JPH0479440U - - Google Patents
Info
- Publication number
- JPH0479440U JPH0479440U JP12300390U JP12300390U JPH0479440U JP H0479440 U JPH0479440 U JP H0479440U JP 12300390 U JP12300390 U JP 12300390U JP 12300390 U JP12300390 U JP 12300390U JP H0479440 U JPH0479440 U JP H0479440U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- mounting
- main body
- heat sink
- metal base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 3
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例を示す半導体素子の
取付装置の分解斜視図、第２図は従来例を示す半
導体素子の取付装置の斜視図である。
１……半導体素子、１ａ……本体、１ｂ……金
属ベース、２……放熱板、３……取付具、３ａ…
…係止部、３ｂ……嵌合穴、３ｃ……取付穴。
FIG. 1 is an exploded perspective view of a semiconductor device mounting device showing an embodiment of the present invention, and FIG. 2 is a perspective view of a semiconductor device mounting device showing a conventional example. DESCRIPTION OF SYMBOLS 1... Semiconductor element, 1a... Main body, 1b... Metal base, 2... Heat sink, 3... Mounting tool, 3a...
...Locking part, 3b... Fitting hole, 3c... Mounting hole.
Claims (1)
半導体素子１を放熱板２に取り付けてなる半導体
素子の取付装置において、半導体素子１の本体１
ａと嵌合する嵌合穴３ｂを略中央部に有し、その
両側をコ字状に立上げその上部端面に前記本体１
ａを係止する複数の係止部３ａを有し、更に他端
両側に半導体素子１の金属ベース１ｂを介して放
熱板２に取り付けるための取付穴３ｃを有する取
付具３を設け、この取付具３を介して半導体素子
１を放熱板２に取り付けてなる半導体素子の取付
装置。 In a semiconductor device mounting device in which a power semiconductor device 1 consisting of a main body 1a and a metal base 1b is attached to a heat sink 2, the main body 1 of the semiconductor device 1 is
It has a fitting hole 3b approximately in the center to be fitted with the main body 1, and its both sides are raised in a U-shape, and the upper end surface of the fitting hole 3b is formed into a U-shape.
A mounting fixture 3 is provided, which has a plurality of locking portions 3a for locking the semiconductor element 1, and has mounting holes 3c on both sides of the other end for mounting the semiconductor element 1 to the heat sink 2 via the metal base 1b. A semiconductor device mounting device that attaches a semiconductor device 1 to a heat sink 2 via a tool 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12300390U JPH0479440U (en) | 1990-11-22 | 1990-11-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12300390U JPH0479440U (en) | 1990-11-22 | 1990-11-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0479440U true JPH0479440U (en) | 1992-07-10 |
Family
ID=31870735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12300390U Pending JPH0479440U (en) | 1990-11-22 | 1990-11-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0479440U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020059010A1 (en) * | 2018-09-18 | 2020-03-26 | 東芝キヤリア株式会社 | Control device, and control device maintenance method |
-
1990
- 1990-11-22 JP JP12300390U patent/JPH0479440U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020059010A1 (en) * | 2018-09-18 | 2020-03-26 | 東芝キヤリア株式会社 | Control device, and control device maintenance method |
| CN112655086A (en) * | 2018-09-18 | 2021-04-13 | 东芝开利株式会社 | Control device and maintenance method for control device |
| JPWO2020059010A1 (en) * | 2018-09-18 | 2021-08-30 | 東芝キヤリア株式会社 | Control device and maintenance method of control device |
| CN112655086B (en) * | 2018-09-18 | 2023-12-26 | 东芝开利株式会社 | Control device and maintenance method for control device |