JP3615490B2 - Electronic component support and support method - Google Patents

Electronic component support and support method Download PDF

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JP3615490B2
JP3615490B2 JP2001038806A JP2001038806A JP3615490B2 JP 3615490 B2 JP3615490 B2 JP 3615490B2 JP 2001038806 A JP2001038806 A JP 2001038806A JP 2001038806 A JP2001038806 A JP 2001038806A JP 3615490 B2 JP3615490 B2 JP 3615490B2
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electronic component
support plate
support
fixing portion
fixing
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JP2002246778A (en
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正幸 小林
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TDK Corp
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TDK Corp
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【０００１】
【発明の属する技術分野】
本発明は電子回路基板に実装された電子部品の支持具に係り、特に１個の支持具で複数の電子部品を筐体や放熱用板等の両面に密着固定することができる電子部品支持具及び支持方法に関するものである。
【０００２】
【従来の技術】
電子装置においては多数の電子部品が使用されている。この電子部品のうち、パワー用ＦＥＴあるいはパワートランジスタの如く、発熱する電子部品も使用されており、このような電子回路基板に実装された発熱電子部品を筐体や放熱用板に固定することが必要となる。
【０００３】
従来は、電子回路基板に実装された電子部品を筐体や放熱用板に固定する手法として、以下のような手法が一般的に使用されていた。
【０００４】
（１）図８に示す如く、電子部品を筐体や放熱用板に直接ねじ止めすること。
【０００５】
（２）図９に示す如く、筐体や放熱用板の一面に支持具を用いて固定すること。
【０００６】
図８に示す前記（１）では、パワー用ＦＥＴの如き電子部品２１をリード足２４において回路用基板２３に対してハンダ付けにより実装するとともに、放熱用板２２に対して電子部品固定用ねじ２５によりこの電子部品２１を密着固定し、電子部品２１の発熱を放熱用板２２を介して放熱するものである。放熱用板２２ではなく、筐体の一部を使用して同様に電子部品を密着固定し、放熱することもできる。
【０００７】
この図８では、熱ストレスやショックが電子部品２１に印加されたとき、リード足２４と回路用基板２３を固定接続しているハンダ部分に直接加圧され、このハンダ部分にクラックが入るという問題があった。
【０００８】
これを改善するため、図９に示す前記（２）では弾性バネで構成された電子部品支持具２６を支持具固定用ねじ２７により放熱用板２２に固着し、回路用基板２３に実装された電子部品２１をこの電子部品支持具２６により放熱用板２２に密着固定し、電子部品２１における発熱を放熱用板２２に放熱するとともに、電子部品２１に熱ストレスやショックが印加されてもこの電子部品支持具２６でこれを吸収し、リード足２４におけるハンダクラックの発生を防止していた。放熱用板２２ではなく、筐体の一部を使用することもできる。
【０００９】
同様に、弾性バネを用いて電子部品を固着することが、特開平１０−９８２８６号公報、特開平１０−３３５８６１号公報に記載されている。
【００１０】
【発明が解決しようとする課題】
ところで、前記図９及び各公報に記載された手法では、その構造上、放熱用板または筐体の片面にしか電子部品を固定できず、電子部品の配置効率が低く、電子機器の小型化、軽量化の妨げとなっていた。
【００１１】
したがって本発明の目的は、このような問題点を改善した、放熱を必要とする電子部品の配置効率を高めるのみならず、電子部品のリード足と回路基板の接合部にストレスが印加されない電子部品支持具及び支持方法を提供することである。
【００１２】
【課題を解決するための手段】
図１〜図３により本発明の概略を説明する。本発明では、電子部品支持具１により、電子部品２１、２１′を放熱用板２２の両面に固定できるように、電子部品２１、２１′を押さえる部分である弾性固定部２、２′が接続部４で接続されており、これにより放熱用板２２の両面に弾性固定部２、２′が位置するように構成する。
【００１３】
本発明の前記目的は、下記（１）〜（６）により達成することができる。
【００１４】
（１）第１の電子部品を放熱用の支持板に押圧する第１の弾性固定部と、第２の電子部品を放熱用の支持板に押圧する第２の弾性固定部と、放熱用の支持板に固着され第１の弾性固定部と接続された第１の支持板固着部と、放熱用の支持板に固着され第２の弾性固定部と接続された第２の支持板固着部と、第１の支持板固着部に形成された第１の固着具用孔部と、第２の支持板固着部に形成された第２の固着具用孔部と、第１の支持板固着部と第２の支持板固着部とを連結する接続部とを具備したことを特徴とする電子部品支持具。
【００１５】
（２）前記第１の固着具用孔部と、第２の固着具用孔部は、いずれも開口部で構成され、ねじとナットを用いて放熱用の支持板に固着することを特徴とする前記（１）記載の電子部品支持具。
【００１６】
（３）前記第１の固着具用孔部と第２の固着具用孔部の一方は開口部で構成され、他方はタップが形成されており、ねじにより放熱用の支持板に固着することを特徴とする前記（１）記載の電子部品支持具。
【００１７】
（４）前記接続部は、電子部品支持具を放熱用の支持板に固着した後にこの電子部品支持具より除去可能に構成されていることを特徴とする前記（１）記載の電子部品支持具。
【００１８】
（５）複数の弾性固定部が形成された第１の連結支持板固着部と、複数の弾性固定部が形成された第２の連結支持板固着部と、第１の連結支持板固着部及び第２の連結支持板固着部に固着具用孔部を形成し、また第１の連結支持板固着部及び第２の連結支持板固着部を接続部で接続し、これら複数の弾性固定部が形成された第１の連結支持板固着部と、複数の弾性固定部が形成された第２の連結支持板固着部と、接続部を弾性板により一体構成したことを特徴とする電子部品支持具。
【００１９】
（６）第１の弾性固定部と、第２の弾性固定部と、第１の支持板固着部と、第２の支持板固着部と、第１の支持板固着部と第２の支持板固着部とを連結する接続部を弾性板により一体構成した電子部品支持具を放熱用の支持板に固着した後に、前記接続部を電子部品支持具より除去することを特徴とする電子部品支持具の支持方法。
【００２０】
これにより下記の作用効果を奏することができる。
【００２１】
（１）１個の電子部品支持具により、放熱用板あるいは筐体の両面に電子部品を押圧保持することができるので、発熱電子部品を放熱用板あるいは筐体等に簡単な手段で、スペース効率よく、しかも作業効果よく取り付けることができる。また電子部品のリード足と回路用基板の接合部にストレスを加えることもなく使用することができ、電子機器の小型化、軽量化をはかることができる。さらに２つの支持板固着部を接続部で接続しているので、２個の弾性固定部が形成された電子部品支持具をきわめて簡単に正確に放熱用板や筐体等に取り付けることができる。
【００２２】
（２）開口部が形成された２つの支持板固着部が接続部で接続され、電子部品支持具が放熱用板等に取り付けられるとき、これらの開口部が対向して位置しているので、放熱用板等の両面に弾性固定部のある電子部品支持具を、１組のねじ・ナットで簡単に取り付けることができる。
【００２３】
（３）第１の固着具用孔部と第２の固着具用孔部の一方は開口部で構成され、他方はタップが形成されているので電子部品支持具をねじにより簡単に放熱用板等に取り付けることができ、作業効率を向上することができる。
【００２４】
（４）電子部品支持具を放熱用板等に取り付けた後に接続部を除去することができるので、高さの低い場所でも放熱用板等を使用して電子部品を取り付けることができ、電子機器の小型化、軽量化をはかることができる。
【００２５】
（５）連結支持板固着部に複数の弾性固定部を形成したので、電子機器を製作するときの作業効果やスペース効果をさらに向上させることができる。
【００２６】
（６）電子部品支持具を放熱用板等に取り付けた後に接続部を除去するので、電子部品支持具の取り付けを正確に、簡単に行うことができるのみならず、高さの低い場所でも放熱用板等を使用して電子部品を配置することができる。
【００２７】
【発明の実施の形態】
本発明の一実施の形態を図１〜図３により説明する。図１は本発明の電子部品支持具の一実施の形態を示し、図２、図３はこの電子部品支持具の使用状態説明図であり、図２は放熱用板に本発明の電子部品支持具を取り付け、電子部品の保持状態を示し、図３はその側面図である。
【００２８】
図中他図と同記号は同一部を示し、１は本発明に係る電子部品支持具、２、２′は弾性固定部、３、３′は支持板固着部、４は接続部、５、５′は連結部、６は丸穴、７はタップである。
【００２９】
電子部品支持部１は放熱用板２２の両面に電子部品２１、２１′を密着保持するものであり、弾性固定部２、２′、支持板固着部３、３′、接続部４、連結部５、５′が形成され、リン青銅やステンレスの如き、ばね性を有する金属板で一体構成されている。
【００３０】
弾性固定部２は、例えばパワーＦＥＴやパワートランジスタの如き発熱性の電子部品２１を放熱用板２２に圧着してこれを放熱用板２２に密着保持し、その発熱を放熱用板２２を介して放熱するものである。放熱用板２２に限らず、例えば筐体を使用して密着、放熱を行うこともできる。弾性固定部２′は弾性固定部２と同様に構成され、電子部品２１′を放熱用板２２に圧着してその発熱を放熱用板２２を介して放熱するものである。
【００３１】
支持板固着部３は、支持板固着部３′とともに電子部品支持具１を放熱用板２２に保持、固着するものであり、支持板固着部３には丸穴６が形成され、支持板固着部３′にはタップ７が形成されている。これら支持板固着部３、３′は、例えばリング状の接続部４により接続されており、図１に示す如く、その丸穴６とタップ７とは対向しているので、図３に示す如く、この支持板固着部３、３′間に放熱用板２２を位置させ、支持具固定用ねじ２７を放熱用板２２に形成された図示省略した穴部を介してこの丸穴６を挿入してタップ７に螺合することにより、電子部品支持具１を放熱用板２２に固定することができる。
【００３２】
連結部５は弾性固定部２と支持板固着部３との間に位置してこれらを連結状態にするものであり、図１〜図３の例では連結部５で支持板固着部３がほぼ直角に折り曲げられ、連結部５の他方の側で弾性固定部２が直角よりもやや内側つまり放熱用板側に折り曲げられている。
【００３３】
電子部品支持具１は、図１に示す如く、これら各部が一体状態で構成され、しかも丸穴６とタップ７が対向位置しているので、これを放熱用板２２に固着するとき電子部品支持具１と支持板固着部３、３′との位置決めが簡単に行えるのみならず、支持具固定用ねじ２７の挿入固着もこれまたきわめて簡単に行うことができる。
【００３４】
このようにして電子部品支持具１を放熱用板２２に固着したあと、回路用基板２３に実装された電子部品２１、２１′を、図２、図３に示す如く、放熱用板２２と弾性固定部２の間及び放熱用板２２と弾性固定部２′の間に保持し、電子部品２１、２１′を放熱用板２２に密着させ、放熱用板２２を介してその発熱を放熱することができる。放熱用板２２は、図示省略した筐体や別の支持具にねじ等で固定されている。なお図２、図３において２４は電子部品２１のリード足であり、２４′は電子部品２１′のリード足である。
【００３５】
このようにして本発明の電子部品支持具１によれば、放熱用板あるいは筐体の両面に電子部品２１、２１′を簡単に密着保持することができるので、放熱用板等に対するスペース効果を高めることができる。
【００３６】
本発明の電子部品支持具の第２の実施の形態を図４、図５により説明する。
【００３７】
本発明の第２の実施の形態では、図４に示す如く、支持板固着部３、３′の両方に丸穴６、６′を形成したものである。これにより図５に示す如く、支持具固定用ねじ２７とナット２８により、つまり通常のねじ・ナットにより電子部品支持具１′を放熱用板２２に固着することができる。
【００３８】
本発明の電子部品支持具の第３の実施の形態を図６、図７により説明する。
【００３９】
本発明の第３の実施の形態では、図６に示す如く、電子部品支持具１１に複数の弾性固定部２及び２′（この図の例ではそれぞれ３個）を設けたものである。
【００４０】
すなわち、連結支持板固着部１３に、３個の弾性固定部２、２、２を形成し、連結支持板固着部１３′に同じく３個の弾性固定部２′、２′、２′を形成し、これら連結支持板固着部１３、１３′を接続部１４、１４にて接続状態に構成する。そして連結支持板固着部１３には固着具用孔部１６、１６、１６を形成する。
【００４１】
この連結支持板固着部１３に設けた固着具用孔部１６、１６、１６は丸穴で構成されているが、連結支持板固着部１３′に設けた固着具用孔部は丸穴でもよいが、取り付け作業の容易性からタップが設けられている方が好ましい。
【００４２】
放熱用板２２にこの電子部品支持具１１を固着したのち、図７に示す如く、回路用基板２１に実装された電子部品２１、２１・・・を、前記図３の場合と同様に放熱用板２２に密着保持することができる。
【００４３】
図６、図７の例では電子部品を放熱用板の両面に３個ずつ密着保持する例について説明したが、本発明では勿論この数に限定されるものではない。
【００４４】
第３の実施の形態によれば、放熱用板等に電子部品支持具を固着するとき、一個の部品で複数の電子部品を密着保持することができるので、電子部品支持具の取り付け効率が向上する。
【００４５】
また電子部品支持具の固着後に接続部を除去する場合には、第１の実施の形態や第２の実施の形態に比し電子部品の数に比べて接続部の数が少ないので、この接続部除去作業に対する作業効率を向上することができる。
【００４６】
なお前記説明では接続部がリング状の例について説明したが、本発明は勿論これに限定されるものではなく、楕円形状でも三角形状でもその他の形状でもよい。
【００４７】
接続部の機能として次の如き効果もある。例えば図１に示す如く、電子部品支持具１が構成されたとき、支持板固着部３、３′の間隔Ｔはこの間に挿入される放熱用板や筐体等の厚みｄと略等しいことが望ましい。しかし本発明では接続部が形成されているため、Ｔ＞ｄの場合は支持具固定用ねじにより固着されるので、実際に使用するときＴ＝ｄとなる。またＴ＜ｄの場合、接続部が存在するため放熱用板等の挿入に際しこの間隔が広がりＴ＝ｄとなるので、これまた正確に取り付けられることになる。
【００４８】
なお接続部の除去としては、切断工具等により切断してもよく、また電子部品支持具１を製造するときあらかじめこの接続部の取外し位置に溝を切っておき、手作業で除去することもできる。
【００４９】
【発明の効果】
本発明により下記の効果を奏することができる。
【００５０】
（１）１個の電子部品支持具により、放熱用板あるいは筐体の両面に電子部品を押圧保持することができるので、発熱電子部品を放熱用板あるいは筐体等に簡単な手段で、スペース効率よく、しかも作業効果よく取り付けることができる。また電子部品のリード足と回路用基板の接合部にストレスを加えることもなく使用することができ、電子機器の小型化、軽量化をはかることができる。さらに２つの支持板固着部を接続部で接続しているので、２個の弾性固定部が形成された電子部品支持具をきわめて簡単に正確に放熱用板や筐体等に取り付けることができる。
【００５１】
（２）開口部が形成された２つの支持板固着部が接続部で接続され、電子部品支持具が放熱用板等に取り付けられるとき、これらの開口部が対向して位置しているので、放熱用板等の両面に弾性固定部のある電子部品支持具を、１組のねじ・ナットで簡単に取り付けることができる。
【００５２】
（３）第１の固着具用孔部と第２の固着具用孔部の一方は開口部で構成され、他方はタップが形成されているので電子部品支持具をねじにより簡単に放熱用板等に取り付けることができ、作業効率を向上することができる。
【００５３】
（４）電子部品支持具を放熱用板等に取り付けた後に接続部を除去することができるので、高さの低い場所でも放熱用板等を使用して電子部品を取り付けることができ、電子機器の小型化、軽量化をはかることができる。
【００５４】
（５）連結支持板固着部に複数の弾性固定部を形成したので、電子機器を製作するときの作業効果やスペース効果をさらに向上させることができる。
【００５５】
（６）電子部品支持具を放熱用板等に取り付けた後に接続部を除去するので、電子部品支持具の取り付けを正確に、簡単に行うことができるのみならず、高さの低い場所でも放熱用板等を使用して電子部品を配置することができる。
【図面の簡単な説明】
【図１】本発明の第１の実施の形態である。
【図２】本発明の第１の実施の形態の電子部品支持具の使用状態説明図（その１）である。
【図３】本発明の第１の実施の形態の電子部品支持具の使用状態説明図（その２）である。
【図４】本発明の第２の実施の形態である。
【図５】本発明の第２の実施の形態の電子部品支持具の使用状態説明図である。
【図６】本発明の第３の実施の形態である。
【図７】本発明の第３の実施の形態の電子部品支持具の使用状態説明図である。
【図８】従来例説明図（その１）である。
【図９】従来例説明図（その２）である。
【符号の説明】
１ 電子部品支持具
２、２′ 弾性固定部
３、３′ 支持板固着部
４ 接続部
５、５′ 連結部
６ 丸穴
７ タップ
２１ 電子部品
２２ 放熱用板
２３ 回路用基板
２４、２４′ リード足
２５ 電子部品固定用ねじ
２６ 電子部品支持具
２７ 支持具固定用ねじ
２８ ナット[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component support mounted on an electronic circuit board, and more particularly, an electronic component support capable of closely fixing a plurality of electronic components to both sides of a housing, a heat dissipation plate, and the like with a single support. And a supporting method.
[0002]
[Prior art]
Many electronic components are used in electronic devices. Among these electronic components, heat generating electronic components such as power FETs or power transistors are also used, and it is possible to fix the heat generating electronic components mounted on such an electronic circuit board to a housing or a heat dissipation plate. Necessary.
[0003]
Conventionally, the following method is generally used as a method for fixing an electronic component mounted on an electronic circuit board to a housing or a heat dissipation plate.
[0004]
(1) As shown in FIG. 8, the electronic component is directly screwed to the housing or the heat radiating plate.
[0005]
(2) As shown in FIG. 9, fix to one side of a housing or a heat radiating plate using a support.
[0006]
In (1) shown in FIG. 8, an electronic component 21 such as a power FET is mounted by soldering on a circuit board 23 at a lead leg 24, and an electronic component fixing screw 25 is mounted on a heat radiating plate 22. Thus, the electronic component 21 is closely fixed, and the heat generated by the electronic component 21 is radiated through the heat radiation plate 22. It is also possible to dissipate heat by using a part of the housing instead of the heat radiating plate 22 and fixing the electronic components in the same manner.
[0007]
In FIG. 8, when thermal stress or shock is applied to the electronic component 21, the solder portion that fixes and connects the lead foot 24 and the circuit board 23 is directly pressed, and the solder portion is cracked. was there.
[0008]
In order to improve this, in (2) shown in FIG. 9, the electronic component support 26 made of an elastic spring is fixed to the heat radiation plate 22 by the support fixing screws 27 and mounted on the circuit board 23. The electronic component 21 is tightly fixed to the heat radiating plate 22 by the electronic component support 26, and heat generated in the electronic component 21 is radiated to the heat radiating plate 22. This is absorbed by the component support 26 to prevent the occurrence of solder cracks in the lead foot 24. A part of the housing can be used instead of the heat radiating plate 22.
[0009]
Similarly, it is described in JP-A-10-98286 and JP-A-10-335861 that an electronic component is fixed using an elastic spring.
[0010]
[Problems to be solved by the invention]
By the way, in the technique described in FIG. 9 and each publication, the electronic components can be fixed only on one side of the heat radiating plate or the housing due to its structure, the arrangement efficiency of the electronic components is low, the electronic device is downsized, It was an obstacle to weight reduction.
[0011]
Accordingly, an object of the present invention is to improve such problems and not only increase the placement efficiency of electronic components that require heat dissipation, but also does not apply stress to the joints between the lead legs of the electronic components and the circuit board. It is to provide a support and a support method.
[0012]
[Means for Solving the Problems]
The outline of the present invention will be described with reference to FIGS. In the present invention, the elastic fixing portions 2 and 2 ′, which are portions for holding the electronic components 21 and 21 ′, are connected so that the electronic components 21 and 21 ′ can be fixed to both surfaces of the heat dissipation plate 22 by the electronic component support 1. The elastic fixing portions 2, 2 ′ are positioned on both surfaces of the heat radiating plate 22.
[0013]
The object of the present invention can be achieved by the following (1) to (6).
[0014]
(1) A first elastic fixing portion that presses the first electronic component against the support plate for heat dissipation, a second elastic fixing portion that presses the second electronic component against the support plate for heat dissipation, and a heat dissipation A first support plate fixing portion fixed to the support plate and connected to the first elastic fixing portion; a second support plate fixing portion fixed to the support plate for heat dissipation and connected to the second elastic fixing portion; , A first fastener hole formed in the first support plate fixing portion, a second fastener hole formed in the second support plate fixing portion, and the first support plate fixing portion. And a second support plate fixing part. A connection part for connecting the second support plate fixing part.
[0015]
(2) The first fixing tool hole portion and the second fixing tool hole portion are each configured by an opening, and are fixed to a support plate for heat dissipation using screws and nuts. The electronic component support according to (1).
[0016]
(3) One of the first fixing tool hole and the second fixing tool hole is constituted by an opening, and the other is formed with a tap, and is fixed to a heat radiating support plate by a screw. The electronic component support according to (1), characterized in that:
[0017]
(4) The electronic component support device according to (1), wherein the connection portion is configured to be removable from the electronic component support device after the electronic component support device is fixed to a support plate for heat dissipation. .
[0018]
(5) a first connection support plate fixing portion in which a plurality of elastic fixing portions are formed, a second connection support plate fixing portion in which a plurality of elastic fixing portions are formed, a first connection support plate fixing portion, and A fixing tool hole is formed in the second connecting support plate fixing portion, and the first connecting support plate fixing portion and the second connecting support plate fixing portion are connected by a connecting portion, and the plurality of elastic fixing portions are connected to each other. An electronic component support device, wherein the first connecting support plate fixing portion formed, the second connecting support plate fixing portion formed with a plurality of elastic fixing portions, and the connection portion are integrally formed of an elastic plate. .
[0019]
(6) First elastic fixing portion, second elastic fixing portion, first support plate fixing portion, second support plate fixing portion, first support plate fixing portion, and second support plate An electronic component support device comprising: an electronic component support device in which a connection portion for connecting to a fixed portion is integrally formed of an elastic plate is fixed to a support plate for heat dissipation, and then the connection portion is removed from the electronic component support device. Support method.
[0020]
Thereby, the following effects can be obtained.
[0021]
(1) Since the electronic component can be pressed and held on both sides of the heat radiating plate or the case by one electronic component support, the heat generating electronic component can be easily attached to the heat radiating plate or the case by a simple means. It can be installed efficiently and with good working efficiency. Further, it can be used without applying stress to the joint between the lead leg of the electronic component and the circuit board, and the electronic device can be reduced in size and weight. Further, since the two support plate fixing portions are connected by the connection portion, the electronic component support having the two elastic fixing portions can be attached to the heat radiating plate or the housing very easily and accurately.
[0022]
(2) When the two support plate fixing portions formed with the openings are connected at the connection portion and the electronic component support is attached to the heat dissipation plate or the like, these openings are located facing each other. An electronic component support having elastic fixing portions on both sides of a heat radiating plate or the like can be easily attached with a set of screws and nuts.
[0023]
(3) Since one of the first fixing tool hole and the second fixing tool hole is formed by an opening and the other is formed with a tap, the electronic component support tool can be easily dissipated by screws. It is possible to improve the working efficiency.
[0024]
(4) Since the connection part can be removed after the electronic component support is attached to the heat dissipation plate, etc., the electronic component can be attached using a heat dissipation plate, etc. even in a low place. Can be reduced in size and weight.
[0025]
(5) Since the plurality of elastic fixing portions are formed on the connecting support plate fixing portion, it is possible to further improve the working effect and the space effect when manufacturing the electronic device.
[0026]
(6) Since the connecting part is removed after the electronic component support is attached to the heat dissipation plate, etc., not only can the electronic component support be attached accurately and easily, but also heat is dissipated in a low height place. Electronic components can be arranged using a board or the like.
[0027]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the present invention will be described with reference to FIGS. FIG. 1 shows an embodiment of the electronic component support of the present invention. FIGS. 2 and 3 are explanatory views of the use state of the electronic component support. FIG. 2 shows the electronic component support of the present invention on a heat radiating plate. FIG. 3 is a side view showing the holding state of the electronic component attached.
[0028]
In the figure, the same symbols as those in the other figures indicate the same parts, 1 is an electronic component support according to the present invention, 2, 2 'is an elastic fixing part, 3' is a support plate fixing part, 4 is a connection part, 5, 5 'is a connection part, 6 is a round hole, 7 is a tap.
[0029]
The electronic component support portion 1 is for holding the electronic components 21 and 21 'in close contact with both surfaces of the heat dissipation plate 22, and includes elastic fixing portions 2, 2', support plate fixing portions 3, 3 ', connection portions 4, and connection portions. 5, 5 'are formed, and are integrally formed of a metal plate having a spring property such as phosphor bronze or stainless steel.
[0030]
The elastic fixing portion 2 is configured such that a heat-generating electronic component 21 such as a power FET or a power transistor is pressure-bonded to a heat-dissipating plate 22 and is closely attached to the heat-dissipating plate 22. It dissipates heat. Not only the heat radiating plate 22 but also, for example, a housing can be used for close contact and heat radiation. The elastic fixing portion 2 ′ is configured in the same manner as the elastic fixing portion 2, and the electronic component 21 ′ is pressure-bonded to the heat radiating plate 22 and the generated heat is radiated through the heat radiating plate 22.
[0031]
The support plate fixing part 3 holds and fixes the electronic component support 1 together with the support plate fixing part 3 ′ on the heat radiating plate 22, and the support plate fixing part 3 is formed with a round hole 6 to fix the support plate. A tap 7 is formed on the portion 3 '. These support plate fixing portions 3, 3 'are connected by, for example, a ring-shaped connecting portion 4, and the round hole 6 and the tap 7 are opposed to each other as shown in FIG. Then, the heat radiating plate 22 is positioned between the support plate fixing portions 3 and 3 ', and the round holes 6 are inserted through the holes not shown in the figure formed in the heat radiating plate 22 with the support fixing screws 27. Then, the electronic component support 1 can be fixed to the heat radiation plate 22 by being screwed into the tap 7.
[0032]
The connecting portion 5 is located between the elastic fixing portion 2 and the support plate fixing portion 3 so as to be in a connected state. In the example of FIGS. The elastic fixing portion 2 is bent on the other side of the connecting portion 5 to the inner side of the right angle, that is, the heat radiating plate side.
[0033]
As shown in FIG. 1, the electronic component support 1 is configured such that these parts are integrated, and the round hole 6 and the tap 7 are opposed to each other. Not only can the positioning of the tool 1 and the support plate fixing portions 3, 3 'be performed easily, but also the fixing of the support fixing screw 27 can be performed very easily.
[0034]
After fixing the electronic component support 1 to the heat radiating plate 22 in this way, the electronic components 21 and 21 'mounted on the circuit board 23 are made elastic with the heat radiating plate 22 as shown in FIGS. Hold between the fixing portions 2 and between the heat dissipation plate 22 and the elastic fixing portion 2 ′, closely contact the electronic components 21, 21 ′ with the heat dissipation plate 22, and dissipate the heat generated through the heat dissipation plate 22. Can do. The heat radiating plate 22 is fixed to a housing or another support (not shown) with screws or the like. 2 and 3, reference numeral 24 denotes a lead leg of the electronic component 21, and 24 'denotes a lead leg of the electronic component 21'.
[0035]
As described above, according to the electronic component support 1 of the present invention, the electronic components 21 and 21 'can be easily held tightly on both sides of the heat radiating plate or the housing. Can be increased.
[0036]
A second embodiment of the electronic component support of the present invention will be described with reference to FIGS.
[0037]
In the second embodiment of the present invention, as shown in FIG. 4, round holes 6 and 6 'are formed in both support plate fixing portions 3 and 3'. As a result, as shown in FIG. 5, the electronic component support 1 ′ can be fixed to the heat radiating plate 22 with the support fixing screws 27 and the nuts 28, that is, with normal screws and nuts.
[0038]
A third embodiment of the electronic component support of the present invention will be described with reference to FIGS.
[0039]
In the third embodiment of the present invention, as shown in FIG. 6, the electronic component support 11 is provided with a plurality of elastic fixing portions 2 and 2 '(three in this example).
[0040]
That is, three elastic fixing portions 2, 2, and 2 are formed on the connecting support plate fixing portion 13, and three elastic fixing portions 2 ', 2', and 2 'are also formed on the connecting support plate fixing portion 13'. The connecting support plate fixing portions 13 and 13 ′ are connected to the connecting portions 14 and 14. The connecting support plate fixing portion 13 is formed with fixing tool holes 16, 16, 16.
[0041]
The fixing tool holes 16, 16, 16 provided in the connection support plate fixing part 13 are round holes, but the fixing tool hole provided in the connection support plate fixing part 13 'may be a round hole. However, it is preferable that a tap is provided in view of ease of attachment work.
[0042]
After the electronic component support 11 is fixed to the heat radiating plate 22, the electronic components 21, 21... Mounted on the circuit board 21 are radiated as shown in FIG. The plate 22 can be tightly held.
[0043]
In the example of FIGS. 6 and 7, the example in which three electronic components are held in close contact with both sides of the heat radiating plate has been described, but of course the present invention is not limited to this number.
[0044]
According to the third embodiment, when an electronic component support is fixed to a heat radiating plate or the like, a plurality of electronic components can be held in close contact with one component, so that the mounting efficiency of the electronic component support is improved. To do.
[0045]
Further, when removing the connection part after the electronic component support is fixed, the number of connection parts is smaller than the number of electronic parts compared to the first and second embodiments. The work efficiency for the part removal work can be improved.
[0046]
In the above description, an example in which the connection portion is ring-shaped has been described. However, the present invention is of course not limited to this, and may be elliptical, triangular, or other shapes.
[0047]
There are the following effects as a function of the connecting portion. For example, as shown in FIG. 1, when the electronic component support 1 is configured, the interval T between the support plate fixing portions 3, 3 ′ is substantially equal to the thickness d of the heat radiating plate or housing inserted between them. desirable. However, in the present invention, since the connecting portion is formed, when T> d, it is fixed by the support fixing screw, so that T = d when actually used. In addition, when T <d, since there is a connecting portion, this interval is widened when inserting a heat radiating plate or the like, and T = d.
[0048]
In addition, as removal of a connection part, you may cut | disconnect with a cutting tool etc. Moreover, when manufacturing the electronic component support tool 1, a groove | channel is cut in the removal position of this connection part beforehand, and it can also remove manually. .
[0049]
【The invention's effect】
The following effects can be achieved by the present invention.
[0050]
(1) Since the electronic component can be pressed and held on both sides of the heat radiating plate or the case by one electronic component support, the heat generating electronic component can be easily attached to the heat radiating plate or the case by a simple means. It can be installed efficiently and with good working efficiency. Further, it can be used without applying stress to the joint between the lead leg of the electronic component and the circuit board, and the electronic device can be reduced in size and weight. Further, since the two support plate fixing portions are connected by the connection portion, the electronic component support having the two elastic fixing portions can be attached to the heat radiating plate or the housing very easily and accurately.
[0051]
(2) When the two support plate fixing portions formed with the openings are connected at the connection portion and the electronic component support is attached to the heat dissipation plate or the like, these openings are located facing each other. An electronic component support having elastic fixing portions on both sides of a heat radiating plate or the like can be easily attached with a set of screws and nuts.
[0052]
(3) Since one of the first fixing tool hole and the second fixing tool hole is formed by an opening and the other is formed with a tap, the electronic component support tool can be easily dissipated by screws. It is possible to improve the working efficiency.
[0053]
(4) Since the connecting portion can be removed after the electronic component support is attached to the heat dissipation plate, etc., the electronic component can be attached using a heat dissipation plate or the like even in a low height place. Can be reduced in size and weight.
[0054]
(5) Since the plurality of elastic fixing portions are formed in the connection support plate fixing portion, it is possible to further improve the working effect and the space effect when manufacturing the electronic device.
[0055]
(6) Since the connecting part is removed after the electronic component support is attached to the heat dissipation plate, etc., not only can the electronic component support be attached accurately and easily, but also heat is dissipated even in low places. Electronic components can be arranged using a board or the like.
[Brief description of the drawings]
FIG. 1 is a first embodiment of the present invention.
FIG. 2 is an explanatory diagram (part 1) of a usage state of the electronic component support according to the first embodiment of the invention.
FIG. 3 is an explanatory diagram (part 2) illustrating a usage state of the electronic component support according to the first embodiment of the invention.
FIG. 4 is a second embodiment of the present invention.
FIG. 5 is an explanatory diagram of a usage state of the electronic component support according to the second embodiment of the present invention.
FIG. 6 is a third embodiment of the present invention.
FIG. 7 is an explanatory diagram of a usage state of the electronic component support according to the third embodiment of the present invention.
FIG. 8 is an explanatory diagram of a conventional example (part 1);
FIG. 9 is an explanatory diagram of a conventional example (part 2);
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Electronic component support 2, 2 'Elastic fixing part 3, 3' Support plate fixing | fixed part 4 Connection part 5, 5 'Connection part 6 Round hole 7 Tap 21 Electronic component 22 Heat radiation board 23 Circuit board 24, 24' Lead Feet 25 Electronic component fixing screw 26 Electronic component support device 27 Support device fixing screw 28 Nut

Claims (6)

第１の電子部品を放熱用の支持板に押圧する第１の弾性固定部と、
第２の電子部品を放熱用の支持板に押圧する第２の弾性固定部と、
放熱用の支持板に固着され第１の弾性固定部と接続された第１の支持板固着部と、
放熱用の支持板に固着され第２の弾性固定部と接続された第２の支持板固着部と、
第１の支持板固着部に形成された第１の固着具用孔部と、
第２の支持板固着部に形成された第２の固着具用孔部と、
第１の支持板固着部と第２の支持板固着部とを連結する接続部とを具備したことを特徴とする電子部品支持具。A first elastic fixing portion that presses the first electronic component against a support plate for heat dissipation;
A second elastic fixing portion that presses the second electronic component against the support plate for heat dissipation;
A first support plate fixing portion fixed to the support plate for heat dissipation and connected to the first elastic fixing portion;
A second support plate fixing portion fixed to the support plate for heat dissipation and connected to the second elastic fixing portion;
A first fixing tool hole formed in the first support plate fixing portion;
A second fixing tool hole formed in the second support plate fixing portion;
An electronic component support device comprising a connection portion for connecting the first support plate fixing portion and the second support plate fixing portion. 前記第１の固着具用孔部と、第２の固着具用孔部は、いずれも開口部で構成され、ねじとナットを用いて放熱用の支持板に固着することを特徴とする請求項１記載の電子部品支持具。The first fixing tool hole portion and the second fixing tool hole portion each include an opening, and are fixed to a heat radiating support plate using a screw and a nut. The electronic component support according to 1. 前記第１の固着具用孔部と第２の固着具用孔部の一方は開口部で構成され、他方はタップが形成されており、ねじにより放熱用の支持板に固着することを特徴とする請求項１記載の電子部品支持具。One of the first fixing hole portion and the second fixing hole portion is configured by an opening, and the other is formed with a tap, and is fixed to a heat radiating support plate by screws. The electronic component support according to claim 1. 前記接続部は、電子部品支持具を放熱用の支持板に固着した後にこの電子部品支持具より除去可能に構成されていることを特徴とする請求項１記載の電子部品支持具。2. The electronic component support according to claim 1, wherein the connection portion is configured to be removable from the electronic component support after the electronic component support is fixed to a support plate for heat dissipation. 複数の弾性固定部が形成された第１の連結支持板固着部と、
複数の弾性固定部が形成された第２の連結支持板固着部と、
第１の連結支持板固着部及び第２の連結支持板固着部に固着具用孔部を形成し、また第１の連結支持板固着部及び第２の連結支持板固着部を接続部で接続し、
これら複数の弾性固定部が形成された第１の連結支持板固着部と、複数の弾性固定部が形成された第２の連結支持板固着部と、接続部を弾性板により一体構成したことを特徴とする電子部品支持具。A first connecting support plate fixing portion formed with a plurality of elastic fixing portions;
A second connecting support plate fixing portion formed with a plurality of elastic fixing portions;
A fixing tool hole is formed in the first connection support plate fixing portion and the second connection support plate fixing portion, and the first connection support plate fixing portion and the second connection support plate fixing portion are connected by a connection portion. And
The first connection support plate fixing portion in which the plurality of elastic fixing portions are formed, the second connection support plate fixing portion in which the plurality of elastic fixing portions are formed, and the connection portion are integrally configured by an elastic plate. An electronic component support device. 第１の弾性固定部と、第２の弾性固定部と、第１の支持板固着部と、第２の支持板固着部と、第１の支持板固着部と第２の支持板固着部とを連結する接続部を弾性板により一体構成した電子部品支持具を放熱用の支持板に固着した後に、前記接続部を電子部品支持具より除去することを特徴とする電子部品支持具の支持方法。A first elastic fixing portion, a second elastic fixing portion, a first support plate fixing portion, a second support plate fixing portion, a first support plate fixing portion and a second support plate fixing portion; A method for supporting an electronic component support comprising: removing an electronic component support from the electronic component support after fixing the electronic component support integrally configured with an elastic plate to a connection plate for heat dissipation. .
JP2001038806A 2001-02-15 2001-02-15 Electronic component support and support method Expired - Fee Related JP3615490B2 (en)

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