JPS645447U - - Google Patents

Info

Publication number
JPS645447U
JPS645447U JP9977287U JP9977287U JPS645447U JP S645447 U JPS645447 U JP S645447U JP 9977287 U JP9977287 U JP 9977287U JP 9977287 U JP9977287 U JP 9977287U JP S645447 U JPS645447 U JP S645447U
Authority
JP
Japan
Prior art keywords
resin
view
sealing
sealing device
communicated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9977287U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9977287U priority Critical patent/JPS645447U/ja
Publication of JPS645447U publication Critical patent/JPS645447U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の下型を示す部分斜視図、第2
図は本考案を説明するための部分断面図、第3図
は本考案の第2の実施例を示す部分断面図、第4
図、第5図は従来の樹脂封止装置の部分断面図で
ある。 1……ポツト部、2……カル部、3……プラン
ジヤー、4……ランナー溝、5……ゲート部、6
……下キヤビテイー、7……上キヤビテイー、8
……上型、9……下型、10……タブレツト樹脂
、11……プランジヤー保持部、12……油圧シ
リンダー、13……リードフレーム、14……プ
ランジヤースライダー、15……スプリング。
Fig. 1 is a partial perspective view showing the lower die of the present invention;
The figures are a partial cross-sectional view for explaining the present invention, FIG. 3 is a partial cross-sectional view showing a second embodiment of the present invention, and FIG.
FIG. 5 is a partial sectional view of a conventional resin sealing device. 1...Pot part, 2...Cull part, 3...Plunger, 4...Runner groove, 5...Gate part, 6
...Lower cavity, 7...Upper cavity, 8
... Upper mold, 9 ... Lower mold, 10 ... Tablet resin, 11 ... Plunger holding section, 12 ... Hydraulic cylinder, 13 ... Lead frame, 14 ... Plunger slider, 15 ... Spring.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体集積回路を樹脂封止するための樹脂封止
装置において、多数一列に配設されたカル部をラ
ンナー溝により連通させたことを特徴とする樹脂
封止装置。
A resin sealing device for sealing a semiconductor integrated circuit with resin, characterized in that a large number of cull portions arranged in a row are communicated by a runner groove.
JP9977287U 1987-06-29 1987-06-29 Pending JPS645447U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9977287U JPS645447U (en) 1987-06-29 1987-06-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9977287U JPS645447U (en) 1987-06-29 1987-06-29

Publications (1)

Publication Number Publication Date
JPS645447U true JPS645447U (en) 1989-01-12

Family

ID=31327239

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9977287U Pending JPS645447U (en) 1987-06-29 1987-06-29

Country Status (1)

Country Link
JP (1) JPS645447U (en)

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