JP5191929B2 - Semiconductor element mounting structure - Google Patents

Description

  The present invention relates to a structure for attaching a semiconductor element to a radiation fin.

  As shown in Patent Document 1 or FIG. 12, conventionally, a semiconductor element 1 has three linear lead terminals 5 arranged in parallel at the same pitch P on the lower side of an element body 3 made of synthetic resin. The semiconductor element 3 is attached to the substrate 7 by providing through holes 9 in the printed circuit board 7 in accordance with the pitch P of the lead terminals 5, inserting the lead terminals 5 into the through holes 9, and connecting the lead terminals from the back side of the printed circuit board 7. 5 is soldered.

  By the way, in the structural design of electronic equipment, heat dissipation of the heat generating component is an important issue, and conventionally, a structure in which the heat generating component is attached to the heat radiating fin is widely adopted as a heat dissipation measure.

  The semiconductor element as a heat-generating component is also radiated by attaching it to the radiating fin. Conventionally, when the semiconductor element is attached to the radiating fin, it is screwed to the printed circuit board 7 as shown in FIG. While the back surface 3a side of the element body 3 is brought into contact with the side surface 11a of the radiation fin 11, the lead terminal is inserted into the through hole, and the semiconductor element 1 is screwed to the radiation fin 11 with a screwdriver from the lateral direction.

JP-A-8-46106 JP 2008-78216 A

  However, among electronic devices that require small size and high density, the mounting / removal of semiconductor elements on the printed circuit board cannot be used by the driver because the surrounding electronic components are in the way. / To remove, the heat dissipating fins had to be removed from the printed circuit board, which required a lot of labor and man-hours.

  Further, in Patent Document 2, as shown in FIG. 14, in a mounting structure in which a first heat radiating plate 13 and a second heat radiating plate 15 are mounted facing each other on a printed circuit board 17, a driver is attached to the first heat radiating plate 13. When the semiconductor element 25 is attached / detached to / from the second heat sink 15, the first heat sink 13 or the second heat sink 15 is provided. A mounting structure for a heat sink is disclosed in which the semiconductor element 25 can be attached / detached without being removed.

  However, in this conventional structure, it takes time to provide the notch 21 and the hole 23 in the first heat radiating plate 13, and the semiconductor element 25 is attached to the part where the notch 21 and the hole 23 are provided. There was a drawback that could not.

  The present invention has been devised in view of such circumstances, and an object of the present invention is to provide a semiconductor element mounting structure in which a semiconductor element can be easily attached / detached to / from a heat radiating fin without being affected by peripheral devices.

  In order to achieve such an object, a semiconductor element mounting structure according to claim 1 is attached to a side surface of a heat radiating fin mounted on a printed circuit board via a mounting piece having an L-shaped cross section. A semiconductor element in which a pressing piece having a substantially J-shaped cross section that extends downward from the front projecting end of the mounting piece toward the radiating fin in an arc shape and presses and holds the semiconductor element on the side surface of the radiating fin is extended. The holding member is formed of a strip-like plate material having spring properties, and a small hole is formed on the lower end side of the curved piece so that the tip of the rod-like operation member can be inserted from above, and the semiconductor element is held via the mounting piece. A member is rotatably attached to the side surface of the radiation fin, the tip of the operation member is inserted into the small hole from above, the pressing piece is moved outward with the front protruding end of the attachment piece as a fulcrum of the operation member, Of the pressing piece and the radiation fin The semiconductor element can be attached to / detached from the side surface of the radiation fin by forming a gap between which the semiconductor element can be inserted and removed and rotating the semiconductor element holding member. .

  According to a second aspect of the present invention, in the semiconductor element mounting structure according to the first aspect, a notch for a fulcrum for positioning the operating member is provided at a front projecting end of the mounting piece. The invention according to claim 3 is characterized in that, in the semiconductor element mounting structure according to claim 2, the notch is formed coaxially with the small hole.

  According to a fourth aspect of the present invention, in the semiconductor element mounting structure according to any one of the first to third aspects, a stopper for preventing the operation member from dropping is provided in the small hole. According to a fifth aspect of the present invention, in the semiconductor element mounting structure according to any one of the first to fourth aspects, the mounting surface of the mounting piece to the radiating fin is It is characterized by being bent toward the heat radiating fin.

  Furthermore, the invention according to claim 6 is the semiconductor element mounting structure according to any one of claims 1 to 5, wherein the mounting piece is mounted wider than the plate thickness of the mounting piece. It is characterized in that it is rotatably attached to the side surface of the heat radiating fin through a bush formed with a single support portion.

  According to the first aspect of the present invention, even when peripheral devices are already mounted on the printed circuit board, heat is dissipated by operating the rod-shaped operation member from above by using the semiconductor element holding member utilizing the action of the lever. The semiconductor element can be easily attached / detached to / from the side surface of the fin. As a result, it has become possible to reduce a great amount of labor and man-hours in the conventional attaching / detaching.

  According to the invention of claim 2, since the notch is provided at the front projecting end of the mounting piece, the operation member is not shaken in the lateral direction by locking the operation member during operation of the operation member. According to the invention which concerns on claim | item 3, a small hole and a notch are arrange | positioned coaxially, Therefore The movement operation | movement to the outward of a pressing piece by an operation member and rotation operation can also be performed easily.

  Furthermore, according to the invention according to claim 4, since the stopper for preventing the operation member from dropping is provided in the small hole, the mounting / removal of the semiconductor element by the operation member can be performed more smoothly, and the invention according to claim 5 According to the invention, since the idle rotation of the semiconductor element holding member rotatably attached to the radiating fin is prevented, there is an advantage that the semiconductor element can be reliably pressed and held by the semiconductor element holding member.

  And by using the bush which concerns on the invention which concerns on Claim 6, a semiconductor element holding member can always be rotatably attached to a radiation fin.

It is a side view of the attachment structure of the semiconductor element which concerns on one Embodiment of the Claims 1 thru | or 6. It is a top view of a holding member. It is a front view of a holding member. It is a bottom view of a holding member. It is a perspective view of a holding member. It is a side view of a holding member. It is a perspective view of a bush. It is a top view of the attachment structure of a semiconductor element. It is a side view of the attachment structure of a semiconductor element. It is a front view of the attachment structure of a semiconductor element. It is a front view of the attachment structure of a semiconductor element. It is explanatory drawing of the attachment method of the conventional semiconductor element. It is a side view of the conventional semiconductor element mounting structure. It is explanatory drawing of the attachment structure of the other conventional semiconductor element.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIGS. 1 to 11 relate to a semiconductor element mounting structure according to an embodiment of claims 1 to 6. In FIG. 1, reference numeral 31 denotes a lower part of an element body 33, similar to the semiconductor element 1 of FIG. 3 is a semiconductor element in which three lead terminals 35 are arranged in parallel at the same pitch, 37 is a heat radiation fin fixed on a printed circuit board 39 by a fixing screw 41, and the semiconductor element 31 is attached to a side surface 43 of the heat radiation fin 37. A semiconductor element holding member 45 that is rotatably attached is attached to the radiation fins 37, and an insulating sheet 47 is interposed between the element body 33 and the side surfaces 43 of the radiation fins 31.

  2 to 6 show details of a semiconductor element holding member (hereinafter referred to as “holding member”) 45, the holding member 45 having an attachment piece 49 formed in an L-shaped cross section and a forward projecting end of the attachment piece 49. 51, a pressing piece 53 having a substantially J-shaped cross section that is curved downward in a circular arc shape toward the side surface 43 of the heat radiating fin 37. These use a single plate-shaped spring stainless steel cut into a strip shape. The mounting piece 49 and the pressing piece 53 have the same width dimension.

  The holding member 45 has a mounting piece 49 rotatably attached to the side surface 43 of the radiating fin 37 by a fixing screw 55 using a conventionally known bush 71 having a T-shaped cross section shown in FIG. An insertion hole 57 through which the cylindrical portion (attachment piece support portion) 71 a of the bush 71 is inserted is provided in the center of the attachment surface 49 a to the heat radiation fin 37. Note that the dimension L of the cylindrical portion 71a of the bush 71 shown in FIG. 7 is slightly longer than the plate thickness of the mounting piece 49 (mounting surface 49a).

  Further, as shown in FIGS. 2 and 5, the mounting surface 49a has a shape that is slightly curved in the width direction and bent back to the anti-radiating fin side. As shown in FIGS. 1 and 8, the holding member 45 by the fixing screw 55 is used. At the time of attachment, the attachment surface 49 a is deformed flat along the side surface 43 to prevent the holding member 45 that is rotatably attached to the side surface 43 from rotating freely.

  Then, as shown in FIG. 5, a U-shaped cut in plan view in which the shaft portion 61 of the driver (bar-like operation member) 59 can be locked as shown in FIGS. A notch 63 is provided.

  On the other hand, as described above, the pressing piece 53 has a substantially J-shaped cross section that is curved downward in a circular arc shape from the front protruding end 51 of the mounting piece 49 toward the side surface 43 of the radiating fin 37, and is held as shown in FIG. When the member 45 is attached to the side surface 43 of the radiating fin 37, the minimum width between the pressing piece 53 that curves toward the side surface 43 and the side surface 43 is set shorter than the thickness of the element body 33 of the semiconductor element 31. Yes.

  Accordingly, the semiconductor element 31 (element body 33) can be sandwiched between the pressing piece 53 and the side surface 43 of the heat radiation fin 37, and the center of the element body 33 in the vertical direction is pressed by the elastic force (restoring force) of the pressing piece 53. Thus, the semiconductor element 31 is pressed and held on the side surface 43 of the radiating fin 37.

  Furthermore, the tip of the shaft portion 61 of the driver 59 can be inserted from above into the center in the width direction of the folded bottom portion 65 on the tip side of the pressing piece 53 having a substantially J-shaped cross section as shown in FIGS. A small hole 67 is provided.

  The small hole 67 is formed by making a U-shaped cut in a plan view in the folded bottom portion 65 and raising it downward, and the raised protrusion 69 projects horizontally forward and is inserted into the small hole 67. It functions as a stopper that prevents the driver 59 from falling. As described above, the small hole 67 and the notch 63 are both formed in the center in the width direction and arranged coaxially, and the semiconductor element 31 is connected to the heat radiating fin via the holding member 45 as shown in FIG. 37, when the shaft portion 61 of the driver 59 is engaged with the notch 63 and the tip of the shaft portion 61 is inserted into the small hole 67, the driver 59 is parallel to the heat radiation fin 37. It is supposed to be arranged in.

  1, when the driver 59 is tilted toward the radiating fin 37 side (in the direction of arrow A in the figure) with the notch 63 as a fulcrum as shown in FIG. 9, the small hole 67 becomes the point of action by the action of the lever. Thus, the pressing piece 53 moves (deforms) in the direction of arrow B, so that a gap is formed between the pressing piece 53 and the semiconductor element 31. Since the holding member 45 is rotatably attached to the side surface 43 of the radiating fin 37 via the bush 71, the driver 59 is moved in the direction of arrow C from the state of FIG. 9 as shown in FIGS. 10 and 11, for example. When operated, the holding member 45 rotates in the same direction around the fixing screw 55.

  The holding member 45 used in the present embodiment is configured as described above. Next, a method of attaching / detaching the semiconductor element 31 using the holding member 45 will be described.

  First, when attaching the semiconductor element 31, the radiation fins 37 are attached to the printed circuit board 39 using the fixing screws 41. Then, a shaft portion (not shown) of the fixing screw 55 is inserted into the bush 71, the cylindrical portion 71 a is inserted into the insertion hole 57 provided in the mounting surface 49 a of the mounting piece 49, and the fixing screw 55 is inserted into the radiating fin. 37 is screwed to a mounting screw hole (not shown) provided on the side surface 43 with a specified torque.

  As a result, the holding member 45 is rotatably attached to the side surface 43 of the radiating fin 37, but by using the bush 71, the holding member 45 is always rotatably attached even if the fixing screw 55 is tightened excessively.

  Then, as shown in FIG. 5, the mounting surface 49 a that has warped toward the anti-radiation fin is deformed into a flat shape along the side surface 43 by tightening the fixing screw 55 as shown in FIG. 8. The biting of the portion prevents the holding member 45, which is rotatably attached to the side surface 43, from rotating freely. Then, the insulating sheet 47 is lightly placed on the side surface 43 of the radiating fin 37.

  Note that the holding member 45 may be attached to the side surface 43 of the radiation fin 37 in advance using the bush 71 before the radiation fin 37 is attached to the printed circuit board 39.

  Then, as shown in FIG. 1, the shaft portion 61 of the driver 59 is engaged with the notch 63 from above the holding member 45, and the tip of the shaft portion 61 is inserted into the small hole 67. At this time, the tip of the shaft portion 61 is raised and comes into contact with the projecting piece 69, so that the driver 59 is prevented from falling downward. From such a state, if the driver 59 is tilted toward the radiating fin 37 side (in the direction of arrow A in the figure) with the notch 63 as a fulcrum as shown in FIG. 9, the small hole 67 is pressed by the action of the lever. The piece 53 is deformed in the direction of arrow B, and a large gap is formed between the side surface 43 of the radiating fin 37.

 Next, as shown in FIGS. 10 and 11, the driver 59 is operated in the direction of arrow C to rotate the holding member 45 in the same direction to form a wide space in the mounting portion of the semiconductor element 31. While element 35 is inserted into a through hole (not shown) of printed circuit board 39, element body 33 is brought into contact with side surface 43 of radiating fin 37.

  Then, if the holding member 45 rotated in the direction of the arrow C is returned to the original position shown in FIG. 10 and the pressing piece 53 that has been deformed in the direction of the arrow B is returned to the original shape shown in FIG. The center of the element main body 33 in the vertical direction is pressed by the elastic force (restoring force), and the semiconductor element 31 is pressed and held on the side surface 43 of the radiation fin 37.

  Thereafter, the lead terminal 35 is soldered from the back side of the printed circuit board 39, and the mounting operation of the semiconductor element 31 is completed.

  On the other hand, when a situation occurs in which the semiconductor element 31 is replaced due to long-term use, even if other peripheral devices (not shown) are mounted on the printed circuit board 39, after the solder of the lead terminals 35 is removed, The driver 59 may be used to perform the same operation as that described above.

  That is, first, as shown in FIG. 1, the shaft portion 61 of the driver 59 is locked to the notch 63 from above the holding member 45, and the tip of the shaft portion 61 is inserted into the small hole 67.

  Then, as shown in FIG. 9, the driver 59 is tilted toward the heat radiating fin 37 (in the direction of arrow A in the figure) with the notch 63 as a fulcrum, and the pressing piece 53 is moved in the direction of arrow B with the small hole 67 as the point of action. 10 and 11, when the holding member 45 is rotated in the same direction by operating the driver 59 as shown in FIGS. 10 and 11, the semiconductor element 33 is exposed. A new semiconductor element may be attached to the side surface 43 of the radiating fin 37 again by the procedure described above.

  As described above, according to the present embodiment, even if peripheral devices are already mounted on the printed circuit board 39, a driver 59 (bar-shaped operation member) from above can be obtained by using the holding member 45 utilizing the action of the lever. ), The semiconductor element 31 can be easily attached / detached to / from the side surface 43 of the radiating fin 37. As a result, it is possible to reduce the conventional labor and man-hour when attaching / detaching the semiconductor element 31. became.

  Further, since the notch 63 is provided in the forward projecting end 51, the shaft portion 61 does not shake laterally when the driver 59 is operated, and the tip of the shaft portion 61 is raised and abuts against the projecting piece 69. Since the downward drop is prevented, the semiconductor element 31 can be mounted / removed smoothly, and the small hole 67 and the notch 63 are formed at the center in the width direction of the holding member 45 and are arranged coaxially. Therefore, the deformation operation of the pressing piece 53 by the driver 59 in the arrow B direction and the rotation operation of the holding member 45 in the arrow C direction can be easily performed.

  Further, the mounting surface 49a that is slightly curved in the width direction and warps toward the anti-radiating fin side is deformed into a flat shape along the side surface 43 by tightening the fixing screw 55 as shown in FIG. Due to the biting of the corners, the holding member 45 that is rotatably attached to the side surface 43 is prevented from rotating freely.

  For this reason, the holding member 45 does not rotate carelessly, and there is an advantage that the semiconductor element 31 can be reliably pressed and held.

  In addition, in the present embodiment, the dimension L of the cylindrical portion 71a of the bush 71 is formed slightly longer than the plate thickness of the mounting piece 49 (mounting surface 49a). Even if 55 is tightened too much, the holding member 45 can always be rotatably attached.

  In addition, although the said embodiment demonstrated attachment / detachment of the one semiconductor element 31, it is also possible to mount several holding members 45 side by side on the side of a long radiating fin, and the number of the semiconductor elements 31 to attach. Accordingly, the number of holding members 45 attached to the side surface 43 may be appropriately selected.

31 Semiconductor element 33 Element body 35 Lead terminal 37 Radiation fin 39 Printed circuit board 43 Radiation fin side surface 45 Holding member 47 Insulating sheet 49 Mounting piece 49a Mounting surface 51 Front projecting end 53 Pressing piece 59 Driver 61 Driver shaft 63 Notch 67 Small hole 69 Raising protrusion 71 Bush 71a Bush cylindrical part

Claims (6)

Attached to the side surface of the radiating fin mounted on the printed circuit board via a mounting piece having an L-shaped cross section, and curved downward in an arc from the front projecting end of the mounting piece toward the radiating fin. And forming a semiconductor element holding member having a substantially J-shaped pressing piece that presses and holds the semiconductor element on the side surface of the heat dissipating fin with a strip-shaped plate material having spring properties. On the lower end side, the tip of the rod-shaped operation member forms a small hole that can be inserted from above,
A semiconductor element holding member is rotatably attached to the side surface of the radiation fin via the mounting piece,
The tip of the operating member is inserted into the small hole from above, the pressing piece is moved outward with the front projecting end of the mounting piece as a fulcrum of the operating member, and a semiconductor is formed between the pressing piece and the side surface of the radiation fin A semiconductor element mounting structure characterized in that a semiconductor element can be attached / detached to / from a side surface of a radiation fin by forming a gap in which an element can be inserted / removed and rotating a semiconductor element holding member.   2. The semiconductor element mounting structure according to claim 1, wherein a notch for a fulcrum for positioning the operation member is provided at a front projecting end of the mounting piece.   The semiconductor element mounting structure according to claim 2, wherein the notch is formed coaxially with the small hole.   The semiconductor element mounting structure according to claim 1, wherein a stopper for preventing the operation member from dropping is provided in the small hole.   5. The semiconductor element mounting structure according to claim 1, wherein a mounting surface of the mounting piece to the heat radiating fin is curved to the side opposite to the heat radiating fin. The said attachment piece is rotatably attached to the side surface of the radiation fin through the bush in which the attachment piece support part wider than the plate | board thickness of this attachment piece was formed. The semiconductor element mounting structure according to any one of the above.

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