JPS62157143U - - Google Patents
Info
- Publication number
- JPS62157143U JPS62157143U JP4425286U JP4425286U JPS62157143U JP S62157143 U JPS62157143 U JP S62157143U JP 4425286 U JP4425286 U JP 4425286U JP 4425286 U JP4425286 U JP 4425286U JP S62157143 U JPS62157143 U JP S62157143U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- pots
- mold
- resin sealing
- runner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 3
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 239000000057 synthetic resin Substances 0.000 claims description 2
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例を示す正断面図、第
２図は成形品の平面図である。
１……上金型、３……下金型、５……ポツト、
６……プランジヤ、７……プレート、８……トラ
ンスフアシリンダ、９……ランナー、１０……リ
ードフレーム、１１……合成樹脂、１２……樹脂
封止部。
FIG. 1 is a front sectional view showing an embodiment of the present invention, and FIG. 2 is a plan view of a molded product. 1... Upper mold, 3... Lower mold, 5... Pot,
6... Plunger, 7... Plate, 8... Transfer cylinder, 9... Runner, 10... Lead frame, 11... Synthetic resin, 12... Resin sealing part.
Claims (1)
スフアシリンダに連結された夫々対応するプラン
ジヤにより加圧して、複数個の成形型に溶融樹脂
を同時に注入するようにした樹脂封止用金型にお
いて、前記各ポツトをランナーにより互に連通さ
せたことを特徴とする樹脂封止用金型。 A resin sealing mold that simultaneously injects molten resin into multiple molds by pressurizing the synthetic resin in multiple pots with corresponding plungers connected to one transfer cylinder. A mold for resin sealing, characterized in that each of the pots is communicated with each other by a runner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986044252U JPH0340579Y2 (en) | 1986-03-26 | 1986-03-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986044252U JPH0340579Y2 (en) | 1986-03-26 | 1986-03-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62157143U true JPS62157143U (en) | 1987-10-06 |
| JPH0340579Y2 JPH0340579Y2 (en) | 1991-08-27 |
Family
ID=30861883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986044252U Expired JPH0340579Y2 (en) | 1986-03-26 | 1986-03-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0340579Y2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01235340A (en) * | 1988-03-16 | 1989-09-20 | Hitachi Ltd | Resin-sealing device for semiconductor |
| JPH01257338A (en) * | 1988-04-07 | 1989-10-13 | Hitachi Ltd | Semiconductor resin-sealing apparatus and semiconductor resin-sealing using same |
| CN114103017A (en) * | 2020-08-28 | 2022-03-01 | 东和株式会社 | Resin molding apparatus and method for manufacturing resin molded product |
| CN114102981A (en) * | 2020-08-28 | 2022-03-01 | 东和株式会社 | Resin molding apparatus and method for manufacturing resin molded product |
| JP2022039810A (en) * | 2020-08-28 | 2022-03-10 | Ｔｏｗａ株式会社 | Molding die, resin molding unit, and manufacturing method of resin molded product |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59225913A (en) * | 1983-06-08 | 1984-12-19 | Y K C:Kk | Method and apparatus for concurrent cast molding in plural molds by plural plungers |
-
1986
- 1986-03-26 JP JP1986044252U patent/JPH0340579Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59225913A (en) * | 1983-06-08 | 1984-12-19 | Y K C:Kk | Method and apparatus for concurrent cast molding in plural molds by plural plungers |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01235340A (en) * | 1988-03-16 | 1989-09-20 | Hitachi Ltd | Resin-sealing device for semiconductor |
| JPH01257338A (en) * | 1988-04-07 | 1989-10-13 | Hitachi Ltd | Semiconductor resin-sealing apparatus and semiconductor resin-sealing using same |
| CN114103017A (en) * | 2020-08-28 | 2022-03-01 | 东和株式会社 | Resin molding apparatus and method for manufacturing resin molded product |
| CN114102981A (en) * | 2020-08-28 | 2022-03-01 | 东和株式会社 | Resin molding apparatus and method for manufacturing resin molded product |
| JP2022039811A (en) * | 2020-08-28 | 2022-03-10 | Ｔｏｗａ株式会社 | Resin molding device and manufacturing method of the resin molding |
| JP2022039810A (en) * | 2020-08-28 | 2022-03-10 | Ｔｏｗａ株式会社 | Molding die, resin molding unit, and manufacturing method of resin molded product |
| JP2022039709A (en) * | 2020-08-28 | 2022-03-10 | Ｔｏｗａ株式会社 | Resin molding device and manufacturing method of the resin molding |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0340579Y2 (en) | 1991-08-27 |