JPH04109545U

JPH04109545U - Hybrid integrated circuit device

Info

Publication number: JPH04109545U
Application number: JP1174991U
Authority: JP
Inventors: 保一池田; 達人西原
Original assignee: 三菱電機株式会社
Priority date: 1991-03-06
Filing date: 1991-03-06
Publication date: 1992-09-22

Abstract

(57)【要約】【目的】セラミック基板を搭載した混成集積回路装置
をシャーシに取り付ける時にネジ止めによるセラミック
基板へのストレスを軽減させることを目的とした。【構成】放熱板のネジ止め部の厚みをセラミック基板
を搭載している部分の放熱板の厚みよりも薄くした。【効果】放熱板ネジ止め時のセラミック基板へのスト
レスを軽減させ、基板ワレ、クラックを防止できる。 (57) [Summary] [Purpose] The purpose was to reduce stress on the ceramic substrate due to screw fastening when installing a hybrid integrated circuit device equipped with a ceramic substrate on a chassis. [Structure] The thickness of the screwed part of the heat sink is made thinner than the thickness of the part of the heat sink where the ceramic board is mounted. [Effect] Reduces the stress on the ceramic board when screwing the heat sink, preventing board cracks and cracks.

Description

[Detailed explanation of the idea]

【０００１】0001

[Industrial application field]

この考案は高出力用の混成集積回路装置に関するものである。 This invention relates to a high power hybrid integrated circuit device.

【０００２】0002

[Conventional technology]

従来、高出力用の混成集積回路装置は図２に示すように、金属からなる放熱板（一般にはCu）３の上に半田２によりセラミック基板１が搭載されていた。 Conventionally, high-output hybrid integrated circuit devices have a heat sink made of metal, as shown in Figure 2. A ceramic substrate 1 was mounted on (generally Cu) 3 with solder 2.

【０００３】この混成集積回路装置は、電気的動作時には、熱を発生するので、図２に示すシャーシ４の上にネジ５により取り付られる。0003 This hybrid integrated circuit device generates heat during electrical operation, so it is shown in Figure 2. It is attached onto the chassis 4 with screws 5.

【０００４】0004

[Problem that the idea aims to solve]

従来の混成集積回路装置は以上のように構成されていたのでシャーシ表面に凹凸があったり、放熱板の裏面とシャーシの表面との間に異物が介在した場合、ネジ止め時の力により、ストレスがセラミック基板に加わり、基板にクラックが入ったり、基板が割れるなどの問題点があった。 Conventional hybrid integrated circuit devices were constructed as described above, so there were no recesses on the chassis surface. If there is a protrusion or there is a foreign object between the back side of the heat sink and the front surface of the chassis, the screw may The force applied when tightening the screws causes stress to be applied to the ceramic board, causing cracks in the board. There were problems such as cracking and cracking of the board.

【０００５】この考案は上記のような問題点を解消するためになされたもので、当該装置をセットのシャーシ上に組立てる場合、シャーシ表面の凹凸や、異物の介在があっても、ネジ止め時の力がセラミック基板に加わることを極力防止できる混成集積回路装置を得ることを目的とする。[0005] This idea was made to solve the above problems, and the device When assembling on a set chassis, there may be irregularities on the chassis surface or foreign objects may be present. A hybrid assembly that can prevent as much force as possible from being applied to the ceramic board when screwing. The purpose is to obtain a circuit device.

【０００６】[0006]

[Means to solve the problem]

この考案に係る混成集積回路装置は、放熱板をシャーシにネジ止めする部分の厚みを、セラミック基板搭載部の放熱板の厚みよりも薄くしたことを特徴とする。 The hybrid integrated circuit device according to this invention has a part where the heat sink is screwed to the chassis. The thickness is thinner than the thickness of the heat sink of the ceramic board mounting part. .

【０００７】[0007]

【作用】この考案における放熱板は、シャーシ表面上の凹凸や、異物の介在があっても、ネジ止め時に発生する力はネジ止め部の放熱板の厚みが薄いことにより、その部分が変形することになり、セラミック基板へのストレスは極力防止することが可能となる。[Effect] The heat sink in this design can be used even if there are irregularities on the chassis surface or foreign objects. , the force generated when screwing is reduced due to the thinness of the heat sink at the screw-fastening part. This will cause parts to deform, and it is best to prevent stress on the ceramic board as much as possible. It becomes possible.

【０００８】[0008]

【Example】

実施例１．以下、この考案の一実施例を図について説明する。図１において、１はセラミック基板、２は半田、３はネジ止め部が薄い金属素材よりなる放熱板、４はシャーシ、５はネジである。 Example 1. An embodiment of this invention will be described below with reference to the drawings. In Figure 1, 1 is ceramic 2 is a solder board, 3 is a heat sink whose screw fixing part is made of a thin metal material, and 4 is a shutter. 5 is a screw.

【０００９】[0009]

[Effect of the idea]

以上のように、この考案によれば、混成集積回路装置の放熱板のネジ止め部の厚みを、セラミック基板搭載部の放熱板の厚みよりも薄くすることにより、混成集積回路装置をセットのシャーシ上に組立てる場合、シャーシ表面の凹凸や、異物の介在にネジ止め時の力がセラミック基板へ加わるストレスを極力防止することが可能となり、基板のクラックや割れの防止対策の向上につながる効果がある。 As described above, according to this invention, the screw fixing part of the heat sink of a hybrid integrated circuit device By making the thickness thinner than the thickness of the heat sink in the ceramic board mounting area, When assembling an integrated circuit device on the chassis of a set, there may be irregularities or irregularities on the chassis surface. To prevent as much as possible the stress that is applied to the ceramic substrate due to the force when screwing into the intervening object. This has the effect of improving measures to prevent cracks and cracks in the board. .

[Brief explanation of drawings]

【図１】この考案の一実施例による混成集積回路装置を
示す断面側面図である。FIG. 1 is a cross-sectional side view showing a hybrid integrated circuit device according to an embodiment of the invention.

【図２】従来の混成集積回路装置を示す断面側面図であ
る。FIG. 2 is a cross-sectional side view showing a conventional hybrid integrated circuit device.

[Explanation of symbols]

１セラミック基板２半田３放熱板 3a 放熱板ネジ止め部４シャーシ５ネジ 1 Ceramic substrate 2 Solder 3 Heat sink 3a Heat sink screw fixing part 4 Chassis 5 screws

Claims

[Scope of utility model registration request]

Claim 1: In a hybrid integrated circuit device having a ceramic substrate mounted via solder on a heat sink made of metal and provided with a screw tightening portion, the thickness of the screw tightening portion of the heat sink is determined by the thickness of the screw tightening portion of the heat sink mounted on the ceramic substrate. A hybrid integrated circuit device characterized in that the thickness is thinner than the thickness of the heat dissipation plate of the part.