JPH02132955U - - Google Patents
Info
- Publication number
- JPH02132955U JPH02132955U JP1989041363U JP4136389U JPH02132955U JP H02132955 U JPH02132955 U JP H02132955U JP 1989041363 U JP1989041363 U JP 1989041363U JP 4136389 U JP4136389 U JP 4136389U JP H02132955 U JPH02132955 U JP H02132955U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- heat sink
- dissipation structure
- heat dissipation
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Description
第１図は本実施例における半導体素子の放熱構
造を示すイグナイタの一部断面図、第２図は半導
体素子の放熱構造の説明図、第３図は従来技術と
しての半導体素子の放熱構造の説明図である。
１……下部ケース、４……下部ヒートシンク、
５……パワートランジスタ、７……上部ケース、
８……上部ヒートシンク、９……ポツテイング材
。
Fig. 1 is a partial cross-sectional view of an igniter showing the heat dissipation structure of a semiconductor element in this embodiment, Fig. 2 is an explanatory diagram of the heat dissipation structure of the semiconductor element, and Fig. 3 is an explanation of the heat dissipation structure of the semiconductor element as a conventional technique. It is a diagram. 1...Lower case, 4...Lower heat sink,
5...Power transistor, 7...Upper case,
8... Upper heat sink, 9... Potting material.
Claims (1)
して取り付けられた半導体素子の放熱構造であつ
て、 上記半導体素子の上面に近接対向する位置に第
２のヒートシンクを設け、 上記半導体素子と上記第２のヒートシンクとの
間にゲル状の樹脂を充填してなる半導体素子の放
熱構造。[Claims for Utility Model Registration] A heat dissipation structure for a semiconductor element housed in a case and attached via a first heat sink, wherein a second heat sink is provided at a position close to and opposite to the upper surface of the semiconductor element. , A heat dissipation structure for a semiconductor element, comprising filling a gel-like resin between the semiconductor element and the second heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989041363U JPH02132955U (en) | 1989-04-07 | 1989-04-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989041363U JPH02132955U (en) | 1989-04-07 | 1989-04-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02132955U true JPH02132955U (en) | 1990-11-05 |
Family
ID=31551964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989041363U Pending JPH02132955U (en) | 1989-04-07 | 1989-04-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02132955U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008153069A (en) * | 2006-12-18 | 2008-07-03 | Toyota Motor Corp | Connecting device |
| JP2013021229A (en) * | 2011-07-13 | 2013-01-31 | Fujitsu Ltd | Electronic component and method of manufacturing the same |
| JP2013074656A (en) * | 2011-09-27 | 2013-04-22 | Nissan Motor Co Ltd | Electric power conversion apparatus |
-
1989
- 1989-04-07 JP JP1989041363U patent/JPH02132955U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008153069A (en) * | 2006-12-18 | 2008-07-03 | Toyota Motor Corp | Connecting device |
| JP2013021229A (en) * | 2011-07-13 | 2013-01-31 | Fujitsu Ltd | Electronic component and method of manufacturing the same |
| JP2013074656A (en) * | 2011-09-27 | 2013-04-22 | Nissan Motor Co Ltd | Electric power conversion apparatus |