JP5218573B2 - Resin molding equipment - Google Patents

Description

  The present invention relates to a resin molding apparatus for sealing an electronic component such as a semiconductor element mounted on a substrate with a resin material.

2. Description of the Related Art Conventionally, a resin molding apparatus having a configuration in which a first mold, a second mold, and a third mold are juxtaposed in a separable manner is known (for example, see Patent Document 1).
In this resin molding apparatus, a substrate on which electronic components are mounted is sandwiched between the second mold and the third mold. At least one of the second mold and the third mold is formed with a molding recess located around the electronic component, and the substrate forms a cavity. The cavity is filled with resin from a runner groove formed between the first mold and the second mold through a vertical runner formed on the second mold, and thereby the electronic component is resin-sealed. . Then, the second mold and the third mold are separated from each other and the molded product is taken out by the ejector pin, while the first mold and the second mold are separated from each other and the unnecessary resin is taken out by the ejector pin.

  However, the conventional resin molding apparatus is configured on the assumption that when the second mold and the third mold are separated from each other, the molded product always remains on the third mold side. For this reason, when a resin with high adhesion is used or when the surface area of the molded part is large, when the mold is opened, the molded product remains on the second mold side instead of the third mold side. , May not be properly removed. In this case, providing the ejector pin to ensure that the molded product remains on the third mold side requires a separate power source for driving the ejector pin, making the structure complicated and expensive. End up.

Japanese Patent No. 4043486

  The present invention provides a resin molding apparatus capable of reliably leaving a molded product in a desired mold and taking it out with a simple and inexpensive configuration regardless of the type of resin used and the shape of the molded part. This is the issue.

As a means for solving the above problems, the present invention provides:
The first mold, the second mold, and the third mold are arranged side by side so as to be able to contact and separate, and the substrate is sandwiched between the second mold and the third mold, and at least formed in the second mold Electrons mounted on the substrate by filling the resin formed in the cavity formed by the recess and the substrate through the runner groove formed in the first mold and the vertical runner hole formed in the second mold. A resin molding device that seals parts with resin,
The first mold includes a movable first mold ejector plate,
The second mold is
A second mold ejector plate for holding a product ejector pin that is linked to the first mold ejector plate and projects the resin solidified in the molding recess;
Energizing the ejector plate for the second mold and separating the product ejector pin from the resin solidified in the recess for molding in a state where the second mold is opened to a predetermined dimension with respect to the first mold. The second mold elastic member.

  With this configuration, when the molded product is released after resin sealing, the second mold is opened by a predetermined dimension with respect to the first mold, and the second mold is pressed by the urging force of the second mold elastic member. The product ejector plate can be actuated and the product ejector pin can be separated from the resin solidified in the molding recess. The power in this case is the urging force of the second mold elastic member, and no separate drive mechanism is required. Then, the second mold is further opened with respect to the first mold, the first mold ejector plate is operated, and the second mold ejector plate is interlocked to thereby form the product via the product ejector pin. The molded product can be released from the recess.

The second mold includes a first plate that comes into contact with the first mold, a second plate that comes into contact with the third mold and has the molding recess, the first plate, and the second plate. A space block provided between the plates and forming a space in which the ejector plate for the second mold can move, and
The second mold ejector plate is held at the second mold ejector plate and abuts against the first mold so that the second mold ejector plate is positioned at an intermediate position in the second mold. It is preferable to provide a second ejector rod for a middle mold whose end surface is flush with the bottom surface of the molding recess.

  With this configuration, when the mold is closed, the second mold first ejector rod positions the second mold ejector plate at an intermediate position, and the bottom surface of the molding recess and the front end surface of the product ejector pin are flush with each other. It can be. Then, the product ejector pin can be separated from the resin solidified in the molding recess by the urging force of the second mold elastic member simply by opening the second mold to a predetermined dimension with respect to the first mold.

The first mold includes a first ejector plate for a first mold and a first elastic member for the first mold, which are arranged to be movable up and down,
The first ejector plate for the first mold holds the first ejector rod for the first mold that can press the first ejector rod for the second mold,
The first elastic member for the first mold, the first mold for the first ejector rod and biases the first ejector plate for the first mold, capable of pressing the second first ejector rod for mold Is preferable.

  With this configuration, when the mold is opened, the second ejector rod for the second mold, that is, the second ejector rod via the first ejector rod for the first mold, by the urging force of the first elastic member for the first mold. The first ejector plate for the mold moves. As a result, the product ejector pin protrudes the resin solidified in the molding recess.

The second mold has a second mold return pin that is inserted through the first mold side and the third mold side and can protrude to the third mold side,
The first ejector plate for the first mold holds a return pin for the first mold that can press the return pin for the second mold,
Said first mold, said the second die and Rukoto closing the third mold, the with second mold for the return pin abuts on the third mold, the first mold for the return pins Abuts against the return pin for the second mold and moves the first ejector plate for the first mold against the urging force of the first elastic member for the first mold, The first ejector rod for use is preferably retracted from the first mold by a predetermined amount.

The first mold further includes a second ejector plate for the first mold, and a second elastic member for the first mold,
The second ejector plate for the first mold holds a runner ejector pin capable of projecting the resin solidified in the runner groove;
The second mold second elastic member biases the first mold second ejector plate when the first mold first ejector rod presses the second mold first ejector rod. Thus, it is preferable that the runner ejector pin does not protrude into the runner groove.

  According to the present invention, since the ejector plate for the second mold is biased by the elastic member for the second mold, the product ejector pin is separated from the resin solidified by the molding recess, so that it is simple and inexpensive. In spite of having a simple structure, the molded product can be reliably taken out.

It is a schematic front view of the resin molding apparatus which concerns on this embodiment. FIG. 2 is a partial cross-sectional view showing a state where the upper mold, the middle mold, and the lower mold shown in FIG. 1 are completely opened and the substrate is set. It is a fragmentary sectional view which shows the closed state of the upper metal mold | die shown in FIG. 1, a middle metal mold | die, and a lower metal mold | die. FIG. 4 is a partial cross-sectional view showing a state where the lower mold and the middle mold are opened downward by a predetermined dimension M from FIG. 3. FIG. 5 is a partial cross-sectional view showing a state in which only the lower mold is further opened downward by a predetermined dimension from FIG. 4. FIG. 6 is a partial cross-sectional view illustrating a state before the upper mold, the middle mold, and the lower mold are completely opened from FIG. 5 and an unnecessary resin and a molded product are taken out. It is the sectional view on the AA line of FIG. It is a block diagram of the resin molding apparatus which concerns on this embodiment. It is a flowchart which shows operation | movement of the resin molding apparatus which concerns on this embodiment.

  Embodiments according to the present invention will be described below with reference to the accompanying drawings. In the following description, terms indicating specific directions and positions (for example, terms including “up”, “down”, “side”, “end”) are used as necessary. Is for facilitating understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meaning of these terms. Further, the following description is merely illustrative in nature, and is not intended to limit the present invention, its application, or its use.

(1. Overall configuration)
FIG. 1 shows a resin molding apparatus according to this embodiment. In this resin molding apparatus, four support columns 1 extend upward from a base (not shown), an upper platen 2 is fixed to the upper end portion thereof, and the lower plate can be moved up and down along the support columns 1. The lower platen 3 is disposed on the bottom. An upper mold 4 is fixed to the lower surface of the upper platen 2, and a middle mold 5 is provided below the upper platen 2 so as to be movable up and down. Further, a lower mold 6 is fixed on the upper surface of the lower platen 3 and faces the middle mold 5 so as to be able to contact and separate.

  On the upper surface of the upper platen 2, an elevating device 7 for elevating the middle mold 5 is disposed. Although details of the elevating device 7 are not shown, the upper end portions of the support pins 10 are fixed to the four corners of the elevating plate 9 protruding from the cover 8, and the middle mold 5 is fixed to the lower end portions of the support pins 10. Yes. In the cover 8, for example, a mechanism for moving the lifting plate 9 up and down via a ball screw and a nut by driving a servo motor is housed. Further, an ejector shaft 33, which will be described later, is connected to the elevating plate 9, and when the middle mold 5 is lowered to the lower end, it comes into contact with a second ejector plate 14 for the upper mold, which will be described later, and this upper mold The mold second ejector plate 14 is lowered by a predetermined dimension.

(1-1. Upper mold 4)
As shown in FIG. 2, the upper mold 4 includes an upper mold space block 11, a runner block 12, an upper mold first ejector plate 13, and an upper mold second ejector plate 14. Yes.

  The upper die space block 11 has a rectangular parallelepiped shape, and is fixed to the lower surface of the upper platen 2 at four locations so as to form a rectangular frame shape in plan view.

  The runner block 12 is made of a metal plate material having a rectangular shape in plan view that is fixed to the lower end surface of the upper die space block 11. On the lower surface of the runner block 12, concave portions 15 having a circular shape in plan view are formed at four locations facing the pot portion 55 on the center line (Y axis). From each recess 15, two runner grooves 16 extend on the same straight line toward vertical runner holes 41 a described later on both sides (X-axis direction). In the middle of each runner groove 16, lock pin holes 17 are formed at two locations, and ejector pin holes 18 are formed at the other two locations (the concave portion 15 side and the end portion side with both lock pin holes 17 interposed), respectively. Is formed. Runner lock pins 19 are respectively disposed in the lock pin holes 17 to hold the resin solidified in the runner grooves 16 on the upper mold side. A runner ejector pin 32 supported by an upper mold second ejector plate 14 described later is slidably inserted into the ejector pin hole 18, and the solidified resin is protruded in the runner groove 16.

  Both the upper die first ejector plate 13 and the upper die second ejector plate 14 have a configuration in which two metal plate members having a rectangular shape in plan view are overlapped and integrated. These plates 13 and 14 are disposed so as to be movable up and down in a space formed between the upper platen 2 and the runner block 12 by the upper die space block 11.

The upper die first ejector plate 13 holds an upper die return pin 20, an upper die first ejector rod 21, and an upper die second ejector rod 22.
The upper mold return pins 20 are arranged at two positions on both ends (in the Y-axis direction), respectively, so that a middle mold return pin 44 described later can be pushed in. The length of the upper mold return pin 20 is such that the upper mold 4, the middle mold 5 and the lower mold 6 are clamped, and the lower end surface of the upper mold return pin 20 is the middle mold return pin. The lower end surfaces of the upper mold first ejector rod 21 and the upper mold second ejector rod 22 are set so as to be positioned above the lower surface of the runner block 12 by a predetermined dimension M. Yes.

  The upper die first ejector rod 21 is disposed at two positions (in the Y-axis direction) inside the upper die return pin 20 so that the middle die first ejector rod 47 described later can be pushed in. It has become. The upper die second ejector rods 22 are disposed at two locations (in the X-axis direction) inside the upper die first ejector rod 21 and at four locations on the center line (X-ray), respectively. The mold second ejector rod 48 can be pushed in. The lengths of the upper die first ejector rod 21 and the upper die second ejector rod 22 are shorter than the upper die return pin 20 by a predetermined dimension M.

  Stepped holes 23 are formed in four locations on the center line (Y-axis) in the upper plate material constituting the first ejector plate 13 for the upper mold, and these stepped holes are formed in the lower plate material. A through hole 24 communicating with the small diameter portion 23 is formed. One end of the upper mold first spring 25 can be guided by the stepped hole 23. The upper mold first ejector plate 13 is formed with relief holes 26 on both sides (X-axis direction) with respect to the four stepped holes 23, and the upper mold second spring 27 is formed there. Are arranged respectively. Further, through holes 28 through which the runner ejector pins 32 are inserted are formed on both sides (X-axis direction) of each stepped hole 23 in the first ejector plate 13 for the upper mold.

  The upper mold second ejector plate 14 is formed with relief holes 29 at positions corresponding to the stepped holes 23. In each escape hole 29, a stopper member 30 and an upper mold first spring 25 are arranged. The stopper member 30 is configured to have a collar portion at the upper end of the shaft portion, and a collar 31 is externally mounted on the shaft portion, and the tip portion is screwed to the runner block 12. The upper mold first spring 25 is disposed on the outer periphery of the collar 31. Thereby, the collar 31 is clamped between the buttocks and the runner block 12. The upper mold second ejector plate 14 holds runner ejector pins 32. The upper mold second ejector plate 14 can be pushed down by an ejector shaft 33 provided on the elevating plate 9. Further, the upper die second ejector plate 14 is urged upward by the upper die second spring 27 and is brought into contact with a stopper pin (not shown) to restrict the rising end.

(1-2. Middle mold 5)
The middle mold 5 includes an upper plate 34, a middle mold space block 35, a cavity plate 36, and a middle mold ejector plate 37.
The upper plate 34 is made of a metal plate having a rectangular shape in plan view, and four rectangular parallelepiped space blocks 35 are fixed to the lower surface thereof so as to form a rectangular frame shape. A cavity plate 36 having the same shape as the upper plate 34 is fixed to the lower surface of each middle mold space block 35. These integrated members are fixed at the lower corners of the support pins 10 extending from the upper platen 2 at the four corners, and can be moved up and down together with the support pins 10.

  The cavity plate 36 is made of a metal plate having a rectangular shape in plan view, and is fixed to the lower end surface of the middle mold space block 35. On the lower surface of the cavity plate 36, molding recesses 38 that form cavities with the substrate 56 are formed at eight positions corresponding to the tip portions of the runner grooves 16.

  An opening 39 having a rectangular shape in plan view is formed in the central portion of the upper plate 34, the middle mold space block 35, the cavity plate 36, and the middle mold ejector plate 37. A protrusion 51 of the lower mold 6 to be described later enters the opening 39, and the molten resin in the pot 55 can be supplied to the runner groove 16.

  The upper plate 34, the middle mold ejector plate 37, and the cavity plate 36 are formed with a communication portion 40 that communicates with the molding recess 38, and a vertical runner member 41 is disposed there. The vertical runner member 41 is formed with a conical vertical runner hole 41a whose cross-sectional area gradually decreases downward, and a lower end opening serves as a pinpoint gate 41b that opens into the molding recess 38. Here, by using the vertical runner member 41 as a separate member from the cavity plate or the like, it is possible to configure it with an expensive material having excellent heat resistance. Moreover, when it deteriorates by use, since only the vertical runner member 41 can be replaced, it is economical.

  The cavity plate 36 is formed with eight sets of four through holes 36 a located at the four corners of each vertical runner member 41. And the product ejector pin 42 hold | maintained at the ejector plate 37 for middle molds can project in the recessed part 38 for shaping | molding through these through-holes 36a. Further, the middle mold return pin 44 described later is inserted into the cavity plate 36, the middle mold space block 35, and the upper plate 34 at positions corresponding to the upper mold return pins 20 at both ends in the Y-axis direction. Each through hole 36b is formed.

  In the upper plate 34, stepped holes 43 each having a small diameter portion and a large diameter portion are formed at positions opposed to the upper mold return pins 20 protruding from the runner block 12. In each stepped hole 43, a return pin 44 for the middle mold is arranged. The space block 35 for the middle mold is formed with a stepped hole 35a having a large diameter portion having the same inner diameter as the large diameter portion of the stepped hole 43, and the spring accommodating portion 45 is constituted by both large diameter portions. ing. The small diameter portion of the stepped hole 35 a communicates with a through hole 36 b formed in the cavity plate 36. The middle mold return pin 44 includes a pressure receiving portion 44a at the upper end portion, a flange portion 44b formed at the lower end thereof, and a shaft portion 44c extending downward from the center of the bottom surface. The pressure receiving portion 44 a is slidably disposed in the small diameter portion of the stepped hole 43. The flange portion 44b is disposed so as to be movable up and down in the spring accommodating portion 45 in a state in which one end side of the middle mold first spring 46 that is externally mounted on the shaft portion is in pressure contact. In this state, the upper end surface of the press receiving portion 44 a is flush with the upper surface of the upper plate 34. The shaft portion 44 c is slidably disposed in a through hole 36 b formed in the middle mold space block 35 and the cavity plate 36. The length of the middle mold return pin 44 is the same as the thickness of the middle mold 5.

  Further, the upper plate 34 is formed with through holes 34 a at positions facing the first upper die ejector rods 21 protruding from the runner block 12, and held in the middle die ejector plate 37. The first ejector rods 47 for the middle mold are slidably disposed. The middle mold first ejector rod 47 is provided with a flange 47b at an intermediate portion of the shaft portion 47a, and the flange 47b is held between two metal plate members constituting the middle mold ejector plate 37. This makes it possible to move up and down integrally. The length of the first ejector rod 47 for the middle mold is the same as the thickness of the entire middle mold, like the return pin 44 for the middle mold. When the upper end surface of the first ejector rod 47 for the middle mold is flush with the upper surface of the upper plate 34, the ejector plate 37 for the middle mold is separated from the upper plate 34 by the predetermined dimension M by the flange 47b. It is designed to be positioned. Further, the upper end surface of the first ejector rod 47 for the middle mold has a larger area than the lower end surface of the first ejector rod 21 for the upper mold that can press the middle ejector rod 47, and is formed on the lower surface of the runner block 12 of the upper mold 4. Contact is possible.

  Further, a through hole 34b is formed in the upper plate 34 at a position facing each of the upper die second ejector rods 22 protruding from the runner block 12, and held in the middle die ejector plate 37 therein. The second ejector rods 48 for the middle mold are slidably disposed. The middle mold second ejector rod 48 is provided with a flange 48 a at the lower end and is held by the middle mold ejector plate 37. The upper end surface of the middle mold second ejector rod 48 has a larger area than the lower end surface of the upper mold second ejector rod 22 capable of pressing the middle mold second ejector rod 48 and is in contact with the lower surface of the runner block 12 of the upper mold 4. It is possible.

  The middle mold ejector plate 37 is formed by stacking and integrating two metal plates having a rectangular shape in plan view, and is formed between the upper plate 34 and the cavity plate 36 by the space block 35 for the middle mold. It is arranged in the space to be moved up and down along the vertical runner member 41. Further, the middle mold ejector plate 37 is urged upward by the second middle mold mold spring 49 disposed in the concave portion of the cavity plate 36, and is located at a raised position where it abuts against the lower surface of the upper plate 34. Then, the first die rod for middle mold 47 and the second ejector rod for middle mold 48 are pushed down by the first ejector rod 21 for upper mold and the second ejector rod 22 for upper mold, respectively. It is located in the lowered position. In the raised position, the tip of the product ejector pin 42 is inserted into the through hole 36a from the molding recess 38, and in the lowered position, the tip of the product ejector pin 42 protrudes into the molding recess 38 and is molded from the molding recess 38. Extrude

(1-3. Lower mold 6)
The lower mold 6 is fixed to the lower platen 3 via a lower mold space block 50. The lower platen 3 can be moved up and down along the support column 1 by a driving device 59 (see FIG. 8, the structure is not shown). The lower mold 6 is formed with a protrusion 51 having a rectangular shape in plan view along the center line (Y axis). In the protrusion 51, through holes 51a are formed at positions corresponding to the respective recesses 15 formed at four locations on the center line of the runner block 12. In each through hole 51a, a plunger tip 54 that can be raised and lowered while sliding through the plunger 53 by raising and lowering the isobaric cylinder 52 by an isobaric cylinder elevating device 60 (see FIG. 8; structure is not shown). Is arranged. A recess formed by the plunger tip 54 in the through hole 51 a is a pot portion 55. The pot portion 55 is supplied with a solid resin material, pressurized by raising the plunger tip 54, and heated by a heated mold. Further, on the upper surface of the lower mold 6, guide concave portions 57 for installing the substrate 56 are formed in regions facing the respective molding concave portions 38 of the cavity plate 36.

  A control device 58 for controlling the isobaric cylinder lifting device 60, the lifting device 7, the driving device 59, and the like is provided, and performs a molding operation described below.

(2. Operation)
Next, the operation of the resin molding apparatus having the above configuration will be described.
First, the elevating device 7 and the drive device 59 are driven and controlled, and the middle mold 5 and the lower mold 6 are lowered with respect to the upper mold 4 to open the molds (step S1). Then, by a loader unit (not shown), as shown in FIG. 2, a substrate 56 on which an electronic component chip (not shown) is mounted is automatically installed in the guide recess 57 of the lower mold 6 (step S2). Resin material is automatically supplied (step S3).

  Subsequently, the middle mold 5 is raised (step S4), and the upper surface of the upper plate 34 of the middle mold 5 is brought into contact with the lower surface of the runner block 12 of the upper mold 4. Further, the lower platen 3 is raised (step S5), and the upper surface of the lower mold 6 is brought into contact with the lower surface of the cavity plate 36 of the middle mold 5. Accordingly, the substrate 56 installed in the guide recess 57 of the lower mold 6 is sandwiched between the middle mold 5. At this time, the protrusion 51 of the lower mold 6 enters the opening 39 of the middle mold 5. Therefore, as shown in FIG. 3, mold clamping is performed (step S6).

  Accordingly, a cavity is formed by the upper surface of the substrate 56 and the molding recess 38 of the cavity plate 36, and the pot portion 55 communicates with the cavity through the runner groove 16 and the vertical runner hole 41a. Therefore, by raising the isobaric cylinder 52, the plunger tip 54 is raised through the plunger 53 (step S7), and the resin material supplied to the pot portion 55 is pressurized. At this time, the plunger tip 54 is positioned so that the upper end surface thereof is slightly below the upper surface of the protrusion 51.

  Since the mold is already heated, the resin material is melted and pushed out of the pot 55 in a state where the pressure is applied by the plunger tip 54. Then, the resin material pushed out from the pot portion 55 flows through the vertical runner hole 41a from the runner groove 16, and then is filled into the cavity via the pinpoint gate 41b. Thereafter, the molten resin is further heated and cured, and the electronic component chip mounted on the substrate 56 is resin-sealed.

By the way, in the mold clamping state, the positional relationship of pins, rods and the like is as follows in each mold.
That is, in the upper mold 4, the lower end surface of the upper mold return pin 20 is in contact with the upper end surface of the middle mold return pin 44 exposed flush with the upper surface of the upper plate 34 of the middle mold 5. Yes. For this reason, the upper mold first ejector plate 13 and the upper mold second ejector plate 14 are positioned at the raised position, and the upper mold first ejector rod 21 and the upper mold second ejector rod 22 are The lower end surface is positioned so as to be above the lower surface of the runner block 12 by a predetermined dimension M.
The upper mold second ejector plate 14 is positioned at the raised position by being urged by the upper mold second spring 27 when the ejector shaft 33 contacting the upper surface of the upper mold plate rises. At this time, the lower end surface of the runner ejector pin 32 is positioned so as to be flush with the bottom surface of the runner groove 16.

  Further, in the middle mold 5, the middle mold first ejector rod 47 is sandwiched between the lower surface of the runner block 12 of the upper mold 4 and the upper surface of the lower mold 6. Further, the upper end surface of the second ejector rod 48 for the middle mold comes into contact with the upper end surface of the runner block 12. As a result, the middle mold ejector plate 37 is lowered by a predetermined dimension M and positioned at an intermediate position, and the lower end surface of the product ejector pin 42 is flush with the bottom surface of the molding recess 38.

  Further, in the lower mold 6, the plunger tip 54 is positioned at a position slightly lowered from the upper surface of the protrusion 51, and the resin material is solidified in a state of protruding downward from the runner groove 16.

When the resin sealing of the electronic component chip on the substrate 56 is completed, the middle mold 5 and the lower mold 6 are lowered by a predetermined dimension M as shown in FIG. 4 (step S8).
Thereby, in the upper mold 4, the upper mold first ejector plate 13 is pushed down by the urging force of the upper mold first spring 25. On the other hand, the upper die second ejector plate 14 remains positioned at the upper end position by the urging force of the upper die second spring 27. Therefore, the upper mold first ejector plate 13 moves away from the upper mold second ejector plate 14 and moves downward by a predetermined dimension M. Further, the lower end surfaces of the upper die first ejector rod 21 and the upper die second ejector rod 22 are flush with the lower surface of the runner block 12.

  In the middle mold 5, the middle mold ejector plate 37 is lowered by a predetermined dimension M with respect to the upper plate 34 against the urging force of the middle mold second spring 49. Here, when the middle mold 5 is lowered by the predetermined dimension M, the upper end surfaces of the first ejector rod 47 for the middle mold and the second ejector rod 48 for the middle mold abut against the lower surface of the runner block 12, and the predetermined dimension is reached. Move down M. As a result, the middle mold ejector plate 37 is raised by a predetermined dimension M with respect to the middle mold 5 by the biasing force of the middle mold second spring 49. As a result, the product ejector pin 42 separates its lower end surface from the bottom surface of the molding recess 38, that is, the surface of the molded product. In other words, the product ejector pin 42 can be separated from the molded product by using only the urging force of the second middle mold die spring 49.

  In the middle mold 5, the resin solidified in the vertical runner portion and the resin on the molded product side are connected only by the pinpoint gate 41 b. A gap (with a predetermined dimension M) is formed between the lower mold 5 and the upper mold 4 due to the lowering of the middle mold 5 described above, but the resin solidified in the runner grooves 16 is held by the runner lock pins 19. ing. At this time, the plunger tip 54 is raised until the upper end surface thereof is flush with the upper surface of the protrusion 51 of the lower mold 6. Therefore, the resin solidified in the runner groove 16 and the vertical runner portion remains on the runner block 12 side of the upper mold 4 and is cut by the pinpoint gate 41b.

Subsequently, as shown in FIG. 5, only the lower mold 6 is further lowered (step S9).
As a result, a gap is formed between the upper surface of the lower mold 6 and the lower surface of the middle mold 5 (cavity plate 36), and the middle mold return pin 44 and the middle mold first ejector rod 47 have lower end surfaces. Lose support.

  The upper die return pin 20 and the upper die first ejector rod 21 are held by the upper die first ejector plate 13 biased by the upper die first spring 25. Therefore, the middle mold return pin 44 is pushed down by the upper mold return pin 20, and the first middle mold ejector rod 47 is pushed down by the first upper mold die ejector rod 21. Maintain the contact state.

  Further, the second ejector rod 48 for the middle mold is pushed down by the second ejector rod 22 for the upper mold. As a result, the urging force of the upper mold first spring 25 continues to act on the middle mold ejector plate 37, and the product ejector pin 42 is lowered together with the middle mold ejector plate 37.

  When the middle mold ejector plate 37 contacts the cavity plate 36, the solidified resin is projected from the molding recess 38 by the product ejector pin 42.

  Thus, the urging force of the upper mold first spring 25 always acts on the molded product through the product ejector pin 42 while the lower mold 6 is lowered. Therefore, the solidified sealing resin portion can be separated from the molding recess 38 while the molded product remains in the guide recess 57 of the lower mold 6.

  Thereafter, as shown in FIG. 6, the middle mold 5 and the lower mold 6 are further lowered (step S10). Thereby, the molded product separated from the molding recess 38 by the product ejector pin 42 remains in the guide recess 57 of the lower mold 6. Further, when the middle mold 5 is separated from the upper mold 4, unnecessary resin solidified in the runner grooves 16 and the vertical runner holes is held by the runner lock pins 19 and remains on the upper mold 4 side.

  Then, the molded product of the lower mold 6 is carried out by driving a molded product conveying device (not shown) (step S11). In addition, an unnecessary resin transfer device (not shown) is driven, and the upper die second ejector plate 14 is lowered via the ejector shaft 33 so that the runner ejector pins 32 protrude into the runner grooves 16. Thereby, since the unnecessary resin is released from the holding state by the runner lock pin 19, it is carried out by the unnecessary resin transfer device (step S12).

  When the unloading of the molded product and the unnecessary resin is completed, the upper mold 4 (the lower surface of the runner block 12) and the upper and lower surfaces of the middle mold 5 (the upper surface of the upper plate 34 and the lower surface of the cavity plate 36) by a mold cleaner (not shown). Then, after the upper surface of the lower mold 6 is cleaned (step S13), the above process is repeated.

  Thus, according to the above-described embodiment, a mechanism other than a mechanism for raising and lowering the middle mold 5 and the lower mold 6 and a mechanism for lowering the upper ejector first ejector plate 13 to open and close the mold. Does not require a special mechanism. In addition, when the mold is opened and closed, the product ejector pin 42 is automatically separated from the molded product or unnecessary resin is separated from the middle mold 5 and the upper mold 6 by a simple and inexpensive configuration such as a spring. You can make it.

(3. Other embodiments)
In addition, this invention is not limited to the structure described in the said embodiment, A various change is possible.

For example, in the above-described embodiment, the mold is configured by the upper mold 4, the middle mold 5, and the lower mold 6 that are arranged in the vertical direction. However, a configuration in which the mold is arranged in the horizontal direction is also possible.
Further, the pot for pressurizing and heating the solid resin to melt is not necessarily formed on the lower side of the apparatus, that is, on the lower mold 6, but may be formed on the upper mold 4.
Various drive devices such as a servo motor, an air cylinder, and a hydraulic cylinder can be used as a drive source for the lower mold 6 and the middle mold 5. It is also possible to use a link mechanism for transmitting power from the drive device.
The target of resin sealing is not limited to the substrate, but may be another base material such as a lead frame. The resin sealing is not limited to one side of the base material, and may be both sides.

DESCRIPTION OF SYMBOLS 1 ... Column 2 ... Upper platen 3 ... Lower platen 4 ... Upper metal mold 5 ... Middle metal mold 6 ... Lower metal mold 7 ... Elevating device 8 ... Cover 9 ... Elevating plate 10 ... Support pin 11 ... Space block for upper metal mold 12 ... runner block 13 ... first ejector plate for upper mold 14 ... second ejector plate for upper mold 15 ... recess 16 ... runner groove 17 ... lock pin hole 18 ... ejector pin hole 19 ... runner lock pin 20 ... upper mold Return pin 21 ... first ejector rod for upper mold 22 ... second ejector rod for upper mold 23 ... stepped hole 24 ... small diameter hole 25 ... first spring for upper mold 26 ... relief hole 27 ... upper mold Second spring 28 ... through hole 29 ... relief hole 30 ... stopper member 31 ... collar 32 ... runner ejector pin 33 ... ejector shaft 34 ... upper 35 ... Space block for middle mold 35a ... Stepped hole 36 ... Cavity plate 36a, 36b ... Through hole 37 ... Ejector plate for middle mold 38 ... Recess for molding 39 ... Opening 40 ... Communication part 41 ... Vertical runner Member 41a ... Vertical runner hole 41b ... Pin point gate 42 ... Product ejector pin 43 ... Stepped hole 44 ... Medium mold return pin 44a ... Press receiving part 44b ... Hang part 45 ... Spring housing part 46 ... Medium mold first DESCRIPTION OF SYMBOLS 1 Spring 47 ... 1st ejector rod for middle molds 48 ... 2nd ejector rod for middle molds 49 ... 2nd spring for middle molds 50 ... Space block for lower molds 51 ... Projection part 52 ... Isobaric cylinder 53 ... plunger 54 ... plunger tip 55 ... pot portion 56 ... substrate 57 ... guide recess 58 ... control device 59 ... drive device 60 ... Isobaric cylinder lifting device

Claims (5)

The first mold, the second mold, and the third mold are arranged side by side so as to be able to contact and separate, and the substrate is sandwiched between the second mold and the third mold, and at least formed in the second mold Electrons mounted on the substrate by filling the resin formed in the cavity formed by the recess and the substrate through the runner groove formed in the first mold and the vertical runner hole formed in the second mold. A resin molding device that seals parts with resin,
The first mold includes a movable first mold ejector plate,
The second mold is
A second mold ejector plate for holding a product ejector pin that is linked to the first mold ejector plate and projects the resin solidified in the molding recess;
Energizing the ejector plate for the second mold and separating the product ejector pin from the resin solidified in the recess for molding in a state where the second mold is opened to a predetermined dimension with respect to the first mold. An elastic member for the second mold,
A resin molding apparatus comprising: The second mold includes a first plate that comes into contact with the first mold, a second plate that comes into contact with the third mold and has the molding recess, the first plate, and the second plate. A space block provided between the plates and forming a space in which the ejector plate for the second mold can move, and
The second mold ejector plate is held at the second mold ejector plate and abuts against the first mold so that the second mold ejector plate is positioned at an intermediate position in the second mold. 2. The resin molding apparatus according to claim 1, wherein a second ejector rod for a second mold is provided in which an end surface is flush with a bottom surface of the molding recess. The first mold includes a first ejector plate for a first mold and a first elastic member for the first mold, which are arranged to be movable up and down,
The first ejector plate for the first mold holds the first ejector rod for the first mold that can press the first ejector rod for the second mold,
The first elastic member for the first mold, the first mold for the first ejector rod and biases the first ejector plate for the first mold, capable of pressing the second first ejector rod for mold The resin molding apparatus according to claim 2, wherein: The second mold has a second mold return pin that is inserted through the first mold side and the third mold side and can protrude to the third mold side,
The first ejector plate for the first mold holds a return pin for the first mold that can press the return pin for the second mold,
Said first mold, said the second die and Rukoto closing the third mold, the with second mold for the return pin abuts on the third mold, the first mold for the return pins Abuts against the return pin for the second mold and moves the first ejector plate for the first mold against the urging force of the first elastic member for the first mold, The resin molding apparatus according to claim 3, wherein the first ejector rod is retracted from the first mold by a predetermined amount. The first mold further includes a second ejector plate for the first mold, and a second elastic member for the first mold,
The second ejector plate for the first mold holds a runner ejector pin capable of projecting the resin solidified in the runner groove;
The second mold second elastic member biases the first mold second ejector plate when the first mold first ejector rod presses the second mold first ejector rod. The resin molding apparatus according to any one of claims 1 to 4, wherein the runner ejector pin does not protrude into the runner groove.

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