JP2011171332A - Heat-dissipation system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve such a problem that it is required to press a metal plate without a gap against on a heat-dissipating sheet stacked on an electronic component, therefore, if external force such as drop impact is applied to the metal plate, the impact is directly transmitted to the heat-dissipating sheet and the electronic component, and consequently, the electronic component is broken. <P>SOLUTION: A heat-dissipation system comprises: a leaf spring 101 that is composed of a heat-receiving part 104 installed on an electronic component 113 while sandwiching a heat-dissipating sheet 109 therebetween so as to receive heat from the electronic component 113, and each long spring 102 and each short spring 103 respectively integrally molded with the heat-receiving part 104 while forming an acute angle from the heat-receiving part 104; the heat-dissipating sheet 109 for covering the leaf spring 101 from the outer surface; and a metal plate 115 for pressing the long springs 102 and short springs 103, covered with the heat-dissipating sheet 109, from above. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a heat dissipation system for dissipating heat from an electronic component such as an IC mounted on a substrate.

  An electronic component such as an IC used in an electronic device is damaged when the temperature of the electronic component becomes high due to the heat generated by the electronic component itself or the influence of an increase in ambient temperature. Therefore, it is necessary to dissipate the heat.

  In order to solve the above problems, Patent Document 1 proposes a heat dissipation structure using a heat dissipation sheet.

  FIG. 7 shows a heat dissipation structure using the heat dissipation sheet, where (a) is a perspective view and (b) is a cross-sectional view thereof.

  According to Patent Document 1, in a fixing mechanism for fixing a heat radiating sheet for radiating heat of an electronic component to the outer surface of the electronic component mounted on the substrate, the heat radiating sheet provided in the substrate or the housing for accommodating the substrate is attached to the electronic component. There is provided a configuration comprising pressing means for elastically pressing the pressing means, and pressing force dispersing means provided between the heat radiation sheet and distributing the pressing force of the pressing means.

  A plate provided between the both sides of the metal plate 44 and the inner wall of the housing 1 so that the metal plate 44 covering the heat radiating sheet 10 provided on the electronic component 3 is directed toward the heat radiating sheet 10. It is configured to be pressed by a spring 45. In this way, since the heat dissipation sheet 10 can be securely attached to the electronic component 3 and the metal plate 44, the heat of the electronic component 3 can be effectively radiated to the metal plate 44.

JP 2004-281790 A

  However, in the conventional heat dissipation structure using the heat dissipation sheet, it is necessary to press the metal plate 44 onto the heat dissipation sheet 10 stacked on the electronic component 3 without a gap, and thus, for example, when the metal plate is an outer component. When an external force such as a drop impact is applied to the metal plate 44, the impact is directly transmitted to the heat radiating sheet 44 and the electronic component 3, which causes a problem that the electronic component 3 is damaged.

  The present invention solves the above-mentioned conventional problems, and by dissipating heat to a metal plate located at a certain distance from the electronic component, the transmission of external force applied to the metal plate to the electronic component is suppressed. An object of the present invention is to reduce damage to the electronic component and to dissipate heat from the electronic component.

  In order to solve the above-described conventional problems, a heat dissipation system according to the present invention is installed on an electronic component with the heat dissipation sheet sandwiched between the heat receiving portion that receives heat from the electronic component, and an acute angle formed from the heat receiving portion. A leaf spring composed of a long spring portion and a short spring portion that are integrally formed with the heat receiving portion, a heat dissipating sheet that covers the leaf spring from the outer surface, and the long spring portion covered with the heat dissipating sheet. A metal plate that presses the short spring portion from above.

  According to the heat dissipation system according to the present invention, by radiating heat to a metal plate located at a certain distance from the electronic component, the external force applied to the metal plate is suppressed from being transmitted to the electronic component, thereby damaging the electronic component. It is possible to reduce the heat of the electronic component.

  Further, in the heat dissipation system according to the present invention, the metal plate includes a projecting portion protruding downward, and the projecting portion includes the long spring portion and the short spring portion in which the metal plate is covered by the heat dissipating sheet. Also in the groove between the long spring and the short spring generated when pressing, the heat dissipation sheet is pressed in close contact with the long spring portion and the short spring portion.

  According to the heat dissipation system according to the present invention, the protrusion of the metal plate also dissipates heat in the groove between the long spring and the short spring generated when the metal plate presses the long spring portion and the short spring portion covered with the heat dissipation sheet. By pressing the sheet in close contact with the long and short spring parts, heat is dissipated to the metal plate located at a distance from the electronic component, thereby transmitting external force applied to the metal plate to the electronic component. By suppressing it, it is possible to reduce damage to the electronic component and to dissipate the heat of the electronic component more efficiently.

  According to the heat dissipation system according to the present invention, by radiating heat to a metal plate located at a certain distance from the electronic component, the external force applied to the metal plate is suppressed from being transmitted to the electronic component, thereby damaging the electronic component. It is possible to reduce the heat of the electronic component.

(A) Front view (b) Plan view (c) Side view (d) Perspective view of leaf spring according to Embodiment 1 of the present invention (A) Side view showing a method of fixing a heat dissipation sheet to a leaf spring (b) Side view showing a state after fixing the heat dissipation sheet to a leaf spring (c) Obliquely upward of the leaf spring Plan view seen from (A) Plan view (b) Side view (c) Rear view when a leaf spring to which a heat dissipation sheet according to Embodiment 1 of the present invention is fixed is mounted on an electronic component. The block diagram showing the state after attaching (a) the state before attaching a metal plate to the case where the printed circuit board and leaf spring concerning Example 1 of the present invention were fixed (a). (A) The block diagram showing the state before attaching a metal plate to the housing | casing to which the printed circuit board and leaf | plate spring concerning Example 2 of this invention were fixed (b) The block diagram showing the state after attaching (A) The figure which shows the triangular-shaped projection part with which a metal plate is provided concerning Example 2 of this invention (b) The figure which shows the square-shaped projection part with which a metal plate is equipped (A) perspective view (b) cross-sectional view of heat dissipation structure using heat dissipation sheet according to conventional example

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.

  FIG. 1 is a leaf spring according to a first embodiment of the present invention, in which (a) is a front view of the leaf spring, (b) is a plan view of the leaf spring, (c) is a side view of the leaf spring, (d). FIG. 3 is a perspective view of a leaf spring.

  In FIG. 1, the leaf spring 101 includes four long spring portions 102, three short spring portions 103 that are shorter than the long spring portions 102, and a heat receiving portion 104 configured on the electronic component side. Yes.

  The long spring portion 102 and the short spring portion 103 are formed integrally with the heat receiving portion 104 at an acute angle from the heat receiving portion 104, and the heat receiving portion 104 is disposed on an electronic component (not shown). It is installed on both sides.

  Here, the leaf spring 101 is made of an elastic material such as stainless steel.

  In addition, it is desirable that the bending angle 105 of the long spring portion 102 of the leaf spring 101 from the heat receiving surface 104 and the bending angle 106 of the short spring portion 103 from the heat receiving surface 104 are substantially equal. They may be different as long as the action of the spring portion 103 is not hindered.

  Further, the length of the long spring portion 102 and the short spring portion 103 and the difference 107 between them, and the width 108 of the long spring portion 102 and the short spring portion 103 do not disturb the action of the long spring portion 102 and the short spring portion 103 which will be described later. If it is a range, it will not specifically limit.

  In the first embodiment, four long spring portions 102 and three short spring portions 103 are provided. However, as long as the functions of the long spring portion 102 and the short spring portion 103 described later are not hindered. The number is not limited to the above.

  FIG. 2 is a diagram illustrating a method of fixing the heat dissipation sheet to the leaf spring according to the first embodiment of the present invention, and a state after the heat dissipation sheet is fixed to the leaf spring, and (a) fixing the heat dissipation sheet to the leaf spring. The side view showing the method to do, (b) is a side view showing the state after fixing a heat-radiating sheet to a leaf | plate spring, (c) is the top view which looked at the leaf | plate spring from diagonally upward.

  In FIG. 2, the heat radiating sheet 109 is made of a material having high thermal conductivity such as a graphite sheet, and in the range 110 from the heat receiving portion 104 of the leaf spring 101 to the roots of the long spring portion 102 and the short spring portion 103. On the other hand, the long spring portion 102 and the short spring portion 103 are not fixed with adhesive or the like from the root to the tip portion.

  The heat dissipating sheet 107 only needs to have a length up to substantially the tip of the long spring portion 102, and the width is desirably a width that covers the entire long spring 102 and the short spring 103. It is not limited to this.

  FIG. 3 is a configuration diagram when a leaf spring to which a heat dissipation sheet according to Example 1 of the present invention is fixed is mounted on an electronic component, (a) is a plan view thereof, (b) is a side view thereof, (C) is a rear view thereof.

  In FIG. 3, an electronic component 113 is mounted on a printed circuit board 112 attached to the bottom plate 111.

  Here, a heat radiating sheet 109 fixed to the heat receiving portion 104 side of the plate spring 101 is installed on the electronic component 113 so as to be in close contact with the electronic component 113, and the plate spring 101 is securely attached to the bottom plate 111 or the like with screws 114. Secure to. The fixing of the leaf spring 101 is not limited to the fixing to the bottom plate 111 with the screws 114, and other fixing methods may be used.

  FIG. 4 is a configuration diagram when a metal plate is attached to the housing to which the printed circuit board and the leaf spring are fixed in FIG. 3, and (a) is a configuration diagram showing a state before the metal plate is attached, (b). These are the block diagrams showing the state after attaching a metal plate.

  As shown in FIG. 4, a metal plate 115 is attached on the plate spring 101 attached on the electronic component 113, and is securely fixed to the bottom plate 111 with screws 116 or the like. Note that the method of fixing the metal plate 115 is not limited to fixing the bottom plate 111 with the screws 116, and other fixing methods may be used.

  At this time, a certain amount of gap 117 is provided between the electronic component 113 and the metal casing 115. Further, the long spring portion 102 and the short spring portion 103 of the plate spring 101 are bent toward the printed circuit board 112 by being pushed by the metal plate 115, and the metal plate 115 and the long spring portion 102 and the short spring portion 103 of the plate spring 101 are between. The heat dissipation sheet 109 is sandwiched between the two.

  With this configuration, since the long spring portion 102 and the short spring portion 103 of the leaf spring 101 are bent by the pressure with which the metal plate 115 presses the long spring portion 102 and the short spring portion 103 of the leaf spring 101, the long spring portion 102 and the short spring The heat dissipation sheet 109 is pressed against the metal plate 115 in the range 118 between the long spring portion 102 and the short spring portion 103 of the heat dissipation sheet 109 due to the repulsive force that the portion 103 tries to return to the original shape, and is securely adhered. become.

  As a result, the heat generated from the electronic component 113 is transmitted by the heat radiating sheet 109 from the heat receiving portion 104 side of the plate spring 101 to the range 118 pressed against the metal plate 115, and heat can be radiated to the metal plate 115.

  Further, even when an external force due to a drop impact or the like is applied to the metal plate 15, it is possible to suppress the transmission of the external force applied to the metal plate 15 to the electronic component 113 by the elastic force of the leaf spring 101. It becomes possible to reduce damage to the component 113.

  According to the heat dissipation system according to the first embodiment of the present invention, by transmitting heat to the metal plate located at a certain distance from the electronic component, the transmission of the external force applied to the metal plate to the electronic component is suppressed. It is possible to reduce damage to the components and to dissipate heat from the electronic components.

  FIG. 5 is a configuration diagram when a metal plate is attached to a casing to which a printed circuit board and a leaf spring according to Embodiment 2 of the present invention are fixed, and (a) is a configuration representing a state before the metal plate is attached. FIG. 4B is a configuration diagram illustrating a state after the metal plate is attached.

  As shown in FIG. 5, a metal plate 115 having an arc-shaped protruding portion 119 that protrudes downward is mounted on the plate spring 101 mounted on the electronic component 113, and is securely attached to the bottom plate 111 with screws 116 or the like. Fix it. The fixing method of the metal plate 115 is not limited to fixing the bottom plate 111 with the screws 116, and other fixing methods may be used.

  At this time, a certain amount of gap 117 is provided between the electronic component 113 and the metal casing 115. The long spring portion 102 and the short spring portion 103 of the plate spring 101 are bent toward the printed circuit board 112 by being pressed by the metal plate 115, and the long spring portion 102 and the short spring portion 103 of the metal plate 115 and the plate spring 101 are bent. The heat dissipation sheet 109 is sandwiched between them.

  With this configuration, the long spring portion 102 and the short spring portion 103 of the leaf spring 101 are bent by the pressure with which the metal plate 115 presses the long spring portion 102 and the short spring portion 103 of the leaf spring 101. The region 118 between the long spring portion 102 and the short spring portion 103 of the heat radiating sheet 109 is pressed against the metal plate 115 by the repulsive force that the spring portion 103 tries to return to the original shape, and the circle provided on the metal plate 115 By pressing the heat radiating sheet 109 into the groove formed in the range 118 between the long spring portion 102 and the short spring portion 103 by the arc-shaped protrusion 119, the arc-shaped protrusion 119 of the heat radiating sheet 109 and the metal plate 115 is securely It will be in close contact.

  As a result, heat generated from the electronic component 113 is transmitted from the heat receiving portion 104 side of the leaf spring 101 to the range 118 pressed against the arc-shaped protrusion 119 provided on the metal plate 115 by the heat radiating sheet 109, and the metal plate 115. More efficient heat dissipation is possible.

  Further, even when an external force due to a drop impact or the like is applied to the metal plate 15, it is possible to suppress the transmission of the external force applied to the metal plate 15 to the electronic component 113 by the elastic force of the leaf spring 101. It becomes possible to reduce damage to the component 113.

  In the second embodiment, the protrusion 119 provided on the metal plate 115 has an arc shape. However, the present invention is not limited to this. For example, the triangular shape shown in FIG. 6A or the square shown in FIG. It may be a polygon such as a shape.

  According to the heat dissipation system according to the second embodiment of the present invention, the protrusion between the metal plate causes the groove between the long spring and the short spring generated when the metal plate presses the long spring portion and the short spring portion covered with the heat dissipation sheet. In this case, the heat-dissipating sheet is pressed against the long spring part and the short spring part to release heat to the metal plate located at a certain distance from the electronic component, so that the external force electronic component applied to the metal plate By suppressing the transmission to the electronic component, damage to the electronic component can be reduced, and the heat of the electronic component can be radiated more efficiently.

  The present invention reduces heat damage to an electronic component by suppressing the transmission of an external force applied to the metal plate to the electronic component by dissipating heat to the metal plate located at a certain distance from the electronic component. It is possible to dissipate the heat of this, so it is useful as a heat dissipation system.

101 Leaf spring 102 Long spring portion 103 Short spring portion 104 Heat receiving portion 105 Bending angle of long spring portion 102 106 Bending angle of short spring portion 107 Difference in length between long spring portion 102 and short spring portion 103 Long spring portion 102 And the width of the short spring portion 109. Heat dissipation sheet 110 Range where the heat dissipation sheet is attached 111 Bottom plate 112 Printed circuit board 113 Electronic component 114, 116 Screw 115 Metal plate 117 A certain amount of distance between the electronic component 113 and the metal plate 115 118 Long spring 119 Protruding portion between the portion 102 and the short spring portion 103

Claims (4)

A heat receiving portion that is installed on the electronic component with the heat dissipation sheet interposed therebetween and receives heat from the electronic component, and a long spring portion and a short spring portion that are integrally formed with the heat receiving portion at an acute angle from the heat receiving portion. A leaf spring comprising:
A heat dissipating sheet covering the plate spring from the outer surface;
A metal plate that presses the long spring portion and the short spring portion covered with the heat dissipation sheet from above,
A heat dissipation system consisting of The metal plate is
Protruding portions projecting downward are provided in the groove between the long spring and the short spring generated when the metal plate presses the long spring portion and the short spring portion covered with the heat dissipation sheet. The heat dissipation system according to claim 1, wherein the heat dissipation sheet is pressed against the long spring portion and the short spring portion. The heat dissipation system according to claim 1 or 2, wherein the heat dissipation sheet is not bonded and fixed to the long spring portion and the short spring portion. The heat dissipation system according to claim 2, wherein the protrusion has one of an arc shape, a triangular shape, a quadrangular shape, and other polygonal shapes.

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