JPH0336146U - - Google Patents

Info

Publication number
JPH0336146U
JPH0336146U JP9667589U JP9667589U JPH0336146U JP H0336146 U JPH0336146 U JP H0336146U JP 9667589 U JP9667589 U JP 9667589U JP 9667589 U JP9667589 U JP 9667589U JP H0336146 U JPH0336146 U JP H0336146U
Authority
JP
Japan
Prior art keywords
heat sink
additional heat
integrated circuit
attached
divided bodies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9667589U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9667589U priority Critical patent/JPH0336146U/ja
Publication of JPH0336146U publication Critical patent/JPH0336146U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例に係る付加ヒートシ
ンクを取付けたヒートシンク付半導体集積回路パ
ツケージの外観を示す斜視図、第2図は第1図に
示すヒートシンクの断面図である。 1……パツケージ本体、2……基本ヒートシン
ク、3……付加ヒートシンク、4……半割体、5
……空間、6……ねじ、7……ナツト、8……ね
じ孔。
FIG. 1 is a perspective view showing the external appearance of a semiconductor integrated circuit package with a heat sink to which an additional heat sink is attached according to an embodiment of the present invention, and FIG. 2 is a sectional view of the heat sink shown in FIG. 1. 1...Package main body, 2...Basic heat sink, 3...Additional heat sink, 4...Half body, 5
...space, 6...screw, 7...nut, 8...screw hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体集積回路のパツケージ本体に一体に形成
したヒートシンクに取付ける付加ヒートシンクで
あつて、該付加ヒートシンクは複数の分割体から
なり、これら分割体にて上記ヒートシンクを囲繞
して取付け可能とした集積回路パツケージ用の付
加ヒートシンク。
An additional heat sink for an integrated circuit package, which is attached to a heat sink integrally formed in a package body of a semiconductor integrated circuit, the additional heat sink being composed of a plurality of divided bodies, which can be attached by surrounding the heat sink with these divided bodies. -Additional heat sink.
JP9667589U 1989-08-21 1989-08-21 Pending JPH0336146U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9667589U JPH0336146U (en) 1989-08-21 1989-08-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9667589U JPH0336146U (en) 1989-08-21 1989-08-21

Publications (1)

Publication Number Publication Date
JPH0336146U true JPH0336146U (en) 1991-04-09

Family

ID=31645864

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9667589U Pending JPH0336146U (en) 1989-08-21 1989-08-21

Country Status (1)

Country Link
JP (1) JPH0336146U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008173904A (en) * 2007-01-19 2008-07-31 Matsushita Electric Works Ltd Woody plywood

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008173904A (en) * 2007-01-19 2008-07-31 Matsushita Electric Works Ltd Woody plywood

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