JP2552899Y2 - Electronic device with cooling device - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component (for example, a semiconductor device such as a microprocessor unit) that generates heat during use, and an electronic device with a cooling device having a heat sink.

[0002]

2. Description of the Related Art Conventionally, an electronic component that generates heat during use is used by being brought into contact with a heat sink made of a metal mold having a high thermal conductivity such as aluminum or an aluminum alloy, and the generated heat is radiated through the heat sink. ing. In particular, in the case of electronic components generating a large amount of heat, there is also known an electronic device with a cooling device in which a cooling fan is further provided for the heat sink to forcibly cool the heat sink (for example, see Japanese Utility Model Application Laid-Open No. 63-163). 164294).

[0003]

The above-mentioned electronic components are often used by being mounted on a printed circuit board (hereinafter referred to as a PC board). Therefore, it is necessary to mount the heat sink and the cooling fan attached to the electronic component on the PC board and fix them. PC
When mounting on a substrate, it is desired that the processing to be applied to the PC substrate be as small as possible. Further, it is required that the stress applied to the PC board by mounting is as small as possible, and it is necessary to minimize the application of external force such as vibration to the electronic component from the PC board side.

Also, electronic components mounted on a PC board and a PC
Since the circuits in the board are electrically connected by soldering, the electronic components also need to be held at predetermined positions on the PC board.

[0005]

SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic device with a cooling device suitable for mounting an electronic component that generates heat during use on a printed circuit board.

The electronic device with a cooling device of the present invention is an electronic device with a cooling device provided with a heat sink and an electronic device that generates heat during use. In the electronic device with a cooling device, the electronic component is interposed via a frame provided to face the heat sink. It is characterized by being pressed and fixed to the heat sink.

That is, the present invention provides an electronic part that generates heat during use.
An electronic device provided with a heat sink.
The child component is placed in front of the
The electronic device with a cooling device that is pressed and fixed to the heat sink
The heat sink has a radiating fin
And fitting the frame body to the outer edge of the electronic component.
Then, the edge of the heat sink is fixed to the edge of the frame.
At the edge of the frame with respect to the printed circuit board.
Provide a mounting part, sandwich the vibration-proof rubber on the heat sink
An electronic device with a cooling device, characterized by mounting a cooling fan
Device.

[0008]

According to the electronic device with the cooling device of the present invention, the electronic components can be mounted on the printed circuit board via the frame. Therefore, it is only necessary to form a mounting structure with the frame on the printed circuit board, and the mounting structure with the electronic component can be eliminated.

As a result, since only the mounting structure of the frame and the printed circuit board is provided on the printed circuit board, the stress applied to the printed circuit board can be reduced. Also, when an external force such as vibration is applied from the printed circuit board side to the electronic component side, the external force can be buffered by the frame.

Further, since the electronic component is supported at a fixed position by attaching the frame to the printed circuit board, the circuit in the printed circuit board and the electronic component can be easily connected by soldering.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. The figure shows an embodiment in which a cooling fan is also installed to forcibly cool the heat sink.
An electronic device with a cooling device is constituted by the electronic component 2, the heat sink 3, the vibration isolating rubber 4, the cooling fan 5 and the fan guard 6.

The rectangular frame 1 is provided with a step 8 which engages with the outer edge of the electronic component 2 along the periphery of the opening 7 and has a mounting portion 10 with a female screw tube 9 embedded in the side edge. And a mounting portion 12 in which a female screw cylinder 11 is also buried. When the electronic component 2 is mounted in the opening 7, the lead terminals 13 of the electronic component 2 project from the lower surface of the rectangular frame 1 by a predetermined length.

The heat sink 3 is made of an extruded material such as aluminum or an aluminum alloy. The heat sink 3 has a plurality of heat radiation fins 14 and 14 and mounting flanges 15 and 16 formed on upper and lower outer sides, respectively. Lower mounting collar 15
Is for connecting to the rectangular frame 1, and the female screw cylinder 1
A through hole 17 is formed at a position facing 1. The upper mounting flange 16 is for connecting to the cooling fan 5 and has a through hole 1.
8 are formed.

The anti-vibration rubber 4 is a rectangular plate having substantially the same shape as the frame 19 of the cooling fan 5, and has a circular opening 21 formed at the center thereof so as to face the rotor 20 of the cooling fan 5. .
At four corners of the square board, through holes 22 are formed so as to face the through holes 18 of the mounting flange 16.

The cooling fan 5 is provided with a rotary wing 20 inside a rectangular frame 19, and through holes 23 are formed at the four corners of the frame 19, similarly to the vibration-proof rubber 4.

The fan guard 6 is formed of an annular wire 24, 2
4 and wires 25, 25 arranged radially. A glass plate 26 is fixed to the tip of each wire 25 so as to match the through hole 23 of the cooling fan 5.

In the figure, reference numeral 27 denotes a screw which is inserted into the through hole 17 of the heat sink 3 and is screwed into the female screw cylinder 11 of the rectangular frame 1. Reference numeral 28 denotes a glass plate 26 of the fan guard 6, and a through hole 2 of the cooling fan 5.
3 is a screw that is inserted into the through hole 22 of the anti-vibration rubber 4 and screwed into the through hole 18 formed in the mounting flange 16 of the heat sink 3.

FIG. 2 shows a state in which the electronic device with a cooling device of the above embodiment is mounted on a PC board 29.
For mounting, after mounting the required electronic components 2 on the square frame 1, the heat sink 3 is brought into contact with the electronic components 2, and the heat sink 3 is fixed to the square frame 1 with screws 27.
The heat sink 3 is pressed against the electronic component 2.
In addition, the anti-vibration rubber 4, the cooling fan 5, and the fan guard 6 are stacked on the heat sink 3 and fixed with screws 28. The electronic device with the cooling device assembled in this manner is connected to a PC.
The screw 30 is inserted into the predetermined position of the substrate 29 and inserted from the back side of the PC substrate 29 and screwed into the female screw cylinders 9 of the square frame 1 to complete the mounting.

That is, the mounting can be completed without processing the PC board 29 for mounting the electronic component 2, the heat sink 3, the cooling fan 5, and the like. PC board 29
Is only the connecting portion between the rectangular frame 1 and the screw 30, so that the mounting stress introduced to the PC board 29 can be reduced as much as possible.

By connecting the PC board 29 and the rectangular frame 1,
The electronic component 2 is held at a predetermined position. Therefore, by forming through-holes through which the lead terminals 13 are inserted in the PC board 29 in correspondence with the lead terminals 13 of the electronic component 2 at the held positions, each lead terminal 13 and the through-hole are kept in a fixed state. And can be sent without any support to the automatic soldering process.

When the electronic device with the cooling device is mounted on the PC board 29, it is subjected to various transporting steps including transporting to the soldering step, and under various conditions during use of the PC board 29. Then, vibrations and other external forces are transmitted from the PC board 29 side to the electronic device with a cooling device. However, vibrations and other external forces are transmitted to the electronic component 2 via the rectangular frame 1, and thus are transmitted. It can buffer external force and protect electronic components.

Further, when the heat sink 3 and the cooling fan 5 are provided for the electronic component 2, the weight becomes considerable, and it is difficult to support the weight by the soldered portion of the lead terminal 13 in terms of strength. Since the weight of the heat sink 3, the cooling fan 5 and the like can be supported by the rectangular frame 1, the soldered portion can be protected.

In the above, the embodiment having the cooling fan 5 has been described. However, an electronic device with a cooling device having only the heat sink 3 with respect to the electronic component 2 may be constituted by the same rectangular frame 1. Can be.

[0024]

According to the present invention, there is an effect that an electronic device with a cooling device which does not require processing for installing a heat sink and a cooling fan on the PC board can be provided. Also,
Since the edge portion of the heat sink edge and the frame body is fixed,
The center of the heat sink and the electronic components are in close contact
The effect that the heat radiation effect of the radiation fin in the center of the
There is. In addition, the cooling fan heats
Since it is fixed to the sink, transmission of vibration etc. to the electronic part is suppressed.
In addition, the heat radiation effect can be enhanced.

Further, since the mounting structure of the heat sink and the cooling fan can be eliminated from the PC board, there is an effect that mounting stress applied to the PC board can be reduced.

Further, since the frame is interposed between the electronic component and the PC board, vibration and other external forces transmitted from the PC board side to the electronic component side are buffered, so that the electronic component can be protected.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of an embodiment of the present invention.

FIG. 2 is a front view of the embodiment in use.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Rectangular frame 2 Electronic components 3 Heat sink 4 Anti-vibration rubber 5 Cooling fan 6 Fan guard 29 PC board

Claims (1)

(57) [Scope of request for utility model registration] An electronic device comprising: an electronic component that generates heat during use; and a heat sink , wherein the electronic component includes a heat sink.
To the heat sink via a frame provided opposite to the heat sink.
In an electronic device with a cooling device for pressing and fixing , the heat
The sink is composed of radiating fins arranged in parallel at the center,
To the outer edge of the electronic component, and
The edge of the heat sink is fixed to the
A mounting portion for a printed circuit board is provided at an edge of
Attach a cooling fan to the heat sink with anti-vibration rubber in between
An electronic device with a cooling device.