JP3736321B2 - Heat sink device - Google Patents
Heat sink device Download PDFInfo
- Publication number
- JP3736321B2 JP3736321B2 JP2000277784A JP2000277784A JP3736321B2 JP 3736321 B2 JP3736321 B2 JP 3736321B2 JP 2000277784 A JP2000277784 A JP 2000277784A JP 2000277784 A JP2000277784 A JP 2000277784A JP 3736321 B2 JP3736321 B2 JP 3736321B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- radiating plate
- pwb
- heat radiating
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【０００１】
【発明の属する技術分野】
本発明は、電子部品から発生する熱を効率的に放熱する放熱板装置に関する。
【０００２】
【従来の技術】
従来、放熱板装置は特開平９−２４６７６５号公報に記載されたものが知られている。
【０００３】
図２に従来の放熱板装置の構造を示しており、図２（ａ）は、従来の放熱板装置を示す組み立て正面図、図２（ｂ）は、従来の放熱板装置を示す組み立て側面図である。
【０００４】
図２において、１がＰＷＢ、２が発熱電子部品、３がリード、４が放熱板、５、６が固定ビスで構成されている。
【０００５】
【発明が解決しようとする課題】
この放熱板装置においては、発熱電子部品２と放熱板４をあらかじめビス５で固定し、その後ＰＷＢ１にリード３を半田付け、及びビス６で固定する必要がある。
【０００６】
本発明は、発熱電子部品をＰＷＢ上にはんだ実装した後から放熱板を組み立てること目的とする。
【０００７】
【課題を解決するための手段】
この課題を解決するために本発明は、放熱板の一端に折り曲げ部を設けＰＷＢの当てゴムに当接すると共に、発熱電子部品と折り曲げ部のほぼ中間点にてＰＷＢ上に固定されたスペーサにビス止めするように構成したものである。
【０００８】
これにより、発熱電子部品と放熱板の密着性が確保でき効率よく熱伝達ができる。
【０００９】
【発明の実施の形態】
本発明の請求項１に記載の発明は、電子機器内部のＰＷＢ上の発熱電子部品と金属製の放熱板の間にシート状弾性体を配置し、前記放熱板と前記ＰＷＢに当接する当てゴムを、前記放熱板の一端の折り曲げ部近傍に配置し、前記発熱電子部品と前記折り曲げ部の間で、前記放熱板を前記ＰＷＢ上のスペーサにビス止めしたことを特徴としたものであり、発熱電子部品と放熱板の密着性が確保され効率よく熱伝達ができ、発熱電子部品をＰＷＢ上にはんだ実装した後から放熱板を組み立てることができる。
【００１０】
請求項２に記載の発明は、放熱板にめネジを形成し、ＰＷＢの裏面よりビスで固定したものであり、部品点数の削減と組みたて作業の簡易化ができる。
【００１１】
請求項３に記載の発明は放熱板に絞り加工を加え、曲げ剛性をあげたものであり、発熱電子部品と放熱板との密着性をより確実にできる。
【００１２】
以下、本発明の実施の形態について、図１から図２を用いて説明する。
【００１３】
（実施の形態１）
図１（ａ）は、本発明の一実施の形態による放熱板装置を示す組み立て上面図を示し、図１（ｂ）は、本発明の一実施の形態による放熱板装置を示す組み立て側面断面図を示している。
【００１４】
図１においてＰＷＢ１は、電子機器の電気回路を形成し、発熱電子部品２が半田実装されている。放熱板３は、シリコンゴムでできたシート状弾性体４を介し発熱電子部品２から放出された熱を伝熱し空中に放散する。また、放熱板３の一端に折り曲げ部３ａを設け、当てゴム５を介しＰＷＢ１に当接している。スペーサ７はＰＷＢ１にナット８で固定されておりビス６で放熱板３をビス止めしている。
【００１５】
【発明の効果】
以上のように本発明によれば、発熱電子部品と放熱板の密着性が確保され効率よく熱伝達ができると共に、発熱電子部品をＰＷＢ上にはんだ実装した後から放熱板を組み立てることができるという有利な効果が得られる。
【図面の簡単な説明】
【図１】（ａ）本発明の一実施の形態による放熱板装置を示す組み立て上面図
（ｂ）本発明の一実施の形態による放熱板装置を示す組み立て側面断面図
【図２】（ａ）従来の放熱板装置を示す組み立て正面図
（ｂ）従来の放熱板装置を示す組み立て側面図
【符号の説明】
１ ＰＷＢ
２ 発熱電子部品
３ 放熱板
３ａ 折り曲げ部
４ シート状弾性体
５ 当てゴム
６ ビス
７ スペーサ
８ ナット[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a heat dissipation plate device that efficiently dissipates heat generated from an electronic component.
[0002]
[Prior art]
Conventionally, a heat radiating plate device described in Japanese Patent Laid-Open No. 9-246765 has been known.
[0003]
FIG. 2 shows the structure of a conventional heat sink device, FIG. 2 (a) is an assembled front view showing the conventional heat sink device, and FIG. 2 (b) is an assembled side view showing the conventional heat sink device. It is.
[0004]
In FIG. 2, 1 is a PWB, 2 is a heat generating electronic component, 3 is a lead, 4 is a heat sink, and 5 and 6 are fixed screws.
[0005]
[Problems to be solved by the invention]
In this heat radiating plate device, it is necessary to fix the heat generating electronic component 2 and the heat radiating plate 4 in advance with screws 5, and then solder the leads 3 to PWB 1 and fix them with screws 6.
[0006]
It is an object of the present invention to assemble a heat sink after soldering a heat generating electronic component on a PWB.
[0007]
[Means for Solving the Problems]
In order to solve this problem, the present invention provides a bent portion at one end of the heat sink and abuts against the rubber of the PWB. It is configured to stop.
[0008]
Thereby, the adhesiveness of a heat-emitting electronic component and a heat sink can be ensured, and heat can be transferred efficiently.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
According to a first aspect of the present invention is to place a sheet-like elastic member between the heat-generating electronic component and a metallic heat dissipation plate on the internal electronic devices PWB, abuts against the rubber with the said heat dissipation plate PWB Is disposed in the vicinity of a bent portion at one end of the heat radiating plate, and the heat radiating plate is screwed to a spacer on the PWB between the heat generating electronic component and the bent portion. Adhesion between the electronic component and the heat radiating plate is ensured and heat can be transferred efficiently, and the heat radiating plate can be assembled after the heat generating electronic component is solder-mounted on the PWB.
[0010]
According to the second aspect of the present invention , a female screw is formed on the heat radiating plate and fixed with screws from the back surface of the PWB, and the number of parts can be reduced and the work can be simplified.
[0011]
According to the third aspect of the present invention, the heat sink is subjected to a drawing process to increase the bending rigidity, and the adhesion between the heat generating electronic component and the heat sink can be further ensured.
[0012]
Hereinafter, embodiments of the present invention will be described with reference to FIGS.
[0013]
(Embodiment 1)
FIG. 1A is an assembled top view showing a heat sink device according to an embodiment of the present invention, and FIG. 1B is an assembled side sectional view showing a heat sink device according to an embodiment of the present invention. Is shown.
[0014]
In FIG. 1, PWB 1 forms an electric circuit of an electronic device, and a heat generating electronic component 2 is solder-mounted. The heat radiating plate 3 transfers the heat released from the heat generating electronic component 2 through the sheet-like elastic body 4 made of silicon rubber and dissipates it into the air. In addition, a bent portion 3 a is provided at one end of the heat radiating plate 3, and is in contact with the PWB 1 via the abutting rubber 5. The spacer 7 is fixed to the PWB 1 with a nut 8 and screws the heat sink 3 with screws 6.
[0015]
【The invention's effect】
As described above, according to the present invention, adhesion between the heat generating electronic component and the heat radiating plate is ensured and heat can be efficiently transferred, and the heat radiating plate can be assembled after the heat generating electronic component is solder-mounted on the PWB. An advantageous effect is obtained.
[Brief description of the drawings]
1A is an assembled top view showing a heat sink device according to an embodiment of the present invention; FIG. 1B is an assembled side sectional view showing a heat sink device according to an embodiment of the present invention; Front view of assembly showing conventional heat sink device (b) Side view of assembly showing conventional heat sink device
1 PWB
2 Heat-generating electronic component 3 Heat sink 3a Bending portion 4 Sheet-like elastic body 5 Rubber bump 6 Screw 7 Spacer 8 Nut
Claims (3)
前記放熱板と前記ＰＷＢに当接する当てゴムを、前記放熱板の一端の折り曲げ部近傍に配置し、
前記発熱電子部品と前記折り曲げ部の間で、前記放熱板を前記ＰＷＢ上のスペーサにビス止めしたことを特徴とする放熱板装置。 Place a sheet-like elastic body between the electronic devices inside the (hereinafter referred to as PWB) printed circuit board on the heat-generating electronic component and a metallic heat dissipation plate,
A rubber abutting against the heat radiating plate and the PWB is disposed in the vicinity of a bent portion at one end of the heat radiating plate ,
A heat dissipation plate device , wherein the heat dissipation plate is screwed to a spacer on the PWB between the heat generating electronic component and the bent portion.
前記放熱板と前記ＰＷＢに当接する当てゴムを、前記放熱板の一端の折り曲げ部近傍に配置し、A rubber abutting against the heat radiating plate and the PWB is disposed in the vicinity of a bent portion at one end of the heat radiating plate,
前記発熱電子部品と前記折り曲げ部の間で、前記放熱板にめネジを形成し、前記放熱板を前記ＰＷＢの裏面よりビスで固定したことを特徴とする放熱板装置。A heat radiating plate device, wherein a female screw is formed on the heat radiating plate between the heat generating electronic component and the bent portion, and the heat radiating plate is fixed with screws from the back surface of the PWB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000277784A JP3736321B2 (en) | 2000-09-13 | 2000-09-13 | Heat sink device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000277784A JP3736321B2 (en) | 2000-09-13 | 2000-09-13 | Heat sink device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002094273A JP2002094273A (en) | 2002-03-29 |
| JP3736321B2 true JP3736321B2 (en) | 2006-01-18 |
Family
ID=18763049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000277784A Expired - Fee Related JP3736321B2 (en) | 2000-09-13 | 2000-09-13 | Heat sink device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3736321B2 (en) |
-
2000
- 2000-09-13 JP JP2000277784A patent/JP3736321B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002094273A (en) | 2002-03-29 |
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