JPS64339U - - Google Patents
Info
- Publication number
- JPS64339U JPS64339U JP9445987U JP9445987U JPS64339U JP S64339 U JPS64339 U JP S64339U JP 9445987 U JP9445987 U JP 9445987U JP 9445987 U JP9445987 U JP 9445987U JP S64339 U JPS64339 U JP S64339U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- protruding piece
- top surface
- bottom face
- side faces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 3
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案になる半導体素子の冷却構造の
一実施例を示し、組立状態を示す分解斜視図、第
２図は本考案の要部の一実施例であるヒートシン
クの展開図、第３図及び第４図は従来の半導体素
子の冷却構造の組立状態を示す分解斜視図である
。
２……半導体素子、１１……嵌合溝、１２……
ヒートシンク、１３……突出片。
Fig. 1 shows an embodiment of the semiconductor device cooling structure of the present invention, an exploded perspective view showing an assembled state, Fig. 2 is an exploded view of a heat sink which is an embodiment of the main part of the invention, and Fig. 3 shows an exploded perspective view showing an assembled state. FIG. 4 is an exploded perspective view showing an assembled state of a conventional cooling structure for a semiconductor device. 2... Semiconductor element, 11... Fitting groove, 12...
Heat sink, 13... protruding piece.
Claims (1)
と突出片を有する一対の側面とよりなるＵ字状に
折曲形成したヒートシンクの突出片を嵌合させる
ことにより、前記底面と前記半導体素子の上面と
を当接させるようにしたことを特徴とする半導体
素子の冷却構造。 By fitting the protruding piece of the heat sink, which is bent into a U-shape and consists of a bottom face and a pair of side faces each having a protruding piece, into the fitting grooves formed on both side faces of the semiconductor element, the bottom face and the semiconductor element are fitted. 1. A cooling structure for a semiconductor device, characterized in that the top surface of the semiconductor device is brought into contact with the top surface of the semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9445987U JPS64339U (en) | 1987-06-19 | 1987-06-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9445987U JPS64339U (en) | 1987-06-19 | 1987-06-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS64339U true JPS64339U (en) | 1989-01-05 |
Family
ID=30957945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9445987U Pending JPS64339U (en) | 1987-06-19 | 1987-06-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS64339U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03194957A (en) * | 1989-12-21 | 1991-08-26 | Internatl Business Mach Corp <Ibm> | Plastic-chip circuit package, method of reinforcing heat dissipation of electronic part and method of mounting heat-sink-element |
-
1987
- 1987-06-19 JP JP9445987U patent/JPS64339U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03194957A (en) * | 1989-12-21 | 1991-08-26 | Internatl Business Mach Corp <Ibm> | Plastic-chip circuit package, method of reinforcing heat dissipation of electronic part and method of mounting heat-sink-element |