | 2020-12-22 | 东和株式会社 | Molding apparatus and method for manufacturing resin molded product |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2010110014A1 (en) | 2012-09-27 |
| JP5578169B2 (en) | 2014-08-27 |
| CN102361740B (en) | 2015-04-29 |
| TW201102252A (en) | 2011-01-16 |
| WO2010110014A1 (en) | 2010-09-30 |
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