JPH0379319A - Molding die - Google Patents
Molding dieInfo
- Publication number
- JPH0379319A JPH0379319A JP21582089A JP21582089A JPH0379319A JP H0379319 A JPH0379319 A JP H0379319A JP 21582089 A JP21582089 A JP 21582089A JP 21582089 A JP21582089 A JP 21582089A JP H0379319 A JPH0379319 A JP H0379319A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- cull
- recess
- runner
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 title claims abstract description 37
- 229920005989 resin Polymers 0.000 claims abstract description 47
- 239000011347 resin Substances 0.000 claims abstract description 47
- 230000002950 deficient Effects 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000000926 separation method Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は樹脂成形用のモールド用金型に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to a mold for resin molding.
（従来の技術）
従来のモールド用金型の１例について第５図と共に説明
する。第５図にはモールド用金型の一方の型（例；上型
）のパーティング面（底面）を示す。(Prior Art) An example of a conventional molding die will be described with reference to FIG. FIG. 5 shows the parting surface (bottom surface) of one mold (eg, upper mold) of the molding die.
上型のパーティング面１００には溶融樹脂が送りこまれ
るカル凹部１０２が凹設され、カル凹部１０２からは成
形品成形用のキャビティ１０４・・・に向けてランナ凹
部１０６・・・及びゲート凹部１０８・・・が凹設され
ている。従って、カル凹部１０２へ送りこまれた溶融樹
脂はランナ凹部１０６・・・で分岐して各キャピテイ１
０４・・・ヘゲート凹部１０８・・・を介して送り込ま
れる。A cull recess 102 into which molten resin is fed is provided in the parting surface 100 of the upper mold, and from the cull recess 102, a runner recess 106 and a gate recess 108 are directed toward a cavity 104 for molding the molded product. ...is recessed. Therefore, the molten resin sent into the cull recess 102 is branched at the runner recess 106...
04... is fed through the hegate recess 108...
（発明が解決しようとする課題）
しかしながら、上記の従来のモールド用金型には次のよ
うな課題が有る。(Problems to be Solved by the Invention) However, the above conventional molding die has the following problems.
樹脂成形に際しては上型と、下型（第５図に不図示）が
型閉じした際に上型のパーティング面１００と下型のパ
ーティング面は密着することが望ましい。しかしながら
成形作業上の理由等から両パーティング面には５ミクロ
ン−１０ミクロン程度の間隙の発生は避けられない。そ
のため成形後、カル凹部１０２及びランナ凹部１０６・
・・内に成形される成形品には第６図に示すようなパー
ティングフラッシュ（薄バリ）１１Ｏ・・・がカル１１
２及びランナ１１４・・・の縁部に発生してしまう。During resin molding, it is desirable that the parting surface 100 of the upper mold and the parting surface of the lower mold come into close contact when the upper mold and the lower mold (not shown in FIG. 5) are closed. However, for reasons such as molding operations, it is unavoidable that a gap of approximately 5 to 10 microns be generated between both parting surfaces. Therefore, after molding, the cull recess 102 and the runner recess 106
...The molded product molded inside has a parting flash (thin burr) 11O as shown in Fig. 6.
2 and the edges of the runners 114...
薄バリ１１０・・・は厚さがせいぜい１０ミクロンと極
めて薄いため成形後、モールド用金型から成形品を離型
させる際にカル１１２やランナ１１４・・・から折離し
、脱落して下型のパーティング面上に落下してしまう。The thin burrs 110 are extremely thin, at most 10 microns thick, so when the molded product is released from the mold after molding, they break off from the culls 112 and runners 114 and fall off, leaving the lower mold. falling onto the parting surface.
これら落下した薄バリ１１・・・は次回の成形の際にゲ
ート凹部１０８・・・に詰まりを発生させたり、キャビ
ティ１０４・・・内に侵入して不良品成形の原因となっ
たりするという課題が有る。特に成形品がＩＣチ・ンプ
等の半導体装置の場合は結線ワイヤの断線障害の原因と
なる等不測の障害を引き起こすという課題が有る。そこ
で、下型パーティング面（及び上型パーティング面）を
成形作業に先立ってクリーニングするという方式も採ら
れているが、作業効率が低下してしまい、特に自動化さ
れたモールド装置の場合、効率ダウンが顕著であるとい
う課題が有る。These fallen thin burrs 11 may clog the gate recess 108 during the next molding, or may enter the cavity 104 and cause defective product molding. There is. Particularly when the molded product is a semiconductor device such as an IC chip, there is a problem that unexpected failures such as disconnection of connecting wires may occur. Therefore, a method has been adopted in which the lower mold parting surface (and upper mold parting surface) is cleaned before the molding operation, but this reduces work efficiency, especially in the case of automated mold equipment. There is a problem that down is noticeable.
従って、本発明は成形品の離型の際にカルやランナから
脱落する薄パリの発生を抑制し得るモールド用金型を提
供することを目的とする。Therefore, an object of the present invention is to provide a molding die that can suppress the occurrence of thin flakes that fall off from culls and runners when a molded product is released from the mold.
（課題を解決するための手段） 上記課題を解決するため本発明は次の構成を備える。(Means for solving problems) In order to solve the above problems, the present invention has the following configuration.
すなわち、成形用の樹脂を一方又は両方のパーティング
面に凹設された樹脂路を介してキャビティ内に送り込む
モールド用金型において、前記パーティング面には少な
くとも型閉した際に前記樹脂路の縁部に連絡可能に凹設
され、樹脂路からの溶融樹脂が入りにくい深さを有する
縁溝部が設けられていることを特徴とする。That is, in a molding die in which resin for molding is fed into a cavity through a resin path recessed in one or both parting surfaces, at least the resin path is formed on the parting surface when the mold is closed. It is characterized in that an edge groove portion is provided that is recessed so as to be able to communicate with the edge portion and has a depth that prevents molten resin from entering from the resin path.
（作用） 作用について説明する。(effect) The effect will be explained.
縁溝部に入った樹脂は、凝固後離型する際に樹脂路内で
成形された成形部分から脱落しない厚さに一体となって
成形されるので、成形品の離型の際に当該成形部分から
の折離、脱落が抑制可能となる。The resin that has entered the edge groove is integrally molded to a thickness that does not fall off from the molded part formed in the resin path when the mold is released after solidification, so when the molded product is released from the mold, the resin will not fall off the molded part. This makes it possible to suppress breakage and falling off.
（実施例）
以下、本発明の好適な実施例について添付図面と共に詳
述する。(Embodiments) Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
第１図には本実施例のリードフレーム樹脂封止用のモー
ルド用金型の型閉状態の断面図を示す。FIG. 1 shows a cross-sectional view of a molding die for resin-sealing a lead frame according to this embodiment in a closed state.
１０は上型であり、パーティング面１２には樹脂路であ
るカル凹部１４及びランナ凹部１６・・・が凹設されて
いる。そのパーティング面１２について第３図を参照し
て説明する。カル凹部１４には４本のランナ凹部１６・
・・の内側端部が連絡しており、一方ランナ凹部１６・
・・の外側端部はリードフレーム（不図示）の封止部で
ある成形品成形用のキャビティ１８・・・ヘゲート凹部
２０・・・を介して連絡されている。キャビティ１８・
・・及びゲート凹部２０・・・もパーティング面１２に
凹設されている。従って、カル凹部１４→ランナ凹部１
６・・・→ゲート凹部２０・・・→キャビティ１８・・
・が連絡されている。Reference numeral 10 denotes an upper mold, and a parting surface 12 is provided with a cull recess 14 and a runner recess 16, which are resin paths. The parting surface 12 will be explained with reference to FIG. The cull recess 14 has four runner recesses 16.
The inner ends of the runners are in contact with each other, while the runner recesses 16 and
... are connected via a cavity 18 for molding a molded product, which is a sealing part of a lead frame (not shown), and a hegate recess 20. Cavity 18・
. . . and gate recesses 20 . . . are also recessed in the parting surface 12. Therefore, the cull recess 14 → the runner recess 1
6...→Gate recess 20...→Cavity 18...
・ has been contacted.
パーティング面１２上であってカル凹部１４とランナ凹
部１６・・・の縁部にはカル凹部１４及びランナ凹部１
６・・・より浅い縁溝部２２・・・が凹設されている。A cull recess 14 and a runner recess 1 are formed on the parting surface 12 at the edges of the cull recess 14 and the runner recess 16.
6...A shallower edge groove 22... is recessed.
縁溝部２２・・・はカル凹部１４及びランナ凹部１６・
・・と連絡されているためパーティング面１２からカル
凹部１４又はランナ凹部１６・・・の間には縁溝部２２
・・・が段差を形成している。なお、リードフレーム成
形用のためゲート凹部２０・・・には縁溝部が対応して
設けられていない。ランナ凹部１６・・・の幅方向の断
面を第２図に示す。本実施例の場合、ランナ凹部１６の
幅Ａ及びパーティング面１２からの深さＢが、Ａ−２ｍ
ｍＳＢ＝２ｍｍの場合、縁溝部２２・・・の幅Ｃは約１
ｍｍ、パーティング面１２からの深さＤは約０．１＋ｕ
ｅが好適である。この深さＤは、溶融樹脂が入り込みに
くい深さであると共に、樹脂成形により縁溝部２２・・
・内で凝固した樹脂が成形品離型時にカル凹部１４及び
ランナ凹部１６・・・内で成形される成形部分（後述）
と折離、脱落しない程度の強度を有する大きさに設定さ
れている。Ｄの大きさは使用される樹脂の種類、凝固時
間等の成形条件を勘案して決められる。The edge groove 22... is the cull recess 14 and the runner recess 16.
..., so there is an edge groove 22 between the parting surface 12 and the cull recess 14 or the runner recess 16.
... forms a step. Note that the gate recesses 20 are not provided with corresponding edge grooves because they are used for lead frame molding. A cross section in the width direction of the runner recesses 16 is shown in FIG. 2. In the case of this embodiment, the width A of the runner recess 16 and the depth B from the parting surface 12 are A-2 m.
When mSB=2mm, the width C of the edge groove 22 is approximately 1
mm, depth D from parting surface 12 is approximately 0.1+u
e is preferred. This depth D is a depth that makes it difficult for the molten resin to enter, and the edge groove 22 is formed by resin molding.
・Molded parts where the resin solidified inside is molded in the cull recess 14 and runner recess 16 when the molded product is released (described later)
The size is set to have enough strength to prevent it from breaking or falling off. The size of D is determined by taking into consideration molding conditions such as the type of resin used and solidification time.
再び第１図において、２４は下型であり、内部にはシリ
ンダ状のポット２６が嵌着されている。Referring again to FIG. 1, reference numeral 24 denotes a lower mold, into which a cylindrical pot 26 is fitted.
ポット２６の上端面は下型２４のパーティング面２８に
開口している。その開口位置は上型１０のパーティング
面１２に凹設されているカル凹部１４と対応した位置で
ある。ポット２６内にはポット２６の内壁面に摺動して
上下動可能なプランジャ２８が配されている。プランジ
ャ２日の上動によりポット２６内の樹脂がカル凹部１４
内へ圧送されるのである。The upper end surface of the pot 26 is open to the parting surface 28 of the lower die 24. The opening position corresponds to the cull recess 14 formed in the parting surface 12 of the upper die 10. A plunger 28 is disposed within the pot 26 and is movable up and down by sliding on the inner wall surface of the pot 26. Due to the upward movement of the plunger on the second day, the resin in the pot 26 is transferred to the cull recess 14.
It is forced into the interior.
なお、上型１０と下型２４は適宜な公知の接離動機構（
不図示）により互いに相対的接離動が可能で、型閉、型
開が可能になっており、型閉した際にカル凹部１４、ラ
ンナ凹部１６・・・、ゲート凹部２０・・・及びキャビ
ティ１８・・・の下方開放面が閉塞されカル凹部１４→
ランナ凹部１６・・・→ゲート凹部２０・・・→キャビ
ティ１８という樹脂の流路が形成される。Note that the upper die 10 and the lower die 24 are connected to each other using an appropriate known contact/separation mechanism (
(not shown) allows relative movement toward and away from each other, making it possible to close and open the mold, and when the mold is closed, the cull recess 14, runner recess 16..., gate recess 20... and cavity The lower open surface of 18... is closed and the cull recess 14→
A resin flow path called runner recess 16 . . . → gate recess 20 . . . → cavity 18 is formed.
次に、動作について説明する。Next, the operation will be explained.
不図示の接離動機構によってリードフレームがインサー
トされた後上型１０と下型２４が型閉する（第１図の状
態）。After the lead frame is inserted by a contact/separation mechanism (not shown), the upper mold 10 and the lower mold 24 are closed (the state shown in FIG. 1).
ポット２６内の溶融された熱硬化樹脂がプランジャ２８
の上動に伴いカル凹部１４内へ圧送される。そしてカル
凹部１４から各ランナ凹部１６・・・内へ送られ、ゲー
ト凹部２０・・・を介してキャビティ１８・・・内に充
填され、ヒータ（不図示）によって加熱された上型１０
及び下型２４の熱で樹脂は硬化してキャビティ１８・・
・内で凝固し、リードフレームの封止部である成形品の
成形が行なわれる。一方、カル凹部１４、ランナ凹部１
６・・・、ゲート凹部２０・・・内においても樹脂は凝
固してカル、ランナ、ゲート等の成形部分（後述）が形
成される。カル凹部１４及びランナ凹部１６には線溝部
２２・・・が設けられている。従って、カル凹部１４及
びランナ凹部１６・・・に圧送された溶融樹脂は、流動
するうちにプランジャ２８からの圧力で次第に線溝部２
２・・・内へ押される。すると、加熱されている上型１
０と下型２４からの熱が線溝部２２・・・内の樹脂へ伝
えられる。その時、線溝部２２・・・の深さＤはランナ
凹部１６・・・の深さＢより十分性いため線溝部２２・
・・内の樹脂はランナ凹部１６・・・内の樹脂と異なり
直ちに凝固する。従って、パーティングフラッシュの発
生、成長を抑制可能となる。The molten thermosetting resin in the pot 26 is transferred to the plunger 28.
As it moves upward, it is forced into the cull recess 14. The upper mold 10 is then sent from the cull recess 14 into each runner recess 16, filled into the cavity 18 through the gate recess 20, and heated by a heater (not shown).
The resin hardens due to the heat from the lower mold 24, forming the cavity 18...
・It solidifies inside, and the molded product that is the sealing part of the lead frame is formed. On the other hand, the cull recess 14 and the runner recess 1
6..., the resin also solidifies in the gate recess 20..., and molded parts (described later) such as culls, runners, gates, etc. are formed. The cull recess 14 and the runner recess 16 are provided with line grooves 22 . Therefore, while flowing, the molten resin pumped into the cull recess 14 and the runner recess 16 is gradually transferred to the line groove 2 by the pressure from the plunger 28.
2... Pushed inward. Then, the heated upper mold 1
0 and the lower die 24 are transferred to the resin within the wire groove portions 22... At that time, the depth D of the line groove portions 22... is more sufficient than the depth B of the runner recess 16, so the line groove portions 22...
The resin inside the runner recess 16 immediately solidifies unlike the resin inside the runner recess 16. Therefore, the occurrence and growth of parting flash can be suppressed.
樹脂が凝固して形成された成形部分３０（キャビティ１
８・・・で形成された成形品である封止部は省略）の平
面図を第４図に示す。カル３２とランナ３４・・・の縁
部には幅Ｃ（本実施例では約１ ｍｍ）で厚さＤ（本実
施例では約０．１日ｍ）のいわゆる「厚バリ」３６・・
・が形成される。成形終了後、型開きする際に成形部分
３０はイジェクトピン（不図示）で上型１０から突き出
される。その際においても厚バリ３６・・・は十分な強
度を持ってランナ３４・・・と一体になっているためラ
ンナ３４・・・から折離して脱落することはない。従っ
て、次回の成形作業のため下型２４のパーティング面２
８（及び上型ｌＯのパーティング面１２））のクリーニ
ング作業は不要となる。Molded part 30 (cavity 1) formed by solidifying the resin
Fig. 4 shows a plan view of the molded product (sealing part is omitted) formed by 8.... A so-called "thick burr" 36 having a width C (approximately 1 mm in this example) and a thickness D (approximately 0.1 mm in this example) is provided at the edges of the cull 32 and runner 34.
・is formed. After molding is completed, the molded portion 30 is ejected from the upper mold 10 by an eject pin (not shown) when the mold is opened. Even in this case, the thick burrs 36 have sufficient strength and are integrated with the runners 34, so they will not break off and fall off from the runners 34. Therefore, for the next molding operation, the parting surface 2 of the lower mold 24 is
8 (and the parting surface 12 of the upper mold lO)) is no longer necessary.
本実施例の場合、リードフレームの樹脂封止用のモール
ド用金型なので、特にパーティングフラッシュが脱落し
て発生する結線ワイヤの変形や断線の発生を抑制するこ
とができる。In the case of this embodiment, since the mold is for resin-sealing a lead frame, it is possible to particularly suppress deformation and disconnection of the connecting wires caused by falling off of the parting flash.
上述の実施例では樹脂路であるカル凹部、ランナ凹部、
及びキャビティ等を上型のパーティング面に凹設したモ
ールド用金型を挙げたが、上記のカル凹部等の凹設部分
が上型と下型とに跨って設けられ、型閉じした際に樹脂
の流路が初めて形成されるようなモールド用金型に線溝
部を設けてもよい。In the above embodiment, the cull recess, the runner recess, which is the resin path,
A molding die in which a cavity etc. is recessed in the parting surface of the upper mold has been mentioned, but the recessed part such as the above-mentioned cull recess is provided across the upper mold and the lower mold, and when the mold is closed, A line groove portion may be provided in a molding die in which a resin flow path is formed for the first time.
また、第７図に示すように樹脂路５０と線溝部５２・・
・を互いに別のパーティング面５４．５６に凹設し、型
閉じした際に初めて両者が連絡するようにしてもよい。Further, as shown in FIG. 7, the resin path 50 and the line groove portion 52...
* may be recessed in separate parting surfaces 54 and 56, and the two may communicate only when the mold is closed.
以上、本発明の好適な実施例について種々述べて来た、
本発明は上述の実施例に限定されるのではな（、例えば
リードフレームの樹脂封止以外の成形用金型にも使える
のはもちろん、成形品によってはゲート凹部にも線溝部
を対応して設けてもよいし、使用する樹脂は熱硬化性樹
脂に限らず熱可塑性樹脂でもよい等、発明の精神を逸脱
しない範囲でさらに多くの改変を施し得る。Various preferred embodiments of the present invention have been described above.
The present invention is not limited to the above-mentioned embodiments (for example, it can be used in molds for molding other than resin sealing of lead frames, and depending on the molded product, the line groove portion can also be used in the gate recess). Further modifications can be made without departing from the spirit of the invention, such as the resin used is not limited to a thermosetting resin but may also be a thermoplastic resin.
（発明の効果）
本発明に係るモールド用金型を用いると、成形部分に形
成される厚パリは離型の際にも成形部分からの折離、脱
落が抑制されるので、パーティング面のクリーニング作
業の回数の軽減を図ることができ、作業効率をアップす
ることができる。自動化されたモールド装置の場合には
特に有効である。また、パリ（フラッシュ）の脱落が抑
制されるのでパリの脱落に起因するゲート凹部の詰まり
やそれに起因する不良品の成形が抑制される等の著効を
奏する。(Effects of the Invention) When the molding die according to the present invention is used, the thick pad formed on the molded part is prevented from breaking or falling off from the molded part even during mold release, so that the parting surface is It is possible to reduce the number of cleaning operations and improve work efficiency. This is particularly effective in the case of automated molding equipment. In addition, since the falling off of flash is suppressed, there are significant effects such as the clogging of the gate recess caused by falling off of flash and the molding of defective products caused by this.
第１図は本発明に係るモールド用金型の実施例を示した
部分断面図、第２図はそのランナ凹部の幅方向断面図、
第３図はその上型のパーティング面を示した部分底面図
、第４図は樹脂路で形成された成形部分の平面図、第５
図は従来のモールド用金型のパーティング面を示した図
、第６図はそのモールド用金型の樹脂路で形成された成
形部分の平面図、第７図は他の実施例を示した樹脂路の
幅方向断面図。
１０・・・上型、 １２・・・上型パーティング面、
１４・・・カル凹部、 １６・・・ランナ凹部、
１８・・・キャビティ、 ２２・・・縁溝部、 ３
０・・・成形部分。FIG. 1 is a partial cross-sectional view showing an embodiment of the molding die according to the present invention, FIG. 2 is a cross-sectional view in the width direction of the runner recess,
Fig. 3 is a partial bottom view showing the parting surface of the upper mold, Fig. 4 is a plan view of the molded part formed by the resin path, and Fig. 5 is a partial bottom view showing the parting surface of the upper mold.
The figure shows the parting surface of a conventional molding die, FIG. 6 is a plan view of the molded part formed by the resin path of the molding die, and FIG. 7 shows another embodiment. FIG. 3 is a cross-sectional view in the width direction of a resin path. 10... Upper die, 12... Upper die parting surface,
14... Cull recess, 16... Runner recess,
18... Cavity, 22... Edge groove, 3
0...molding part.
Claims (1)
設された樹脂路を介してキャビティ内に送り込むモール
ド用金型において、 前記パーティング面には少なくとも型閉した際に前記樹
脂路の縁部に連絡可能に凹設され、樹脂路からの溶融樹
脂が入りにくい深さを有する縁溝部が設けられているこ
とを特徴とするモールド用金型。[Claims] 1. A molding die in which resin for molding is fed into a cavity through a resin path recessed in one or both of the parting surfaces, the parting surface having at least a mold closed surface. A molding die characterized in that an edge groove portion is provided which is recessed so as to be able to communicate with the edge of the resin path and has a depth that prevents molten resin from entering from the resin path.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21582089A JP2597010B2 (en) | 1989-08-22 | 1989-08-22 | Mold for mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21582089A JP2597010B2 (en) | 1989-08-22 | 1989-08-22 | Mold for mold |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0379319A true JPH0379319A (en) | 1991-04-04 |
| JP2597010B2 JP2597010B2 (en) | 1997-04-02 |
Family
ID=16678802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21582089A Expired - Fee Related JP2597010B2 (en) | 1989-08-22 | 1989-08-22 | Mold for mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2597010B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010280110A (en) * | 2009-06-04 | 2010-12-16 | Apic Yamada Corp | Molding mold and moldind device having the same |
| CN103831946A (en) * | 2012-11-27 | 2014-06-04 | 深圳市兆威机电有限公司 | Runner structure capable of preventing breakage |
| CN106827421A (en) * | 2017-03-20 | 2017-06-13 | 温州市文泰笔业有限公司 | Injection moulding apparatus are additional except useless mechanism |
-
1989
- 1989-08-22 JP JP21582089A patent/JP2597010B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010280110A (en) * | 2009-06-04 | 2010-12-16 | Apic Yamada Corp | Molding mold and moldind device having the same |
| CN103831946A (en) * | 2012-11-27 | 2014-06-04 | 深圳市兆威机电有限公司 | Runner structure capable of preventing breakage |
| CN106827421A (en) * | 2017-03-20 | 2017-06-13 | 温州市文泰笔业有限公司 | Injection moulding apparatus are additional except useless mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2597010B2 (en) | 1997-04-02 |
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