JPH032639U - - Google Patents
Info
- Publication number
- JPH032639U JPH032639U JP6360789U JP6360789U JPH032639U JP H032639 U JPH032639 U JP H032639U JP 6360789 U JP6360789 U JP 6360789U JP 6360789 U JP6360789 U JP 6360789U JP H032639 U JPH032639 U JP H032639U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- pot
- gate
- runner
- cull
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 7
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案に係る樹脂モールド装置の一実
施例を示す断面図、第２図は第１図の樹脂モール
ド装置での樹脂モールド状態を示す断面図、第３
図及び第４図は第１図の樹脂モールド装置でのリ
ードフレーム離型状態を示す各断面図である。第
５図は従来の樹脂モールド装置を示す一部断面を
含む平面図、第６図は第５図のＡ−Ａ線に沿う断
面図、第７図は第６図の樹脂モールド装置での樹
脂モールド状態を示す断面図、第８図は第６図の
樹脂モールド装置でのリードフレーム離型状態を
示す断面図である。
２１……上金型、２２……下金型、２３……ポ
ツト、２４……カル、２５……ランナ、２６……
ゲート、２７……キヤビテイ、３２……樹脂タブ
レツト。
FIG. 1 is a cross-sectional view showing an embodiment of the resin molding device according to the present invention, FIG. 2 is a cross-sectional view showing the state of resin molding in the resin molding device of FIG. 1, and FIG.
These figures and FIG. 4 are cross-sectional views showing the release state of the lead frame in the resin molding apparatus of FIG. 1. FIG. 5 is a plan view including a partial cross section showing a conventional resin molding device, FIG. 6 is a sectional view taken along line A-A in FIG. 5, and FIG. FIG. 8 is a cross-sectional view showing the molded state of the lead frame in the resin molding apparatus of FIG. 6. 21...Upper mold, 22...Lower mold, 23...Pot, 24...Cal, 25...Runner, 26...
Gate, 27... Cavity, 32... Resin tablet.
Claims (1)
、他の金型衝合面にポツトと対向してカルを設け
、その金型衝合面にカルと連通してランナ、ゲー
ト、キヤビテイを設け、ポツト内に供給した樹脂
タブレツトをランナ、ゲートを介してキヤビテイ
に圧送するものにおいて、 上記金型に対してゲート部を上下動自在に配設
したことを特徴とする樹脂モールド装置。[Scope of Claim for Utility Model Registration] A pot is opened on one of the mold abutting surfaces of the upper and lower molds, a cull is provided opposite to the pot on the other mold abutting surface, and a cull is provided on the mold abutting surface. A runner, a gate, and a cavity are provided in communication with the mold, and the resin tablets supplied in the pot are force-fed into the cavity via the runner and the gate, and the gate part is arranged to be able to move up and down with respect to the mold. A resin molding device featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6360789U JPH032639U (en) | 1989-05-30 | 1989-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6360789U JPH032639U (en) | 1989-05-30 | 1989-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH032639U true JPH032639U (en) | 1991-01-11 |
Family
ID=31593809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6360789U Pending JPH032639U (en) | 1989-05-30 | 1989-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH032639U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4724704U (en) * | 1971-04-07 | 1972-11-20 |
-
1989
- 1989-05-30 JP JP6360789U patent/JPH032639U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4724704U (en) * | 1971-04-07 | 1972-11-20 | ||
| JPS5038087Y2 (en) * | 1971-04-07 | 1975-11-05 |