JPH02122437U - - Google Patents
Info
- Publication number
- JPH02122437U JPH02122437U JP3095389U JP3095389U JPH02122437U JP H02122437 U JPH02122437 U JP H02122437U JP 3095389 U JP3095389 U JP 3095389U JP 3095389 U JP3095389 U JP 3095389U JP H02122437 U JPH02122437 U JP H02122437U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- pellet
- semiconductor pellet
- heat sink
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 5
- 239000008188 pellet Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims 1
Description
第１図は係止突起側にエアベントを設けた樹脂
モールド用金型の縦断面図、第２図はリード側に
エアベントを設けた樹脂モールド用金型の縦断面
図である。また、第３図は従来の樹脂モールド用
金型の縦断面図である。
１……放熱板、２……リード、４……上金型、
５……下金型、６……半導体ペレツト、１２……
樹脂の注入用ゲート、１３……エアベント。
FIG. 1 is a longitudinal sectional view of a resin molding die provided with an air vent on the locking protrusion side, and FIG. 2 is a longitudinal sectional view of a resin molding die provided with an air vent on the lead side. Moreover, FIG. 3 is a longitudinal sectional view of a conventional resin molding die. 1... Heat sink, 2... Lead, 4... Upper mold,
5... Lower mold, 6... Semiconductor pellet, 12...
Resin injection gate, 13... air vent.
Claims (1)
ペレツト上の電極とリードとを電気的にに接続し
て半導体ペレツト、リードの一部を含む放熱板の
全面を樹脂にて被覆するとともにペレツト載置面
と反対側の樹脂厚を可及的に薄く形成した絶縁型
半導体装置の製造に使用される樹脂モールド用金
型に於いて、 前記金型の樹脂注入用ゲートと対向する部位に
、樹脂の流入方向に向かつて容積が漸増するエア
ベントを形成したことを特徴とする樹脂モールド
装置。[Claim for Utility Model Registration] A semiconductor pellet is mounted on a heat sink, the electrodes on the semiconductor pellet and the leads are electrically connected, and the entire surface of the heat sink, including a part of the semiconductor pellet and the leads, is covered with resin. In a resin molding die used for manufacturing an insulated semiconductor device in which the thickness of the resin on the side opposite to the pellet placement surface is made as thin as possible, the resin injection gate is opposite to the resin injection gate of the die. A resin molding device characterized in that an air vent is formed in a portion where the resin is injected, the volume of which increases gradually in the direction in which the resin flows.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3095389U JPH02122437U (en) | 1989-03-18 | 1989-03-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3095389U JPH02122437U (en) | 1989-03-18 | 1989-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02122437U true JPH02122437U (en) | 1990-10-08 |
Family
ID=31256454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3095389U Pending JPH02122437U (en) | 1989-03-18 | 1989-03-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02122437U (en) |
-
1989
- 1989-03-18 JP JP3095389U patent/JPH02122437U/ja active Pending
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