JPH0294461A - Lead frame for semiconductor device - Google Patents
Lead frame for semiconductor deviceInfo
- Publication number
- JPH0294461A JPH0294461A JP24564988A JP24564988A JPH0294461A JP H0294461 A JPH0294461 A JP H0294461A JP 24564988 A JP24564988 A JP 24564988A JP 24564988 A JP24564988 A JP 24564988A JP H0294461 A JPH0294461 A JP H0294461A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- radiation plate
- resin
- heat sink
- projection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 17
- 239000011347 resin Substances 0.000 claims abstract description 27
- 229920005989 resin Polymers 0.000 claims abstract description 27
- 238000007789 sealing Methods 0.000 claims abstract description 13
- 238000000465 moulding Methods 0.000 abstract description 6
- 230000005855 radiation Effects 0.000 abstract 8
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は主に放熱板付樹脂封止型半導体装置に利用する
ことのできるリードフレームに関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention mainly relates to a lead frame that can be used in a resin-sealed semiconductor device with a heat sink.
従来の技術
放熱根付樹脂１１止型の半導体装置を樹脂封止成形する
際は、樹脂封止用金型の上型と下型によって、リードフ
レームのリード部と成熱板部の一部封止されない部分を
クランプすることによって樹脂成形されていた。Conventional technology Heat dissipation resin 11 When molding a molded semiconductor device with resin, the lead part of the lead frame and the heating plate part are partially sealed by the upper and lower molds of the resin molding mold. It was molded in resin by clamping the parts that were not covered.
発明が解決しようとする課題
しかしながら上記従来の半導体装置の樹脂１・１止では
樹脂封止用金型の上型と下型で放熱板付リードフレーム
の上面と下面を押さえるため、前記欣然板の上面および
下面への封止樹脂のもれは少ないが、前記放熱板側面に
は、前記金型との間に生じる隙間のために樹脂成形片樹
脂が侵入し、欣然板側面に樹脂パリが発生していた。そ
して、このパリ取り工程で放熱板に傷をつけたりしてい
た。Problems to be Solved by the Invention However, in the conventional 1-1 resin molding of the semiconductor device described above, the upper and lower molds of the resin molding mold press down the upper and lower surfaces of the lead frame with a heat dissipation plate. Although there is little leakage of the sealing resin to the bottom surface, the resin molded piece resin enters the side surface of the heat dissipation plate due to the gap created between it and the mold, and resin flakes are generated on the side surface of the plate. was. This deburring process also caused damage to the heat sink.
本発明は上記問題を解決するために樹脂バリがあまり発
生しない半導体装置用リードフレームを提供することを
目的とするものである。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, it is an object of the present invention to provide a lead frame for a semiconductor device in which resin burrs do not occur much.
課題を解決するための手段
上記問題を解決するために本光明は、半導体素子が接続
されるリード部に連結された外枠部と、この外枠部に連
結された放熱板とを有し、この放熱板の側面に、前記外
枠部および放熱板を樹脂封止用の金型に収容したときに
押しつぶされて前記金型と欣然板側面との間の隙間の一
部をうずめる突部を形成したものである。Means for Solving the Problems In order to solve the above problems, the present light has an outer frame portion connected to a lead portion to which a semiconductor element is connected, and a heat sink connected to the outer frame portion, The side surface of the heat sink is provided with a protrusion that is crushed when the outer frame and the heat sink are housed in a mold for resin sealing, filling a part of the gap between the mold and the side surface of the board. It was formed.
作用
上記構成により、半導体装置の樹脂封止の際、樹脂封止
用金型によりリードフレームの上面と下面を押えたとき
に、放熱板側面の突部は金型により押しつぶされて、金
型と放熱板側面との間の隙間の一部をうずめるように密
着し、金型と欣然板側面との間の隙間への封止樹脂の侵
入が金型に密着した突部により阻止され、これにより侵
入樹脂による欣然板側面のパリのツテ生が防止される。Effect With the above configuration, when the resin sealing mold is used to press the top and bottom surfaces of the lead frame when a semiconductor device is resin-sealed, the protrusions on the side surfaces of the heat sink are crushed by the mold and do not connect with the mold. The protrusions that are in close contact with the mold prevent the sealing resin from entering the gap between the mold and the side surface of the heat dissipation plate, filling a part of the gap between the mold and the side surface of the heat sink. This prevents creeping of the sides of the board due to intruding resin.
実施例
以下、本光明の一実施例を図面に基づき説明する。第１
図は本光明の一実施例を示づ成熱板付きの半導体Ｍｌ用
リードフレームの４Ｍ脂１４止後の平面図、第２図は同
半導体装置用リードフレームの樹脂封止前の要部斜視図
、第３図（ａ ） ｄ３よび（ｂ）はそれぞれ四半導体
装置用リードフレームを金型内に収容した際の要部平面
図および要部側面断面図、第４図（ａ）および（Ｌ））
Ｇよそれぞれ同半導体装置用リードフレームを金型内
に収容して金型により上下より押圧した後の要部平面図
および要部側面断面図である。第１図において、１はリ
ードフレームで、半導体素子（図示せず）が接続される
リード部２と、このリード部に連結された外枠部３と、
この外枠部３に連結された放熱板４とを有し、第２図に
拡大して示すように、放熱板４の側面には側方へ突出す
る突部４ａが形成されている。また、４ｂは放熱板規制
孔、５は封止樹脂である。第３図（ａ）および（ｂ）に
ｄ３いて、６および７は半導体素子を樹脂封止するため
の上金型および下金型で、上金型６における放熱板４の
突部４ａに対応する箇所には下方に突出する凹部６ａが
設けられている。EXAMPLE Hereinafter, an example of the present invention will be described based on the drawings. 1st
The figure shows an embodiment of the present invention, and is a plan view of a lead frame for semiconductor Ml with a heating plate after being sealed with 4M resin, and Figure 2 is a perspective view of the main parts of the lead frame for semiconductor devices before being sealed with resin. Figures 3 (a), d3 and (b) are a plan view and a side sectional view of the main parts when the lead frame for a semiconductor device is accommodated in the mold, respectively, and Figs. 4 (a) and (L ))
FIG. 1G is a plan view and a side sectional view of the main part after the lead frame for the semiconductor device is housed in a mold and pressed from above and below by the mold, respectively. In FIG. 1, 1 is a lead frame, which includes a lead part 2 to which a semiconductor element (not shown) is connected, an outer frame part 3 connected to this lead part,
The heat sink 4 has a heat sink 4 connected to the outer frame 3, and as shown in an enlarged view in FIG. 2, a side surface of the heat sink 4 is formed with a protrusion 4a that projects laterally. Further, 4b is a heat sink regulating hole, and 5 is a sealing resin. At d3 in FIGS. 3(a) and 3(b), 6 and 7 are an upper mold and a lower mold for resin-sealing a semiconductor element, and correspond to the protrusion 4a of the heat sink 4 in the upper mold 6. A concave portion 6a that protrudes downward is provided at the location.
上記構成により、樹脂封止成形の際に、上金型６と下金
型７により外枠部３および放熱板４をクランプすると、
第４図（ａ）および（ｂ）に示すように、上金型６の凸
部６ａにより放熱板４の突部４ａは押しつぶされて、下
金型７と放熱板４の側面との間の隙間がこの位置でうず
められる。したがって封止樹脂の矢印で示すような流れ
が突部４ａにより遮断され、金型と放熱板側面の間の残
りの隙間８への樹脂の廻り込みは阻止され、放熱板４の
この部分の側面にパリがｇｕｌＥＶることが防■される
。なお、この突部４ａの幅１よ１ 、５ ｍｌ−４，０
１Ｍ＋で、岸さ０．２．ｍ 〜２．０．＃Ｉの範囲に設
定することが好適である。また、このままの状態Ｃは、
電子部品としては突部４ａがつぶれているため製品には
ならないので、この突部４ａは製品加工（量、）に切り
離され、これにより製品として使用される。With the above configuration, when the outer frame 3 and the heat sink 4 are clamped by the upper mold 6 and the lower mold 7 during resin sealing molding,
As shown in FIGS. 4(a) and 4(b), the protrusion 4a of the heat sink 4 is crushed by the convex portion 6a of the upper mold 6, and the gap between the lower mold 7 and the side surface of the heat sink 4 is crushed. The gap will be filled in at this location. Therefore, the flow of the sealing resin as shown by the arrow is blocked by the protrusion 4a, and the resin is prevented from flowing into the remaining gap 8 between the mold and the side surface of the heat sink 4, and the side surface of this portion of the heat sink 4 is blocked. Paris is prevented from being gulEV. Note that the width of this protrusion 4a is 1 - 1,5 ml - 4,0
1M+, shore depth 0.2. m ~2.0. It is preferable to set it in the range of #I. In addition, state C as it is is
Since the protrusion 4a is crushed as an electronic component, it cannot be used as a product, so the protrusion 4a is cut off for product processing and used as a product.
発明の効果
以Ｌ１本発明によれば、リードフレームの放熱板側面に
、金型に押しつ４：され′Ｃ放熱板側面と金型との間の
隙間の一部をうずめる突部を形成したので、前記隙間か
らの樹脂の侵入が阻止されて放熱板側面のパリの発生は
防止され、パリ取り工程が不要となり、したがって、こ
のパリ１ｌｌ（す１程で放熱板に傷をつけることがなく
なり、品質向上にも有益である。Effects of the Invention L1 According to the present invention, a protrusion is formed on the side surface of the heat sink of the lead frame to press against the mold and fill a part of the gap between the side surface of the heat sink and the mold. Therefore, resin is prevented from entering through the gap, and the occurrence of burr on the side surface of the heat sink is prevented, eliminating the need for a burr removal process. , it is also beneficial for quality improvement.
第１図は本発明の一実施例を示す半導体装置用リードフ
レームの樹脂１１止後の平面図、第２図（、↓同半導体
装置用リードフレームの樹脂１・目的の要部斜視図、第
３図（ａ）、（ｂ）おＪ、び第４図（ａ）、（ｂ）は同
半導体装置用リードフレームを金型内に収容した際およ
び金型によりＬトより押した後の要部平面図と要部側面
断面図である。
１・・・リードフレーム、２・・・リード部、３・・・
外枠部、４・・・欣然板、４ａ・・・突部、５・・・封
止樹脂、６・・・上金型、６ａ・・・凸部、７・・・下
金型。
代理人 森 本 う 弘
第１図
一
リード゛フし−ム
放馳扱
り１４卆 卸
封圧４釘庖
第２図
第３図
（ａ）
（ｔ））FIG. 1 is a plan view of a lead frame for a semiconductor device showing an embodiment of the present invention after resin 11 is fixed, and FIG. Figures 3 (a) and (b) and Figure 4 (a) and (b) show the main points when the lead frame for the semiconductor device is housed in the mold and after being pressed from L by the mold. They are a top view and a side sectional view of main parts. 1... Lead frame, 2... Lead part, 3...
Outer frame portion, 4... Protrusion plate, 4a... Protrusion, 5... Sealing resin, 6... Upper mold, 6a... Convex portion, 7... Lower mold. Agent Uhiro Morimoto (Figure 1, 1 lead book, 14 volumes, wholesale sealing pressure, 4 nails, Figure 2, Figure 3 (a) (t))
Claims (1)
部と、この外枠部に連結された放熱板とを有し、この放
熱板の側面に、前記外枠部および放熱板を樹脂封止用の
金型に収容したときに押しつぶされて前記金型と放熱板
側面との間の隙間の一部をうずめる突部を形成した半導
体装置用リードフレーム。1. It has an outer frame part connected to a lead part to which a semiconductor element is connected, and a heat sink connected to this outer frame part, and the outer frame part and the heat sink are attached to a side surface of the heat sink with resin. A lead frame for a semiconductor device, which is formed with a protrusion that is crushed when housed in a sealing mold and fills a part of the gap between the mold and a side surface of a heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24564988A JPH07114213B2 (en) | 1988-09-29 | 1988-09-29 | Lead frame for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24564988A JPH07114213B2 (en) | 1988-09-29 | 1988-09-29 | Lead frame for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0294461A true JPH0294461A (en) | 1990-04-05 |
| JPH07114213B2 JPH07114213B2 (en) | 1995-12-06 |
Family
ID=17136781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24564988A Expired - Lifetime JPH07114213B2 (en) | 1988-09-29 | 1988-09-29 | Lead frame for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07114213B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5898216A (en) * | 1995-11-14 | 1999-04-27 | Sgs-Thomson Microelectronics S.A. | Micromodule with protection barriers and a method for manufacturing the same |
| WO2015083263A1 (en) * | 2013-12-05 | 2015-06-11 | 新電元工業株式会社 | Lead frame, molding die, and method for manufacturing mounting component-attached lead frame |
-
1988
- 1988-09-29 JP JP24564988A patent/JPH07114213B2/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5898216A (en) * | 1995-11-14 | 1999-04-27 | Sgs-Thomson Microelectronics S.A. | Micromodule with protection barriers and a method for manufacturing the same |
| US6071758A (en) * | 1995-11-14 | 2000-06-06 | Sgs-Thomson Microelectronics S.A. | Process for manufacturing a chip card micromodule with protection barriers |
| WO2015083263A1 (en) * | 2013-12-05 | 2015-06-11 | 新電元工業株式会社 | Lead frame, molding die, and method for manufacturing mounting component-attached lead frame |
| CN104838494A (en) * | 2013-12-05 | 2015-08-12 | 新电元工业株式会社 | Lead frame, molding die, and method for manufacturing mounting component-attached lead frame |
| KR101564636B1 (en) * | 2013-12-05 | 2015-10-30 | 신덴겐코교 가부시키가이샤 | Lead frame, mold and method of manufacturing lead frame with mounted component |
| JP5937222B2 (en) * | 2013-12-05 | 2016-06-22 | 新電元工業株式会社 | Manufacturing method of lead frame, mold, lead frame with mounting parts |
| US9601416B2 (en) | 2013-12-05 | 2017-03-21 | Shindengen Electric Manufacturing Co., Ltd. | Lead frame, mold and method of manufacturing lead frame with mounted component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07114213B2 (en) | 1995-12-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| MY126370A (en) | Plastic molded type semiconductor device and fabrication process thereof | |
| JPH0294461A (en) | Lead frame for semiconductor device | |
| JP2517691B2 (en) | Semiconductor device and manufacturing method thereof | |
| JP2995119B2 (en) | Method for manufacturing lead frame for power transistor | |
| JPS62115834A (en) | Semiconductor sealing device | |
| JPH10270606A (en) | Structure of packaged semiconductor device | |
| JP2546129B2 (en) | Method for manufacturing lead frame for semiconductor device | |
| JPS6232622A (en) | Resin-sealed metal mold for semiconductor device | |
| JPH0794635A (en) | Resin sealed package | |
| JP2585771B2 (en) | Method for manufacturing semiconductor device | |
| JPH06216178A (en) | Molding die for resin-sealed semiconductor device | |
| JP2838948B2 (en) | Lead frame | |
| JPH0644105Y2 (en) | Lead frame of resin mold type semiconductor device | |
| JPH06224244A (en) | Seal molding method for electronic components and die therefor | |
| JP2560194B2 (en) | Method of manufacturing packaged semiconductor device | |
| JPH06232304A (en) | Lead frame for full mold package | |
| JPH09129661A (en) | Molding device and molding | |
| JPH04186740A (en) | Semiconductor sealing mold | |
| JPH0745663A (en) | Semiconductor device with heat sink and its manufacture | |
| JP2543657Y2 (en) | Semiconductor manufacturing equipment | |
| JPS6130280Y2 (en) | ||
| JP3061114U (en) | Mold resin for semiconductor devices | |
| JPH01239855A (en) | Method of sealing semiconductor device | |
| JPH0758245A (en) | Semiconductor device and manufacture thereof | |
| JPH0446899Y2 (en) |