CN112655086A - Control device and maintenance method for control device - Google Patents
Control device and maintenance method for control device Download PDFInfo
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- CN112655086A CN112655086A CN201880097239.1A CN201880097239A CN112655086A CN 112655086 A CN112655086 A CN 112655086A CN 201880097239 A CN201880097239 A CN 201880097239A CN 112655086 A CN112655086 A CN 112655086A
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- 238000012423 maintenance Methods 0.000 title claims description 13
- 238000000034 method Methods 0.000 title claims description 13
- 239000004065 semiconductor Substances 0.000 claims abstract description 149
- 239000000758 substrate Substances 0.000 claims abstract description 57
- 238000003780 insertion Methods 0.000 claims abstract description 24
- 230000037431 insertion Effects 0.000 claims abstract description 24
- 230000002093 peripheral effect Effects 0.000 claims description 31
- 239000000463 material Substances 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims 1
- 239000003507 refrigerant Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The control device (17) is provided with: a semiconductor element (21); a substrate (18) on which a semiconductor element (21) is mounted; a heat sink (24) that is in contact with the upper surface of the semiconductor element (21); a female screw portion (37) formed on the heat sink (24); a fixing member (50) provided between the lower surface of the semiconductor element (21) and the substrate (18); a screw insertion hole (51) formed in a position of the fixing member (50) corresponding to the female screw portion (37); an engaging portion (52) formed on the fixing member (50) and engaged with an engaged portion (32) of the semiconductor element (21); and a screw (33) inserted into the screw insertion hole (51) and screwed into the female screw portion (37).
Description
Technical Field
Embodiments of the present invention relate to a control device and a maintenance method for the control device.
Background
Conventionally, in a control device such as a power supply circuit or an inverter device, heat generated from a semiconductor element mounted on a substrate is radiated by a heat sink formed of an aluminum plate or the like. In such a control device, a heat sink fixing screw inserted into a screw hole of the substrate is screwed into a mounting hole of the heat sink through a slit or a screw hole provided between both ends of the semiconductor element. The mounting holes of the heat sink are spaced from each other by a dimension corresponding to the spacing dimension between the cutouts or screw holes of the semiconductor element. Further, the semiconductor element is fixed to the heat sink by the heat sink fixing screw, and heat can be satisfactorily transmitted between the semiconductor element and the heat sink.
Prior art documents:
patent documents:
patent document 1: international publication No. 2016/162991
Disclosure of Invention
Problems to be solved by the invention
The substrate may be replaced due to a failure or the like. Semiconductor devices tend to be miniaturized year by year, and the gap between the cutouts or the screw holes of the semiconductor devices of the new type is reduced in size. Therefore, when the semiconductor device is replaced, it is necessary to change the heat sink to a heat sink having a size between the mounting holes corresponding to the size. However, since the heat sink is generally fixed to a structural member such as an electrical box, the removal work is troublesome. In addition, a heat sink must be newly manufactured, and the cost increases. Therefore, it is desirable to replace the substrate without replacing the heat sink. Further, if semiconductor elements of different sizes can be mounted on the same heat sink, the number of types of heat sinks can be reduced.
Embodiments of the present invention have been made in view of such circumstances, and an object thereof is to provide a control device and a maintenance method for the control device, in which a substrate on which different semiconductor elements are mounted can be mounted without replacing a heat sink.
Means for solving the problems
A control device according to an embodiment of the present invention includes: a semiconductor element; a substrate on which the semiconductor element is mounted; a heat sink in contact with an upper surface of the semiconductor element; an internal thread portion formed on the heat sink; a fixing member provided between a lower surface of the semiconductor element and the substrate; a screw insertion hole formed in a position of the fixing member corresponding to the internal thread portion; an engaging portion formed on the fixing member and engaged with an engaged portion of the semiconductor element; and a screw inserted into the screw insertion hole and screwed to the internal thread portion.
In the control device according to the embodiment of the present invention, at least two of the female screw portions are provided on the heat sink with a specific distance therebetween, and at least two of the screw insertion holes are provided on the fixing member with the specific distance therebetween.
In the control device according to the embodiment of the present invention, the engaged portion is a notch or a hole for fastening a screw formed in the semiconductor element, and the engaging portion is an upper surface protrusion protruding upward from an upper surface of the fixing member.
In the control device according to the embodiment of the present invention, the engaged portion is a side surface of the semiconductor element, and the engaging portion is a peripheral edge wall portion protruding upward from a peripheral edge of the fixing member.
In the control device according to the embodiment of the present invention, a dimension from the upper surface of the fixing member to the upper end of the peripheral wall portion is smaller than a thickness dimension of the semiconductor element.
In the control device according to the embodiment of the present invention, the fixing member is formed of a flexible material, and an upper end of the peripheral wall portion is in contact with a lower surface of the heat sink when the screw is screwed into the female screw portion.
The control device according to an embodiment of the present invention includes a lower surface protrusion protruding downward from a lower surface of the fixing member.
A control device according to an embodiment of the present invention includes: a peripheral edge wall portion that protrudes upward from a peripheral edge of the fixing member and engages with an engaged portion of the semiconductor element; and a lower surface protrusion portion protruding downward from a lower surface of the fixing member, the lower surface protrusion portion being in contact with an inner surface side of the peripheral wall portion when at least two fixing members are stacked.
A control device according to an embodiment of the present invention includes: a connector to which a wiring for leading out an alternating current converted by the semiconductor element to the outside of the substrate is connected, the semiconductor element being an inverter for converting a direct current into an alternating current; and an opening portion that opens at a position of the fixing member corresponding to the connector.
A control device according to an embodiment of the present invention includes: an electrical enclosure housing the substrate; and a mounting portion formed on the electrical package, to which the heat sink is mounted.
A maintenance method for a control device according to an embodiment of the present invention includes: a step of providing a fixing member between the lower surface of the semiconductor element and the substrate; engaging an engaging portion formed on the fixing member with an engaged portion of the semiconductor element; mounting the semiconductor element on the substrate; a step of bringing an upper surface of the semiconductor element into contact with a heat sink having a female screw portion formed therein; inserting a screw into a screw insertion hole formed in a position of the fixing member corresponding to the female screw portion; and a step of screwing the screw into the internal thread portion.
Drawings
Fig. 1 is a perspective view showing an external appearance of an outdoor unit of an air conditioner.
Fig. 2 is an exploded perspective view showing an outdoor unit.
Fig. 3 is a block diagram showing a control device using a semiconductor element.
Fig. 4 is a sectional view showing the heat sink, the fixing member, and the base plate.
Fig. 5 is a V-V sectional view of fig. 4.
Fig. 6 is a plan view showing the fixing member.
Fig. 7 is a bottom view showing the fixing member.
Fig. 8 is a perspective view showing the fixing member.
Fig. 9 is a side view showing the fixing member.
Fig. 10 is an enlarged sectional view showing the semiconductor element and the fixing member before screw fastening.
Fig. 11 is an enlarged cross-sectional view showing the semiconductor element and the fixing member after screw fastening.
Fig. 12 is a sectional view showing a state in which the fixing members are stacked.
Fig. 13 is a flowchart illustrating a maintenance method of the control device.
Detailed Description
Hereinafter, embodiments of the control device and the maintenance method of the control device will be described in detail with reference to the drawings. The upper side of the paper in fig. 4, 5, 10, and 11 will be described as the upper side of the control device.
The control device of the present embodiment will be described by taking an outdoor controller of an air conditioner including an inverter device for driving a compressor as an example. Reference numeral 1 in fig. 1 denotes an outdoor unit of an air conditioner. The air conditioner includes an outdoor unit 1 installed outdoors and an indoor unit (not shown) installed indoors. The outdoor unit 1 and the indoor units are connected by refrigerant pipes through which a refrigerant circulates. The refrigeration cycle is configured by circulating a refrigerant between the outdoor unit 1 and the indoor units.
As shown in fig. 1, the outdoor unit 1 includes a casing 2 formed in a vertically long box shape. The case 2 has an opening 3 formed in a part of the side surface and the back surface. Two upper and lower air outlets 4 are opened on the front side of the casing 2, and a mesh-like fan screen 5 is provided on the air outlets 4.
As shown in fig. 2, the inside of the casing 2 is divided by a partition plate 6 into a heat exchange chamber 7 and a machine chamber 8. A heat exchanger 9 is provided in the heat exchange chamber 7, and two upper and lower blowers 10 are provided in front of the heat exchanger 9. The air blowers 10 are respectively provided at positions corresponding to the two fan shrouds 5 on the front side of the casing 2.
The blower 10 is composed of a fan motor 11 and a propeller fan 12 attached to a rotation shaft of the fan motor 11. Fan 12 is rotated by driving fan motor 11. Then, air flows in from the opening 3 of the casing 2, heat is exchanged between the air and the refrigerant flowing through the inside of the heat exchanger 9, and the air after the heat exchange is blown out from the outlet 4 to which the fan guard 5 is attached.
The machine room 8 is provided with a compressor 13 for compressing a gaseous refrigerant, an accumulator 14 for storing a liquid refrigerant, and a four-way valve 15 for switching the flow of the refrigerant in the refrigerant pipe. In addition, an electrical box 16 is provided in the machine room 8. The electrical equipment box 16 houses a control device 17, and the control device 17 is an outdoor controller including an inverter device for supplying electric power to and controlling various devices such as the fan motor 11 and the compressor 13. The inverter device is a device that converts direct current into alternating current.
As shown in fig. 4 and 5, a printed circuit board 18 (hereinafter, referred to as a substrate 18) constituting the control device 17 is housed inside a case 26 of the electrical enclosure 16. A semiconductor element 21 as an electronic component is mounted on the substrate 18. A plurality of semiconductor elements 21 and various electric and/or electronic components are mounted on the substrate 18. These components constitute a control circuit for controlling the fan motor 11 and the compressor 13.
Next, a circuit configuration of the control device 17 will be described with reference to a block diagram shown in fig. 3. The circuit of the control device 17 includes, as heat generating elements: a first semiconductor element 21A which is a switching element IGBT constituting a power factor correction circuit; a second semiconductor device 21B which is a three-phase Inverter (IPM) connected to the compressor 13; a third semiconductor device 21C, which is a three-phase Inverter (IPM) connected to one fan motor 11; a fourth semiconductor device 21D which is a three-phase Inverter (IPM) connected to the other fan motor 11; a fifth semiconductor element 21E which is a full-wave rectifier circuit connected to the ac power supply 22; and a sixth semiconductor element 21F which is a full-wave rectifier circuit connected to the ac power supply 22. Hereinafter, the first to sixth semiconductor elements 21A to 21F may be collectively referred to as the semiconductor element 21.
In the first semiconductor element 21A, only a single element of the IGBT is housed in the package. In the second to fourth semiconductor devices 21B to 21d (ipm), switching elements such as 6 IGBTs constituting the inverter and circuits for driving the switching elements are housed in one package.
Of these semiconductor devices 21, the device having the largest amount of heat generation is the second semiconductor device 21B which switches a large current for driving the compressor 13 by PWM (Pulse Width Modulation).
Further, a control unit 23 is provided, and the control unit 23 is connected to the first semiconductor element 21A, the second semiconductor element 21B, the third semiconductor element 21C, and the fourth semiconductor element 21D, respectively, and controls the operation of each element. The controller 23 controls the switching of the respective elements to drive the compressor 13 and the 2 fan motors 11 at variable speeds. The control unit 23 is constituted by a microcomputer and its peripheral circuits, and these circuits and elements are also mounted on the substrate 18.
The fifth semiconductor element 21E and the sixth semiconductor element 21F are connected to an ac power supply 22 via an inductor 20. The dc current rectified by the sixth semiconductor device 21F is supplied to the second semiconductor device 21B, the third semiconductor device 21C, and the fourth semiconductor device 21D via the capacitor 19.
The first semiconductor element 21A constitutes a power factor correction circuit (high power factor circuit) that is turned on/off one or more times at a specific timing of a half-wave of a sine wave of the ac power supply 22, thereby bringing the current from the ac power supply 22 close to the sine wave and improving the power factor. Since the first semiconductor element 21A needs to be turned on/off in both the positive half-wave and the negative half-wave, the input from the ac power supply 22 is rectified by a full-wave rectifier circuit of the fifth semiconductor element 21E provided on the input side thereof.
As shown in fig. 4 and 5, the housing 26 of the electrical enclosure 16 is formed of sheet metal. The electrical box 16 is provided with a heat sink 24 for cooling the mounted semiconductor element 21. The heat sink 24 is mounted on a mounting portion 27, and the mounting portion 27 is formed on a case 26 of the electrical box 16 formed of a sheet metal or the like.
The mounting portion 27 is an opening portion through which the heat sink 24 protrudes from the inside to the outside of the case 26. A retaining piece 28 for retaining the heat sink 24 to the case 26 is provided at an edge portion of the mounting portion 27. Further, the length and width dimensions of the mounting portion 27 are formed to match those of the heat sink 24. That is, the heat sink 24 and the holding piece 28 are fixed in a watertight manner by a connecting member such as a screw, not shown, so that water droplets do not enter the inside of the case 26 from the outside.
The substrate 18 to which various electric and electronic components are soldered is fixed to a predetermined portion of the case 26. The semiconductor element 21 mounted on the substrate 18 includes a package 29 for housing a semiconductor chip. A plurality of terminals 30 protruding from the side surface of the package 29 are soldered to the substrate 18. The package 29 has a rectangular flat plate shape in plan view (see fig. 6). Terminals 30 are provided on two longitudinal side surfaces of the four side surfaces of the package 29, and cutout portions 32 are formed on two width side surfaces 31, and the cutout portions 32 are used to fix the semiconductor element 21 to the heat sink 24 with screws.
In the present embodiment, the fixing member 50 is provided between the lower surface of the semiconductor element 21 and the upper surface of the substrate 18. The semiconductor element 21 is mounted on the heat sink 24 by 2 screws 33 via the fixing member 50. Therefore, the cutout portion 32 for screw fastening provided in the semiconductor element 21 described above is not used for screw fastening. Each screw 33 is provided with a washer 34 for hooking a screw head on a lower surface of the fixing member 50. The fixing member 50 is formed of a flexible material such as a synthetic resin. In this way, the manufacturability of the fixing member 50 can be improved.
The lower surface of the base 35 of the heat sink 24 is in close contact with the upper surface of the semiconductor element 21 fixed by the screws 33. The heat sink 24 is provided with a plurality of fins 25 projecting to the outside of the case 26. The heat sink 24 is made of metal having high thermal conductivity such as aluminum. The heat generated from the semiconductor element 21 is released to the outside by the heat sink 24, and the temperature of the semiconductor element 21 is prevented from rising. The shape and size of the fins 25 are set to a protruding size that does not interfere with other structural members 36 constituting the outdoor unit 1, for example, the casing 2 on the rear surface side of the outdoor unit 1. That is, the shape and the protruding size of the fins 25 are set according to the structure of the outdoor unit 1.
As shown in fig. 5, two female screw portions 37 provided at a predetermined distance L1 are formed in the heat sink 24. The screw 33 is screwed into the female screw portion 37. The female screw 37 penetrates the base 35 of the heat sink 24 in the vertical direction. Further, since the female screw portion 37 of the heat sink 24 penetrates to the outside, it is necessary to reliably seal with the screw 33 so as not to allow rainwater to enter the case 26.
The two female screw portions 37 are provided for each semiconductor element 21. That is, in the case where a plurality of semiconductor elements 21 are provided, the heat sink 24 is formed with the female screw portions 37 twice as many as the semiconductor elements 21.
Two large-opening holes 38 having opening dimensions larger than those of the screw head of the screw 33 and the washer 34 penetrate the base plate 18. These large-opening holes 38 are provided at positions corresponding to the female screw portions 37 of the heat sink 24, respectively.
On the upper surface of the substrate 18, minute electronic components 39 such as resistors are provided in addition to the semiconductor elements 21. Further, a connector 40 is provided on the lower surface of the substrate 18, and the connector 40 outputs alternating current converted by the semiconductor element 21 as an inverter device. The connector 40 is provided corresponding to the mounting position of the semiconductor element 21. A terminal 42 of a wiring 41 for leading the ac converted by the semiconductor element 21 to the outside of the substrate 18 is connected to the connector 40. When a plurality of semiconductor elements 21 are mounted on the substrate 18, the connectors 40 are not provided at all the positions of the semiconductor elements 21, and there are some semiconductor elements 21 where the connectors 40 are not provided.
As shown in fig. 6 to 9, the fixing member 50 is formed in a rectangular (rectangular) flat plate shape in a plan view. At least two screw insertion holes 51 provided with a specific distance L2 therebetween are formed in the fixing member 50. The specific distance L2 between the two screw insertion holes 51 of the fixing member 50 is the same as the specific distance L1 between the two female screw portions 37 of the heat sink 24 (see fig. 5). That is, the screw insertion hole 51 is provided at a position corresponding to the female screw portion 37. The screw 33 is inserted into the screw insertion hole 51 from the lower surface side of the fixing member 50, and is screwed with the female screw portion 37 of the heat sink 24.
The cutout portion 32 of the semiconductor element 21 has a shape obtained by cutting the side surface 31 in the width direction of the semiconductor element 21 into a semicircular shape. The distance L3 between the two cutout portions 32 is shorter than the predetermined distances L1 and L2. The original purpose of the notch 32 is to fix the semiconductor element 21 to the heat sink 24 by inserting a screw 33 into the notch 32. The specific distance L1 between the female screw portions 37 of the heat sink 24 and the distance L3 between the cutout portions 32 are substantially equal to each other.
However, since semiconductor elements 21 are miniaturized year by year, a distance L3 between cutout portions 32 of new semiconductor element 21 becomes smaller than a distance L3 between cutout portions 32 of old semiconductor element 21. That is, the spacing distance L3 between the cutout portions 32 of the new semiconductor element 21 and the specific distance L1 between the internal thread portions 37 of the heat sink 24 do not coincide. When the substrate 18 or the old type semiconductor element 21 is broken due to long-term use and the outdoor unit 1 needs to be repaired, it may be difficult to obtain the old type semiconductor element 21. In this case, the substrate 18 is newly manufactured using the new semiconductor element 21.
Here, the heat sink 24 fitted to the old semiconductor element 21 has a problem that the female screw portion 37 is not fitted to the notch portion 32 of the new semiconductor element 21 and cannot be mounted. Further, it is easy to newly manufacture the substrate 18 in order to incorporate the new semiconductor element 21, but it takes time to newly manufacture the heat sink 24. In particular, the heat sink 24 is fixed to the casing 26 of the electrical box 16, the casing 26 is fixed to the casing 2 of the outdoor unit 1, and when the original heat sink 24 is removed and a new heat sink 24 is attached, many parts of the outdoor unit 1 need to be disassembled and assembled, which is a time-consuming and labor-consuming operation. Further, the heat sink 24 and the case 26 of the electrical component box 16 need to be watertight, and a very troublesome work is required to rivet the joint surface of both.
Therefore, in the present embodiment, the small-sized new semiconductor element 21 is mounted on the heat sink 24 manufactured in accordance with the old semiconductor element 21 by using the fixing member 50. Thus, the substrate 18 on which the new semiconductor element 21 is mounted can be replaced without replacing the heat sink 24. Further, since the fixing member 50 is formed of synthetic resin, it can be easily newly manufactured in accordance with the size and shape of the new semiconductor element 21.
As shown in fig. 6 and 9, the fixing member 50 has a frame shape as a whole, and includes two upper surface protrusions 52 protruding upward from the upper surface thereof. These upper surface protrusions 52 are formed in a cylindrical shape having a cutout in a part thereof in a plan view. Each upper surface protrusion 52 engages with the notch 32 of the package 29 of the semiconductor element 21. That is, the notch 32 serves as an engaged portion, and the upper surface protrusion 52 serving as an engaging portion is engaged with the engaged portion.
In this way, since upper surface protrusions 52 of fixing member 50 are engaged with notches 32 of semiconductor element 21, semiconductor element 21 can be positioned. The semiconductor element 21 does not wobble in the lateral direction (left-right direction on the paper of fig. 6) and the longitudinal direction (up-down direction on the paper of fig. 6).
The cylindrical shape of the upper surface protrusion 52 may be narrowed as it moves upward. Thus, when semiconductor element 21 is mounted on fixing member 50 from above, upper surface protruding portion 52 is easily engaged with notch portion 32.
When the screw 33 is inserted into the screw insertion hole 51, a gap is provided between the screw 33 and the notch 32 of the semiconductor element 21. That is, the screw 33 does not engage with the notch 32 of the semiconductor element 21. In this way, the semiconductor element 21 can be positioned without being affected by the position of the screw 33 (female screw portion 37).
The fixing member 50 includes two peripheral edge wall portions 53 projecting upward from the peripheral edge. These peripheral wall portions 53 are provided corresponding to the two side surfaces 31 where the terminals 30 of the semiconductor element 21 are not provided. Each of the peripheral wall portions 53 is formed in a U shape in plan view, and an end thereof engages with the side surface 31 of the package 29 of the semiconductor element 21. That is, the side surface 31 of the semiconductor element 21 of the present embodiment is an engaged portion to which the peripheral wall portion 53 as an engaging portion is engaged.
In this way, since peripheral edge wall portion 53 of fixing member 50 is engaged with side surface 31 of semiconductor element 21, semiconductor element 21 can be positioned. The semiconductor element 21 does not wobble in the lateral direction (the left-right direction of the paper of fig. 6). The semiconductor element 21 can be fixed by the peripheral wall portion 53 without shaking. The protruding dimension of the peripheral wall 53 is larger than the protruding dimension of the upper surface protrusion 52.
As shown in fig. 7 and 8, the fixing member 50 includes four lower surface protrusions 54 protruding downward from the lower surface thereof. The lower surface protrusions 54 are provided at four corners of the lower surface of the fixing member 50. These lower surface protrusions 54 contact the upper surface of the substrate 18. Since a space is provided between the lower surface of the fixing member 50 and the upper surface of the substrate 18 in this way, the fixing member 50 does not interfere with the fine electronic component 39 provided on the substrate 18 (see fig. 5).
The lower surface of the fixing member 50 is provided with two washer surfaces 55 for engaging the screw head of the screw 33 and the washer 34. These washer surfaces 55 are provided at a position higher than the other portions of the lower surface of the fixing member 50. In this way, the head of the screw 33 does not interfere with the tiny electronic component 39 provided on the substrate 18.
As shown in fig. 6, an opening 56 is opened in the center of the fixing member 50, and the opening 56 is formed in a square shape (rectangular shape) in a plan view. The opening 56 is provided at a position corresponding to the connector 40. Thus, the fixing member 50 can not interfere with the connector 40 to which a high voltage is applied. Further, the fixing member 50 may be formed using a general-purpose resin material. That is, since a distance can be separated from the high voltage part, a high tracking resistance material is not used, and the fixing member 50 can be manufactured at low cost.
As shown in fig. 10, before the fixing member 50 is fastened to the heat sink 24 with the screws 33, a projection dimension T1 from the upper surface of the fixing member 50 to the upper end of the peripheral wall portion 53 is smaller than a thickness dimension T2 of the semiconductor element 21. That is, the fixing member 50 is formed by providing a difference D (negative error) between the projection dimension T1 of the peripheral edge wall portion 53 and the thickness dimension T2 of the semiconductor element 21. Thus, the upper surface of the semiconductor element 21 can be brought into close contact with the lower surface of the heat sink 24.
As shown in fig. 11, after the fixing member 50 is fastened to the heat sink 24 with the screws 33, the upper end of the peripheral wall portion 53 contacts the lower surface of the heat sink 24. That is, when the screw 33 is screwed into the female screw portion 37 of the heat sink 24, the fixing member 50 is warped by the fastening force, and the upper end of the peripheral edge wall portion 53 comes into contact with the lower surface of the heat sink 24. Further, even if the screw 33 is tightened, the upper end of the peripheral wall portion 53 contacts the lower surface of the heat sink 24, and therefore, the load applied to the fixing member 50 can be suppressed.
As shown in fig. 12, when the fixing member 50 is transported as a component, the component is packaged in a state where a plurality of fixing members 50 are stacked. Here, the fixing member 50 is provided at a position where the lower surface protrusion 54 abuts the inner surface side of the peripheral wall portion 53 of the lower stage when a plurality of fixing members 50 are stacked up and down. Thus, the fixing members 50 do not shake in the lateral direction (the left-right direction of the paper surface in fig. 12) during the conveyance.
As shown in fig. 5, in the present embodiment, since the screw insertion holes 51 of the fixing member 50 correspond to the female screw portions 37 of the heat sink 24, the semiconductor element 21 can be fixed to the heat sink 24 regardless of the shape of the novel semiconductor element 21.
Further, the screws 33 are screwed to close the female screw portions 37 formed at a plurality of places of the heat sink 24. Therefore, water droplets do not enter the interior of the housing 26 from these female screw portions 37. In addition, only the number of female screw portions 37 corresponding to the number of semiconductor elements 21 to be mounted is formed in the heat sink 24. Therefore, all the female screw portions 37 are closed by the screws 33.
In addition, in the case of a newly manufactured heat sink 24, the shape and size of the fins 25 must not interfere with the other structural members 36, and the manufacturing thereof is troublesome. In the present embodiment, the substrate 18 can be replaced with the heat sink 24 attached to the attachment portion 27 of the electrical box 16, and therefore, the heat sink 24 does not need to be newly manufactured. That is, the old heat sink 24 may be reused.
Further, since the fixing member 50 is not fixed to the substrate 18, it is not necessary to strictly perform size management of the fixing member 50. Therefore, the manufacturability of the fixing member 50 can be improved.
Next, a maintenance method of the control device 17 will be described with reference to a flowchart (process diagram) of fig. 13. Fig. 4 to 11 are appropriately referred to. Steps S11 to S13 in fig. 13 are a method for manufacturing the substrate 18, and steps S14 and thereafter are a method for replacing the control device 17, and these steps are combined to describe a method for maintaining the control device 17.
First, in step S11, when manufacturing a new substrate 18 for maintenance, the manufacturer mounts the fixing member 50 as a temporary fixing on the new substrate 18. For example, a pin of a predetermined jig is inserted into the wide hole 38 from the lower side of the new substrate 18, and the pin of the jig is inserted into the screw insertion hole 51 of the fixing member 50. Thus, the fixing member 50 is positioned by the pin of the jig.
In the next step S12, the manufacturer places the new semiconductor device 21 on the upper surface of the fixing member 50. Here, upper surface protruding portion 52 as an engaging portion of fixing member 50 is engaged with notch portion 32 as an engaged portion of semiconductor element 21. Further, the peripheral wall portion 53 as an engaging portion of the fixing member 50 is engaged with the side surface 31 as an engaged portion of the semiconductor element 21.
In next step S13, the manufacturer mounts the semiconductor element 21 on a new substrate 18. That is, the terminals 30 of the semiconductor element 21 are soldered to the substrate 18. After the soldering, a predetermined jig is removed from the new substrate 18.
In the next step S14, the operator starts the maintenance operation of the outdoor unit 1. Here, the worker detaches the old substrate 18 from the electrical box 16. The fixing member 50 is not provided on the old substrate 18, and the semiconductor element 21 is directly screwed to the heat sink 24 through the cutout 32. Therefore, the screws 33 fixing the semiconductor element 21 are first removed. Then, the old substrate 18 is detached. Further, the heat sink 24 is still attached to the electrical box 16.
In the next step S15, the operator stores a new substrate 18 for maintenance in the electrical component box 16. That is, a new substrate 18 is mounted to the electrical enclosure 16.
In next step S16, the worker mounts the new board 18 on the electrical box 16, and brings the upper surface of the semiconductor element 21 into contact with the lower surface of the heat sink 24.
In the next step S17, the operator inserts the screw 33 from the lower side of the new board 18 through the wide hole 38. Then, the screw 33 is inserted into the screw insertion hole 51 of the fixing member 50.
In the next step S18, the worker screws the screw 33 inserted into the screw insertion hole 51 into the female screw portion 37 of the heat sink 24. Then, the maintenance work of the outdoor unit 1 is finished.
In the flowchart of the present embodiment, the series execution of the steps is exemplified, but the context of the steps is not necessarily fixed, and the context of some of the steps may be reversed. In addition, some steps may be performed in parallel with other steps.
In the present embodiment, the two female screw portions 37 are formed in the heat sink 24, and the two screw insertion holes 51 are formed in the fixing member 50, but other forms are also possible. For example, in the case where two female screw portions 37 are provided in the heat sink 24, one screw insertion hole 51 may be formed in the fixing member 50. Further, the screw 33 may be inserted into one screw insertion hole 51 of the fixing member 50 to fix one end of the semiconductor element 21, and the screw 33 may be inserted into the cutout portion 32 at the other end of the semiconductor element 21 to fix the other end. That is, at least one screw insertion hole 51 may be provided in the fixing member 50 separately from the cutout portion 32 of the semiconductor element 21.
In addition, according to the semiconductor element 21, holes for fastening screws may be provided at both ends in the longitudinal direction instead of the cutout portions 32 of the side surface 31. In this case, a hole for fastening a screw may be used as the engaged portion. When the holes for fastening screws at both ends of the semiconductor element 21 are used as the engaged portions, the holes are not used for fastening screws.
According to the embodiments described above, by providing the fixing member provided between the lower surface of the semiconductor element and the substrate, it is possible to mount the substrate on which a different semiconductor element is mounted without replacing the heat sink. In addition, according to the present embodiment, not only the repair member but also a substrate on which semiconductor elements of different sizes are mounted on the same heat sink can be used in combination in the manufacturing stage.
Several embodiments of the present invention have been described, but these embodiments are presented as examples and are not intended to limit the scope of the invention. These embodiments may be implemented in various other ways, and various omissions, substitutions, and changes may be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and spirit of the invention, and are also included in the invention described in the claims and equivalents thereof.
Description of reference numerals
1 … outdoor unit, 2 … casing, 3 … opening, 16 … electric box, 17 … control device, 18 … substrate (printed circuit board), 21(21A to 21F) … semiconductor element, 23 … control unit, 24 … heat sink, 25 … tab, 26 … electric box casing, 27 … mounting unit, 28 … holding piece, 29 … package, 30 … terminal, 31 … side (engaged unit), 32 … notch (engaged unit), 33 … screw, 37 … female screw unit, 40 … connector, 50 … fixing member, 51 … screw insertion hole, 52 … upper surface protrusion, 53 … peripheral edge wall, 54 … lower surface protrusion, 55 … washer surface, 56 … opening, D … difference, L1, L2 … specific distance, L3 … spacing distance, T1 … protrusion size, and T2 … thickness size.
Claims (11)
1. A control device is provided with:
a semiconductor element;
a substrate on which the semiconductor element is mounted;
a heat sink in contact with an upper surface of the semiconductor element;
an internal thread portion formed on the heat sink;
a fixing member provided between a lower surface of the semiconductor element and the substrate;
a screw insertion hole formed in a position of the fixing member corresponding to the internal thread portion;
an engaging portion formed on the fixing member and engaged with an engaged portion of the semiconductor element; and
and a screw inserted through the screw insertion hole and screwed to the female screw portion.
2. The control device according to claim 1, wherein at least two of the internal screw portions are provided on the heat sink at a specific distance, and at least two of the screw insertion holes are provided on the fixing member at the specific distance.
3. The control device according to claim 1, wherein the engaged portion is a notch portion or a hole for screw fastening formed in the semiconductor element, and the engaging portion is an upper surface protrusion portion protruding upward from an upper surface of the fixing member.
4. The control device according to claim 1, wherein the engaged portion is a side surface of the semiconductor element, and the engaging portion is a peripheral edge wall portion protruding upward from a peripheral edge of the fixing member.
5. The control device according to claim 4, wherein a dimension from an upper surface of the fixing member to an upper end of the peripheral wall portion is smaller than a thickness dimension of the semiconductor element.
6. The control device according to claim 4, wherein the fixing member is formed of a material having flexibility, and an upper end of the peripheral wall portion is in contact with a lower surface of the heat sink when the screw is screwed into the female screw portion.
7. The control device according to claim 1, wherein a lower surface protrusion portion protruding downward from a lower surface of the fixing member is provided.
8. The control device according to claim 1, comprising:
a peripheral edge wall portion that protrudes upward from a peripheral edge of the fixing member and engages with an engaged portion of the semiconductor element; and
a lower surface protrusion protruding downward from a lower surface of the fixing member,
the lower surface protrusion is in contact with an inner surface side of the peripheral wall portion when at least two of the fixing members are stacked.
9. The control device according to claim 1, comprising:
a connector to which a wiring for leading out an alternating current converted by the semiconductor element as an inverter for converting a direct current into an alternating current to the outside of the substrate is connected; and
an opening portion that opens at a position of the fixing member corresponding to the connector.
10. The control device according to claim 1, comprising:
an electrical enclosure housing the substrate; and
and an installation part formed at the electrical package and installed with the heat sink.
11. A maintenance method for a control device, comprising:
a step of providing a fixing member between the lower surface of the semiconductor element and the substrate;
engaging an engaging portion formed on the fixing member with an engaged portion of the semiconductor element;
mounting the semiconductor element on the substrate;
a step of bringing an upper surface of the semiconductor element into contact with a heat sink having a female screw portion formed therein;
inserting a screw into a screw insertion hole formed in a position of the fixing member corresponding to the internal thread portion; and
and screwing the screw into the internal thread portion.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2018/034415 WO2020059010A1 (en) | 2018-09-18 | 2018-09-18 | Control device, and control device maintenance method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112655086A true CN112655086A (en) | 2021-04-13 |
| CN112655086B CN112655086B (en) | 2023-12-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880097239.1A Active CN112655086B (en) | 2018-09-18 | 2018-09-18 | Control device and maintenance method for control device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7072076B2 (en) |
| CN (1) | CN112655086B (en) |
| WO (1) | WO2020059010A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7438434B1 (en) | 2023-06-27 | 2024-02-26 | 日立ジョンソンコントロールズ空調株式会社 | Air conditioner circuit structure and air conditioner |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0479440U (en) * | 1990-11-22 | 1992-07-10 | ||
| EP1338711A1 (en) * | 2002-02-26 | 2003-08-27 | fischerwerke Artur Fischer GmbH & Co. KG | Device for fastening an object to a wall |
| CN1969448A (en) * | 2004-06-24 | 2007-05-23 | 株式会社安川电机 | Motor controller |
| JP2009026871A (en) * | 2007-07-18 | 2009-02-05 | Denso Corp | Method of manufacturing electronic device |
| JP2013089784A (en) * | 2011-10-19 | 2013-05-13 | Hitachi Ltd | Semiconductor device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3806588B2 (en) | 2000-08-29 | 2006-08-09 | 株式会社ケンウッド | Assembly structure of electronic parts and radiator |
| JP2008004869A (en) | 2006-06-26 | 2008-01-10 | Daikin Ind Ltd | Electrical component |
| JPWO2016162991A1 (en) | 2015-04-08 | 2017-08-24 | 三菱電機株式会社 | Semiconductor device and manufacturing method of semiconductor device |
| JP6501925B2 (en) | 2016-02-12 | 2019-04-17 | 東芝キヤリア株式会社 | Radiator and method of assembling the same |
-
2018
- 2018-09-18 WO PCT/JP2018/034415 patent/WO2020059010A1/en active Application Filing
- 2018-09-18 JP JP2020547491A patent/JP7072076B2/en active Active
- 2018-09-18 CN CN201880097239.1A patent/CN112655086B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0479440U (en) * | 1990-11-22 | 1992-07-10 | ||
| EP1338711A1 (en) * | 2002-02-26 | 2003-08-27 | fischerwerke Artur Fischer GmbH & Co. KG | Device for fastening an object to a wall |
| CN1969448A (en) * | 2004-06-24 | 2007-05-23 | 株式会社安川电机 | Motor controller |
| JP2009026871A (en) * | 2007-07-18 | 2009-02-05 | Denso Corp | Method of manufacturing electronic device |
| JP2013089784A (en) * | 2011-10-19 | 2013-05-13 | Hitachi Ltd | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020059010A1 (en) | 2020-03-26 |
| JP7072076B2 (en) | 2022-05-19 |
| JPWO2020059010A1 (en) | 2021-08-30 |
| CN112655086B (en) | 2023-12-26 |
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