JPH0294461A - Lead frame for semiconductor device - Google Patents

Lead frame for semiconductor device

Info

Publication number
JPH0294461A
JPH0294461A JP24564988A JP24564988A JPH0294461A JP H0294461 A JPH0294461 A JP H0294461A JP 24564988 A JP24564988 A JP 24564988A JP 24564988 A JP24564988 A JP 24564988A JP H0294461 A JPH0294461 A JP H0294461A
Authority
JP
Japan
Prior art keywords
mold
radiation plate
resin
heat sink
projection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24564988A
Other languages
Japanese (ja)
Other versions
JPH07114213B2 (en
Inventor
Tetsuo Muramatsu
哲雄 村松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP24564988A priority Critical patent/JPH07114213B2/en
Publication of JPH0294461A publication Critical patent/JPH0294461A/en
Publication of JPH07114213B2 publication Critical patent/JPH07114213B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent production of burrs on side faces of a radiation plate of a lead frame by providing a projection on the side face of the radiation plate and crushing the projection by molds to fill a gap defined between the molds and the side face of the radiation plate. CONSTITUTION:A projection 4a is provided on side faces of a radiation plate 4 while a part of an upper mold 6 is projected at 6a corresponding to the projection 4a. When the radiation plate 4 and an outer frame connected to leads are clamped together by upper and lower molds 6 and 7 during molding of sealing resin, the projection 4a is crushed by the projected part 6a of the upper mold 6 to fill the gap defined between the lower mold 7 and the side face of the radiation plate 4. Thus, flow of the sealing resin is blocked by the projection 4a and is prevented from entering into any residual gap between the molds and the side face of the radiation plate. Accordingly, no burr is produced on the side faces of the radiation plate 4.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は主に放熱板付樹脂封止型半導体装置に利用する
ことのできるリードフレームに関する。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention mainly relates to a lead frame that can be used in a resin-sealed semiconductor device with a heat sink.

従来の技術 放熱根付樹脂11止型の半導体装置を樹脂封止成形する
際は、樹脂封止用金型の上型と下型によって、リードフ
レームのリード部と成熱板部の一部封止されない部分を
クランプすることによって樹脂成形されていた。
Conventional technology Heat dissipation resin 11 When molding a molded semiconductor device with resin, the lead part of the lead frame and the heating plate part are partially sealed by the upper and lower molds of the resin molding mold. It was molded in resin by clamping the parts that were not covered.

発明が解決しようとする課題 しかしながら上記従来の半導体装置の樹脂1・1止では
樹脂封止用金型の上型と下型で放熱板付リードフレーム
の上面と下面を押さえるため、前記欣然板の上面および
下面への封止樹脂のもれは少ないが、前記放熱板側面に
は、前記金型との間に生じる隙間のために樹脂成形片樹
脂が侵入し、欣然板側面に樹脂パリが発生していた。そ
して、このパリ取り工程で放熱板に傷をつけたりしてい
た。
Problems to be Solved by the Invention However, in the conventional 1-1 resin molding of the semiconductor device described above, the upper and lower molds of the resin molding mold press down the upper and lower surfaces of the lead frame with a heat dissipation plate. Although there is little leakage of the sealing resin to the bottom surface, the resin molded piece resin enters the side surface of the heat dissipation plate due to the gap created between it and the mold, and resin flakes are generated on the side surface of the plate. was. This deburring process also caused damage to the heat sink.

本発明は上記問題を解決するために樹脂バリがあまり発
生しない半導体装置用リードフレームを提供することを
目的とするものである。
SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, it is an object of the present invention to provide a lead frame for a semiconductor device in which resin burrs do not occur much.

課題を解決するための手段 上記問題を解決するために本光明は、半導体素子が接続
されるリード部に連結された外枠部と、この外枠部に連
結された放熱板とを有し、この放熱板の側面に、前記外
枠部および放熱板を樹脂封止用の金型に収容したときに
押しつぶされて前記金型と欣然板側面との間の隙間の一
部をうずめる突部を形成したものである。
Means for Solving the Problems In order to solve the above problems, the present light has an outer frame portion connected to a lead portion to which a semiconductor element is connected, and a heat sink connected to the outer frame portion, The side surface of the heat sink is provided with a protrusion that is crushed when the outer frame and the heat sink are housed in a mold for resin sealing, filling a part of the gap between the mold and the side surface of the board. It was formed.

作用 上記構成により、半導体装置の樹脂封止の際、樹脂封止
用金型によりリードフレームの上面と下面を押えたとき
に、放熱板側面の突部は金型により押しつぶされて、金
型と放熱板側面との間の隙間の一部をうずめるように密
着し、金型と欣然板側面との間の隙間への封止樹脂の侵
入が金型に密着した突部により阻止され、これにより侵
入樹脂による欣然板側面のパリのツテ生が防止される。
Effect With the above configuration, when the resin sealing mold is used to press the top and bottom surfaces of the lead frame when a semiconductor device is resin-sealed, the protrusions on the side surfaces of the heat sink are crushed by the mold and do not connect with the mold. The protrusions that are in close contact with the mold prevent the sealing resin from entering the gap between the mold and the side surface of the heat dissipation plate, filling a part of the gap between the mold and the side surface of the heat sink. This prevents creeping of the sides of the board due to intruding resin.

実施例 以下、本光明の一実施例を図面に基づき説明する。第1
図は本光明の一実施例を示づ成熱板付きの半導体Ml用
リードフレームの4M脂14止後の平面図、第2図は同
半導体装置用リードフレームの樹脂封止前の要部斜視図
、第3図(a ) d3よび(b)はそれぞれ四半導体
装置用リードフレームを金型内に収容した際の要部平面
図および要部側面断面図、第4図(a)および(L))
 Gよそれぞれ同半導体装置用リードフレームを金型内
に収容して金型により上下より押圧した後の要部平面図
および要部側面断面図である。第1図において、1はリ
ードフレームで、半導体素子(図示せず)が接続される
リード部2と、このリード部に連結された外枠部3と、
この外枠部3に連結された放熱板4とを有し、第2図に
拡大して示すように、放熱板4の側面には側方へ突出す
る突部4aが形成されている。また、4bは放熱板規制
孔、5は封止樹脂である。第3図(a)および(b)に
d3いて、6および7は半導体素子を樹脂封止するため
の上金型および下金型で、上金型6における放熱板4の
突部4aに対応する箇所には下方に突出する凹部6aが
設けられている。
EXAMPLE Hereinafter, an example of the present invention will be described based on the drawings. 1st
The figure shows an embodiment of the present invention, and is a plan view of a lead frame for semiconductor Ml with a heating plate after being sealed with 4M resin, and Figure 2 is a perspective view of the main parts of the lead frame for semiconductor devices before being sealed with resin. Figures 3 (a), d3 and (b) are a plan view and a side sectional view of the main parts when the lead frame for a semiconductor device is accommodated in the mold, respectively, and Figs. 4 (a) and (L ))
FIG. 1G is a plan view and a side sectional view of the main part after the lead frame for the semiconductor device is housed in a mold and pressed from above and below by the mold, respectively. In FIG. 1, 1 is a lead frame, which includes a lead part 2 to which a semiconductor element (not shown) is connected, an outer frame part 3 connected to this lead part,
The heat sink 4 has a heat sink 4 connected to the outer frame 3, and as shown in an enlarged view in FIG. 2, a side surface of the heat sink 4 is formed with a protrusion 4a that projects laterally. Further, 4b is a heat sink regulating hole, and 5 is a sealing resin. At d3 in FIGS. 3(a) and 3(b), 6 and 7 are an upper mold and a lower mold for resin-sealing a semiconductor element, and correspond to the protrusion 4a of the heat sink 4 in the upper mold 6. A concave portion 6a that protrudes downward is provided at the location.

上記構成により、樹脂封止成形の際に、上金型6と下金
型7により外枠部3および放熱板4をクランプすると、
第4図(a)および(b)に示すように、上金型6の凸
部6aにより放熱板4の突部4aは押しつぶされて、下
金型7と放熱板4の側面との間の隙間がこの位置でうず
められる。したがって封止樹脂の矢印で示すような流れ
が突部4aにより遮断され、金型と放熱板側面の間の残
りの隙間8への樹脂の廻り込みは阻止され、放熱板4の
この部分の側面にパリがgulEVることが防■される
。なお、この突部4aの幅1よ1 、5 ml−4,0
1M+で、岸さ0.2.m 〜2.0.#Iの範囲に設
定することが好適である。また、このままの状態Cは、
電子部品としては突部4aがつぶれているため製品には
ならないので、この突部4aは製品加工(量、)に切り
離され、これにより製品として使用される。
With the above configuration, when the outer frame 3 and the heat sink 4 are clamped by the upper mold 6 and the lower mold 7 during resin sealing molding,
As shown in FIGS. 4(a) and 4(b), the protrusion 4a of the heat sink 4 is crushed by the convex portion 6a of the upper mold 6, and the gap between the lower mold 7 and the side surface of the heat sink 4 is crushed. The gap will be filled in at this location. Therefore, the flow of the sealing resin as shown by the arrow is blocked by the protrusion 4a, and the resin is prevented from flowing into the remaining gap 8 between the mold and the side surface of the heat sink 4, and the side surface of this portion of the heat sink 4 is blocked. Paris is prevented from being gulEV. Note that the width of this protrusion 4a is 1 - 1,5 ml - 4,0
1M+, shore depth 0.2. m ~2.0. It is preferable to set it in the range of #I. In addition, state C as it is is
Since the protrusion 4a is crushed as an electronic component, it cannot be used as a product, so the protrusion 4a is cut off for product processing and used as a product.

発明の効果 以L1本発明によれば、リードフレームの放熱板側面に
、金型に押しつ4:され′C放熱板側面と金型との間の
隙間の一部をうずめる突部を形成したので、前記隙間か
らの樹脂の侵入が阻止されて放熱板側面のパリの発生は
防止され、パリ取り工程が不要となり、したがって、こ
のパリ1ll(す1程で放熱板に傷をつけることがなく
なり、品質向上にも有益である。
Effects of the Invention L1 According to the present invention, a protrusion is formed on the side surface of the heat sink of the lead frame to press against the mold and fill a part of the gap between the side surface of the heat sink and the mold. Therefore, resin is prevented from entering through the gap, and the occurrence of burr on the side surface of the heat sink is prevented, eliminating the need for a burr removal process. , it is also beneficial for quality improvement.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例を示す半導体装置用リードフ
レームの樹脂11止後の平面図、第2図(、↓同半導体
装置用リードフレームの樹脂1・目的の要部斜視図、第
3図(a)、(b)おJ、び第4図(a)、(b)は同
半導体装置用リードフレームを金型内に収容した際およ
び金型によりLトより押した後の要部平面図と要部側面
断面図である。 1・・・リードフレーム、2・・・リード部、3・・・
外枠部、4・・・欣然板、4a・・・突部、5・・・封
止樹脂、6・・・上金型、6a・・・凸部、7・・・下
金型。 代理人   森  本  う  弘 第1図 一 リード゛フし−ム 放馳扱 り14卆 卸 封圧4釘庖 第2図 第3図 (a) (t))
FIG. 1 is a plan view of a lead frame for a semiconductor device showing an embodiment of the present invention after resin 11 is fixed, and FIG. Figures 3 (a) and (b) and Figure 4 (a) and (b) show the main points when the lead frame for the semiconductor device is housed in the mold and after being pressed from L by the mold. They are a top view and a side sectional view of main parts. 1... Lead frame, 2... Lead part, 3...
Outer frame portion, 4... Protrusion plate, 4a... Protrusion, 5... Sealing resin, 6... Upper mold, 6a... Convex portion, 7... Lower mold. Agent Uhiro Morimoto (Figure 1, 1 lead book, 14 volumes, wholesale sealing pressure, 4 nails, Figure 2, Figure 3 (a) (t))

Claims (1)

【特許請求の範囲】[Claims] 1、半導体素子が接続されるリード部に連結された外枠
部と、この外枠部に連結された放熱板とを有し、この放
熱板の側面に、前記外枠部および放熱板を樹脂封止用の
金型に収容したときに押しつぶされて前記金型と放熱板
側面との間の隙間の一部をうずめる突部を形成した半導
体装置用リードフレーム。
1. It has an outer frame part connected to a lead part to which a semiconductor element is connected, and a heat sink connected to this outer frame part, and the outer frame part and the heat sink are attached to a side surface of the heat sink with resin. A lead frame for a semiconductor device, which is formed with a protrusion that is crushed when housed in a sealing mold and fills a part of the gap between the mold and a side surface of a heat sink.
JP24564988A 1988-09-29 1988-09-29 Lead frame for semiconductor device Expired - Lifetime JPH07114213B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24564988A JPH07114213B2 (en) 1988-09-29 1988-09-29 Lead frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24564988A JPH07114213B2 (en) 1988-09-29 1988-09-29 Lead frame for semiconductor device

Publications (2)

Publication Number Publication Date
JPH0294461A true JPH0294461A (en) 1990-04-05
JPH07114213B2 JPH07114213B2 (en) 1995-12-06

Family

ID=17136781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24564988A Expired - Lifetime JPH07114213B2 (en) 1988-09-29 1988-09-29 Lead frame for semiconductor device

Country Status (1)

Country Link
JP (1) JPH07114213B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5898216A (en) * 1995-11-14 1999-04-27 Sgs-Thomson Microelectronics S.A. Micromodule with protection barriers and a method for manufacturing the same
WO2015083263A1 (en) * 2013-12-05 2015-06-11 新電元工業株式会社 Lead frame, molding die, and method for manufacturing mounting component-attached lead frame

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5898216A (en) * 1995-11-14 1999-04-27 Sgs-Thomson Microelectronics S.A. Micromodule with protection barriers and a method for manufacturing the same
US6071758A (en) * 1995-11-14 2000-06-06 Sgs-Thomson Microelectronics S.A. Process for manufacturing a chip card micromodule with protection barriers
WO2015083263A1 (en) * 2013-12-05 2015-06-11 新電元工業株式会社 Lead frame, molding die, and method for manufacturing mounting component-attached lead frame
CN104838494A (en) * 2013-12-05 2015-08-12 新电元工业株式会社 Lead frame, molding die, and method for manufacturing mounting component-attached lead frame
KR101564636B1 (en) * 2013-12-05 2015-10-30 신덴겐코교 가부시키가이샤 Lead frame, mold and method of manufacturing lead frame with mounted component
JP5937222B2 (en) * 2013-12-05 2016-06-22 新電元工業株式会社 Manufacturing method of lead frame, mold, lead frame with mounting parts
US9601416B2 (en) 2013-12-05 2017-03-21 Shindengen Electric Manufacturing Co., Ltd. Lead frame, mold and method of manufacturing lead frame with mounted component

Also Published As

Publication number Publication date
JPH07114213B2 (en) 1995-12-06

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