JPS63156720U - - Google Patents
Info
- Publication number
- JPS63156720U JPS63156720U JP4927487U JP4927487U JPS63156720U JP S63156720 U JPS63156720 U JP S63156720U JP 4927487 U JP4927487 U JP 4927487U JP 4927487 U JP4927487 U JP 4927487U JP S63156720 U JPS63156720 U JP S63156720U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- mold
- resin
- lower mold
- position detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 2
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
第１図は本考案の一実施例の部分斜視図、第２
図はリードフレームの平面図、第３図は本考案の
他の実施例の上型を除いた平面図、第４図は第３
図の実施例の部分断面図、第５図は従来の樹脂封
止金型の断面図である。
１，１８……下型、２，１９……上型、３……
パイプ、４……信号検出装置、５……カル部、６
……ランナー、７……ゲート部、８……キヤビテ
イ、９……ポツト部、１０……プランジヤー、１
１……リードフレーム、１２……外枠、１４……
真空ポンプ、１５……パーテイング面、１７……
樹脂片、２１……回路素子、２２……樹脂タブレ
ツト、ｂ１，ｂ２，……リードフレーム位置決め
穴、ｈ１，ｈ２，……リードフレーム位置検出穴
、ｐ１，ｐ２，……リードフレーム位置決めピン
。
Fig. 1 is a partial perspective view of one embodiment of the present invention;
The figure is a plan view of the lead frame, FIG. 3 is a plan view of another embodiment of the present invention with the upper die removed, and FIG.
FIG. 5 is a partial cross-sectional view of the embodiment shown in the figure, and FIG. 5 is a cross-sectional view of a conventional resin-sealing mold. 1,18...Lower mold, 2,19...Upper mold, 3...
Pipe, 4...Signal detection device, 5...Cull part, 6
...Runner, 7...Gate section, 8...Cavity, 9...Pot section, 10...Plunger, 1
1... Lead frame, 12... Outer frame, 14...
Vacuum pump, 15... Parting surface, 17...
Resin piece, 21...Circuit element, 22...Resin tablet, b1 , b2 ,...Lead frame positioning hole, h1 , h2 ,...Lead frame position detection hole, p1 , p2 ,... Lead frame locating pin.
Claims (1)
上型と下型との間に形成されるキヤビテイ内に樹
脂を注入し成形する樹脂封止金型において、前記
下型のリードフレームがセツトされる所定の位置
に２箇所以上のリードフレーム位置検出穴を配設
し、このリードフレーム位置検出穴の一方の端に
真空検出装置を具備したことを特徴とする樹脂封
止金型。 In a resin sealing mold in which a lead frame is sandwiched between an upper mold and a lower mold and resin is injected into a cavity formed between the upper mold and the lower mold and molded, the lead frame of the lower mold is A resin-sealed mold characterized in that two or more lead frame position detection holes are provided at predetermined positions to be set, and a vacuum detection device is provided at one end of the lead frame position detection holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4927487U JPS63156720U (en) | 1987-03-31 | 1987-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4927487U JPS63156720U (en) | 1987-03-31 | 1987-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63156720U true JPS63156720U (en) | 1988-10-14 |
Family
ID=30871571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4927487U Pending JPS63156720U (en) | 1987-03-31 | 1987-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63156720U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH034017U (en) * | 1989-05-31 | 1991-01-16 |
-
1987
- 1987-03-31 JP JP4927487U patent/JPS63156720U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH034017U (en) * | 1989-05-31 | 1991-01-16 |