TWI629163B - Stamping mechanism, stamping method, compression molding device, and compression molding method - Google Patents

Abstract

The punching mechanism includes: an upper die; a lower die; an upper fixed plate; a lower fixed plate; an intermediate plate can be moved up and down relative to the upper fixed plate and a lower fixed plate; a sliding plate can be moved relative to the upper fixed plate and the lower fixed plate In the up and down direction; the mold closing mechanism; the transmission mechanism, which is arranged below the slide plate, and conveys the mold closing force of the mold closing mechanism to the slide plate; the first elastic mechanism is provided in the first upper mold and the first lower mold of the upper mold. The second elastic mechanism is provided between the second upper mold and the second lower mold of the lower die. The first elastic mechanism forms a predetermined gap between the first upper die and the first lower die of the upper die, and the second elastic mechanism forms a predetermined gap between the second upper die and the second lower die of the lower die. At the beginning of the state, the first elastic mechanism and the second elastic mechanism are compressed simultaneously by the mold closing force of the mold closing mechanism, so that the upper mold and the lower mold are closed simultaneously.

Description

Stamping mechanism, stamping method, compression molding device, and compression molding method

The present invention relates to a pressing mechanism, a pressing method, a compression forming apparatus, and a compression forming method.

Conventionally, there is a compression molding apparatus that uses a resin material to compression-mold a semiconductor wafer or the like. 11 and 12 are front views showing the opened and closed states of the mold mechanism part 1000 included in the conventional compression molding apparatus.

As shown in FIG. 11 and FIG. 12, the mold mechanism unit 1000 includes two forming dies 110 and 120 that are stacked in a vertical direction. The forming die 110 includes an upper die 110A and a lower die 110B, and the forming die 120 includes an upper die 120A and a lower die 120B.

The mold mechanism part 1000 includes: an upper fixed plate 130, an upper mold 110A for fixing the forming mold 110; an intermediate plate 140, a lower mold 110B for fixing the forming mold 110, and an upper mold 120A for the forming mold 120; a sliding plate 150, for fixing the forming mold 120 Lower mold 120B; lower fixed disk 160, which is disposed below the sliding disk 150; a link mechanism 170 and a ball screw 180 for transmitting the mold closing force to the sliding disk 150; and a rack and gear set 190, which connects the intermediate disk 140 And sliding disk 150.

The intermediate plate 140 and the slide plate 150 are movable in the vertical direction with respect to the upper fixed plate 130 and the lower fixed plate 160. The intermediate plate 140 and the slide plate 150 are driven in a vertical direction by a servo motor (not shown) through the ball screw 180 and the link mechanism 170. Thereby, the mold opening states of the forming dies 110 and 120 (Fig. 11) and Switching of the mold closed state (Figure 12).

With the reduction in thickness and size of devices, the reduction in thickness and accuracy of molded products has become more demanding. In the conventional press structure, it has been difficult to maintain the parallelism between the intermediate plate 140 and the slide plate 150 of the movable platen with high accuracy. If an inclination occurs between the intermediate plate 140 and the slide plate 150, a force for correcting the inclination is not generated, and the influence of the inclination is also transferred to the molded product.

The present invention has been made in view of the above-mentioned problems, and provides a stamping mechanism, a stamping method, and a compression molding apparatus and a compression molding method using the above mechanism and method.

The punching mechanism of the present invention includes: an upper die, which has a first upper die and a first lower die; a lower die, which is stacked under the upper die and has a second upper die and a second lower die; An upper fixed plate that fixes the first upper die of the upper die; a lower fixed plate that is disposed below the upper fixed plate; an intermediate plate to place the first lower die and the lower die of the upper die The second upper mold is fixed in a state where the two are fixed, and can be moved up and down with respect to the upper fixed plate and the lower fixed plate; a sliding plate to fix the second lower mold of the lower mold. The state is set and can be moved in the up-down direction relative to the upper fixed plate and the lower fixed plate; a mold closing mechanism that applies the required mold closing force to the upper mold and the lower mold; a transmission mechanism is provided on the sliding disk Below, convey the mold closing force of the mold closing mechanism to the slide disc; a first elastic mechanism is provided between the first upper mold and the first lower mold of the upper mold; a second elastic mechanism is provided Between the second upper die and the second lower die of the lower die.

The second elastic mechanism can transmit the mold closing force of the mold closing mechanism to the intermediate plate in a state where a predetermined gap is formed between the second upper mold and the second lower mold of the lower mold, so that the middle The disc moves toward the upper fixed disc, a predetermined gap is formed from the first elastic mechanism between the first upper die of the upper die and the first lower die, and the second elastic mechanism is in the first die of the lower die. Starting from a state where a predetermined gap is formed between the 2 upper mold and the second lower mold, the first elastic mechanism and the second elastic mechanism are simultaneously compressed by the mold closing force of the mold closing mechanism, so that the upper mold and the lower mold The mold is closed at the same time.

In one embodiment, the above-mentioned punching mechanism further includes a lower stage floating mechanism disposed between the sliding plate and the second lower die of the lower die to correct the inclination of the second lower die relative to the sliding plate.

In one embodiment, the above-mentioned punching mechanism further includes: an upper floating mechanism disposed between the intermediate plate and the first lower die of the upper die to correct the inclination of the first lower die relative to the intermediate plate.

The compression molding device of the present invention includes: a mold unit for compression molding an embedded member with a resin material, wherein the mold unit includes the above-mentioned punching mechanism.

In one embodiment, in the above compression molding apparatus, the mold unit has a plurality of mold units detachably provided to each other.

The punching method of the present invention uses a punching mechanism. The punching mechanism includes: an upper die, which has a first upper die and a first lower die; a lower die, which is stacked under the upper die and has a second die; An upper die and a second lower die; an upper fixed plate that fixes the first upper die of the upper die; a lower fixed plate that is arranged below the upper fixed plate; an intermediate plate that is in the upper die 1st The lower die and the second upper die of the lower die are set in a fixed state; a sliding disk is set in a state of fixing the second lower die of the lower die; a first elastic mechanism is provided in the Between the first upper die of the upper die and the first lower die; a second elastic mechanism is provided between the second upper die of the lower die and the second lower die.

The above-mentioned punching method includes: transmitting a mold closing force to the slide plate; and in a state where a predetermined gap is formed by the second elastic mechanism between the second upper mold and the second lower mold of the lower mold, The mold closing force transmitted to the slide plate is transmitted to the intermediate plate through the second elastic mechanism, so that the intermediate plate moves from the lower fixed plate toward the upper fixed plate; and from the first upper mold of the upper die. A predetermined gap is formed between the lower die and the first lower die by the first elastic mechanism, and a predetermined gap is formed between the second upper die and the second lower die of the lower die by the second elastic mechanism; At the beginning of the state, the first elastic mechanism and the second elastic mechanism are compressed at the same time, so that the upper mold and the lower mold are closed simultaneously.

In one embodiment, in the above-mentioned punching method, the inclination of the second lower die with respect to the sliding plate is corrected by a lower floating mechanism provided between the sliding plate and the second lower die of the lower die.

In one embodiment, in the above-mentioned punching method, the inclination of the first lower die with respect to the intermediate plate is corrected by an upper stage floating mechanism provided between the intermediate plate and the first lower die of the upper section die.

The compression molding method of the present invention includes: preparing an embedded member and a resin material; and compression molding the embedded member with the resin material by the above-mentioned punching method.

The above and other objects, features, viewpoints, and advantages of the present invention can be understood from the following detailed description of the present invention in association with and understood from the drawings. Learned.

11, 12, 110, 120 ‧ ‧ ‧ forming dies

11A, 12A, 110A, 120A‧‧‧

11A1‧‧‧Clamp

11A2‧‧‧Compression member

11B, 12B, 110B, 120B

13, 130‧‧‧ Upper fixed plate

14, 140‧‧‧ intermediate plate

15, 150‧‧‧ sliding disk

16, 160‧‧‧ Lower fixed plate

17, 170‧‧‧ connecting rod mechanism

18, 180‧‧‧ Ball screw

19‧‧‧ keep box

21, 22‧‧‧Flexible mechanism

21A‧‧‧ Coil Spring

30‧‧‧ Floating Agency

31‧‧‧block

32‧‧‧flow

33‧‧‧Piston cover

34‧‧‧Piston

35‧‧‧oil injection port

40‧‧‧ release film

50‧‧‧ granular resin

60‧‧‧ substrate

100, 1000‧‧‧Mould mechanism department

190‧‧‧ Racks and Pinions

200‧‧‧ Supply Department

300‧‧‧ Take-out section

A‧‧‧Mould Unit

B‧‧‧ Supply Unit

C‧‧‧ Take out unit

FIG. 1 is a plan view showing the overall structure of a compression molding apparatus according to an embodiment of the present invention.

Fig. 2 shows a state in which a mold unit in the compression molding apparatus shown in Fig. 1 is added.

FIG. 3 shows the first step of a compression molding method using a compression molding apparatus according to an embodiment of the present invention.

FIG. 4 shows a second step of a compression molding method using a compression molding apparatus according to an embodiment of the present invention.

Fig. 5 shows the third step of a compression molding method using a compression molding apparatus according to an embodiment of the present invention.

Fig. 6 shows a fourth step of a compression molding method using a compression molding apparatus according to an embodiment of the present invention.

Figures 7A to 8B show an example of a structure in which an elastic mechanism is provided between an upper mold and a lower mold.

Figures 9A to 9C show an example of a structure in which a floating mechanism is provided between the lower mold and the slide plate or the intermediate plate.

Fig. 10 shows an example of the structure of a forming die.

Fig. 11 is a front view showing a press mechanism (a mold opening state) included in a conventional compression molding apparatus.

Fig. 12 is a front view showing a press mechanism (closed mold state) included in a conventional compression molding apparatus

Hereinafter, embodiments of the present invention will be described. In some cases, the same or equivalent parts will be marked with the same symbol without repeated description.

In the embodiments described below, when the number and quantity are mentioned, the scope of the present invention is not limited to the number and quantity unless otherwise stated. In addition, in the following embodiments, each of the constituent elements is not an absolutely necessary element for the present invention unless it is specifically described.

FIG. 1 is a plan view showing the entire structure of a compression molding apparatus according to this embodiment. As shown in FIG. 1, the compression molding apparatus according to this embodiment includes a mold unit A. A mold mechanism unit 100 including a resin material for compression molding (resin sealing molding) of a substrate (embedded member) on which a semiconductor warp surface is mounted; a supply unit B including a supply unit 200 for supplying a mold to the mold unit A; The take-out unit C includes a take-out unit 300 for taking out a molded product from a molding die of the mold unit A, and a storage unit that stores the molded product. The supply unit 200 and the extraction unit 300 move in the vertical direction in the first figure.

The mold unit A, the supply unit B, and the take-out unit C can be detachably connected to each other through a connection mechanism such as a screw or a bolt. In the example in FIG. 1, two mold units A are provided, but this number can be adjusted to increase or decrease depending on the production volume. The number of mold units A may be one, or may be increased to, for example, four as shown in FIG. 2.

In the examples of FIGS. 1 and 2, the mold unit A, the supply unit B, and the take-out unit C are arranged in this order. However, the mold unit A, the supply unit B, and the take-out unit C may be integrated. A compression molding apparatus configured by arranging one master machine and one or plural slave machines including only the mold unit A.

In the example shown in FIGS. 1 and 2, the insert member and the resin material may be manually supplied to the mold unit A, and the molded product may be taken out.

Figures 3 to 6 show the steps in the compression molding direction using the compression molding apparatus of this embodiment.

As shown in FIGS. 3 to 6, the mold mechanism section 100 in the compression molding apparatus of this embodiment includes two molding dies 11 and 12 that are stacked in the vertical direction. The forming die 11 includes an upper die 11A and a lower die 11B, and the forming die 12 includes an upper die 12A and a lower die 12B.

The mold mechanism part 100 includes an upper fixed plate 13 and an upper mold 11A for fixing the forming mold 11; an intermediate plate 140, a lower mold 11B for fixing the forming mold 11 and an upper mold 12A for the forming mold 12; The lower mold 12B; the lower fixed disk 16 is disposed below the sliding disk 15; the link mechanism 17 and the ball screw 18 are used to transmit the mold closing force to the sliding disk 15.

Elastic mechanisms 21 and 22 are provided between the upper die 11A and the lower die 11B of the forming die 11 and between the upper die 12A and the lower die 12B of the forming die 12, respectively. A floating mechanism 30 is provided between the slide plate 15 and the lower mold 12B of the forming mold 12.

The intermediate plate 14 and the slide plate 15 are connected to a holding frame 19 provided between the upper fixed plate 13 and the lower fixed plate 16 in a vertical direction through an LM guide member (not shown), and can be moved in the vertical direction. The intermediate plate 14 and the slide plate 15 are driven in the vertical direction by a servo motor (not shown) through the ball screw 18 and the link mechanism 17. Thereby, each state shown in FIGS. 3 to 6 is switched. A more detailed explanation is as follows.

First, the power of a servo motor (not shown) passes through the ball screw 18 And the link mechanism 17 is transmitted to the slide plate 15. With this, starting from the state shown in FIG. 3, the slide plate 15, the floating mechanism 30, and the lower die 12B are raised. As shown in FIG. 4, the upper die 12A and the lower die 12B of the forming die 12 sandwich the elastic mechanism. twenty two.

If power is applied from the state shown in FIG. 4, the upper die 12A and the lower die 12B of the forming die 12 are maintained at a predetermined distance by the elastic mechanism 22, and the intermediate plate 14 and the lower die 11B are raised, as shown in FIG. 5. The upper die 11A and the lower die 11B of the forming die 11 sandwich the elastic mechanism 21. That is, the elastic mechanism 22 can raise the intermediate plate 14 in a state where a predetermined gap is formed between the upper die 12A and the lower die 12B of the forming die 12. The floating mechanism 30 provided between the slide plate 15 and the lower mold 12B of the forming mold 12 corrects the inclination of the lower mold 12B when the lower mold 12B is inclined with respect to the slide disk 15 so that the lower mold 12B becomes parallel.

When power is further applied from the state in FIG. 5, as shown in FIG. 6, the elastic mechanisms 21 and 22 are compressed, and the molds 11 and 12 are closed at the same time to perform resin sealing. Thereafter, after a certain curing time has elapsed, the molds 11 and 12 are opened by an operation opposite to the above operation.

By providing the elastic mechanism 21, 22 and the floating mechanism 30 in the mold mechanism part 100 of this embodiment, the parallelism of the intermediate disk 14 and the sliding disk 15 can be maintained along the parallelism of the upper fixed disk 13. Thereby, the mold closing and resin sealing can be performed while maintaining high-precision parallelism, and therefore, high-precision (less unevenness) resin thickness can be achieved. That is, during the mold closing process, it is possible to reduce the uneven resin thickness of the molded product without tilting the intermediate plate 14. In addition, as compared with the conventional press structure, high-precision assembly work of the intermediate plate 14 or the slide plate 15 is not required, and the number of assembly steps can be reduced.

7A to 8B are diagrams showing a configuration example of the elastic mechanism 21. 7A As shown in FIG. 7B, the elastic mechanism 21 is also constituted by the coil spring 21A, and as shown in FIGS. 8A and 8B, the elastic mechanism 21 may be a mechanism in which a latch 21B is provided on the coil spring 21A. As shown in FIG. 7A and FIG. 8A, the coil spring 21A, the coil spring 21A, and the latch 21B are all arranged concentrically on the forming die 11B. Alternatively, as shown in FIG. 7B and FIG. 8B, they may be divided into The inner peripheral portion and the outer peripheral portion are provided. The elastic mechanism 21 preferably has a compression movement amount of about 5 mm to 10 mm from the temporarily closed state (FIG. 5) to the true closed state (FIG. 6). The above description is similarly applied to the elastic mechanism 22.

Figures 9A to 9C show examples of the structure of the floating mechanism 30. FIG. 9A is a side view of the floating mechanism 30. Figure 9B is a plan view of the same mechanism. Fig. 9C is an enlarged cross-sectional view of a portion "A" in Fig. 9A. As shown in FIGS. 9A to 9C, the floating mechanism 30 includes a block body 31, a flow path 32, a piston cover 33, a piston 34, and an oil injection port 35. The flow path 32 formed in the block 31 is supplied with a fluid such as silicone oil through the oil injection port 35. The piston cover 33 attached to the block 31 is fitted into the piston 34. The piston 34 is biased upward by the pressure of the fluid supplied to the flow path 32. The pistons 34 are arranged in a matrix on the block 31. The fluid supplied to the flow path 32 functions to equalize (isobaric) the pressure of the fluid in all the flow paths 32. Thereby, even when the slide plate 15 is tilted, the floating mechanism 30 is corrected so that the mold surface of the lower mold 12B is parallel to the mold surface of the upper mold 12A.

FIG. 10 shows a structural example of the forming die 11. As shown in FIG. 10, a release film 40 and a particulate resin 50 are provided between the upper mold 11A and the lower mold 11B of the forming mold 11. The upper mold 11A includes a clamp 11A1 and a stamper member 11A2 for holding the substrate 60. The contents described above also apply to the forming die 12.

In this embodiment, an example has been described in which the elastic mechanisms 21 and 22 are provided on the lower molds 11B and 12B. However, the elastic mechanisms 21 and 22 may be provided on the upper molds 11A and 12A. The floating mechanism 30 may be omitted, and may be provided on both the forming dies 11 and 12.

In addition, the scope of the present invention is not limited to the holding frame 19, and may be a stamping mechanism in which columnar tie rods are provided on four sides. The power transmission method is not limited to the link mechanism 17 and may be a direct pressure type (direct-acting type) of a motor or a hydraulic pressure.

In this embodiment, the mold mechanism portion 100 for compression-molding the insert member with a resin material has been described. However, the scope of the present invention is not limited to resin sealing. The present invention is also used to sandwich a pair of metal molds. Possibility of a device that corrects warpage after sealing, injection molding, and injection molding. In addition, the present invention also has a possibility of using a hot press device used for manufacturing a laminated board as a material for a printed circuit board.

Although the embodiments of the present invention have been described above, the embodiments of the present disclosure are illustrative and not restrictive in all aspects. The scope of the present invention will be expressed in terms of the scope of patent applications, and includes the same scope as the requested scope. The meaning and all the deformations within the scope.

Claims (9)

A stamping mechanism includes: an upper die, which has a first upper die and a first lower die; a lower die, which is stacked under the upper die and has a second upper die and a second lower die; An upper fixed plate fixes the first upper mold of the upper die; a lower fixed plate is disposed below the upper fixed plate; an intermediate plate is provided between the first lower die of the upper mold and the first die of the lower mold. The second upper mold is fixed between the two, and can be moved up and down relative to the upper fixed disk and the lower fixed disk; a sliding disk is set to fix the second lower mold of the lower mold. And can be moved up and down relative to the upper fixed plate and the lower fixed plate; a mold closing mechanism that applies the required mold closing force to the upper mold and the lower mold; a transmission mechanism is provided below the sliding disk To convey the mold closing force of the mold closing mechanism to the sliding disc; a first elastic mechanism is disposed between the first upper mold and the first lower mold of the upper mold; a second elastic mechanism is disposed on the Between the second upper die and the second lower die of the lower die, wherein by It is possible to close the mold in a state where a predetermined gap is formed between the second upper mold and the second lower mold by the second elastic mechanism sandwiched between the second upper mold and the second lower mold of the lower mold. The mold closing force of the mechanism is transmitted to the intermediate plate, and the intermediate plate is moved toward the upper fixed plate. From the first elastic mechanism sandwiched by the first upper mold and the first lower mold of the upper mold, A predetermined gap is formed between the first upper die and the first lower die, and the second elastic mechanism sandwiched between the second upper die and the second lower die of the lower die is used for the first upper die. Starting from a state where a predetermined gap is formed between the 2 upper mold and the second lower mold, the first elastic mechanism and the second elastic mechanism are simultaneously compressed by the mold closing force of the mold closing mechanism, so that the upper mold and the lower mold The mold is closed at the same time. The punching mechanism described in item 1 of the scope of patent application, further includes: a lower floating mechanism disposed between the sliding disk and the second lower mold of the lower mold, and correcting the second lower mold relative to the sliding disk Of tilt. The punching mechanism described in item 1 or 2 of the scope of patent application, further includes: an upper floating mechanism disposed between the intermediate plate and the first lower die of the upper die, and modifying the first lower die relative to the Tilt of the middle plate. A compression molding device includes a mold unit for compression-molding an embedded member with a resin material, wherein the mold unit includes a stamping mechanism according to item 1 or 2 of the scope of patent application. The compression molding device according to item 4 of the scope of patent application, wherein the mold unit has a plurality of mold units detachably provided to each other. A punching method uses a punching mechanism. The punching mechanism includes: an upper die, which has a first upper die and a first lower die; a lower die, which is stacked under the upper die and has a second upper die; And a second lower die; an upper fixed plate, which fixes the first upper die of the upper die; a lower fixed plate, which is arranged below the upper fixed plate; an intermediate plate, which is on the first die of the upper die The lower die and the second upper die of the lower die are set in a fixed state; a sliding disk is set in a state of fixing the second lower die of the lower die; a first elastic mechanism is provided in the Between the first upper die and the first lower die of the upper die; a second elastic mechanism is disposed between the second upper die and the second lower die of the lower die, wherein the punching method includes: The mold closing force is transmitted to the sliding disc; between the second upper mold and the second lower mold by the second elastic mechanism sandwiched by the second upper mold and the second lower mold of the lower mold. In a state where a predetermined gap is formed, the mold clamping force transmitted to the slide plate is transmitted to the intermediate plate through the second elastic mechanism, The intermediate plate is moved from the lower fixed plate toward the upper fixed plate; and from the first elastic mechanism sandwiched by the first upper mold and the first lower mold of the upper mold, the first A predetermined gap is formed between the upper die and the first lower die, and the second upper die and the second upper die are sandwiched by the second elastic mechanism sandwiched by the second upper die and the second lower die of the lower die. The state in which a predetermined gap is formed between the second lower molds is started, and the first elastic mechanism and the second elastic mechanism are compressed at the same time, so that the upper mold and the lower mold are closed simultaneously. The punching method as described in item 6 of the scope of patent application, wherein the lower stage floating mechanism provided between the slide disc and the second lower die of the lower stage die corrects the second lower die relative to the slide disc. Of tilt. The punching method according to item 6 or 7 of the scope of the patent application, wherein the upper stage floating mechanism provided between the intermediate plate and the first lower die of the upper stage die corrects the first lower die relative to the Tilt of the middle plate. A compression molding method includes: preparing an embedded member and a resin material; and compressing the embedded member with the resin material by a punching method as described in item 6 or 7 of the scope of patent application.