JPH0267639U - - Google Patents
Info
- Publication number
- JPH0267639U JPH0267639U JP14669488U JP14669488U JPH0267639U JP H0267639 U JPH0267639 U JP H0267639U JP 14669488 U JP14669488 U JP 14669488U JP 14669488 U JP14669488 U JP 14669488U JP H0267639 U JPH0267639 U JP H0267639U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- lead frame
- transfer molding
- runner
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001721 transfer moulding Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案実施例の構造を示す金型の断面
図、第２図は従来におけるトランスフア成形用金
型の断面図、第３図は第２図における下型の斜視
図である。図において、
１：上型、２：下型、３：キヤビテイ、４：ラ
ンナ、５：ゲート、６：リードフレーム、７：半
導体チツプ、８：フラツシユ生成間隙、ｇ：間隙
寸法、ｄ：リードフレームの板厚寸法。
FIG. 1 is a sectional view of a mold showing the structure of an embodiment of the present invention, FIG. 2 is a sectional view of a conventional transfer molding mold, and FIG. 3 is a perspective view of the lower mold in FIG. 2. In the figure, 1: upper mold, 2: lower mold, 3: cavity, 4: runner, 5: gate, 6: lead frame, 7: semiconductor chip, 8: flash generation gap, g: gap dimension, d: lead frame Plate thickness dimension.
Claims (1)
成形用金型であり、上型と下型との間にチツプ素
子をマウントしたリードフレームをインサートし
、この状態でランナよりゲートを経てキヤビテイ
に溶融樹脂を注入するものにおいて、ランナブロ
ツクに対応する金型のパーテイング面域に０．０
２mmないしリードフレームの板厚寸法に相当する
フラツシユ生成間隙を設けたことを特徴とするト
ランスフア成形用金型。 This is a transfer molding mold for molding resin-sealed semiconductor elements. A lead frame with a chip element mounted thereon is inserted between the upper mold and the lower mold, and in this state, molten resin is poured from the runner into the cavity through the gate. 0.0 in the parting surface area of the mold corresponding to the runner block.
A mold for transfer molding characterized by having a flash generation gap of 2 mm or equivalent to the plate thickness of a lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14669488U JPH0739230Y2 (en) | 1988-11-10 | 1988-11-10 | Mold for transfer molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14669488U JPH0739230Y2 (en) | 1988-11-10 | 1988-11-10 | Mold for transfer molding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0267639U true JPH0267639U (en) | 1990-05-22 |
| JPH0739230Y2 JPH0739230Y2 (en) | 1995-09-06 |
Family
ID=31416424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14669488U Expired - Fee Related JPH0739230Y2 (en) | 1988-11-10 | 1988-11-10 | Mold for transfer molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0739230Y2 (en) |
-
1988
- 1988-11-10 JP JP14669488U patent/JPH0739230Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0739230Y2 (en) | 1995-09-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |