JPH051285U - Heat dissipation plate - Google Patents
Heat dissipation plateInfo
- Publication number
- JPH051285U JPH051285U JP4711491U JP4711491U JPH051285U JP H051285 U JPH051285 U JP H051285U JP 4711491 U JP4711491 U JP 4711491U JP 4711491 U JP4711491 U JP 4711491U JP H051285 U JPH051285 U JP H051285U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation plate
- circuit board
- printed circuit
- screw hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】
【目的】 放熱プレートに取付けるプリント基板の割れ
及び、プリント基板に取付けられた電気部品の破損を防
止する。
【構成】 装置の筐体１に放熱プレート２を固定する
際、両者の平面度が悪い場合、取付用ネジ３を締め付け
た時でも、肉薄部４に変形が集中してプリント基板取付
部５の変形を防止する。
(57) [Summary] [Purpose] To prevent cracks in the printed circuit board mounted on the heat dissipation plate and damage to the electrical components mounted on the printed circuit board. [Structure] When fixing the heat dissipation plate 2 to the housing 1 of the device, if the flatness of both is poor, even when the mounting screw 3 is tightened, deformation is concentrated on the thin portion 4 and the printed board mounting portion 5 Prevent deformation.
Description
【０００１】[0001]
本考案は放熱プレートに関する。 The present invention relates to a heat dissipation plate.
【０００２】[0002]
従来、この種の放熱プレート２は図３に示すように、中央部にプリント基板７ を放熱プレート２に取付けるためのプリント基板取付部５が設けられ、プリント 基板取付部５の外側にネジ穴６が設けられていた。そして、放熱プレート２はネ ジ穴６に挿通したネジ３により装置の筐体１に固定されていた。 Conventionally, as shown in FIG. 3, this type of heat dissipation plate 2 is provided with a printed circuit board mounting portion 5 for mounting the printed circuit board 7 on the heat dissipation plate 2 in the central portion, and a screw hole 6 is provided outside the printed circuit board mounting portion 5. Was provided. The heat dissipation plate 2 is fixed to the housing 1 of the device by the screw 3 inserted through the screw hole 6.
【０００３】 ここに、従来の放熱プレート２は、プリント基板取付部５とネジ穴６周囲との 肉厚が一定となっていた。Here, in the conventional heat dissipation plate 2, the thickness between the printed board mounting portion 5 and the periphery of the screw hole 6 is constant.
【０００４】[0004]
上述した従来の放熱プレート２は、装置の筐体等に固定するネジ穴６の周囲が プリント基板取付部５の肉厚と同一の肉厚となっているので、筐体側と放熱プレ ートの平面度が良くない場合、ネジの締め付け時に放熱プレート２が全体的に変 形し、放熱プレートに取付けられているプリント基板７が割れたり、プリント基 板７上に取付けられている電気部品等が破損してしまうという危険性があった。 In the conventional heat dissipation plate 2 described above, the circumference of the screw hole 6 for fixing to the housing of the device is the same as the thickness of the printed circuit board mounting portion 5, so that the housing side and the heat dissipation plate are If the flatness is not good, the heat radiating plate 2 will be deformed as a whole when the screws are tightened, the printed circuit board 7 mounted on the heat radiating plate will be cracked, and the electric parts etc. mounted on the printed circuit board 7 will be damaged. There was a risk of damage.
【０００５】 本考案の目的は、放熱プレート固定時にプリント基板に無理な力が加わらない ようにした放熱プレートを提供することにある。An object of the present invention is to provide a heat radiating plate that does not apply unreasonable force to a printed circuit board when fixing the heat radiating plate.
【０００６】[0006]
前記目的を達成するため、本考案に係る放熱プレートにおいては、プリント基 板取付部と、ネジ穴とを有する放熱プレートであって、 前記プリント基板取付部は、プリント基板を放熱プレートに取付けるためのも のであり、 前記ネジ穴は、放熱プレートを装置の筐体等に固定するネジが挿通するもので あり、 前記ネジで装置の筐体等に緊締される放熱プレートのネジ穴の周囲に、放熱プ レートの他の部分より肉厚が薄い部分を有するものである。 To achieve the above object, the heat dissipation plate according to the present invention is a heat dissipation plate having a printed board mounting part and a screw hole, wherein the printed circuit board mounting part is for mounting the printed circuit board on the heat dissipation plate. The screw holes are for inserting screws that fix the heat dissipation plate to the housing of the device, and the heat dissipation is performed around the screw holes of the heat dissipation plate that are tightened to the device housing with the screws. It has a portion having a thinner wall thickness than other portions of the plate.
【０００７】[0007]
本考案では、ネジ穴の周囲に脆弱な部分を設け、この脆弱な部分を変形させる ことにより放熱プレートに加わる無理な力を吸収するようにしたものである。 In the present invention, a fragile portion is provided around the screw hole, and the fragile portion is deformed to absorb an excessive force applied to the heat dissipation plate.
【０００８】[0008]
以下、本考案の一実施例を図により説明する。 An embodiment of the present invention will be described below with reference to the drawings.
【０００９】 図１は、本考案の一実施例を示す縦断面図、図２は、ネジ穴部分を示す斜視図 である。FIG. 1 is a vertical sectional view showing an embodiment of the present invention, and FIG. 2 is a perspective view showing a screw hole portion.
【００１０】 図において、本実施例では、放熱プレート２の中央部にプリント基板７を放熱 プレート２に取付けるためのプリント基板取付部５を有し、その外側にネジ穴６ を有している。In the figure, in this embodiment, a printed circuit board mounting portion 5 for mounting the printed circuit board 7 on the thermal radiation plate 2 is provided at the center of the thermal radiation plate 2, and a screw hole 6 is provided on the outside thereof.
【００１１】 ここに、ネジ穴６の周囲には、放熱プレート２の他の部分の肉厚より薄い肉薄 部４を有している。Around the screw hole 6, there is a thin portion 4 thinner than the other portions of the heat dissipation plate 2.
【００１２】 実施例において、装置の筐体１に放熱プレート２を固定する際、両者の平面度 が悪い場合、取付用ネジ３を締め付けた時でも、肉薄部４に変形が集中して、プ リント基板取付部５の変形を防止する。In the embodiment, when fixing the heat dissipation plate 2 to the housing 1 of the apparatus, if the flatness of both is poor, deformation is concentrated in the thin portion 4 even when the mounting screw 3 is tightened, The deformation of the lint board mounting portion 5 is prevented.
【００１３】[0013]
以上説明したように本考案は、放熱プレートの筐体等への固定用ネジ穴の周囲 の肉厚を他より薄くしたため、筐体と放熱プレートの平面度が良くない場合でも 、ネジを締め付ける際、その肉薄部分に変形が集中し、プリント基板の取付け部 分は変形しないこととなり、プリント基板やプリント基板上に取付けた部品の破 損を防止することができるという効果がある。 As described above, according to the present invention, since the thickness of the periphery of the screw hole for fixing the heat dissipation plate to the housing etc. is thinner than others, even when the flatness of the housing and the heat dissipation plate is not good, when tightening the screw The deformation concentrates on the thin portion, and the mounting portion of the printed circuit board does not deform, which has the effect of preventing damage to the printed circuit board or parts mounted on the printed circuit board.
【図１】本考案の一実施例を示す縦断面図である。FIG. 1 is a vertical sectional view showing an embodiment of the present invention.
【図２】本考案の一実施例におけるネジ穴を示す斜視図
である。FIG. 2 is a perspective view showing a screw hole according to an embodiment of the present invention.
【図３】従来の放熱プレートを示す縦断面図である。FIG. 3 is a vertical cross-sectional view showing a conventional heat dissipation plate.
１ 装置の筐体 ２ 放熱プレート ３ ネジ ４ 肉薄部 ５ プリント基板取付部 ６ ネジ穴 ７ プリント基板 1 Device case 2 Heat dissipation plate 3 Screw 4 Thin part 5 Printed circuit board mounting part 6 Screw hole 7 Printed circuit board
Claims (1)
る放熱プレートであって、前記プリント基板取付部は、
プリント基板を放熱プレートに取付けるためのものであ
り、前記ネジ穴は、放熱プレートを装置の筐体等に固定
するネジが挿通するものであり、前記ネジで装置の筐体
等に緊締される放熱プレートのネジ穴の周囲に、放熱プ
レートの他の部分より肉厚が薄い部分を有することを特
徴とする放熱プレート。Claims for utility model registration 1. A heat dissipation plate having a printed circuit board mounting portion and a screw hole, wherein the printed circuit board mounting portion comprises:
This is for attaching the printed circuit board to the heat dissipation plate, and the screw hole is for inserting a screw for fixing the heat dissipation plate to the housing of the device, etc. A heat radiating plate having a portion having a thinner wall thickness than other portions of the heat radiating plate around a screw hole of the plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4711491U JP2543252Y2 (en) | 1991-06-21 | 1991-06-21 | Heat dissipation plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4711491U JP2543252Y2 (en) | 1991-06-21 | 1991-06-21 | Heat dissipation plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH051285U true JPH051285U (en) | 1993-01-08 |
| JP2543252Y2 JP2543252Y2 (en) | 1997-08-06 |
Family
ID=12766152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4711491U Expired - Lifetime JP2543252Y2 (en) | 1991-06-21 | 1991-06-21 | Heat dissipation plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2543252Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2575168A1 (en) | 2011-09-30 | 2013-04-03 | Fujitsu Limited | Electronic device |
| JP2015505172A (en) * | 2012-01-25 | 2015-02-16 | コーニンクレッカ フィリップス エヌ ヴェ | LED module, LED unit, and luminaire including LED module |
-
1991
- 1991-06-21 JP JP4711491U patent/JP2543252Y2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2575168A1 (en) | 2011-09-30 | 2013-04-03 | Fujitsu Limited | Electronic device |
| JP2015505172A (en) * | 2012-01-25 | 2015-02-16 | コーニンクレッカ フィリップス エヌ ヴェ | LED module, LED unit, and luminaire including LED module |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2543252Y2 (en) | 1997-08-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |