JP3806588B2 - Assembly structure of electronic parts and radiator - Google Patents

Assembly structure of electronic parts and radiator Download PDF

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Publication number
JP3806588B2
JP3806588B2 JP2000258359A JP2000258359A JP3806588B2 JP 3806588 B2 JP3806588 B2 JP 3806588B2 JP 2000258359 A JP2000258359 A JP 2000258359A JP 2000258359 A JP2000258359 A JP 2000258359A JP 3806588 B2 JP3806588 B2 JP 3806588B2
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JP
Japan
Prior art keywords
radiator
power
bracket
assembly structure
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000258359A
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Japanese (ja)
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JP2002076221A (en
Inventor
友之 前田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kenwood KK
Original Assignee
Kenwood KK
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Filing date
Publication date
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Priority to JP2000258359A priority Critical patent/JP3806588B2/en
Publication of JP2002076221A publication Critical patent/JP2002076221A/en
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Publication of JP3806588B2 publication Critical patent/JP3806588B2/en
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Description

【０００１】
【発明の属する技術分野】
この発明はパワーＩＣ等の電子部品と放熱器との組付け構造に係わり、特に、締め付けトルクの管理が容易な電子部品と放熱器との組付け構造に関する。
【０００２】
【従来の技術】
従来の車載用音響機器等に用いられるパワーＩＣと放熱器との組付け構造の例を図５および図６に示す。図に示すパワーＩＣ７の穴を挿通したビス８、８が放熱器６に設けられたねじ穴にねじ込まれパワーＩＣ７が放熱器６に締着される。
【０００３】
【発明が解決しようとする課題】
上記した従来のパワーＩＣと放熱器との組付け構造では、ビス８の締付け力が直接パワーＩＣ７に掛かり、その荷重が制限されないため、パワーＩＣに過負荷がかかり割れることがあった。
【０００４】
この発明は上記した点に鑑みてなされたものであって、その目的とするところは、電子部品にかかる荷重が制限され、電子部品が破壊される恐れのない電子部品と放熱器との組付け構造を提供することにある。
【０００５】
【課題を解決するための手段】
この発明の電子部品と放熱器との組付け構造放は、熱器とブラケットにより電子部品を挟んだ状態で前記ブラケットに僅かな隙間を介して放熱器に近接する少なくとも２箇所の近接部を生じるように構成し、前記近接部をねじで前記放熱器に締着したものである。
【０００７】
さらに、前記電子部品と放熱器との組付け構造において、前記放熱器にブラケットの位置決めボスを形成し、前記位置決めボスと前記ブラケットの穴または凹部とを係合させたものである。
【０００８】
【発明の実施の形態】
この発明の実施例であるパワーＩＣと放熱器との組付け構造を図面に基づいて説明する。図１はこの発明の第１の実施例であるパワーＩＣと放熱器との組付け構造を示す平面図、図２は同パワーＩＣと放熱器との組付け構造を示す側面図である。なお、図１において、図２に示したナット９は図示していない。
【０００９】
図に示すブラケット３には底面の両端から前方に突出したフランジ３ａ、３ａが形成されている。ブラケット３の底面と放熱器２の間にパワーＩＣ１を挟むとフランジ３ａ、３ａと放熱器２の間に僅かな隙間が生じる。
【００１０】
このときパワーＩＣ１の凹み１ａ、１ａに放熱器２の位置決めボス２ａ、２ａが係合し、ブラケット３の穴３ｂ、３ｂに放熱器２の位置決めボス２ｂ、２ｂが係合して放熱器２、パワーＩＣ１およびブラケット３の相互の位置決めがなされる。
【００１１】
そして、ビス８、８を放熱器２およびブラケット３の穴を挿通させナット９と螺合させて締付けることによりパワーＩＣ１がブラケット３を介して放熱器２に締着される。ビス８とナット９との締付け力が大きくてもブラケット３のフランジ３ａが放熱器２に圧接された後はパワーＩＣ１に加わる圧力は増大せず、パワーＩＣ１に過負荷が加わることはない。
【００１２】
図３はこの発明の第２の実施例であるパワーＩＣと放熱器との組付け構造を示す平面図、図４は同パワーＩＣと放熱器との組付け構造を示す側面図である。なお、図３において、図４に示したナット９は図示していない。
【００１３】
図に示すブラケット５には底面の両端から前方に突出したフランジ５ａ、５ａが形成されている。ブラケット５の底面と放熱器４の間にパワーＩＣ１を挟むとフランジ５ａ、５ａと放熱器４の間に僅かな隙間が生じる。
【００１４】
このときパワーＩＣ１の凹み１ａ、１ａとブラケット５の穴５ｂ、５ｂに放熱器４の位置決めボス４ａ、４ａが係合して放熱器４、パワーＩＣ１およびブラケット５の相互の位置決めがなされる。そして、ビス８、８を放熱器４およびブラケット５の穴を挿通させてナット９と螺合させて締付けることによりパワーＩＣ１がブラケット５を介して放熱器４に締着される。ビス８とナット９との締付け力が大きくてもブラケット５のフランジ５ａが放熱器４に圧接された後はパワーＩＣ１に加わる圧力は増大せず、パワーＩＣ１に過負荷が加わることはない。
【００１５】
【発明の効果】
この発明の電子部品と放熱器との組付け構造によれば、電子部品を放熱器に締着するときのトルク管理が簡単であり、しかも、電子部品に過負荷が加わる恐れがない。
【図面の簡単な説明】
【図１】この発明の第１の実施例であるパワーＩＣと放熱器との組付け構造を示す平面図である。
【図２】同パワーＩＣと放熱器との組付け構造を示す側面図である。
【図３】この発明の第２の実施例であるパワーＩＣと放熱器との組付け構造を示す平面図である。
【図４】同パワーＩＣと放熱器との組付け構造を示す側面図である。
【図５】従来のパワーＩＣと放熱器との組付け構造の例を示す平面図である。
【図６】同パワーＩＣと放熱器との組付け構造を示す側面図である。
【符号の説明】
１ パワーＩＣ、１ａ 凹み
２ 放熱器、２ａ，２ｂ 位置決めボス
３ ブラケット、３ａ フランジ、３ｂ 穴
４ 放熱器、４ａ 位置決めボス
５ ブラケット、５ａ フランジ、５ｂ 穴
６ 放熱器
７ パワーＩＣ
８ ビス
９ ナット[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a structure for assembling an electronic component such as a power IC and a radiator, and more particularly, to a structure for assembling an electronic component and a radiator for which tightening torque can be easily managed.
[0002]
[Prior art]
An example of an assembly structure of a power IC and a radiator used in a conventional vehicle-mounted acoustic device is shown in FIGS. Screws 8 and 8 inserted through the holes of the power IC 7 shown in the figure are screwed into screw holes provided in the radiator 6, and the power IC 7 is fastened to the radiator 6.
[0003]
[Problems to be solved by the invention]
In the assembly structure of the conventional power IC and radiator described above, the tightening force of the screw 8 is directly applied to the power IC 7 and the load is not limited. Therefore, the power IC may be overloaded and cracked.
[0004]
The present invention has been made in view of the above points, and an object of the present invention is to assemble an electronic component and a radiator that limit the load applied to the electronic component and does not cause the electronic component to be destroyed. To provide a structure.
[0005]
[Means for Solving the Problems]
The assembly structure of the electronic component and the radiator according to the present invention results in at least two proximity portions that are close to the radiator via a slight gap in the bracket with the electronic component sandwiched between the heater and the bracket. The proximity portion is fastened to the radiator with screws.
[0007]
Further, the assembling structure of the front Symbol electronic components and the radiator, the form the positioning bosses of the bracket to the radiator, in which is engaged a hole or recess of the bracket and the positioning boss.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
An assembly structure of a power IC and a radiator which is an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing an assembly structure of a power IC and a radiator according to the first embodiment of the present invention, and FIG. 2 is a side view showing an assembly structure of the power IC and the radiator. In FIG. 1, the nut 9 shown in FIG. 2 is not shown.
[0009]
The bracket 3 shown in the figure is formed with flanges 3a and 3a protruding forward from both ends of the bottom surface. When the power IC 1 is sandwiched between the bottom surface of the bracket 3 and the radiator 2, a slight gap is generated between the flanges 3 a and 3 a and the radiator 2.
[0010]
Recess 1a at this time power IC1, 1a to the radiator 2 positioning bosses 2a, 2a are engaged, hole 3b, 3 b into the radiator 2 the positioning bosses 2b of the bracket 3, 2b are engaged with the radiator 2 The power IC 1 and the bracket 3 are positioned relative to each other.
[0011]
The screws 8 and 8 are inserted into the holes of the radiator 2 and the bracket 3 and screwed into the nut 9 to be tightened, whereby the power IC 1 is fastened to the radiator 2 via the bracket 3. Even if the tightening force between the screw 8 and the nut 9 is large, the pressure applied to the power IC 1 does not increase after the flange 3 a of the bracket 3 is pressed against the radiator 2, so that no overload is applied to the power IC 1.
[0012]
FIG. 3 is a plan view showing an assembly structure of a power IC and a radiator according to a second embodiment of the present invention, and FIG. 4 is a side view showing an assembly structure of the power IC and the radiator. In FIG. 3, the nut 9 shown in FIG. 4 is not shown.
[0013]
The bracket 5 shown in the figure is formed with flanges 5a and 5a protruding forward from both ends of the bottom surface. When the power IC 1 is sandwiched between the bottom surface of the bracket 5 and the radiator 4, a slight gap is generated between the flanges 5 a and 5 a and the radiator 4.
[0014]
At this time, the positioning bosses 4a and 4a of the radiator 4 are engaged with the recesses 1a and 1a of the power IC 1 and the holes 5b and 5b of the bracket 5 so that the radiator 4, the power IC 1 and the bracket 5 are positioned relative to each other. The screws 8 and 8 are inserted through the holes of the radiator 4 and the bracket 5 and screwed into the nut 9 to be tightened, whereby the power IC 1 is fastened to the radiator 4 via the bracket 5. Even if the tightening force between the screw 8 and the nut 9 is large, the pressure applied to the power IC 1 does not increase after the flange 5a of the bracket 5 is pressed against the radiator 4, and no overload is applied to the power IC 1.
[0015]
【The invention's effect】
According to the assembly structure of the electronic component and the radiator of the present invention, torque management when the electronic component is fastened to the radiator is simple, and there is no fear that an overload is applied to the electronic component.
[Brief description of the drawings]
FIG. 1 is a plan view showing an assembly structure of a power IC and a radiator according to a first embodiment of the present invention.
FIG. 2 is a side view showing an assembly structure of the power IC and a radiator.
FIG. 3 is a plan view showing an assembly structure of a power IC and a radiator according to a second embodiment of the present invention.
FIG. 4 is a side view showing an assembly structure of the power IC and a radiator.
FIG. 5 is a plan view showing an example of a conventional assembly structure of a power IC and a radiator.
FIG. 6 is a side view showing an assembly structure of the power IC and a radiator.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Power IC, 1a Indentation 2 Radiator, 2a, 2b Positioning boss 3 Bracket, 3a Flange, 3b Hole 4 Radiator, 4a Positioning boss 5 Bracket, 5a Flange, 5b Hole 6 Radiator 7 Power IC
8 Screw 9 Nut

Claims (2)

放熱器とブラケットにより電子部品を挟んだ状態で前記ブラケットに僅かな隙間を介して放熱器に近接する少なくとも２箇所の近接部を生じるように構成し、前記近接部をねじで前記放熱器に締着したことを特徴とする電子部品と放熱器との組付け構造。With the electronic component sandwiched between the radiator and the bracket, the bracket is configured to generate at least two proximity parts close to the radiator via a slight gap, and the proximity part is fastened to the radiator with a screw. An assembly structure of electronic parts and heatsinks characterized by wearing. 前記放熱器にブラケットの位置決めボスを形成し、前記位置決めボスと前記ブラケットの穴または凹部とを係合させた請求項１の電子部品と放熱器との組付け構造。It said radiator to form a positioning boss of the bracket, the assembly of the radiator and the positioning boss and the electronic component according to claim 1 which is engaged with the hole or recess of the bracket structure.
JP2000258359A 2000-08-29 2000-08-29 Assembly structure of electronic parts and radiator Expired - Fee Related JP3806588B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000258359A JP3806588B2 (en) 2000-08-29 2000-08-29 Assembly structure of electronic parts and radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000258359A JP3806588B2 (en) 2000-08-29 2000-08-29 Assembly structure of electronic parts and radiator

Publications (2)

Publication Number Publication Date
JP2002076221A JP2002076221A (en) 2002-03-15
JP3806588B2 true JP3806588B2 (en) 2006-08-09

Family

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Country Status (1)

Country Link
JP (1) JP3806588B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020059010A1 (en) * 2018-09-18 2020-03-26 東芝キヤリア株式会社 Control device, and control device maintenance method

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