JP4417199B2 - Electronic component mounting structure - Google Patents

Electronic component mounting structure Download PDF

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JP4417199B2
JP4417199B2 JP2004226400A JP2004226400A JP4417199B2 JP 4417199 B2 JP4417199 B2 JP 4417199B2 JP 2004226400 A JP2004226400 A JP 2004226400A JP 2004226400 A JP2004226400 A JP 2004226400A JP 4417199 B2 JP4417199 B2 JP 4417199B2
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support plate
contact
electronic component
mounting surface
pressing member
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JP2006049466A (en
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卓也 上野
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Description

本発明は、取付面に対して面接触可能な支持板と、この支持板に載置されるチップ部とを備え、支持板の縁部における複数箇所を締め付ける電子部品の取付構造に関する。   The present invention relates to a mounting structure for an electronic component that includes a support plate that can be brought into surface contact with a mounting surface and a chip portion that is placed on the support plate, and that clamps a plurality of locations on the edge of the support plate.

各電子機器に用いられる例えば電界効果トランジスタ（Field Effect Transistor：以下、「FET」と称す）等の電子部品は、金属製の取付面に対して面接触可能な支持板と、支持板に載置されるチップ部とを備え、支持板の縁部における複数個を厚み方向に貫通する複数のネジを取付面に螺合することにより取り付けられる。
チップ部は、支持板に載置されるチップ本体と、チップ本体を覆う箱状の蓋部とを有する。支持板を取付面に面接触させることにより、電子部品に良好な放熱性、電気導通性を得ている。 For example, electronic components such as field effect transistors (hereinafter referred to as “FETs”) used in each electronic device are placed on a support plate that can be brought into surface contact with a metal mounting surface. And a plurality of screws that penetrate through a plurality of edges of the support plate in the thickness direction to the mounting surface.
The chip portion includes a chip body placed on the support plate and a box-shaped lid that covers the chip body. By bringing the support plate into surface contact with the mounting surface, good heat dissipation and electrical conductivity are obtained for the electronic component.

しかしながら、製造誤差などにより、取付面と支持板の中央部との間に隙間が生じる虞がある。隙間が生じると所望の放熱性や電気導通性が得られず、電子機器としての性能を保証できない。
また、電子部品の自己発熱により熱膨張することで、支持板に撓みが生じて隙間が生じる可能性もある。 However, there may be a gap between the mounting surface and the center portion of the support plate due to manufacturing errors. If the gap is generated, desired heat dissipation and electrical conductivity cannot be obtained, and performance as an electronic device cannot be guaranteed.
In addition, thermal expansion due to self-heating of the electronic component may cause the support plate to bend and create a gap.

この対策として、取付面と支持板との間に、支持板全面に沿う銅箔のシートを介装したり、取付面と支持板との間に、グリースを塗布したりする取付構造が提案されている（例えば、特許文献１）。
特開２００２−３５３３８８号公報 As countermeasures, a mounting structure has been proposed in which a copper foil sheet is interposed between the mounting surface and the support plate, or grease is applied between the mounting surface and the support plate. (For example, Patent Document 1).
JP 2002-353388 A

ところで、図７に示すように、取付面１０１と支持板１０２との間にシート１０３を介装する取付構造１００は、支持板１０２の左右側の縁部１０２Ａにネジ１０４を貫通させ、貫通させたネジ１０４を取付面１０１に螺合するという構造である。   By the way, as shown in FIG. 7, in the mounting structure 100 in which the sheet 103 is interposed between the mounting surface 101 and the support plate 102, screws 104 are passed through the left and right edges 102 </ b> A of the support plate 102. The screw 104 is screwed onto the mounting surface 101.

取付構造１００は、支持板１０２の左右側の縁部１０２Ａのみをネジ１０４で締め付けているだけなので、例えば支持板１０２の製造誤差や、チップ部１０５の自己発熱による支持板１０２の熱膨張で、取付面１０１と支持板１０２の中央部１０２Ｂが上方に持ち上がってしまう。
このため、取付面１０１と支持板１０２の中央部１０２Ｂとの間に生じた隙間を、金属泊のシートで緩和するには限界がある。 Since the mounting structure 100 only tightens the left and right edges 102A of the support plate 102 with screws 104, for example, due to manufacturing errors of the support plate 102 or thermal expansion of the support plate 102 due to self-heating of the chip portion 105, The mounting surface 101 and the central portion 102B of the support plate 102 are lifted upward.
For this reason, there is a limit in relaxing the gap generated between the mounting surface 101 and the central portion 102B of the support plate 102 with the metal stay sheet.

一方、図８に示すように、取付面１０１と支持板１０２との間にグリース１１１を塗布する取付構造１１０を採用すれば、取付面１０１と支持板１０２の中央部１０２Ｂとの間に生じた隙間を緩和することは可能である。
しかし、グリース１１１は電気的導通性がないため、取付構造１１０を採用すると、チップ部１０５の接地（グランド）が弱い、あるいは接地が取れないため、電気特性が不安定になる虞がある。 On the other hand, as shown in FIG. 8, when the mounting structure 110 that applies the grease 111 between the mounting surface 101 and the support plate 102 is employed, the gap is generated between the mounting surface 101 and the central portion 102 </ b> B of the support plate 102. It is possible to reduce the gap.
However, since the grease 111 does not have electrical continuity, if the mounting structure 110 is employed, the grounding (ground) of the chip portion 105 is weak or cannot be grounded, and thus the electrical characteristics may become unstable.

本発明は上記事情に鑑みてなされたもので、取付面に対して支持板を確実に面接触させることにより良好な放熱性、電気導通性が得られる電子部品の取付構造を提供することを目的とする。   The present invention has been made in view of the above circumstances, and an object thereof is to provide an electronic component mounting structure in which good heat dissipation and electrical conductivity can be obtained by reliably bringing a support plate into surface contact with a mounting surface. And

本発明の電子部品の取付構造は、取付面に対して面接触可能な支持板と、前記支持板に載置されるチップ部とを備え、前記支持板の縁部における複数箇所を厚み方向に貫通する複数のネジを前記取付面に螺合することにより取り付けられる電子部品の取付構造であって、前記チップ部を前記取付面に向かって押圧する押圧部材を備え、前記押圧部材が、前記支持板に載置されて前記ネジに共締めされる座部と、前記座部に接続されて前記チップ部の上面に弾性接触する接触部とを有し、前記接触部が前記チップ部の上面における縁部にのみ接触するように形成されていることを特徴とする。
An electronic component mounting structure according to the present invention includes a support plate that can be brought into surface contact with a mounting surface, and a chip portion that is placed on the support plate. A mounting structure of an electronic component that is mounted by screwing a plurality of penetrating screws to the mounting surface, and includes a pressing member that presses the chip portion toward the mounting surface, and the pressing member includes the support a seat which is mounted on the plate is fastened to the screw, is connected to said seat have a contact portion for elastically contacting the upper surface of the tip portion, the upper surface of the contact portion is the tip portion It is formed so that it may contact only an edge part .

押圧部材の座部を支持板にネジで共締めすることで、接触部をチップ部の上面に弾性接触させることで、押圧部材でチップ部を取付面に向けて押圧する。
よって、ネジの締め付け力と、接触部の弾性接触とにより、支持板全体を取付面に均一に接触させて、取付面に対して支持板を確実に面接触させることができる。
チップ部の上面における縁部にのみに接触部を接触させることで、接触部による押圧力をチップ部の側壁にかけることが可能になる。
よって、接触部による押圧力をチップ部の側壁を経て支持板に効率よく伝え、取付面に対して支持板をより確実に面接触させることができる。
By fastening the seat portion of the pressing member to the support plate with a screw, the contact portion is elastically brought into contact with the upper surface of the tip portion, and the tip portion is pressed toward the mounting surface by the pressing member.
Thus, the entire support plate can be brought into uniform contact with the mounting surface by the screw tightening force and the elastic contact of the contact portion, and the support plate can be reliably brought into surface contact with the mounting surface.
By bringing the contact portion into contact with only the edge portion on the upper surface of the tip portion, it becomes possible to apply a pressing force by the contact portion to the side wall of the tip portion.
Therefore, the pressing force by the contact portion can be efficiently transmitted to the support plate through the side wall of the tip portion, and the support plate can be more reliably brought into surface contact with the mounting surface.

また、本発明の電子部品の取付構造は、前記押圧部材が前記座部を複数有し、前記接触部が前記各座部に接続されていることを特徴とする。   The electronic component mounting structure according to the present invention is characterized in that the pressing member includes a plurality of the seat portions, and the contact portions are connected to the seat portions.

複数の座部をネジで共締めすることで、それぞれのネジによる締め付け力を接触部に伝える。よって、チップ部に対する接触部の押圧力が強くなり、取付面に対して支持板をより確実に面接触させることができる。   By tightening a plurality of seats together with screws, the tightening force of each screw is transmitted to the contact portion. Therefore, the pressing force of the contact portion with respect to the tip portion is increased, and the support plate can be more reliably brought into surface contact with the mounting surface.

本発明によれば、ネジの締め付け力、および接触部の弾性接触で、支持板全体を取付面に均一に接触させることで、取付面に対して支持板を確実に面接触させて良好な放熱性、電気導通性が得られるという効果を有する。   According to the present invention, the entire support plate is brought into uniform contact with the mounting surface by the screw tightening force and the elastic contact of the contact portion, so that the surface of the support plate is reliably brought into surface contact with the mounting surface. And electrical conductivity can be obtained.

図１〜図２に示すように、第１実施の形態の電子部品の取付構造１０は、金属製の取付面１１に対してシート１２を介して面接触可能な支持板１３と、支持板１３に載置されるチップ部（電子部品）１５とを備え、支持板１３の縁部１３Ａにおける複数箇所（左右端の２箇所）を厚み方向に貫通する複数（２個）のネジ１６を、取付面１１の取付孔１１Ａに螺合することにより取り付けられ、かつチップ部１５を取付面１１に向かって押圧する押圧部材１８を備え、押圧部材１８が、支持板１３に載置されてネジ１６に共締めされる左右側の座部１９と、左右側の座部１９に接続されてチップ部１５の上面１５Ａに弾性接触する接触部２１とを有する。   As shown in FIGS. 1 to 2, the electronic component mounting structure 10 according to the first embodiment includes a support plate 13 that can be brought into surface contact with a metal mounting surface 11 via a sheet 12, and a support plate 13. And a plurality of (two) screws 16 penetrating through a plurality of locations (two locations at the left and right ends) of the edge portion 13A of the support plate 13 in the thickness direction. The pressing member 18 is attached by screwing into the mounting hole 11A of the surface 11 and presses the tip portion 15 toward the mounting surface 11. The pressing member 18 is placed on the support plate 13 and attached to the screw 16. The left and right side seat portions 19 are fastened together, and the contact portion 21 is connected to the left and right side seat portions 19 and elastically contacts the upper surface 15A of the chip portion 15.

シート１２は、銅箔にエンボス（凹凸）加工を施したものである。支持板１３をネジ１６で取付面１１に取り付ける際に、取付面１１と支持板１３との間に、支持板１３全面に沿うように介装することで、シート１２のエンボスを潰して隙間を埋める。なお、シート１２は＋面接触である。
ここで、取付面１１と支持板１３との間の隙間は、支持板の製造誤差や、チップ部１５の自己発熱により熱膨張により支持板１３に撓みが生じることにより発生するものである。 The sheet 12 is obtained by embossing (unevening) a copper foil. When the support plate 13 is attached to the attachment surface 11 with the screws 16, the embossing of the sheet 12 is crushed by interposing the support plate 13 along the entire surface of the support plate 13 between the attachment surface 11 and the support plate 13. fill in. In addition, the sheet | seat 12 is + surface contact.
Here, the gap between the mounting surface 11 and the support plate 13 is generated when the support plate 13 is bent due to thermal expansion due to a manufacturing error of the support plate or self-heating of the chip portion 15.

支持板１３は、チップ部１５が略中央に載置されるとともに、左右の縁部１３Ａに凹部２３が形成された略矩形状の板材である。左右の凹部２３は、ネジ１６が差し込み可能に形成されている。   The support plate 13 is a substantially rectangular plate material in which the chip portion 15 is placed substantially at the center and the recesses 23 are formed in the left and right edge portions 13A. The left and right recesses 23 are formed so that the screws 16 can be inserted.

チップ部１５は、支持板１３に載置されるチップ本体２４と、チップ本体２４を覆う箱状の蓋部２５とを有する。
支持板１３を、シート１２を介して取付面１１に面接触させることにより、チップ本体２４に良好な放熱性、電気導通性が得られる。 The chip unit 15 includes a chip main body 24 placed on the support plate 13 and a box-shaped lid unit 25 that covers the chip main body 24.
By bringing the support plate 13 into surface contact with the mounting surface 11 via the sheet 12, good heat dissipation and electrical conductivity can be obtained in the chip body 24.

押圧部材１８は、座部１９を複数（一例として、左右側に２個）有し、それぞれの座部１９が接触部２１に接続されている。
接触部２１は、左右の鉛直片２７と、左右の鉛直片２７の上端間にかけ渡した押さえ片２８とを有し、左右の鉛直部２７および押さえ片２８で略Ｍ字状に形成されている。押さえ片２８は、中央部２８Ａを下方に向けて折り曲げることで、略く字状に形成されている。 The pressing member 18 has a plurality of seat portions 19 (two on the left and right sides as an example), and each seat portion 19 is connected to the contact portion 21.
The contact portion 21 includes a left and right vertical piece 27 and a pressing piece 28 that spans between the upper ends of the left and right vertical pieces 27, and is formed in a substantially M shape by the left and right vertical portions 27 and the pressing piece 28. . The holding piece 28 is formed in a substantially square shape by bending the central portion 28 </ b> A downward.

一対の接触部２１を、所定間隔をおいて配置した状態で、一対の左側鉛直片２７の下端に左側座部１９が設けられ、一対の右側鉛直片２７の下端に右側座部１９が設けられている。換言すれば、左右側の座部１９に、一対の接触部２１が所定間隔をおいて取り付けられている。   The left seat 19 is provided at the lower end of the pair of left vertical pieces 27 and the right seat 19 is provided at the lower end of the pair of right vertical pieces 27 with the pair of contact portions 21 arranged at a predetermined interval. ing. In other words, the pair of contact portions 21 are attached to the left and right seat portions 19 at a predetermined interval.

左右側の座部１９には、ネジ１６を差し込み可能な差込孔１９Ａがそれぞれ形成されている。
左右の差込孔１９Ａにネジ１６を差し込み、差し込んだネジ１６で支持板１３および座部１９を共締めすることで、押圧部材１８を組み付ける。この状態で、押さえ片２８の中央部２８Ａがチップ部１５の上面１５Ａに当接して、チップ部１５の上面１５Ａを押圧する。 The left-right seat 19 is formed with insertion holes 19A into which the screws 16 can be inserted.
The pressing member 18 is assembled by inserting screws 16 into the left and right insertion holes 19A and fastening the support plate 13 and the seat portion 19 together with the inserted screws 16. In this state, the central portion 28A of the pressing piece 28 comes into contact with the upper surface 15A of the chip portion 15 and presses the upper surface 15A of the chip portion 15.

ここで、図３に示すように、押さえ片２８の中央部２８Ａがチップ部１５の上面１５Ａに当接したとき、座部１９と支持板１３との間隔をＳ１とする。
一方、支持板１３にチップ部１５を載置した状態で、支持板１３をシート１２介して取付面１１に取り付けた際に発生する撓みをＳ２とする。Ｓ１とＳ２の関係は、Ｓ１＞Ｓ２である。
一例として、Ｓ１＝１ｍｍ以上であり、Ｓ２＝２０μｍ（ミクロン）である。 Here, as shown in FIG. 3, when the center portion 28A of the pressing piece 28 comes into contact with the upper surface 15A of the tip portion 15, the interval between the seat portion 19 and the support plate 13 is set to S1.
On the other hand, the bending which occurs when the support plate 13 is attached to the attachment surface 11 via the sheet 12 in a state where the chip portion 15 is placed on the support plate 13 is defined as S2. The relationship between S1 and S2 is S1> S2.
As an example, S1 = 1 mm or more, and S2 = 20 μm (micron).

よって、図４に示すように、押圧部材１８の左右側の座部１９を、支持板１３にネジ１６で共締めした際に、押圧部材１８（特に、押さえ片２８）が弾性変形する。
このように、押圧部材１８の座部１９を支持板１３にネジ１６で共締めすることで、接触部２１の中央部２８Ａをチップ部１５の上面１５Ａに弾性接触させることで、押圧部材１８でチップ部１５を取付面１１に向けて押圧する。 Therefore, as shown in FIG. 4, when the left and right seats 19 of the pressing member 18 are fastened together with the screws 16 to the support plate 13, the pressing member 18 (particularly, the pressing piece 28) is elastically deformed.
In this manner, by pressing the seat portion 19 of the pressing member 18 together with the support plate 13 with the screw 16, the central portion 28A of the contact portion 21 is brought into elastic contact with the upper surface 15A of the tip portion 15 so that the pressing member 18 The tip portion 15 is pressed toward the mounting surface 11.

よって、ネジ１６の締め付け力と、接触部２１の中央部２８Ａの弾性接触とにより、支持板１３全体を取付面１１に均一に接触させて、取付面１１に対して支持板１３を確実に面接触させることができる。   Therefore, the entire support plate 13 is uniformly brought into contact with the mounting surface 11 by the tightening force of the screw 16 and the elastic contact of the central portion 28 </ b> A of the contact portion 21. Can be contacted.

さらに、左右側の座部１９をネジ１６で共締めすることで、それぞれのネジ１６による締め付け力を接触部２１に伝える。
よって、接触部２１に複数の座部１９を連結することにより、複数のネジ１６による締め付け力を接触部２１に伝えることが可能になる。
これにより、チップ部１５に対する接触部２１の押圧力が強くなり、取付面１１に対して支持板１３をより確実に面接触させることができる。 Furthermore, by tightening the left and right seats 19 together with the screws 16, the tightening force of each screw 16 is transmitted to the contact portion 21.
Therefore, by connecting the plurality of seats 19 to the contact part 21, it is possible to transmit the tightening force by the plurality of screws 16 to the contact part 21.
As a result, the pressing force of the contact portion 21 against the tip portion 15 is increased, and the support plate 13 can be brought into surface contact with the mounting surface 11 more reliably.

ここで、図５（Ａ）に示すように、電子部品の取付構造１０は、一対の接触部２１を、所定間隔をおいて配置することで、それぞれの接触部２１がチップ部１５の上面１５Ａにおける縁部１５Ｂにのみ接触するように形成されている。   Here, as shown in FIG. 5A, the electronic component mounting structure 10 has a pair of contact portions 21 arranged at a predetermined interval so that each contact portion 21 has an upper surface 15 </ b> A of the chip portion 15. It is formed so as to contact only the edge 15B.

このように、チップ部１５の上面１５Ａにおける縁部１５Ｂにのみに接触部２１の中央部２８Ａを接触させることで、接触部２１による押圧力Ｆ１をチップ部１５の側壁１５Ｃにかけることが可能になる。
よって、接触部２１による押圧力がチップ部１５の側壁１５Ｃを経て支持板１３に効率よく伝えられる。 In this way, by bringing the central portion 28A of the contact portion 21 into contact only with the edge portion 15B of the upper surface 15A of the tip portion 15, the pressing force F1 by the contact portion 21 can be applied to the side wall 15C of the tip portion 15. Become.
Therefore, the pressing force by the contact portion 21 is efficiently transmitted to the support plate 13 through the side wall 15C of the tip portion 15.

一方、図５（Ｂ）の比較例に示すように、比較例の押圧部材５８の接触部５９を一体に形成し、この接触部５９の中央部５９Ａで、チップ部１５の中央部１５Ｄを押圧力Ｆ２で押圧すると、蓋部２５の中央部１５Ｄが変形してチップ本体２４に接触する虞がある。   On the other hand, as shown in the comparative example of FIG. 5B, the contact portion 59 of the pressing member 58 of the comparative example is integrally formed, and the central portion 15D of the tip portion 15 is pushed by the central portion 59A of the contact portion 59. When pressed with the pressure F2, the central portion 15D of the lid portion 25 may be deformed and come into contact with the chip body 24.

さらに、図６（Ａ）に示すように、電子部品の取付構造１０は、一対の接触部２１を、所定間隔をおいて配置することで、万が一接触部２１に、矢印方向のねじれが生じた場合でも、一対の接触部２１でチップ部１５の上面１５Ａにおける縁部１５Ｂに押圧力をかけることができる。
これにより、接触部２１による押圧力をチップ部１５の側壁１５Ｃにかけることが可能になり、一対の接触部２１による押圧力がチップ部１５の側壁１５Ｃを経て支持板１３に効率よく伝えられる。 Furthermore, as shown in FIG. 6 (A), the electronic component mounting structure 10 has a pair of contact portions 21 arranged at a predetermined interval so that the contact portions 21 are twisted in the direction of the arrow. Even in this case, the pair of contact portions 21 can apply a pressing force to the edge portion 15B of the upper surface 15A of the tip portion 15.
Thereby, it becomes possible to apply the pressing force by the contact portion 21 to the side wall 15C of the tip portion 15, and the pressing force by the pair of contact portions 21 is efficiently transmitted to the support plate 13 through the side wall 15C of the tip portion 15.

一方、図６（Ｂ）の比較例に示すように、比較例の押圧部材５８の接触部５９を一体に形成すると、万が一接触部５９に、矢印方向のねじれが生じた場合には、接触部５９の縁部５９Ｂで、チップ部１５の上面１５Ａにおける一方の縁部１５Ｂのみに押圧力をかけることになる。
このため、押圧力がチップ部１５に偏ってかかってしまい、チップ部１５を支持板１５に均一に押し付けることが難しい。 On the other hand, as shown in the comparative example of FIG. 6B, if the contact portion 59 of the pressing member 58 of the comparative example is formed integrally, if the contact portion 59 is twisted in the direction of the arrow, the contact portion The pressing force is applied only to one edge 15B of the upper surface 15A of the tip 15 at the edge 59B of 59.
For this reason, the pressing force is biased toward the tip portion 15, and it is difficult to press the tip portion 15 against the support plate 15 uniformly.

なお、前記実施の形態では、押圧部材１８の押さえ片２８を略く字状に曲げ、中央部２８Ａでチップ部１５の上面１５Ａを押圧する例について説明したが、その他の例として、例えば押さえ片２８を湾曲状に形成することも可能である。   In the above-described embodiment, the example in which the pressing piece 28 of the pressing member 18 is bent in a substantially square shape and the upper surface 15A of the tip portion 15 is pressed by the central portion 28A has been described. It is also possible to form 28 in a curved shape.

また、前記実施の形態では、支持部１３の左右の縁部１３Ａにネジ１６の取付孔を形成し、取付孔に差し込んだネジ１６で支持板１３を締め付ける例について説明したが、その他の例として、左右の縁部１３Ａに加えて、前後の縁部をネジ１６で締め付けるように構成することも可能である。
この場合、４本のネジ１６の締付力を、押圧部材１８の押さえ片２８に伝えることができるので、押さえ片２８でチップ部１５の上面１５Ａを、より強く押圧できる。 Further, in the above-described embodiment, the example in which the mounting holes for the screws 16 are formed in the left and right edge portions 13A of the supporting portion 13 and the supporting plate 13 is tightened with the screws 16 inserted into the mounting holes has been described. In addition to the left and right edge portions 13 </ b> A, the front and rear edge portions can be tightened with screws 16.
In this case, the tightening force of the four screws 16 can be transmitted to the pressing piece 28 of the pressing member 18, so that the upper surface 15 </ b> A of the tip portion 15 can be pressed more strongly with the pressing piece 28.

本発明は、取付面に対して面接触可能な支持板と、この支持板に載置されるチップ部とを備え、支持板の縁部における複数箇所を締め付ける電子部品の取付構造への適用に好適である。   The present invention includes a support plate that can be brought into surface contact with the mounting surface, and a chip portion that is placed on the support plate, and is applied to an electronic component mounting structure that tightens a plurality of locations on the edge of the support plate. Is preferred.

本発明に係る電子部品の取付構造を示す分解斜視図である。It is a disassembled perspective view which shows the attachment structure of the electronic component which concerns on this invention. 本発明に電子部品の取付構造を示す斜視図である。It is a perspective view which shows the attachment structure of an electronic component in this invention. 本発明に係る電子部品の取付構造の特性について説明した図である。It is a figure explaining the characteristic of the attachment structure of the electronic component which concerns on this invention. 本発明に係る電子部品の取付構造の側面図である。It is a side view of the electronic component mounting structure according to the present invention. 本発明に係る電子部品の取付構造の押圧力について説明した図である。It is a figure explaining the pressing force of the attachment structure of the electronic component which concerns on this invention. 本発明に係る電子部品の取付構造がねじれた場合について説明する図である。It is a figure explaining the case where the attachment structure of the electronic component which concerns on this invention is twisted. 従来の電子部品の取付構造を示す側面図である。It is a side view which shows the attachment structure of the conventional electronic component. 従来のもう一つの電子部品の取付構造を示す側面図である。It is a side view which shows the attachment structure of another conventional electronic component.

符号の説明Explanation of symbols

１０ 電子部品の取付構造
１１ 取付面
１３ 支持板
１３Ａ 支持板の縁部
１５ チップ部（電子部品）
１６ ネジ
１８ 押圧部材
１９ 座部
２１ 接触部 DESCRIPTION OF SYMBOLS 10 Electronic component mounting structure 11 Mounting surface 13 Support plate 13A Edge of support plate 15 Chip portion (electronic component)
16 Screw 18 Pressing member 19 Seat part 21 Contact part

Claims (2)

取付面に対して面接触可能な支持板と、前記支持板に載置されるチップ部とを備え、前記支持板の縁部における複数箇所を厚み方向に貫通する複数のネジを前記取付面に螺合することにより取り付けられる電子部品の取付構造であって、
前記チップ部を前記取付面に向かって押圧する押圧部材を備え、
前記押圧部材が、前記支持板に載置されて前記ネジに共締めされる座部と、
前記座部に接続されて前記チップ部の上面に弾性接触する接触部とを有し、
前記接触部が前記チップ部の上面における縁部にのみ接触するように形成されていることを特徴とする電子部品の取付構造。 A support plate that can be brought into surface contact with the mounting surface, and a chip portion that is placed on the support plate, and a plurality of screws that penetrate a plurality of locations in the edge of the support plate in the thickness direction are provided on the mounting surface. An electronic component mounting structure that is mounted by screwing,
A pressing member that presses the tip portion toward the mounting surface;
The pressing member is placed on the support plate and seated together with the screw;
Is connected to said seat have a contact portion for elastically contacting the upper surface of the tip portion,
An attachment structure for an electronic component, wherein the contact portion is formed so as to contact only an edge portion on an upper surface of the chip portion . 前記押圧部材が前記座部を複数有し、前記接触部が前記各座部に接続されていることを特徴とする請求項１に記載の電子部品の取付構造。   The electronic component mounting structure according to claim 1, wherein the pressing member includes a plurality of the seat portions, and the contact portions are connected to the seat portions.
JP2004226400A 2004-08-03 2004-08-03 Electronic component mounting structure Expired - Fee Related JP4417199B2 (en)

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JP4643703B2 (en) * 2008-11-21 2011-03-02 株式会社東芝 Semiconductor device fixture and mounting structure thereof
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